A semiconductor fingerprint sensor LGA particle testing device and testing method
By designing a test device for semiconductor fingerprint sensors, collecting current and image information, and using the main controller and the upper computer for data processing, the problem of insufficient testing devices in the prior art is solved, and the accuracy of LGA particle performance of semiconductor fingerprint sensors is achieved. Improvement of testing and production efficiency.
Patent Information
- Application Number
- CN202110167860.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-02-07
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2041-02-07
AI Technical Summary
There is a lack of devices for LGA particle testing of semiconductor fingerprint sensors in the prior art, which affects the improvement of production efficiency and finished product quality.
A test device including a main controller, ammeter, chip switch, test points and fake finger mold is designed to collect current and image information through current test points, motherboard test points, fake finger mold test points and image communication test points. The main controller and the upper computer are used to perform data processing to judge the performance of the semiconductor fingerprint sensor.
Accurate testing of LGA particle performance of semiconductor fingerprint sensors has been achieved, production efficiency has been improved, and bad products have been prevented from flowing into the market.
Smart Images

Figure CN114280446B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor fingerprint sensors, and in particular to a semiconductor fingerprint sensor LGA particle testing device and a testing method. Background Art
[0002] Fingerprint sensor is the key component to realize automatic fingerprint collection. According to the sensing principle, it can be divided into optical fingerprint sensor, semiconductor fingerprint sensor, semiconductor thermistor sensor, ultrasonic sensor and radio frequency RF sensor. Common fingerprint sensors on the market include BS801C / 2C / 4C / 6C / 8C, BS804C and BS808C. Semiconductor fingerprint sensors mainly include capacitive fingerprint sensor and inductive fingerprint sensor. When using this type of fingerprint sensor to obtain fingerprint image, the finger is attached to the other side of the capacitor (inductor). Due to the uneven plane of the finger, the actual distance between the convex point and the concave point in contact with the plate is different, and the capacitance / inductance value formed is different. According to this principle, the different values collected are summarized to realize fingerprint collection.
[0003] Now the fingerprint series products are more and more extensive in the market, and the shipment volume is also growing continuously. Good production efficiency and quality assurance are the competitive advantages of all fingerprint manufacturers, and are also the current research goals of each manufacturer. Therefore, when the fingerprint sensor is mass-produced, it is necessary to test the performance of its LGA particles (capacitors / inductors). The performance mainly includes touch function and chip function. The touch function refers to whether the fingerprint image of the finger can be displayed on the PC when the finger touches the sensor. The chip function refers to whether the current is normal after the chip switch in the sensor is turned on. However, there is a lack of devices for testing LGA particles of semiconductor fingerprint sensors in the prior art, which seriously affects the quality of finished products and the improvement of production efficiency of semiconductor fingerprint sensors. Summary of the invention
[0004] In view of the problem that there is a lack of devices for testing LGA particles of semiconductor fingerprint sensors in the prior art, which affects the improvement of production efficiency, the present invention provides a semiconductor fingerprint sensor LGA particle testing device and a testing method, which can realize accurate testing of the performance of semiconductor fingerprint sensor LGA particles and improve production efficiency.
[0005] To achieve the above object, the present invention adopts the following technical solution:
[0006] A semiconductor fingerprint sensor LGA particle testing device comprises a main controller, an ammeter, a chip switch, a test point, and a fake finger mold, wherein the test point comprises a current test point, a mainboard test point, a fake finger mold test point, and an image communication test point, the chip switch is connected to the VCC terminal of the main controller, the current test point comprises a first current test point and a second current test point, the first current test point is connected to the negative pole of the ammeter, the second current test point is connected to the negative pole of the ammeter through a magnetic bead, the positive pole of the ammeter and the mainboard test point are connected to the main controller, the fake finger mold is connected to the fake finger mold test point, the fake finger mold test point is connected to the main controller through the image communication test point, and the main controller is connected to a host computer.
[0007] It is further characterized in that
[0008] The test points include 32, namely test point 1 to test point 32;
[0009] The first current test points include three, namely, test point 2, test point 6, and test point 8; the second current test points include five, namely, test point 1, test point 7, test point 16, test point 22, and test point 32; the test points 1, 7, 16, 22, and 32 are connected to one end of the magnetic bead, and the other end of the magnetic bead and the test points 2, 6, and 8 are all connected to the input end of the ammeter, and the output end of the ammeter is connected to pin 1 of the main controller;
[0010] The fake finger mold test point includes a test point 4, and the fake finger mold is connected to the test point 4;
[0011] The image communication test points include test points 10, 11, 31, 13-26, the test points 10, 11, 31 are connected to pin 2 of the main controller, and the test points 13-26 are respectively connected to pins 2-15 of the main controller, for realizing the communication between the image signal of the semiconductor fingerprint sensor and the main controller;
[0012] The test points 3, 5, 9, 12, 28, 29, and 30 are reserved test points;
[0013] It also includes a voltage adapter board, a GND port of the voltage adapter board is connected to the GND port of the main controller, a DP port of the voltage adapter board is connected to the DP port of the main controller, a DN port of the voltage adapter board is connected to the DN port of the main controller, and the voltage adapter board is connected to the main controller through the chip switch.
[0014] A testing method, which uses the testing device to test the performance of the LGA particle of the semiconductor fingerprint sensor, wherein the performance includes an image function and a chip function, and the chip switch is used to select whether to test the LGA particle, wherein S1, the chip switch is turned on, and the main controller is powered on;
[0015] S2. Collecting current information of the first current test point and the second current test point through the ammeter;
[0016] S3, collecting image information of the fake finger model through the test point 4;
[0017] S4, the image information is sent to the main controller through the test points 13-26;
[0018] S5, the main controller sends the image information to the host computer;
[0019] S6. The host computer determines whether the image information meets the standard.
[0020] It is further characterized in that
[0021] The ammeter is a display ammeter with a display screen, which is used to display the current information of the first current test point;
[0022] The ammeter is connected to the main controller via a current feedback circuit, the current feedback circuit comprises a feedback resistor R, one end of the resistor R is connected to the negative electrode of the ammeter, and the other end of the resistor R is connected to the I / O signal input end of the main controller; the main controller comprises a first data processing unit, the first data processing unit is used to compare the current information with a pre-stored current threshold;
[0023] The host computer includes a second data processing unit, and the second processing unit is used to compare the image information with a pre-stored standard image.
[0024] The above structure of the present invention can achieve the following beneficial effects: the test device includes a current test point, a mainboard test point, a fake finger mold test point, and an image communication test point. The current information of the semiconductor fingerprint sensor can be tested through the current test point. The image information of the fake finger mold can be collected through the fake finger mold test point and the image communication test point. The image information is sent to the host computer through the main controller. The host computer can determine whether the image information meets the standard. The current information is used to determine the chip function of the semiconductor fingerprint sensor, and the image information is used to determine the chip function of the semiconductor fingerprint sensor, thereby realizing the performance judgment of the LGA particles of the semiconductor fingerprint sensor.
[0025] The test device is used to test the performance of the semiconductor fingerprint sensor LGA particles. During the test, the chip switch can be used to select whether to test the semiconductor fingerprint sensor LGA particles. After the chip switch is turned on, the ammeter will display the current information of the semiconductor fingerprint sensor current test point. The tester determines whether the current information exceeds the current threshold. If the current threshold is exceeded, it means that the current information is abnormal and the chip function of the semiconductor fingerprint sensor is abnormal. The image information of the fake finger mold can be collected through the fake finger mold test point and the image communication test point, and the image information is sent to the host computer through the main controller. The image information is compared with the pre-stored standard image through the host computer. If the difference with the standard image is large, it means that the image function of the semiconductor fingerprint sensor is abnormal, thereby realizing accurate testing of the performance of the semiconductor fingerprint sensor LGA particles, preventing defective products from entering the market, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 This is a structural block diagram of a semiconductor fingerprint sensor LGA particle testing device according to a first embodiment of the present invention;
[0027] Figure 2 This is a schematic diagram of an interface circuit of a semiconductor fingerprint sensor LGA particle testing device according to an embodiment of the present invention;
[0028] Figure 3 This is a structural block diagram of another embodiment of the semiconductor fingerprint sensor LGA particle testing device according to the second embodiment of the present invention;
[0029] Figure 4 This is a schematic diagram of an interface circuit of a semiconductor fingerprint sensor LGA particle testing device according to a second embodiment of the present invention;
[0030] Figure 5 A flow chart for testing the performance of semiconductor fingerprint sensor LGA particles using a test device. DETAILED DESCRIPTION
[0031] See Figure 1 , Figure 2Embodiment 1, a semiconductor fingerprint sensor LGA particle testing device, including a main controller 101, an ammeter 102, a chip switch 103, a test point, and a fake finger mold 104, the test point includes a current test point 105, a mainboard test point 106, a fake finger mold test point 107, and an image communication test point 108, the chip switch 103 is connected to the VCC terminal of the main controller 101, the current test point 105 includes a first current test point and a second current test point, the first current test point is connected to the negative pole of the ammeter 102, the second current test point is connected to the negative pole of the ammeter 102 through a magnetic bead 109, the positive pole of the ammeter 102, the mainboard test point 106 are connected to the main controller 101, the fake finger mold 104 is connected to the fake finger mold test point 107, the fake finger mold test point 107 is connected to the main controller 101 through the image communication test point 108, and the main controller 101 is connected to the host computer 120. The ammeter 102 is a display ammeter with a display screen, which is used to display the current information of the first current test point.
[0032] There are 32 test points, namely test point 1 to test point 32; the first current test points include three, namely test point 2, test point 6, and test point 8, and the second current test points include five, namely test point 1, test point 7, test point 16, test point 22, and test point 32; test point 1, test point 7, test point 16, test point 22, and test point 32 are connected to one end of the magnetic bead, and the other end of the magnetic bead and test point 2, test point 6, and test point 8 are all connected to the output end of the ammeter, and the input end of the ammeter is connected to Connected to pin 1 of the main controller; the fake finger mold test point 104 includes test point 4, and the fake finger mold is connected to test point 4; the image communication test point 108 includes test points 10, 11, 31, 13-26, test points 10, 11, 31 are connected to pin 2 of the main controller, and test points 13-26 are respectively connected to pins 2-15 of the main controller, which are used to realize the communication between the image signal of the semiconductor fingerprint sensor and the main controller 101; test points 3, 5, 9, 12, 28, 29, 30 are reserved test points.
[0033] It also includes a voltage adapter board 121, the GND port of the voltage adapter board 121 is connected to the GND port of the main controller 101, the DP port of the voltage adapter board 121 is connected to the DP port of the main controller 101, the DN port of the voltage adapter board 121 is connected to the DN port of the main controller 101, and the voltage adapter board 121 is connected to the main controller 101 through the chip switch 121.
[0034] See Figure 5 A testing method, which uses the above-mentioned testing device to test the performance of the LGA particles of the semiconductor fingerprint sensor, the performance includes image function and chip function, and whether to test the LGA particles is selected by the chip switch, S1, the chip switch 103 is turned on, and the main controller 101 is powered on;
[0035] S2, collecting current information of the first current test point and the second current test point through the ammeter 102;
[0036] S3, collecting image information of the fake finger mold 104 through the test point 4;
[0037] S4, the image information is sent to the main controller 101 through the test points 13-26;
[0038] S5, the main controller 101 sends the image information to the host computer 120;
[0039] S6. The host computer 120 determines whether the image information meets the standard. The host computer 120 includes a second data processing unit, and the second processing unit is used to compare the image information with a pre-stored standard image.
[0040] See Figure 3 , Figure 4 , Embodiment 2, in this embodiment, the connection structure of the main controller 101, the ammeter 102, the chip switch 103, the test point, and the fake finger mold 104 is consistent with the connection structure in Embodiment 1, and can be Figure 5 The steps shown are used to test the performance of the semiconductor fingerprint sensor LGA particles. The main controller 101 can use an existing single-chip microcomputer, model BFM800_Main_V 2.1. In this embodiment, the negative pole of the ammeter 102 is also connected to a current feedback circuit 121. The ammeter 102 is connected to the main controller 101 through the current feedback circuit 121. The current feedback circuit 121 includes a feedback resistor R. One end of the resistor R is connected to the negative pole of the ammeter 102, and the other end of the resistor R is connected to the I / O signal input terminal of the main controller 101. The main controller 101 includes a first data processing unit. The first data processing unit is used to compare the current information with the pre-stored current threshold. The main controller is connected to the alarm prompt unit. The current output from the negative pole of the ammeter can be fed back to the main controller through the resistor R and the I / O signal input terminal. The first data processing unit in the main controller 101 processes the current information. If the current information exceeds the pre-stored current threshold, a signal can be sent to the buzzer in the alarm prompt unit to make a buzzing sound, prompting the tester that the current information of the first current test point of the semiconductor fingerprint sensor does not meet the standard, thereby achieving accurate testing of the electrical properties of the LGA particles of the semiconductor fingerprint sensor. Compared with the method of manually reading the ammeter information for judgment in Example 1, this method can reduce the occurrence of problems such as misjudgment caused by subjective initiative, further improve the convenience and accuracy of the test, and improve production efficiency.
[0041] The above are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.
Claims
1. A semiconductor fingerprint sensor LGA particle testing device, including a main controller, an ammeter, a chip switch, a test point, and a fake finger mold, It is characterized in that The test points include current test points, mainboard test points, fake finger mold test points, and image communication test points. The chip switch is connected to the VCC terminal of the main controller. The current test points include a first current test point and a second current test point. The first current test point is connected to the negative pole of the ammeter, and the second current test point is connected to the negative pole of the ammeter through a magnetic bead. The positive pole of the ammeter and the mainboard test point are connected to the main controller. The fake finger mold is connected to the fake finger mold test point. The fake finger mold test point is connected to the main controller through the image communication test point, and the main controller is connected to a host computer.
2. A semiconductor fingerprint sensor LGA particle testing device according to claim 1, It is characterized in that The test points include 32, namely test point 1 to test point 32, the first current test points include three, namely test point 2, test point 6, and test point 8, and the second current test points include five, namely test point 1, test point 7, test point 16, test point 22, and test point 32; the test points 1, 7, 16, 22, and 32 are connected to one end of the magnetic bead, and the other end of the magnetic bead and the test points 2, 6, and 8 are all connected to the output end of the ammeter, and the input end of the ammeter is connected to pin 1 of the main controller.
3. A semiconductor fingerprint sensor LGA particle testing device according to claim 2, It is characterized in that The fake finger mold test point includes test point 4, the fake finger mold is connected to test point 4, and the test point 4 is used to obtain image information of the fake finger mold. The image communication test point includes test points 10, 11, 31, and 13 to 26. The test points 10, 11, and 31 are connected to pin 2 of the main controller, and the test points 13 to 26 are respectively connected to pins 2 to 15 of the main controller, so as to realize the communication between the image signal of the semiconductor fingerprint sensor and the main controller.
4. A semiconductor fingerprint sensor LGA particle testing device according to claim 1 or 3, It is characterized in that It also includes a voltage adapter board, the GND port of the voltage adapter board is connected to the GND port of the main controller, the DP port of the voltage adapter board is connected to the DP port of the main controller, the DN port of the voltage adapter board is connected to the DN port of the main controller, and the voltage adapter board is connected to the main controller through the chip switch.
5. A semiconductor fingerprint sensor LGA particle testing device according to claim 4, It is characterized in that The ammeter is a display ammeter with a display screen, which is used to display the current information of the first current test point.
6. A semiconductor fingerprint sensor LGA particle testing device according to claim 5, It is characterized in that The ammeter is connected to the main controller through a current feedback circuit, and the current feedback circuit includes a feedback resistor R, one end of the resistor R is connected to the negative electrode of the ammeter, and the other end of the resistor R is connected to the I / O signal input end of the main controller; the main controller includes a first data processing unit, and the first data processing unit is used to compare the current information with a pre-stored current threshold.
7. A testing method, wherein the method uses the testing device according to any one of claims 5 or 6 to test the performance of the LGA particles of the semiconductor fingerprint sensor, wherein the performance includes image function and chip function, and the chip switch is used to select whether to test the LGA particles. include: The chip switch is turned on, and the main controller is powered on and works; Collecting current information of the first current test point and the second current test point by using the ammeter; Collecting image information of the fake finger model through the test point 4; The image information is sent to the main controller via the test points 13 to 26; The main controller sends the image information to the host computer; The host computer determines whether the image information meets the standard.
8. The test method according to claim 7, It is characterized in that The host computer includes a second data processing unit, and the second data processing unit is used to compare the image information with a pre-stored standard image.
