Automatic silicon wafer splitting machine

Abstract

The invention discloses a novel automatic silicon wafer splitting machine, which relates to the technical field of silicon wafer splitting equipment, including a fixed table, a fixed frame, a silicon wafer placing table and a lower pressure roller, a sliding table is slidably provided on the upper end of the fixed table, a bearing seat is slidably provided on the upper end of the sliding table, a support column is rotatably provided on the upper end of the bearing seat, the top of the support column is fixed on the silicon wafer placing table, a driven gear is fixedly provided on the outside of the support column, a telescopic cylinder is provided on one side of the bearing seat, a telescopic rod of the telescopic cylinder is fixed on the bearing seat, a rotating drive mechanism and a driving gear are provided on the other side of the bearing seat, and the driven gear and the driving gear are gear-driven after the bearing seat slides close to one side of the rotating drive mechanism, a lower pressure roller that can be lifted and lowered is provided on the inner side of the fixed frame, and the lower pressure roller is arranged on the upper end of the silicon wafer placing table. The invention can automatically rotate the silicon wafer 90 degrees and then split it again, without the need for workers to operate, saving labor, and greatly improving the efficiency of splitting.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer splitting equipment, in particular to an automatic silicon wafer splitting machine. Background Art

[0002] Silicon wafers are important materials for making integrated circuits. Various semiconductor devices can be made by photolithography, ion implantation and other methods. Chips made of silicon wafers have amazing computing power. The development of science and technology has continuously promoted the development of semiconductors. The development of automation and computer technologies has reduced the cost of high-tech products such as silicon wafers to a very low level. Silicon wafers need to be cut during processing. During the laser cutting process, in order to prevent the laser from damaging the cutting platform, the silicon wafer will not be directly cut off. Another process of splitting is required to break the silicon wafer along the laser cutting trace. The existing splitting method is generally operated manually. The silicon wafer is manually taken and clamped, and then a special splitting tool is used to break the silicon wafer along the laser cutting trace. The workers need to concentrate their attention, and the fixation effect of the silicon wafer is poor, which directly causes the silicon wafer to be damaged during splitting, and the labor intensity of the workers is relatively high.

[0003] The Chinese invention patent with application number 201410350738 discloses an automatic silicon wafer splitting machine, including a base, a bracket, an active roller, a driven roller, an adjusting bolt, a driving motor and a switch, wherein the bracket is fixed on the base, the active roller is fixed on the bracket, the driven roller is slidably arranged on the bracket through a fixing frame, the driven roller and the active roller are arranged relatively up and down; the driving motor drives the active roller; threaded holes matching the adjusting bolts are arranged relatively on the crossbar of the bracket and the crossbar of the fixing frame. When this type of wafer splitting machine is used, the machine needs to split in one direction, then flip 90 degrees and put it between the rollers again to split in one direction, that is, one silicon wafer needs to be split twice to complete, and the working efficiency is low. Summary of the invention

[0004] In view of the shortcomings and defects in the prior art, the present invention provides an automatic silicon wafer splitting machine with a high degree of automation, which is used to solve the problem that a silicon wafer needs to be manually adjusted in direction and split twice before completion.

[0005] In order to solve the above technical problems, the present invention adopts the following technical scheme: an automatic silicon wafer splitting machine, comprising a fixed table, a fixed frame, a silicon wafer placing table and a lower pressure roller, a sliding table is slidably provided on the upper end of the fixed table, a bearing seat is slidably provided on the upper end of the sliding table, a support column is rotatably provided on the upper end of the bearing seat, the top of the support column is fixed on the silicon wafer placing table, a driven gear is fixedly provided on the outside of the support column, a telescopic cylinder is provided on one side of the bearing seat, the telescopic rod of the telescopic cylinder is fixed on the bearing seat, a rotating drive mechanism and a driving gear are provided on the other side of the bearing seat, the driven gear and the driving gear are gear-transmitted after the bearing seat slides close to one side of the rotating drive mechanism, a liftable lower pressure roller is provided on the inner side of the fixed frame, and the lower pressure roller is arranged at the upper end of the silicon wafer placing table.

[0006] As a further improvement of the present invention, a limiting cylinder is provided at the upper end of the telescopic cylinder, the telescopic rod of the limiting cylinder is vertically upward, and a limiting hole is provided at the relative position of the silicon wafer placing table, the diameter of the limiting hole is larger than the diameter of the end of the telescopic rod of the limiting cylinder, and there are 4 limiting holes in total, and the angle between every two adjacent limiting holes and the silicon wafer placing table is 90 degrees, and the limiting holes are long strips in the direction from the edge to the center point.

[0007] As a further improvement of the present invention, a longitudinal slide rail is provided at the upper end of the fixed table, a longitudinal slider matching the longitudinal slide rail is provided at the lower end of the slide, a longitudinal drive mechanism is provided at the rear end of the fixed table, the longitudinal drive mechanism is connected to a screw, the other end of the screw is rotatably set on the fixed table, a nut is provided on the screw, and the nut is fixedly set at the bottom end of the slide.

[0008] As a further improvement of the present invention, a transverse slide rail is provided at the upper end of the slide table, and a transverse sliding block matching the transverse slide rail is provided at the bottom end of the bearing seat.

[0009] As a further improvement of the present invention, the fixed frame includes a horizontal bar and vertical frames on both sides, the inner side of the vertical frame is provided with a vertical slide rail, the brackets at both ends of the lower pressure roller are respectively slidably set in the vertical slide rails on both sides, an inverted U-shaped connecting rod is provided at the upper end of the bracket, and a lifting cylinder is provided on the horizontal bar of the fixed frame, and the lifting rod of the lifting cylinder is fixedly set on the U-shaped connecting rod.

[0010] As a further improvement of the present invention, vertically sliding light rods are respectively provided on the cross bars on both sides of the lifting cylinder, the light rods are slidably connected to the cross bars via linear bearings, and the bottom ends of the light rods are fixed to the U-shaped connecting rods.

[0011] As a further improvement of the present invention, a proximity switch is provided on a side of the inner side of the vertical frame close to the telescopic cylinder.

[0012] As a further improvement of the present invention, a proximity switch block is provided on one side of the slide close to the longitudinal drive mechanism and close to the telescopic cylinder.

[0013] Compared with the prior art, the present invention has the following beneficial effects: the present invention uses the sliding of the silicon wafer placement table, and during the sliding process, the lower pressure roller presses down the silicon wafer to split it. After the splitting is completed, the silicon wafer placement table is pushed by the telescopic cylinder until the driving gear and the driven gear are mutually gear-transmitted, and then as the driving gear rotates 90 degrees, the telescopic cylinder pulls the silicon wafer placement table back to its original position again. At this time, the silicon wafer is rotated 90 degrees, and at the same time, the slide slides to the original position driven by the longitudinal drive mechanism, and the silicon wafer is split again. In the whole process, there is no need to manually react the silicon wafer, the degree of automation is high, labor is saved, and the splitting efficiency is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments:

[0015] Figure 1 It is a front view structural schematic diagram of the present invention;

[0016] Figure 2 It is a side structural schematic diagram of the present invention.

[0017] In the figure: 1. fixed table, 2. fixed frame, 201. vertical frame, 202. cross bar, 3. silicon wafer placement table, 4. lower pressure roller, 5. slide table, 6. longitudinal slide rail, 7. longitudinal slider, 8. nut, 9. screw, 10. rotation drive mechanism, 11. driving gear, 12. bearing seat, 13. transverse slide rail, 14. driven gear, 15. telescopic cylinder, 16. proximity switch, 17. limit cylinder, 18. bracket, 19. vertical slide rail, 20. U-shaped connecting rod, 21. light rod, 22. lifting cylinder, 23. longitudinal drive mechanism, 24. proximity opening block, 25. limit hole, 2. support column.

[0018] It is worth noting that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operate in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. DETAILED DESCRIPTION

[0020] In order to make the technical scheme and beneficial effects of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific implementation methods described herein are only used to understand the present invention and are not used to limit the present invention. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0021] See also Figure 1 and Figure 2 The automatic silicon wafer splitting machine comprises a fixed table 1, a fixed frame 2, a silicon wafer placing table 3 and a lower pressure roller 4. A slide table 5 is slidably provided on the upper end of the fixed table 1, and a bearing seat 12 is slidably provided on the upper end of the slide table 5. A support column 26 is rotatably provided on the upper end of the bearing seat 12. The top of the support column 26 is fixed on the silicon wafer placing table 3. A driven gear 14 is fixedly provided on the outside of the support column 26. A telescopic cylinder 15 is provided on one side of the bearing seat 12. The telescopic rod of the telescopic cylinder 15 is fixed on the bearing seat 12. A rotating driving mechanism 10 and a driving gear 11 are provided on the other side of the bearing seat 12. The driven gear 14 and the driving gear 11 are gear-transmitted after the bearing seat 12 slides close to one side of the rotating driving mechanism 10. A liftable lower pressure roller 4 is provided on the inner side of the fixed frame 2. The lower pressure roller 4 is arranged at the upper end of the silicon wafer placing table 3. The sliding direction of the slide table 5 is parallel to the rolling direction of the lower pressure roller 4, and the sliding direction of the bearing seat 12 is perpendicular to the sliding direction of the slide table 5.

[0022] In order to allow the silicon wafer placement table 3 to rotate 90 degrees each time, a limit cylinder 17 is provided at the upper end of the telescopic cylinder 15. The telescopic rod of the limit cylinder 17 is vertically upward, and a limit hole 25 is provided at the relative position of the silicon wafer placement table 3. The diameter of the limit hole 25 is larger than the diameter of the end of the telescopic rod of the limit cylinder 17. There are 4 limit holes 25 in total, and the angle between each two adjacent limit holes 25 and the center position of the silicon wafer placement table 3 is 90 degrees. The limit cylinder 17 is inserted into the limit hole 25 to control the rotation not to exceed 90 degrees, so as to eliminate the inertia caused by the gear transmission. The limit hole 25 is long and strip-shaped in the direction from the edge to the center point.

[0023] In order to allow the silicon wafer placement table 3 and the lower pressure roller 4 to move relative to each other to split the silicon wafer, the silicon wafer placement table 3 needs to be able to slide longitudinally. During the sliding process, the lower pressure roller 4 splits the silicon wafer. The sliding of the silicon wafer placement table 3 is achieved by providing a longitudinal slide rail 6 at the upper end of the fixed table 1, and a longitudinal slider 7 matching the longitudinal slide rail 6 is provided at the bottom end of the slide 5. A longitudinal driving mechanism 23 is provided at the rear end of the fixed table 1, and the longitudinal driving mechanism 23 is connected to a screw 9. The other end of the screw 9 is rotatably set on the fixed table 1, and a nut 8 is provided on the screw 9, and the nut 8 is fixedly set at the bottom end of the slide 5.

[0024] In order to allow the silicon wafer placement table 3 to start rotating when it reaches a suitable position, a proximity switch block 24 is provided on the slide 5 near the longitudinal drive mechanism 23 and at the same time near the telescopic cylinder 15, a proximity switch 16 is provided on the inner side of the vertical frame 201 near the telescopic cylinder 15, a transverse slide rail 13 is provided at the upper end of the slide 5, and a transverse slider matching the transverse slide rail 13 is provided at the bottom end of the bearing seat 12. When the proximity switch 16 and the proximity switch block 24 sense each other, the telescopic cylinder 15 starts, pushing the bearing seat 12 to slide toward the side close to the driving gear 11, and starts to rotate when the driving gear 11 and the driven gear 14 come into contact.

[0025] In order to enable the lower pressure roller to press down the silicon wafer, the fixed frame 2 includes a horizontal bar 202 and vertical frames 201 on both sides. The inner side of the vertical frame 201 is provided with a vertical slide rail 19. The brackets 18 at both ends of the lower pressure roller 4 are respectively slidably set in the vertical slide rails 19 on both sides. An inverted U-shaped connecting rod 20 is provided at the upper end of the bracket 18. A lifting cylinder 22 is provided on the horizontal bar 202 of the fixed frame 2, and the lifting rod of the lifting cylinder 22 is fixedly set on the U-shaped connecting rod 20.

[0026] In order to make the downward pressing of the pressing roller 4 smoother, vertically sliding light rods 21 are respectively provided on the cross bars 202 on both sides of the lifting cylinder 22. The light rods 21 are slidably connected to the cross bars 202 through linear bearings, and the bottom ends of the light rods 21 are fixed on the U-shaped connecting rods 20.

[0027] In order to prevent the silicon wafer from being crushed during the splitting process, soft materials are provided on the outside of the lower pressing roller 4 and the upper end surface of the silicon wafer placement table 3 to protect the integrity of the silicon wafer.

[0028] When the present invention is in use, firstly, the silicon wafer is placed on the silicon wafer placement table 3 according to the direction of splitting, then the lifting cylinder 22 is turned on, the lower pressure roller 4 is pressed down, and the longitudinal driving mechanism 23 is turned on at the same time, the screw 9 starts to rotate, and then drives the slide 5 to move. During the movement of the slide 5, the lower pressure roller 4 presses down the silicon wafer to split it. When the proximity switch block 24 and the proximity switch 16 reach the mutual induction area, the lifting cylinder 22 is turned on, the lower pressure roller 4 rises, and the telescopic cylinder 15 is turned on at the same time. The telescopic rod pushes the bearing seat 12 and drives the driven gear 14 to move to the other side. After the telescopic cylinder 15 is turned on for a certain period of time, the rotation drive mechanism 10 is automatically turned on, the driving gear 11 starts to rotate, and the driving gear 11 drives the driven gear 14 to rotate together, and the silicon wafer placement table 3 rotates accordingly At the same time, the reverse rotation of the longitudinal drive mechanism 23 is started, the slide 5 begins to return to the original position, and the limit cylinder 17 is started. When the telescopic rod of the limit cylinder 17 extends into the limit hole 25, the rotation drive mechanism 10 is closed, and the contraction action of the telescopic cylinder 15 is started at the same time to pull the bearing seat 12 back to the original position. At this time, the slide 5 has returned to the original position, and the silicon wafer placement table 3 has also rotated 90 degrees. The lifting cylinder 22 is started again to lower the lower pressure roller 4, and the above action of splitting the silicon wafer is repeated again. After the silicon wafer is split in two directions, the next silicon wafer is placed, and this reciprocating process is repeated, which greatly saves the workload of the workers, improves the efficiency of silicon wafer splitting, and improves the accuracy, while protecting the integrity of the silicon wafer.

[0029] The invention cooperates with an automatic loading device at the front end and a silicon wafer conveying device at the rear end, which makes silicon wafer splitting more automated.

Claims

1. An automatic silicon wafer splitting machine, characterized in that: It includes a fixed table, a fixed frame, a silicon wafer placing table and a lower pressure roller, the upper end of the fixed table is slidably provided with a slide table, the upper end of the slide table is slidably provided with a bearing seat, the upper end of the bearing seat is rotatably provided with a support column, the top end of the support column is fixed on the silicon wafer placing table, a driven gear is fixedly provided on the outside of the support column, a telescopic cylinder is provided on one side of the bearing seat, the telescopic rod of the telescopic cylinder is fixed on the bearing seat, a rotating driving mechanism and a driving gear are provided on the other side of the bearing seat, the driven gear and the driving gear are gear-transmitted after the bearing seat slides close to one side of the rotating driving mechanism, a liftable lower pressure roller is provided on the inner side of the fixed frame, and the lower pressure roller is arranged on the upper end of the silicon wafer placing table; A limit cylinder is provided at the upper end of the telescopic cylinder, the telescopic rod of the limit cylinder is vertically upward, and a limit hole is provided at a relative position of the silicon wafer placement platform, the diameter of the limit hole is larger than the diameter of the end of the telescopic rod of the limit cylinder, and there are 4 limit holes in total, and the angle between each two adjacent limit holes and the center position of the silicon wafer placement platform is 90 degrees, and the limit hole is in the shape of a long strip along the direction from the edge to the center point; The upper end of the fixed platform is provided with a longitudinal slide rail, the lower end of the slide is provided with a longitudinal slider matching the longitudinal slide rail, the rear end of the fixed platform is provided with a longitudinal drive mechanism, the longitudinal drive mechanism is connected with a screw, the other end of the screw is rotatably arranged on the fixed platform, the screw is provided with a nut, and the nut is fixedly arranged at the lower end of the slide; The longitudinal drive mechanism is turned on, the screw starts to rotate, and then drives the slide to move. During the movement of the slide, the lower pressure roller presses down on the silicon wafer to crack it, and the lower pressure roller rises. At the same time, the telescopic cylinder is turned on, and the telescopic rod pushes the bearing seat and drives the driven gear to move to the other side. After the telescopic cylinder is turned on for a certain period of time, the rotation drive mechanism is automatically turned on, the active gear starts to rotate, and the active gear drives the driven gear to rotate together, and the silicon wafer placement table rotates accordingly. At the same time, the reverse rotation of the longitudinal drive mechanism is turned on, and the slide begins to return to its original position, and the limit cylinder is turned on. When the telescopic rod of the limit cylinder extends into the limit hole, the rotation drive mechanism is closed, and the contraction action of the telescopic cylinder is turned on to pull the bearing seat back to its original position. At this time, the slide has returned to its original position and the silicon wafer placement table has also rotated 90 degrees.

2. The automatic silicon wafer splitting machine according to claim 1, characterized in that: The upper end of the slide table is provided with a transverse slide rail, and the bottom end of the bearing seat is provided with a transverse sliding block matching the transverse slide rail.

3. The automatic silicon wafer splitting machine according to claim 1, characterized in that: The fixed frame includes a cross bar and vertical frames on both sides, the inner side of the vertical frame is provided with a vertical slide rail, the brackets at both ends of the lower pressure roller are respectively slidably set in the vertical slide rails on both sides, an inverted U-shaped connecting rod is provided at the upper end of the bracket, and a lifting cylinder is provided on the cross bar of the fixed frame, and the lifting rod of the lifting cylinder is fixedly set on the U-shaped connecting rod.

4. The automatic silicon wafer splitting machine according to claim 3, characterized in that: Vertically sliding light rods are respectively arranged on the cross bars on both sides of the lifting cylinder. The light rods are slidably connected to the cross bars through linear bearings, and the bottom ends of the light rods are fixed on the U-shaped connecting rods.

5. The automatic silicon wafer splitting machine according to claim 3, characterized in that: A proximity switch is arranged on one side of the inner side of the vertical frame close to the telescopic cylinder.

6. The automatic silicon wafer splitting machine according to claim 1, characterized in that: A proximity switch block is provided on one side of the slide close to the longitudinal drive mechanism and close to the telescopic cylinder.

7. The automatic silicon wafer splitting machine according to claim 1, characterized in that: The outer portion of the lower pressing roller and the upper end surface of the silicon wafer placing table are both provided with soft materials.

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