A layered rigid-flex board with electroplating and a method for manufacturing the same

Abstract

The present invention discloses a method for manufacturing a layered rigid-flexible board with electroplated gold, the method comprising: providing an outer rigid board, an inner flexible board, and a prepreg to be pressed, wherein an electroplated gold lead and an electroplated gold lead conductive end are provided on the non-electroplated gold area of ​​the inner flexible board; sequentially performing pressing, drilling, electroplating, and milling processes on the outer rigid board, the inner flexible board, and the prepreg; placing a supporting component between the inner flexible boards, and sequentially performing an electroplating process and a post-process on the rigid-flexible board to obtain a layered rigid-flexible board with electroplated gold. The method for manufacturing a layered rigid-flexible board with electroplated gold provided by the present invention provides conditions for subsequent electroplating process processing by providing an electroplated gold lead and an electroplated gold lead conductive end on the non-electroplated gold area of ​​the inner flexible board. The method has a simple process, avoids the problem of expansion and contraction coefficient in the pressing process, improves the pass rate of the product, and saves costs.

Description

Technical Field

[0001] The present invention relates to the field of circuit boards, and in particular to a method for manufacturing a layered rigid-flexible board with electroplated gold and the layered rigid-flexible board with electroplated gold. Background Art

[0002] In the field of rigid-flex PCB, when the number of flexible boards or flexible boards is greater than or equal to 2 layers, and the flexible boards are layered, it is called a multi-layered rigid-flex PCB.

[0003] The processing of multi-layered rigid-flex PCBs is more difficult than that of ordinary rigid-flex PCBs. If there is a requirement for electroplated gold surface area (hereinafter referred to as electroplated gold area) on each flexible board, the difficulty is further increased.

[0004] Since the electroplated gold area is in the flexible board layer, and each flexible board layer has an electroplated gold area, that is, from the final form and structure of the product, part of the electroplated gold area exists in the "inner layer", so a special process is required during processing.

[0005] At present, the general method of manufacturing is to process layer by layer, electro-metallize layer by layer, and then press together. That is, each flexible board that needs electro-metallization is electro-metallized one by one, and finally the layers are pressed together for processing.

[0006] This processing method will result in a cumbersome electroplating process for multi-layered rigid-flex PCBs, requiring a large amount of manpower, materials, and time. Moreover, after each flexible PCB is electroplated one by one, the matching of the expansion and contraction coefficients between them is reduced, and the expansion and contraction is difficult to control. The graphics need to be constantly changed to adapt to the new expansion and contraction coefficients of each layer, further increasing the difficulty of processing. If the coefficients are not well controlled, it is very easy to cause scrap.

[0007] Therefore, based on the above background, it is necessary to provide a manufacturing method that can effectively shorten the manufacturing process of the electroplating area of ​​the multi-layered rigid-flexible board and ensure product reliability. Summary of the Invention

[0008] The main purpose of the present invention is to propose a method for manufacturing a layered rigid-flexible board with electroplating, aiming to solve the technical problems that the production process of the electroplating area of ​​the existing multi-layered rigid-flexible board is cumbersome and easily scrapped due to low expansion and contraction coefficient matching.

[0009] To achieve the above objectives, the present invention proposes a method for manufacturing a layered rigid-flex PCB with electroplating, the method comprising:

[0010] providing an outer rigid plate to be pressed;

[0011] Providing a plurality of inner-layer flexible boards to be pressed together, wherein the plurality of inner-layer flexible boards include areas to be electroplated and areas not to be electroplated, applying a peelable blue adhesive to the areas to be electroplated of the plurality of inner-layer flexible boards, and providing electroplated gold leads and electroplated gold lead conductive ends connected to the electroplated gold leads on the non-electroplated areas of the plurality of inner-layer flexible boards;

[0012] Providing a plurality of prepregs to be laminated, wherein the prepregs between the plurality of inner flexible boards are subjected to windowing treatment;

[0013] Performing a lamination process on the outer rigid board, the plurality of inner flexible boards, and the plurality of prepreg layers to obtain a laminated rigid-flex board;

[0014] The laminated rigid-flexible board is subjected to drilling, electroplating and large through-groove milling processes in sequence to obtain a layered rigid-flexible board to be electroplated.

[0015] A supporting component is placed between the plurality of inner-layer flexible boards, and the layered rigid-flexible board to be electroplated is subjected to an electroplating process and a post-process in sequence to obtain a layered rigid-flexible board with electroplating.

[0016] Furthermore, the step of milling the large through groove process includes: the milling direction of the large through groove process extends from the flexible board area of ​​the rigid-flexible board to the board edge support area.

[0017] Furthermore, the number of the electro-gold lead rings, electro-gold lead pads or electro-gold lead blocks is single or multiple.

[0018] Furthermore, the number of the electro-gold leads is single or multiple.

[0019] Furthermore, the plurality of gold-coated leads are connected to the plurality of gold-coated lead conductive ends in a one-to-one correspondence; or, one gold-coated lead is connected to the plurality of gold-coated lead conductive ends; or, the plurality of gold-coated leads are connected to the same gold-coated lead conductive end.

[0020] Furthermore, the pattern of the electro-gold lead is a straight line, a curve or a broken line.

[0021] Furthermore, the width of the strippable blue glue is equal to the width of the area to be electroplated with gold, and the length of the strippable blue glue is 2mm-6mm greater than the length of the area to be electroplated with gold.

[0022] Furthermore, the supporting component is an elastic supporting strip.

[0023] Furthermore, the elastic support strip is an elastic support strip with a U-shaped opening.

[0024] To achieve the above object, the present invention proposes a layered rigid-flexible board with electroplated gold, and the layered rigid-flexible board with electroplated gold is manufactured by the above-mentioned manufacturing method.

[0025] In the technical solution of the present invention, the present invention provides a method for manufacturing a layered rigid-flexible board with electroplating, which provides conditions for subsequent electroplating process by arranging electroplating leads and electroplating lead conductive ends on the non-electroplating area of ​​the inner flexible board; by arranging supporting components, each flexible board layer is supported and finally effective electroplating processing is performed; it effectively prevents the problem of difficult-to-control expansion and contraction caused by layer-by-layer processing and then pressing; the manufacturing method has a simple process, avoids the expansion and contraction coefficient problem of the pressing process, improves the product pass rate, and saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0027] Figure 1 This is a schematic diagram of the process flow of a method for manufacturing a layered rigid-flex PCB with electroplating gold according to the present invention;

[0028] Figure 2 This is a schematic structural diagram of a layered rigid-flex board with electroplating gold according to the present invention;

[0029] Figure 3 This is a schematic structural diagram of a layered rigid-flex board with electroplating to be pressed together according to the present invention;

[0030] Figure 4a It is a structural schematic diagram of an embodiment of an electroplated gold lead and an electroplated gold lead conductive end according to the present invention;

[0031] Figure 4b It is a structural schematic diagram of another embodiment of the electroplated gold lead and the electroplated gold lead conductive end of the present invention;

[0032] Figure 4c It is a structural schematic diagram of another embodiment of the electroplated gold lead and the electroplated gold lead conductive end of the present invention;

[0033] Figure 5a For the present invention Figure 3 Schematic diagram of the structure after slot milling;

[0034] Figure 5b For the present invention Figure 5a Schematic diagram of the cross-sectional structure of AA;

[0035] Figure 6 It is a structural schematic diagram of the supporting component of the present invention;

[0036] Figure 7a A schematic diagram of the top view of the support member of the present invention during processing;

[0037] Figure 7b For the present invention Figure 7a Schematic diagram of the cross-sectional structure of the BB.

[0038] Description of Figure Numbers:

[0039]

[0040] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0042] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0043] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0044] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0045] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0046] In the prior art, the typical manufacturing process for ordinary circuit boards includes: cutting; inner layer pattern processing (pre-processing micro-etching, laminating the photosensitive layer, exposure, development, etching, and stripping); layout and lamination processing; drilling processing; electroplating (copper deposition, board electroplating); outer layer pattern processing; pattern electroplating processing; solder mask processing; surface treatment processing; molding processing; electrical testing processing; FQC appearance inspection processing; packaging processing; and shipping. The rigid-flex PCB manufacturing method of this embodiment focuses on the inner layer flexible board processing and layout and lamination processing process.

[0047] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the process flow of a method for manufacturing a layered rigid-flex PCB with electroplating gold according to the present invention; Figure 2 The figure is a schematic structural diagram of a layered rigid-flexible board with electroplating gold according to the present invention.

[0048] like Figure 2 As shown, the layered rigid-flex board 100 with electroplating gold in this embodiment is composed of Figure 1 The layered rigid-flex circuit board 100 with electroplating gold, obtained by the manufacturing method, includes, from the inside to the outside, a plurality of inner flexible boards 120 and a first prepreg layer 131 located between the inner flexible boards 120; two outer rigid boards 110 and a second prepreg layer 132 located between the outer rigid boards 110 and the inner flexible boards 120; and a flexible board cover film 140 located outside the flexible board area of ​​the inner flexible boards 120. A electroplating gold layer 150 treated with electroplating gold is provided on one side of the inner flexible boards 120.

[0049] Please also refer to Figure 1 7 , the steps of the method for manufacturing a layered rigid-flex PCB with electroplating gold of the present invention specifically include:

[0050] Step S10: providing an outer rigid plate to be pressed.

[0051] In this embodiment, an outer layer rigid board 110 to be pressed is provided, which is a rigid board on both sides of the outer side of the rigid-flexible board. The outer layer rigid board to be pressed is usually a multi-layer rigid board. The multi-layer outer layer rigid board to be pressed can be composed of a plurality of single-layer rigid boards and / or double-layer rigid boards. Each single-layer rigid board and / or double-layer rigid board is a rigid board with a circuit already made. In this embodiment, each single-layer rigid board and / or double-layer rigid board is a complete rigid board, including the rigid area of ​​the rigid-flexible board and the flexible area of ​​the rigid-flexible board. Among them, the rigid board in the flexible area will be removed through the milling process in subsequent work.

[0052] Specifically, the outer rigid board to be laminated is one that already has circuitry fabricated. It is typically a multi-layered rigid board, where the upper and lower rigid boards can have the same or different number of layers, and can have either an odd or even number of layers. For example, both upper and lower rigid boards can have four layers, or the upper rigid board can have five layers and the lower rigid board can have six layers. These examples are not listed here. This is illustrated by the upper and lower rigid boards 110 (circuitry not shown).

[0053] Step S20: providing a plurality of inner-layer flexible boards to be pressed together, wherein the plurality of inner-layer flexible boards include areas to be electroplated and areas not to be electroplated, applying a peelable blue glue on the areas to be electroplated of the plurality of inner-layer flexible boards, and providing electroplated gold leads and electroplated gold lead conductive ends connected to the electroplated gold leads on the non-electroplated areas of the plurality of inner-layer flexible boards.

[0054] In the field of rigid-flex boards, when there are two or more layers of flexible boards, and the flexible boards are separated by layers, it is called a multi-layered rigid-flex board. The layered rigid-flex board in this embodiment also has two or more layers of flexible boards (including two layers) and a layered structure between the flexible boards. The two-layer structure is used as an example, but it is not limiting.

[0055] like Figure 4a As shown, a plurality of inner-layer flexible boards 120 to be pressed are provided, and the number of layers of the inner-layer flexible boards 120 is two or more, wherein each inner-layer flexible board 120 is an inner-layer flexible board with circuits already made. In this embodiment, each inner-layer flexible board 120 is a double-layer flexible board with copper layers on both sides. The plurality of inner-layer flexible boards 120 include a region to be electroplated 121 and a non-electroplated region 122, that is, each inner-layer flexible board that needs to be electroplated is provided with a region to be electroplated 121 and a non-electroplated region 122; further, a peelable blue glue 123 is applied on the region to be electroplated 121 of the plurality of inner-layer flexible boards 120, and an electroplated gold lead 124 and an electroplated gold lead conductive end 125 connected to the electroplated gold lead 124 are provided on the non-electroplated gold region 122 of the plurality of inner-layer flexible boards 120.

[0056] Specifically, a peelable blue glue 123 is applied to the area to be electroplated 121 of each inner flexible board 120 that requires electroplating, wherein the width of the peelable blue glue 123 is equal to the width of the area to be electroplated 121, and the length of the peelable blue glue 123 is greater than the length of the area to be electroplated 121 by 2mm-6mm. The strippable blue glue 123 is provided to protect the gold area to be electrified 121 from mutual friction and extrusion during the pressing process, thereby causing problems such as scratches on the copper surface; the size of the strippable blue glue 123 is set as follows: its width is the same as the gold area to be electrified 121. If the width is too large, the strippable blue glue 123 will overlap with the covering film of the flexible board, and pressing will cause a bulge problem. If the width is too small, it will not be enough to effectively protect the gold area to be electrified 121; its length is relatively long, and its length is 2mm-6mm longer than the length of the gold area to be electrified 121, because it is necessary to open a window on the side of the flexible board area first, and then tear off the strippable blue glue. Therefore, the length of the strippable blue glue 123 is set longer than the length of the gold area to be electrified 121, to ensure sufficient length for opening the window and tearing off the strippable blue glue.

[0057] Furthermore, in addition to the area to be electroplated 121 and the non-electroplated area 122, the inner flexible board 120 is also provided with a board edge support area 126. The board edge support area 126 is a board edge waste area or an ineffective area of ​​the board edge, which provides support and other required functions for the rigid-flexible board during the manufacturing process. On each non-electroplated area 122 of the inner flexible board 120 that requires electroplating, an electroplating lead 123 and an electroplating lead conductive end 125 connected to the electroplating lead 124 are provided. The electroplating lead 124 extends from the area to be electroplated 122 to the board edge support area 126, and the electroplating lead conductive end 125 is located in the board edge support area 126. The electroplating lead conductive end 125 is the position where the electroplating fixture of the subsequent electroplating process is clamped.

[0058] In this embodiment, the pattern of the conductive gold lead 124 can be a straight line, a curved line, or a broken line. In practical applications, when the pattern of the conductive gold lead 124 is a straight line, it can coexist with the effective pattern circuit of the inner flexible board 120, that is, it is a copper layer circuit, which reduces the changes in the processing pattern circuit and shortens the development time. When the conductive gold lead 124 does not coexist with the effective pattern circuit of the inner flexible board 120, that is, the conductive gold lead 124 is an additional copper layer circuit, it can be a straight line, a curved line, or a broken line, independent of the effective pattern circuit of the inner flexible board 120, with less impact on the effective pattern circuit of the inner flexible board 120, allowing for diversified design solutions and good stability.

[0059] Specifically, the copper layer pattern of the conductive gold lead terminal 125 is ring-shaped, disc-shaped, or square-shaped, allowing the conductive gold lead terminal 125 to be ring-shaped, circular, or square-shaped. After the pressing process, the conductive gold lead terminal 125 needs to be drilled and electroplated. The drilling process drills a large hole with a diameter of 1mm-5mm. After drilling, the conductive gold lead terminal 125 becomes a lead hole. The lead hole includes a large annular ring (i.e., the conductive area outside the hole). The single-side dimension of the annular ring is at least 0.5mm-3.0mm larger than the drilled hole diameter, i.e., the outer diameter of the annular ring is 1.0mm-6.0mm larger than the drilled hole diameter. A larger annular ring can improve the conductive effect. For example, when the conductive gold lead terminal 125 is ring-shaped, the inner diameter of the annular ring is equal to the drilled hole diameter, and the outer diameter of the annular ring is 1.0mm-6.0mm larger than the drilled hole diameter. When the conductive end 125 of the electro-gold lead can be circular or square, the machining accuracy can be reduced, as long as a hole ring larger than the drill hole diameter of 1.0mm-6.0mm is provided. In this embodiment, after the pressing process, the conductive end 125 of the electro-gold lead needs to be drilled and electroplated. Through electroplating of the lead hole, the hole is metallized. The electro-gold lead 124 extends from the non-electro-gold area of ​​the inner flexible board 120 to the lead hole position, forming a conductive arrangement, providing a conductive lead for the area to be electro-golded 121 on the inner flexible board 120.

[0060] To effectively improve the conductive effect, in this embodiment, the number of the conductive gold lead ends 125 can be single or multiple. The number of the conductive gold leads 124 can be single or multiple. Multiple conductive gold leads can be connected to multiple conductive gold lead ends in a one-to-one correspondence; alternatively, one conductive gold lead can be connected to multiple conductive gold lead ends; alternatively, multiple conductive gold leads can be connected to the same conductive gold lead end.

[0061] More specifically, when the number of the conductive gold lead 125 is single, it can be connected to a single or multiple conductive gold leads 124, or when the number of the conductive gold lead 125 is multiple, it can also be connected to a single or multiple conductive gold leads 124. Typically, one conductive gold lead 124 is connected to one conductive gold lead 125 (see Figure 4a ), forming a one-to-one correspondence; when an electric gold lead 124 is connected to multiple electric gold lead conductive ends 125 (see Figure 4b ), the electro-gold lead conductive end 125 provides multiple conductive positions, and its electro-gold treatment success rate is high; when multiple electro-gold leads 124 are connected to a single electro-gold lead conductive end 125, multiple electro-gold lead conductive ends 125 are provided for conduction, and its electro-gold treatment efficiency is high. When multiple electro-gold leads 124 are connected to multiple electro-gold lead conductive ends 125 (see Figure 4c ), its electroplating gold processing success rate is high and the efficiency is also high.

[0062] In this embodiment, the inner flexible board 120 to be laminated is a pre-printed flexible board. The inner flexible board 120 includes a rigid board area 127 and a flexible board area 128. A flexible board cover film 140 is applied to both sides of the flexible board area 128. Prior to application, the flexible board cover film 140 has window treatment in the area to be plated, where gold is to be applied. Removable blue adhesive 123 is then applied to the area to be plated. The flexible board cover film 140 protects the flexible board area of ​​the rigid-flex board and also serves to separate the inner flexible boards.

[0063] Step S30: providing a plurality of prepregs to be laminated, wherein the prepregs between the plurality of inner-layer flexible boards are subjected to windowing treatment.

[0064] A plurality of prepregs 130 to be laminated are provided, and the prepregs between the inner flexible boards 120 are subjected to windowing treatment.

[0065] Specifically, such as Figure 3 As shown, the prepreg 130 includes a first prepreg 131 placed between the inner flexible boards 120, and a second prepreg 132 placed between the outer rigid board 110 and the inner flexible board 120. More specifically, the first prepreg 131 includes two prepregs 1311 with a first window size and one prepreg 1312 with a second window size, while the second prepreg 132 includes a prepreg 1321 with a first window size and a prepreg 1322 without a window. The first window size is larger than the second window size. The prepreg 1311 with the first window size is positioned adjacent to the flexible board cover film 140, and the second window size is adjacent to the flexible board area. This arrangement allows a portion of the flexible board cover film 140 to extend into the rigid board area.

[0066] Step S40: performing a lamination process on the outer rigid board, the plurality of inner flexible boards, and the plurality of prepreg layers to obtain a laminated rigid-flex board.

[0067] like Figure 3 As shown, with the outer rigid board 110 on the outside and the inner flexible board 120 on the inside, a flexible board cover film 140 is applied on both sides of each inner flexible board 120, and two prepregs 1311 and a prepreg 1312 are placed between the two inner flexible boards 120, and a prepreg 1321 and a prepreg 1322 are placed between the outer rigid board and the inner flexible board 120, wherein a peelable blue glue 123 is applied to the area to be electroplated on the inner flexible board 120. According to the above placement rules, the two outer rigid boards 110 to be laminated, the two inner flexible boards 120 and the multiple prepreg layers are subjected to a lamination process to obtain a laminated rigid-flexible board.

[0068] Step S50: performing drilling, electroplating and milling large through-grooves on the laminated rigid-flexible board in sequence to obtain a layered rigid-flexible board to be electroplated.

[0069] The laminated rigid-flexible board is processed in sequence with drilling, electroplating, outer layer patterning, solder resist and large through-groove milling to obtain a layered rigid-flexible board to be electroplated.

[0070] First, the laminated rigid-flexible board is subjected to drilling and electroplating processes in sequence to obtain a layered rigid-flexible board to be processed.

[0071] A drilling process is performed at the location of the conductive end 125 of the electro-gold lead. The hole diameter of the drilling process is 1mm-5mm. In this embodiment, a through hole is drilled in the conductive end 125 of the electro-gold lead. The through hole is then electroplated to metalize the through hole of the rigid-flexible board, preparing for subsequent electro-gold deposition. Specifically, after the lamination process, the conductive end 125 of the electro-gold lead needs to be drilled and electroplated. Through electroplating of the lead hole, the hole is metalized. The electro-gold lead 124 extends from the non-electro-gold area of ​​the inner flexible board 120 to the lead hole location, forming a conductive structure and providing a conductive lead for the area 121 to be electro-gold deposited on the inner flexible board 120.

[0072] Then, the rigid-flexible board to be processed is processed in sequence with outer layer patterning, solder resist and large through-groove milling processes to obtain a layered rigid-flexible board to be electroplated.

[0073] The outer layer pattern and solder resist process are existing manufacturing technologies and will not be described in detail here.

[0074] The layered rigid-flexible board to be milled with large through-grooves is subjected to a large through-groove milling process to obtain the layered rigid-flexible board to be electroplated.

[0075] like Figure 5a and Figure 5b As shown, the inner flexible board 120 also includes milled large through-grooves 129 located on either side of the flexible board area 128. These large through-grooves are milled on both sides. The milled large through-grooves 129 are relatively wide, but after milling, a certain board edge support area must be reserved to provide support for subsequent electroplating. The width of the milled large through-grooves ranges from 10 mm to 50 mm.

[0076] In this embodiment, the large through-groove milling process is used, that is, large through-grooves are milled on both sides of the flexible area of ​​the entire rigid-flexible board, while the rigid area is temporarily not milled. A large through-groove is formed, and the rigid board area is retained on the outside of the large through-groove. The rigid area is retained to form support for the flexible area to facilitate subsequent electrometallurgical processing.

[0077] The large through-groove milling process extends the milling direction from the flexible board area of ​​the rigid-flexible board to the board edge support area. That is, the milling direction of the large through-groove milling process starts from the edge of the flexible board area 128 of the rigid-flexible board and gradually extends "outward" to the board edge support area 126. Finally, a certain width of the board edge is reserved in the board edge support area 126. The reserved board edge width ranges from 5mm to 10mm, for example. The reserved board edge not only provides exchange space for the subsequent electroplating of the flexible board area, but also provides support for the processing of the flexible board area of ​​the rigid-flexible board.

[0078] Step S60: placing a supporting component between the plurality of inner-layer flexible boards, and sequentially performing an electroplating process and a post-process on the layered rigid-flexible board to be electroplated to obtain a layered rigid-flexible board with electroplating.

[0079] In this embodiment, Figure 6 As shown, the support component 160 is an elastic support bar. The elastic support bar is an elastic support bar with a U-shaped opening. Specifically, the elastic support bar 160 includes a support base 161 and two support rods 162. The support base 161 and the support rods 162 are integrally formed, and the elastic support bar 160 is made of smooth, elastic plastic. The support base 161 can provide elasticity for the support rods 162, and the support rods 162 can support the inner layer flexible board 120, "separating" each flexible board or flexible board to form a layered rigid-flexible board (a gap is formed between the flexible boards to prevent the layers from adhering to each other and provide space for the exchange of potions for the electroplating gold).

[0080] like Figure 7a and 7b As shown, elastic support bars 160 are placed between multiple inner-layer flexible boards 120, and the layered rigid-flex board to be electroplated is subjected to the electroplating process and post-processing in sequence to obtain a layered rigid-flex board with electroplating. Specifically, after the elastic support bars 160 are placed, the electroplating pre-treatment process is performed. The electroplating pre-treatment process uses a weak acid solution (or micro-etching solution) for pre-treatment (no mechanical polishing or sandblasting pre-treatment is required). During electroplating, the electroplating leads and the conductive ends of the electroplating leads are used to conduct electricity to the area to be electroplated on the flexible board. The support bars prop up the flexible board layers, and the solution enters the flexible board layers and exchanges, forming a layered rigid-flex board with electroplating.

[0081] The principle of electroplating is basically the same as that of electroplating. The conductive end 125 of the electroplating lead on the inner flexible board 120 is used to introduce current to form an electroplating current loop, so that the gold ions in the electroplating solution gain electrons and undergo a reduction reaction, and then adhere to the copper surface of the area to be electroplated to form an electroplated gold layer 150.

[0082] After the electroplating is completed, the support strips are removed and the molding process and post-processing are finally carried out. Among them, the molding process and post-processing are the existing processing steps of the circuit board and will not be described in detail here.

[0083] In this embodiment, the multi-layer layered rigid-flexible board is first pressed together to form an integral circuit board, and lead holes are set on the edge of the board and leads are set inside the board to form conductive conditions for electroplating. The area to be electroplated is protected by applying blue glue, and a large groove is milled on the side of the flexible board without milling through the support area of ​​the board edge. The retained rigid board is used to form a support for the flexible board, and support strips are set to hold the flexible board layer apart, and finally effective electroplating is performed; this effectively prevents the problem of uncontrollable expansion and contraction caused by layer-by-layer processing and then pressing, effectively shortens the processing flow, saves manpower, materials, and time costs, and effectively improves product reliability.

[0084] To sum up, in the technical solution of the present invention, the method for manufacturing a layered rigid-flexible board with electroplated gold provided by the present invention provides conditions for subsequent electroplating process by arranging electroplated gold leads and electroplated gold lead conductive ends on the non-electroplated gold area of ​​the inner flexible board. The manufacturing method has a simple process, avoids the expansion and contraction coefficient problem of the pressing process, improves the product pass rate, and saves costs.

[0085] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a layered rigid-flexible board with electroplating, characterized in that: The production method comprises: providing an outer rigid plate to be pressed; Providing a plurality of inner-layer flexible boards to be pressed together, wherein the plurality of inner-layer flexible boards include areas to be electroplated and areas not to be electroplated, applying a peelable blue adhesive to the areas to be electroplated of the plurality of inner-layer flexible boards, and providing electroplated gold leads and electroplated gold lead conductive ends connected to the electroplated gold leads on the non-electroplated areas of the plurality of inner-layer flexible boards; Providing a plurality of prepregs to be laminated, wherein the prepregs between the plurality of inner flexible boards are subjected to windowing treatment; Performing a lamination process on the outer rigid board, the plurality of inner flexible boards, and the plurality of prepreg layers to obtain a laminated rigid-flex board; The laminated rigid-flexible board is subjected to drilling, electroplating and large through-groove milling processes in sequence to obtain a layered rigid-flexible board to be electroplated. An elastic support strip with a U-shaped opening is placed between the plurality of inner flexible boards, and the layered rigid-flexible board to be electroplated is subjected to an electroplating process and a post-process in sequence to obtain a layered rigid-flexible board with electroplating.

2. The production method according to claim 1, wherein: The steps of milling the large through groove process include: the milling direction of the large through groove process extends from the flexible board area of ​​the rigid-flexible board to the board edge support area.

3. The production method according to claim 2, characterized in that The number of the electro-gold lead ring, electro-gold lead pad or electro-gold lead block is single or multiple.

4. The production method according to claim 3, wherein: The number of the electro-gold leads is one or more.

5. The production method according to claim 4, characterized in that: Multiple gold leads are connected to multiple gold lead conductive ends in a one-to-one correspondence; or, one gold lead is connected to multiple gold lead conductive ends; or, multiple gold leads are connected to the same gold lead conductive end.

6. The production method according to claim 1, wherein: The graph of the electro-gold lead is a straight line, a curve or a broken line.

7. The production method according to claim 1, wherein: The width of the strippable blue glue is equal to the width of the area to be electroplated with gold, and the length of the strippable blue glue is 2mm-6mm greater than the length of the area to be electroplated with gold.

8. A layered rigid-flex board with electroplated gold, characterized in that: The layered rigid-flex circuit board with electroplated gold is manufactured by the manufacturing method according to any one of claims 1 to 7.

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