A dual-drive system power device

Abstract

The present invention relates to a power device of a dual-drive system, which comprises a dual-drive power component and a heat dissipation component. The heat dissipation component includes a first heat dissipation support plate and a second heat dissipation support plate. The dual-drive power component is divided into two groups and symmetrically arranged on one side of the first heat dissipation support plate. The first heat dissipation support plate and the second heat dissipation support plate are hermetically connected to form two cooling channels corresponding to the two groups of power components. Compared with the prior art, the power device of the dual-drive system is smaller in volume, better in heat dissipation effect, smaller in inductance, and more convenient for automated assembly.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of drive motor controllers for new energy vehicles, and particularly to a power device for a dual-drive system. Background Art

[0002] With the continuous development of the electric drive vehicle industry, the requirements for the internal layout space of vehicles are becoming increasingly strict, the requirements for the volume of drive motor controllers are getting smaller, and the requirements for integration are getting higher, so as to meet the layout requirements of the whole vehicle.

[0003] However, inside the existing drive motor controllers, the structural layout is usually such that the power module and the heat dissipation water channel are separated. The heat dissipation water channel is integrated at the bottom surface of the motor controller box to dissipate heat from the power module. Especially in a dual-motor drive control system, two sets of the same power modules need to be assembled, and the heat dissipation system also needs to be enlarged to dissipate heat from the two modules. This layout method of separating the power module and the heat dissipation water channel will cause the overall volume of the electrical device to be large, the integration degree to be low, and the assembly process to be cumbersome, making it difficult to meet the development requirements of the current drive motor controller for integration, miniaturization, and automated production. Summary of the Invention

[0004] The purpose of the present invention is to overcome the above-mentioned defects existing in the prior art and provide a power device for a dual-drive system.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A power device for a dual-drive system includes a dual-drive power component and a heat dissipation component. The heat dissipation component includes a first heat dissipation support plate and a second heat dissipation support plate. The dual-drive power component is divided into two groups and symmetrically arranged on one side of the first heat dissipation support plate. The first heat dissipation support plate and the second heat dissipation support plate are hermetically connected to form two cooling channels corresponding to the two groups of power components.

[0007] The two cooling channels are interconnected to form a U shape. One of the cooling channels is connected to the inlet of the U-shaped cooling channel, and the other cooling channel is connected to the outlet of the U-shaped cooling channel.

[0008] The first heat dissipation support plate and the second heat dissipation support plate are hermetically connected to form a reflux channel and two cooling channels corresponding to the two groups of power components. Both of the two cooling channels are communicated with the reflux channel. The inlets of the two cooling channels and the outlet of the reflux channel are located on the same side of the heat dissipation component. A diverter is located at the inlet and the outlet. The diverter diverts the coolant of the two cooling channels and blocks the reflux liquid of the coolant from the reflux channel.

[0009] The inlet of the cooling channel and the outlet of the reflux channel are connected to a shunt groove. The shunt groove is connected to a shunt groove liquid inlet and a shunt groove liquid outlet located on the side wall of the second heat dissipation support plate. The shunt groove liquid outlet and the shunt groove liquid inlet are arranged longitudinally. The two cooling channels and the reflux channel are communicated through a confluence groove, and a diverter is located in the shunt groove.

[0010] The shunt groove liquid outlet is located above the shunt groove liquid inlet. The diverter includes a body and two wings connected to the body. One end of the body is clamped to the inner wall of the reflux channel. The depth of the reflux channel is adapted to the size of the shunt groove liquid outlet. The other end is connected to the side wall of the second heat dissipation support plate between the shunt groove liquid outlet and the shunt groove liquid inlet. The two wings are clamped to the inner wall of the shunt groove, and the two wings are connected to the first heat dissipation support plate.

[0011] Both the shunt groove and the confluence groove are long strip-shaped grooves.

[0012] Heat dissipation pins are arranged in a staggered manner inside the two cooling channels.

[0013] The first heat dissipation support plate forms a boss corresponding to the dual-drive power component. The cavity between the boss and the second heat dissipation support plate forms a cooling channel. The dual-drive power component is fixedly connected to the boss.

[0014] The dual-drive power component is connected by vacuum reflow soldering to an insulating board.

[0015] The dual-drive power component includes an insulating board, an upper-tube IGBT and a lower-tube IGBT connected to the insulating board. The upper-tube IGBT and the lower-tube IGBT are fixedly arranged in opposite directions on the first heat dissipation support plate. Both the upper-tube IGBT and the lower-tube IGBT are provided with a wide copper row at one end and a narrow copper row at the other end. The narrow copper row of the upper-tube IGBT is connected to the wide copper row of the lower-tube IGBT. The insulating tube is connected to the first heat dissipation support plate.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] (1) The dual-drive power components are integrated together and directly connected to the heat dissipation component, which is beneficial to reducing the volume of the drive motor controller. The dual-drive power components are divided into two groups and symmetrically arranged on one side of the first heat dissipation support plate. The first heat dissipation support plate and the second heat dissipation support plate are hermetically connected to form two cooling channels corresponding to the two groups of power components. The two cooling channels can well dissipate heat from the dual-drive power components divided into two groups. This structure is beneficial to improving the heat dissipation efficiency.

[0018] (2) The first heat dissipation support plate and the second heat dissipation support plate are hermetically connected to form a reflux channel and two cooling channels corresponding to two sets of power components. Both cooling channels are connected to the reflux channel. The inlets of the two cooling channels and the outlet of the reflux channel are located on the same side of the heat dissipation component. The diverter is located at the inlet and the outlet. The diverter diverts the coolant of the two cooling channels and blocks the coolant from mixing with the reflux liquid in the reflux channel. This structure adopts a parallel connection method for the two cooling channels, which can further improve the heat dissipation effect, enhance the integration, facilitate the reduction of the volume of the drive motor controller, and is convenient for automated assembly.

[0019] (3) The dual-drive power components are divided into two groups and symmetrically arranged on one side of the first heat dissipation support plate, which makes the current performance and voltage performance of the system better, with a small inductance, effectively avoiding the generation of voltage spikes and current spikes, and reducing the probability of failure of the dual-drive power components.

[0020] (4) The first heat dissipation support plate and the second heat dissipation support plate are formed by cold extrusion, with high strength and density. The density of the heat dissipation pins is large, the heat dissipation area is increased several times, and the heat dissipation efficiency is high, which can meet the heat dissipation requirements for the normal operation of the dual-drive system.

[0021] (5) Cooling is carried out through the diverter, shunt groove, confluence groove, reflux channel and cooling channel, and the processing technology is simple and easy to implement. Brief Description of the Drawings

[0022] Figure 1 It is a three-dimensional structure schematic diagram of Embodiment 1 of the present invention;

[0023] Figure 2 It is a partial structure schematic diagram of the dual-drive power components of the present invention;

[0024] Figure 3 It is a schematic diagram of the upper surface structure of the first heat dissipation support plate of the present invention;

[0025] Figure 4 It is a schematic diagram of the lower surface structure of the first heat dissipation support plate of the present invention;

[0026] Figure 5 It is a schematic diagram of the structure of the second heat dissipation support plate of Embodiment 1 of the present invention;

[0027] Figure 6 It is a schematic diagram of the structure of the diverter of Embodiment 1 of the present invention;

[0028] Figure 7 It is a schematic diagram of the structure of the second heat dissipation support plate of Embodiment 2 of the present invention;

[0029] Reference Signs:

[0030] 1 is a dual-drive power component; 2 is the first heat dissipation support plate; 3 is the second heat dissipation support plate; 4 is a shunt; 11 is an insulating plate; 12 is an upper-tube IGBT; 13 is a lower-tube IGBT; 14 is an AC output terminal; 15 is a positive input terminal; 16 is a negative input terminal; 23 is a cooling channel; 24 is a heat dissipation pin; 25 is a boss; 31 is a shunt groove liquid inlet; 32 is a shunt groove liquid outlet; 33 is a shunt groove; 34 is a return channel; 35 is a confluence groove; 36 is a body; 37 is a flank; 38 is a U-shaped cooling channel liquid inlet; 39 is a U-shaped cooling channel liquid outlet. Detailed implementation mode

[0031] The present invention will be described in detail below with reference to the drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and gives a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0032] Embodiment 1

[0033] This embodiment provides a dual-drive system power device, including a dual-drive power component 1 and a heat dissipation component. The heat dissipation component includes a first heat dissipation support plate 2 and a second heat dissipation support plate 3. The dual-drive power component 1 is divided into two groups and symmetrically arranged on one side of the first heat dissipation support plate 2. The first heat dissipation support plate 2 and the second heat dissipation support plate 3 are hermetically connected to form two cooling channels 23 corresponding to the two groups of power components.

[0034] Specifically:

[0035] As Figure 1 shown, the first heat dissipation support plate 2 and the second heat dissipation support plate 3 are hermetically connected to form a return channel 34 and two cooling channels 23 corresponding to the two groups of power components. The two cooling channels 23 are both communicated with the return channel 34. The inlets of the two cooling channels and the outlet of the return channel 34 are located on the same side of the heat dissipation component. The shunt 4 is located at the inlet and the outlet. The shunt 4 shunts the coolant of the two cooling channels 23 and blocks the return liquid of the coolant from the return channel 34 (the liquid in the cooling channel 23 is called coolant, and the liquid in the return channel 34 is called return liquid). As Figure 4 and Figure 5As shown, the inlet of the cooling channel and the outlet of the reflux channel 34 are connected to the flow dividing groove 33. The flow dividing groove 33 is connected to the flow dividing groove liquid inlet 31 and the flow dividing groove liquid outlet 32 on the side wall of the second heat dissipation support plate 3. The flow dividing groove liquid outlet 32 and the flow dividing groove liquid inlet 31 are arranged longitudinally. The two cooling channels 23 and the reflux channel 34 are communicated through the confluence groove 35. The flow divider 4 is located in the flow dividing groove 33. The flow dividing groove liquid outlet 32 is above the flow dividing groove liquid inlet 31. The flow divider 4 divides the flow dividing groove 33 into upper and lower parts. One part is directly communicated with the reflux channel 34 and the flow dividing groove liquid outlet 32, and the other part is below the flow divider 4, so that the flow dividing groove liquid inlet 31 is communicated with the inlet of the cooling channel, as Figure 6 shown, the flow divider 4 includes a body 36 and two wings 37 connected to the body 36. One end of the body 36 is clamped to the inner wall of the reflux channel 34. The depth of the reflux channel 34 is adapted to the size of the flow dividing groove liquid outlet 32. The other end is connected to the side wall of the second heat dissipation support plate 3 between the flow dividing groove liquid outlet 32 and the flow dividing groove liquid inlet 31. The two wings 37 are clamped to the inner wall of the flow dividing groove 33. The two wings 37 are connected to the first heat dissipation support plate 2. The flow dividing groove 33, the reflux channel 34 and the confluence groove 35 are all long strip-shaped grooves.

[0036] The two cooling channels 23 are symmetrically arranged in parallel and are both cuboid cavity structures. Elliptical heat dissipation pins 24 are arranged in a staggered manner inside the cavity. The spacing between the heat dissipation pins 24 is 1.1 mm and the height is 24 mm.

[0037] As Figure 3 shown, the first heat dissipation support plate 2 forms a boss 25 corresponding to the dual-drive power component 1. The cavity between the boss 25 and the second heat dissipation support plate 3 forms the cooling channel 23. The dual-drive power component 1 is fixedly connected to the boss 25.

[0038] The insulating plate 11 is a rectangular non-metallic sheet. The dual-drive power component 1 is connected to the insulating plate 11 by vacuum reflow soldering with low-temperature solder paste.

[0039] As Figure 2 shown, the dual-drive power component 1 includes an insulating plate 11, and an upper tube IGBT 12 and a lower tube IGBT 13 fixed on the insulating plate 11. The upper tube IGBT 12 and the lower tube IGBT 13 have the same structure. The upper tube IGBT 12 and the lower tube IGBT 13 are fixed to the insulating plate 11 in opposite directions. Both the upper tube IGBT 12 and the lower tube IGBT 13 are provided with a wide copper row at one end and a narrow copper row at the other end. The narrow copper row of the upper tube IGBT 12 is connected to the wide copper row of the lower tube IGBT 13 to form an AC output terminal 14. The wide copper row of the upper tube IGBT 12 is the positive input terminal 15, and the narrow copper row of the lower tube IGBT 13 is the negative input terminal 16. The insulating plate 11 is fixedly connected to the first heat dissipation support plate 2.

[0040] The first heat dissipation support plate 2 and the second heat dissipation support plate 3 are cold extruded.

[0041] In this embodiment, the flow mode of the liquid during the actual working process is as follows: The liquid first enters the shunt groove 33 from the shunt groove liquid inlet 31. Since the shunt groove 33 is separated into two parts by the shunt 4, the lower part is communicated with the shunt groove liquid inlet 31. Therefore, the liquid enters the lower part of the shunt groove 33, is evenly shunted to the left and right, and enters the inlets of the two cooling channels, and then enters the two cooling channels 23, exchanges heat with the internal heat dissipation pins 24, takes away the heat generated by the dual-drive power component 1, and finally enters the confluence groove 35 from the outlets of the two cooling channels to complete concentration, and then enters the return channel 34 and flows out to the shunt groove liquid outlet 32, and is discharged through the shunt groove liquid outlet 32 to complete the entire circulation process.

[0042] The assembly process of the dual-drive system power device in this embodiment is as follows:

[0043] The upper-tube IGBT 12 and the lower-tube IGBT 13 are fixed side by side in reverse on the insulating plate 11 and fixed by reflow soldering to complete the assembly of the dual-drive power component 1.

[0044] Then, the dual-drive power component 1 is installed on the boss 25 of the first heat dissipation support plate 2. Then, the shunt 4 is placed inside the shunt groove 33 and fixed with glue. Then, the second heat dissipation support plate 3 with the shunt 4 placed is fixed on the lower surface of the first heat dissipation support plate 2 with bolts, and wet glue is used for sealing in the middle.

[0045] The dual-drive system power device of this embodiment has the following advantages:

[0046] The dual-drive power component 1 is self-integrated and deeply integrated with the heat dissipation component, making it smaller in volume, better in heat dissipation effect, smaller in inductance, and more convenient for automated assembly.

[0047] The fixed position between the upper-tube IGBT 12 and the lower-tube IGBT 13 in this embodiment is only one fixed position in this embodiment. For example, the upper-tube IGBT 12 and the lower-tube IGBT 13 can also be arranged in parallel in a line. In actual operation, the structure of the dual-drive system power device can also be changed by changing the fixed positions of the upper-tube IGBT 12 and the lower-tube IGBT 13, as long as the electrical connection structure of these dual-drive power components 1 meets the requirements. These arrangement methods are within the scope of protection of this patent.

[0048] In this embodiment, the dual-drive power component 1 is fixed on the first heat dissipation support plate 2 by bolts. If it is replaced with fully automatic laser welding assembly, laser welding fixation can also be achieved. Welding can not only meet the requirements of electrical connection, but also reduce inductance and save space. These connection methods are within the scope of protection of this patent.

[0049] Embodiment 2

[0050] The two cooling channels 23 communicate with each other to form a U shape. One of the cooling channels 23 is connected to the U-shaped cooling channel liquid inlet 38, and the other cooling channel 23 is connected to the U-shaped cooling channel liquid outlet 39. That is, the two cooling channels 23 form a series structure. The liquid flows into one of the cooling channels 23 from the U-shaped cooling channel liquid inlet 38, and then enters the other cooling channel 23. During this period, the liquid exchanges heat with the dual-drive power component 1, and finally flows out from the U-shaped cooling channel liquid outlet 39 to complete a cooling cycle.

[0051] The assembly process of the dual-drive system power device in this embodiment is as follows:

[0052] The upper tube IGBT 12 and the lower tube IGBT 13 are fixed side by side in reverse on the insulating plate 11 and fixed by reflow soldering to complete the assembly of the dual-drive power component 1.

[0053] Then, the dual-drive power component 1 is installed on the boss 25 of the first heat dissipation support plate 2, and then the second heat dissipation support plate 3 is fixed on the lower surface of the first heat dissipation support plate 2 with bolts, and wet glue is used for sealing in the middle. The rest is the same as in Embodiment 1.

Claims

1. A dual-drive system power device, characterized in that, It includes a dual-drive power component (1) and a heat dissipation component. The heat dissipation component includes a first heat dissipation support plate (2) and a second heat dissipation support plate (3). The dual-drive power component (1) is divided into two groups and symmetrically arranged on one side of the first heat dissipation support plate (2). The first heat dissipation support plate (2) and the second heat dissipation support plate (3) are hermetically connected to form a reflux channel (34) and two cooling channels (23) corresponding to the two groups of power components (1). The two cooling channels (23) are located on the side of the first heat dissipation plate (2) where the power component (1) is not installed, and the reflux channel (34) is located on the side of the second heat dissipation plate (3) close to the first heat dissipation plate (2). The two cooling channels (23) are both communicated with the reflux channel (34). The inlets of the two cooling channels (23) and the outlet of the reflux channel (34) are located on the same side of the heat dissipation component. The inlet of the cooling channel (23) and the outlet of the reflux channel (34) are connected to a flow dividing groove (33), and a flow divider (4) is located in the flow dividing groove (33). The flow divider (4) divides the coolant of the two cooling channels (23) and blocks the reflux liquid of the coolant from the reflux channel (34).

2. The power device of a dual-drive system according to claim 1, characterized in that, The two cooling channels (23) are communicated with each other to form a U shape. One of the cooling channels (23) is connected to the inlet (38) of the U-shaped cooling channel, and the other cooling channel (23) is connected to the outlet (39) of the U-shaped cooling channel.

3. A dual-drive system power device according to claim 1, characterized in that, The flow dividing groove (33) is connected to a flow dividing groove inlet (31) and a flow dividing groove outlet (32) on the side wall of the second heat dissipation support plate (3). The flow dividing groove outlet (32) and the flow dividing groove inlet (31) are arranged longitudinally. The two cooling channels (23) and the reflux channel (34) are communicated through a confluence groove (35).

4. A dual-drive system power device according to claim 3, characterized in that The flow dividing groove outlet (32) is located above the flow dividing groove inlet (31). The flow divider (4) includes a body (36) and two wings (37) connected to the body (36). One end of the body (36) is clamped to the inner wall of the reflux channel (34). The depth of the reflux channel (34) is adapted to the size of the flow dividing groove outlet (32). The other end is connected to the side wall of the second heat dissipation support plate (3) between the flow dividing groove outlet (32) and the flow dividing groove inlet (31). The two wings (37) are clamped to the inner wall of the flow dividing groove (33), and the two wings (37) are connected to the first heat dissipation support plate (2).

5. A dual-drive system power device according to claim 3, characterized in that, Both the flow dividing groove (33) and the confluence groove (35) are long strip-shaped grooves.

6. A dual-drive system power device according to claim 1, wherein, Heat dissipation pins (24) are arranged in a staggered manner inside the two cooling channels (23).

7. A dual-drive system power device according to claim 1, characterized in that, The first heat dissipation support plate (2) forms a boss (25) corresponding to the dual-drive power component (1). The cavity between the boss (25) and the second heat dissipation support plate (3) forms a cooling channel (23), and the dual-drive power component (1) is fixedly connected to the boss (25).

8. A dual-drive system power device according to claim 7, characterized in that The dual-drive power component (1) is connected to the insulating board (11) by vacuum reflow soldering.

9. A dual-drive system power device according to claim 1, characterized in that, The dual-drive power component (1) includes an insulating plate (11), an upper-tube IGBT (12) and a lower-tube IGBT (13) connected to the insulating plate (11). The upper-tube IGBT (12) and the lower-tube IGBT (13) are fixedly arranged in opposite directions on a first heat dissipation support plate (2). One end of each of the upper-tube IGBT (12) and the lower-tube IGBT (13) is provided with a wide copper bar, and the other end is provided with a narrow copper bar. The narrow copper bar of the upper-tube IGBT (12) is connected to the wide copper bar of the lower-tube IGBT (13), and the insulating plate is connected to the first heat dissipation support plate (2).

Images