Polarizer, display panel including the polarizer, and method of manufacturing the polarizer

Abstract

The present invention relates to a polarizer, a display panel including the polarizer, and a method for manufacturing the polarizer. The polarizer includes a buffer member and a linear metal pattern. The buffer member includes a protrusion. Each protrusion has a width that increases downward. The buffer member is formed of a polymer. The linear metal patterns separated from each other extend in a first direction. Each linear metal pattern covers a respective protrusion.

Description

[0001] This invention application is a divisional application of an invention application with an application date of October 26, 2015, an application number of 201510701072.3 (the application number of the divisional application is 201911167343.6) and an invention name of “Polarizer, display panel including a polarizer, and method for manufacturing a polarizer”. Technical Field

[0002] The present invention relates to a wire grid polarizer, a method of manufacturing a polarizer, and a display panel including a polarizer. Background Art

[0003] Polarizers control the transmittance of light. Polarizers can transmit polarization components parallel to the emission axis, and can absorb or reflect polarization components perpendicular to the emission axis.

[0004] Polarizers include absorption polarizers and reflection polarizers. Reflective polarizers reflect a specific polarization component of incident light to polarize it. The reflected polarization component of the incident light can be reused by the reflection plate of the backlight assembly to increase the brightness of the display device. Summary of the invention

[0005] According to an exemplary embodiment of the present invention, a polarizer includes a buffer member and a linear metal pattern. The buffer member includes a protrusion. Each protrusion has a width that increases downward. The buffer member is formed of a polymer. The linear metal patterns separated from each other extend in a first direction. Each linear metal pattern covers a respective protrusion.

[0006] According to an exemplary embodiment of the present invention, a method for manufacturing a polarizer is provided as follows. A buffer layer including a polymer and a metal layer are formed. The metal layer is formed on the buffer layer. A linear metal pattern and a plurality of protrusions are formed from the metal layer and the buffer layer respectively by pressing the metal layer and the buffer layer using a mold having a pressing pattern. At least a portion of each protrusion is inserted into the respective linear metal pattern.

[0007] According to an exemplary embodiment of the present invention, a display panel includes a first substrate, a second substrate facing the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a polarizer including a plurality of linear metal patterns and a buffer member formed of a polymer and having a plurality of protrusions. A portion of each protrusion is inserted into the respective linear metal pattern. Each protrusion has a tapered shape.

[0008] According to an exemplary embodiment of the present invention, a display panel includes a buffer member and a metal wire. The buffer member includes a protrusion. Each protrusion protrudes from an upper surface of the buffer member, and the protrusion causes the buffer member to have a corrugated surface. The metal wire is arranged on the corrugated surface of the buffer member. Each protrusion is surrounded by a respective metal wire, and two adjacent metal wires expose a portion of the upper surface of the buffer member between the two adjacent metal wires. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] These and other features of the inventive concept will become more apparent by describing in detail exemplary embodiments of the inventive concept with reference to the accompanying drawings, in which:

[0010] Figure 1 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention;

[0011] Figure 2 is a top view of a polarizer according to an exemplary embodiment of the present invention;

[0012] Figure 3 yes Figure 1 an enlarged cross-sectional view of area "A";

[0013] Figures 4 to 7 is a diagram showing the manufacturing method according to an exemplary embodiment of the present invention. Figure 1 A cross-sectional view of the polarizer method shown;

[0014] Figure 8 is a perspective view of a pressing process using a roller;

[0015] Fig. 9 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention;

[0016] Fig.10 and Fig.11 is a diagram showing the manufacturing method according to an exemplary embodiment of the present invention. Fig. 9 A cross-sectional view of the polarizer method shown;

[0017] Figure 12 to Figure 14 is a cross-sectional view showing a method of manufacturing a polarizer according to an exemplary embodiment of the present invention;

[0018] Fig.15 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention;

[0019] Fig.16 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention;

[0020] Fig.17 and Fig.18 is a diagram showing the manufacturing method according to an exemplary embodiment of the present invention. Fig.16 A cross-sectional view of a method of a polarizer;

[0021] Fig.19 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention;

[0022] Fig. 20 and Fig.21 is a diagram showing the manufacturing method according to an exemplary embodiment of the present invention. Fig.19 A cross-sectional view of a method of a polarizer;

[0023] Figure 22 to Figure 24 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention;

[0024] Fig.25 is a cross-sectional view of a display panel according to an exemplary embodiment of the present invention;

[0025] Fig.26 is a cross-sectional view of a display panel according to an exemplary embodiment of the present invention; and

[0026] Fig. 27 is a cross-sectional view of a display panel according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0027] Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, the present invention can be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. In the drawings, the thickness of layers and regions may be magnified for clarity. It will also be understood that when an element is referred to as being "on" another element or substrate, it can be directly on another element or substrate, or there may also be an intermediate layer. It will also be understood that when an element is referred to as being "coupled to" or "connected to" another element, it can be directly coupled or connected to another element, or there may also be an intermediate element. Throughout the specification and drawings, the same reference numerals may refer to the same elements.

[0028] Figure 1 is a cross-sectional view of a polarizer according to an exemplary embodiment. Figure 2 is a top view of a polarizer according to an exemplary embodiment. Figure 3 yes Figure 1 An enlarged cross-sectional view of area "A" is shown in FIG.

[0029] refer to Figure 1 and Figure 2The polarizer includes a base substrate 10a, a buffer member 11a disposed on the base substrate 10a, and a wire grid array disposed on the buffer member 11a. The wire grid array includes a plurality of linear metal patterns 13a extending in a first direction D1 and spaced apart from each other in a second direction D2 intersecting the first direction D1. The buffer member 11a includes a protrusion 12a. At least a portion of the protrusion 12a is inserted into the linear metal pattern 13a.

[0030] The base substrate 10a may include a glass substrate, a quartz substrate, a sapphire substrate, a plastic substrate, etc. The plastic substrate may include polyimide, polyethylene terephthalate, polyethylene naphthalate, polyvinyl chloride, etc.

[0031] The base substrate 10a may be removed after forming the wire grid array.

[0032] If the buffer member 11a has a sufficient thickness, the base substrate 10a may be omitted in the manufacture of the wire grid array. In this case, the removal of the base substrate 10a after the formation of the wire grid array may also be omitted.

[0033] The cushioning member 11a includes a polymer so that the cushioning member 11a is elastic. The polymer may include a thermoplastic resin or a thermosetting resin. For example, the cushioning member 11a may include polymethyl methacrylate, polydimethylsiloxane, polycarbonate, polyethylene terephthalate, polystyrene, polyethylene, polypropylene, polyvinyl alcohol, etc. The polymer may be modified or a copolymer.

[0034] In one exemplary embodiment, the cushioning member 11a may include a polymer having a rubber phase at room temperature and having a softening point equal to or less than about 50° C. For example, the cushioning member 11a may include polydimethylsiloxane or a copolymer thereof. Examples of polydimethylsiloxane copolymers may include polydimethylsiloxane / polycarbonate copolymers, polydimethylsiloxane / polymethyl methacrylate copolymers, and the like.

[0035] Alternatively, the buffer member 11 a may include a polymer having a softening point equal to or greater than about 100° C. For example, the buffer member 11 a may include polyethylene terephthalate, polycarbonate, or a copolymer thereof.

[0036] The buffer member 11a may have various thicknesses depending on the thickness of the linear metal pattern 13a and a manufacturing process. For example, the buffer member 11a may have a thickness of about 30 nanometers to about 500 nanometers.

[0037] The buffer member 11a includes a protrusion 12a protruding from the upper surface of the buffer member 11a. For example, the buffer member 11a may include a base having a flat layer shape and a protrusion 12a protruding from the base. The protrusion 12a is inserted into the linear metal pattern 13a so that the upper surface and the side surface of the protrusion 12a are covered by the linear metal pattern 13a. In an exemplary embodiment, substantially the entire portion of the protrusion 12a may be inserted into the linear metal pattern 13a.

[0038] The protrusion 12a may extend in the same direction as the direction in which the linear metal pattern 13a extends. For example, the protrusion 12a extends in the first direction D1. The protrusion 12a is arranged to correspond to each linear metal pattern 13a. Therefore, the protrusions 12a are arranged to be parallel to each other in the second direction D2. The protrusion 12a and the buffer member 11a are formed in a single unit. Therefore, the protrusion 12a and the buffer member 11a are formed of the same material.

[0039] The wire grid array is used to perform polarization. For example, when light is incident on the wire grid array, the component of the light parallel to the transmission axis of the wire grid array can be transmitted, and the component of the light perpendicular to the transmission axis of the wire grid array can be reflected.

[0040] The linear metal pattern 13a may include a metal. For example, the linear metal pattern 13a may include aluminum, gold, silver, copper, chromium, iron, nickel, titanium, molybdenum, tungsten, or an alloy thereof. In an exemplary embodiment, the linear metal pattern 13a may include aluminum, gold, silver, or copper. In an exemplary embodiment, the linear metal pattern 13a includes aluminum having relatively high ductility and reflectivity. In addition, the linear metal pattern 13a may have a multilayer structure including different metal layers. In addition, the linear metal pattern 13a may further include metal oxides, metal nitrides, and the like.

[0041] The linear metal pattern 13a may have a pitch, a thickness, and a line width such that the linear metal pattern 13a serves to polarize light.

[0042] For example, the pitch of the linear metal pattern 13a may be less than the wavelength of the incident light. For example, the pitch P of the linear metal pattern 13a may be equal to or less than about 400 nanometers to polarize the visible light. In an exemplary embodiment, the pitch P of the linear metal pattern 13a may be equal to or less than about 150 nanometers. For example, the pitch of the linear metal pattern 13a may be about 50 nanometers to about 150 nanometers.

[0043] In one exemplary embodiment, the thickness H of the linear metal pattern 13a may be defined as the length between the upper end of the protrusion 12a and the upper end of the linear metal pattern 13a. The thickness H of the linear metal pattern 13a may be equal to or greater than about 80 nanometers. In one exemplary embodiment, the thickness H may be about 80 nanometers to about 300 nanometers.

[0044] The transmittance or refractive index of the wire grid array may depend on the ratio of the line width to the pitch P. The line width may be defined differently depending on the shape of the linear metal pattern 13a and the size of the protrusion 12a. For example, the line width may be defined as the width W1 of the lower end of the linear metal pattern 13a or the width W2 of the upper end of the linear metal pattern 13a. The linear metal pattern 13a may have a tapered shape. Therefore, the width W1 of the lower end may be greater than the width W2 of the upper end. In an exemplary embodiment, the line width may be less than or equal to about 100 nanometers. For example, the line width may be about 20 nanometers to about 100 nanometers.

[0045] refer to Figure 3 , the protrusion 12a of the buffer member 11a and the linear metal pattern 13a may have a tapered shape including a lower end wider than an upper end.

[0046] Therefore, a taper angle θ1 of the linear metal pattern 13a defined by a side surface of the linear metal pattern 13a and an upper surface of the buffer member 11a and a taper angle θ2 of the protrusion 12a defined by a side surface of the protrusion 12a and a horizontal line extending from the upper surface of the buffer member 11a may be less than about 90°. In addition, the taper angle θ2 of the protrusion 12a may be smaller than the taper angle θ1 of the linear metal pattern 13a.

[0047] although Figure 1 The linear metal pattern 13a shown has a tapered shape such that the width W1 of the lower end is greater than the width W2 of the upper end, but the present invention is not limited thereto. The shape of the linear metal pattern 13a may vary depending on, for example, the shape of the mold. For example, the cross-section of the linear metal pattern 13a may have a substantially rectangular shape to increase polarization.

[0048] Furthermore, although the cross section of the protrusion 12a has Figures 1 to 3 The cross section of the protrusion 12a may be changed depending on, for example, the shape of the mold or the conditions of the manufacturing process. For example, the cross section of the protrusion 12a may have a triangular shape, an arc shape, etc.

[0049] Figures 4 to 7 It shows the manufacturing Figure 1 A cross-sectional view of an approach to a polarizer. Figure 8 is a perspective view of a pressing process using a roller 160 .

[0050] refer to Figure 4 and Figure 5 , a buffer layer BL is formed on the base substrate 10 a , and a metal layer ML is formed on the buffer layer BL.

[0051] The buffer layer BL may include polymethyl methacrylate, polydimethylsiloxane, polycarbonate, polyethylene terephthalate, polystyrene, polyethylene, polypropylene, polyvinyl alcohol, or a copolymer thereof.

[0052] A composition including a polymer dispersed in a solvent such as alcohol, glycol, ether, etc. may be provided on the base substrate 10a. The solvent may be removed by a drying process to form a buffer layer BL. In an exemplary embodiment, the buffer layer BL is first formed into a sheet, and the buffer layer BL is attached to the base substrate 10a, for example, by lamination. In an exemplary embodiment, a composition including a polymer resin, a curing agent, and a polymerization initiator is provided on the base substrate 10a, and the composition may be cured by thermal curing or photocuring to form a buffer layer BL including a cured polymer resin.

[0053] The metal layer ML may include aluminum, gold, silver, copper, chromium, iron, nickel, titanium, molybdenum, tungsten or alloys thereof. In an exemplary embodiment, the metal layer ML may include aluminum, gold, silver or copper. The metal layer ML may be formed by a conventional method for forming a metal layer, such as sputtering, lamination, etc.

[0054] After the metal layer ML is formed, the mold 16a including the pressing pattern 17a is disposed on the metal layer ML to press the metal layer ML. The pressing pattern 17a approaches the metal layer ML in the pressing process.

[0055] The mold 16a includes a material having a higher surface hardness than the metal layer ML. For example, the mold 16a may include a material having a high surface hardness, such as silicon, nickel, tungsten, or the like.

[0056] The pressing pattern 17a extends in one direction. A plurality of pressing patterns 17a are arranged parallel to each other in a direction intersecting the extending direction. The cross section of the pressing pattern 17a has a tapered shape so that the width of the upper end is greater than the width of the lower end. The pressing patterns 17a are spaced apart from each other to form a groove therebetween. The groove may have a shape substantially the same as the linear metal pattern to be formed in the pressing process.

[0057] refer to Figure 5 and Figure 6As the mold 16a is pressed to the metal layer ML, the shape of the pressing surface of the mold 16a is transferred to the metal layer ML and the buffer layer BL. A portion of the metal layer ML and a portion of the buffer layer BL are deformed along the shape of the pressing surface of the mold 16a. Although the buffer layer BL has rubber elasticity, the deformed portion of the buffer layer BL is covered by the plastically deformed portion of the metal layer ML, so the deformed portion of the buffer layer BL maintains a protruding shape, and the deformed portion contacts the lower end of the pressing pattern 17a and can penetrate into the buffer layer BL. During the transfer process, the metal layer ML may be elongated along the deformed portion of the buffer layer BL, and the elongated metal layer ML is disconnected in the region contacting the lower end of the pressing pattern 17a.

[0058] As a result, a wire grid array including a plurality of linear metal patterns 13a spaced apart from each other and arranged in parallel with each other is formed. In addition, the buffer layer BL is partially pressed to form a buffer member 11a including a protrusion 12a inserted into the linear metal pattern 13a. Even if the buffer member 11a includes a polymer having a rubber phase at room temperature, the shape of the protrusion 12a can be maintained because the protrusion 12a is constrained by the linear metal pattern 13a. Because the protrusion 12a is formed by the penetration of the pressing pattern 17a, the protrusion 12a can have a smaller taper angle than the linear metal pattern 13a.

[0059] In the process of pressing the mold 16a, the metal layer ML and the buffer layer BL may be heated. For example, if the buffer layer BL includes a polymer having a solid phase at room temperature and if the pressing process is performed at room temperature, the buffer layer BL may have insufficient flexibility. When a polymer having a solid phase at room temperature is heated to a temperature close to a glass transition temperature or a softening point, the phase of the polymer changes to a rubber phase. Therefore, the buffer layer BL may provide sufficient flexibility and elasticity.

[0060] The heating temperature may vary depending on the properties of the polymer of the buffer layer BL. For example, the heating temperature may be, but is not limited to, about 100°C to about 200°C.

[0061] In an exemplary embodiment, heat HEAT is provided by the base substrate 10a. For example, a conveyor belt conveying the base substrate 10a may include a central portion to heat the base substrate 10a. Alternatively, the mold 16a may be heated. Heat may be provided before the mold 16a approaches the base substrate 10a.

[0062] In an exemplary embodiment, the mold 16a may have a plate shape. Alternatively, Figure 8 The mold 16a shown may have a roll shape. The mold having a roll shape can reduce the manufacturing time for manufacturing a large-sized polarizer.

[0063] refer to Figure 7, the mold 16a is removed from the buffer member 11a and the wire grid array.

[0064] According to an exemplary embodiment, the mold may be directly pressed into a metal layer disposed on a buffer layer providing elasticity and flexibility to form a wire grid array. Therefore, an etching process using a mask may be omitted. Therefore, damage to the wire grid pattern due to the etching process may be prevented or reduced. In addition, the manufacturing time for the polarizer may be reduced.

[0065] In addition, since the protrusion of the buffer member is inserted into the linear metal pattern, the lower surface of the linear metal pattern has an uneven cross-section. Therefore, when the polarizer is used in the display substrate, the reflection of external light can be prevented or reduced to improve the display quality.

[0066] In addition, the polarizer may include a buffer member having flexibility, or may be directly formed on a flexible substrate. Therefore, the polarizer may be used for a flexible display device.

[0067] Fig. 9 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention. Fig.10 and Fig.11 It shows the manufacturing Fig. 9 A cross-sectional view of the polarizer approach is shown.

[0068] In the following exemplary embodiments, for and Figures 1 to 3 Any repeated description of elements of the polarizer having the same function and including the same material will be omitted.

[0069] refer to Fig. 9 , the polarizer includes a base substrate 10b, a buffer member 11b disposed on the base substrate 10b, and a wire grid array disposed on the buffer member 11b. The wire grid array includes a plurality of linear metal patterns extending in a first direction and spaced apart from each other in a second direction intersecting the first direction. The buffer member 11b includes a plurality of protrusions 12b. Each protrusion 12b is covered by a respective linear metal pattern. In an exemplary embodiment, at least a portion of each protrusion 12b is inserted into a respective linear metal pattern.

[0070] The linear metal pattern includes a lower metal pattern 13b and an upper protective pattern 14 covering the lower metal pattern 13b. The protrusion 12b of the buffer member 11b is inserted into the lower metal pattern 13b. The upper protective pattern 14 covers the upper and side surfaces of the lower metal pattern 13b.

[0071] The lower metal pattern 13b and the upper protection pattern 14 are formed of different materials from each other. For example, the lower metal pattern 13b may include aluminum, gold, silver, copper or an alloy thereof. The upper protection pattern 14 may include molybdenum, tungsten, titanium, nickel, an alloy thereof, an oxide thereof or a nitride thereof. The upper protection pattern 14 may be used to protect the lower metal pattern 13b in a subsequent process after the lower metal pattern 13b is formed.

[0072] refer to Fig.10 and Fig.11 , a buffer layer BL is formed on the base substrate 10b. A first metal layer ML1 is formed on the buffer layer BL. A second metal layer ML2 is formed on the first metal layer ML1. In an exemplary embodiment, the second metal layer ML2 is thinner than the first metal layer ML1.

[0073] The buffer layer BL may include the polymers listed above.

[0074] The first metal layer ML1 may include aluminum, gold, silver, copper, or an alloy thereof. The second metal layer ML2 may include molybdenum, tungsten, titanium, nickel, or an alloy thereof.

[0075] After the second metal layer ML2 is formed on the base substrate 10b, the base substrate 10b is pressed using a mold 16b having a pressing pattern 17b. During the pressing, the first metal layer ML1 and the second metal layer ML2 and the buffer layer BL are pressed to form a Fig. 9 degree of structure.

[0076] As a result, a wire grid array including a plurality of linear metal patterns spaced apart from each other, each of the linear metal patterns including a lower metal pattern 13 b and an upper protective pattern 14 , is formed.

[0077] Figure 12 to Figure 14 is a cross-sectional view illustrating a method of manufacturing a polarizer according to an exemplary embodiment of the present invention.

[0078] refer to Fig.12 and Fig.13 , a mold 16c including a pressing pattern 17c is used to press the metal layer to form a linear metal pattern 13c and a buffer member 11c including a protrusion 12c. According to the pressing process conditions, Fig.13 The linear metal patterns 13c shown are connected to each other by connection portions 15 remaining after the pressing process.

[0079] like Fig.14As shown, an etching process is used to remove the connection portion 15. For example, after the mold 16c is raised from the base substrate 10c, an etchant ETCH is provided so that the connection portion 15 is removed. The linear metal pattern 13c is partially removed in the etching process for removing the connection portion 15. In the process of removing the connection portion 15, the thickness of the linear metal pattern 13c is reduced, and the spacing between two adjacent linear metal patterns 13c is increased. The etching process may include an isotropic etching process or an anisotropic etching process. In order to prevent the profile of the linear metal pattern 13c from being damaged, the connection portion 15 may be removed by an anisotropic etching process.

[0080] Alternatively, the connection portion 15 does not need to be removed if it is thin to the extent that visible light passes through the connection portion 15. For example, if the connection portion 15 including aluminum may have a thickness equal to or less than about 10 nanometers, visible light may pass through the connection portion 15, and thus the connection portion does not need to be removed. Therefore, the wire grid array having the connection portion 15 can be used to polarize incident light.

[0081] Fig.15 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention.

[0082] refer to Fig.15 , the polarizer includes a base substrate 10d, a buffer member 11d disposed on the base substrate 10d, a plurality of linear metal patterns 13d disposed on the buffer member 11d, and a protective layer 20 disposed on the linear metal patterns 13d. The linear metal patterns 13d extend in a first direction and are spaced apart from each other in a second direction intersecting the first direction. The buffer member 11d includes a protrusion 12d. Each linear metal pattern 13d covers a respective protrusion 12d. In an exemplary embodiment, at least a portion of each protrusion 12d may be inserted into a respective linear metal pattern 13d.

[0083] The protective layer 20 has a continuous film shape. The protective layer 20 protects the linear metal pattern 13d. The protective layer 20 has a flat film shape opposite to the buffer member 11d. Therefore, an air gap 50 is formed between adjacent linear metal patterns 13d. The air gap 50 can increase the refractive index difference of the polarizer to improve the polarization characteristics.

[0084] The protective layer 20 may be formed of an inorganic insulating material including silicon oxide (SiOx), silicon oxycarbide (SiOC), silicon nitride (SiNx), etc. The protective layer 20 may have a thickness of about 100 nanometers to about 1 micrometer. For example, the protective layer 20 may be formed using a chemical vapor deposition process.

[0085] Although the polarizer includes the protective layer having a flat film shape so that air gaps are formed between adjacent linear patterns in this exemplary embodiment, a polarizer according to another exemplary embodiment may include an organic insulating layer or an inorganic insulating layer filling the air gaps 50 between the linear patterns.

[0086] Fig.16 is a cross-sectional view of a polarizer according to an exemplary embodiment of the present invention. Fig.17 and Fig.18 is shown for manufacturing Fig.16 A cross-sectional view of an approach to a polarizer.

[0087] refer to Fig.16 The polarizer includes a base substrate 10e, a buffer member 11e disposed on the base substrate 10e, a wire grid array disposed on the buffer member 11e, and a reflective component 22 formed of the same layer as the wire grid array. The wire grid array includes a plurality of linear metal patterns 13e extending in a first direction and spaced apart from each other in a second direction intersecting the first direction. The buffer member 11e includes a first protrusion 12e and a second protrusion 21. At least a portion of the first protrusion 12e is inserted into the linear metal pattern 13e. At least a portion of the second protrusion 21 is inserted into the reflective component 22.

[0088] The reflective part 22 has a width greater than that of the linear metal pattern 13e. The second protrusion 21 has a width greater than that of the first protrusion 12e. The polarizer including the reflective part 22 may reflect light incident thereon to increase reuse of light in the liquid crystal display panel.

[0089] refer to Fig.17 and Fig.18 , a buffer layer BL is formed on the base substrate 10 e , and a metal layer ML is formed on the buffer layer BL.

[0090] After forming the metal layer ML, a mold 16e including a pressing pattern 17e is disposed on the metal layer ML to press the metal layer ML. A plurality of pressing patterns 17e are spaced apart from each other by a first distance in a first region R1 of the mold 16e to form a wire grid pattern, and are spaced apart from each other by a second distance greater than the first distance in a second region R2 of the mold 16e to form a reflective groove 18.

[0091] As a result, a wire grid array and a reflective member 22 formed of the same layer as the wire grid array are formed.

[0092] Fig.19 is a cross-sectional view of a polarizer according to an exemplary embodiment. Fig. 20 and Fig.21 It shows the manufacturing Fig.19 A cross-sectional view of the polarizer approach is shown.

[0093] refer to Fig.19 The polarizer includes a base substrate 10f, a rubber phase buffer member 23 disposed on the base substrate 10f, a solid phase buffer member 11f disposed on the rubber phase buffer member 23, and a wire grid array disposed on the solid phase buffer member 11f. The wire grid array includes a plurality of linear metal patterns 13f extending in a first direction and spaced apart from each other in a second direction intersecting the first direction. The solid phase buffer member 11f includes a protrusion 12f. At least a portion of the protrusion 12f is inserted into the linear metal pattern 13f.

[0094] The solid-phase buffer member 11f and the rubber-phase buffer member 23 are formed of different materials.

[0095] For example, the rubber phase buffer member 23 may include a polymer having a rubber phase at room temperature. For example, the rubber phase buffer member 23 may include a polymer having a softening point equal to or less than about 50° C. For example, the rubber phase buffer member 23 may include polyethylene, polypropylene, polydimethylsiloxane, or a copolymer thereof. In an exemplary embodiment, the rubber phase buffer member 23 may include polydimethylsiloxane or a copolymer thereof.

[0096] The solid phase buffer member 11f may include a polymer having a solid (glass) phase at room temperature. For example, the solid phase buffer member 11f may include a polymer having a softening point equal to or greater than about 100° C. For example, the solid phase buffer member 11f may include polyethylene terephthalate, polycarbonate, or a copolymer thereof.

[0097] The rubber-phase buffer member 23 may include protrusions 24 overlapping the protrusions 12f of the solid-phase buffer member 11f.

[0098] refer to Fig. 20 and Fig.21 , a first buffer layer BL1 , a second buffer layer BL2 , and a metal layer ML are formed on the base substrate 10 f .

[0099] The first buffer layer BL1 includes a polymer having a rubber phase at room temperature, for example, having a softening point equal to or less than about 50° C. The second buffer layer BL2 has a solid phase at room temperature, for example, having a softening point equal to or greater than about 100° C.

[0100] After the metal layer ML is formed, a mold 16f including a pressing pattern 17f is disposed on the metal layer ML to press the metal layer ML.

[0101] In the process of pressing the metal layer ML, the second buffer layer BL2 is heated by a temperature equal to or greater than the softening point of the second buffer layer BL2 and changes into a rubber phase. Therefore, the pressing pattern 17f may penetrate the metal layer ML to the extent that the metal layer ML is disconnected by the pressing pattern 17f.

[0102] When the mold 16f is removed, the temperature decreases. Therefore, the solid-phase buffer member 11f and the protrusion 12f formed of the second buffer layer BL2 are solidified. Therefore, it is possible to prevent the arrangement of the wire grid array provided on the solid-phase buffer member 11f from being changed.

[0103] The rubber-phase buffer member 23 formed of the first buffer layer BL1 provides elasticity and flexibility to the polarizer at room temperature to prevent separation by external force and increase flexibility of the polarizer.

[0104] In one exemplary embodiment, the rubber-phase buffer member 23 includes protrusions 24 to form an uneven upper surface. Alternatively, the rubber-phase buffer member 23 does not include protrusions 24 depending on the properties of the polymer included therein or manufacturing conditions so that the rubber-phase buffer member 23 has a flat upper surface.

[0105] In one exemplary embodiment, the linear metal pattern has a tapered shape, but the present invention is not limited thereto and may have various shapes.

[0106] For example, refer to Fig. 22 , the polarizer includes a base substrate 10g, a buffer member 11g disposed on the base substrate 10g, and a wire grid array disposed on the buffer member 11g and including a linear metal pattern 13g. The buffer member 11g includes a protrusion 12g inserted into the linear metal pattern 13g. The linear metal pattern 13g has a substantially rectangular shape. Therefore, the side surface of the linear metal pattern 13g may extend in a direction substantially perpendicular to the upper surface of the base substrate 10g. The rectangular shape of the linear metal pattern 13g may increase the polarization characteristics of the polarizer.

[0107] refer to Fig.23 , the polarizer includes a base substrate 10h, a buffer member 11h disposed on the base substrate 10h, and a wire grid array disposed on the buffer member 11h and including a linear metal pattern 13h. The buffer member 11h includes a protrusion 12h inserted into the linear metal pattern 13h. The linear metal pattern 13h includes a lower portion that is wider than an upper portion. The side surface of the upper portion extends in a direction substantially perpendicular to the upper surface of the base substrate 10h. The side surface of the lower portion extends to form an angle of less than about 90° with the upper surface of the base substrate 10h. The linear metal pattern 13h can increase the polarization characteristics of the polarizer. In addition, since the linear metal pattern 13h is formed by a mold having a sharp end, the metal layer can be easily disconnected.

[0108] refer to Fig.24, the polarizer includes a base substrate 10i, a buffer member 11i disposed on the base substrate 10i, and a wire grid array disposed on the buffer member 11i and including a linear metal pattern 13i. The buffer member 11i includes a protrusion 12i inserted into the linear metal pattern 13i. The linear metal pattern 13i includes an upper portion and a lower portion having side surfaces in different directions from the upper portion. For example, the upper portion has a taper angle smaller than the lower portion. The linear metal pattern 13i includes two portions with different taper angles. Alternatively, the linear metal pattern 13i may have a moth-eye shape so that the taper angle gradually decreases from the lower end toward the upper end. The linear metal pattern 13i may reduce the reflectivity of light incident thereon to achieve anti-reflection.

[0109] According to an exemplary embodiment, the wire grid array pattern can be directly transferred from a mold without an etching process using a mask. Therefore, the wire grid array pattern can have various desired profiles.

[0110] Fig.25 is a cross-sectional view of a display panel according to an exemplary embodiment. Fig.26 is a cross-sectional view of a display panel according to an exemplary embodiment. Fig. 27 is a cross-sectional view of a display panel according to an exemplary embodiment.

[0111] refer to Fig.25 The display panel includes a first substrate 100, a second substrate 200 facing the first substrate 100, and a liquid crystal layer interposed between the first substrate 100 and the second substrate 200. The display panel receives light LIGHT from a light source module LS disposed under the display panel to display an image.

[0112] The first substrate 100 includes a first polarizer and a thin film transistor array. Light incident on the first polarizer from the light source module LS may be partially transmitted and partially reflected. Light reflected by the first polarizer may enter the light source module LS and may be reflected by a reflective member of the light source module LS to re-enter the display panel.

[0113] The first substrate 100 includes a first base substrate 110, a first buffer member 111, a wire grid array including a first linear metal pattern 113, a first protection layer 114, a gate electrode GE, a gate insulating layer 115, an active pattern AP, a source electrode SE, a drain electrode DE, a passivation layer 116, an organic insulating layer 117 and a pixel electrode PE.

[0114] The first buffer member 111 is disposed between the first base substrate 110 and the wire grid array. The first buffer member 111 includes a polymer. The first buffer member 111 includes a protrusion 112 protruding upward from an upper surface of the first buffer member 111. At least a portion of the protrusion 112 is inserted into the first linear metal pattern 113, so that the upper surface and the side surface of the protrusion 112 are covered by the first linear metal pattern 113.

[0115] The protrusion 112 and the first linear metal pattern 113 extend in a first direction. The plurality of protrusions 112 and the plurality of first linear metal patterns 113 are arranged parallel to each other in a second direction intersecting the first direction. The protrusion 112 and the first buffer member 111 are formed in a single integral unit formed of the same material.

[0116] The wire grid array may be used to polarize incident light LIGHT. The first linear metal pattern 113 includes a metal. In an exemplary embodiment, the first linear metal pattern 113 may be formed of a multilayer structure including different metal layers. In this case, the first linear metal pattern 113 may further include a metal oxide, a metal nitride, and the like.

[0117] The protrusion 112 and the first linear metal pattern 113 may have a tapered shape with a lower end wider than an upper end. The tapered angle of the protrusion 112 may be smaller than the tapered angle of the first linear metal pattern 113.

[0118] A first protection layer 114 is formed on the wire grid array to protect the wire grid array.

[0119] The first polarizer and Fig.15 The polarizers of FIG. 1 and FIG. 2 are substantially the same. Therefore, the description of the first polarizer will be omitted.

[0120] The gate electrode GE, the active pattern AP, the source electrode SE and the drain electrode DE form a thin film transistor. The thin film transistor is electrically connected to the pixel electrode PE. The first polarizer is disposed between the thin film transistor and the first base substrate 110. After the first polarizer is formed on the first base substrate 110, a thin film transistor array may be formed on the first polarizer.

[0121] The gate electrode GE is disposed on the first protective layer 114. The gate electrode GE is electrically connected to a gate line extending in one direction on the first base substrate 110. The gate electrode GE may include aluminum, copper, chromium, molybdenum, tungsten, titanium, gold, silver, nickel, or an alloy thereof. In addition, the gate electrode GE may have a single-layer structure or a multi-layer structure including different metal layers. For example, the gate electrode GE may have a three-layer structure of aluminum / molybdenum / aluminum, or a double-layer structure including an upper layer formed of copper and a lower layer formed of titanium.

[0122] The gate insulating layer 115 covers the gate electrode GE. The gate insulating layer 115 may include an inorganic insulating material such as silicon oxide, silicon nitride, etc. The gate insulating layer 115 may have a single-layer structure or a multi-layer structure including different materials. For example, the gate insulating layer 115 may include an upper layer including silicon oxide and a lower layer including silicon nitride.

[0123] The active pattern AP is disposed on the gate insulating layer 115 and overlaps the gate electrode GE. The active pattern AP forms a channel between the source electrode SE and the drain electrode DE. The active pattern AP may include amorphous silicon, polycrystalline silicon, an oxide semiconductor, or the like. When the active pattern AP includes amorphous silicon, the active pattern AP may further include an ohmic contact layer contacting the source electrode SE and the drain electrode DE. The oxide semiconductor may include a multi-component metal oxide, such as indium gallium oxide, indium gallium zinc oxide, or the like.

[0124] The source electrode SE is electrically connected to the data line. The data line, the source electrode SE and the drain electrode DE may be formed by the same metal layer. The source electrode SE may include aluminum, copper, chromium, molybdenum, tungsten, titanium, gold, silver, nickel or an alloy thereof. In addition, the source electrode SE may have a single-layer structure or a multilayer structure including different metal layers. For example, the source electrode SE may have a three-layer structure of aluminum / molybdenum / aluminum, or a double-layer structure including an upper layer formed of copper and a lower layer formed of titanium. Alternatively, the source electrode SE may include a barrier layer including a metal oxide. For example, the source electrode SE may include a copper layer and a metal oxide layer disposed on or below the copper layer. The metal oxide layer may include indium zinc oxide, indium gallium oxide, gallium zinc oxide, etc.

[0125] The passivation layer 116 covers the source electrode SE, the drain electrode DE, and the gate insulating layer 115. The passivation layer 116 may include an inorganic insulating material such as silicon oxide, silicon nitride, or the like.

[0126] The organic insulating layer 117 is disposed on the passivation layer 116 to planarize the substrate. The organic insulating layer 117 may include an organic insulating material such as acrylic resin, phenolic resin, etc. Alternatively, the passivation layer 116 and / or the organic insulating layer 117 may be omitted.

[0127] The pixel electrode PE is disposed on the organic insulating layer 117. The pixel electrode PE is electrically connected to the drain electrode DE. A pixel voltage is applied to the pixel electrode PE through a thin film transistor so that an electric field is formed by a voltage difference between the pixel voltage and a common voltage applied to a common electrode.

[0128] In one exemplary embodiment, the pixel electrode PE passes through the passivation layer 116 and the organic insulating layer 117 to contact the drain electrode DE. The pixel electrode PE may include a transparent conductive material such as indium tin oxide, indium zinc oxide, or the like.

[0129] The second substrate 200 includes a second base substrate 210 , a second buffer member 211 including protrusions 212 , a wire grid array including second linear metal patterns 213 , a second protection layer 214 , a light blocking member BM, a color filter CF, an overcoat layer OC, and a common electrode CE.

[0130] The second polarizer including the second buffer member 211 including the protrusion 212, the second linear metal pattern 213 and the second protective layer 214 is substantially the same as the first polarizer. The first polarizer and the second polarizer are arranged to face each other. For example, the protrusion 112 of the first buffer member and the protrusion 212 of the second buffer member face opposite directions. Therefore, the description of the second polarizer will be omitted.

[0131] The second linear metal pattern 213 extends in the same direction as the first linear metal pattern 113. The present invention is not limited thereto. For example, the second linear metal pattern 213 may extend in a direction different from the first linear metal pattern 113, for example, in a direction perpendicular to the first linear metal pattern 113.

[0132] The light blocking member BM is disposed on the second protective layer 214. The light blocking member BM may be a black matrix having a matrix shape. The light blocking member BM overlaps the thin film transistor.

[0133] The color filter CF is disposed on the second protective layer 214. The color filter CF faces and overlaps the pixel electrode PE. The color filter CF may include a red filter, a green filter, a blue filter, a cyan filter, a yellow filter, a magenta filter, a white filter, etc.

[0134] The overcoat layer OC covers the light blocking member BM and the color filter CF. The overcoat layer OC may include an organic insulating material.

[0135] The common electrode CE is disposed on the overcoat layer OC and overlaps the pixel electrode PE. The common electrode CE may include a transparent conductive material such as indium tin oxide, indium zinc oxide, or the like.

[0136] In an exemplary embodiment, the pixel electrode PE is disposed on the first substrate 100, and the common electrode CE is disposed in the second substrate 200. The present invention is not limited thereto. For example, the pixel electrode and the common electrode may be disposed on the same substrate. The color filter and / or the light blocking member may be disposed in a substrate having a thin film transistor substrate.

[0137] According to an exemplary embodiment, a display panel includes a wire grid polarizer. The wire grid polarizer can share a base substrate with a display substrate to reduce the thickness of the display panel and can replace expensive absorbing polarizers.

[0138] In addition, the polarizer can be manufactured without an etching process using a mask. Therefore, the profile of the metal pattern can be protected and the manufacturing efficiency can be increased.

[0139] In addition, the lower surface of the linear metal pattern of the polarizer forms an uneven surface due to the protrusion of the buffer member. The uneven surface can prevent reflectivity of external light to increase the display quality of the display panel.

[0140] refer to Fig.26 , the display panel includes a first substrate 300 , a second substrate 400 facing the first substrate 300 , and a liquid crystal layer interposed between the first substrate 300 and the second substrate 400 .

[0141] The first substrate 300 includes a first polarizer and a thin film transistor array. The first substrate 300 includes a first base substrate 310, a first buffer member 311 including a protrusion 312, a wire grid array including a first linear metal pattern 313, a first protective layer 314, a gate electrode GE, a gate insulating layer 315, an active pattern AP, a source electrode SE, a drain electrode DE, a passivation layer 316, an organic insulating layer 317, and a pixel electrode PE.

[0142] The second substrate 400 includes a second base substrate 410 , a second buffer member 411 including protrusions 412 , a wire grid array including second linear metal patterns 413 , a second protection layer 414 , a light blocking member BM, an overcoat layer OC, and a common electrode CE.

[0143] The first substrate 300 and the thin film transistor array are connected in a manner that the first base substrate 310 is disposed between the first polarizer and the thin film transistor array and the first polarizer is vertically inverted. Fig.25 The first substrate 100 shown is substantially the same. In this case, the protrusion 312 of the first buffer member 311 and the protrusion 412 of the second buffer member 411 face the same direction.

[0144] The second substrate 400 and Fig.25 The second substrate 200 is substantially the same.

[0145] The uneven surface of the first linear metal pattern 313 faces the liquid crystal layer. Therefore, the transmittance of light provided from the light source module to the first substrate 300 may be increased.

[0146] refer to Fig. 27 , the display panel includes a first substrate 500 , a second substrate 600 facing the first substrate 500 , and a liquid crystal layer interposed between the first substrate 500 and the second substrate 600 .

[0147] The first substrate 500 includes a first polarizer and a thin film transistor array. The first substrate 500 includes a first base substrate 510, a first buffer member 511 including a protrusion 512, a wire grid array including a first linear metal pattern 513, a first protection layer 514, a gate electrode GE, a gate insulating layer 515, an active pattern AP, a source electrode SE, a drain electrode DE, a passivation layer 516, an organic insulating layer 517, and a pixel electrode PE.

[0148] The second substrate 600 includes a second base substrate 610 , a second buffer member 611 including protrusions 612 , a wire grid array including second linear metal patterns 613 , a second protection layer 614 , a light blocking member BM, an overcoat layer OC, and a common electrode CE.

[0149] In addition to the first substrate 500 further including a reflective part 519 formed of the same layer as the wire grid array and the first buffer member 511 further including a second protrusion 518 at least a portion of which is inserted into the reflective part 519, the first substrate 500 and Fig.25 The first substrate 100 is substantially the same.

[0150] The second substrate 600 and Fig.25 The second substrate 200 is substantially the same.

[0151] The reflective part 519 is formed of the same material as the first linear metal pattern 513. In addition, the reflective part 519 has a greater width than the first linear metal pattern 513. The reflective part 519 may be disposed in the light blocking region. For example, the reflective part 519 overlaps the thin film transistor or the light blocking member BM.

[0152] When the first substrate 500 does not include the reflective part 519, light entering the light blocking area may be transmitted and absorbed by the light blocking member BM. The reflective part 519 reflects light incident thereon so that the reflected light may be reused. Therefore, the brightness of the display panel may be increased.

[0153] The present invention can be used in various display devices including polarizers. For example, the present invention can be used in organic light emitting devices or optical devices including polarizers.

[0154] While the present invention has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the inventive concept as defined by the following claims.

Claims

1. A display panel, comprising: base substrate; A thin film transistor disposed on the base substrate; A pixel electrode electrically connected to the thin film transistor; as well as a polarizer disposed on the base substrate and comprising a plurality of linear metal patterns and a buffer member formed of a polymer and having a plurality of protrusions, wherein a portion of each protrusion is inserted into a respective linear metal pattern, and wherein each pattern has a tapered shape, The buffer member includes a rubber phase buffer member and a solid phase buffer member, wherein the solid phase buffer member is disposed on the rubber phase buffer member, and wherein the protrusion is formed by the solid buffer member, and wherein the rubber phase buffer member includes a polymer having a softening point of 50°C or less, and the solid phase buffer member includes a polymer having a softening point of 100°C or more. 2 . The display panel according to claim 1 , wherein the linear metal pattern comprises at least one of aluminum, gold, silver, copper, chromium, iron, nickel, titanium, molybdenum, tungsten and alloys thereof. 3 . The display panel of claim 1 , wherein the buffer member comprises at least one of polymethyl methacrylate, polydimethylsiloxane, polycarbonate, polyethylene terephthalate, polystyrene, polyethylene, polypropylene, polyvinyl alcohol, and copolymers thereof. The display panel according to claim 1 , wherein the polarizer is disposed on the thin film transistor and the pixel electrode.

5. The display panel according to claim 1, further comprising: A protection layer is disposed on the linear metal patterns and opposite to the buffer member so that an air gap is formed between adjacent ones of the linear metal patterns.

6. A display panel, comprising: a cushioning member including a plurality of protrusions, wherein each protrusion protrudes from an upper surface of the cushioning member, and the protrusions cause the cushioning member to have a corrugated surface; and a plurality of metal wires disposed on the corrugated surface of the buffer member, wherein each protrusion is surrounded by a respective metal wire, and wherein two adjacent metal wires expose a portion of the upper surface of the buffer member between the two adjacent metal wires, The buffer member includes a rubber phase buffer member and a solid phase buffer member, wherein the solid phase buffer member is disposed on the rubber phase buffer member, and wherein the protrusion is formed by the solid buffer member, and wherein the rubber phase buffer member includes a polymer having a softening point of 50°C or less, and the solid phase buffer member includes a polymer having a softening point of 100°C or more.

7. The display panel according to claim 6, further comprising: A protection layer is disposed on the plurality of metal lines and opposite to the buffer member so that an air gap is formed between the two adjacent metal lines.

8. The display panel of claim 6, wherein each metal line comprises a first sidewall tapered at a first angle, wherein each protrusion comprises a second sidewall tapered at a second angle smaller than the first angle, and wherein the second sidewall is covered by each metal line.

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