Detection system

Abstract

Provided is a detection system capable of coping with various specifications while maintaining a footprint. The detection system comprises: a plurality of inspection chambers provided with detection heads used when inspecting a substrate on a stage; and a heat medium supply unit for supplying heat medium to the stage, wherein the heat medium supply unit is arranged in a lower area of ​​an inspection area where the plurality of inspection chambers are arranged.

Description

Technical Field

[0001] The present disclosure relates to a detection system. Background Art

[0002] There is known a test system that places a wafer on which a semiconductor device is formed on a stage and supplies a current to the semiconductor device from a tester via a probe or the like, thereby testing the electrical characteristics of the semiconductor device.

[0003] Patent document 1 discloses a detection system including a system body having a plurality of inspection rooms, the inspection rooms accommodating inspection units for inspecting an object to be inspected on a table, and a refrigerant supply unit supplying refrigerant to the table. In addition, the figure shows that the refrigerant supply unit is arranged outside the system body.

[0004] <Prior Art Literature>

[0005] <Patent Documents>

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-29627 Summary of the invention

[0007] <Problems to be Solved by the Present Disclosure>

[0008] In one aspect, the present disclosure provides a detection system that can handle multiple formats while maintaining a small footprint.

[0009] <Methods used to solve the problem>

[0010] In order to solve the above-mentioned problem, according to one embodiment, a detection system is provided, comprising: a plurality of inspection chambers provided with detection heads used when inspecting a substrate on a stage; and a heat medium supply unit for supplying heat medium to the stage, wherein the heat medium supply unit is arranged in a lower area of ​​an inspection area where the plurality of inspection chambers are arranged.

[0011] <Effects of the Invention>

[0012] According to one aspect, a detection system can be provided that can cope with various specifications while maintaining a small footprint. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is an example of a perspective view schematically illustrating the configuration of the detection system according to the present embodiment.

[0014] Figure 2A This is an example of a perspective view of a detection head.

[0015] Figure 2BThis is an example of a front view showing the arrangement state of the detection head, the spring holder, and the probe card in the inspection room.

[0016] Figure 3A This is an example of a perspective view during maintenance of the detection head.

[0017] Figure 3B is an example of a perspective view during maintenance of a temperature regulation module.

[0018] Figure 4A 1 is an example of arrangement of the temperature adjustment modules 100 arranged in the unit tower in the detection system according to the first embodiment.

[0019] Figure 4B This is an example of a circuit diagram of the temperature adjustment module in the detection system according to the first embodiment.

[0020] Figure 5A 1 is an example of arrangement of the temperature adjustment modules 100 arranged in the unit tower in the detection system according to the second embodiment.

[0021] Figure 5B This is an example of a circuit diagram of a temperature adjustment module in the detection system according to the second embodiment.

[0022] Fig. 6A 1 is an example of arrangement of the temperature adjustment modules 100 arranged in the unit tower in the detection system according to the third embodiment.

[0023] Figure 6B This is an example of a circuit diagram of a temperature adjustment module in the detection system according to the third embodiment. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In each of the drawings, the same components are given the same reference numerals, and overlapping descriptions may be omitted.

[0025] <Detection system>

[0026] use Figure 1 The detection system 10 according to the present embodiment will be described. Figure 1 It is an example of a stereogram schematically illustrating the configuration of the detection system 10 according to the present embodiment. It should be noted that in the following description, the direction in which the cells 12 are arranged is the X direction, the length direction of the cells 12 is the Y direction, and the height direction is the Z direction.

[0027] The detection system 10 includes a unit tower 11 and a loader 15 .

[0028] The unit tower 11 has a rectangular parallelepiped shape, and the plurality of units 12 divided therein are arranged in multiple layers, for example, 4 rows and 4 layers. In the unit 12a at the bottom layer among the plurality of units 12, a temperature adjustment module 100 described later is arranged. The units 12b to 12d above the second layer among the plurality of units 12 are used for controlling the wafer W (see the temperature adjustment module 100 described later). Figure 2A , Figure 2B ) for inspection. That is, the temperature adjustment module 100 is arranged in the lower area of ​​the inspection area where a plurality of inspection rooms are arranged. It should be noted that Figure 1 In the example shown, although the case where four temperature adjustment modules 100 are arranged is illustrated as an example, it is not limited to this, and it can be more than one. In addition, it is preferred that the units 12a have the same shape, and the four temperature adjustment modules 100 also have the same shape. In addition, it is preferred that the unit 12a has the same shape as the units 12b to 12d. In addition, the unit 12a in the bottom layer that is not equipped with a temperature adjustment module 100 can also be used as an inspection room.

[0029] The loader 15 has a rectangular parallelepiped shape and is arranged adjacent to the unit tower 11. The loader 15 has a transfer mechanism (not shown) and performs loading and unloading operations of loading and unloading wafers W into or from the units 12b to 12d as inspection rooms.

[0030] Figure 2A and Figure 2B This is an example of a diagram for explaining components built into an inspection room. Figure 2A 1 is an example of a perspective view of the detection head 20 . Figure 2B 1 is an example of a front view showing an arrangement state of the detection head 20, a pogo frame 26, and a probe card 23 in the inspection room.

[0031] like Figure 2A As shown, the detection head 20 has a main body 21 made of a rectangular parallelepiped housing and a flange 22 protruding from the upper side of the main body 21 in the longitudinal direction (Y direction) to the side direction. The main body 21 accommodates a main board (not shown) as a detection circuit.

[0032] like Figure 2BAs shown, the unit 12 as the inspection chamber has a test head 20, a probe card 23, and a spring holder 26 for holding a pogo pin (not shown) for electrically connecting the probe card 23 and the main board of the test head 20. A sealing member 27 is arranged between the probe card 23 and the spring holder 26, and a sealing member 28 is arranged between the spring holder 26 and the test head 20. By reducing the pressure of the space surrounded by the sealing members 27 and 28, the probe card 23 and the spring holder 26 are attached to the test head 20 by vacuum adsorption.

[0033] The probe card 23 has a disk-shaped body 24 and a plurality of contact probes 25 as a large number of columnar contact terminals arranged so as to protrude downward in the figure from the lower surface of the body 24. When the wafer W is brought into contact with the probe card 23, each contact probe 25 contacts an electrode pad and a solder bump (not shown) of each semiconductor device formed on the wafer W.

[0034] The stage 30 for placing the wafer W is positioned in a rotation direction with the X direction, the Y direction, and the Z direction as the rotation axis by a positioner (not shown). In addition, the stage 30 is moved up and down by a lifting mechanism (not shown). As a result, the wafer W placed on the stage 30 abuts against the probe card 23.

[0035] In addition, a flow path 31 for a heat medium such as salt water to flow is formed on the stage 30 for placing the wafer W. One end of the flow path 31 is connected to one end of a pipe 32. The other end of the pipe 32 is connected to the temperature adjustment module 100. The other end of the flow path 31 is connected to one end of a pipe 33. The other end of the pipe 33 is connected to the temperature adjustment module 100. Thus, the heat medium circulates between the temperature adjustment module 100 and the flow path 31 via the pipes 32 and 33. In this way, the temperature of the wafer W during the inspection is controlled by supplying the heat medium whose temperature is adjusted by the temperature adjustment module 100 to the flow path 31 of the stage 30.

[0036] return Figure 1 A maintenance opening 29 is provided on the outside of each unit 12 serving as an inspection room.

[0037] Figure 3A and Figure 3B This is an example of a perspective view for explaining maintenance of the detection system 10 . Figure 3A This is an example of a perspective view during maintenance of the detection head 20 . Figure 3B FIG. 1 is an example of a perspective view during maintenance of the temperature adjustment module 100 .

[0038] like Figure 3A and Figure 3BAs shown, a maintenance area 90 is ensured on the opposite side of the unit tower 11 to the surface adjacent to the loader 15 (hereinafter referred to as the "outside"), where a worker can perform maintenance work on each unit 12.

[0039] like Figure 3A As shown, when the detection head 20 is to be maintained or the like, the detection head 20 is pulled out to the maintenance area 90 through the maintenance opening 29. It should be noted that the detection head 20 is supported by a slide rail (not shown) arranged along the length direction (Y direction) of the detection head 20 in the unit 12 via the flange 22, and is configured to be pulled out along the length direction through a plurality of ball bases provided on the upper surface of the slide rail. The operator can remove the worn main board from the pulled out detection head 20 and install a new main board. It should be noted that in order to make it easy for the operator to replace the main board, a support mechanism (not shown) for supporting the pulled out detection head 20 can be provided.

[0040] like Figure 3B As shown, when the temperature control module 100 is maintained, the temperature control module 100 is pulled out to the maintenance area 90. The operator can perform maintenance on the pulled out temperature control module 100. In this way, the maintenance area 90 for maintaining the temperature control module 100 can be shared with the maintenance area 90 for maintaining the detection head 20. As a result, the increase in the occupied area of ​​the entire detection system 10 can be suppressed.

[0041] Next, an example of the configuration of the temperature adjustment module 100 in the detection system 10 will be described using FIGS. 4 to 6 .

[0042] <First Embodiment>

[0043] Figure 4A and Figure 4B This is a diagram for explaining an example of the configuration of the temperature adjustment module 100 in the detection system 10 according to the first embodiment. Figure 4A 1 is an example of arrangement of the temperature adjustment modules 100 arranged in the unit tower 11 in the detection system 10 according to the first embodiment. Figure 4B This is an example of a circuit diagram of the temperature adjustment module 100 in the detection system 10 according to the first embodiment.

[0044] like Figure 4A and Figure 4B As shown, in the first embodiment, a temperature adjustment module 100 includes one cooler 101 and one circulator 102. The other unit 12 is an inspection room.

[0045] The pipe 33 extending from the other end of the flow path 31 of the stage 30 is connected to the heat medium inlet of the cooler 101 via a detachable joint 41a. The heat medium outlet of the cooler 101 is connected to one end of the connection pipe 51 via a detachable joint 41b. The other end of the connection pipe 51 is connected to the heat medium inlet of the circulator 102 via a detachable joint 42a. The heat medium outlet of the circulator 102 is connected to the pipe 32 extending to one end of the flow path 31 of the stage 30 via a detachable joint 42b.

[0046] The cooler 101 includes, for example, a condenser 101b, an evaporator 101c, and a circuit unit 101a. The circuit unit 101a includes, for example, a compressor (not shown) and an expansion valve (not shown).

[0047] The compressor compresses the refrigerant adiabatically and discharges the high-temperature and high-pressure refrigerant. The condenser 101b is a heat exchanger that supplies the high-temperature and high-pressure refrigerant from the compressor to the primary side, supplies the cooling water from the cooling water outflow pipe 61 to the secondary side, and performs heat exchange between the high-temperature and high-pressure refrigerant and the cooling water. As a result, the refrigerant dissipates heat to the cooling water. The cooling water that has absorbed heat from the refrigerant flows to the cooling water return pipe 62. The expansion valve decompresses the refrigerant that has dissipated heat in the condenser 101b to obtain a low-temperature and low-pressure refrigerant. The evaporator 101c is a heat exchanger that supplies the low-temperature and low-pressure refrigerant from the expansion valve to the primary side, supplies the heat medium from the heat medium inlet of the cooler 101 to the secondary side, and performs heat exchange between the low-temperature and low-pressure refrigerant and the heat medium. As a result, the refrigerant absorbs heat from the heat medium. The cooled heat medium flows out from the heat medium outlet of the cooler 101.

[0048] Note that cooling water cooled in, for example, a cooling tower (not shown) flows through the cooling water outflow pipe 61. The cooling water return pipe 62 returns the heated cooling water to the cooling tower.

[0049] The circulator 102 includes a circuit section 102a, a heat exchanger 102b, and valves 102c and 102d. The circuit section 102a includes, for example, a tank (not shown) and a pump (not shown).

[0050] The heat medium flowing in from the heat medium inlet of the circulator 102 is stored in a tank. The pump discharges the heat medium in the tank and causes it to flow out from the heat medium outlet of the circulator 102. The heat exchanger 102b is a heat exchanger that supplies a heat transfer medium for cooling the circuit part 102a to the primary side, supplies cooling water from the cooling water outflow pipe 61 to the secondary side, and performs heat exchange between the heat transfer medium and the cooling water. As a result, the heat transfer medium dissipates heat to the cooling water. The cooling water that has absorbed heat from the heat transfer medium flows to the cooling water return pipe 62.

[0051] It should be noted that a valve 102c is provided near the heat medium inlet of the circulator 102, and a valve 102d is provided near the heat medium outlet of the circulator 102. It should be noted that, for example, when the joints 42a and 42b are removed for maintenance of the circulator 102 or replacement with another temperature control module 100, the valves 102c and 102d are closed.

[0052] As described above, according to the detection system 10 of the first embodiment, the heat medium cooled by the cooler 101 can be supplied to the flow path 31 of the stage 30 via the circulator 102 and the pipe 32. In addition, the heat medium flowing out of the flow path 31 of the stage 30 circulates to the cooler 101 via the pipe 33. That is, according to the detection system 10 of the first embodiment, a low-temperature heat medium can be supplied to the flow path 31 of the stage 30 in the inspection room.

[0053] <Second Embodiment>

[0054] Figure 5A and Figure 5B This is a diagram for explaining an example of the configuration of the temperature adjustment module 100 in the detection system 10 according to the second embodiment. Figure 5A 1 is an example of arrangement of the temperature adjustment modules 100 arranged in the unit tower 11 in the detection system 10 according to the second embodiment. Figure 5B This is an example of a circuit diagram of the temperature adjustment module 100 in the detection system 10 according to the second embodiment.

[0055] like Figure 5A and Figure 5B As shown, in the second embodiment, two coolers 103 and 104 and one circulator 105 are provided as the temperature adjustment module 100. The other unit 12 is an inspection room.

[0056] The pipe 33 extending from the other end of the flow path 31 of the stage 30 is connected to the heat medium inlet of the cooler 103 via a detachable joint 43a. The heat medium outlet of the cooler 103 is connected to one end of the connecting pipe 52 via a detachable joint 43b. The other end of the connecting pipe 52 is connected to the heat medium inlet of the cooler 104 via a detachable joint 44a. In addition, the heat medium outlet of the cooler 104 is connected to one end of the connecting pipe 53 via a detachable joint 44b. The other end of the connecting pipe 53 is connected to the heat medium inlet of the circulator 105 via a detachable joint 45a. The heat medium outlet of the circulator 105 is connected to the pipe 32 extending to one end of the flow path 31 of the stage 30 via a detachable joint 42b.

[0057] It should be noted that the configuration of the coolers 103 and 104 is the same as that of the cooler 101 , and the configuration of the circulator 105 is the same as that of the circulator 102 , and therefore, duplicate descriptions are omitted.

[0058] As described above, according to the detection system 10 of the second embodiment, the heat medium cooled by the cooler 103 can be further cooled by the cooler 104, and supplied to the flow path 31 of the stage 30 via the circulator 105 and the pipe 32. In addition, the heat medium flowing out of the flow path 31 of the stage 30 circulates to the cooler 103 via the pipe 33. That is, according to the detection system 10 of the second embodiment, the heat medium of extremely low temperature can be supplied to the flow path 31 of the stage 30 in the inspection room.

[0059] <Third Embodiment>

[0060] Fig. 6A and Figure 6B This is a diagram for explaining an example of the configuration of the temperature adjustment module 100 in the detection system 10 according to the third embodiment. Fig. 6A 1 is an example of arrangement of the temperature adjustment modules 100 arranged in the unit tower 11 in the detection system 10 according to the third embodiment. Figure 6B This is an example of a circuit diagram of the temperature adjustment module 100 in the detection system 10 according to the third embodiment.

[0061] like Fig. 6A and Figure 6B As shown, in the third embodiment, two systems of heat medium are output. The first system includes two coolers 106 and 107 and one circulator 108 as the temperature adjustment module 100. The second system includes one circulator 109 as the temperature adjustment module 100. The other units 12 are inspection rooms.

[0062] In the first system, the pipe 33A extending from the other end of the flow path 31 of the stage 30 is connected to the heat medium inlet of the cooler 106 via a detachable joint 46a. The heat medium outlet of the cooler 106 is connected to one end of the connecting pipe 54 via a detachable joint 46b. The other end of the connecting pipe 54 is connected to the heat medium inlet of the cooler 107 via a detachable joint 47a. In addition, the heat medium outlet of the cooler 107 is connected to one end of the connecting pipe 55 via a detachable joint 47b. The other end of the connecting pipe 55 is connected to the heat medium inlet of the circulator 108 via a detachable joint 48a. The heat medium outlet of the circulator 108 is connected to the pipe 32A extending to one end of the flow path 31 of the stage 30 via a detachable joint 48b.

[0063] In the second system, a pipe 33B extending from the other end of the flow path 31 of the stage 30 is connected to the heat medium inlet of the circulator 109 via a detachable joint 49a. The heat medium outlet of the circulator 109 is connected to a pipe 32B extending to one end of the flow path 31 of the stage 30 via a detachable joint 49b.

[0064] It should be noted that the configuration of the coolers 106 and 107 is the same as that of the cooler 101 , and the configuration of the circulator 108 is the same as that of the circulator 102 , and therefore, duplicate descriptions are omitted.

[0065] The configuration of the circulator 108 is the same as that of the circulator 102, so repeated descriptions are omitted. In addition, the circulator 108 may have a heater (not shown) for heating the heat medium. For example, the heater is provided in a tank for storing the heat medium, and heats the heat medium in the tank. Thus, the circulator 108 can make the heated heat medium flow out from the heat medium outlet of the circulator 102.

[0066] As described above, according to the detection system 10 according to the third embodiment, the heat medium cooled by the cooler 106 can be further cooled by the cooler 107, and supplied to the flow path 31 of the stage 30 via the circulator 108 and the pipe 32A. In addition, the heat medium flowing out of the flow path 31 of the stage 30 circulates to the cooler 106 via the pipe 33A. In addition, the heat medium heated by the circulator 109 can be supplied to the flow path 31 of the stage 30 via the pipe 32B. In addition, the heat medium flowing out of the flow path 31 of the stage 30 circulates to the circulator 109 via the pipe 33B. That is, according to the detection system 10 according to the third embodiment, heat medium with different temperatures can be supplied to the inspection room.

[0067] For example, a very low temperature heat medium can be supplied to the flow path 31 of the stage 30 in the inspection room of the upper unit 12d among the plurality of units 12, and a heated heat medium can be supplied to the flow path 31 of the stage 30 in the inspection room of the middle units 12b and 12c among the plurality of units 12. Thus, inspections can be performed within different temperature ranges.

[0068] As described above, according to the detection system 10 of the present embodiment, as shown in FIGS. 4 to 6 , the temperature adjustment module 100 such as a cooler or a circulator can be arranged in the unit 12 d of the lowest layer of the unit tower 11 .

[0069] Here, in the case of a detection system in which a temperature control module such as a cooler or a circulator is arranged outside the unit tower 11, the number of coolers and circulators in the detection system for low-temperature inspection and the detection system for high-temperature inspection differs according to the temperature range to be inspected, so the overall footprint of the detection system is different. Therefore, it is necessary to determine the specifications of the detection system at the time of investment.

[0070] In addition, in the case of a detection system in which a temperature control module such as a cooler or a circulator is arranged outside the unit tower 11, if the number of coolers or circulators increases or decreases due to a change in specifications, the floor space occupied by the entire detection system will also increase or decrease. Therefore, it is sometimes necessary to significantly change the layout of the room in which the detection system is installed.

[0071] In contrast, according to the detection system 10 of the present embodiment, the footprint of the detection system 10 can be maintained even if the specifications of the detection system 10 are different. In addition, since the footprint of the detection system 10 can be maintained even if the specifications of the detection system 10 are changed, it is possible to prevent the need to significantly change the layout of the room in which the detection system 10 is installed.

[0072] In addition, if Figure 3A and Figure 3B As shown, the temperature control module 100 such as a cooler and a circulator can be pulled out in the same direction as the detection head 20 for maintenance. Thus, the temperature control module 100 can be pulled out to the maintenance area 90 for maintenance of the detection head 20 for easy maintenance. In addition, the increase in the occupied area of ​​the entire detection system 10 including the floor area of ​​the detection system 10 and the maintenance area 90 can be suppressed. In addition, when the specifications of the detection system 10 are changed, the temperature control module 100 can also be pulled out to the maintenance area 90 to be replaced with another temperature control module 100.

[0073] In addition, the temperature adjustment module 100 is divided into a cooler and a circulator. Therefore, as shown in the examples of FIG. 4 to FIG. 6 , by changing the combination of the cooler and the circulator, it is possible to cope with various specifications of the detection system 10 .

[0074] Furthermore, by arranging the temperature adjustment module 100 in the lowest unit 12 a among the plurality of units 12 of the unit tower 11 , even if heat medium, cooling water, etc. leak from the temperature adjustment module 100 , the influence on the inspection room can be suppressed.

[0075] Although the detection system 10 has been described above, the present disclosure is not limited to the above-described embodiment and the like, and various modifications and improvements can be made within the scope of the gist of the present disclosure described in the claims.

[0076] Although the units 12 of the unit tower 11 are described as having the same shape, the present invention is not limited thereto. For example, the unit 12a at the bottom layer where the temperature control module 100 (cooler, circulator) is arranged may have a different shape from the units 12b to 12d that are inspection rooms. For example, the unit 12a may have a size twice that of the units 12b to 12d that are inspection rooms.

[0077] It should be noted that this application claims priority based on Japanese invention patent application No. 2019-164007 filed on September 9, 2019, and the entire contents of the Japanese invention patent application are cited by reference in this application.

[0078] Explanation of symbols

[0079] 10. Detection system;

[0080] 11-unit tower;

[0081] Units 12, 12a to 12d;

[0082] 15 Loader;

[0083] 20 detection head;

[0084] 29 Opening for maintenance;

[0085] 30 units;

[0086] 31 flow path;

[0087] 32, 33 pipelines;

[0088] 51-55 connecting pipe (connecting part);

[0089] 61 Cooling water outlet pipe;

[0090] 62 Cooling water return pipe;

[0091] 90 Maintenance area;

[0092] 100 temperature regulating module (heat medium supply unit);

[0093] 101, 103, 104, 106, 107 cooler (heat medium supply unit);

[0094] 101a Circuit Department;

[0095] 101b Condenser;

[0096] 101c Evaporator;

[0097] 102, 105, 108, 109 circulator (heat medium supply unit);

[0098] 102a circuit part;

[0099] 102b heat exchanger;

[0100] 102c, 102d valves;

[0101] W wafer.

Claims

1. A detection system, comprising: A plurality of inspection chambers are provided with inspection heads used when inspecting substrates on the stage; a heat medium supply unit for supplying heat medium to the stage; as well as A unit tower has a plurality of compartmentalized units. The heat medium supply unit is arranged in the lowest unit among the plurality of units. The plurality of inspection rooms are arranged in a unit located at an upper level than a unit in which the heat medium supply unit is arranged, The heat medium supply unit includes a circulator for circulating the heat medium, and the circulator is disposed in a unit in which the heat medium supply unit is disposed.

2. The detection system according to claim 1, wherein: The heat medium supply unit includes a cooler that cools the heat medium, and the cooler is disposed in a unit different from a unit in which the circulator is disposed.

3. The detection system according to claim 2, wherein: The heat medium supply unit includes a connection unit that connects the circulator and the cooler so that the heat medium can flow through the circulator and the cooler.

4. The detection system according to claim 2 or 3, wherein: The circulator has the same shape as the cooler.

5. The detection system according to any one of claims 1 to 3, wherein: The detection head is configured to be able to be pulled out from the inspection room to a maintenance area. The heat medium supply unit is configured to be pullable from the unit of the unit tower to the maintenance area.

6. The detection system according to claim 5, further comprising: A loader is arranged adjacent to the unit tower and transfers the substrate, wherein the unit tower is arranged so as to be sandwiched between the loader and the maintenance area.

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