Contact structure, substrate support, electroplating device and method for supplying power to substrate

Abstract

The present invention provides a contact structure, a substrate support, an electroplating device, and a method for supplying power to a substrate. A structure for improving the suppression of contact between an electroplating solution and a substrate contact. The contact structure comprises: a substrate contact having a first contact portion on the front end side in contact with a substrate and a second contact portion on the base end side relative to the first contact portion; a sealing component covering the periphery of the substrate contact and having a sealing surface in contact with the substrate to seal the substrate contact; a first pressing portion elastically applying contact pressure to the substrate on the substrate contact; and a second pressing portion in contact with the sealing component and applying contact pressure to the substrate on the sealing component independently of the first pressing portion, the first contact portion being bonded to the sealing component, and the second contact portion being embedded in the sealing component in a manner capable of relative displacement relative to the sealing component.

Description

Technical Field

[0001] The invention relates to a contact structure for supplying power to a substrate, a substrate support, an electroplating device and a method for supplying power to a substrate. Background Art

[0002] Wiring, bumps (protruding electrodes), etc. are formed on the surface of substrates such as semiconductor wafers and printed circuit boards. As a method for forming the wiring and bumps, electroplating is known. In the electroplating device used in the electroplating method, a substrate holder is provided, which is held in a manner that the end face of a circular or polygonal substrate is sealed and the plated surface is exposed. When the substrate surface is electroplated in such an electroplating device, the substrate holder holding the substrate is immersed in the electroplating solution. However, in recent years, with the miniaturization of the circuit line width, the seed layer for power on the surface of the substrate also has a tendency to be thin-filmed. If the seed layer becomes thinner (for example, about 1 μm or less) and the electrical contacts (contacts) are wet, there is a situation in which the seed layer dissolves due to the flow of shunt current (bipolar current) in the seed layer and / or etching near the gas-liquid interface (local battery corrosion caused by the dissolved oxygen concentration gradient). If the seed layer dissolves, proper electroplating cannot be performed, so it is necessary to dry at least the electrical contacts.

[0003] In the past, various contact structures for suppressing or preventing the contact between the substrate contact and the plating solution have been proposed. In Japanese Patent Publication No. 8-13198 (Patent Document 1), a structure is described in which a cylindrical substrate contact is covered with a fluororubber cover, and a hollow conical portion protruding and extending from the front end of the contact is provided on the cover. In this structure, when the substrate contact contacts the substrate, the hollow conical portion of the cover is pressed and tightly attached to the substrate, and the contact surface of the contact is sealed and contained in the inner space of the hollow conical portion. In Japanese Patent Publication No. 7-54199 (Patent Document 2), in a hook-shaped contact formed by bending the front end side of an elastic sheet, the elastic sheet is covered with an insulating tape and an adhesive is applied to the hook, and a structure other than the contact position of the contact is shielded with an insulator. Japanese Patent Application Publication No. 2000-219998 (Patent Document 3) describes a structure in which a contact has a plate-shaped or rod-shaped conductive support portion and a conductive contact portion provided at the front end of the support portion, and in which a portion other than the contact portion is covered with an insulating cover portion. In this structure, the contact position between the contact and the substrate is sealed by an insulating film.

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 8-13198

[0005] Patent Document 2: Japanese Patent Application Laid-Open No. 7-54199

[0006] Patent Document 3: Japanese Patent Application Laid-Open No. 2000-219998

[0007] If a hollow conical portion that is elastically deformed is provided as in Patent Document 1, it is difficult to generate a strong sealing force. In addition, there is a problem that the area covered by the sealant on the substrate increases. The structure in which the contact member and the sealant are integrated as in Patent Documents 2 and 3 is not a structure that maintains the sealing force, and in this case, sufficient sealing force cannot be obtained. Any structure in Patent Documents 1 to 3 has problems in preventing the seed layer from dissolving. Summary of the invention

[0008] An object of the present invention is to solve at least a part of the above-mentioned problems.

[0009] According to one aspect of the present invention, a contact structure is provided, comprising: a substrate contact, having a first contact portion on the front end side in contact with a substrate and a second contact portion on the base end side than the first contact portion; a sealing component covering the periphery of the substrate contact and having a sealing surface in contact with the substrate to seal the substrate contact; a first pressing portion for elastically applying contact pressure on the substrate to the substrate contact; and a second pressing portion in contact with the sealing component and applying contact pressure on the substrate to the sealing component independently of the first pressing portion, the first contact portion being bonded to the sealing component, and the second contact portion being engaged with the sealing component in a manner capable of relative displacement relative to the sealing component. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is an overall configuration diagram of a plating device using a substrate holder according to an embodiment of the present invention.

[0011] Figure 2 This is a perspective view of the substrate holder viewed from the front side.

[0012] Figure 3 This is a perspective view of the substrate holder viewed from the back side.

[0013] Figure 4 It is a perspective view of the substrate holder showing a state in which each holding member is separated.

[0014] Figure 5 It is an enlarged perspective view of the external connection part of the substrate holder.

[0015] Figure 6 It is a longitudinal cross-sectional view of a longitudinal component.

[0016] Figure 7 It is an exploded perspective view of the longitudinal components.

[0017] Figure 8This is a perspective view of a bus bar corresponding to one unit length of a power supply module, as seen from the back side.

[0018] Fig. 9 This is a perspective view of the sealing member as seen from the back side.

[0019] Fig.10 This is a perspective view of the contact plate as seen from the back side.

[0020] Fig.11 This is a perspective view of the front plate corresponding to the amount of power supply module×1 unit length, viewed from the back side.

[0021] Fig.12 This is a top view of the area near the power supply module.

[0022] Fig.13 It is along Fig.12 XIII - Cross-sectional view of the power supply module of XIII.

[0023] Fig.13A This is an explanatory diagram for explaining the edge effect of the seal portion.

[0024] Fig.14 It is along Fig.12 A cross-sectional view of the XIV-XIV power supply module.

[0025] Fig.15 It is a cross-sectional perspective view of the power supply module.

[0026] Fig.16 It is a cross-sectional view of a power supply module having another structure with a pressure plate.

[0027] Fig.17 It is a top view showing other structures of the pressure plate.

[0028] Fig.18 It is a cross-sectional view of a power supply module according to another embodiment.

[0029] Fig.19 It is a perspective view which enlarges the vicinity of the locking mechanism of the second holding member.

[0030] Fig. 20 It is a perspective view showing the locking mechanism in the engaged state of the first holding member and the second holding member.

[0031] Fig.21 It is a rear view which enlarges the vicinity of the locking mechanism of the second holding member.

[0032] Fig. 22 It is locked along Fig.21 Cross-sectional view of line XXII-XXII.

[0033] Fig.23It is locked along Fig.21 Cross-sectional view of XXIII-XXIII.

[0034] Description of Reference Numerals

[0035] 39…plating tank; 100…plating device; 200…substrate holder; 210…first holding member; 211a, 211b…longitudinal member; 212, 213…lateral member; 215…guide rail; 216…arm; 217…external connection portion; 218a, 218b…bus bar; 220…second holding member; 230…power supply module; 231…sealing member; 232…pressing plate; 232a ...extension; 232b...through hole; 232c...spacer; 233...contact plate; 234...contact plate pressing piece; 235...sealing portion; 236...substrate contact; 236a...large diameter portion; 236b...conical portion; 236c...small diameter portion; 236d...screw hole; 237...sealing portion; 238...through hole; 239...sealing portion; 240...protrusion; 241...cutout; 242...through hole; 243...front end; 243a...through hole; 244...slit; 245...through hole; 246...screw; 247...through hole; 248...screw; 250...front plate; 251...screw hole; 252, 253...recess; 260...bus bar; 261...holding portion; 262...thick wall portion; 263...through hole; 264...protrusion; 265...screw hole; 266...sealing groove; 267...through hole; 268...through hole; 27 0…pin; 274, 275…flange; 280…back plate; 290…floating plate; 291…guide pin; 295…spring; 297…guide pin; 300…locking plate; 301…base end portion; 302…guide portion; 303…guide groove; 304…stop portion; 304a…step portion; 305…force applying mechanism; 309…spring; 400…adhesive region; 401…elastic member; 402…contact block. DETAILED DESCRIPTION

[0036] Hereinafter, embodiments of the electroplating device and the substrate support used in the electroplating device according to the present invention will be described based on the accompanying drawings. In the accompanying drawings, identical or similar reference symbols are used for identical or similar elements, and repeated descriptions of identical or similar elements are omitted in the description of each embodiment. In addition, the features shown in each embodiment can also be applied to other embodiments as long as they are not contradictory.

[0037] In this specification, "substrate" is not only a semiconductor substrate, a glass substrate, a liquid crystal substrate, a printed circuit substrate, but also includes a magnetic recording medium, a magnetic recording sensor, a reflector, an optical element, a micro-mechanical element, or a partially manufactured integrated circuit, or any other object to be processed. The substrate includes a substrate of any shape including a polygon or a circle. In addition, in this specification, expressions such as "front", "back", "front", "back", "up", "down", "left", and "right" are used, but for ease of explanation, these expressions represent the position and direction on the paper of the illustrated drawings, and there are different situations in the actual configuration when the device is used.

[0038] Figure 1 1 is an overall configuration diagram of an electroplating device using a substrate holder according to an embodiment of the present invention. The electroplating device 100 holds a substrate on a substrate holder 200 ( Figure 2 ) state to perform electroplating treatment on the substrate. The electroplating device 100 is roughly divided into a loading / unloading unit 110, a processing unit 120, and a cleaning unit 50a, wherein the loading / unloading unit 110 loads the substrate on the substrate holder 200 or unloads the substrate from the substrate holder 200, and the processing unit 120 processes the substrate. The processing unit 120 also includes a pre-processing / post-processing unit 120A for performing pre-processing and post-processing of the substrate, and an electroplating processing unit 120B for performing electroplating treatment on the substrate.

[0039] The loading / unloading section 110 includes two cassette tables 25 and a substrate disassembly mechanism 29. The cassette table 25 carries a cassette 25a storing a substrate. The substrate disassembly mechanism 29 is configured to disassemble and detach a substrate from a substrate holder 200. In addition, a stocker 30 for storing the substrate holder 200 is provided near (e.g., below) the substrate disassembly mechanism 29. The cleaning section 50a includes a cleaning device 50 for cleaning and drying the substrate after the electroplating process.

[0040] A substrate transport device 27 composed of a transport robot for transporting substrates between these units is arranged at a position surrounded by the cassette stage 25, the substrate loading and unloading mechanism 29, and the cleaning section 50a. The substrate transport device 27 is configured to be able to travel by a travel mechanism 28. The substrate transport device 27 is configured to, for example, take out a substrate before electroplating from the cassette 25a and transport it to the substrate loading and unloading mechanism 29, receive a substrate after electroplating from the substrate loading and unloading mechanism 29, transport the substrate after electroplating to the cleaning section 50a, and take out a substrate after cleaning and drying from the cleaning section 50a and store it in the cassette 25a.

[0041] The pre-processing / post-processing section 120A has a pre-wetting tank 32, a pre-impregnation tank 33, a pre-washing tank 34, a blowing tank 35 and a rinsing tank 36. In the pre-wetting tank 32, the substrate is immersed in pure water. In the pre-impregnation tank 33, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate is etched away. In the pre-washing tank 34, the pre-impregnated substrate and the substrate holder are cleaned with a cleaning liquid (pure water, etc.). In the blowing tank 35, the liquid is removed from the cleaned substrate. In the rinsing tank 36, the electroplated substrate and the substrate holder are cleaned with a cleaning liquid. In addition, this structure is an example and is not limited to the above structure. The pre-processing / post-processing section 120A can adopt other structures.

[0042] The electroplating treatment section 120B has a plurality of electroplating tanks (electroplating units) 39 and an overflow tank 38. Each electroplating tank 39 accommodates a substrate inside, immerses the substrate in the electroplating solution held inside, and electroplates the substrate surface with copper or the like. Here, the type of electroplating solution is not particularly limited, and various electroplating solutions can be used according to the application.

[0043] The electroplating apparatus 100 includes a substrate holder conveying device 37 using, for example, a linear motor method, which is located on the side of each of these devices and conveys the substrate holder 200 together with the substrate between these devices. The substrate holder conveying device 37 is configured to convey the substrate holder between the substrate mounting and dismounting mechanism 29, the stocker 30, the pre-wetting tank 32, the pre-preg tank 33, the pre-washing tank 34, the blowing tank 35, the rinsing tank 36, and the electroplating tank 39.

[0044] The electroplating device 100 constructed as described above has a controller 175, which serves as a control unit configured to control the above-mentioned units. The controller 175 has a memory 175B storing a predetermined program and a CPU 175A executing the program of the memory 175B. The storage medium constituting the memory 175B stores various setting data, various programs including a program for controlling the electroplating device 100, and the like. The program includes, for example, a program for executing the conveying control of the substrate conveying device 27, the loading and unloading control of the substrate to the substrate holder in the substrate disassembly mechanism 29, the conveying control of the substrate holder conveying device 37, the control of the processing in each processing tank, the control of the electroplating processing in each electroplating tank 39, and the control of the cleaning unit 50a. The storage medium can include a non-volatile and / or volatile storage medium. As the storage medium, for example, a computer-readable ROM, RAM, flash memory or other memory, a hard disk, a CD-ROM, a DVD-ROM, a disk-shaped storage medium such as a floppy disk, and other known structures can be used.

[0045] The controller 175 is configured to be able to communicate with a higher-level controller (not shown) that uniformly controls the electroplating device 100 and other related devices, and to exchange data with a database possessed by the higher-level controller. A portion or all of the functions of the controller 175 can be constituted by hardware such as an ASIC. A portion or all of the functions of the controller 175 can also be constituted by a sequencer. A portion or all of the controller 175 can be configured inside and / or outside the frame of the electroplating device 100. A portion or all of the controller 175 is communicatively connected to various parts of the electroplating device 100 via wired and / or wireless communication.

[0046] (Substrate holder)

[0047] Figure 2 This is a perspective view of the substrate holder viewed from the front side. Figure 3 This is a perspective view of the substrate holder viewed from the back side. Figure 4 It is a perspective view of the substrate holder showing a state in which each holding member is separated. Figure 5 The substrate holder 200 includes a first holding member 210 and a second holding member 220 , which are engaged with each other and hold the substrate W in a sandwiched state between the first holding member 210 and the second holding member 220 .

[0048] The first holding member 210 includes a longitudinal member 211a, a longitudinal member 211b, a transverse member 212, a transverse member 213, a guide rail 215, an arm 216, and an external connection portion 217. In addition, the first holding member 210 includes a plurality of pins 270 as a locking mechanism for locking the first holding member 210 to the second holding member 220 ( Figure 4). The longitudinal member 211a and the longitudinal member 211b extend substantially parallel to each other and are provided with a power supply portion including an electrical contact for contacting the front surface of the substrate W and flowing an electric current, namely, a substrate contact (described later). Here, the case where the power supply portion is provided only in the longitudinal member 211a and the longitudinal member 211b is taken as an example, but in other embodiments, the power supply portion can be provided in the transverse member 212 and / or the transverse member 213 instead of the longitudinal member 211a and / or the longitudinal member 211b or in addition to the longitudinal member 211a and / or the longitudinal member 211b. The transverse member 212 connects the longitudinal member 211a and the longitudinal member 211b to each other on the side away from the arm 216. The transverse member 213 connects the longitudinal member 211a and the longitudinal member 211b to each other on the side close to the arm 216. The transverse members 212 and 213 support the longitudinal members 211a and 211b to suppress bending. The front surface of the substrate W is exposed in the area surrounded by the vertical members 211a, 211b and the horizontal members 212, 213. The horizontal members 212, 213 may be omitted to form a so-called gate-type substrate holder.

[0049] The guide rail 215 is installed substantially parallel to the arm 216, and the longitudinal members 211a and 211b are installed to be slidable along the guide rail 215. By moving the longitudinal members 211a and 211b to approach or separate along the guide rail 215, the positions of the longitudinal members 211a and 211b can be adjusted according to the size of the substrate W.

[0050] The arm 216 is a holding portion held by the substrate holder conveying device 37 and is a portion supported when arranged in each processing tank. The arm 216 extends approximately perpendicular to the longitudinal member 211a and is provided with an external connection portion 217 at one end. In other embodiments, the external connection portion 217 may be provided at both ends of the arm 216. The external connection portion 217 is an external connection terminal for electrically connecting the substrate holder 200 to an external power source, and has, for example, a plurality of external connection contacts ( Figure 5 ). Part of the external connection point ( Figure 5 The near front side) is electrically connected to the bus bar 218a, and the other part of the external connection contact ( Figure 5 The busbar 218a and 218b are electrically connected to the inner side of the arm 216. The busbars 218a and 218b are appropriately covered by a cover or a protective member. The busbar 218a is configured to extend along the long side direction of the arm 216 and to be connected to the busbar 260 ( Figure 3 ) mechanically and electrically connected. The bus bar 218a is a structure that can be connected to the bus bar 260 of the longitudinal member 211a at multiple positions according to the adjustment of the position of the longitudinal member 211a. The bus bar 218b is configured to extend along the long side direction of the arm 216 and connect to the bus bar 260 ( Figure 3 ) mechanical connection and electrical connection. The bus bar 218b is a structure that can be connected to the bus bar 260 of the longitudinal member 211b at multiple positions according to the adjustment of the position of the longitudinal member 211b. In one example, the connection position of the bus bars 218a, 218b and the bus bars 260 of the longitudinal members 211a, 211b is located inside the cover or protective member.

[0051] The second holding member 220 includes a back plate 280 and a locking mechanism including a locking plate 300 provided on the back plate 280 for locking the second holding member 220 to the first holding member 210. The locking mechanism includes the locking plate 300 extending corresponding to the longitudinal members 211a and 211b, a floating plate 290 extending between the back plate 280 and the locking plate 300 corresponding to the locking plate 300, and a urging mechanism 305 generating a pushing force between the locking plate 300 and the floating plate 290. The locking mechanism will be described in detail later.

[0052] (Power supply module)

[0053] Figure 6 is a longitudinal cross-sectional view of the longitudinal component. Since the longitudinal component 211a and the longitudinal component 211b have the same structure, the longitudinal component 211a is used as an example for explanation below. As shown in the figure, the longitudinal component 211a has a front plate 250, a bus bar 260, a plurality of power supply modules 230 electrically connected to the bus bar 260, and a plurality of pins 270 arranged on both sides of each power supply module 230 (between adjacent power supply modules 230 and on the outside of the end power supply modules 230). Figure 6 In FIG. 2 , d is used to represent the interval between adjacent pins 270. Figure 3 and Figure 4 As shown, bus bar 260 extends over the entire length of longitudinal member 211a and is mechanically connected to rail 215 and bus bars 218a, 218b ( Figure 5 ) mechanical connection and electrical connection. The bus bar 260 is electrically connected to the external connection portion 217 via the bus bars 218a and 218b in the arm 216. Figure 2 as well as Figure 6 As shown, the front plate 250 extends along the bus bar 260 along the entire length of the longitudinal member 211a on the front side of the bus bar 260. The front plate 250 and the sealing member 231 together isolate the substrate contact 236 and the contact plate 233 from the plating solution. The power supply module 230 is a power supply unit constituting the power supply part. Figure 6 As shown in FIG. 2 , the power supply module 230 is disposed on the front side of the bus bar 260 along the long side direction of the longitudinal component 211a. In this example, the power supply module 230 is disposed between the bus bar 260 and the front plate 250. Figure 7As described later, each power supply module 230 is configured to have a substrate contact 236, and the front end side of the substrate contact 236 extends to the back side of the bus bar 260 (the opposite side of the front plate 250) through the through hole 263 of the bus bar 260 and contacts the substrate W.

[0054] Figure 7 It is an exploded perspective view of the longitudinal components. Figure 8 This is a perspective view of a bus bar corresponding to one unit length of a power supply module, as seen from the back side. Fig. 9 This is a perspective view of the sealing member as seen from the back side. Fig.10 This is a perspective view of the contact plate as seen from the back side. Fig.11 This is a perspective view of the front plate corresponding to the amount of power supply module×1 unit length, viewed from the back side. Fig.12 This is a top view of the area near the power supply module. Fig.13 It is along Fig.12 XIII - Cross-sectional view of the power supply module of XIII. Fig.14 It is along Fig.12 A cross-sectional view of the XIV-XIV power supply module. Fig.15 This is a cross-sectional perspective view of the power supply module. Figure 6 As shown, the front plate 250 and the bus bar 260 extend along the entire length of the longitudinal member 211a, but Figure 7 , Figure 8 , Fig.11 In order to avoid complication of the drawing, only a portion corresponding to one power supply module 230 (power supply module×1 unit length) is shown. In addition, there is a case where the power supply module is referred to as a contact sealing module.

[0055] The power supply module 230 includes a sealing member 231, a substrate contact 236 disposed in the sealing member 231, a pressing plate 232, a contact plate 233, and a contact plate pressing member 234. Fig.15 As shown, the power supply module 230 is a structure in which a substrate contact 236 surrounded by a sealing portion 235 receives power from a bus bar 260 via a contact plate 233, the contact plate 233 cantilevered by the bus bar 260 elastically applies a contact pressure on the substrate to the substrate contact 236, and the pressure plate 232 applies a contact pressure (sealing pressure) on the substrate to the sealing portion 235. In the following description, there is a case where "contact pressure on the substrate" is referred to simply as "contact pressure".

[0056] The sealing member 231 is an elastic member (e.g., an elastic body such as rubber) having a substantially rectangular shape, and includes a sealing portion 235 for receiving a substrate contact 236, and a sealing member 236 disposed on the front side of the sealing member 231 (on the Figure 7The sealing portion 237 (the upper surface in the figure), the through hole 238 provided on the outer side of the sealing portion 235, and the back side of the sealing member 231 (refer to Fig. 9 ) is provided around the through hole 238, and on the back side of the sealing member 231 (see Fig. 9 ) A protrusion 240 disposed on the outer side of the through hole 238, and a cutout 241 for receiving the pin 270. Figures 13 to 15 As shown, the substrate contact 236 is provided so as to penetrate from the front side to the back side of the sealing portion 235 .

[0057] like Fig.13 As shown, the sealing portion 235 passes through the through hole 263 of the bus bar 260 and is exposed on the back side (lower side of the figure) of the longitudinal part 211a. The sealing portion 235 is fitted into the through hole 263 in a manner that it can move relative to the bus bar 260. The sealing portion 235 is formed to protrude from the back side of the bus bar 260 by a specified length. The sealing portion 235 has a taper that becomes a small diameter toward the front end surface (sealing surface). According to this structure, the range (sealing surface) of the sealing portion 235 in contact with the substrate can be adjusted to a desired range, and the portion of the sealing portion 235 outside the desired range can be prevented from contacting the substrate. In addition, by setting the taper to adjust the contact range, sudden shape changes of the sealing component can be avoided, and the fluidity of the rubber when the sealing component is molded can be easily ensured.

[0058] like Figure 7 as well as Fig.14 As shown in FIG. 1 , a plurality of substrate contacts 236 are provided in the sealing portion 235 so as to penetrate from the front side to the back side of the sealing member 231. The plurality of substrate contacts 236 are arranged along the inner side near the inner side of the sealing member 231. In order to uniquely determine the positional relationship between the substrate contacts 236 and the front end of the sealing portion 235, the substrate contacts 236 and the sealing portion 235 are combined in a concave and convex manner ( Figures 13 to 15 ). A plurality of substrate contacts 236 are mounted on the contact plate 233, for example, by screws 246. Fig.13As shown, the base end of the substrate contact 236 (large diameter portion 236a) protrudes from the front of the sealing portion 235 by a predetermined distance, and the front end of the substrate contact 236 (small diameter portion 236c) is arranged to be substantially in the same plane (flat) as the front end surface (sealing surface) of the sealing portion 235. By arranging the front end surface of the substrate contact 236 to be in the same plane as the front end surface of the sealing portion 235, liquid is suppressed / prevented from remaining at the front end of the substrate contact 236. In addition, the front end of the substrate contact 236 (small diameter portion 236c) is not limited to a structure in which the front end is substantially in the same plane (flat) as the front end surface (sealing surface) of the sealing portion 235, and a structure in which the front end of the substrate contact 236 (small diameter portion 236c) is set back from the front end surface (sealing surface) of the sealing portion 235, or a structure in which the front end of the substrate contact 236 (small diameter portion 236c) protrudes from the front end surface (sealing surface) of the sealing portion 235 may be adopted.

[0059] The substrate contact 236 is a conductive component, and can be formed of SUS, for example. The substrate contact 236 is a block pin structure, and in the present embodiment, has a cylindrical shape. However, the substrate contact 236 may also be any shape other than the cylindrical shape. The substrate contact 236 includes a large diameter portion 236a, a small diameter portion 236c, and a tapered portion 236b connecting the large diameter portion 236a and the small diameter portion 236c. The front end side of the substrate contact 236 is bonded to the sealing member 231 (sealing portion 235), and the base end side of the substrate contact 236 is not bonded to the sealing member 231 (sealing portion 235), and can be relatively movably engaged with the sealing member 231 (sealing portion 235). Here, the so-called "bonding" includes bonding during integral molding with rubber, resin, etc., bonding using an adhesive, bonding using welding, and other bonding. In addition, the bonding range and the non-bonding range are ranges in which, when the substrate is held by the substrate holder, the substrate contact 236 is displaced in the direction opposite to the contact pressure (the direction opposite to the substrate) by the force received from the substrate side, and a sealing pressure (sealing force) is generated by the residual action of the sealing surface of the sealing portion 235.

[0060] exist Fig.13In the example, the small diameter portion 236c and the tapered portion 236b are cross-linked and bonded to the sealing member 231 by vulcanization molding (in the figure, the bonding area 400 is indicated by a double-dashed line). On the other hand, the large diameter portion 236a is not bonded to the sealing member 231, and can be relatively movably engaged in the sealing member 231 (sealing portion 235). For example, by not simply applying an adhesive (agent for bonding rubber), or applying an agent (release agent, etc.) to the non-bonded portion of the substrate contact 236, and / or applying an agent for bonding rubber to the bonded portion of the substrate contact 236, and then vulcanizing, it is possible to achieve a structure in which the front end side of the substrate contact 236 is bonded to the sealing portion 235, and the base end side is not bonded to the sealing portion 235. In addition, instead of integral molding, a sealing member 231 having a hole for receiving the substrate contact 236 can be independently formed, and the substrate contact 236 can be bonded or welded to the sealing member 231 by an adhesive or the like.

[0061] The large diameter portion 236a has a diameter that can ensure the contact area (power supply area) with the contact plate 233 and provide the substrate contact 236 with a strength that can withstand the high pressure from the rubber material when the substrate contact 236 is integrally molded with the sealing member 231. In addition, by providing the large diameter portion 236a, there is also a secondary effect of forming a connection between the substrate contact 236 in the molding die and the molding die (a method of fixing the substrate contact 236 to the molding die, etc.). The large diameter portion 236a is provided with a screw hole 236d for screwing a screw 246 for fixing the contact plate 233 to the large diameter portion 236a.

[0062] The small diameter portion 236c has a smaller diameter than the large diameter portion 236a, and has a shorter length than the large diameter portion 236a in order to ensure rigidity. In addition, the small diameter portion 236c is formed to be suitable for the size of the area (contactable range) allocated on the substrate W together with the front end surface (sealing surface) of the sealing portion 235. The contactable range is set according to the specifications of the substrate. In addition, by making the substrate contact 236 into a tapered block pin shape, it is also possible to ensure the interval between multiple substrate contacts.

[0063] The tapered portion 236b is provided to suppress a sudden change in the size of the substrate contact 236 and to ensure the fluidity of the rubber when integrally molded with the sealing member 231. In this embodiment, in order to further reliably ensure the fluidity of the rubber, R processing is performed on the corner between the tapered portion 236b and the small diameter portion 236c, and the corner between the tapered portion 236b and the large diameter portion 236a.

[0064] In the present embodiment, the sealing member 231 holding the substrate contact 236 is configured such that the sealing portion 235 contacts the seed layer not covered by the resist on the substrate W. By making the entire sealing portion 235 holding the substrate contact 236 contact the portion at the same height on the substrate, the sealing property of the sealing portion 235 to the substrate contact 236 can be improved.

[0065] The sealing portion 237 is constructed as follows: Figure 7 As shown, it is arranged along the outer periphery of the front of the sealing member 231, as shown in FIG. Fig.13 As shown, the seal between the sealing component 231 and the front plate 250 protects the substrate contacts 236, the contact plate 233, etc. from the influence of the plating solution. The sealing portion 237 can be a protrusion provided integrally with the sealing component 231, or it can be a structure in which other components such as O-rings are installed on the main body of the sealing component. The through hole 238 is provided on the outside of the sealing portion 235, and passes through from the front side to the back side. The shape and size of the through hole 238 can be any shape according to the shape and size of the protrusion 264 of the bus bar 260. For example, Figure 7 As shown, the through hole 238 can be in the shape of a long hole extending substantially parallel to the sealing portion 235. Fig.13 As shown, the protrusion 264 of the bus bar 260 passes through the through hole 238, and the end surface of the protrusion 264 of the bus bar 260 is exposed on the front side of the substrate holder. In order to facilitate connection with the contact plate 233, it is preferred that the protrusion 264 of the bus bar 260 protrudes from the front of the sealing member 231 by a predetermined length and the end surface of the protrusion 264 is exposed. Fig. 9 as well as Fig.13 As shown, the sealing portion 239 is configured to be provided around the through hole 238 on the back side of the sealing member 231, and to seal between the sealing member 231 and the bus bar 260 around the protrusion 264, thereby protecting the contact plate 233 connected to the same position as the protrusion 264 from the influence of the plating solution. The sealing portion 239 may be a protrusion provided integrally with the sealing member 231, or may be a structure in which other components such as an O-ring are mounted on the main body of the sealing member.

[0066] like Fig. 9 and Fig.13 As shown in FIG. 2 , the protrusion 240 is provided to protrude from the back side of the sealing member 231 outside the through hole 238. When the substrate holder 200 clamps the substrate W, the protrusion 240 functions as a support against the second holding member 220 and functions as a pressure receiving portion that receives the pressing force from the second holding member 220. Since the protrusion 240 functions as a pressure receiving portion that receives the pressing force from the second holding member 220 together with the sealing member 235, it is preferably formed in a shape and size corresponding to the sealing member 235. For example, Figure 7 and Fig. 9As shown, the protrusion 240 extends substantially parallel to the sealing portion 235 and is formed into an elongated shape having substantially the same length. Fig.13 As shown, the protrusion 240 extends toward the second holding member 220 (not shown) disposed on the back side through the through hole 267 of the bus bar 260. When the substrate W is clamped by the first holding member 210 and the second holding member 220, the protrusion 240 contacts the second holding member 220 and functions as a pressure receiving portion that receives a part of the force of the second holding member 220 pressing the first holding member 210.

[0067] like Figure 7 and Fig.13 As shown, the pressing plate 232 is disposed between the sealing member 231 and the contact plate 233, and is a member that supports the contact plate 233 and presses the sealing member 231. The pressing plate 232 is formed, for example, of SUS. The pressing plate 232 is formed to have a higher rigidity than the contact plate 233. In other words, the pressing plate 232 has a rigidity that is difficult to be displaced in a direction away from the substrate due to the force received from the substrate side compared to the contact plate 233. The thickness of the pressing plate 232 is formed to be substantially the same as the height of the protrusion 264 of the bus bar 260 protruding from the sealing member 231. In the pressing plate 232, a through hole 242 is provided that allows the protrusion 264 of the bus bar 260 to pass through, substantially corresponding to the through hole 238 of the sealing member 231. The through hole 242 may also be slightly larger than the through hole 238.

[0068] When the substrate contact 236 is pressed against the substrate W, the pressing plate 232 presses the sealing portion 235 against the substrate W and applies a contact pressure on the substrate W (hereinafter the same as the contact pressure on the substrate) to the sealing portion 235. Due to the pressing by the pressing plate 232, the base end side of the sealing portion 235 (in this example, the portion corresponding to the large diameter portion 236a) and the substrate contact 236 are deformed / displaced independently, and the front end side of the sealing portion 235 bonded to the substrate contact 236 (in this example, the portion corresponding to the tapered portion 236b and the small diameter portion 236c) is pressed against the substrate W. In this embodiment, the base end surface of the sealing member 231 is formed to be substantially parallel to the substrate, and the pressing plate 232 applies a contact pressure to the sealing portion 235 via a surface substantially parallel to the sealing surface of the sealing portion 235, so that sufficient pressing force can be applied to the sealing portion 235 and sufficient contact pressure can be applied to the sealing surface. Furthermore, in the present embodiment, the pressing plate 232 and the front plate 250 apply contact pressure to the sealing portion 235 .

[0069] The pressing plate 232 may be in contact with the sealing portion 235 over the entire circumference near the substrate contact point 236 , and may elastically apply contact pressure to the sealing portion 235 . Fig.16 It is a cross-sectional view of a power supply module having another structure with a pressure plate. Fig.172 is a top view showing other structures of the pressing plate. The pressing plate 232 has an extension portion 232a that surrounds the entire periphery of the substrate contact 236, and a through hole 232b is provided in the extension portion 232a through which the base end side (large diameter portion 236a) of the substrate contact 236 passes. In this structure, Fig.16 As shown by arrow B, since the pressing plate 232 presses the sealing portion 235 all around the substrate contact 236, the sealing portion 235 is pressed more evenly around the substrate contact 236, and a uniform contact pressure can be applied to the sealing portion 235 all around the substrate contact 236. In addition, in the present embodiment, between the extension portion 232a of the pressing plate 232 and the front plate 250, as shown in FIG. Fig.16 As shown, an electrically insulating spacer 232c is configured, and the front plate 250 and the pressing plate 232 are electrically insulated. In addition, for simplicity, the spacer 232c can be removed, and the front plate 250 and the pressing plate 232 can be directly in contact with each other, and electrical insulation can be achieved through a coating or the like. Fig.16 In the structure of Fig.13 Compared with the structure of the present invention, the pressure plate 232 is not fixed by a cantilever but is fixed on both sides, so deformation of the pressure plate 232 can be prevented and a higher sealing force can be obtained.

[0070] exist Fig.13 and Fig.16 In any structure of the present invention, the portion of the pressure plate 232 (pressing portion) that applies contact pressure to the sealing portion 235 and the position where the front plate 250 directly contacts the sealing portion 235 are located outside the substrate contact point 236 compared to the sealing surface of the sealing portion 235 for the substrate. Fig.13A As shown in the figure, since the load (arrow B) applied to the sealing part 235 by the pressing part is applied to the outside of the sealing surface, the outside (end) of the sealing surface receives the moment (arrow C) in the direction of the substrate contact 236, which makes it easy to maintain the sealing pressure brought by the sealing surface and improve the sealing effect (edge ​​effect) at the sealing edge. In this figure, arrow A represents the force of the substrate pressing the substrate contact 236 (the force received by the substrate contact 236 from the substrate).

[0071] The contact plate 233 is a conductive elastic member, for example, configured to function as a leaf spring. The contact plate 233 is formed of, for example, SUS. The contact plate 233 is supported by a cantilever by fixing its base end to the protrusion 264 of the bus bar 260. Fig.13 As shown, the base end of the contact plate 233 is fixed to the protrusion 264 of the bus bar 260 by a screw 248, and each substrate contact 236 is installed at each front end 243 of the contact plate 233 by a screw 246. By making the contact plate 233 a leaf spring supported by a cantilever, a structure is realized in which a contact force is elastically applied to the substrate contact 236. In addition, as shown in FIG. Figure 7 as well as Fig.10 As shown, the contact plate 233 has a plurality of front end portions 243 that contact the substrate contact 236. Each front end portion 243 is in the form of a leaf-shaped electrode separated from each other by a slit 244, and each substrate contact 236 can be displaced independently of each other. As a result, each substrate contact 236 can follow the warping and bending of the substrate and contact the substrate well. A through hole 243a is provided at each front end portion 243 for a screw 246 installed on the substrate contact 236 to pass through. A through hole 245 is provided at the base end portion of the contact plate 233 for a screw 248 installed on the protrusion 264 of the bus bar 260 to pass through.

[0072] like Fig.13 As shown, the contact plate pressing member 234 is a member that is fixed to the protrusion 264 of the bus bar 260 on the contact plate 233 and presses the contact plate 233 and the pressing plate 232. The contact plate pressing member 234 is provided to ensure the contact uniformity between the contact plate 233 and the bus bar 260 and to adjust the cantilever rigidity of the contact plate 233. In addition, the force with which the pressing plate 232 presses the sealing member 231 (sealing portion 235) can also be adjusted by the contact plate pressing member 234. In order to achieve electrical insulation from the front plate 250, the contact plate pressing member 234 is formed of an electrically insulating material such as vinyl chloride. However, in the case where electrical insulation from the front plate 250 is ensured by other units, the contact plate pressing member 234 may also be formed of a material other than an electrically insulating material. As Figure 7 As shown, the contact plate pressing member 234 has a through hole 247 through which the screw 248 passes. Fig.13 As shown, the contact plate pressing member 234 is configured to clamp the contact plate 233 together with the pressing plate 232 and the protrusion 264 of the bus bar 260, and is configured to press the contact plate 233 against the pressing plate 232 and the protrusion 264. Figure 7 as well as Fig.13 As shown, when the contact plate 233 and the contact plate pressing member 234 are sequentially arranged on the pressure plate 232 and the protrusion 264, the contact plate 233 and the contact plate pressing member 234 are fixed to the end surface of the protrusion 264 of the bus bar 260 by screwing the screw 248 to the screw hole 265 on the end surface of the protrusion 264 of the bus bar 260. As a result, the contact plate 233 and the bus bar 260 are electrically connected while maintaining contact uniformity. In addition, by adjusting the pressing force and / or pressing range of the contact plate pressing member 234, the cantilever rigidity of the contact plate 233 can be adjusted with a simple structure. In addition, by adjusting the pressing force and / or pressing range of the contact plate pressing member 234, the force with which the pressure plate 232 presses the sealing component 231 (sealing portion 235) can be adjusted with a simple structure.

[0073] The bus bar 260 includes a holding portion 261 for mounting the power supply module 230, and a thick wall portion 262 provided outside the holding portion 261. The holding portion 261 is provided with a through hole 263 for passing the sealing member 231, a protrusion 264 connected to the contact plate 233, a screw hole 265 provided on the end surface of the protrusion 264, a through hole 267 for passing the protrusion 240 of the sealing member 231, and a through hole 268 for passing the pin 270. In addition, in order to ensure electrical insulation and corrosion resistance to the plating solution, a surface coating having an electrical insulation / corrosion resistance function such as a PFA coating is applied to the surface of the bus bar 260 other than the end surface of the protrusion 264 connected to the contact plate 233. The insulating coating protects the bus bar 260 from the plating solution and prevents the current from flowing directly from the plating solution to the bus bar 260. The shape and size of the through hole 263 can be any size and shape according to the shape and size of the sealing portion 235. For example, Figure 7 As shown, the through hole 263 can be a slit-shaped long hole extending substantially parallel to the longitudinal member 211a. Fig.13 As shown in FIG. 2 , the through hole 263 receives the sealing portion 235 covering the entire circumference of the main part of the substrate contact 236, and positions the substrate contact 236 and the sealing portion 235. The protrusion 264 is formed on the outer side of the through hole 263 to be substantially parallel to the through hole 263. A sealing groove 266 for receiving the sealing portion 239 of the sealing member 231 may also be provided around the base end side of the protrusion 264. Fig.13 As shown, the through hole 267 allows the protrusion 240 of the sealing member 231 to pass therethrough, so that the protrusion 240 protrudes toward the back side of the bus bar 260 by a predetermined length. Figure 6 As shown, the through hole 268 is a through hole for passing the pin 270. Figure 7 In FIG. 2 , since only a portion of the bus bar 260 corresponding to one power supply module 230 is shown, a portion of the through hole 268 is shown.

[0074] The front plate 250 is formed of a metal such as titanium, and a surface coating having electrical insulation and corrosion resistance such as a PFA coating is applied. It can also be formed of the same material as the sealing member 231 (elastomer such as rubber). Fig.13 As shown, the front plate 250 is disposed on the front side of the first holding member 210. Fig.12 as well as Fig.13As shown, on the back side of the front plate 250, there are provided one or more recesses 252 for receiving the heads of the screws 248 for fixing the contact plate 233, and recesses 253 that function as spaces for allowing the substrate contact 236 and the contact plate 233 to deform toward the front plate 250. The recesses 253 also function to receive the screws 246 for mounting the contact plate 233 on the substrate contact 236. In addition to allowing the substrate contact 236 and the contact plate 233 to deform toward the front plate 250, a moment is generated due to the sealing portion 235 being bonded to the front end side of the substrate contact 236. As shown in FIG. Figure 6 and Figure 7 As shown, the front plate 250 has a screw hole 251 with an internal thread that is combined with the external thread portion of the pin 270, and is fixed by being engaged with the thread of the pin 270 to sandwich the bus bar 260 and the like. Figure 7 In the figure, since only the portion of the front plate 250 corresponding to one power supply module 230 is shown, a portion of the screw hole 251 is shown. The pin 270 has a middle portion 272 ( Fig. 22 ), and the step difference with the front end portion 271 abuts against the bus bar 260. Thus, by screwing the pin 270 into the screw hole 251, the front plate 250 and the bus bar 260 become one, and the components of the power supply module 230 are arranged / fixed (integrated) in a predetermined positional relationship between the front plate 250 and the bus bar 260.

[0075] (Substrate holder locking mechanism)

[0076] Fig.19 It is a perspective view in which the vicinity of the locking mechanism of the second holding member is enlarged. Fig. 20 It is a perspective view showing the locking mechanism in the engaged state of the first holding member and the second holding member. Fig.21 It is a rear view showing an enlarged view of the vicinity of the locking mechanism of the second holding member. Fig. 22 It is locked along Fig.21 Cross-sectional view of line XXII-XXII. Fig.23 It is locked along Fig.21 Cross-sectional view of XXIII-XXIII.

[0077] (Back plate, floating plate)

[0078] like Fig.19 As shown, the second holding member 220 includes: a back plate 280, a floating plate 290 that can be moved closer to or farther from the back plate 280, and a locking plate 300 that can slide laterally in a plane relative to the floating plate 290. Figures 2 to 4 As shown, the back plate 280 is formed into a size and shape capable of covering the substrate W and the portions of the longitudinal components 211a and 211b corresponding to the substrate W. Figure 4As shown, the floating plate 290 is provided on both sides of the back side of the back plate 280, along the left and right sides of the substrate W, corresponding to the longitudinal parts 211a and 211b of the first holding part 210. The floating plate 290 is configured by a plurality of guide pins 297 ( Fig.19 ) is fixed in position in the in-plane direction relative to the back plate 280 and is guided by the guide pins 297 to move toward or away from the back plate 280.

[0079] like Fig. 22 As shown in FIG. 1 , a spring 295 is provided between the back plate 280 and the floating plate 290, and a force is applied in a direction in which the two are separated from each other by the spring 295. More specifically, the locking plate 300 is arranged on one end side of the spring 295 via the floating plate 290, and the back plate 280 is arranged on the other end side of the spring 295. In other words, a spring 295 is provided between the locking plate 300 and the back plate 280, and a force is applied in a direction in which the two are separated from each other by the spring 295. The plurality of pins 270 are locking pins for locking the second holding member 220 to the first holding member 210 by locking the locking plate 300. When the second holding member 220 is mounted on the first holding member 210, the pins 270 of the first holding member 210 penetrate the back plate 280 and the floating plate 290 inside the spring 295 of the second holding member 220, and the pins 270 are locked to the locking portion 304 of the locking plate 300. In this state, the spring 295 is compressed to push the floating plate 290 (locking plate 300) and the back plate 280 away from each other. As a result, the back plate 280 is pressed against the first holding member 210, and when the substrate W is held, the substrate W is pressed against the sealing portion 235 by the back plate 280.

[0080] like Fig. 22 As shown, the back plate 280 has a through hole 283 for passing the pin 270, and the floating plate 290 has a through hole 294 for passing the pin 270, and the through hole 283 and the through hole 294 are arranged at positions corresponding to each other. Large diameter portions for arranging springs 295 are arranged on the sides of the through holes 283 and 294 facing each other, and these large diameter portions constitute a space for accommodating the springs 295. One end of the spring 295 abuts against the step portion at the boundary between the large diameter portion and the small diameter portion of the through hole 283, and the other end of the spring 295 abuts against the step portion at the boundary between the large diameter portion and the small diameter portion of the through hole 294. Through this structure, the spring 295 applies force in the direction of separating the back plate 280 and the floating plate 290 (locking plate 300) from each other. As shown Fig. 22As shown, the pin 270 has: a front end portion 271 fixed to the first holding member 210 (in the present embodiment, screwed), an intermediate portion 272 having a larger diameter than the front end portion 271 and passing through the back plate 280 and the floating plate 290, a base end portion 273 having a smaller diameter than the intermediate portion 272, a flange 274 provided in the middle of the base end portion 273, and a flange 275 provided at the end of the base end portion 273. The flange 274 constitutes a first latching portion for locking the substrate holder 200 in a state of holding the substrate, and the flange 275 constitutes a second latching portion for semi-locking the substrate holder 200 in a state of not holding the substrate. The semi-locked state is a state in which no load is applied to the sealing portion, such as when storing the substrate holder 200. In the Fig. 22 , it is shown that the locking plate 300 is locked to the flange 274 of the pin 270 , and the locked state of the substrate is maintained between the first holding member 210 and the second holding member 220 .

[0081] (Locking plate)

[0082] like Figure 4 and Fig.19 As shown, the locking plate 300 is provided on the back side of the floating plate 290, along the left and right sides of the substrate W, corresponding to the longitudinal parts 211a and 211b of the first holding member 210. The locking plate 300 includes a base end portion 301, a guide portion 302, a guide groove 303 provided in the guide portion 302, a stopper 304 provided in the base end portion 301, and a force applying mechanism 305. The base end portion 301 is an elongated shape corresponding to the longitudinal part 211a of the first holding member 210, and a plurality of stoppers 304 are provided along the long side direction to engage with a plurality of pins 270 of the first holding member 210. Fig. 22 As shown, the stopper 304 is configured to engage with the flange 274 or the flange 275 of the pin 270. Fig.19 As shown, the locking portion 304 has a shape substantially corresponding to a portion (eg, half the circumference) of the flanges 274 , 275 of the pin 270 , and has a step portion 304 a that abuts against the bottom surfaces of the flanges 274 , 275 .

[0083] like Fig.19 As shown, the guide portion 302 extends from the base end portion 301 in a direction transverse to the longitudinal direction (lateral direction) to form a guide groove 303 in the shape of an elongated hole extending in the lateral direction. In this embodiment, the guide groove 303 extends in a direction perpendicular to the longitudinal direction and penetrates the thickness of the guide portion 302. Two guide pins 291 are connected to the guide groove 303, and the locking plate 300 is configured to be guided by these guide pins 291 and to move laterally relative to the floating plate 290 on the floating plate 290. Fig. 22As shown in FIG. 1 , the guide pin 291 includes a pin 292 fixed to the floating plate 290, and a sleeve 293 having flanges on both sides and mounted on the outer periphery of the base end side of the pin 292. The locking plate 300 is engaged between the flanges on both sides of the sleeve 293, and the distance between the floating plate 290 and the locking plate 300 is defined or fixed by the flanges on both sides. In this structure, the locking plate 300 approaches or moves away from the back plate 280 together with the floating plate 290.

[0084] like Fig.23 As shown, the urging mechanism 305 includes a spring 309, and the spring 309 is arranged between a spring seat 306 fixed to the locking plate 300 and a spring seat 307 fixed to the floating plate 290. Fig. 20 As shown, the spring 309 pushes the locking plate 300 against the floating plate 290 in the direction (outward) in which the locking portion 304 engages with the pin 270. Fig. 20 In this state, if the locking plate 300 is moved inward relative to the floating plate 290 against the urging force of the spring 309, the locking portion 304 of the locking plate 300 is separated from the pin 270, and the locking plate 300 is released from the locking of the pin 270.

[0085] (Partial sealing structure)

[0086] like Fig.23 As shown in FIG. 2 , the pin 270 and the spring 295 are provided near the sealing portion 235 along the outer periphery of the substrate W (in this example, along the left and right sides of the substrate W). Therefore, the force pressing the substrate W via the back plate 280 can be directly transmitted to the sealing portion 235 through the pin 270 and the spring 295 and in a short transmission path. Thus, the load applied to the substrate W due to the pressing force of the pin 270 and the spring 295 can be suppressed. As a result, the load on the substrate W can be suppressed, and an appropriate pressing force can be applied to the sealing portion 235 to seal the substrate contact 236. This structure is particularly effective in large substrates. It is difficult to apply uniform force to the sealing portion 235 over a long length of a large substrate, but according to the present embodiment, the force pressing the substrate W via the back plate 280 can be transmitted directly to the sealing portion 235 via a shorter transmission path through the pin 270 and the spring 295, and a local sealing structure can be implemented that suppresses the load applied to the substrate W and properly seals the sealing portion 235 over a long distance.

[0087] In addition, the protrusion 240 of the sealing member 231 is configured to clamp the pin 270 and the spring 295 together with the sealing portion 235 in the outer direction of the substrate W. In addition, the so-called outer direction of the substrate means a direction that is orthogonal to the tangent of the side or outer edge of the substrate and faces outward. In the case where the substrate is circular, the outer direction is radially outward. In the case where the substrate is polygonal, it is a direction that is orthogonal to the side and faces outward. According to this structure, the sealing portion 235 and the protrusion 240 act as a pressure receiving portion that receives the pressing force of the pin 270 and the spring 295, and can construct a position to be powered / sealed, that is, the sealing portion 235, to effectively act with an appropriate driving force, and further suppress the load caused by the driving force from affecting the entire substrate. The local sealing structure or structure. Since the pressing force of the pin 270 and the spring 295 is received by the sealing portion 235 on the inner side of the pin 270 and the spring 295, and is received by the protrusion 240 on the outer side of the pin 270 and the spring 295, it is difficult for the first holding member 210 (longitudinal members 211a, 211b) to deform. Furthermore, the sealing component 231 is arranged in a plurality of modules, and the sealing portion 235 and the protrusion 240 are divided into a plurality of modules along the edge of the substrate. Therefore, in this structure, the sealing pressure required to protect the substrate contact 236 from the influence of the plating solution can be properly ensured. In the conventional substrate holder, it is known to make an integrated sealing component contact along the edge of the substrate, but in the integrated sealing component, it is difficult to generate a uniform sealing pressure along the edge of the substrate, and there is a possibility that excessive sealing pressure is generated and the substrate is damaged depending on the situation.

[0088] In addition, by combining a local sealing structure formed by a plurality of pins 270 locally arranged along the outer periphery of the substrate W and a local urging force based on the spring 295, and a local sealing structure sealed by the sealing portion 235 according to the power supply module 230 or the substrate contact 236, a more local sealing can be achieved. Thus, the adaptability to large substrates is further improved. In addition, other elastic elements can also be used instead of the spring 295.

[0089] (Substrate loading and unloading method)

[0090] In the substrate holder 200 in a state where the substrate is not held (for example, in a semi-locked state), the locking plate 300 is slid inward relative to the floating plate 290 by compressing the spring 309 of the urging mechanism 305, and the locking portion 304 of the locking plate 300 is released from the pin 270. Next, the second holding member 220 is removed from the first holding member 210, and the substrate W is placed on the first holding member 210. Thereafter, the second holding member 220 in a state where the spring of the urging mechanism 305 is compressed is placed on the longitudinal members 211a and 211b of the first holding member 210 on which the substrate W is placed. Furthermore, the floating plate 290 (and / or the locking plate 300) is pushed toward the back plate 280, and the locking portion 304 of the locking plate 300 is adjusted so that it can engage with the flange 274 of the pin 270 (see FIG. 2 ). Fig.23 ) engagement height. Next, by releasing the compression of the spring 309 of the urging mechanism 305, the locking portion 304 of the locking plate 300 engages with the flange 274 of the pin 270. Thus, the substrate W is held in a locked state by the substrate holder 200.

[0091] When removing the substrate, the locking plate 300 is slid inward relative to the floating plate 290 in such a manner that the spring 309 of the urging mechanism 305 of the substrate holder 200 holding the substrate is compressed, and the locking portion 304 of the locking plate 300 is released from the pin 270. Next, the second holding member 220 is removed from the first holding member 210, and the substrate W is removed from the first holding member 210. Thereafter, the second holding member 220 in a state in which the spring 309 of the urging mechanism 305 is compressed is placed on the longitudinal members 211a and 211b of the first holding member 210 without the substrate, and the floating plate 290 (and / or the locking plate 300) is pushed toward the back plate 280, and the height is adjusted to enable the locking portion 304 of the locking plate 300 to engage with the flange 275 of the pin 270. Next, by releasing the compression of the spring 309 of the urging mechanism 305, the locking portion 304 of the locking plate 300 engages with the flange 275 of the pin 270. Thereby, the substrate holder 200 is brought into a semi-locked state.

[0092] In the above structure, when the substrate is clamped and held by the substrate holder 200, the substrate contact 236 is cantilevered by the contact plate 233 as a leaf spring, so the substrate contact 236 is supported by the force from the substrate side ( Fig.13 On the other hand, when the sealing portion 235 is pressed by the pressing plate 232, the sealing portion 235 receives a force ( Fig.13Arrow B), becomes a tendency to remain in the direction of the contact pressure. That is, since the part where the contact pressure is applied to the substrate contact 236 and the part where the contact pressure is applied to the sealing part 235 are independent, the substrate contact 236 uses the force received from the substrate side to displace in the direction opposite to the contact pressure, and plays the role of the residual sealing surface of the sealing part 235, and the sealing pressure of the sealing part 235 can be generated by this effect. Since the sealing pressure of the sealing part 235 against the substrate can be fully generated to isolate the substrate contact 236 from the plating liquid, the surrounding area of ​​the substrate contact 236 can be kept dry, and the dissolution of the substrate seed layer can be effectively suppressed or prevented. According to this structure, in a structure in which the front end of the substrate contact and the front end of the sealing part are flat, it can play a similar role to the structure in which the front end of the substrate contact is recessed from the front end of the sealing part, and liquid can be avoided from remaining at the front end of the substrate contact. In addition, the parts of the pressing plate 232 and the front plate 250 that contact the sealing part 235 can be collectively referred to as "pressing parts".

[0093] In addition, since the substrate contact 236 is bonded to the sealing portion 235 only at the front end side, the sealing portion 235 can be relatively displaced relative to the bus bar 260, so the sealing portion 235 is smoothly compressed in the direction of the contact pressure as a whole, and the base end side of the sealing portion 235 can be displaced and / or deformed independently of the substrate contact 236, so that the sealing surface is strongly pressed against the substrate. With this structure, the effect of increasing the sealing pressure can be further improved.

[0094] In addition, even if the plating solution contacts the substrate contact 236, since the front end side of the substrate contact 236 is bonded to the sealing portion 235, the plating solution is suppressed or prevented from intruding between the substrate contact 236 and the sealing portion 235, and the contact between the substrate contact 236 and the plating solution can be suppressed to a minimum, and the dissolution of the substrate seed layer can be further suppressed or prevented. In addition, since the front end side of the sealing portion 235 is bonded to the substrate contact 236, the front end side of the sealing portion 235 can be suppressed from being excessively deformed and / or tilted, and sufficient sealing pressure is generated on the sealing surface.

[0095] In addition, since the sealing component 231 and the substrate contact 236 are integrally formed together through vulcanization molding and cross-linked and bonded to the substrate contact 236, the bonding strength between the front end side of the substrate contact 236 and the sealing component 231 can be improved, and the plating liquid can be more reliably suppressed or prevented from invading between the front end side of the substrate contact 236 and the sealing component 231.

[0096] In the above structure, since the base end side of the substrate contact 236 is protruded from the sealing portion 235, the substrate contact 236 is elastically pressed by the contact plate 233 for power supply, and the sealing portion 235 near the substrate contact 236 is pressed by the pressing plate 232 between the sealing portion 235 and the contact plate 233, it is possible to suppress the addition of components, and realize a structure in which the substrate contact 236 and the sealing portion 235 are elastically in contact with the substrate with a simple structure. In addition, since the contact plate 233 for power supply functions as a leaf spring supported by a cantilever, it is possible to suppress the addition of components, and realize elastic contact of the substrate contact 236 with a simple structure.

[0097] In the above structure, since the substrate contact 236 passes through the through hole 263 of the bus bar 260 and is positioned in a state covered by the sealing portion 235, the substrate contact 236 and the sealing portion 235 can be accurately positioned relative to the substrate by the bus bar 260, and a compact structure for holding them can be formed. In addition, the through hole 263 can suppress the deformation of the base end side of the sealing portion 235 in a direction parallel to the substrate surface when the substrate contact 236 and the sealing portion 235 are pressed against the substrate, and a sufficient sealing pressure can be ensured.

[0098] In the above structure, since the sealing component 231 and the substrate contact 236 are arranged in the form of multiple modules (power supply modules 230), it is also possible to more easily manufacture the sealing component 231 that can well seal one or more substrate contacts 236 arranged along the length of the side of the substrate in the case of a large-scale substrate. In addition, since it is a structure in which the substrate contacts 236 are sealed by the sealing portion 235, in the case of a large-scale substrate, the substrate contacts 236 can be well sealed by the local sealing structure. In the above structure, the sealing component 231 including the substrate contact 236 can be replaced independently according to the power supply module 230, which makes maintenance easier and reduces the maintenance cost. In addition, the contact plate 233 can also be replaced independently according to the power supply module 230, which makes maintenance easier.

[0099] In the above structure, the power supply module 230 can be set according to the size of the substrate used, which can improve the versatility of the substrate holder. By omitting the power supply module 230 in the unused area (the part not in contact with the substrate), the cost of the substrate holder can be reduced. In addition, a virtual component can be configured in the part where the power supply module 230 is omitted to isolate the bus bar 260 from the plating solution, and the current will not flow directly from the plating solution to the bus bar 260.

[0100] (Other Embodiments)

[0101] Fig.18It is a cross-sectional view of a power supply module involved in other embodiments. The points different from the above-mentioned embodiments are mainly described, and the description of the same structure is omitted. In the present embodiment, the contact block 402 arranged to contact the base end surface of the sealing portion 235 applies contact pressure to the sealing portion 235, and the elastic component 401 arranged between the contact block 402 and the substrate contact 236 is configured to elastically apply contact pressure to the substrate contact 236. In one example, the contact block 402 contacts the sealing portion 235 via a surface substantially parallel to the sealing surface of the sealing portion 235 (a surface substantially parallel to the substrate), and applies contact pressure to the sealing portion 235. The contact block 402 can be set according to the substrate contact 236 (for example, in the form of an axis), or it can be set for multiple substrate contacts 236 in common (for example, in the form of a strip). The sealing portion 235 can be a part of the above-mentioned sealing component 231.

[0102] The front end side of the substrate contact 236 is bonded to the sealing portion 235. The reference numeral 400 indicates the bonding range. The substrate contact 236 may be configured to include a large diameter portion, a small diameter portion, and a tapered portion as required, as in the above-mentioned embodiment, or may be bonded as in the above-mentioned embodiment. As in the above-mentioned embodiment, each substrate contact 236 may be a structure surrounded by a sealing member 231 (sealing portion 235). In addition, as in the above-mentioned embodiment, the substrate contact 236 and the sealing member 231 (sealing portion 235) may be integrally formed by vulcanization molding and cross-linked and bonded. However, on the base end side of the sealing member 231, a space for configuring the elastic member 401 is ensured. The sealing portion 235 may also be fitted into the through hole 263 in a manner that allows relative movement with the bus bar 260, as in the above-mentioned embodiment. The sealing portion 235 may also have a tapered portion that tapers on the sealing surface side, as in the above-mentioned embodiment. The elastic component 401 can be an elastic component with conductivity (e.g., a conductive spring, rubber, resin, etc.) that can supply power to the substrate contact 236 from the contact block 402. In one example, the elastic component 401 can be a metal spring. The elastic component 401 is configured to be able to transmit contact force from the contact block 402 to the substrate contact 236 via the elastic component 401, and can be fixed to the contact block 402 and / or the substrate contact 236 or not. The contact block 402 is provided at each substrate contact 236 and is formed of a conductive material (e.g., metal). The contact block 402 contacts or is mounted on the above-mentioned contact plate 233, and is pressed by the contact plate 233. However, in this structure, it is preferred that the contact plate 233 has the same rigidity as the above-mentioned pressure plate 232 so that the contact plate 233 can appropriately compress the sealing portion 235. The rigidity of the contact plate 233 can be adjusted to be increased by, for example, expanding the range of the contact plate pressing member 234. In addition, the contact block 402 is not limited to the contact plate 233, and any pressing mechanism or unit may be used to press the contact block 402.

[0103] In this embodiment, since the portion where contact pressure is applied to the substrate contact 236 (the portion where the elastic member 401 contacts the substrate contact 236) and the portion where contact pressure is applied to the seal 235 (the portion where the contact block 402 contacts the seal 235) are independent, the front end side of the seal 235 and the substrate contact 236 are bonded, and the base end side of the seal 235 and the substrate contact 236 can move relative to each other, the same effect as the above embodiment is achieved. In addition, in this embodiment, since the substrate contact 236 applies contact pressure via the elastic member 401, it is easy to suppress excessive force from being applied to the substrate through the contact between the substrate contact 236 and the substrate.

[0104] (Variation Example)

[0105] (1) In the above embodiment, the power supply portion is provided on the substrate holder 200 along two sides of the substrate W. However, the power supply portion may be provided on the substrate holder 200 over the entire circumference of the substrate W.

[0106] (2) The structure of the plurality of power supply modules 230 may be applied to a substrate holder for double-sided plating. For example, the plurality of power supply modules 230 may be disposed on both the first holding member and the second holding member of the substrate holder.

[0107] (3) In the above embodiment, the front plate is a continuous integrated structure along the bus bar, but the front plate can also be independently provided corresponding to each power supply module. In this case, in each power supply module, each front plate protects the substrate contact 236 together with the sealing component 231. Therefore, it can also be considered that a part of each power supply module includes each front plate. Each front plate can also be formed of the same material as the sealing component 231.

[0108] From the above-mentioned embodiment, at least the following aspects can be understood.

[0109] According to a first embodiment, a contact structure is provided, comprising: a substrate contact having a first contact portion on the front end side in contact with a substrate and a second contact portion on the base end side relative to the first contact portion; a sealing member covering the periphery of the substrate contact and having a sealing surface in contact with the substrate to seal the substrate contact; a first pressing portion elastically applying contact pressure to the substrate on the substrate contact; and a second pressing portion in contact with the sealing member and applying contact pressure to the substrate on the sealing member independently of the first pressing portion, wherein the first contact portion is bonded to the sealing member, and the second contact portion is engaged with the sealing member in a manner capable of relative displacement relative to the sealing member. In addition, the first contact portion may be bonded to the sealing member in the area around it including the front end, and the entire periphery of the first contact portion need not necessarily be bonded to the sealing member.

[0110] According to this method, since the part where the contact pressure is elastically applied to the substrate contact is independent of the part where the contact pressure is applied to the sealing component (sealing portion), when the substrate is held by the substrate holder, the substrate contact is displaced in the direction opposite to the contact pressure (the direction opposite to the substrate) by the force received from the substrate side, and the sealing surface of the sealing component remains, thereby generating the sealing pressure of the sealing component. In addition, since the substrate contact is only bonded on the front end side, the base end side of the sealing component is displaced and / or deformed independently from the substrate contact, and the sealing surface can be strongly pressed against the substrate. Through this structure, the effect of increasing the sealing pressure is further enhanced. Since the sealing pressure of the sealing component against the substrate is fully generated to isolate the substrate contact from the plating solution, the area around the substrate contact can be kept dry, and the dissolution of the substrate seed layer can be effectively suppressed / prevented.

[0111] In addition, even when the plating liquid contacts the substrate contact, since the front end side of the substrate contact is bonded to the sealing member, the plating liquid is suppressed or prevented from intruding between the substrate contact and the sealing member, and the contact between the substrate contact and the plating liquid can be suppressed to a minimum, which can further suppress or prevent the dissolution of the substrate seed layer. In addition, since the front end side of the sealing member is bonded to the substrate contact, the front end side of the sealing member can be suppressed from being excessively deformed and / or tilted, and sufficient sealing pressure can be generated on the sealing surface.

[0112] According to a second aspect, in the contact structure of the first aspect, the second pressing portion is in contact with the sealing member via a surface that is substantially parallel to the sealing surface of the sealing member.

[0113] According to this aspect, since the pressing force is applied to the sealing member via the surface substantially parallel to the sealing surface, a sufficient pressing force can be applied to the sealing member.

[0114] According to a third aspect, in the contact structure of the first or second aspect, the second pressing portion is located outside the sealing surface of the sealing member with respect to the substrate contact.

[0115] According to this method, since the load applied to the sealing component by the second pressing portion is applied to the outside of the sealing surface, the outside (end) of the sealing surface receives the torque toward the substrate contact point, which makes it easy to maintain the sealing pressure and improve the sealing effect at the sealing edge.

[0116] According to a fourth aspect, in any of the contact structures in the first to third aspects, a portion of the base end side of the second contact portion protrudes from the sealing member, and the contact structure comprises: a first pressing plate, which is arranged on the sealing member, contacts with the sealing member and presses the sealing member; and a contact plate, which is a contact plate for supplying power to the substrate contact, which is arranged on the first pressing plate, contacts with the second contact portion and elastically presses the second contact portion, the contact portion of the contact plate that contacts the second contact portion functions as the first pressing portion, and the portion of the first pressing plate that presses the sealing member around a portion or the entire periphery of the substrate contact functions as the second pressing portion. The first pressing plate may also be arranged around a portion or the entire periphery of the substrate contact.

[0117] According to this method, the base end side of the substrate contact is made to protrude from the sealing component, and the substrate contact is elastically pressed by the contact plate for power supply, and the sealing component near the substrate contact can be pressed by the first pressing plate between the sealing component and the contact plate. Therefore, the addition of components can be suppressed, and the first pressing part and the second pressing part can be formed by a simple structure. The contact plate can be formed in the form of a leaf spring, for example.

[0118] According to a fifth aspect, in the contact structure of the fourth aspect, the first pressing plate has a through hole, and the second contact portion at least partially passes through the through hole of the first pressing plate.

[0119] According to this aspect, since the first pressing plate exists around the entire circumference of the second contact portion, the sealing member can be pressed more uniformly around the entire circumference of the second contact portion as a whole.

[0120] According to the sixth embodiment, in the contact structure of the fourth or fifth embodiment, there is a bus bar for supplying power to the above-mentioned contact plate, the above-mentioned sealing portion is arranged through the through hole of the above-mentioned bus bar and can be relatively displaced on the above-mentioned bus bar, and the above-mentioned contact plate is fixed to the bus bar on the side opposite to the side in contact with the above-mentioned second contact part, and is cantilevered by the above-mentioned bus bar.

[0121] According to this method, since the sealing component is positioned in the through hole of the busbar, the substrate contact and the sealing component are correctly positioned on the substrate through the busbar, and a compact structure for holding them can be formed. In addition, the deformation of the base end side of the sealing component in a direction parallel to the substrate surface when pressed against the substrate can be suppressed, and sufficient sealing pressure can be ensured. In addition, since the sealing component can be relatively displaced relative to the busbar, the sealing component can be smoothly compressed as a whole in the direction of the contact pressure. Since the contact plate for power supply functions as a leaf spring supported by a cantilever, the addition of components can be suppressed, and elastic contact of the substrate contact can be achieved through a simple structure.

[0122] According to a seventh aspect, in the contact structure of the sixth aspect, a second pressing plate is provided, the second pressing plate being arranged on the contact plate and used to adjust the contact uniformity between the contact plate and the bus bar and the cantilever rigidity of the contact plate.

[0123] According to this method, by using the second pressing plate to press the contact plate against the bus bar, the contact uniformity between the contact plate and the bus bar can be ensured. In addition, by adjusting the pressing force and / or pressing range of the second pressing plate, the cantilever rigidity of the contact plate can be adjusted with a simple structure. In addition, by adjusting the pressing force and / or pressing range of the second pressing plate, the pressing force of the first pressing plate can be adjusted with a simple structure.

[0124] According to an eighth aspect, in any of the contact structures of the fourth to seventh aspects, a plurality of the substrate contacts are provided, the contact plate has a plurality of front end portions attached to the respective contacts, and the front end portions are independently displaceable and separable from each other.

[0125] According to this aspect, each of the front end portions of the contact plate is independently displaced, so that each substrate contact point can be independently displaced, and good electrical contact can be maintained at each substrate contact point in accordance with the warping and bending of the substrate.

[0126] According to the ninth aspect, in any contact structure among the first to third aspects, there is provided: a contact block, which is arranged on the above-mentioned sealing component, contacts with the above-mentioned sealing component and presses the above-mentioned sealing component to contact; and an elastic component, which is arranged between the above-mentioned contact block and the above-mentioned second contact part of the above-mentioned substrate contact, the contact part of the above-mentioned elastic component with the above-mentioned substrate contact functions as the above-mentioned first pressing part, and the contact part of the above-mentioned contact block with the above-mentioned sealing component functions as the above-mentioned second pressing part.

[0127] According to this aspect, since the substrate contact point applies contact pressure via the elastic member, it is possible to suppress or prevent an excessive force from being applied to the substrate due to the contact between the substrate contact point and the substrate.

[0128] According to a tenth aspect, in the contact point structure of the ninth aspect, the contact point block is provided at each of the substrate contacts. According to this aspect, each substrate contact point can be displaced independently and can follow the warping and bending of the substrate.

[0129] According to the eleventh aspect, in the contact structure of the ninth or tenth aspect, the elastic component has conductivity, and power can be supplied from the contact block to the substrate contact via the elastic component. According to this aspect, by replacing a part of the power supply path with the elastic component, contact pressure can be applied to the substrate contact independently of contact pressure on the sealing component through a simple and compact structure.

[0130] According to a twelfth aspect, in any one of the ninth to eleventh aspects, a contact point structure is provided, wherein a contact point plate is provided for supplying power to the substrate contact point, and the contact point plate is in contact with and pressed against the contact point block.

[0131] According to this aspect, the first pressing portion and the second pressing portion can be configured with a simple structure while suppressing the addition of components.

[0132] According to a thirteenth aspect, in any one of the contact structures of the first to twelfth aspects, a diameter of the second contact portion is larger than a diameter of the first contact portion.

[0133] According to this method, the contact area between the substrate contact and the contact plate can be ensured, and the contact area between the substrate contact and the substrate can be adjusted to a desired range. In addition, by appropriately adjusting the length of the first contact portion with a small diameter, the rigidity of the entire substrate contact including the first contact portion with a small diameter and the second contact portion with a large diameter can be ensured. For example, when the sealing component made of rubber and the substrate contact are integrally molded, the rigidity of the substrate contact that can withstand the pressure during molding can be achieved.

[0134] According to a fourteenth aspect, in the contact structure of the thirteenth aspect, the substrate contact has a tapered portion between the first contact portion and the second contact portion.

[0135] According to this embodiment, the substrate contact point can be prevented from undergoing a sudden change in shape, and the substrate contact point and the sealing member can be combined well. In addition, when the substrate contact point and the sealing member are integrally molded, the fluidity of the rubber can be ensured.

[0136] According to a fifteenth aspect, in the contact structure of the fourteenth aspect, R is provided at a connection portion between the tapered portion and the first contact portion and / or a connection portion between the tapered portion and the second contact portion.

[0137] According to this aspect, it is possible to further suppress a sudden change in shape of the substrate contact. In addition, the tapered portion and the R-shaped corner of the substrate contact make it easier to ensure the fluidity of the rubber when the substrate contact and the sealing member are integrally molded.

[0138] According to a sixteenth aspect, in the contact structure of the fourteenth or fifteenth aspect, the tapered portion is bonded to the sealing member.

[0139] According to this aspect, by bonding the tapered portion in a direction inclined according to the contact pressure, it is possible to increase the bonding strength between the substrate contact point and the sealing portion.

[0140] According to a seventeenth aspect, in any one of the contact structures of the first to sixteenth aspects, the sealing member is integrally molded together with the substrate contact by vulcanization molding, and the substrate contact and the sealing member are cross-linked and bonded.

[0141] According to this aspect, the bonding strength between the bonding position of the substrate contact and the sealing member can be improved, and the plating solution can be more reliably suppressed or prevented from intruding between the front end side of the substrate contact and the sealing member.

[0142] According to the eighteenth aspect, in any one of the contact structures of the first to seventeenth aspects, the tip of the first contact portion and the sealing surface of the sealing member are configured to be substantially flush with each other.

[0143] According to this aspect, since the tip of the substrate contact point and the sealing surface of the sealing portion are configured to be substantially flush with each other, it is possible to suppress liquid from remaining at the tip of the substrate contact point.

[0144] According to a nineteenth aspect, there is provided a substrate holder, comprising a first holding member and a second holding member, the first holding member and the second holding member being engaged with each other and sandwiching the substrate for holding, at least one of the first holding member and the second holding member having at least one power supply module, the power supply module having the contact structure as described in any one of the first to eighteenth aspects. According to this aspect, the effects described in the above aspects are achieved.

[0145] According to a twentieth aspect, there is provided an electroplating device comprising: the substrate holder according to the nineteenth aspect, and an electroplating tank, and electroplating is performed on a substrate held by the substrate holder. According to this aspect, the effects described in the above aspect are achieved.

[0146] According to a twenty-first aspect, there is provided a method for supplying power to a substrate, wherein a substrate contact is brought into contact with the substrate, wherein the substrate contact is covered by a sealing member, and the substrate contact comprises: a first contact portion bonded to the sealing member and located on a side in contact with the substrate; and a second contact portion engaged with the sealing member at a base end side relative to the first contact portion so as to be relatively displaceable, a contact pressure on the substrate is elastically applied to the substrate contact, and a contact pressure on the substrate is applied to the sealing member independently of the application of the contact pressure to the substrate contact, the substrate contact is displaced in a direction opposite to the substrate (the direction opposite to the contact pressure) by a force received from the substrate side, and a sealing pressure caused by the sealing member is generated by the action of the sealing member remaining on the substrate. According to this aspect, the effects described in the above aspect are achieved.

[0147] Above, the embodiments of the present invention are described based on several examples, but the embodiments of the invention described above are for easy understanding of the present invention and are not intended to limit the content of the present invention. The present invention can certainly be changed and improved without departing from its purport, and the present invention includes its equivalents. In addition, within the scope of at least a part of the above-mentioned problem that can be solved or within the scope of at least a part of the effect, each constituent element recorded in the claims and the specification can be arbitrarily combined or omitted.

[0148] This application claims priority based on Japanese Patent Application No. 2020-163755 filed on September 29, 2020. All disclosed contents of Japanese Patent Application No. 2020-163755 filed on September 29, 2020 including specification, claims, drawings and abstract are incorporated herein by reference in their entirety.

[0149] The entire disclosures of Japanese Patent Application Laid-Open No. 8-13198 (Patent Document 1), Japanese Patent Application Laid-Open No. 7-54199 (Patent Document 2), and Japanese Patent Application Laid-Open No. 2000-219998 (Patent Document 3) including specifications, claims, drawings, and abstracts are incorporated herein by reference in their entirety.

Claims

1. A contact structure having: A substrate contact having a first contact portion on the front end side in contact with the substrate and a second contact portion on the base end side relative to the first contact portion; A sealing member covering the periphery of the substrate contact and having a sealing surface in contact with the substrate to seal the substrate contact; A first pressing portion elastically applies contact pressure to the substrate contact point; as well as The second pressing portion is in contact with the sealing member and applies a contact pressure to the sealing member against the substrate independently of the first pressing portion. The first contact portion is bonded to the sealing member. The second contact portion is fitted to the sealing member so as to be displaceable relative to the sealing member.

2. The contact structure according to claim 1, wherein: The second pressing portion is in contact with the sealing member via a surface parallel to the sealing surface of the sealing member.

3. The contact structure according to claim 1 or 2, wherein: The second pressing portion is located outside the sealing surface of the sealing member with respect to the substrate contact point.

4. The contact structure according to claim 1 or 2, wherein: A portion of the base end side of the second contact portion protrudes from the sealing member, The above contact structure has: A first pressing plate is disposed on the sealing component, contacts the sealing component and presses the sealing component; The contact plate is used to supply power to the substrate contact, is disposed on the first pressing plate, contacts the second contact portion and elastically presses the second contact portion, The contact portion of the contact plate that contacts the second contact portion functions as the first pressing portion. The portion of the first pressing plate that presses the sealing member around a portion or the entire periphery of the substrate contact point functions as the second pressing portion.

5. The contact structure according to claim 4, wherein: The first pressing plate has a through hole. The second contact portion at least partially passes through the through hole of the first pressing plate.

6. The contact structure according to claim 4, wherein: A bus bar is provided for supplying power to the contact plate. The sealing member passes through the through hole of the bus bar and is relatively displaceably arranged on the bus bar. The contact plate is fixed to a bus bar at a side opposite to a side in contact with the second contact portion, and is cantilever-supported by the bus bar.

7. The contact structure according to claim 6, wherein: A second pressing plate is provided, the second pressing plate being arranged on the contact plate and used for adjusting the contact uniformity between the contact plate and the bus bar and the cantilever rigidity of the contact plate.

8. The contact structure according to claim 4, wherein: A plurality of the above-mentioned substrate contacts are provided, The contact plate has a plurality of front end portions mounted on the respective contacts, and the front end portions are independently displaceable and separable from each other.

9. The contact structure according to claim 1 or 2, wherein: have: The contact block is arranged on the sealing component, contacts with the sealing component and presses the sealing component. an elastic member disposed between the contact block and the second contact portion of the substrate contact, The contact portion of the elastic member with the substrate contact point functions as the first pressing portion. A portion of the contact block that is in contact with the sealing member functions as the second pressing portion.

10. The contact structure according to claim 9, wherein: The contact block is provided for each of the substrate contacts.

11. The contact structure according to claim 9, wherein: The elastic member has conductivity, and power can be supplied from the contact block to the substrate contact via the elastic member.

12. The contact structure according to claim 9, wherein: A contact plate is provided, the contact plate is used to supply power to the substrate contacts, and the contact plate contacts the contact block to press the contact block.

13. The contact structure according to claim 1 or 2, wherein: The diameter of the second contact portion is greater than the diameter of the first contact portion.

14. The contact structure according to claim 13, wherein: The substrate contact has a tapered portion between the first contact portion and the second contact portion.

15. The contact structure according to claim 14, wherein: An R is provided at a connection portion between the tapered portion and the first contact portion, and / or a connection portion between the tapered portion and the second contact portion.

16. The contact structure according to claim 14, wherein: The tapered portion is bonded to the sealing member.

17. The contact structure according to claim 1 or 2, wherein: The sealing member is integrally formed together with the substrate contact point by vulcanization molding, and the substrate contact point and the sealing member are cross-linked and bonded.

18. The contact structure according to claim 1 or 2, wherein: The front end of the first contact portion and the sealing surface of the sealing member are configured to be in the same plane.

19. A substrate support, wherein: The device comprises: a first holding member and a second holding member, wherein the first holding member and the second holding member are engaged with each other and sandwich the substrate therebetween to hold the substrate, At least one of the first holding member and the second holding member has at least one power supply module, and the power supply module has the contact structure according to claim 1 or 2.

20. An electroplating device comprising: The substrate support of claim 19; and The plating tank performs electroplating on the substrate held by the substrate holder.

21. A method of supplying power to a substrate, wherein: The substrate contact is brought into contact with the substrate, wherein the substrate contact is covered by a sealing member, and the substrate contact comprises: a first contact portion bonded to the sealing member and located on a side in contact with the substrate; and a second contact portion engaged with the sealing member at a base end side relative to the first contact portion so as to be relatively displaceable. Contact pressure on the substrate is elastically applied to the substrate contact, and contact pressure on the substrate is applied to the sealing component independently of the contact pressure applied to the substrate contact. The substrate contact is displaced in a direction opposite to the substrate by the force received from the substrate side, and the sealing pressure caused by the sealing component is generated by the action of the sealing component remaining on the substrate.

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