A condenser heat exchange structure and an evaporative condenser unit

Abstract

The present invention discloses a condenser heat exchange structure and an evaporative condenser unit. The condenser heat exchange structure is applied to the evaporative condenser unit and includes a heat conductor and a driving device. The heat conductor is arranged on the housing of the evaporative condenser unit or on the condenser, and the driving device is in transmission connection with the heat conductor. The driving device is used to drive the heat conductor to move, so that the housing and the condenser are in heat conduction contact or released from heat conduction contact through the heat conductor. When the condenser heat exchange structure disclosed by the present invention is in use, it is installed on the evaporative condenser unit. When the evaporative condenser unit needs to dissipate heat, the driving device drives the heat conductor to move to the positions where it is in heat conduction contact with the housing and the condenser respectively, and the heat of the condenser is conducted to the housing through the heat conductor, realizing rapid heat dissipation. Compared with the existing air heat conduction method, the present invention improves the heat dissipation efficiency of the condenser.

Description

Technical Field

[0001] The invention relates to the technical field of cooling units, and in particular to a condenser heat exchange structure and an evaporative condenser unit. Background Art

[0002] At present, in an evaporative condenser unit, the heat in the condenser coil is dissipated into the air, and the heat in the coil is dissipated by heat exchange between the air and the unit shell, and the heat exchange efficiency is low.

[0003] Therefore, how to improve the heat exchange efficiency of the condenser is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0004] In view of this, the first object of the present invention is to provide a condenser heat exchange structure that can directly contact the condenser to dissipate heat and improve the heat dissipation efficiency of the condenser.

[0005] A second object of the present invention is to provide an evaporative condenser unit.

[0006] In order to achieve the above first object, the present invention provides the following scheme:

[0007] A condenser heat exchange structure, applied to an evaporative condenser unit, comprises a heat conductor and a driving device;

[0008] The heat conductor is arranged on the shell of the evaporative condenser unit or on the condenser in the shell, and the driving device is transmission-connected to the heat conductor;

[0009] The driving device is used to drive the heat conductor to move so that the shell is in heat-conducting contact with the condenser through the heat conductor or is released from heat-conducting contact.

[0010] In a specific embodiment, the condenser heat exchange structure further includes a shell temperature sensor and a condenser temperature sensor;

[0011] The shell temperature sensor is used to detect the temperature of the shell, and the condenser temperature sensor is used to detect the temperature of the condenser;

[0012] When the temperature of the shell is lower than the temperature of the condenser, the driving device drives the heat conductor to move from one of the shell and the condenser toward the other, so that the shell is in thermal contact with the condenser through the heat conductor;

[0013] When the temperature of the shell is greater than the temperature of the condenser, the driving device drives the heat conductor to move from one of the shell and the condenser to a direction away from the other, so that the condenser and the shell are released from heat conduction contact.

[0014] In another specific embodiment, the heat conductor is slidably mounted on the inner wall of the housing or on the condenser along a direction parallel to any inner wall surface of the circumferential side wall of the housing, or rotatably mounted along a direction perpendicular to any inner wall surface of the circumferential side wall of the housing.

[0015] In another specific embodiment, the heat conductor is an integrally formed long block;

[0016] Or

[0017] The heat conductor includes a heat conductor body and a telescopic assembly that are in thermal contact with each other. The heat conductor body is fixed on the housing and is in thermal contact with the housing. The telescopic assembly is telescopically mounted on the wall surface of the heat conductor body facing away from the housing for fitting against the condenser to be in thermal contact with the condenser;

[0018] Or

[0019] The heat conductor body is fixed on the condenser and is in thermal contact with the condenser. The telescopic assembly is telescopically mounted on the wall surface of the heat conductor body facing away from the condenser for fitting against the housing to be in thermal contact with the housing.

[0020] In another specific embodiment, the telescopic assembly includes an abutting block and a spring;

[0021] A receiving groove is formed in the heat conductor body. The spring is located in the receiving groove, and one end of the spring abuts against or is connected to the bottom of the receiving groove. The other end of the spring abuts against or is connected to the abutting block. The abutting block is slidably connected to the receiving groove for fitting against the condenser to be in thermal contact with the condenser or fitting against the housing to be in thermal contact with the housing.

[0022] In another specific embodiment, a fitting groove is formed on one side of the abutting block for fitting against the coil of the condenser.

[0023] In another specific embodiment, when the heat conductor is rotatably mounted on the inner wall of the housing or on the condenser, the driving device is a rotary driving device;

[0024] When the heat conductor is slidably mounted on the inner wall of the housing or on the condenser, the driving device is a linear driving device.

[0025] In another specific embodiment, the heat conductor is slidably mounted on the inner wall of the housing or on the condenser along a direction perpendicular to or inclined to any inner wall surface of the circumferential side wall of the housing.

[0026] In another specific embodiment, an installation through-hole is provided on the housing, and the heat conductor is slidably plugged and installed at the installation through-hole along the axial direction of the installation through-hole;

[0027] Or,

[0028] A slide rail is installed on the condenser along the direction perpendicular to any inner wall surface of the circumferential side wall of the housing, and the heat conductor is slidably installed on the slide rail.

[0029] In another specific embodiment, the driving device includes an electromagnet and an elastic reset member;

[0030] One end of the elastic reset member is connected to the housing or the condenser, and the other end of the elastic reset member is connected to the heat conductor;

[0031] The elastic reset member drives the heat conductor to conduct heat contact with the condenser or the housing, or the elastic reset member drives the heat conductor away from the condenser or the housing to release the heat conduction contact between the condenser and the housing;

[0032] The heat conductor is a metal block, and / or a permanent magnet capable of being adsorbed by the electromagnet is fixed on the heat conductor;

[0033] When the electromagnet is energized, the electromagnet adsorbs the heat conductor to move in a direction away from or close to the other one of the housing and the condenser, so as to release the heat conduction contact between the two or make the two conduct heat contact; when the electromagnet is de-energized, the elastic reset member drives the heat conductor to move in a direction close to or away from the other one of the housing and the condenser, so as to make the two conduct heat contact or release the heat conduction contact between the two.

[0034] In another specific embodiment, the driving device includes a first electromagnet and a second electromagnet;

[0035] The heat conductor is a metal block, and / or a permanent magnet is fixed on the heat conductor;

[0036] When the first electromagnet is energized and the second electromagnet is de-energized, the first electromagnet adsorbs the heat conductor to move away from the other one of the housing and the condenser, so as to release the heat conduction contact therebetween;

[0037] When the first electromagnet is de-energized and the second electromagnet is energized, the second electromagnet adsorbs the heat conductor to move in a direction close to the other one of the housing or the condenser, so as to conduct heat contact with the other one.

[0038] In another specific embodiment, a fitting groove that fits the coil of the condenser is provided on the surface of the heat conductor facing the condenser.

[0039] In another specific embodiment, the heat conductor is made of copper or graphite.

[0040] The various embodiments of the present invention can be arbitrarily combined as needed. The embodiments obtained after these combinations are also within the scope of the present invention and are part of the specific implementation manners of the present invention.

[0041] For the condenser heat exchange structure disclosed by the present invention, during use, the condenser heat exchange structure is installed on an evaporative condenser unit. When the evaporative condenser unit needs to dissipate heat, the driving device drives the heat conductor to move to positions where it is in thermal contact with the housing and the condenser respectively, and conducts the heat of the condenser to the housing through the heat conductor, achieving rapid heat dissipation. Compared with the existing air heat conduction method, the present invention improves the heat dissipation efficiency of the condenser.

[0042] To achieve the above second object, the present invention provides the following solution:

[0043] An evaporative condenser unit includes a housing, a condenser, and the condenser heat exchange structure as described in any one of the above.

[0044] The condenser is installed in the housing, and the condenser heat exchange structure is installed on the housing or the condenser.

[0045] Since the evaporative condenser unit provided by the present invention includes the condenser heat exchange structure in any one of the above, therefore, the beneficial effects included in the condenser heat exchange structure are all included in the evaporative condenser unit disclosed by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0047] Figure 1 It is the front view structural schematic diagram of the condenser heat exchange structure provided by an embodiment of the present invention;

[0048] Figure 2 It is the sectional view structural schematic diagram of the condenser heat exchange structure provided by another embodiment of the present invention;

[0049] Figure 3Schematic front view structure diagram of an evaporative condenser unit provided by an embodiment of the present invention;

[0050] Figure 4 Schematic front view structure diagram of an evaporative condenser unit provided by another embodiment of the present invention.

[0051] Among them, Figures 1 - 4 In:

[0052] Condenser heat exchange structure 100, evaporative condenser unit 1000, heat conductor 101, driving device 102, housing 200, condenser 300, electromagnet 102a, elastic reset member 102b, fitting groove 101a, permanent magnet 103. Specific embodiments

[0053] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying Figures 1 - 4 drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. The purpose of providing the following specific embodiments is to facilitate a clearer and more thorough understanding of the disclosed content of the present invention. The words indicating directions such as below are only for the positions of the shown structures in the corresponding drawings.

[0054] It can be understood that the terms used herein are only for describing specific embodiments and are not intended to limit the present invention. When used herein, unless the context clearly states otherwise, the singular forms "a" and "" are also intended to include the plural forms. Further, when used in this specification, the terms "comprising" and / or "including" indicate the presence of features, wholes, steps, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, elements, components, and / or their combinations. The subsequent description in the specification is a preferred embodiment for implementing the present invention, but the description is for the purpose of explaining the general principles of the present invention and is not intended to limit the scope of the present invention. The protection scope of the present invention shall be determined by the scope defined by the appended claims.

[0055] As Figures 1 - 2 shown, the present invention provides a condenser heat exchange structure 100, which is applied to an evaporative condenser unit 1000. Heat is conducted to the housing 200 of the evaporative condenser unit 1000 through direct contact between the heat conductor 101 and the condenser 300 for heat dissipation, improving the heat dissipation efficiency of the condenser 300.

[0056] Specifically, the condenser heat exchange structure 100 includes a heat conductor 101 and a driving device 102. The heat conductor 101 is arranged on the housing 200 of the evaporative condenser unit 1000. It should be noted that the heat conductor 101 being arranged on the housing 200 includes all forms in which the heat conductor 101 is always in contact with the housing 200, including forms such as fitting and sliding connection.

[0057] Alternatively, the heat conductor 101 may be disposed on the condenser 300. Similarly, the heat conductor 101 disposed on the condenser 300 includes all forms in which the heat conductor 101 is always in contact with the condenser 300, including forms such as fitting and sliding connection.

[0058] The driving device 102 is in transmission connection with the heat conductor 101 to drive the heat conductor 101 to move, so that the housing 200 is in heat conduction contact with or separated from the condenser 300 through the heat conductor 101. That is, when the heat conductor 101 is disposed on the housing 200, the driving device 102 drives the heat conductor 101 to be in heat conduction contact with or separated from the condenser 300. The driving device 102 is fixed on the housing 200 or on the condenser 300. The driving device 102 is any power structure capable of driving the heat conductor 101 to move to a position where it is in heat conduction contact with or separated from the condenser 300. When the heat conductor 101 is disposed on the condenser 300, the driving device 102 drives the heat conductor 101 to be in heat conduction contact with the housing 200. The driving device 102 is fixed on the housing 200 or on the condenser 300. The driving device 102 is any power structure capable of driving the heat conductor 101 to move to a position where it is in heat conduction contact with or separated from the housing 200.

[0059] When the condenser 300 needs to dissipate heat, the driving device 102 drives the heat conductor 101 to move, so that the housing 200 is in heat conduction contact with the condenser 300 through the heat conductor 101. When the radiator does not need to dissipate heat, the driving device 102 drives the heat conductor 101 to move, so that the condenser 300 is separated from the housing 200 to release the heat conduction contact and avoid heat transfer through the heat conductor 101.

[0060] It can be understood that the release of heat conduction contact between the condenser 300 and the housing 200 in this article means that there is no heat conduction contact between the condenser 300 and the housing 200. The heat conduction contact between the condenser 300 and the housing 200 in this article means that heat conduction occurs when the condenser 300 and the housing 200 are in contact, and here the contact means contact through the heat conductor 101.

[0061] In order to improve the heat conduction efficiency of the heat conductor 101, the present invention discloses that the heat conductor 101 is made of copper or graphite.

[0062] The condenser heat exchange structure 100 disclosed in the present invention, when in use, is installed on the evaporative condenser unit 1000. When the evaporative condenser unit 1000 needs to dissipate heat, the driving device 102 drives the heat conductor 101 to move, so that the housing 200 is in heat-conducting contact with the condenser 300 through the heat conductor 101. The heat of the condenser 300 is conducted to the housing 200 through the heat conductor 101 to achieve rapid heat dissipation. Compared with the existing air heat-conducting method, the present invention improves the heat dissipation efficiency of the condenser 300.

[0063] In some embodiments, the condenser heat exchange structure 100 further includes a housing temperature sensor and a condenser temperature sensor. The housing temperature sensor, the condenser temperature sensor and the driving device 102 are respectively connected to the controller in signal. The controller can be the controller within the condenser heat exchange structure 100, or a separately configured controller, or a controller built into the driving device 102, etc.

[0064] The housing temperature sensor is used to detect the temperature of the housing 200, and the condenser temperature sensor is used to detect the temperature of the condenser 300.

[0065] When the temperature of the housing 200 is lower than the temperature of the condenser 300, the driving device 102 drives the heat conductor 101 to move from either the housing 200 or the condenser 300 towards the other to make the housing 200 in heat-conducting contact with the condenser 300 through the heat conductor 101; when the temperature of the housing 200 is higher than the temperature of the condenser 300, the driving device 102 drives the heat conductor 101 to move from either the housing 200 or the condenser 300 away from the other to release the heat-conducting contact between the condenser 300 and the housing 200.

[0066] Taking the heat conductor 101 being arranged on the housing 200 as an example, when the temperature of the housing 200 is higher than the temperature of the condenser 300, the controller controls the driving device 102 to drive the heat conductor 101 away from the condenser 300; when the temperature of the housing 200 is higher than the temperature of the condenser 300 of the evaporative condenser unit 1000, the controller controls the driving device 102 to drive the heat conductor 101 to be in heat-conducting contact with the condenser 300.

[0067] In some embodiments, the heat conductor 101 is slidably mounted or rotatably mounted along a direction parallel to any inner wall surface of the circumferential side wall of the housing 200 or along a direction perpendicular to any inner wall surface of the circumferential side wall of the housing 200 on the inner wall of the housing 200 or on the condenser 300.

[0068] Understandably, the heat conductor 101 here includes the heat conductor 101 being completely parallel or slightly inclined at an angle to any inner wall surface along the circumferential side wall of the parallel housing 200. It should be noted that any inner wall surface of the circumferential side wall of the housing 200 here refers to any inner wall surface of the side wall of the housing 200 surrounding the condenser. Understandably, arranging the heat conductor 101 to be slidable along the direction parallel to any inner wall surface of the circumferential side wall of the housing 200 or rotatable along the direction perpendicular to any inner wall surface of the circumferential side wall of the housing 200 and installed on the inner wall of the housing 200 or the condenser 300 is only a specific embodiment of the present invention. In practical applications, it is also possible to arrange the heat conductor 101 to be slidable along the direction parallel to any inner wall surface of the top wall or the bottom wall of the housing 200, or rotatable along the direction perpendicular to any inner wall surface of the top wall or the bottom wall of the housing 200 and installed on the inner wall of the housing 200 or the condenser 300, etc.

[0069] Taking the heat conductor 101 being slidable or rotatable and installed on the inner wall of the housing 200 as an example, as Figure 2 shown, the position where the heat conductor 101 fits the condenser 300 is not limited. Considering that there are heat dissipation fins arranged at the middle position of the coil of the condenser 300, in order to avoid interference between the heat conductor 101 and the heat dissipation fins on the coil, the heat conductor 101 is placed on the side wall of the housing 200 so that the heat conductor 101 fits at the position where the coil bends, and there are no heat dissipation fins at this position. Understandably, arranging the heat conductor 101 to be slidable or rotatable and installed on the side wall of the housing 200 is only a specific embodiment of the present invention. In practical applications, it is also possible that arranging the heat conductor 101 to be slidably installed on the side wall of the housing 200 specifically includes: (1) the heat conductor 101 slides along the height direction of the side wall of the housing 200; (2) the heat conductor 101 slides along the horizontal direction of the side wall of the housing 200; (3) the heat conductor 101 slides obliquely along the side wall of the housing 200 or slides along a curved path, etc.

[0070] Corresponding to the heat conductor 101 being slidably installed on the side wall of the housing 200, the driving device 102 is a linear driving device. Specifically, the linear driving device can be an electric push rod, a cylinder, or a hydraulic cylinder, etc. In order to facilitate the sliding of the heat conductor 101, a track or groove for the heat conductor 101 to slide can be arranged on the side wall of the housing 200 along the moving track of the heat conductor 101.

[0071] The heat conductor 101 is rotatably installed on the side wall of the housing 200, and the driving device 102 is a rotary driving device. Specifically, the rotary driving device is a motor or a rotary cylinder, etc. In order to adjust the rotation speed of the heat conductor 101, the heat conductor 101 is connected to the motor through a speed reducer, etc.

[0072] When the heat conductor 101 is slidably mounted on the condenser 300 along a direction parallel to the inner wall surface of the housing 200, a guide rail can be provided on the condenser 300 along a direction parallel to the inner wall surface of the housing 200, and the heat conductor 101 is slidably mounted on the guide rail along the guide rail.

[0073] When the heat conductor 101 is rotatably mounted on the condenser 300 along a direction perpendicular to the inner wall surface of the housing 200, a bracket can be mounted on the condenser 300, and the heat conductor 101 is rotatably mounted on the bracket.

[0074] In some embodiments, the heat conductor 101 is an integrally formed long block. It should be noted that the heat conductor 101 can also be of other shapes.

[0075] In some other embodiments, the heat conductor 101 includes a heat conductor body and a telescopic assembly that are in heat-conducting contact with each other. The heat conductor body is fixed on the housing 200 and is in heat-conducting contact with the housing 200. The telescopic assembly is telescopically mounted on the wall surface of the heat conductor body facing away from the housing 200 and is used to fit against the condenser 300 to be in heat-conducting contact with the condenser 300.

[0076] It should be noted that it can also be that the heat conductor body is fixed on the condenser 300 and is in heat-conducting contact with the condenser 300, and the telescopic assembly is telescopically mounted on the wall surface of the heat conductor body facing away from the condenser 300 and is used to fit against the housing 200 to be in heat-conducting contact with the housing 200.

[0077] In the present invention, through the telescoping of the telescopic assembly, it is convenient for the driving device 102 to drive the heat conductor 101 into the space between the inner wall of the housing 200 and the condenser 300.

[0078] It can be understood that the end of the heat conductor body facing the condenser 300 specifically refers to the end face of the heat conductor body facing the condenser 300 when the heat conductor 101 is mounted on the housing 200 and is in contact with the condenser 300. The end of the heat conductor body facing the housing 200 specifically refers to the end face of the heat conductor body facing the housing 200 when the heat conductor 101 is mounted on the condenser 300 and is in contact with the housing 200.

[0079] In order to facilitate the heat conductor 101 to enter the space between the inner wall of the housing 200 and the condenser 300, the present invention discloses that a guiding portion is further provided on the telescopic assembly. Taking the heat conductor 101 mounted on the housing 200 as an example, the surface of the guiding portion in contact with the condenser 300 is an inclined surface, and along the direction in which the heat conductor 101 enters the space between the housing 200 and the condenser 300, the inclined surface is inclined towards the direction close to the housing 200.

[0080] Furthermore, the present invention discloses that the telescopic assembly includes an abutting block and a spring.

[0081] A receiving groove is formed in the heat conducting body main body. The spring is located in the receiving groove, and one end of the spring abuts against or is connected to the bottom of the receiving groove, and the other end of the spring abuts against or is connected to the abutting block. The abutting block is slidably connected to the receiving groove. The abutting block is used to fit against the condenser 300 to conduct heat contact with the condenser 300 or to fit against the housing 200 to conduct heat contact with the housing 200. When the abutting block enters between the condenser 300 and the housing 200 to fit against the condenser 300 or the housing 200, the abutting block is squeezed by the condenser 300 or the housing 200, compressing the spring, realizing flexible contact between the abutting block and the condenser 300 or the housing 200, and avoiding rigid damage between the abutting block and the condenser 300 or the housing 200.

[0082] Specifically, the abutting block is slidably connected to the groove wall of the receiving groove. Among the abutting block and the groove wall of the receiving groove, a slider is provided on one of them, and a sliding groove is provided on the other. A limiting block for preventing the abutting block from slipping off is also provided on the receiving groove.

[0083] Furthermore, the present invention discloses that a fitting groove is formed on one side of the abutting block for fitting against the condenser 300 to fit against the coil of the condenser 300, increasing the contact area with the coil, and further improving the heat conduction efficiency.

[0084] It should be noted that the number of the fitting grooves is not limited to 1 and can be set as required.

[0085] In some other embodiments, the heat conducting body 101 can be slidably installed on the inner wall of the housing 200 or the condenser 300 along a direction perpendicular to or inclined to any inner wall surface of the circumferential side wall of the housing 200.

[0086] When the heat conducting body 101 is installed on the housing 200, as Figure 1 shown, an installation through hole is formed in the housing 200, and the heat conducting body 101 is slidably plugged and installed at the installation through hole along the axial direction of the installation through hole. That is to say, the heat conducting body 101 is also equivalent to a part of the housing 200. In order to further improve the heat dissipation efficiency of the condenser 300, heat dissipation fins and the like are provided at the end of the heat conducting body 101 facing away from the condenser 300. In addition to contacting the housing 200 and dissipating heat through the housing 200, heat can also be dissipated through the heat dissipation fins.

[0087] When the heat conducting body 101 is installed on the condenser 300, a slide rail is installed on the condenser 300 along a direction perpendicular to any inner wall surface of the circumferential side wall of the housing 200, and the heat conducting body 101 can be slidably installed on the slide rail. Specifically, the slide rail is arranged along a direction perpendicular to or inclined to any inner wall surface of the circumferential side wall of the housing 200.

[0088] Furthermore, the present invention discloses that the driving device 102 includes an electromagnet 102a and an elastic reset member. One end of the elastic reset member is connected to the housing 200 or the condenser 300, and the other end of the elastic reset member is connected to the heat conducting body 101. When the elastic reset member is in a compressed state, the elastic reset member drives the heat conducting body 101 to conduct heat and contact the condenser 300 or the housing 200. When the elastic reset member is in a stretched state, the elastic reset member drives the heat conducting body 101 away from the condenser 300 or the housing 200 to release the heat conducting contact between the condenser 300 and the housing 200.

[0089] In order to achieve the adsorption between the electromagnet 102a and the heat conducting body 101, the present invention discloses that the heat conducting body 101 is a metal block. It should be noted that the heat conducting body 101 can also be made of non-metallic material, and a permanent magnet 103 capable of adsorbing with the electromagnet 102a is fixed on the heat conducting body 101.

[0090] When the electromagnet 102a is energized, the electromagnet 102a adsorbs the heat conducting body 101 to move in a direction away from or close to either one of the housing 200 and the condenser 300, so as to release the heat conducting contact between the two or make the two conduct heat and contact; when the electromagnet 102a is de-energized, the elastic reset member drives the heat conducting body 101 to move in a direction close to or away from either one of the housing 200 and the condenser 300, so as to make the two conduct heat and contact or release the heat conducting contact between the two.

[0091] Taking the example that the elastic reset member is connected to the housing 200 and the elastic reset member is in a compressed state, the electromagnet 102a is fixed outside the housing 200. One end of the elastic reset member is connected to the housing 200, and the other end of the elastic reset member is connected to the heat conducting body 101, and the elastic reset member drives the heat conducting body 101 to fit against the condenser 300. That is, when the electromagnet 102a is not energized, the heat conducting body 101 fits against the condenser 300 under the action of the elastic reset member; when the electromagnet 102a is energized, the magnetic attraction force between the electromagnet 102a and the heat conducting body 101 overcomes the acting force of the elastic reset member, driving the heat conducting body 101 to move away from the condenser 300 and separate from the condenser 300. When the electromagnet 102a is energized, the electromagnet 102a adsorbs the heat conducting body 101 away from the condenser 300; when the electromagnet 102a is de-energized, the elastic reset member 102b drives the heat conducting body 101 to fit against the condenser 300.

[0092] Taking the case where the elastic reset member is connected to the housing 200 and the elastic reset member is in a stretched state as an example, the electromagnet 102a is fixed in the housing 200, a mounting plate is arranged on the outer wall of the housing 200 in a direction away from the housing 200, one end of the elastic reset member is connected to the mounting plate, the other end of the elastic reset member is connected to the heat conductor 101, and the length of the elastic reset member is greater than the initial length of the elastic reset member, that is, it is in a stretched state, and the elastic reset member drives the heat conductor 101 away from the condenser 300. That is, when the electromagnet 102a is not powered on, the heat conductor 101 is separated from the condenser 300 under the action of the elastic reset member; when the electromagnet 102a is powered on, the magnetic attraction between the electromagnet 102a and the heat conductor 101 overcomes the action of the elastic reset member, drives the heat conductor 101 to move in a direction close to the condenser 300, and fits with the condenser 300. When the electromagnet 102 a is powered on, the electromagnet 102 a attracts the heat conductor 101 to approach and fit the condenser 300 ; when the electromagnet 102 a is powered off, the elastic reset member 102 b drives the heat conductor 101 to separate from the condenser 300 .

[0093] It is understandable that the above structure of the driving device 102 is a specific embodiment of the present invention. In practical applications, the driving device 102 can also be set to other structures, for example, the driving device 102 includes a first electromagnet and a second electromagnet. The heat conductor 101 is a metal block, and the first electromagnet and the second electromagnet are adsorbed on the heat conductor 101 respectively; the heat conductor 101 can also be made of non-metallic material, and a permanent magnet 103 is fixed on the heat conductor 101, and the first electromagnet and the second electromagnet are adsorbed respectively by the permanent magnet 103; of course, the heat conductor 101 can also be made of metal material, and a permanent magnet 103 is also fixed on the heat conductor 101.

[0094] When the first electromagnet is powered on and the second electromagnet is powered off, the first electromagnet attracts the heat conductor 101 to move away from the shell 200 and the condenser 300 to release the thermal contact between the two; when the first electromagnet is powered off and the second electromagnet is powered on, the second electromagnet attracts the heat conductor 101 to move toward the other from the shell 200 or the condenser 300 to contact the other in thermal conduction.

[0095] Taking the installation of the heat conductor 101 on the housing 200 as an example, the first electromagnet and the second electromagnet are located inside the housing 200 and outside the housing 200, respectively. Specifically, brackets for installing the first electromagnet and the second electromagnet are respectively provided on the outer wall of the housing 200 and the inner wall of the housing 200. When the first electromagnet is powered on and the second electromagnet is powered off, the first electromagnet adsorbs the heat conductor 101 away from the condenser 300; when the first electromagnet is powered off and the second electromagnet is powered on, the second electromagnet adsorbs the heat conductor 101 and fits it to the condenser 300.

[0096] Furthermore, on the surface of the heat conductor 101 facing the condenser 300, there is a fitting groove 101a that fits the coil of the condenser 300, so as to fit the coil of the condenser 300, increase the contact area with the coil, and thus improve the heat conduction efficiency.

[0097] It should be noted that the number of grooves is not limited to 1 and can be set as needed.

[0098] As Figure 3 and Figure 4 shown, in the second aspect of the present invention, there is provided an indirect evaporative condenser unit, including a housing 200, a condenser 300, and a condenser heat exchange structure 100 in any one of the above embodiments.

[0099] The condenser 300 is installed in the housing 200, and the condenser heat exchange structure 100 is installed on the housing 200 or the condenser 300.

[0100] Since the indirect evaporative condenser 300 unit provided by the present invention includes the condenser heat exchange structure 100 in any one of the above, therefore, the beneficial effects included in the condenser heat exchange structure 100 are all included in the indirect evaporative condenser unit disclosed by the present invention.

[0101] It should be noted that the words indicating directions in this article, such as up, down, etc., are all set according to the directions in the attached drawings of the specification. It is only for the convenience of expression and does not have any other specific meanings. Figure 1 It is also necessary to note that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of another identical element in the article or device including the above elements.

[0102] Specific examples are used in this article to elaborate on the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the core idea of the present invention. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and modifications can still be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

[0103] Specific examples are used in this article to elaborate on the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the core idea of the present invention. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and modifications can still be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A heat exchange structure of a condenser, which is applied to an evaporative condenser unit, is characterized in that, It includes a heat conductor and a driving device; The heat conductor is arranged on the housing of the evaporative condenser unit or on the condenser within the housing, and the driving device is in transmission connection with the heat conductor; The driving device is used to drive the heat conductor to move, so that the housing is in heat-conducting contact with the condenser or the heat-conducting contact is released through the heat conductor.

2. The condenser heat exchange structure according to claim 1, characterized in that It further includes a housing temperature sensor and a condenser temperature sensor; The housing temperature sensor is used to detect the temperature of the housing, and the condenser temperature sensor is used to detect the temperature of the condenser; When the temperature of the housing is lower than the temperature of the condenser, the driving device is used to drive the heat conductor to move from either the housing or the condenser towards the direction close to the other, so that the housing is in heat-conducting contact with the condenser through the heat conductor; When the temperature of the housing is higher than the temperature of the condenser, the driving device is used to drive the heat conductor to move from either the housing or the condenser towards the direction away from the other, so that the condenser and the housing are released from heat-conducting contact.

3. The condenser heat exchange structure according to claim 2, characterized in that, The heat conductor is slidably installed on the inner wall of the housing or on the condenser along a direction parallel to any inner wall surface of the circumferential side wall of the housing or rotatably installed along a direction perpendicular to any inner wall surface of the circumferential side wall of the housing.

4. The condenser heat exchange structure according to any one of claims 1-3, characterized in that, The heat conductor is an integrally formed long block; Or The heat conductor includes a heat conductor body and a telescopic component that are in heat-conducting contact with each other. The heat conductor body is fixed on the housing and is in heat-conducting contact with the housing. The telescopic component is telescopically installed on the wall surface of the heat conductor body facing away from the housing and is used to fit the condenser to be in heat-conducting contact with the condenser; Or The heat conductor body is fixed on the condenser and is in heat-conducting contact with the condenser. The telescopic component is telescopically installed on the wall surface of the heat conductor body facing away from the condenser and is used to fit the housing to be in heat-conducting contact with the housing.

5. The condenser heat exchange structure according to claim 4, characterized in that, The telescopic component includes a contact block and a spring; A receiving groove is formed on the heat conductor body. The spring is located in the receiving groove, and one end of the spring abuts or is connected to the bottom of the receiving groove. The other end of the spring abuts or is connected to the contact block. The contact block is slidably connected to the receiving groove and is used to fit the condenser to be in heat-conducting contact with the condenser or fit the housing to be in heat-conducting contact with the housing.

6. The condenser heat exchange structure according to claim 5, characterized in that A fitting groove is formed on the side of the contact block for fitting the coil of the condenser.

7. The condenser heat exchange structure according to claim 3, wherein, When the heat conductor is rotatably installed on the inner wall of the housing or on the condenser, the driving device is a rotary driving device; When the heat conductor is slidably installed on the inner wall of the housing or on the condenser, the driving device is a linear driving device.

8. The condenser heat exchange structure according to claim 1, characterized in that The heat conductor is slidably installed on the inner wall of the housing or on the condenser along a direction perpendicular or inclined to any inner wall surface of the circumferential side wall of the housing.

9. The condenser heat exchange structure according to claim 8, wherein, An installation through-hole is formed on the housing. The heat conductor is slidably plugged and installed at the installation through-hole along the axial direction of the installation through-hole and is in heat-conducting contact with the housing; Or, A slide rail is installed on the condenser along the direction of any inner wall surface perpendicular to the circumferential side wall of the housing, and the heat conductor is slidably installed on the slide rail.

10. The condenser heat exchange structure according to claim 8, characterized in that, The driving device includes an electromagnet and an elastic reset member; One end of the elastic reset member is connected to the housing or the condenser, and the other end of the elastic reset member is connected to the heat conductor; The elastic reset member is used to drive the heat conductor to conduct heat contact with the condenser or the housing, or the elastic reset member is used to drive the heat conductor away from the condenser or the housing to release the heat conduction contact between the condenser and the housing; The heat conductor is a metal block, and / or a permanent magnet capable of being adsorbed by the electromagnet is fixed on the heat conductor; When the electromagnet is energized, the electromagnet adsorbs the heat conductor to move in a direction away from or close to either the housing or the condenser, so that the heat conduction contact between the two is released or the heat conduction contact between the two is established; when the electromagnet is de-energized, the elastic reset member drives the heat conductor to move in a direction close to or away from either the housing or the condenser, so that the heat conduction contact between the two is established or the heat conduction contact between the two is released.

11. The condenser heat exchange structure according to claim 8, characterized in that, The driving device includes a first electromagnet and a second electromagnet; The heat conductor is a metal block, and / or a permanent magnet is fixed on the heat conductor; When the first electromagnet is energized and the second electromagnet is de-energized, the first electromagnet adsorbs the heat conductor to move in a direction away from the other one of the housing and the condenser, so as to release the heat conduction contact therebetween; When the first electromagnet is de-energized and the second electromagnet is energized, the second electromagnet adsorbs the heat conductor to move in a direction close to the other one of the housing or the condenser, so as to conduct heat contact with the other one.

12. The condenser heat exchange structure according to claim 8, wherein, A fitting groove that fits with the coil of the condenser is provided on the surface of the heat conductor facing the condenser.

13. The condenser heat exchange structure according to any one of claims 1-3, characterized in that, The heat conductor is made of copper or graphite.

14. An evaporative condenser unit, characterized in that, It includes a housing, a condenser, and a condenser heat exchange structure according to any one of claims 1-13; The condenser is installed in the housing; The condenser heat exchange structure is installed on the housing or the condenser.

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