Distributed optical fiber temperature measurement parameter automatic adjustment system and method

Abstract

The application provides a distributed optical fiber temperature measurement parameter automatic adjustment system and method, comprising a first temperature measurement device and a second temperature measurement device connected to an optical fiber temperature measurement system, the first temperature measurement device and the second temperature measurement device are respectively installed at different positions of the optical fiber, the first temperature measurement device comprises a first circuit, a first temperature measurement module in a first temperature holding cavity and connected to the first circuit, the second temperature measurement device comprises a second circuit, a second temperature holding cavity and a second temperature measurement module in the second temperature holding cavity and connected to the second circuit, the first circuit is used for communication connection of the optical fiber temperature measurement system, and the second circuit is used for communication connection of the optical fiber temperature measurement system. The system can automatically adjust parameters at any time, and provides two temperature measurement devices with temperature holding cavities, which can be directly sleeved on the optical fiber during use, and are very convenient to use, do not need to be wound, and do not need the participation of a constant temperature tank, and have the advantages of convenient use, high practicability and the like.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of distributed optical fiber temperature measurement, and particularly relates to a distributed optical fiber temperature measurement parameter automatic adjustment system and method. BACKGROUND

[0002] The working principle of the distributed optical fiber temperature measurement sensor is based on the temperature characteristics of optical fiber back Raman scattering. Since the Raman scattering light pulse signals with different amplitudes represent the temperature information of each point of the optical fiber, according to the propagation speed of light in the medium and by using the OTDR technology, the relative round-trip time and amplitude of the back Raman scattering light signal are observed, so that the instantaneous temperature and its change of all points of the optical fiber can be accurately detected. The temperature measurement of the distributed optical fiber temperature measurement sensor is determined by the ratio of the back Raman scattering light intensity to the Stokes light intensity, that is,

[0003]

[0004] In the formula, I as is the back Raman scattering light intensity; I s is the Stokes scattering light intensity, h is the Planck constant, c is the speed of light in vacuum, Δv is the Raman frequency shift, k is the Boltzmann constant, and T is the temperature. Since the ratio of the two is only related to the temperature, the biggest advantage of determining the temperature by using the ratio is that the measurement error caused by the stress, loss or change of laser power due to various changes of the optical fiber can be eliminated, and research shows that the light intensity ratio and the actual temperature have a linear relationship i=1, 2, 3…n, representing the corresponding temperature measurement point. At present, during the installation of the optical fiber, the temperature of the optical fiber is tested based on the above principle, the appropriate parameters of the linear relationship are found, the linear relationship with the appropriate parameters is input into the processing module of the distributed optical fiber temperature measurement system, and the instantaneous temperature of each point is obtained through the linear relationship subsequently.

[0005] However, when the use time of the optical fiber reaches a certain service life, the loss of the optical fiber will gradually increase, at which time the parameters need to be adjusted. In addition, as the change of the temperature increases, the change of the loss of the optical fiber will also increase, at which time the parameters also need to be adjusted. At present, the manual adjustment of the parameters is adopted, but manual modification has many inconveniences, for example, it is unknown when the adjustment should be made, and moreover, the temperature change often occurs, so manual modification is very troublesome, time-consuming and labor-consuming. For some places with relatively harsh environment or inconvenient to enter at will, it is very inconvenient to adjust the parameters.

[0006] In order to solve the above technical problems, people have carried out long-term exploration, for example, a kind of optical fiber temperature measurement system parameter calibration method, device and system disclosed in Chinese patent [application number: CN201810977719.9], the scheme proposes to use constant temperature tank and temperature sensor to calibrate parameters at any time, which is more accurate than the traditional method of fixing parameters in the system after calibration only once, and also does not need artificial parameter adjustment. SUMMARY

[0007] The purpose of the present application is to solve the above problems, provide a kind of distributed optical fiber temperature measurement parameter automatic adjustment system and method.

[0008] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0009] A kind of distributed optical fiber temperature measurement parameter automatic adjustment system, including the first temperature measuring device and second temperature measuring device connected to optical fiber temperature measurement system, first temperature measuring device and second temperature measuring device are respectively installed at different positions of optical fiber, and the first temperature measuring device includes first circuit, first insulation cavity and first temperature measuring module located in first insulation cavity and connected to the first circuit, the second temperature measuring device includes second circuit, second insulation cavity and second temperature measuring module located in second insulation cavity and connected to the second circuit, the first circuit is used for communication connection optical fiber temperature measurement system, the second circuit is used for communication connection optical fiber temperature measurement system.

[0010] In the above distributed optical fiber temperature measurement parameter automatic adjustment system, first temperature measuring device and second temperature measuring device are respectively detachably installed at both ends of optical fiber.

[0011] In the above distributed optical fiber temperature measurement parameter automatic adjustment system, the first circuit includes first power module, first MCU module, first communication module and heating module, the first power module is connected to the first MCU module, the first communication module, heating module and first temperature measuring module are all connected to the first MCU module;

[0012] The second circuit includes second power module, second MCU module and second communication module, the second power module is connected to the second MCU module, the second communication module and second temperature measuring module are all connected to the second MCU module;

[0013] The first temperature measuring device and second temperature measuring device send the measured temperature value to optical fiber temperature measurement system through first communication module and second communication module respectively.

[0014] In the above-mentioned distributed optical fiber temperature measurement parameter automatic adjustment system, the first temperature measurement device / second temperature measurement device comprises a temperature measurement shell with an inner cavity, a mounting structure and a circuit accommodating cavity, the first circuit / second circuit is located in the circuit accommodating cavity, and the mounting structure is used for mounting the first temperature measurement device / second temperature measurement device to the optical fiber. The inner cavity of the first temperature measurement device / second temperature measurement device mounted on the optical fiber constitutes the first temperature measurement cavity / second temperature measurement cavity.

[0015] The first temperature measurement module / second temperature measurement module is located in the corresponding inner cavity.

[0016] In the above-mentioned distributed optical fiber temperature measurement parameter automatic adjustment system, the first temperature measurement module / second temperature measurement module each comprises two temperature sensors, and the two temperature sensors of the first temperature measurement module / second temperature measurement module are oppositely arranged in the temperature measurement shell along the radial direction of the optical fiber.

[0017] In the above-mentioned distributed optical fiber temperature measurement parameter automatic adjustment system, the circuit accommodating cavity is located on the outer wall of the temperature measurement shell.

[0018] The heating module is located on the inner wall of the inner cavity of the first temperature measurement device.

[0019] The temperature measurement shell comprises an upper shell and a lower shell which are hingedly connected, and the inner cavity is formed by relatively closing the upper shell and the lower shell.

[0020] The two ends of the temperature measurement shell constitute a wire passing round hole for clamping the optical fiber when the upper shell and the lower shell are relatively closed.

[0021] The upper shell and the lower shell each have a heat insulation cavity, and the wires of the heating module, the first temperature measurement module and the second temperature measurement module connected to the first MCU module each extend from the corresponding heat insulation cavity to the circuit accommodating cavity.

[0022] In the above-mentioned distributed optical fiber temperature measurement parameter automatic adjustment system, the circuit accommodating cavity has a plurality of circuit board mounting holes and conductive columns, and the conductive columns are connected to the corresponding heating module / first temperature measurement module / second temperature measurement module through wires.

[0023] In the above-mentioned distributed optical fiber temperature measurement parameter automatic adjustment system, sealing silica gel is applied to the contact surface of the upper shell and the lower shell when the upper shell and the lower shell are relatively closed.

[0024] The first magnetic attraction structure is located at the occlusion part of the upper shell and the lower shell in the heat insulation cavity of the upper shell, and the second magnetic attraction structure which can be attracted to the first magnetic attraction structure is located at the occlusion part in the heat insulation cavity of the lower shell.

[0025] The mounting structure is formed by the wire passing round hole, the first magnetic attraction structure and the second magnetic attraction structure.

[0026] The two temperature sensors of the first temperature measuring module / second temperature measuring module are respectively installed on the inner walls of the upper shell and the lower shell, and the upper shell has a conductive contact column / conductive groove at the occlusal part, and the lower shell has a conductive groove / conductive contact column at the occlusal part, which is matched with the conductive contact column, the circuit accommodating cavity is located at the upper shell, and the conductive contact column / conductive groove is connected to the first MCU module / second MCU module through the wire in the heat insulation cavity, and the conductive groove / conductive contact column is connected to the temperature sensor located in the lower shell through the wire in the heat insulation cavity.

[0027] A distributed optical fiber temperature measurement parameter automatic adjustment method based on the above-mentioned distributed optical fiber temperature measurement parameter automatic adjustment system, comprising the following steps:

[0028] S1. Obtain at least two sensor temperature values;

[0029] S2. Adjust the parameters of the temperature measurement formula according to the sensor temperature value and the light intensity ratio of the temperature measurement position.

[0030] In the above-mentioned distributed optical fiber temperature measurement parameter automatic adjustment method, step S1 specifically comprises:

[0031] The first MCU module applies power to the heating module according to the instruction to heat the first heat preservation cavity to be within a set temperature range, and when it is determined according to the two temperature sensors in the first heat preservation cavity that the temperature in the first heat preservation cavity is in a stable state, the average value of the two temperature sensors is taken as the sensor temperature value of the first temperature measuring module;

[0032] Meanwhile, the second module applies power according to the instruction, and when it is determined according to the two temperature sensors in the second heat preservation cavity that the temperature in the second heat preservation cavity is in a stable state, the average value of the two temperature sensors is taken as the sensor temperature value of the second temperature measuring module.

[0033] The advantages of the present application are:

[0034] 1. The system can automatically adjust parameters at any time, improve the temperature monitoring accuracy of the distributed optical fiber temperature measurement system, and does not need human intervention;

[0035] 2. Two temperature measuring devices with heat preservation cavities are provided, which can be directly sleeved on the optical fiber during use, and are very convenient to use, without the need for winding or the participation of a constant temperature tank;

[0036] 3. Two temperature sensors are configured in each heat preservation cavity, which can not only obtain the required detection temperature value of the position, but also ensure that the heat preservation cavity has a stable temperature during parameter adjustment, thereby ensuring the accuracy of parameter adjustment;

[0037] 4. The two temperature measuring devices are installed on the optical fiber by suction, which makes replacement and disassembly very convenient. Moreover, the circuit parts in the upper shell and the circuit parts in the lower shell are electrically connected by conductive contact posts and conductive grooves, which can avoid the confusion of the circuit and prevent the circuit from affecting the opening and closing action between the hinged upper and lower shells. At the same time, it can automatically connect the circuits on both sides after installation. It has the advantages of ingenious design and convenient operation. Attached Figure Description

[0038] Figure 1 This is a system structure block diagram of the distributed optical fiber temperature measurement parameter automatic adjustment system of the present invention;

[0039] Figure 2 This is a schematic diagram showing the installation of the two temperature measuring devices of the present invention on the optical fiber;

[0040] Figure 3 This is a side view of the temperature measuring device of the present invention when the upper and lower outer shells are closed;

[0041] Figure 4 This is a side view of the temperature measuring device of the present invention when the upper and lower outer shells are opened;

[0042] Figure 5 This is a schematic diagram of the internal structure of the circuit housing cavity of the temperature measuring device of the present invention, near the upper outer shell.

[0043] Figure 6 for Figure 4 Enlarged view of the central occlusal region A;

[0044] Figure 7 for Figure 3 Enlarged view of the middle occlusal region A.

[0045] Figure Descriptions: First temperature measuring device 1; First circuit 11; First insulation cavity 12; First temperature measuring module 13; First power module 14; First MCU module 15; First communication module 16; Heating module 17; Second temperature measuring device 2; Second circuit 21; Second insulation cavity 22; Second temperature measuring module 23; Second power module 24; Second MCU module 25; Second communication module 26; Fiber optic temperature measuring system 3; Fiber optic cable 4; Temperature measuring housing 5; Inner cavity 51; Mounting structure 52; Upper housing 53; Lower housing 54; Wire through hole 55; Heat insulation cavity 56; First magnetic attraction structure 57; Second magnetic attraction structure 58; Circuit accommodating cavity 59; Circuit board mounting hole 591; Conductive post 592; Temperature sensor 6; Conductive contact post 71; Conductive groove 72; Sealing silicone 8. Detailed Implementation

[0046] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0047] likeFigure 1 Good Figure 2 As shown in the figure, the embodiment provides a distributed optical fiber temperature measurement parameter automatic adjustment system, which comprises a first temperature measurement device 1 and a second temperature measurement device 2 connected to an optical fiber temperature measurement system 3. The first temperature measurement device 1 and the second temperature measurement device 2 are respectively installed at different positions of an optical fiber 4. The first temperature measurement device 1 comprises a first circuit 11, a first temperature measurement cavity 12, and a first temperature measurement module 13 located in the first temperature measurement cavity 12 and connected to the first circuit 11. The second temperature measurement device 2 comprises a second circuit 21, a second temperature measurement cavity 22, and a second temperature measurement module 23 located in the second temperature measurement cavity 22 and connected to the second circuit 21. The first circuit 11 is used for communication connection of the optical fiber temperature measurement system 3, and sends the measurement value obtained by the first temperature measurement module 13 to the optical fiber temperature measurement system 3, while providing power supply for the first temperature measurement module 13. The second circuit 21 is used for communication connection of the optical fiber temperature measurement system 3, and sends the measurement value obtained by the second temperature measurement module 23 to the optical fiber temperature measurement system 3, while providing power supply for the second temperature measurement module 23. The optical fiber temperature measurement system 3 adjusts the parameters of the temperature measurement formula according to the light intensity ratio of the sensor temperature measurement value and the temperature measurement position. Preferably, the first temperature measurement device 1 and the second temperature measurement device 2 are respectively detachably installed at the two ends of the optical fiber 4. The two temperature measurement devices simultaneously provide the functions of temperature measurement cavity and temperature measurement. In use, the two temperature measurement devices are directly installed at the corresponding positions of the optical fiber, and then the two temperature measurement devices are communication connected to the optical fiber temperature measurement system 3, so that on-site automatic parameter adjustment can be realized, and the optical fiber temperature measurement system 3 can have high temperature measurement accuracy.

[0048] Specifically, the first circuit 11 comprises a first power supply module 14, a first MCU module 15, a first communication module 16, and a heating module 17. The first power supply module 14 is connected to the first MCU module 15. The first communication module 16, the heating module 17, and the first temperature measurement module 13 are all connected to the first MCU module 15.

[0049] The second circuit 21 comprises a second power supply module 24, a second MCU module 25, and a second communication module 26. The second power supply module 24 is connected to the second MCU module 25. The second communication module 26 and the second temperature measurement module 23 are both connected to the second MCU module 25.

[0050] The first temperature measurement device 1 and the second temperature measurement device 2 respectively send the measured temperature value to the optical fiber temperature measurement system 3 through the first communication module 16 and the second communication module 26. The communication module can adopt a wireless mode, a wired mode, or a combination of the two modes for user selection. When the wired mode is adopted, the circuit accommodating cavity has a communication line slot connected to the communication module. When it is necessary to use or disassemble, the communication line can be plugged in or pulled out. Since in most cases, the two ends of the optical fiber are connected to the optical fiber temperature measurement system 3, and the two temperature measurement devices are installed at the two ends of the optical fiber in the embodiment, the wired mode is preferably adopted.

[0051] Both the first power module 14 and the second power module 24 include a power circuit that converts the power supply voltage to the required voltage. A battery can be used as the power source, and the power circuit is connected to the battery to power the temperature measuring device. If a wired communication method is available, power can be obtained from the fiber optic temperature measuring system 3 via a communication line, and the power circuit is connected to the communication line slot.

[0052] Furthermore, the circuit receiving cavity 59 may have a circuit switch, which operates when the circuit switch is turned on and does not operate when the circuit switch is turned off.

[0053] like Figures 2-4 As shown, the first temperature measuring device 1 / second temperature measuring device 2 includes a temperature measuring shell 5 having an inner cavity 51, a mounting structure 52 and a circuit receiving cavity 59. The first circuit 11 / second circuit 21 is located in the circuit receiving cavity 59. The mounting structure 52 is used to mount the first temperature measuring device 1 / second temperature measuring device 2 onto the optical fiber 4. The inner cavity 51 of the first temperature measuring device 1 / second temperature measuring device 2 mounted on the optical fiber 4 constitutes the first heat preservation cavity 12 / second heat preservation cavity 22.

[0054] Specifically, both the first temperature measuring module 13 and the second temperature measuring module 23 include two temperature sensors 6. The two temperature sensors 6 of the first temperature measuring module 13 and the second temperature measuring module 23 are arranged opposite each other within the temperature measuring housing 5 along the radial direction of the optical fiber 4. In this embodiment, the two temperature sensors are absolutely opposite each other, that is, the connecting line of the two temperature sensors is parallel to the radial line of the optical fiber. However, in actual use, it is not necessary for the two temperature sensors to be absolutely opposite each other; staggered arrangement of the two temperature sensors should also be within the protection scope of this solution. When the difference in the detected values ​​of the two temperature sensors 6 in the first temperature measuring module 13 and the second temperature measuring module 23 is within a preset range for a continuous period of time, and the temperature fluctuation is always within a certain range, the average value of the two temperature sensors 6 is taken as the sensor temperature value of the corresponding temperature measuring module. That is, each temperature measuring device has two temperature sensors 6, and the two temperature sensors are a certain distance apart from each other. The temperature values ​​of the two temperature sensors are used to determine whether the temperature inside the insulation cavity is stable, ensuring that the temperature of the insulation cavity is stable when the temperature value is obtained.

[0055] The temperature measuring shell 5 comprises an upper shell 53 and a lower shell 54 which are hingedly connected to each other, and an inner cavity 51 is formed by relatively closing the upper shell 53 and the lower shell 54. The heating module 17 adopts an electric heating wire which is coiled on the inner wall of the upper shell 53 or the lower shell 54, and the former is taken as an example in the embodiment. Two temperature sensors are installed on the inner wall of the upper shell 53 and the lower shell 54 respectively. The temperature sensor close to the electric heating wire can be provided with a raised platform on the inner wall of the corresponding shell. In the embodiment, the electric heating wire is installed on the inner wall of the upper shell 53, so a raised platform is fixed on the inner wall of the upper shell 53, and the height of the raised platform is selected according to the height of the temperature sensor installed on the top of the raised platform so that the temperature sensor can be close to the optical fiber. The other temperature sensor is directly installed on the inner wall of the corresponding shell.

[0056] Preferably, the upper shell 53 and the lower shell 54 are respectively provided with a heat insulation cavity 56, and the wires of the heating module 17, the first temperature measuring module 13 and the second temperature measuring module 23 connected to the first MCU module 15 are extended from the corresponding heat insulation cavity 56 to the circuit accommodating cavity 59.

[0057] As shown in Figure 5 , the circuit accommodating cavity 59 is provided with a plurality of circuit board mounting holes 591 and conductive columns 592, and the conductive columns 592 are connected to the corresponding heating module 17 / first temperature measuring module 13 / second temperature measuring module 23 through the wires in the heat insulation cavity 56. The circuit board mounting holes 591 are used for mounting the circuit board with the first circuit 11 / second circuit 21. After the circuit board is installed, the user can connect the conductive columns 592 and the circuit board through the wires to connect the circuit with the circuit part inside the temperature measuring shell 5. Of course, the circuit board can be directly installed in the plug-in slot matched with the conductive column 592, and the connection can be completed by directly inserting the conductive column 592 into the plug-in slot when the circuit board is installed.

[0058] As shown in Figure 6 and Figure 7 , the heat insulation cavity 56 of the upper shell 53 is provided with a first magnetic attraction structure 57 at the engaging portion A of the upper shell 53 and the lower shell 54, and the heat insulation cavity 56 of the lower shell 54 is provided with a second magnetic attraction structure 58 at the engaging portion A which can be attracted to the first magnetic attraction structure 57.

[0059] The upper shell 53 is provided with a conductive contact column 71 / conductive slot 72 at the engaging portion A, and the lower shell 54 is provided with a conductive slot 72 / conductive contact column 71 matched with the conductive contact column 71 / conductive slot 72 at the engaging portion A, and the circuit accommodating cavity 59 is located on the outer wall of the upper shell 53. The conductive contact column 71 / conductive slot 72 is connected to the first MCU module 15 / second MCU module 25 through the wires in the heat insulation cavity 56, and the conductive slot 72 / conductive contact column 71 is connected to the temperature sensor 6 located on the lower shell 54 through the wires in the heat insulation cavity 56.

[0060] The upper shell 53 and the lower shell 54 are provided with sealing silica gel 8 at the contact surface when the upper shell 53 and the lower shell 54 are relatively closed, so that the heat preservation performance of the temperature measuring device installed on the optical fiber can be improved.

[0061] The two ends of the temperature measuring shell 5 form a through hole 55 for clamping the optical fiber 4 when the upper shell 53 and the lower shell 54 are relatively closed. The mounting structure 52 is formed by the through hole 55, the first magnetic attraction structure 57 and the second magnetic attraction structure 58.

[0062] The use method of the present application when put into use is as follows:

[0063] Two temperature measuring devices are installed at different positions of the optical fiber, preferably at both ends of the optical fiber. Before installation, the temperature measuring positions are selected to obtain the light intensity ratio of the temperature measuring positions, and the temperature measuring devices are installed on the optical fiber in a manner that the two temperature sensors correspond to the temperature measuring positions;

[0064] The first MCU module 15 adjusts the heating time, current intensity and the like according to the feedback temperature of the temperature measuring values of the two temperature sensors, so that the first heat preservation cavity 12 is in a set temperature range, and when it is judged according to the two temperature sensors 6 in the first heat preservation cavity 12 that the temperature in the heat preservation cavity 12 is in a stable state, the average value of the two temperature sensors 6 is taken as the sensor temperature measuring value of the first temperature measuring module 13;

[0065] Meanwhile, the second module takes the average value of the two temperature sensors 6 as the sensor temperature measuring value of the second temperature measuring module 23 according to the instruction when it is judged that the temperature in the second heat preservation cavity 22 is in a stable state according to the two temperature sensors 6 in the second heat preservation cavity 22.

[0066] The parameters of the temperature measuring formula are adjusted according to the temperature measuring values of the two sensors and the light intensity ratio of the two temperature measuring positions, that is, the two The adjusted k and b are obtained by solving the equation set,

[0067] It should be noted that the instruction is a timing instruction or an instant instruction sent by the optical fiber temperature measuring system 3.

[0068] The following conditions are in a stable state: the temperature fluctuation of the two temperature sensors is always within the fluctuation range, and the difference between the temperature measuring values of the two temperature sensors 6 in the heat preservation cavity is within the preset range in the length of the continuous time period. The fluctuation range, the length of the continuous time period and the preset range are determined by those skilled in the art, and in this embodiment, the fluctuation range is 0.5 degrees Celsius, the length of the continuous time period is 5 minutes, and the preset range is 1 degree Celsius.

[0069] If the heat preservation cavity 22 cannot be in a stable state for a long time, such as still cannot be in a stable state after starting the automatic adjustment for half an hour, the corresponding temperature measuring device sends information to the optical fiber temperature measuring system 3, and the optical fiber temperature measuring system 3 sends an alarm to the staff. The staff can go to the site to check whether there is a fault. Moreover, since the temperature measuring device of the present scheme is directly hinged and fastened by magnetic attraction, it is very convenient to disassemble, overhaul and replace.

[0070] The specific embodiments described herein are merely illustrative of the spirit of the present application. The temperature measuring device in the embodiments has a cylindrical structure, and in actual use, other structures such as a rectangular columnar structure can also be used. Only one of the two temperature measuring devices in the embodiments has a heating module, but in actual use, both temperature measuring devices can also use a heating module. The use of two temperature measuring devices with a heating module should be within the protection scope of the present scheme. In use, the two heating modules can heat the two heat preservation cavities to different temperatures. Those skilled in the art to which the present application belongs can make various modifications or supplements to the described specific embodiments or use similar ways to replace them, but will not deviate from the spirit of the present application or exceed the scope defined by the appended claims.

[0071] Although the terms first temperature measuring device 1; first circuit 11; first heat preservation cavity 12; first temperature measuring module 13; first power module 14; first MCU module 15; first communication module 16; heating module 17; second temperature measuring device 2; second circuit 21; second heat preservation cavity 22; second temperature measuring module 23; second power module 24; second MCU module 25; second communication module 26; optical fiber temperature measuring system 3; optical fiber 4; temperature measuring shell 5; inner cavity 51; mounting structure 52; upper shell 53; lower shell 54; wire passing round hole 55; heat insulation cavity 56; first magnetic attraction structure 57; second magnetic attraction structure 58; circuit accommodating cavity 59; temperature sensor 6; conductive contact column 71; conductive groove 72; sealing silica gel 8 are used more frequently in the present text, but the possibility of using other terms is not excluded. The use of these terms is only to facilitate the description and explanation of the essence of the present application; any kind of additional limitation is contrary to the spirit of the present application.

Claims

1. A distributed fiber-optic temperature parameter automatic adjustment system, characterized in that, The application relates to a fiber-optic temperature measuring system (3) comprising a first temperature measuring device (1) and a second temperature measuring device (2) connected to the fiber-optic temperature measuring system (3), the first temperature measuring device (1) and the second temperature measuring device (2) are respectively detachably installed at different positions of an optical fiber (4), the first temperature measuring device (1) comprises a first circuit (11), a first temperature measuring cavity (12) and a first temperature measuring module (13) connected to the first circuit (11) and composed of two temperature sensors (6) oppositely arranged along the radial direction of the optical fiber, the second temperature measuring device (2) comprises a second circuit (21), a second temperature measuring cavity (22) and a second temperature measuring module (23) connected to the second circuit (21) and composed of two temperature sensors (6) oppositely arranged along the radial direction of the optical fiber, the first circuit (11) and the second circuit (21) are both communicatively connected to the fiber-optic temperature measuring system (3); the first circuit (11) comprises a first MCU module (15) and a heating module (17), the first MCU module (15) heats the first temperature measuring cavity (12) through the heating module (17); The first temperature measuring device (1) and the second temperature measuring device (2) both comprise a temperature measuring shell (5) provided with an inner cavity (51), a mounting structure (52) and a circuit accommodating cavity (59); The temperature measuring shell (5) comprises an upper shell (53) and a lower shell (54) hingedly connected to each other, and the inner cavity (51) is formed by relatively closing the upper shell (53) and the lower shell (54); Two ends of the temperature measuring shell (5) form a wire passing circular hole (55) for clamping the optical fiber (4) when the upper shell (53) and the lower shell (54) are relatively closed; The upper shell (53) and the lower shell (54) are respectively provided with a heat insulation cavity (56); The first magnetic attraction structure (57) is arranged in the heat insulation cavity (56) of the upper shell (53) and located at a clamping portion (A) of the upper shell (53) and the lower shell (54), and the second magnetic attraction structure (58) is arranged in the heat insulation cavity (56) of the lower shell (54) and located at the clamping portion (A) and capable of being attracted to the first magnetic attraction structure (57); The mounting structure (52) is formed by the wire passing circular hole (55), the first magnetic attraction structure (57) and the second magnetic attraction structure (58); The two temperature sensors (6) of the first temperature measuring module (13) and the second temperature measuring module (23) are respectively arranged on the inner walls of the upper shell (53) and the lower shell (54), the upper shell (53) is provided with a conductive contact column (71) at the clamping portion (A), the lower shell (54) is provided with a conductive groove (72) at the clamping portion (A) and matched with the conductive contact column (71), and the conductive contact column (71) and the conductive groove (72) are connected to the first MCU module (15) and the second MCU module (25) through wires in the heat insulation cavity (56).

2. The distributed optical fiber temperature measurement parameter automatic adjustment system according to claim 1, wherein, The first circuit (11) comprises a first power module (14), a first communication module (16), the first power module (14) is connected to the first MCU module (15), the first communication module (16), a heating module (17) and a first temperature measuring module (13) are all connected to the first MCU module (15); The second circuit (21) comprises a second power module (24), a second MCU module (25) and a second communication module (26), the second power module (24) is connected to the second MCU module (25), the second communication module (26) and a second temperature measuring module (23) are all connected to the second MCU module (25); The first temperature measuring device (1) and the second temperature measuring device (2) respectively send the measured temperature values to the optical fiber temperature measuring system (3) through the first communication module (16) and the second communication module (26).

3. The distributed fiber temperature parameter automatic adjustment system of claim 2, wherein, The first circuit (11) and the second circuit (21) are both located in the circuit accommodating cavity (59), the mounting structure (52) is used for mounting the first temperature measuring device (1) and the second temperature measuring device (2) to the optical fiber (4) respectively, and the inner cavities (51) of the first temperature measuring device (1) and the second temperature measuring device (2) mounted on the optical fiber (4) respectively constitute the first temperature maintaining cavity (12) and the second temperature maintaining cavity (22); The first temperature measuring module (13) and the second temperature measuring module (23) are respectively located in the corresponding inner cavities (51).

4. The distributed optical fiber temperature measurement parameter automatic adjustment system according to claim 3, characterized in that, The circuit accommodating cavity (59) is located on the outer wall of the temperature measuring shell (5); The heating module (17) is located on the inner wall of the inner cavity (51) of the first temperature measuring device (1).

5. The distributed fiber temperature parameter automatic adjustment system of claim 4, wherein, The upper shell (53) and the lower shell (54) are provided with sealing silica gel on the contact surface when the upper shell (53) and the lower shell (54) are relatively closed.

6. A distributed optical fiber temperature parameter automatic adjustment method based on the distributed optical fiber temperature parameter automatic adjustment system of any one of claims 1-5, characterized in that, The method comprises the following steps: S1. obtaining at least two sensor temperature values; S2. adjusting the parameters of the temperature measuring formula according to the light intensity ratio of the sensor temperature value and the temperature measuring position.

7. The method of claim 6, wherein, The step S1 specifically comprises: The first MCU module (15) supplies power to the heating module (17) according to the instruction to heat, so that the first temperature maintaining cavity (12) is in a set temperature range, and when it is judged that the temperature in the first temperature maintaining cavity (12) is in a stable state according to the two temperature sensors (6) in the first temperature maintaining cavity (12), the average value of the two temperature sensors (6) is taken as the sensor temperature value of the first temperature measuring module (13); At the same time, the second MCU module (25) supplies power according to the instruction, and when it is judged that the temperature in the second temperature maintaining cavity (22) is in a stable state according to the two temperature sensors (6) in the second temperature maintaining cavity (22), the average value of the two temperature sensors (6) is taken as the sensor temperature value of the second temperature measuring module (23).

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