Contact area structure

Abstract

A contact area structure is provided, comprising: an organic substrate, an inorganic conductive layer, an organic adhesive layer and a transparent conductive layer. The organic substrate comprises at least one overlapping area, and the overlapping area comprises a first block and a second block adjacent to the first block. The inorganic conductive layer is arranged on the organic substrate, wherein the inorganic conductive layer is partially arranged in the first block, and the second block exposes the upper surface of the organic substrate. The organic adhesive layer covers the inorganic conductive layer and the upper surface of the organic substrate. The transparent conductive layer is arranged on the organic adhesive layer to enhance the adhesion of the transparent conductive layer to the inorganic conductive layer.

Description

Technical Field

[0001] The present disclosure relates to a contact region structure, and more particularly to a structure of organic and inorganic conductors in the contact region. Background Art

[0002] In the prior art, in the contact area where the touch electrode and the transmission line meet, the transmission line material is mostly a solid metal layer, and the touch electrode is adhered to the transmission line using an organic material. Therefore, the larger the contact area, the smaller the contact resistance. However, organic materials cannot form bonds with inorganic materials such as metals, resulting in poor adhesion and thus causing the touch electrode to fall off. In view of this, the prior art needs to be improved. Summary of the invention

[0003] An embodiment of the present disclosure aims to provide a contact region structure, which significantly enhances the adhesion of the transparent conductive layer to the inorganic conductive layer, thereby preventing the photoresist from falling off during stripping.

[0004] One embodiment of the present disclosure provides a contact area structure, comprising: an organic substrate, an inorganic conductive layer, an organic adhesive layer, and a transparent conductive layer. The organic substrate comprises at least one contact pad area, and the contact pad area comprises a first block and a second block adjacent to the first block. The inorganic conductive layer is disposed on the organic substrate, wherein the inorganic conductive layer is partially disposed on the first block, and the second block exposes the upper surface of the organic substrate. The organic adhesive layer covers the upper surface of the inorganic conductive layer and the organic substrate. The transparent conductive layer is disposed on the organic adhesive layer.

[0005] In some embodiments, the inorganic conductive layer is a metal layer.

[0006] In some embodiments, the metal layer is a copper layer.

[0007] In some embodiments, the inorganic conductive layer has a linear structure in a plan view.

[0008] In some embodiments, the width of the linear structures is 10 microns to 50 microns.

[0009] In some embodiments, the thickness of the inorganic conductive layer is from 0.1 micrometer to 1 micrometer.

[0010] In some embodiments, the inorganic conductive layers are arranged in intervals in a cross-sectional view of the overlapping region.

[0011] In some embodiments, the inorganic conductive layer has a mesh, dendrite, honeycomb, or grid structure.

[0012] In some embodiments, the inorganic conductive layer has an area of ​​10,000 square microns to 1,000,000 square microns.

[0013] In some embodiments, the organic substrate further comprises a plurality of overlapping regions, and the plurality of overlapping regions are electrically connected via the inorganic conductive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The various aspects of the present disclosure will be most easily understood when the following detailed description is read in conjunction with the accompanying drawings. It should be noted that various features may not be drawn to scale in accordance with industry standard operating procedures. In fact, the size of various features may be arbitrarily increased or decreased for clarity of discussion.

[0015] Figure 1 A schematic diagram showing the contact region structure of the first embodiment of the present disclosure is shown;

[0016] Figure 2 Draw Figure 1 A partial cross-sectional view of

[0017] Figure 3 A schematic diagram illustrating a contact region structure according to a second embodiment of the present disclosure is shown;

[0018] Figure 4 A schematic diagram illustrating a contact region structure according to a third embodiment of the present disclosure;

[0019] Figure 5 Draw Figure 4 A partial cross-sectional view of

[0020] Figure 6 A schematic diagram illustrating a contact region structure according to a fourth embodiment of the present disclosure is shown.

[0021]

Explanation of symbols

[0022] 10: Contact area structure

[0023] 100: Organic substrate

[0024] 110: Overlap area

[0025] 111: First block

[0026] 112: Second block

[0027] 200: Inorganic conductive layer

[0028] 300: Organic adhesive layer

[0029] 400: Transparent conductive layer DETAILED DESCRIPTION

[0030] In order to make the description of the present disclosure more detailed and complete, the following is an illustrative description of the implementation and specific embodiments of the present disclosure, but this is not the only form of implementing or using the specific embodiments of the present disclosure. The various embodiments disclosed below can be combined or replaced with each other in a beneficial situation, and other embodiments can be added to one embodiment without further recording or explanation. In the following description, many specific details will be described in detail so that the reader can fully understand the following embodiments. However, the embodiments of the present disclosure can also be practiced without these specific details.

[0031] In addition, spatially relative terms, such as "lower", "upper", etc., are used to conveniently describe the relative relationship of an element or feature to other elements or features in the drawings. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the drawings. The device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0032] In this document, unless the context specifically limits the article, "a", "an" and "the" may refer to one or more. It will be further understood that "comprising", "including", "having" and similar words used in this document specify the features, regions, integers, steps, operations, elements and / or components recorded therein, but do not exclude other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

[0033] Several embodiments and experimental examples are listed below to further illustrate the contact area structure of the present disclosure. However, they are only for illustrative purposes and are not intended to limit the present disclosure. The protection scope of the present disclosure shall be based on the scope defined in the attached claims.

[0034] In some embodiments of the present disclosure, please refer to Figure 1 and Figure 2 The contact region structure 10 includes an organic substrate 100 , an inorganic conductive layer 200 , an organic adhesive layer 300 , and a transparent conductive layer 400 .

[0035] In one embodiment, the contact area structure 10 disclosed herein can be widely used in places where organic materials and inorganic materials overlap and contact, including, but not limited to, the location where nanosilver contacts the metal layer. For example, the contact area structure 10 is the intersection or overlap of the touch electrode and the signal transmission line in the touch panel, so that the signal of the touch electrode can be transmitted to the signal transmission line.

[0036] In one embodiment, the organic substrate 100 refers to a non-conductive material. The substrate may be rigid or flexible. The substrate may be transparent or opaque. Suitable rigid substrates include, for example, polycarbonates, acrylics, and the like. Suitable flexible substrates include, but are not limited to, polyesters (e.g., polyethylene terephthalate (PET), polynaphthalate, and polycarbonate), polyolefins (e.g., linear, branched, and cyclic polyolefins), polyethylenes (e.g., polyvinyl chloride, polyvinylidene chloride, polyvinyl acetal, polystyrene, polyacrylates, and the like), cellulose ester substrates (e.g., cellulose triacetate, cellulose acetate), polysulfones (e.g., polyethersulfone), polyimides, polysiloxanes, and other conventional polymeric films. Other examples of suitable substrates can be found, for example, in U.S. Pat. No. 6,975,067.

[0037] In one embodiment, the organic substrate 100 includes at least one overlapping region 110, and the overlapping region 110 includes a first block 111 and a second block 112 adjacent to the first block 111. In some embodiments, the overlapping region 110 is in the form of a continuous plane or a block.

[0038] In one embodiment, the organic substrate 100 includes a plurality of overlapping regions 110. In some embodiments, the overlapping regions 110 are not connected to each other. In some embodiments, the overlapping regions 110 are electrically connected via the inorganic conductive layer 200.

[0039] In one embodiment, the inorganic conductive layer 200 is disposed on the organic substrate 100, wherein the inorganic conductive layer 200 is partially disposed in the first block 111, and the second block 112 exposes the upper surface of the organic substrate 100. Figure 2 In the partial cross-sectional view, the inorganic conductive layer 200 is covered with an organic adhesive layer 300 on both sides of the organic substrate 100, forming an interval arrangement of organic, inorganic, and organic materials, so that the transparent conductive layer 400 has strong adhesion and is not easy to fall off when the photoresist is stripped. In one embodiment, the inorganic conductive layer 200 is a metal layer. In some embodiments, the material of the metal layer includes, but is not limited to, indium tin oxide, silver, zinc, copper, gold, platinum, tungsten, aluminum, or alloys of the above metals. In some embodiments, the inorganic conductive layer 200 is used as a transmission line. In some embodiments, the inorganic conductive layer 200 is a part of a flexible circuit board.

[0040] In one embodiment, the organic adhesive layer 300 can help adhere the transparent conductive layer 400 to the inorganic conductive layer 200 and the organic substrate 100. The organic adhesive layer 300 includes a suitable binder, such as an optically transparent polymer, including (but not limited to): polyacrylics, such as polymethacrylates (e.g., poly(methyl methacrylate)), polyacrylates, and polyacrylonitrile; polyvinyl alcohol; polyesters (e.g., polyethylene terephthalate (PET), polyethylene naphthalate, and polycarbonate); polymers with a high degree of aromaticity, such as phenol-formaldehyde or cresol-formaldehyde Polystyrene, polyvinyl toluene, polyvinyl xylene, polyimide, polyamide, polyamideimide, polyetherimide, polysulfide, polysulfone, polyphenyl and polyphenyl ether, polyurethane (PU), epoxy resin, polyolefin (such as polypropylene, polymethylpentene and cyclic olefin), acrylonitrile-butadiene-styrene copolymer (ABS), cellulose, polysiloxane and other silicon-containing polymers (such as polysilsesquioxane and polysilane), polyvinyl chloride (PVC), polyacetate, polynorbornene, synthetic rubber (such as EPR, SBR, EPDM) and fluoropolymer (such as polyvinylidene fluoride, polytetrafluoroethylene (TFE) or polyhexafluoropropylene), copolymers of fluorine-olefin and hydrocarbon olefin (such as ) and amorphous fluorocarbon polymers or copolymers (e.g., Asahi Glass or DuPont AF).

[0041] In one embodiment, the transparent conductive layer 400 is prepared by coating a coating composition containing nanostructures. To form the coating composition, the metal nanowires are usually dispersed in a volatile liquid to assist the coating process. It should be understood that, as used herein, any non-corrosive volatile liquid in which the metal nanowires can form a stable dispersion can be used. Preferably, the metal nanowires are dispersed in water, alcohol, ketone, ether, hydrocarbon or aromatic solvent (benzene, toluene, xylene, etc.). More preferably, the liquid is volatile and has a boiling point of no more than 200°C, no more than 150°C or no more than 100°C.

[0042] In addition, the metal nanowire dispersion may contain additives and binders to control viscosity, corrosion, adhesion, and nanowire dispersion. Examples of suitable additives and binders include, but are not limited to, carboxymethyl cellulose (CMC), 2-hydroxyethyl cellulose (HEC), hydroxypropyl methyl cellulose (HPMC), methyl cellulose (MC), polyvinyl alcohol (PVA), tripropylene glycol (TPG), and xanthan gum (XG); and surfactants such as ethoxylates, alkoxylates, ethylene oxide and propylene oxide and copolymers thereof, sulfonates, sulfates, disulfonates, sulfosuccinates, phosphates, and fluorinated surfactants (e.g., DuPont's ).

[0043] In some embodiments, the nanowire dispersion or "ink" comprises 0.0025% to 0.1% by weight of a surfactant (e.g., FSO-100 preferably ranges from 0.0025% to 0.05%), 0.02% to 4% viscosity modifier (e.g., HPMC preferably ranges from 0.02% to 0.5%), 94.5% to 99.0% solvent, and 0.05% to 1.4% metal nanowires. Representative examples of suitable surfactants include FSN, FSO, FSH, Triton (x100, x114, x45), Dynol (604, 607), n-dodecyl bD-maltoside and Novek. Examples of suitable viscosity modifiers include hydroxypropyl methylcellulose (HPMC), methylcellulose, xanthan gum, polyvinyl alcohol, carboxymethyl cellulose and hydroxyethyl cellulose. Examples of suitable solvents include water and isopropanol.

[0044] The concentration of nanowires in the dispersion can affect or determine parameters of the nanowire network layer, such as thickness, conductivity (including surface conductivity), optical transparency, and mechanical properties. The solvent percentage can be adjusted to provide the desired concentration of nanowires in the dispersion. However, in preferred embodiments, the relative ratios of the other components can remain unchanged. Specifically, the ratio of surfactant to viscosity modifier is preferably in the range of about 80 to about 0.01; the ratio of viscosity modifier to metal nanowire is preferably in the range of about 5 to about 0.000625; and the ratio of metal nanowire to surfactant is preferably in the range of about 560 to about 5. The ratio of each component in the dispersion can vary depending on the substrate used and the application method. The preferred viscosity range for the nanowire dispersion is between about 1 cP and 100 cP.

[0045] After coating, the volatile liquid is removed by evaporation. Evaporation can be accelerated by heating (e.g., baking). The resulting nanowire network layer may require post-treatment to make it conductive. As described below, this post-treatment may involve process steps such as exposure to heat, plasma, corona discharge, UV-ozone, or pressure.

[0046] In one embodiment, the optical transparency or clarity of the transparent conductive layer 400 (i.e., the conductive network on the non-conductive substrate) can be quantitatively defined by parameters including light transmittance and turbidity. "Light transmittance" (or "light transmittance") refers to the percentage of incident light transmitted through a medium. In many embodiments, the transmittance of the conductive layer is at least 80% and can be as high as 98%. Performance enhancement layers such as adhesive layers, anti-reflective layers, or anti-glare layers can further help reduce the overall transmittance of the transparent conductor. In many embodiments, the transmittance (T%) of the transparent conductor can be at least 50%, at least 60%, at least 70%, or at least 80%, and can be as high as at least 91% to 92% or at least 95%.

[0047] The organic substrate 100 , the inorganic conductive layer 200 , the organic adhesion layer 300 , and the transparent conductive layer 400 are described in more detail in the following non-limiting examples.

[0048] Example 1

[0049] Figure 1 is a schematic diagram of a contact region structure according to a first embodiment of the present disclosure, Figure 2 for Figure 1 The contact region structure 10 of one embodiment of the present disclosure includes an organic substrate 100 , an inorganic conductive layer 200 , an organic adhesive layer 300 , and a transparent conductive layer 400 .

[0050] The organic substrate 100 includes at least one overlapping region 110 . The overlapping region 110 includes a first block 111 and a second block 112 adjacent to the first block 111 .

[0051] The inorganic conductive layer 200 is disposed on the organic substrate 100, wherein the inorganic conductive layer 200 is partially disposed in the first block 111, and the second block 112 exposes the upper surface 101 of the organic substrate 100. The inorganic conductive layer 200 is a metal layer, such as a copper layer. The inorganic conductive layer 200 is a linear structure in a plan view, wherein the width of the linear structure is about 10 microns to 50 microns, such as about 15 microns, about 20 microns, about 25 microns, about 30 microns, about 35 microns, about 40 microns, about 45 microns, or any value between any two of these values. The thickness of the inorganic conductive layer 200 is about 0.1 microns to 1 micron, such as about 0.2 microns, about 0.3 microns, about 0.4 microns, about 0.5 microns, about 0.6 microns, about 0.7 microns, about 0.8 microns, about 0.9 microns, or any value between any two of these values. The area of ​​the inorganic conductive layer 200 is about 10,000 square microns to about 1,000,000 square microns, for example, about 50,000 square microns, about 100,000 square microns, about 200,000 square microns, about 500,000 square microns, about 700,000 square microns, about 900,000 square microns, or any value between any two of these values, which will facilitate the adhesion between the transparent conductive layer 400 and the inorganic conductive layer 200.

[0052] The organic adhesive layer 300 covers the inorganic conductive layer 200 and the upper surface 101 of the organic substrate 100 . In other words, the organic substrate 100 is covered by the inorganic conductive layer 200 and a portion of the organic adhesive layer 300 .

[0053] The transparent conductive layer 400 is disposed on the organic adhesive layer 300. The transparent conductive layer 400 includes nanosilver. The inorganic conductive layer 200 and part of the organic adhesive layer 300 cover the organic substrate 100, so that the transparent conductive layer 400 has strong adhesion and is not easy to fall off when the photoresist is stripped.

[0054] Example 2

[0055] Figure 3 A schematic diagram of the contact region structure of the second embodiment of the present disclosure is shown. The difference between the second embodiment and the first embodiment is that the inorganic conductive layer 200 of the second embodiment is a curved linear structure in the plane. Figure 2 Similarly, both sides of the inorganic conductive layer 200 are covered on the organic substrate 100 by the organic adhesive layer 300, so that the transparent conductive layer 400 has strong adhesion and is not easy to fall off when the photoresist is stripped.

[0056] Example 3

[0057] Figure 4 A schematic diagram showing a contact region structure according to a third embodiment of the present disclosure is shown. Figure 5 Draw Figure 4 The difference between Example 3 and Example 1 is that the inorganic conductive layer 200 is arranged at intervals in the cross-sectional view of the overlap region 110, and the overlap region 110 has a plurality of first blocks 111 and a plurality of second blocks 112. In detail, the inorganic conductive layer 200 presents a grid-like structure, and the hollowed-out parts of the inorganic conductive layer 200 are the second blocks 112, and the upper surface of the organic substrate 100 is exposed. Figure 5 In the partial cross-sectional view, the inorganic conductive layer 200 is covered on both sides by the organic adhesive layer 300 on the organic substrate 100, forming an interval arrangement of organic, inorganic, organic, inorganic, and organic materials, so that the transparent conductive layer 400 has strong adhesion and is not easy to fall off when the photoresist is stripped.

[0058] Example 4

[0059] Figure 6 FIG. 4 is a schematic diagram showing the contact region structure of the fourth embodiment of the present disclosure. The difference between the fourth embodiment and the third embodiment is that the inorganic conductive layer 200 presents a honeycomb structure in the cross-sectional view of the overlapping region 110. Figure 5 Similarly, the inorganic conductive layer 200 has organic adhesive layers 300 on both sides covering the organic substrate 100, forming an alternating arrangement of organic, inorganic, organic, inorganic, and organic materials, so that the transparent conductive layer 400 has strong adhesion and is not easily peeled off when the photoresist is stripped.

[0060] The organic adhesive layer 300 and the organic substrate 100, both made of organic materials, are bonded to each other by chemical bonds, which has a stronger adhesion than the inorganic conductive layer 200 and the organic substrate 100, both made of inorganic materials, are bonded to each other by van der Waals forces. Therefore, in one embodiment of the present disclosure, the adhesion of the transparent conductive layer 400 to the inorganic conductive layer 200 is significantly enhanced to prevent the transparent conductive layer 400 from falling off when the photoresist is stripped.

[0061] One embodiment of the present disclosure is to cut a conventional continuous sheet of nanosilver and metal layer into small pieces of special-shaped contacts in the overlap area. After the metal layer in the overlap area is partially hollowed out, the nanosilver adhesive with good adhesion can be adhered to the organic substrate, while the metal layer with poor adhesion is adhered by the adhesive on both sides. In some embodiments, due to the material properties of nanosilver, the nanosilver and the metal layer in the overlap area will not cause the contact area to resistance to increase in proportion after being hollowed out.

[0062] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be based on the scope defined by the attached claims.

Claims

1. A contact area structure, characterized in that: Include: An organic substrate comprises at least one overlapping region, wherein the overlapping region comprises a first block and a second block adjacent to the first block; an inorganic conductive layer disposed on the organic substrate, wherein the inorganic conductive layer is partially disposed in the first area, the second area exposes an upper surface of the organic substrate, and the area of ​​the inorganic conductive layer is 10,000 square microns to 1,000,000 square microns; an organic adhesion layer covering the inorganic conductive layer and the upper surface of the organic substrate, wherein a lower surface of the organic adhesion layer in contact with the upper surface of the organic substrate comprises chemical bonds; and A transparent conductive layer is disposed on the organic adhesive layer, wherein the transparent conductive layer includes nano silver.

2. The contact area structure according to claim 1, characterized in that: The inorganic conductive layer is a metal layer.

3. The contact area structure according to claim 2, characterized in that: The metal layer is a copper layer.

4. The contact area structure according to claim 1, characterized in that: The inorganic conductive layer is in a linear structure in a plan view.

5. The contact area structure according to claim 4, characterized in that: The width of the linear structure is 10 micrometers to 50 micrometers.

6. The contact area structure according to claim 4, characterized in that: The thickness of the inorganic conductive layer is 0.1 micrometer to 1 micrometer.

7. The contact area structure according to claim 1, characterized in that: The inorganic conductive layers are arranged at intervals in a cross-sectional view of the overlapping region.

8. The contact area structure according to claim 7, characterized in that: The inorganic conductive layer is in a mesh, tree-branch, honeycomb, or grid structure.

9. The contact area structure according to claim 1, characterized in that: The organic substrate also comprises a plurality of overlapping regions, and the plurality of overlapping regions are electrically connected via the inorganic conductive layer.

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