PCBA product production scheduling method and device, computer equipment and readable storage medium

By calculating the optimal wave combination and wave division, the problem of high SMT downtime waiting costs was solved, achieving the minimum number of SMT downtimes and reducing production costs.

CN114331136BActive Publication Date: 2025-11-04HANGZHOU CODE DOG TECH CO LTD
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Patent Information

Application Number
CN202111640817.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-12-29
Publication Date
2025-11-04
Estimated Expiration
2041-12-29

AI Technical Summary

Technical Problem

In existing technologies, SMT downtime and waiting costs are high, leading to increased production costs.

Method used

By obtaining the number of SMT feed slots and the bill of materials for PCBA products to be produced, the optimal wave combination is calculated, and the waves are divided according to the optimal wave combination to reduce the number of waves and the number of material changes.

Benefits of technology

It effectively reduces the number of SMT downtimes, lowers downtime waiting costs, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to an order processing method and device, computer equipment and a computer readable storage medium. An SMT feeding groove number and a bill of materials table of PCBA products to be arranged for production are acquired; based on the bill of materials table and the SMT feeding groove number, an optimal wave combination of the PCBA products to be arranged for production is calculated; the optimal wave combination is a wave combination with the least number of waves in all wave combinations; the material types of all PCBA products in the same wave are not more than the SMT feeding groove number; and the PCBA products to be arranged for production are divided into waves according to the optimal wave combination. According to the bill of materials table of the PCBA products to be arranged for production and the SMT feeding groove number, the wave combination of the PCBA products with the least number of waves is calculated, so that the PCBA products to be arranged for production are divided into waves, the PCBA products to be arranged for production are produced according to the optimal wave combination, the number of SMT shutdowns is minimized, and the SMT shutdown waiting cost is effectively reduced.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of SMT patch order management and job scheduling, and particularly relates to a PCBA product production scheduling method and device, computer equipment and a computer readable storage medium. BACKGROUND

[0002] SMT (Surface Mounted Technology) patch is a high-efficiency processing method commonly used in the field of circuit board manufacturing, which refers to a series of process flows based on PCB (Printed Circuit Board) processing. Electronic products are all processed by PCB plus various electronic components according to the designed circuit diagram, and various SMT patch processing processes are needed for various products. The feeding position of the SMT patch machine is very limited and valuable, and a SMT patch machine can usually support dozens of tape feeding mechanisms at the same time. There are more than 1 million types of materials used in production, and a factory needs to configure tens of thousands of SMT patch machines to put all the materials on the feeding mechanism of the patch machine. Whether it is site occupation or machine purchase, the cost is relatively high. Therefore, in actual production, materials are stored on shelves at ordinary times, and when the order is produced, the materials needed for the production of the current PCBA (Printed Circuit Board Assembly) product are picked from the shelves and loaded into the feeding mechanism of the SMT patch machine for production. When producing another PCBA product, the materials in the feeding mechanism are replaced with the required types. Stopping to replace the materials will bring a series of production costs, including SMT downtime waiting cost and manual operation cost. The more the SMT downtime, the higher the production cost.

[0003] In the prior art, after the system receives a new PCBA product, the new PCBA product is added to the PCBA products to be arranged for production, and the PCBA products to be arranged for production are combined according to the required completion deadline by default, which has the problem of high SMT downtime waiting cost. In view of the problem of high SMT downtime waiting cost in the related art, no effective solution has been proposed so far. SUMMARY

[0004] Therefore, it is necessary to provide a PCBA product production scheduling method, device, computer equipment and computer readable storage medium to solve the problem of high SMT downtime waiting cost in the related art.

[0005] In a first aspect, embodiments of the present application implement a PCBA product production scheduling method for planning production scheduling of PCBA products to be arranged in SMT patch products. The method comprises the following steps:

[0006] Obtaining the SMT supply slot number and the bill of materials table of the PCBA products to be arranged;

[0007] Based on the bill of materials table of the PCBA products to be arranged and the SMT supply slot number, the optimal wave combination of the PCBA products to be arranged is calculated. The optimal wave combination is the wave combination with the least number of waves in all wave combinations. The material types of all PCBA products in the same wave do not exceed the SMT supply slot number;

[0008] According to the optimal wave combination, the PCBA products to be arranged are divided into waves.

[0009] In some embodiments, the method further comprises:

[0010] Based on the bill of materials table of the PCBA products to be arranged, the material coincidence degree between each wave in the optimal wave combination is calculated;

[0011] According to the material coincidence degree, the optimal processing sequence of all waves in the optimal wave combination is calculated. The optimal processing sequence is the processing sequence with the least material replacement times in the processing sequences of all waves in the optimal wave combination;

[0012] According to the optimal processing sequence, all waves in the optimal wave combination are sorted.

[0013] In some embodiments, when a user submits a new PCBA product, the method further comprises:

[0014] Obtaining the bill of materials table of the PCBA product newly submitted by the current user, and determining whether there is a PCBA product in the PCBA products to be arranged whose material coincidence degree with the PCBA product newly submitted by the current user exceeds a first set threshold;

[0015] If there is, the PCBA product newly submitted by the current user is added to the PCBA products to be arranged.

[0016] In some embodiments, the method further comprises:

[0017] If the material coincidence degree of the PCBA product newly submitted by the current user exceeds the first set threshold, it is determined whether there is a PCBA product in the PCBA products waiting for order combination, the material coincidence degree of which exceeds the second set threshold with the PCBA product newly submitted by the current user;

[0018] If there is, the PCBA product newly submitted by the current user is added to the PCBA products waiting for order combination.

[0019] If there is not, it is determined whether the current user agrees to wait for order combination production.

[0020] If the current user agrees to wait for order combination production, the PCBA product newly submitted by the current user is added to the PCBA products waiting for order combination.

[0021] In some embodiments, the method further comprises:

[0022] When the PCBA product newly submitted by the current user is added to the PCBA products waiting for order combination, it is determined whether there is a PCBA product in the PCBA products waiting for order combination, the material coincidence degree of which exceeds the second set threshold with the PCBA product newly submitted by the current user.

[0023] If there is, the PCBA product, the material coincidence degree of which exceeds the second set threshold with the PCBA product newly submitted by the current user, is added to the PCBA products waiting for order combination.

[0024] In some embodiments, after the determination of whether the current user agrees to wait for order combination production, the method further comprises:

[0025] If the current user agrees to wait for order combination production, the maximum waiting time for the current user to wait for order combination production is obtained.

[0026] The PCBA product in the PCBA products waiting for order combination, the maximum waiting time of which has passed, is added to the PCBA products waiting for order combination.

[0027] In some embodiments, the method further comprises:

[0028] According to the material usage in the historical PCBA products, the popularity of the materials is quantified regularly, the materials with the usage frequency higher than a third set threshold in the current quantification period are marked as popular materials, and the materials with the usage frequency lower than a fourth set threshold in the current quantification period are marked as unpopular materials.

[0029] In some embodiments, the SMT supply slot number and the bill of materials of the PCBA product to be arranged for production are obtained by the following steps:

[0030] The SMT supply slot number except for the SMT supply slot corresponding to the hot material and the bill of materials of the materials used by the PCBA product to be arranged for production except for the hot material are obtained.

[0031] In some embodiments, the intention of the current user to wait for a single production is obtained by the following steps:

[0032] The proportion of the cold material of the PCBA product newly submitted by the current user is obtained.

[0033] If the proportion of the cold material of the PCBA product newly submitted by the current user is lower than the fifth set threshold, the intention of the current user to wait for a single production is obtained.

[0034] In a second aspect, a PCBA product production scheduling device is provided in the embodiment, which is used to plan the production scheduling of the PCBA product to be arranged for production in the SMT patch product. The device comprises an obtaining module, a calculating module and a dividing module:

[0035] The obtaining module is used to obtain the SMT supply slot number and the bill of materials of the PCBA product to be arranged for production.

[0036] The calculating module is used to calculate the optimal wave combination of the PCBA product to be arranged for production based on the bill of materials of the PCBA product to be arranged for production and the SMT supply slot number. The optimal wave combination is the wave combination with the least number of waves in all wave combinations. The material types of all PCBA products in the same wave do not exceed the SMT supply slot number.

[0037] The dividing module is used to divide the PCBA product to be arranged for production according to the optimal wave combination.

[0038] In a third aspect, a computer device is provided in the embodiment, which comprises a memory, a processor and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the method of the first aspect are implemented.

[0039] In a fourth aspect, a computer readable storage medium is provided in the embodiment, which stores a computer program. When the processor executes the computer program, the steps of the method of the first aspect are implemented.

[0040] The PCBA product production scheduling method, device, computer equipment and computer readable storage medium obtain the SMT feeding groove number and a bill of materials table of PCBA products to be arranged for production. Based on the bill of materials table and the SMT feeding groove number, an optimal wave combination of the PCBA products to be arranged for production is calculated. The optimal wave combination is a wave combination with the least number of waves in all wave combinations. The material types of all PCBA products in the same wave are not more than the SMT feeding groove number. The PCBA products to be arranged for production are divided into waves according to the optimal wave combination. According to the bill of materials table of the PCBA products to be arranged for production and the SMT feeding groove number, the wave combination of the PCBA products with the least number of waves is calculated, so that the PCBA products to be arranged for production are divided into waves, the PCBA products to be arranged for production are produced according to the optimal wave combination, the number of SMT shutdowns is minimized, and the SMT shutdown waiting cost is effectively reduced. BRIEF DESCRIPTION OF DRAWINGS

[0041] The accompanying drawings, which are included to provide a further understanding of the present application, constitute a part of this application and illustrate embodiments of the present application and together with the description serve to explain the present application. In the drawings:

[0042] Figure 1 is a flow of a PCBA product production scheduling method provided according to an embodiment of the present application Figure 1 ;

[0043] Figure 2 is a flow of a PCBA product production scheduling method provided according to an embodiment of the present application Figure 2 ;

[0044] Figure 3 is a flow of a PCBA product production scheduling method provided according to an embodiment of the present application Figure 3 ;

[0045] Figure 4 is a structural schematic diagram of a PCBA product production scheduling device provided according to an embodiment of the present application

[0046] Figure 5 is a structural schematic diagram of a computer equipment provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application is described and explained below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application. Based on the embodiments provided by the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0048] It is apparent that the drawings in the following description merely show some examples or embodiments of the present application, and based on these drawings, the present application can be applied to other similar situations without creative efforts by those skilled in the art. In addition, it can be understood that, although the efforts made in the development process can be complex and lengthy, some design, manufacture or production changes based on the technical content disclosed in the present application are only routine technical means for those skilled in the art related to the content disclosed in the present application, and should not be understood as insufficient disclosure of the content disclosed in the present application.

[0049] In the present application, "embodiment" means that the specific features, structures or properties described in combination with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present application can be combined with other embodiments without conflict.

[0050] Unless otherwise defined, technical terms or scientific terms related to the present application should be understood as their usual meanings by those skilled in the art. The terms "one", "a", "an", "the", and the like similar words in the present application do not represent quantity restrictions, but can represent singular or plural. The terms "include", "contain", "have", and any variations thereof in the present application are intended to cover non-exclusive inclusion; for example, a process, method, system, product or device including a series of steps or modules (units) is not limited to the listed steps or units, but can also include steps or units not listed, or can also include other steps or units inherent to the process, method, product or device. The terms "connected", "connected", "coupled" and the like similar words in the present application are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The term "multiple" in the present application means two or more. The association between the associated objects is described by the term "and / or", which means that there can be three relationships, for example, "A and / or B" can mean that A exists alone, A and B exist together, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects. The terms "first", "second", "third" and the like in the present application are only to distinguish similar objects, and do not represent a specific order for the objects.

[0051] The first embodiment of the present application provides a PCBA product production scheduling method for planning the production scheduling of the PCBA product to be arranged in the SMT patch product, such asFigure 1 As shown, the method comprises the following steps:

[0052] In step S110, the number of SMT feeding slots and a bill of materials table of the PCBA product to be arranged for production are acquired.

[0053] Specifically, the number of SMT feeding slots is very limited, and the number of SMT feeding slots determines how many materials can be placed on the SMT chip mounter in one processing wave. The materials required for processing the PCBA product are usually represented by a bill of materials table. As shown in Table 1, a bill of materials table usually contains three columns, wherein the first column describes the model of the required material, the second column describes the position of the required material on the PCB, and the third column describes the physical size and pin layout of the required material. Usually, the first column and the third column jointly determine the type of a material. Each PCBA product saves a bill of materials table, and by acquiring the bill of materials table of the PCBA product to be arranged for production, the type of material required for the PCBA product to be arranged for production can be acquired.

[0054] Table 1

[0055]

[0056] In step S120, based on the bill of materials table of the PCBA product to be arranged for production and the number of SMT feeding slots, the optimal wave combination of the PCBA product to be arranged for production is calculated; the optimal wave combination is the wave combination with the least number of waves among all wave combinations; and the material types of all PCBA products in the same wave do not exceed the number of SMT feeding slots.

[0057] Specifically, since the material types used by the PCBA products to be arranged for production often repeat, when several PCBA products have repeated material types, if the several PCBA products are placed in one processing wave, the required SMT supply slot will be correspondingly reduced. For example, assuming that according to the material list of products A and B, 100 types of materials are required for processing product A, 150 types of materials are required for processing product B, and 50 types of material types are repeated between A and B, if A and B are placed in the same processing wave, A and B only need to occupy 200 SMT supply slots. In addition, the material types of all PCBA products in the same wave cannot exceed the number of SMT supply slots, so when the PCBA products are combined in waves, the number of SMT supply slots also needs to be considered. For example, assuming that according to the material list of products A and B, 150 types of materials are required for processing product A, 150 types of materials are required for processing product B, and 50 types of material types are repeated between A and B, if A and B are placed in the same processing wave, A and B only need to occupy 250 SMT supply slots, but the number of SMT supply slots is only 200, so A and B cannot be placed in the same processing wave.

[0058] Based on the material list of the PCBA products to be arranged for production and the number of SMT supply slots, all wave combinations of the PCBA products to be arranged for production can be obtained, and in all wave combinations, the wave combination with the least number of waves can be calculated, that is, the optimal wave combination of the PCBA products to be arranged for production. For example, assuming that the PCBA products to be arranged for production are A, B, C, D, E, and F, according to the material list of each product, 100 types of materials are required for processing product A, 150 types of materials are required for processing product B, 80 types of materials are required for processing product C, 140 types of materials are required for processing product D, 90 types of materials are required for processing product E, and 130 types of materials are required for processing product F, the number of SMT supply slots is 200, and the number of repeated material types between each PCBA product is as shown in Table 2, and the optimal wave combination calculated is as follows: A and B form one processing wave, C and D form one processing wave, and E and F form one processing wave, and the total number of waves is 3.

[0059] Table 2

[0060] A B C D E F A 100 50 7 8 6 10 B 50 150 20 30 35 40 C 7 20 80 30 8 9 D 8 30 30 140 16 25 E 6 35 8 16 90 20 F 10 40 9 25 20 130

[0061] Step S130, dividing the PCBA products to be arranged for production into waves according to the optimal wave combination.

[0062] Specifically, taking the optimal wave combination calculated above as an example, the PCBA products to be arranged for production are divided into waves according to the optimal wave combination, that is, A and B are divided into one processing wave, C and D are divided into one processing wave, and E and F are divided into one processing wave. In the actual processing process, A and B are processed in one wave, C and D are processed in one wave, and E and F are processed in one wave, realizing the minimum number of waves, thereby realizing the minimum number of SMT downtime, and effectively reducing the SMT downtime waiting cost.

[0063] In the related art, after the system receives a new PCBA product, the new PCBA product is added to the PCBA products to be arranged for production, and the PCBA products to be arranged for production are combined by default according to the required completion deadline, which has the problem of high SMT downtime waiting cost. Through steps S110 to S130, the SMT feeding groove number and the bill of materials of the PCBA products to be arranged for production are obtained, the optimal wave combination of the PCBA products to be arranged for production is calculated based on the bill of materials and the SMT feeding groove number, the optimal wave combination is the wave combination with the minimum number of waves among all wave combinations, the material types of all PCBA products in the same wave do not exceed the SMT feeding groove number, and the PCBA products to be arranged for production are divided into waves according to the optimal wave combination. Through the bill of materials of the PCBA products to be arranged for production and the SMT feeding groove number, the wave combination of the PCBA products with the minimum number of waves is calculated, thereby the PCBA products to be arranged for production are divided into waves, the PCBA products to be arranged for production are produced according to the optimal wave combination, the number of SMT downtime is minimized, and the SMT downtime waiting cost is effectively reduced.

[0064] Referring to Figure 2 In one embodiment, the PCBA product production scheduling device and method provided by the first embodiment of the present application further includes the following steps:

[0065] Step S140, based on the bill of materials of the PCBA products to be arranged for production, the material coincidence degree between each wave in the optimal wave combination is calculated.

[0066] Specifically, the material coincidence degree, i.e., the number of coinciding material types, is the number of coinciding material types required by all PCBA products in each wave. For example, the PCBA products to be arranged for production consist of three waves, X, Y, and Z. Assume that the X wave requires three types of materials, a, b, and c, the Y wave requires four types of materials, a, b, c, and d, and the Z wave requires three types of materials, a, d, and e. Then, the coinciding material types of the X wave and the Y wave are a, b, and c, and the material coincidence degree of the X wave and the Y wave is 3. The coinciding material type of the X wave and the Z wave is a, and the material coincidence degree of the X wave and the Z wave is 1. The coinciding material types of the Y wave and the Z wave are a and d, and the material coincidence degree of the Y wave and the Z wave is 2.

[0067] In step S150, the optimal processing sequence of all waves in the optimal wave combination is calculated according to the material coincidence degree. The optimal processing sequence is the processing sequence with the least number of material changes among the processing sequences of all waves in the optimal wave combination.

[0068] Because of the coincidence of material types between waves, if the processing sequences of waves with coinciding material types are arranged in adjacent positions, after the PCBA products of one wave are processed, the coinciding material types do not need to be removed from the material supply mechanism of the SMT chip mounter, thereby reducing the number of material changes and saving the material change cost. For all waves, the processing sequences of the waves are different, and the total material coincidence degree is different. The higher the total material coincidence degree, the more the number of material changes is reduced, the fewer the number of material changes, and the more the material change cost is saved. Taking the above X, Y, and Z waves as an example, there are six processing sequences of all waves, among which the total material coincidence degree is 6 in the processing sequences of the X wave, the Y wave, the Z wave, or the Z wave, the Y wave, and the X wave, and the total number of material changes is reduced by 6. In the processing sequences of the two waves, the number of material changes is reduced the most, and the processing sequences of the two waves are the processing sequences of the waves with the least number of material changes. Regardless of the number of waves, the processing sequences of the waves with the least number of material changes usually have two kinds, and the two sequences are completely opposite because the total material coincidence degree is the same and the number of material changes is the same in the two completely opposite sequences. Therefore, the two processing sequences of the waves can be used as the optimal processing sequence, or one of the two processing sequences of the waves can be used as the optimal processing sequence by referring to other dimensions, such as the deadline for completing the requirements of the PCBA products in the waves.

[0069] Step S160, according to the optimal processing sequence, all the wave numbers in the optimal wave number combination are sorted.

[0070] Taking the above X, Y and Z wave numbers as an example, since the optimal processing sequence of all wave numbers can be any one of the two kinds of X wave number, Y wave number, Z wave number or Z wave number, Y wave number, X wave number, all wave numbers are sorted according to the optimal processing sequence of all wave numbers, the order is X, Y, Z or Z, Y, X. Of course, if in the above step, reference is made to other dimensions, one of the two kinds of processing sequence of X wave number, Y wave number, Z wave number or Z wave number, Y wave number, X wave number is determined as the optimal processing sequence of all wave numbers, then all wave numbers are sorted according to the finally determined optimal processing sequence.

[0071] The embodiment calculates the processing sequence of all wave numbers with the least material replacement times according to the material coincidence degree between each two wave numbers, so as to optimally sort all wave numbers, realize the least material replacement times, and effectively reduce the material replacement cost.

[0072] Referring to Figure 3 , the second embodiment of the application also provides a PCBA product production scheduling method, which can be used for planning the production scheduling of the PCBA products to be arranged in the SMT patch product, such as Figure 3 As shown, when the user has a new PCBA product to submit, the method further includes the following steps on the basis of the above-mentioned first embodiment:

[0073] Step S210, the material list table of the PCBA product newly submitted by the current user is obtained, and it is judged whether there is a PCBA product with material coincidence degree exceeding the first set threshold in the PCBA product to be arranged in the production among the PCBA product newly submitted by the current user.

[0074] Step S220, if there is, the PCBA product newly submitted by the current user is added to the PCBA product to be arranged in the production.

[0075] Specifically, since the material coincidence degree of the newly submitted PCBA product of the current user and the PCBA product to be arranged for production may not be high, if the newly submitted PCBA product of the current user is added to the PCBA product to be arranged for production, and the PCBA product to be arranged for production is divided into waves, the newly submitted PCBA product of the current user cannot achieve the purpose of reducing the number of occupied SMT supply slots, and accordingly, the wave number cannot be reduced, and the SMT downtime number is relatively large. According to the implementation manner of the embodiment, when the user submits a new PCBA product, under the condition that there is a PCBA product in the PCBA product to be arranged for production, the material coincidence degree of which exceeds a first set threshold with the newly submitted PCBA product of the current user, the newly submitted PCBA product of the current user is added to the PCBA product to be arranged for production, and the PCBA product to be arranged for production is divided into waves according to the optimal wave combination, which can effectively reduce the wave number, achieve the purpose of reducing the SMT downtime number, and thus reduce the SMT downtime waiting cost. The first set threshold can be set according to actual needs.

[0076] In one of the embodiments, the PCBA product production scheduling method provided in Embodiment Two of the present application further includes the following steps:

[0077] In step S230, if there is no PCBA product in the PCBA product to be arranged for production, the material coincidence degree of which exceeds a first set threshold with the newly submitted PCBA product of the current user, it is determined whether there is a PCBA product in the PCBA product waiting for order combination, the material coincidence degree of which exceeds a second set threshold with the newly submitted PCBA product of the current user;

[0078] In step S240, if there is, the newly submitted PCBA product of the current user and the PCBA product, the material coincidence degree of which exceeds the second set threshold with the newly submitted PCBA product of the current user, are added to the PCBA product to be arranged for production;

[0079] In step S250, if there is not, it is determined whether the current user agrees to wait for order combination production;

[0080] In step S260, if the current user agrees to wait for order combination production, the newly submitted PCBA product of the current user is added to the PCBA product waiting for order combination.

[0081] Specifically, the PCBA products waiting for order combination and the PCBA products waiting for production are different. The PCBA products waiting for production are PCBA products that will be processed immediately, and the PCBA products waiting for order combination are PCBA products waiting for order combination with other PCBA products. Only when the order combination with other PCBA products is successful, the PCBA products waiting for order combination will be added to the PCBA products waiting for production for processing. If there is no PCBA product in the PCBA products waiting for production that has a material coincidence degree exceeding a first set threshold with the PCBA product newly submitted by the current user, it indicates that the material coincidence degree between the PCBA product newly submitted by the current user and the PCBA products waiting for production is not high. If the PCBA product newly submitted by the current user is added to the PCBA products waiting for production and wave division is performed on the PCBA products waiting for production, the PCBA product newly submitted by the current user cannot achieve the purpose of reducing the number of occupied SMT supply slots, and accordingly, the number of waves cannot be reduced, and the number of SMT downtime is relatively large. Under the condition that there is a PCBA product in the PCBA products waiting for order combination that has a material coincidence degree exceeding a second set threshold with the PCBA product newly submitted by the current user, the PCBA product with the material coincidence degree exceeding the second set threshold is added to the PCBA products waiting for production, and the PCBA products waiting for production are divided into waves according to the optimal wave combination, which can effectively reduce the number of waves and achieve the minimum number of SMT downtime, thereby effectively reducing the SMT downtime waiting cost. The second set threshold can be set according to actual needs.

[0082] If there is no PCBA product in the PCBA products waiting for production that has a material coincidence degree exceeding a first set threshold with the PCBA product newly submitted by the current user and there is no PCBA product in the PCBA products waiting for order combination that has a material coincidence degree exceeding a second set threshold with the PCBA product newly submitted by the current user, at this time, whether the current user waits for order combination production is determined by obtaining the intention of the current user to wait for order combination production. If the current user agrees to wait for order combination production, the PCBA product newly submitted by the current user is added to the PCBA products waiting for order combination. The intention of the current user to wait for order combination production can be obtained by prompting the current user to click the option of whether to agree to order combination production set by the system. In order to further encourage users to agree to wait for order combination production, a waiting order combination preferential policy can be set to give the current user a corresponding subsidy according to the length of time the current user waits for order combination. Through order combination design, a balance is achieved between customer delivery time and generation cost, delivery cost is effectively saved, and customer order willingness is improved.

[0083] In one of the embodiments, the PCBA product production scheduling method provided in Embodiment Three of the present application includes the following steps when a user submits a new PCBA product based on Embodiment One:

[0084] In step S310, the bill of materials table of the PCBA product newly submitted by the current user is acquired, and it is determined whether there is a PCBA product with a material coincidence degree exceeding a first set threshold in the PCBA products to be arranged for production among the PCBA product newly submitted by the current user;

[0085] In step S320, if there is, the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production;

[0086] In step S330, when the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production, it is determined whether there is a PCBA product with a material coincidence degree exceeding a second set threshold in the PCBA products waiting for order combination among the PCBA product newly submitted by the current user;

[0087] In step S340, if there is, the PCBA product with a material coincidence degree exceeding the second set threshold among the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production.

[0088] Specifically, when the user has a PCBA product newly submitted, there may be a PCBA product with a material coincidence degree exceeding the first set threshold in the PCBA products to be arranged for production, and there may be a PCBA product with a material coincidence degree exceeding the second set threshold in the PCBA products waiting for order combination. If there is a PCBA product with a material coincidence degree exceeding the first set threshold in the PCBA products to be arranged for production when the PCBA product newly submitted by the current user is acquired, the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production, thereby ignoring the possibility that the PCBA products waiting for order combination can be combined with the PCBA product newly submitted by the current user, resulting in that the PCBA products waiting for order combination miss an opportunity for order combination. In the embodiment, when the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production, it is further detected whether there is a PCBA product with a material coincidence degree exceeding the second set threshold in the PCBA products waiting for order combination, and if there is, the PCBA product with a material coincidence degree exceeding the second set threshold among the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production, so as to further reduce the number of wave orders while preparing for processing as soon as possible.

[0089] Further, in one of the embodiments, the PCBA product production scheduling method provided in the second embodiment of the present application further comprises the following steps after the intention of the current user whether to agree to wait for order combination production is acquired in step S250:

[0090] Step S261, if the current user agrees to wait for the production of the order, obtaining the maximum waiting time for the current user to wait for the production of the order.

[0091] Step S262, adding the PCBA product in the order waiting production whose maximum waiting time has passed to the PCBA product to be arranged for production.

[0092] Specifically, any one of the PCBA products in the order waiting production cannot wait indefinitely for the PCBA product with the material coincidence degree reaching the requirement, after all, all PCBA products have a delivery deadline. By obtaining the maximum waiting time for the current user to wait for the production of the order in the case where the current user agrees to wait for the production of the order, adding the PCBA product in the order waiting production whose maximum waiting time has passed to the PCBA product to be arranged for production for processing, it can effectively avoid missing the delivery deadline of the current PCBA product due to too long waiting time of the current PCBA product, reduce the SMT downtime waiting cost, and ensure the delivery deadline requirement of the user.

[0093] Embodiment four of the application also provides an order processing method, which can be used to plan the production scheduling of the PCBA product to be arranged for production in the SMT patch product. The method further includes the following steps based on the above-mentioned embodiment two and embodiment three:

[0094] According to the usage of the materials in the historical PCBA products, the popularity of the materials is quantified regularly, the materials with the usage frequency higher than the third set threshold in the current quantification period are marked as popular materials, and the materials with the usage frequency lower than the fourth set threshold in the current quantification period are marked as unpopular materials.

[0095] By regularly quantifying the popularity of the materials, the popularity of various materials can be more clearly understood, and different strategies can be deployed according to the popularity of various materials, such as the deployment of the proportion of the purchase quantity of various materials, the deployment of the number of warehouses for storing various materials, etc., which can effectively improve the working efficiency of the SMT patch machine. The third set threshold and the fourth set threshold can be set according to actual needs.

[0096] Further, in one of the embodiments, in the step S120, obtaining the SMT feeding slot number and the material list table of the PCBA product to be arranged for production includes the following steps:

[0097] Obtaining the SMT feeding slot number except the SMT feeding slot corresponding to the popular material and the material list table of the material used by the PCBA product to be arranged for production except the popular material.

[0098] Specifically, the hot material means a high frequency of use. As one of the embodiments, the hot material can be made to reside in the supply mechanism of the SMT chip mounter, and the hot material does not need to be replaced, which can reduce the material replacement cost to a certain extent. Since the hot material does not need to be replaced, only the material other than the hot material needs to be replaced. After obtaining the number of SMT supply slots other than the SMT supply slots corresponding to the hot material and the list of materials other than the hot material used by the PCBA product to be arranged for production, based on the list of materials other than the hot material used by the PCBA product to be arranged for production and the number of SMT supply slots other than the SMT supply slots corresponding to the hot material, the optimal wave combination of the PCBA product to be arranged for production is calculated; and the PCBA product to be arranged for production is divided into waves according to the optimal wave combination, which can effectively reduce the number of material replacements and minimize the material replacement cost.

[0099] In one of the embodiments, the step S250 of obtaining the intention of the current user to wait for the order production includes the following steps:

[0100] In step S251, the proportion of cold materials of the PCBA product newly submitted by the current user is obtained.

[0101] In step S252, if the proportion of cold materials of the PCBA product newly submitted by the current user is lower than the fifth set threshold, the intention of the current user to wait for the order production is obtained.

[0102] Specifically, the cold material means a low frequency of use. If the proportion of cold materials required by the PCBA product newly submitted by the current user is too high, it is difficult to wait for the material coincidence degree of a certain PCBA product and the PCBA product newly submitted by the current user to exceed the second set threshold, even if the PCBA product newly submitted by the current user is placed in the waiting order PCBA product. Therefore, in order to avoid the waste of waiting time of the PCBA product newly submitted by the current user, it is unnecessary to obtain the intention of the current user to wait for the order production and give the PCBA product newly submitted by the current user the opportunity to wait for the order production. Only when the proportion of cold materials of the PCBA product newly submitted by the current user is lower than the fifth set threshold, the intention of the current user to wait for the order production is obtained, and the PCBA product newly submitted by the current user is given the opportunity to wait for the order production. The fifth set threshold can be set according to actual needs.

[0103] The steps S251 to S252 can effectively avoid the waste of waiting time of the PCBA product whose proportion of cold materials exceeds the fifth set threshold.

[0104] Figure 4is a schematic diagram of a PCBA product production scheduling device according to an embodiment of the present application, as shown, a PCBA product production scheduling device 60 is provided, which comprises an acquisition module 61, a calculation module 62 and a division module 63: Figure 4

[0105] The acquisition module 61 is configured to acquire the SMT feeding slot number and the bill of materials table of the PCBA products to be arranged for production.

[0106] The calculation module 62 is configured to calculate the optimal wave combination of the PCBA products to be arranged for production based on the bill of materials table of the PCBA products to be arranged for production and the SMT feeding slot number; the optimal wave combination is the wave combination with the least number of waves among all wave combinations; the material types of all PCBA products in the same wave do not exceed the SMT feeding slot number.

[0107] The division module 63 is configured to divide the PCBA products to be arranged for production according to the optimal wave combination.

[0108] The PCBA product production scheduling device 60 described above acquires the SMT feeding slot number and the bill of materials table of the PCBA products to be arranged for production, calculates the optimal wave combination of the PCBA products to be arranged for production based on the bill of materials table and the SMT feeding slot number, and divides the PCBA products to be arranged for production according to the optimal wave combination. The present application calculates the wave combination of the PCBA products with the least number of waves according to the bill of materials table of the PCBA products to be arranged for production and the SMT feeding slot number, thereby dividing the PCBA products to be arranged for production into waves, producing the PCBA products to be arranged for production according to the optimal wave combination, and realizing the least number of SMT downtime, thereby effectively reducing the SMT downtime waiting cost.

[0109] In one embodiment, the PCBA product production scheduling device 60 further comprises a sorting module configured to calculate the material coincidence degree between each two waves in the optimal wave combination based on the bill of materials table of the PCBA products to be arranged for production.

[0110] According to the material coincidence degree, the optimal processing sequence of all waves in the optimal wave combination is calculated; the optimal processing sequence is the processing sequence with the least number of material changes among the processing sequences of all waves in the optimal wave combination.

[0111] According to the optimal processing sequence, all waves in the optimal wave combination are sorted.

[0112] ​In one of the embodiments, the PCBA product production scheduling device 60 further comprises a first submission module configured to acquire a bill of materials table of a PCBA product newly submitted by a current user, and determine whether there is a PCBA product with a material coincidence degree exceeding a first set threshold in the PCBA products to be arranged for production in the PCBA product newly submitted by the current user;

[0113] If there is, the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production.

[0114] In one of the embodiments, the first submission module is further configured to, if there is no PCBA product with a material coincidence degree exceeding the first set threshold in the PCBA products to be arranged for production in the PCBA product newly submitted by the current user, determine whether there is a PCBA product with a material coincidence degree exceeding a second set threshold in the PCBA products to be arranged for production in the PCBA product newly submitted by the current user;

[0115] If there is, the PCBA product newly submitted by the current user and the PCBA product with a material coincidence degree exceeding the second set threshold in the PCBA product newly submitted by the current user are added to the PCBA products to be arranged for production.

[0116] If there is not, it is determined whether the current user agrees to wait for a single production;

[0117] If the current user agrees to wait for a single production, the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production.

[0118] In one of the embodiments, the PCBA product production scheduling device 60 further comprises a second submission module configured to, when the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production, determine whether there is a PCBA product with a material coincidence degree exceeding the second set threshold in the PCBA products to be arranged for production in the PCBA product newly submitted by the current user;

[0119] If there is, the PCBA product with a material coincidence degree exceeding the second set threshold in the PCBA product newly submitted by the current user is added to the PCBA products to be arranged for production.

[0120] In one of the embodiments, after acquiring the intention of the current user whether to agree to wait for a single production, the first submission module is further configured to, if the current user agrees to wait for a single production, acquire a maximum waiting time for the current user to wait for a single production;

[0121] The PCBA product in the PCBA products to be arranged for production that has exceeded the maximum waiting time is added to the PCBA products to be arranged for production.

[0122] In one of the embodiments, the PCBA product production scheduling device 60 further comprises a quantification module configured to periodically quantify the popularity of the materials in the historical PCBA products according to the usage of the materials in the historical PCBA products, mark the materials with a usage frequency higher than a third preset threshold in the current quantification period as popular materials, and mark the materials with a usage frequency lower than a fourth preset threshold in the current quantification period as unpopular materials.

[0123] In one of the embodiments, the obtaining module 61 is further configured to obtain the number of SMT feeding slots other than the SMT feeding slots corresponding to the popular materials and a list of materials other than the popular materials used by the PCBA products to be arranged for production.

[0124] In one of the embodiments, the first submitting module is further configured to obtain the proportion of unpopular materials of the PCBA product newly submitted by the current user.

[0125] If the proportion of unpopular materials of the PCBA product newly submitted by the current user is lower than a fifth preset threshold, the intention of the current user whether to agree to wait for order production is obtained.

[0126] It should be noted that each of the above modules can be a functional module or a program module, which can be implemented by software or hardware. Each of the above modules can be embedded in or independent of the processor in the computer device in hardware form, or stored in the memory in the computer device in software form, so as to call and execute the operations corresponding to each of the above modules by the processor.

[0127] In one embodiment, a computer device is provided, which can be a server, and an internal structure diagram of the computer device can be as shown in Figure 5 The computer device comprises a processor, a memory, a network interface and a database connected through a system bus. The processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The memory provides an environment for the operating system and the computer program in the non-volatile storage medium. The database of the computer device is configured to store a preset configuration information set. The network interface of the computer device is configured to communicate with an external terminal through a network connection. The computer program is executed by the processor to implement the above PCBA product production scheduling method.

[0128] In one embodiment, a computer device is provided, which can be a terminal. The computer device comprises a processor, a memory, a network interface, a display screen and an input device connected through a system bus. The processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The memory provides an environment for the operating system and the computer program in the non-volatile storage medium to run. The network interface of the computer device is configured to communicate with external terminals through network connection. The computer program is executed by the processor to implement a PCBA product production scheduling method. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer overlaid on the display screen, or a key, trackball or touchpad arranged on the shell of the computer device, or an external keyboard, touchpad or mouse, etc.

[0129] Those skilled in the art can understand that, Figure 5 The structure shown in the above is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the computer device to which the scheme of the present application is applied. The specific computer device can comprise more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0130] In one embodiment, a computer readable storage medium is provided, which stores a computer program. The computer program is executed by a processor to implement the following steps:

[0131] Obtaining the number of SMT supply slots and a bill of materials table of PCBA products to be arranged for production;

[0132] Based on the bill of materials table of PCBA products to be arranged for production and the number of SMT supply slots, the optimal wave combination of PCBA products to be arranged for production is calculated. The optimal wave combination is the wave combination with the least number of waves among all wave combinations. The material types of all PCBA products in the same wave do not exceed the number of SMT supply slots;

[0133] According to the optimal wave combination, the PCBA products to be arranged for production are divided into waves.

[0134] In one embodiment, the processor further implements the following steps when executing the computer program:

[0135] Based on the bill of materials table of PCBA products to be arranged for production, the material coincidence degree between each two waves in the optimal wave combination is calculated;

[0136] According to the material coincidence degree, the optimal processing sequence of all waves in the optimal wave combination is calculated; the optimal processing sequence is the processing sequence in which the material replacement times are the least in the optimal wave combination;

[0137] According to the optimal processing sequence, all waves in the optimal wave combination are sorted.

[0138] In an embodiment, when a user has a new PCBA product submitted, the processor executing the computer program also implements the following steps:

[0139] Obtain the bill of materials table of the PCBA product newly submitted by the current user, and determine whether there is a PCBA product with a material coincidence degree exceeding a first set threshold in the PCBA product to be arranged for production among the PCBA product newly submitted by the current user;

[0140] If there is, the PCBA product newly submitted by the current user is added to the PCBA product to be arranged for production.

[0141] In an embodiment, the processor executing the computer program also implements the following steps:

[0142] If there is no PCBA product with a material coincidence degree exceeding the first set threshold in the PCBA product to be arranged for production among the PCBA product newly submitted by the current user, it is determined whether there is a PCBA product with a material coincidence degree exceeding a second set threshold in the PCBA product to be arranged for production among the PCBA product newly submitted by the current user;

[0143] If there is, the PCBA product newly submitted by the current user and the PCBA product with a material coincidence degree exceeding the second set threshold are added to the PCBA product to be arranged for production;

[0144] If there is not, it is determined whether the current user agrees to wait for the production of the PCBA product;

[0145] If the current user agrees to wait for the production of the PCBA product, the PCBA product newly submitted by the current user is added to the PCBA product to be arranged for production.

[0146] In an embodiment, the processor executing the computer program also implements the following steps:

[0147] When the PCBA product newly submitted by the current user is added to the PCBA product to be arranged for production, it is determined whether there is a PCBA product with a material coincidence degree exceeding the second set threshold in the PCBA product to be arranged for production among the PCBA product to be arranged for production;

[0148] If there are, PCBA products with material coincidence degree exceeding the second set threshold with the newly submitted PCBA product of the current user are added to the PCBA products to be arranged for production.

[0149] In one embodiment, after obtaining the intention of the current user whether to wait for the production of the order combination, the processor further implements the following steps when executing the computer program:

[0150] If the current user agrees to wait for the production of the order combination, the maximum waiting time for the current user to wait for the production of the order combination is obtained.

[0151] The PCBA products in the PCBA products waiting for the production of the order combination that have exceeded the maximum waiting time are added to the PCBA products to be arranged for production.

[0152] In one embodiment, the processor further implements the following steps when executing the computer program:

[0153] According to the usage of materials in the historical PCBA products, the popularity of the materials is quantified regularly, and the materials with usage frequency higher than the third set threshold in the current quantification period are marked as popular materials, and the materials with usage frequency lower than the fourth set threshold in the current quantification period are marked as unpopular materials.

[0154] In one embodiment, the processor further implements the following steps when executing the computer program:

[0155] The number of SMT supply slots other than the SMT supply slots corresponding to the popular materials and the list of materials other than the popular materials used by the PCBA products to be arranged for production are obtained.

[0156] In one embodiment, the processor further implements the following steps when executing the computer program:

[0157] The proportion of unpopular materials of the newly submitted PCBA product of the current user is obtained.

[0158] If the proportion of unpopular materials of the newly submitted PCBA product of the current user is lower than the fifth set threshold, the intention of the current user whether to wait for the production of the order combination is obtained.

[0159] The storage medium obtains the SMT feeding groove number and a bill of materials of the PCBA product to be arranged for production; based on the bill of materials and the SMT feeding groove number, the optimal wave combination of the PCBA product to be arranged for production is calculated; the optimal wave combination is the wave combination with the least number of waves in all wave combinations; the material types of all PCBA products in the same wave do not exceed the SMT feeding groove number; and the PCBA product to be arranged for production is divided into waves according to the optimal wave combination. According to the bill of materials of the PCBA product to be arranged for production and the SMT feeding groove number, the wave combination of the PCBA product with the least number of waves is calculated, so that the PCBA product to be arranged for production is divided into waves, the PCBA product to be arranged for production is produced according to the optimal wave combination, the number of SMT shutdowns is minimized, and the SMT shutdown waiting cost is effectively reduced.

[0160] It should be understood that the specific embodiments described herein are merely exemplary and not intended to limit the application. Based on the embodiments provided in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.

[0161] Obviously, the drawings are only some examples or embodiments of the present application, and those of ordinary skill in the art can also apply the present application to other similar situations according to the drawings without creative labor. In addition, it can be understood that although the work done in the development process may be complex and long, certain design, manufacture or production changes made by those of ordinary skill in the art according to the technical content disclosed in the present application are only routine technical means and should not be regarded as insufficient disclosure of the present application.

[0162] The term "embodiment" in the present application means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The presence of this phrase in various places in the specification does not necessarily mean the same embodiment, nor does it mean independence or alternative to other embodiments. Those of ordinary skill in the art can clearly or implicitly understand that the embodiments described in the present application can be combined with other embodiments without conflict.

[0163] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of patent protection. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. A PCBA product production scheduling method, used to plan the production scheduling of PCBA products to be produced in SMT assembly products, characterized in that, The method includes the following steps: Obtain the number of SMT feed slots and the bill of materials for the PCBA products to be manufactured; Based on the bill of materials for the PCBA products to be manufactured, the optimal wave combination for the PCBA products to be manufactured is calculated according to the number of overlapping material types among the PCBA products to be manufactured and the number of SMT feed slots. The optimal wave combination is the wave combination with the fewest waves among all wave combinations. The number of material types of all PCBA products in the same wave does not exceed the number of SMT feed slots. The PCBA products to be scheduled for production are divided into waves based on the optimal wave combination.

2. The PCBA product production scheduling method according to claim 1, characterized in that, The method further includes: Based on the bill of materials for the PCBA products to be produced, calculate the material overlap between each pair of waves in the optimal wave combination. Based on the material overlap, calculate the optimal processing sequence for all waves in the optimal wave combination; the optimal processing sequence is the processing sequence with the fewest material changes among all wave processing sequences in the optimal wave combination. Sort all waves in the optimal wave combination according to the optimal processing order.

3. The PCBA product production scheduling method according to claim 1 or 2, characterized in that, When a user submits a new PCBA product, the method further includes: Obtain the bill of materials for the PCBA products newly submitted by the current user, and determine whether there are any PCBA products among the PCBA products to be scheduled for production that have a material overlap with the PCBA products newly submitted by the current user that exceeds a first set threshold. If it exists, the newly submitted PCBA product by the current user will be added to the PCBA products to be scheduled for production.

4. The PCBA product production scheduling method according to claim 3, characterized in that, The method further includes: If there is no PCBA product among the PCBA products to be scheduled for production that has a material overlap with the PCBA product newly submitted by the current user that exceeds a first set threshold, then determine whether there is a PCBA product among the PCBA products waiting to be grouped into orders that has a material overlap with the PCBA product newly submitted by the current user that exceeds a second set threshold. If they exist, add the PCBA products newly submitted by the current user and the PCBA products whose material overlap with the newly submitted PCBA products by the current user exceeds the second set threshold to the PCBA products to be scheduled for production. If not, retrieve whether the current user agrees to wait for the group purchase to be produced; If the current user agrees to wait for group production, the newly submitted PCBA products will be added to the list of PCBA products waiting for group production.

5. The PCBA product production scheduling method according to claim 3, characterized in that, The method further includes: When adding a newly submitted PCBA product to the PCBA products to be scheduled for production, it is determined whether there are any PCBA products in the waiting group order that have a material overlap with the newly submitted PCBA product that exceeds a second set threshold. If such products exist, those PCBA products whose material overlap with the currently submitted PCBA products exceeds a second set threshold will be added to the PCBA products to be scheduled for production.

6. The PCBA product production scheduling method according to claim 4, characterized in that, After obtaining whether the current user agrees to wait for the group order to be produced, the method further includes: If the current user agrees to wait for the group order to be produced, obtain the maximum waiting time for the current user to wait for the group order to be produced. Add the PCBA products that have exceeded the maximum waiting time from the PCBA products waiting for group purchase to the PCBA products to be scheduled for production.

7. The PCBA product production scheduling method according to any one of claims 4 to 6, characterized in that, The method further includes: Based on the historical material usage in PCBA products, the popularity of materials is quantified periodically. Materials whose usage frequency in the current quantification period is higher than the third set threshold are marked as popular materials, and materials whose usage frequency in the current quantification period is lower than the fourth set threshold are marked as unpopular materials.

8. The PCBA product production scheduling method according to claim 7, characterized in that, The process of obtaining the number of SMT feed slots and the bill of materials for the PCBA products to be manufactured includes the following steps: Obtain the number of SMT feed slots other than those corresponding to the popular materials, and the bill of materials other than the popular materials among the materials to be used in the PCBA products to be produced.

9. The PCBA product production scheduling method according to claim 4 or 6, characterized in that, The process of obtaining whether the current user agrees to wait for the group purchase to be produced includes the following steps: Obtain the proportion of unpopular materials in the PCBA product newly submitted by the user; If the proportion of unpopular materials in the newly submitted PCBA product by the current user is lower than the fifth set threshold, the system will determine whether the current user agrees to wait for group production.

10. A PCBA product production scheduling device, used for planning the production scheduling of PCBA products to be produced in SMT assembly products, characterized in that, The device includes: an acquisition module, a calculation module, and a partitioning module. The acquisition module is used to acquire the number of SMT feed slots and the bill of materials for the PCBA products to be produced. The calculation module is used to calculate the optimal wave combination of the PCBA products to be produced based on the bill of materials table of the PCBA products to be produced, according to the number of overlapping material types among the PCBA products to be produced and the number of SMT feed slots; the optimal wave combination is the wave combination with the fewest wave numbers among all wave combinations; the number of material types of all PCBA products in the same wave does not exceed the number of SMT feed slots. The partitioning module is used to partition the PCBA products to be scheduled for production into waves according to the optimal wave combination.

11. A computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 9.

12. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 9.

Citation Information

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