Treatment container and liquid treatment device

Abstract

A substrate processing apparatus is provided. The substrate processing apparatus includes a processing vessel including an outer cup and an inner cup disposed inside the outer cup, the inner cup and the outer cup in combination defining a recovery path for recovering liquid; a rotatable spin head disposed within the processing vessel, a cleaning fixture disposed on the spin head; wherein the processing vessel includes a first protrusion protruding from an inner surface of the outer cup to direct cleaning liquid shed from the cleaning fixture toward a surface of the inner cup.

Description

Technical Field

[0001] The embodiments of the inventive concept described herein relate to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of cleaning a cup disposed at a liquid processing unit. Background Technology

[0002] To manufacture semiconductor devices, various processes are required, such as cleaning, vapor deposition, photolithography, etching, and ion implantation. Among these, photolithography is a continuous process of coating, exposure, and development. The coating process involves applying a coating solution, such as photoresist, to the substrate surface. The exposure process involves using a photomask to expose the photoresist on the substrate. The development process involves selectively removing the exposed photoresist from the substrate.

[0003] Typically, the coating and developing processes involve supplying a processing solution to the substrate and treating the substrate with the processing solution. The liquid treatment on the substrate is carried out in a processing container, and the used processing solution is recycled through the processing container.

[0004] Because various processing solutions are recycled into the processing container at each stage of the process, these solutions can contaminate the container. This contaminated solution can generate fumes or become a major cause of substrate contamination.

[0005] Figure 1a is a cross-sectional view showing a typical liquid handling apparatus used in the coating process. Referring to Figure 1a, in this liquid handling apparatus, a substrate W is placed in a processing container 2, and a photosensitive solution X is supplied onto the substrate W. The photosensitive solution X is a viscous liquid and adheres in large quantities to the recovery path. The photosensitive solution X adhering to the recovery path of the processing container 2 may contaminate peripheral equipment and adversely affect the operator.

[0006] Therefore, the processing container containing residual photosensitive solution X needs to be cleaned regularly.

[0007] Figure 1b is a cross-sectional view showing the cleaning process of the processing container in the apparatus of Figure 1. Referring to Figure 1b, the cleaning process of the processing container 2 can be performed before or after the liquid application to the substrate W is completed. During the cleaning process of the processing container 2, cleaning fluid Y is supplied from above and below the cleaning fixture. The cleaning fluid Y spills from the cleaning fixture and is recovered through a recycling path, thereby cleaning the residual photosensitive liquid.

[0008] However, the cleaning solution Y did not reach some areas x and y of the processing container 2 that form the recycling path. For example, the lower area y facing the substrate W and the upper area x above the substrate W in the processing container 2 correspond to areas not reached by the cleaning solution Y. Therefore, even after the cleaning process is completed, the photosensitive solution X may still remain on the processing container 2, and cleaning it is very difficult. Summary of the Invention

[0009] Embodiments of the present invention provide a processing container and a substrate processing apparatus that are easy to clean of residual processing liquid.

[0010] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become clear to those skilled in the art through the following description.

[0011] In one aspect of an embodiment of the present invention, a substrate processing apparatus includes: a processing container comprising an outer cup and an inner cup disposed inside the outer cup, the inner cup and the outer cup together defining a recovery path for recovering liquid; a rotatable rotating head disposed within the processing container, wherein a cleaning clamp is placed on the rotating head; wherein the processing container includes a first protrusion projecting from the inner surface of the outer cup to guide cleaning fluid spilled from the cleaning clamp to the surface of the inner cup.

[0012] In one embodiment, the first protrusion may be formed such that cleaning fluid spilled from the cleaning fixture collides with the first protrusion.

[0013] In one embodiment, the outer cup may include a vertical wall and an inclined wall that slopes inward and upward from the top of the vertical wall, wherein a first protrusion is disposed in the inner surface of the inclined wall.

[0014] In one embodiment, the outer cup may further include a second protrusion that protrudes from the inner surface of the inclined wall toward the inner cup and is positioned apart from the first protrusion that is closer to the inner side.

[0015] In one embodiment, the second protrusion may be positioned outside the edge of the cleaning fixture.

[0016] In one embodiment, the first protrusion and the second protrusion may be arranged in an annular shape on the inclined wall.

[0017] In one embodiment, the outer cup may include a first recess located between the vertical wall and the first protrusion; and a second recess located between the first protrusion and the second protrusion.

[0018] In one embodiment, the inner cup may include recesses on its upper surface for recovering cleaning fluid.

[0019] In one embodiment, the inner cup may include an inner inclined wall that slopes upward away from the rotating head and is located below the cleaning clamp, and an outer inclined wall connected to the inner inclined wall and slopes downward away from the rotating head, the combination of the outer inclined wall and the outer cup defining a recovery path.

[0020] In one embodiment, the recess may be provided on the upper surface of the outwardly inclined wall.

[0021] In one embodiment, the cleaning solution may include a diluent.

[0022] In another aspect of an embodiment of the present invention, the processing container may be configured to surround the rotating head, the processing container comprising: an outer cup including a vertical wall and an inclined wall sloping inward and upward from the top of the vertical wall; an inner cup placed inside the outer cup, the inner cup and the outer cup together defining a recovery path for recovering liquid, wherein the outer cup includes a first protrusion projecting from the inner surface of the inclined wall into the inner cup.

[0023] In one embodiment, the protrusion may be positioned below the substrate placed on the rotating head.

[0024] In one embodiment, the outer cup may further include a second protrusion that extends from the inner surface of the inclined wall toward the inner cup and is positioned away from the first protrusion.

[0025] In one embodiment, the second protrusion may be located at a position away from the substrate on which the rotating head is placed.

[0026] In one embodiment, the first protrusion and the second protrusion may be arranged in an annular shape on the inclined wall.

[0027] In one embodiment, the outer cup may include a first recess between the vertical wall and the first protrusion, and a second recess between the first protrusion and the second protrusion.

[0028] In one embodiment, the inner cup may include an inner inclined wall that is inclined upward away from the rotating head and below the cleaning clamp, and an outer inclined wall that is connected to the inner inclined wall and inclined downward away from the rotating head. The combination of the outer inclined wall and the outer cup defines a recovery path, wherein the outer inclined wall includes recesses on its upper surface for recovering the cleaning fluid.

[0029] In one embodiment, the recess may be formed to be spatially aligned with the first protrusion and the second protrusion.

[0030] In another aspect of the embodiments of the present invention, the liquid handling apparatus may include: a handling container comprising an outer cup and an inner cup disposed inside the outer cup, the inner cup and the outer cup together defining a recovery path for recovering liquid; a rotatable rotating head disposed within the handling container, on which a cleaning clamp is placed; and a cleaning fluid nozzle that sprays cleaning fluid onto the top surface of the cleaning clamp to clean the handling container, wherein the outer cup comprises: a vertical wall; an inclined wall sloping inward and upward from the top of the vertical wall, a first protrusion colliding with cleaning fluid spilled from the cleaning clamp to direct the cleaning fluid toward the surface of the inner cup.

[0031] In one embodiment, the outer cup may include a second protrusion projecting from the inner surface of the inclined wall toward the inner cup and positioned away from the first protrusion; a first recess between the vertical wall and the first protrusion; and a second recess between the first protrusion and the second protrusion.

[0032] In one embodiment, the inner cup may include an inner inclined wall that is inclined upward away from the rotating head and below the cleaning fixture; and an outer inclined wall that is connected to the inner inclined wall and inclined downward away from the rotating head. The combination of the outer inclined wall and the outer cup defines a recovery path, wherein the outer inclined wall includes a recess on its upper surface that is aligned with the space between a first protrusion and a second protrusion, and the recess recovers the cleaning fluid that falls onto the outer inclined wall.

[0033] In embodiments of the present invention, cleaning residual cleaning fluid on the processing container can be made easy. Attached Figure Description

[0034] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals refer to the same parts in the various drawings, and

[0035] in:

[0036] Figure 1a is a cross-sectional view showing a typical liquid handling apparatus used in the coating process.

[0037] Figure 1b is a cross-sectional view showing the cleaning process of the processing container in the apparatus of Figure 1.

[0038] Figure 2 This is a top view of the substrate processing apparatus in the first embodiment of the present invention.

[0039] Figure 3 yes Figure 2 A cross-sectional view of the device along the AA direction.

[0040] Figure 4 yes Figure 2 BB direction cross-sectional view of the device.

[0041] Figure 5 yes Figure 2 A cross-sectional view of the device along the CC direction.

[0042] Figure 6 yes Figure 2 A cross-sectional view of the substrate processing apparatus.

[0043] Figure 7 and Figure 8 This is a diagram showing the spillage of treatment fluid and cleaning fluid in the treatment container. Detailed Implementation

[0044] The inventive concept can be modified in various ways and can take many forms, and its specific embodiments will be shown and described in detail in the accompanying drawings. However, the embodiments conceived according to the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions contained within the spirit and technical scope of the inventive concept. In the description of the inventive concept, detailed descriptions of relevant known technologies may be omitted when the essence of the inventive concept may be unclear.

[0045] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms “comprising” and / or “including,” when used in this specification, designate the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “exemplary” is intended to refer to an example or illustration.

[0046] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another region, layer, or portion. Therefore, without departing from the teachings of the inventive concept, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion.

[0047] The apparatus of embodiments of the present invention can be used to perform photolithography processes on substrates such as semiconductor wafers or flat panel displays. In particular, the apparatus of embodiments of the present invention can be connected to an exposure apparatus to perform coating and development processes on the substrate. As an example only, embodiments of the present invention will be described below in the case of semiconductor wafer substrates.

[0048] Figures 2 to 8 A substrate processing apparatus 1 according to an embodiment of the present invention is shown.

[0049] Figure 2 This is a top view of the substrate processing apparatus 1. Figure 3 This is a view of the substrate processing apparatus 1 in Figure 1 from direction AA. Figure 4 yes Figure 2 A BB-direction view of the middle substrate processing apparatus 1, and Figure 5 yes Figure 2CC view of the middle substrate processing apparatus 1.

[0050] Reference Figures 2 to 5 The substrate processing apparatus 1 includes a loading port 100, a transposition model 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500, a processing module 600 for pre- and post-exposure processing, and an interface module 700. The loading port 100, transposition module 200, first buffer module 300, coating and developing module 400, second buffer module 500, processing module 600 for pre- and post-exposure processing, and interface module 700 are arranged in a row.

[0051] In the following text, the arrangement direction of the loading port 100, the transposition module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the processing module 600 for pre- and post-exposure processing, and the interface module 700 will be referred to as the first direction 12. When viewed from above, the direction perpendicular to the first direction 12 will be referred to as the second direction 14, and the direction perpendicular to both the first direction 12 and the second direction 14 will be referred to as the third direction 16.

[0052] The substrate W stored in box 20 is transferred. Box 20 has a structure that can be sealed to the outside. For example, a front-opening unified compartment (FOUP) with a fully open door can be used for box 20.

[0053] In the following text, the loading port 100, the transposition module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the processing module 600 for pre- and post-exposure processing, and the interface module 700 will be explained.

[0054] The loading port 100 has a placement stage 120 on which 20 boxes of storage substrates W are placed. Multiple placement stages 120 are provided, arranged in a row along a second direction 14. Figure 2 In the embodiment shown, four placement platforms 120 are provided.

[0055] The indexing module 200 transfers substrate W between a cassette 20 placed on a loading stage 120 at the loading port 100 and a first buffer module 300. The indexing module 200 includes a frame 210, an indexing robot 200, and a guide rail 230. The frame 210 is typically configured as a hollow cuboid. The frame 210 is arranged between the loading port 100 and the first buffer module 300. The frame 210 of the indexing module 200 may be positioned at a height lower than the frame 310 of the first buffer module 300, as will be explained further later. The indexing robot 220 and the guide rail 230 are disposed inside the frame 210. The indexing robot 220 has a hand 221 that directly handles the substrate W and is movable and rotatable in a first direction 12, a second direction 14, and a third direction 16. The indexing robot 220 includes a hand 221, an arm 222, a support 223, and a base 224. The hand 221 is fixedly mounted to the arm 222. The arm 222 is configured to be telescopic and rotatable. The support 223 extends along a third direction 16. The arm 222 is connected to and movable on the support 223. The support 223 is fixedly connected to the base 224. The guide rail 230 extends along a second direction 14. The base 224 is connected to and linearly movable on the guide rail 230. Furthermore, although not shown, a door opener for opening and closing the door of the box 20 is provided in the frame 210.

[0056] The first buffer module 300 includes a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is shaped like a hollow cuboid and is positioned between the indexing module 200 and the coating and developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are disposed within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are arranged sequentially from bottom to top in a third direction 16. The first buffer 320 is positioned at the same height as the coating module 401 of the coating and developing module 400, as will be described below. The second buffer 330 and the cooling chamber 350 are positioned at the same height as the developing module 402 of the coating and developing module 400, as will be described below. The first buffer robot 360 is positioned separately from the second buffer 330, the cooling chamber 350, and the first buffer 320 in a second direction 14.

[0057] First buffer 320 and second buffer 330 temporarily store multiple substrates W. Second buffer 330 has a housing 331 and multiple supports 332. Supports 332 are arranged within housing 331 and are spaced apart from each other in a third direction 16. Individual substrates W are placed on each support 332. Housing 331 has openings (not shown) toward the indexing robot 220, first buffer robot 360, and developing robot 482, such that the indexing robot 220, first buffer robot 360, and developing robot 482 (to be further described) of the developing module 402 can bring substrates W into / out of housing 331 on supports 332. First buffer 320 generally has a similar structure to second buffer 330, i.e., housing 321 of first buffer 320 has openings toward first robot 360 and coating robot 432 disposed in coating module 401 for transferring wafers W between them. The number of support members 322 provided in the first buffer 320 and the number of support members 332 provided in the second buffer 330 may be the same or different. In one embodiment, the number of support members 332 provided in the second buffer 330 may be greater than the number of support members 332 provided in the first buffer 320.

[0058] A first buffer robot 360 transfers a substrate W between a first buffer 320 and a second buffer 330. The first buffer robot 360 includes a hand 361, an arm 362, and a support 363. The hand 361 is fixedly mounted to the arm 362. The arm 362 is configured to be telescopic, allowing the hand to move in a second direction 14. The arm 362 is movably connected to the support 363, and the arm moves linearly along a third direction on the support 363. The support 363 has a length extending between a point corresponding to the position of the second buffer 330 and a point corresponding to the position of the first buffer 320. The support 363 may further extend upward or downward. The first robot 360 may be configured with a dual-axis drive structure, allowing the hand 361 to move in both the second direction 14 and the third direction 16.

[0059] Cooling chamber 350 cools each substrate W. Cooling chamber 350 includes housing 351 and cooling plate 352. Cooling plate 352 includes a top surface for placing substrate W and cooling member 353 for cooling substrate W. Cooling member 353 can utilize various cooling methods, such as cooling water or thermoelectric devices. Cooling chamber 350 may further be provided with lifting pin assembly (not shown) for placing substrate W on cooling plate 352. Housing 351 may have openings (not shown) toward indexing robot 220 and developing robot 482 for indexing robot 220 and developing robot 482 to bring substrate W into / out of cooling plate 352. In addition, cooling chamber 350 is provided with doors for opening and closing the aforementioned openings.

[0060] The coating and developing module 400 performs processes such as applying a photosensitive solution to the substrate W before the exposure process and developing the substrate W after the exposure process. The coating and developing module 400 typically has a cuboid shape. The coating and developing module 400 includes a coating module 401 and a developing module 402. The coating module 401 and the developing module 402 are arranged to be divided into different layers. In one embodiment, the coating module 401 may be disposed above the developing module 402.

[0061] The coating module 401 performs processes such as applying a photosensitive solution, such as a photoresist solution, to the substrate W before and after the photoresist coating process, as well as heat treatment processes such as heating and cooling the substrate W. The coating module 401 has a photoresist coating chamber 410, a baking chamber 420, and a transfer chamber 430. The photoresist coating chamber 410, baking chamber 420, and transfer chamber 430 are arranged sequentially in a second direction 14. Therefore, the photoresist coating chamber 410 and baking chamber 420 are positioned separately in the second direction, with the transfer chamber 430 located between them. Multiple photoresist coating chambers 410 can be provided, and multiple chambers can be provided in both the first direction 12 and the third direction 16. An example of six baking chambers 420 is provided in the figure. However, a greater number of baking chambers 420 can be provided.

[0062] The transfer chamber 430 is arranged side-by-side with the first buffer 320 of the first buffer module 300 in the first direction 12. A coating robot 432 and a guide rail 433 are disposed within the transfer chamber 430. The transfer chamber 430 generally has a rectangular shape. The coating robot 432 transfers the substrate W between the baking chamber 420, the photoresist coating chamber 410, the first buffer 320 of the first buffer module 300, and the first cooling chamber 520 of the second buffer module 500, as will be explained later. The guide rail 433 is arranged to extend its length along the first direction 12. The guide rail 433 guides the coating robot 432 to move linearly (i.e., back and forth) along the first direction 12. The coating robot 432 has a hand 434, an arm 435, a support 436, and a base 437. The hand 434 is fixedly mounted to the arm 435. The arm 435 is configured as a telescopic structure, allowing the hand 434 to move horizontally. The support 436 is arranged to extend its length along a third direction 16. The arm is connected to the support 436, allowing it to move linearly along a third direction 16 on the support 436. The support 436 is fixedly mounted to the base 437, and the base 437 is connected to the guide rail 433 so that it is movable along the guide rail 433.

[0063] The photoresist coating chambers 410 have the same structure. However, the photoresist used in each photoresist coating chamber 410 can be different. In one embodiment, a chemically amplified resist can be used as the photoresist. The photoresist coating chamber 410 coats the photoresist onto the surface of the substrate W. The liquid coating process is performed on the substrate processing apparatus 800, which will refer to... Figures 6 to 7 Further explanation.

[0064] Return to reference Figures 2 to 5 The baking chamber 420 performs heat treatment on the substrate W. For example, the baking chamber 420 may perform a pre-baking process such as heating the substrate W to a predetermined temperature before applying photoresist to remove organic materials or moisture from the surface of the substrate W, or a soft baking process after applying photoresist to the substrate W, followed by a cooling process to cool the substrate W. The baking chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with a cooling device 423, such as cooling water or a thermoelectric device. Furthermore, the heating plate 422 is provided with a heating device 424, such as a hot wire or a thermoelectric device. The cooling plate 421 and the heating plate 422 may be disposed in one baking chamber 420. Alternatively, some baking chambers 420 may include only the cooling plate 421, while others may include only the heating plate 422.

[0065] The developing module 402 includes a developing process that removes a portion of the photoresist by supplying a developing solution to obtain a pattern on the substrate W, and heat treatment processes such as heating and cooling performed on the substrate W before and after the developing process. The developing module 402 has a developing chamber 460, a baking chamber 470, and a transfer chamber 480. The developing chamber 460, baking chamber 470, and transfer chamber 480 are arranged sequentially along a second direction 14. Therefore, the developing chamber 460 and baking chamber 470 are positioned separately from each other in the second direction 14, with the transfer chamber 480 interposed therebetween. A plurality of developing chambers 460 are provided, and the plurality of developing chambers 460 are respectively arranged in a first direction 12 and a third third direction 16. An example of six developing chambers 460 is shown in the figure. A plurality of baking chambers 470 are respectively arranged in a first direction 12 and a third third direction 16. An example of six baking chambers 470 is shown in the figure. However, unlike this, more baking chambers 470 can be provided.

[0066] The transfer chamber 480 is placed side-by-side with the second buffer 330 of the first buffer module 300 in the first direction 12. Inside the transfer chamber 480 are a developing robot 482 and a guide rail 483. The transfer chamber is generally rectangular in shape. The developing robot 482 moves the substrate W between the baking chamber 470, the developing chamber 460, the second buffer 330 of the first buffer module 300, the cooling chamber 350, and the second cooling chamber 540 of the second buffer module 500. The guide rail 483 extends along the first direction 12. The guide rail 483 guides the developing robot 482 to move linearly along the first direction 12. The developing robot 482 has a hand 484, an arm 485, a support 486, and a base 487. The hand 484 is fixedly mounted to the arm 485. The arm 485 is telescopic, allowing the hand 484 to move horizontally. The support 486 extends along a third direction 16. The arm 485 is connected to the support 486 for linear movement along a third direction 16. The support 486 is fixedly mounted to the base 487. The base 487 is combined with the guardrail 483 so that it can move along the guardrail 483.

[0067] All developing chambers 460 have the same structure. However, the developing solutions used in each developing chamber 460 can be different from each other. The developing chamber 460 can remove the light-exposed portions of the photoresist applied to the surface of the substrate W. At this time, the light-exposed portions of the protective layer can also be removed. Depending on the type of photoresist, portions of the photoresist that were not exposed to light and portions of the protective layer can be removed.

[0068] The developing chamber 460 includes a container 461, a support plate 462, and a nozzle 463. The container 461 is cup-shaped with an opening at the top. The support plate 462 is disposed within the container 461 and supports the substrate W. The support plate 462 is rotatably disposed. The nozzle 463 supplies developer to the substrate W. The nozzle 463 has a cylindrical shape and can supply developer to the center of the substrate W. Alternatively, the length of the nozzle can be matched to the diameter of the substrate W, and the outlet of the nozzle 463 can be a slit. Furthermore, a nozzle 464 for supplying a cleaning solution such as deionized water can be additionally provided in the developing chamber 460 to clean the surface of the substrate W.

[0069] Baking chamber 470 performs heat treatment on substrate W. For example, baking chamber 470 performs a post-baking process of heating substrate W before performing a developing process, a hard baking process of heating substrate W after performing a developing process, and a cooling process of cooling the heated wafer after each baking process. Baking chamber 470 has a cooling plate 471 or a heating plate 472. Cooling plate 471 is provided with a cooling device 473, such as cooling water or a thermoelectric device. Alternatively, heating plate 472 is provided with a heating device 474, such as a hot wire or a thermoelectric device. Cooling plate 471 and heating plate 472 may be respectively provided in one baking chamber 470. Alternatively, some baking chambers 470 may include only cooling plate 471, while others may include only heating plate 472.

[0070] As described above, the coating module 401 and the developing module 402 are configured such that they can be separated from each other within the coating and developing module 400. Furthermore, when viewed from above, the coating module 401 and the developing module 402 may have the same chamber arrangement.

[0071] The second buffer module 500 is configured as a channel for conveying the substrate W between the coating and developing module 400 and the processing module 600 for pre- and post-exposure processing. Furthermore, the second buffer module 500 performs certain processes, such as cooling on the substrate W or edge exposure processes. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560. The frame 510 has a cuboid shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are housed within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are positioned at a height corresponding to the coating module 401. The second cooling chamber 540 is positioned at a height corresponding to the developing module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are arranged in a row along a third direction 16. When viewed from above, the buffer 520 is positioned along the first direction 12 together with the transfer chamber 430 of the coating module 401. The edge exposure chamber 550 is positioned separately from the buffer 520 or the first cooling chamber 530 in the second direction 14.

[0072] A second buffer robot 560 transports the substrate W between a buffer 520, a first cooling chamber 530, and an edge exposure chamber 550. The second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 can be configured similarly to the structure of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform subsequent processing on the wafer W processed in the coating module 401. The first cooling chamber 530 cools the substrate W processed in the coating module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes the edges of the wafer W that have been cooled in the first cooling chamber 530. The buffer 520 temporarily stores the substrate W before it is transferred to the preprocessing module 601 for further interpretation. The second cooling chamber 540 cools the wafer W before it is transferred to the developing module 402 after being processed in the post-processing module 602. The second buffer module 500 may further include a buffer added at a height corresponding to that of the developing module 402. In this case, the wafer W processed in the post-processing module 602 may be temporarily stored in the added buffer and then transferred to the developing module 402.

[0073] When the exposure apparatus 1000 performs an immersion exposure process, the pre- and post-exposure processing module 600 can apply a protective layer to protect the photoresist film applied to the substrate W during immersion exposure. Furthermore, the pre- and post-exposure processing module 600 can perform a post-exposure cleaning process on the substrate W. Additionally, when a chemically amplified resist is used in the application process, the pre- and post-exposure processing module 600 can perform a post-exposure baking process.

[0074] The processing module 600 for pre- and post-exposure processing includes a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a pre-exposure processing step on the substrate W, and the post-processing module 602 performs a post-exposure processing step on the substrate W. The pre-processing module 601 and the post-processing module 602 are arranged in layers. In one embodiment, the pre-processing module 601 is positioned above the post-processing module 602. The pre-processing module 601 is positioned at the same height as the coating module 401. The post-processing module 602 is positioned at the same height as the developing module 402. Module 601 includes a protective layer coating chamber 610, a baking chamber 620, and a transfer chamber 630. The protective layer coating chamber 610, the transfer chamber 630, and the baking chamber 620 are arranged sequentially along a second direction 14. Therefore, the protective layer coating chamber 610 and the baking chamber 620 are positioned separately from each other in the second direction 14, with the transfer chamber 630 interposed therebetween. Multiple protective layer coating chambers 610 are provided and positioned along a third direction 16 to form a layer. Alternatively, multiple protective layer coating chambers 610 may be provided on the first direction 12 and the third direction 16 respectively. Multiple baking chambers 620 may be provided and positioned along the third direction 16 to form a layer. Alternatively, multiple baking chambers 620 may be provided on the first direction 12 and the third direction 16 respectively.

[0075] The transfer chamber 630 is placed side-by-side with the first cooling chamber 530 of the second buffer module 500 in the first direction 12. A pre-processing robot 632 is located inside the transfer chamber 630. The transfer chamber 630 is typically square or rectangular. The pre-processing robot 632 moves the substrate W between the protective coating chamber 610, the baking chamber 620, the buffer 520 of the second buffer module 500, and the first buffer of the interface chamber 700, as will be explained further. The pre-processing robot 632 has a hand 633, an arm 634, and a support 632. The hand 633 is fixedly mounted to the arm 634. The arm 634 is telescopic and rotatable. The arm 634 is connected to the support 635 for linear movement in the third direction 16.

[0076] The protective layer coating chamber 610 applies photoresist to the surface of the substrate W. The protective layer coating chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with an open top. The support plate 612 is disposed inside the housing 611 and supports the substrate W. The support plate 612 is rotatable. The nozzle 613 provides photoresist to the surface of the substrate W disposed on the support plate 612. The nozzle 613 has a cylindrical shape and can provide photoresist at the center of the substrate W. Alternatively, the length of the nozzle 613 can correspond to the diameter of the substrate W, and the outlet of the nozzle 613 can be configured as a slit. In this case, the support plate 612 can be fixedly disposed. The photoresist includes a foamed material. Photoresist or a hydrophobic material can be used. In one embodiment, the photoresist may include a fluoride-based solvent. The protective layer coating chamber 610 rotates the substrate W placed on the support plate 612 and supplies photoresist to the central region of the substrate W.

[0077] Baking chamber 620 performs heat treatment on substrate W coated with a protective layer. Baking chamber 620 has a cooling plate 621 or a heating plate 622. Cooling plate 621 is provided with a cooling device 623, such as cooling water or a thermoelectric device. Alternatively, heating plate 622 is provided with a heating device 624, such as a hot wire or a thermoelectric device. Heating plate 622 and cooling plate 621 may each be located in a separate baking chamber 620. Alternatively, some baking chambers 620 may include only heating plate 622, while others may include only cooling plate 621.

[0078] The post-processing module 602 includes a cleaning chamber 660, a post-exposure baking chamber 670, and a transfer chamber 680. The cleaning chamber 660, transfer chamber 680, and post-exposure baking chamber 670 are arranged sequentially along a second direction 14. Therefore, the cleaning chamber 660 and the post-exposure baking chamber 670 are positioned separately from each other in the second direction 14, with the transfer chamber 680 located between them. Multiple cleaning chambers 660 are provided and can be positioned along a third direction 16 to form a layer. Alternatively, multiple cleaning chambers 660 can be provided in both the first direction 12 and the third direction 16, respectively. Multiple post-exposure baking chambers 670 are provided and can be positioned along a third direction 16 to form a layer. Alternatively, multiple post-exposure baking chambers 670 can be provided in both the first direction 12 and the third direction 16, respectively.

[0079] Viewed from above, the transfer chamber 680 is positioned parallel to the second cooling chamber 540 of the second buffer module 500 in the first direction 12. The transfer chamber 680 has a generally square or rectangular shape. The post-processing robot 682 is placed in the transfer chamber 680. The post-processing robot 682 transfers the substrate W between the cleaning chamber 660, the post-exposure baking chamber 670, the second cooling chamber 540 of the second buffer module 500, and the second buffer 730 of the interface module 700, which will be described later. The post-processing robot 682 disposed in the post-processing module 602 can be configured with the same structure as the pre-processing robot 632 disposed in the pre-processing module 601.

[0080] Cleaning chamber 660 cleans substrate W after the exposure process. Cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. Housing 661 has a cup shape with an open top. Support plate 662 is placed in housing 661 and supports substrate W. Support plate 662 is configured to be rotatable. Nozzle 663 supplies cleaning fluid to substrate W placed on support plate 662. Water such as deionized water can be used as cleaning fluid. Cleaning chamber 660 supplies cleaning fluid to the central region of substrate W while rotating substrate W placed on support plate 662. Alternatively, while rotating substrate W, nozzle 663 can move linearly from the central region of substrate W or rotate to the edge region.

[0081] The post-exposure baking chamber 670 uses atomic rays to heat the substrate W on which the exposure process is performed. In the post-exposure baking process, the substrate W is heated to amplify the acid generated in the photoresist through exposure, thereby altering the properties of the photoresist. The post-exposure baking chamber 670 has a heating plate 672. The heating plate 672 is provided with a heating device 674, such as a hot wire or a thermoelectric device. The post-exposure baking chamber 670 may also include a cooling plate 671. The cooling plate 671 is provided with a cooling device 673, such as cooling water or a thermoelectric device. Alternatively, a baking chamber with only a cooling plate 671 may be provided.

[0082] As described above, the pre-processing module 601 and post-processing module 602 in the processing module 600 for pre- and post-exposure processing are configured to be completely separate from each other. Furthermore, the transfer chamber 630 of the pre-processing module 601 and the transfer chamber 680 of the post-processing module 602 can be configured to be of the same size and can be configured to completely overlap each other when viewed from above. Additionally, the protective layer coating chamber 610 and the cleaning chamber 660 can be configured to be of the same size and can be configured to completely overlap each other when viewed from above. Furthermore, the baking chamber 620 and the post-exposure baking chamber 670 can be configured to be of the same size so that they completely overlap each other when viewed from above.

[0083] Interface module 700 transfers substrate W between processing module 600 (for pre- and post-exposure processing) and exposure apparatus 1000. Interface module 700 includes frame 710, first buffer 720, second buffer 730, and interface robot 740. The first buffer 720, second buffer 730, and interface robot 740 are housed within frame 710. The first buffer 720 and second buffer 730 are placed separately from each other and arranged to stack on top of each other. The first buffer 720 is positioned higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to pre-processing module 601, and the second buffer 730 is positioned at a height corresponding to post-processing module 602. When viewed from above, the first buffer 720 is aligned with the transfer chamber 630 of pre-processing module 601 in a first direction 12, and the second buffer 730 is aligned with the transfer chamber 630 of post-processing module 602.

[0084] The interface robot 740 is positioned separately from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 transfers the substrate W between the first buffer 720, the second buffer 730, and the exposure apparatus 1000. The interface robot 740 has a structure that is substantially similar to that of the second buffer robot 560.

[0085] The first buffer 720 temporarily stores the substrate W processed at the pre-processing module 601 before it is moved to the exposure apparatus 1000. Furthermore, the second buffer 730 temporarily stores the substrate W, which has already been processed in the exposure apparatus 1000, before it is moved to the post-processing apparatus 602 for further processing. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and spaced apart from each other along a third direction. A substrate W is placed on each support 722. The housing 721 has openings toward the interface robot 740 and the pre-processing robot 632, allowing the interface robot 740 and the pre-processing robot to bring the substrate W into or out of the housing 721 through the openings. The second buffer 730 has a similar structure to the first buffer 720 for conveying the substrate W. However, the housing 4531 of the second buffer 730 has openings (not shown) in the direction of setting the interface robot 740 and the direction of setting the post-processing robot 682. As mentioned above, only the buffer and robot can be set up in the interface module, without setting up the chamber on the wafer to perform specific processes.

[0086] The resist coating chamber 410 can be configured as a substrate processing apparatus for applying photoresist to the substrate W described below.

[0087] Figure 6 This is a cross-sectional view showing the substrate processing apparatus in Figure 1.

[0088] refer to Figure 6 The substrate processing apparatus 800 is an apparatus for applying photoresist onto a substrate W. The substrate processing apparatus 800 may include a housing 810, a substrate support unit 830, a processing container 850, a lifting unit 840, a liquid supply unit 890, and a controller 880.

[0089] The housing 810 is configured in a rectangular cylindrical shape, containing a processing space 812. An opening (not shown) is formed on one side of the housing 810. The opening serves as an inlet through which the substrate W is transported. A door is installed at the opening, which opens and closes. When the substrate processing is in progress, the door closes the opening to seal the processing space 812 of the housing 810. An internal exhaust port 814 and an external exhaust port 816 are formed on the lower surface of the housing 810. Airflow formed in the housing 810 is discharged to the outside through the internal exhaust port 814 and the external exhaust port 816. According to an example, airflow provided in the processing container 850 can be discharged through the internal exhaust port 814, while airflow provided outside the processing container 850 can be discharged through the external exhaust port 816.

[0090] A substrate support unit 830 supports a substrate W within the processing space 812 of the housing 810. The substrate support unit 830 rotates the substrate W. The substrate support unit 830 includes a rotating head 832, a rotating shaft 834, and a driver 836. The rotating head 832 is configured as a substrate support member 832 supporting the substrate. The rotating head 832 is configured to have a circular plate shape. The substrate W contacts the upper surface of the rotating head 832. The rotating head 832 is configured to have a diameter smaller than that of the substrate W. In one embodiment, the rotating head 832 can vacuum-adsorb and clamp the substrate W. Alternatively, the rotating head 832 can be configured as an electrostatic chuck for clamping the substrate W using electrostatic force. Furthermore, the rotating head 832 can clamp the substrate W using physical force.

[0091] Meanwhile, during the cleaning process of container 850, cleaning fixture 900 ( Figure 8 (As shown) can be mounted on a rotating head 832. A rotating shaft 834 and a driver 836 are configured as rotational drive members 834 and 836 for rotating the rotating head 832. The rotating shaft 834 supports the rotating head 832 below it. The rotating shaft 834 extends vertically. The rotating shaft 834 is configured to be rotatable about its central axis. The driver 836 provides driving force to rotate the rotating shaft 834. For example, the driver 836 can be an engine capable of changing the rotational speed of the rotating shaft. The rotational drive members 834 and 836 can rotate the rotating head 832 at different rotational speeds depending on the substrate processing steps.

[0092] The processing container 850 provides a processing space 812 for performing the coating process. The processing container 850 is configured to surround the substrate support unit 830. The processing container 850 is configured as a cup shape with a top opening. The processing container 850 includes an inner cup 852 and an outer cup 862.

[0093] The inner cup 852 is configured as a circular cup shape around the rotation axis 834. When viewed from above, the inner cup 852 is positioned to overlap with the inner exhaust port 814. When viewed from above, the upper surface of the inner cup 852 is configured such that the outer region and the inner region of the inner cup 852 are inclined at different angles to each other. In one embodiment, the outer inclined wall 853 corresponding to the outer region of the inner cup 852 may be inclined downward as it moves away from the substrate support unit 830, and the inner inclined wall 854 corresponding to the inner region of the inner cup 852 may be inclined upward as it moves away from the substrate support unit 830. The portion where the outer and inner regions of the inner cup 852 connect to each other is substantially aligned with or slightly offset inward from the edge of the substrate W. The outer inclined wall 853 of the inner cup 852 may be configured as the area through which the processing liquid flows.

[0094] Simultaneously, a recessed portion, such as a pit 855, can be provided on the upper surface of the outer inclined wall 853 to recover the cleaning solution. During the cleaning process of the treatment container 850, the cleaning solution is recovered into the pit 855, and in subsequent liquid processing, the cleaning solution filling the pit prevents the photoresist solution falling onto the outer inclined wall 853 from solidifying. Therefore, when cleaning the treatment container 850, the photoresist solution on the outer inclined wall can be quickly cleaned. The cleaning solution used for cleaning the treatment container may contain a diluent.

[0095] The outer cup 862 is configured in a cup shape surrounding the substrate support unit 830 and the inner cup 852. The outer cup 862 may include a bottom wall 864, side walls 866, and an inclined wall 870. The bottom wall 864 is configured in a circular plate shape with an opening at its center. A recovery line 865 is formed on the bottom wall 864. The recovery line 865 recovers the processing liquid supplied to the substrate W. The processing liquid recovered by the recovery line 865 can be reused by an external liquid regeneration system. The side wall 866 is configured in a cylindrical shape surrounding the substrate support unit 830. The side wall 866 extends vertically from the side end of the bottom wall 864. The side wall 866 extends upward from the bottom wall 864.

[0096] An inclined wall 870 extends from the upper end of the side wall 866 toward the inner side of the outer cup 862. The inclined wall 870 is configured to slope upward and inward as it travels upward closer to the substrate support unit 830. The inclined wall 870 is configured to have an annular shape. The upper end of the inclined wall 870 is positioned above the substrate W supported by the substrate support unit 830.

[0097] The inclined wall 870 has a first protrusion 872, a second protrusion 874, a first recess 876, and a second recess 878 (see...) Figure 7 ).

[0098] The first protrusion 872 protrudes from the inner surface of the inclined wall 870. Preferably, the first protrusion 872 protrudes such that its end is below the upper surface of the cleaning fixture (or substrate); for example, the first protrusion 872 protrudes downward beyond the upper surface of the fixture. When cleaning the treatment container 850, from the cleaning fixture 900 ( Figure 8 As shown, the spilled cleaning fluid collides with the first protrusion 872. The cleaning fluid that collides with the first protrusion 872 falls onto the upper surface (outer inclined wall) of the inner cup 852 to clean the surface of the inner cup 852, and partially flows along the second recess 878 to clean the surface of the inclined wall 870.

[0099] like Figure 7 As shown, during the liquid processing of the substrate, the processing liquid (e.g., photoresist liquid) spilled from the substrate collides with the inner surface 872b of the first protrusion 872. That is, the first protrusion 872 can prevent the processing liquid from spilling onto the outside of the outer cup 862 (e.g., to the sidewall 866) and causing contamination.

[0100] In addition, such as Figure 8 As shown, during the cleaning process of the treatment container 850, the cleaning fluid spilled from the cleaning fixture 900 impacts the inner surface 872b of the first protrusion 872. Furthermore, the first protrusion 872, for example, its outer surface 872a, prevents backflow generated in the recovery path between the outer cup 862 and the inner cup 852 (caused by...). Figure 7 and Figure 8 (The dashed lines in the text represent...)

[0101] The second protrusion 874 protrudes from the inner surface of the inclined wall 870 toward the inner cup 852. The second protrusion 874 may be formed separately from the first protrusion 872 and closer to the center of the processing container 850 than the first protrusion 872. The second protrusion 874 is formed at a position higher than the first protrusion 872. For example, the second protrusion 874 may protrude such that the end of the second protrusion 874 is higher than the upper surface of the clamp (or substrate).

[0102] like Figure 7 As shown, a second protrusion 874 can be provided to prevent obstruction or collision with the processing liquid (e.g., photoresist liquid) spilling from the substrate during the liquid processing steps of the substrate. Figure 8 As shown, a second protrusion 874 can be provided so as not to obstruct or collide with the cleaning fluid spilling from the cleaning fixture 900 during the cleaning process. However, as Figure 8As shown, the second protrusion 874 prevents the cleaning fluid that collides with the inner surface 872b of the first protrusion 872 from flowing along the second recess 878 to the substrate.

[0103] A first recess 876 is formed on the inner surface of an inclined wall 870 between a first vertical wall 866 and a first protrusion 872. In the first recess 876, a vortex of the flow V flowing back in the recycling path is formed between the outer cup and the inner cup, and the flow V flows back along the vertical wall 866 and the inclined wall 870, then flows along the outer surface 872a of the first protrusion 872 towards the inner cup 852. In other words, the first recess 876 and the first protrusion 872 prevent the flow V flowing back in the recycling path between the outer cup 862 and the inner cup 852 from flowing towards the substrate.

[0104] The second recess 878 is formed between the first protrusion 872 and the second protrusion 874.

[0105] The lifting unit 840 raises and moves the inner cup 852 and the outer cup 862 respectively. The lifting unit 840 includes an inner moving member 842 and an outer moving member 844. The inner moving member 842 moves the inner cup 852 vertically, and the outer moving member 844 moves the outer cup 862 vertically.

[0106] The liquid supply unit 890 can selectively supply various types of processing liquids to the substrate W.

[0107] refer to Figure 6 In one embodiment, the liquid supply unit 890 may include a first supply member 890a and a second supply member 890b for supplying a processing liquid to the substrate W. The first supply member 890a and the second supply member 890b may each include nozzles 892a and 892b and nozzle moving members 894a and 894b. The first supply member 890a supplies the processing liquid for a coating process onto the substrate. The second supply member 890b supplies a cleaning liquid for cleaning the processing container 850. The cleaning liquid may contain a diluent. The nozzles can be moved to a processing position or a standby position via the nozzle moving members. Here, the processing position is the position where the nozzles are positioned facing the substrate W placed on the rotating jig 832 or the cleaning jig. The standby position is a position other than the processing position. For example, the processing liquid may be a highly sensitive liquid such as photoresist or rinsing solution.

[0108] The effects of this invention are not limited to those described above, and those skilled in the art will clearly understand any unmentioned effects from the specification and drawings. Although preferred embodiments of the invention have been illustrated and described to date, the invention is not limited to the specific embodiments described above, and it should be noted that those skilled in the art can implement the invention in various ways without departing from the essence of the inventive concept claimed in the claims, and modifications should not be interpreted separately from the technical spirit or prospect of the invention.

Claims

1. A liquid handling apparatus, comprising: A processing container comprising an outer cup and an inner cup disposed inside the outer cup, the combination of the inner cup and the outer cup defining a recovery path for recovering liquid; A rotatable rotating head is placed inside the processing container, and a cleaning fixture is placed on the rotating head; The processing container includes a first protrusion extending from the inner surface of the outer cup to guide cleaning fluid spilled from the cleaning fixture toward the surface of the inner cup. The outer cup includes: The bottom wall is configured as a circular plate with an opening; A vertical wall that extends vertically upward from the side end of the bottom wall; An inclined wall, the inclined wall sloping inward and upward from the top of the vertical wall; and A second protrusion protrudes from the inner surface of the inclined wall toward the inner cup and is positioned separately from the first protrusion, which is closer to the inner side. The first protrusion is disposed in the inner surface of the inclined wall. The second protrusion is positioned outside the edge of the cleaning fixture.

2. The liquid handling apparatus according to claim 1, wherein, The first protrusion is formed to protrude such that the cleaning fluid falling from the cleaning fixture collides with the first protrusion.

3. The liquid handling apparatus according to claim 1, wherein, The first protrusion and the second protrusion are arranged in annular shape on the inclined wall.

4. The liquid handling apparatus according to claim 1, wherein, The outer cup includes: A first recess, located between the vertical wall and the first protrusion; and The second recess is located between the first protrusion and the second protrusion.

5. The liquid handling apparatus according to claim 1, wherein, The inner cup includes recesses on its upper surface for recovering the cleaning fluid.

6. The liquid handling apparatus according to claim 5, wherein, The inner cup includes: The inner inclined wall that is inclined upward away from the rotating head and below the cleaning clamp, and An outer inclined wall, connected to the inner inclined wall and inclined downwards away from the rotating head, and the outer inclined wall and the outer cup together define the recycling path. The recess is located on the upper surface of the outwardly inclined wall.

7. The liquid handling apparatus according to claim 5, wherein, The recess is formed to be aligned with the space between the first protrusion and the second protrusion.

8. A processing container configured to surround a rotating head, comprising: An outer cup, the outer cup comprising a vertical wall and an inclined wall that slopes inward and upward from the top of the vertical wall; An inner cup is placed inside the outer cup, and the combination of the inner cup and the outer cup defines a recovery path for recovering liquid. The outer cup further includes: A first protrusion protrudes from the inner surface of the inclined wall toward the inner cup; The bottom wall is configured as a circular plate with an opening; A second protrusion protrudes from the inner surface of the inclined wall toward the inner cup and is positioned separately from the first protrusion, which is closer to the inner side. The vertical wall extends vertically upward from the side end of the bottom wall. The first protrusion is disposed in the inner surface of the inclined wall. The second protrusion is positioned outside the edge of the cleaning fixture.

9. The processing container according to claim 8, wherein, The first protrusion is positioned below the substrate placed on the rotating head.

10. The processing container according to claim 9, wherein, The second protrusion is located at a position away from the substrate on which the rotating head is placed.

11. The processing container according to claim 9, wherein, The first protrusion and the second protrusion are arranged in annular shape on the inclined wall.

12. The processing container according to claim 9, wherein, The outer cup includes: The first recess between the vertical wall and the first protrusion, and A second recess between the first protrusion and the second protrusion.

13. The processing container according to claim 9, wherein, The inner cup includes: The inner inclined wall that is inclined upward away from the rotating head and below the cleaning clamp, and An outer inclined wall, connected to the inner inclined wall and inclined downwards away from the rotating head, and the outer inclined wall and the outer cup together define the recycling path. The outer inclined wall includes recesses on its upper surface for recovering cleaning fluid.

14. The processing container of claim 13, wherein the recess is formed to be spatially aligned with the space between the first protrusion and the second protrusion.

15. A liquid handling apparatus, comprising: A processing container comprising an outer cup and an inner cup disposed inside the outer cup, the combination of the inner cup and the outer cup defining a recovery path for recovering liquid; A rotatable rotating head is placed inside the processing container, and a cleaning fixture is placed on the rotating head; as well as A cleaning fluid nozzle sprays cleaning fluid onto the top surface of the cleaning fixture to clean the processing container. The outer cup includes: The bottom wall is configured as a circular plate with an opening; A vertical wall that extends vertically upward from the side end of the bottom wall; An inclined wall, which slopes inward and upward from the top of the vertical wall, has a first protrusion that collides with the cleaning fluid spilling from the cleaning clamp to direct the cleaning fluid toward the surface of the inner cup; and The second protrusion protrudes from the inner surface of the inclined wall toward the inner cup and is positioned separately from the first protrusion which is closer to the inner side; The second protrusion is positioned outside the edge of the cleaning fixture.

16. The liquid handling apparatus according to claim 15, wherein, The outer cup includes: The first recess between the vertical wall and the first protrusion; and The second recess between the first protrusion and the second protrusion.

17. The liquid handling apparatus according to claim 16, wherein, The inner cup includes: An inner inclined wall that is inclined upward away from the rotating head and below the cleaning clamp; and An outer inclined wall, connected to the inner inclined wall and inclined downwards away from the rotating head, and the outer inclined wall and the outer cup together define the recycling path. The outer inclined wall includes a recess on its upper surface, which is aligned with the space between the first protrusion and the second protrusion, and the recess collects the cleaning fluid that falls onto the outer inclined wall.

Images