An automatically replaceable silicon wafer cleaning device and cleaning method

Abstract

The present invention provides an automatically detachable silicon wafer cleaning device, which includes a carrier, a cleaning tank assembly, an adjusting assembly, and a cleaning assembly. A plurality of accommodating cavities are provided in the carrier. The cleaning tank assembly includes a processing frame corresponding to the accommodating cavity and a control member provided on the carrier. A position grating and a code reader are provided on the cavity wall of the accommodating cavity. A code chip is attached to the side wall of the processing frame, and the code reader can read the information of the code chip to confirm the function of the processing frame. The control member includes a moving frame. The adjusting assembly includes a pulling column, a cover cylinder, and a lifting plate. The lifting plate is movably installed on the moving frame, and the cover cylinder is installed on the moving frame. The cover cylinder is detachably installed on the pulling column. The cleaning assembly includes a carrying basket, and the carrying basket can carry the silicon wafer into the processing frame. The processing frame is automatically arranged by the moving frame and the adjusting assembly according to the silicon wafer cleaning process, which can reduce the preparation time of the cleaning solution and improve the cleaning efficiency of the silicon wafer.

Description

Technical Field

[0001] The invention relates to the technical field of cleaning devices, and in particular to a detachable silicon wafer cleaning device and a cleaning method. Background Art

[0002] When cleaning silicon wafers, due to the different contents of trace elements in silicon wafers and different processing techniques of silicon wafers, different cleaning solutions need to be selected according to the conditions of the silicon wafers during cleaning. The silicon wafers are placed in different cleaning solutions in turn according to the scheduled cleaning sequence, and the components of the silicon wafers are replaced, thereby achieving thorough cleaning of the silicon wafers. In this process, the impurities on the silicon wafers are different, and the components of the cleaning solutions required are also different. The cleaning sequence of silicon wafers in different processing steps is also different. Therefore, before cleaning the silicon wafers, it is necessary to prepare the corresponding cleaning solutions in advance, and arrange the cleaning solutions in accordance with the cleaning sequence, and then clean the silicon wafers in each cleaning solution in sequence. The process of preparing the cleaning solution in advance increases the process of silicon wafer cleaning, resulting in the silicon wafer cleaning work being too cumbersome, affecting the efficiency of the silicon wafer cleaning process. Summary of the invention

[0003] The technical problem to be solved by the present invention is to reduce the cleaning efficiency of silicon wafers in the process of preparing cleaning solution for silicon wafers.

[0004] The technical solution adopted by the present invention to solve its technical problem is: an automatically detachable silicon wafer cleaning device, comprising a carrier, a cleaning pool assembly installed in the carrier, an adjustment assembly for adjusting the cleaning pool assembly, and a cleaning assembly that can extend into the cleaning pool assembly, wherein the carrier is provided with a plurality of parallel accommodating cavities, the cleaning pool assembly comprises a processing frame corresponding to the accommodating cavities and a control member arranged on the carrier, a position grating and a code reader are arranged on the cavity wall of the accommodating cavity, a code chip is attached to the side wall of the processing frame, and the code reader can read The information of the code chip is obtained to confirm the function of the processing frame. The control component includes a movable frame that moves along the supporting frame. The adjusting component includes a pulling column installed on the processing frame, a cover cylinder corresponding to the pulling column, and a lifting plate. The lifting plate is movably installed on the movable frame. The cover cylinder is installed on the movable frame. After the lifting plate moves on the movable frame, the cover cylinder can be pluggably installed on the pulling column. The cleaning component includes a movably mounted supporting basket on the movable frame. The supporting basket can carry silicon wafers into the processing frame.

[0005] Furthermore, a control board is fixedly mounted on the carrier frame, the control board is arranged corresponding to the accommodating cavity, and the code reader is fixedly mounted on the control board.

[0006] Further, a control block is installed on the processing frame, and the reader is arranged corresponding to the control block.

[0007] Further, the control member further includes a travel track plate installed on both sides of the carrier. The travel track plate is convexly provided with track bars, and the moving frame is movably installed on the track bars.

[0008] Further, a plurality of sliding angle columns are installed on the moving frame, and the sliding angle columns are slidably installed on the track bars.

[0009] Further, the cleaning assembly further includes a fixing frame installed on the moving frame. A driving screw is rotatably inserted through the middle position of the fixing frame. One end of the driving screw rotatably penetrates the moving frame, and the other end of the driving screw is fixedly inserted into the cleaning basket. A driving member is installed on the fixing frame, and the driving member can control the driving screw to move relative to the fixing frame.

[0010] Further, the driving member includes a rotating sleeve fixedly installed on the fixing frame and a control ring rotatably sleeved inside the rotating sleeve. The inner wall of the control ring is cooperatively sleeved on the driving screw.

[0011] Further, a rotation stopping crank column is fixedly installed on the fixing frame, a rotation stopping groove is formed on the driving screw, and one end of the rotation stopping crank column away from the fixed column is slidably inserted into the rotation stopping groove.

[0012] Further, a method for cleaning a silicon wafer, using the automatically replaceable silicon wafer cleaning device according to any one of the above, includes the following steps:

[0013] Step S1: The silicon wafer information and the corresponding cleaning process are both programmed into the control terminal; Step S2: The control terminal establishes a cleaning program according to the cleaning process of the silicon wafer, and compares the chip information of the processing frame to detect the processing frames in the carrier that do not meet the cleaning program; Step S3: Drive the moving frame to move along the carrier to take out the processing frames that do not meet the cleaning program from the moving frame; Step S4: Drive the moving frame to move relative to the processing frame, and use the adjustment assembly on the moving frame to schedule the processing frames in the carrier according to the cleaning program in Step S2; Step S5: The moving frame drives the silicon wafer to move sequentially between each processing frame through the carrier basket to complete the cleaning process of the silicon wafer.

[0014] The beneficial effects of the present invention are as follows. With the aid of the adjustment component on the moving frame, the processing box in the processing box component can be adjusted to be sorted according to the cleaning process of the silicon wafer. After the lifting plate on the moving frame drives the cover cylinder to move onto the pulling column, with the cooperation between the cover cylinder and the pulling column, the processing box can be taken out from the accommodating cavity, and the relative positions of the various processing boxes can be adjusted by means of the moving frame. According to the cleaning method of the silicon wafer, the processing boxes are arranged until the scheduling of the processing boxes is applicable to the cleaning process of the silicon wafer. The moving frame carries the carrying basket and the silicon wafer and moves along the carrying rack. Since the processing boxes adapted to the cleaning process of the silicon wafer are automatically arranged by the moving frame and the adjustment component, the preparation work can be quickly completed before the silicon wafer is cleaned, improving the cleaning efficiency of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Figure 1 is a perspective view of the silicon wafer cleaning device of the present invention;

[0017] Figure 2 is Figure 1 top view of;

[0018] Figure 3 is along Figure 2 A-A cross-sectional view in;

[0019] Figure 4 is along Figure 2 B-B cross-sectional view in;

[0020] Figure 5 is a flow chart of the silicon wafer cleaning method of the present invention;

[0021] In the figure: silicon wafer cleaning device 100, carrying rack 10, cleaning tank component 20, adjustment component 30, cleaning component 40, cross bar 110, vertical rod 120, accommodating partition 130, accommodating cavity 131, control board 140, processing box 210, control part 220, position grating 211, control block 212, reader 132, travel track board 221, moving frame 222, track bar 223, sliding corner post 224, pulling column 310, cover cylinder 320, lifting plate 330, control column 331, fixed frame 410, carrying basket 430, driving screw 420, driving part 411, rotating sleeve 412, control ring 413, anti-rotation groove 312, anti-rotation turning post 313. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limitations of the present invention. On the contrary, embodiments of the present invention include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0023] like Figures 1 to 4 As shown, the present invention provides an automatically detachable silicon wafer cleaning device 100, comprising a carrier frame 10, a cleaning pool assembly 20 installed in the carrier frame 10, an adjusting assembly 30 for adjusting the cleaning pool assembly 20, and a cleaning assembly 40 that can extend into the cleaning pool assembly 20.

[0024] The support frame 10 includes a plurality of cross bars 110 and vertical bars 120, which are connected end to end, and the support frame 10 is a hollow rectangular structure formed by splicing the cross bars 110 and the vertical bars 120. A accommodating partition 130 is provided in the support frame 10, and the support frame 10 is divided into a plurality of parallel accommodating cavities 131 by the accommodating partition 130. The support frame 10 also includes a control panel 140 set on the sides of the cross bars 110 and the vertical bars 120, and the control panel 140 blocks the side openings of each accommodating cavity 131.

[0025] The cleaning pool assembly 20 includes a processing frame 210 corresponding to the accommodating cavity 131 and a control member 220 arranged on the carrier 10. The processing frame 210 is movably inserted into the accommodating cavity 130. A position grating 211 is arranged on the side wall of the processing frame 210 corresponding to the accommodating partition 130. A control block 212 is arranged on the side of the processing frame 210 corresponding to the control board 140. A reader 132 corresponding to the control block 212 is convexly arranged on the control board 140. Specifically, a position grating 211 is attached to the control block 212. The code chip is a sticker with a QR code or a bar code. The control board 140 is provided with a code reader corresponding to the control block 212. When the control block 212 and the code reader are aligned, the code reader can analyze the information on the code chip. The QR code or bar code on the code chip is made according to the composition of the cleaning liquid stored in the processing frame 210, that is, the code reader can determine the composition of the cleaning liquid according to the content of the QR code or the bar code, thereby determining the application mode of the processing frame 210, to ensure the smooth progress of the silicon wafer cleaning process.

[0026] The control member 220 includes a travel track plate 221 and a movable carriage 222 disposed on the travel track 221. There are at least two travel track plates 221, which are respectively arranged on both sides of the carrier 10 and the control board 140. A track bar 223 protrudes from the travel track plate 221 and is arranged parallel to the control board 140. The carriage 222 is movably mounted on the track bar 223. Preferably, a number of symmetric sliding angle columns 224 are mounted on the carriage 222, and the sliding angle columns 224 are inserted into the track bar 223 in a matching manner. After being driven, the sliding angle columns 224 can drive the carriage 222 to move along the track bar 223. The method of driving the sliding angle columns 224 to move on the track bar 223 can be pneumatic cylinder drive, chain and gear drive, or lead screw linear drive. In this embodiment, the driving method of the carriage 222 is not specifically limited.

[0027] The adjustment assembly 30 includes a number of pulling columns 310 mounted on the processing frame 210, a cover cylinder 320 arranged corresponding to the pulling columns 310, and a lifting plate 330. The pulling columns 310 are fixedly mounted on the processing frame 210. The lifting plate 330 is arranged parallel above the processing frame 210. The cover cylinder 320 is mounted on the lifting plate 330 corresponding to the pulling columns 310. A control column 331 is mounted on the side of the lifting plate 330 facing away from the cover cylinder 320. A chain (not shown in the figure) is connected to the control column 331 and can be wound and collected on a spool (not shown in the figure) through the carriage 222. The spool is driven to rotate by a motor. When the spool is driven by the motor to rotate, the chain can be released, thereby driving the lifting plate 330 to move on the carriage 222 until the cover cylinder 320 can be tightly sleeved on the pulling column 310. Preferably, there is a threaded fit between the cover cylinder 320 and the pulling column 310, and the cover cylinder 320 is rotatably mounted on the lifting plate 330. After the cover cylinder 320 contacts the pulling column 310, the cover cylinder 320 can be covered on the pulling column 310 by rotation. After the sleeving process of the cover cylinder 320 is completed, the motor is started again to drive the spool to rotate in the reverse direction. Under the pulling of the chain, when the lifting plate 330 is lifted and lowered again, the processing frame 210 can be moved out of a certain accommodating cavity 131, and then the carriage 222 is driven to move along the track bar 223 to move the processing frame 210 out of the carriage 222 or move it to another accommodating cavity 131 to complete the sorting of the processing frame 210.

[0028] The cleaning component 40 includes a fixing frame 410 fixedly installed on the moving frame 222 and a carrying basket 430 movably installed on the moving frame 222. The fixing frame 410 has a cross structure, and the ends of the fixing frame 410 are fixedly installed on the moving frame 222. A driving screw 420 is rotatably inserted through the middle position of the fixing frame 410. The driving screw 420 vertically extends into the processing frame 210. A driving member 411 is installed at the end of the driving screw 420 penetrating through the moving frame 222. The carrying basket 430 is rotatably installed on the other end of the driving screw 420. Preferably, the driving member 411 includes a rotating sleeve 412 fixedly installed on the fixing frame 410 and a control ring 413 sleeved on the rotating sleeve 412. The control ring 413 is rotatably sleeved on the rotating sleeve 412. The outer side of the control ring 413 is connected to the rotating sleeve 412, and the inner side of the control ring 413 is fitted and sleeved on the driving screw 420. Preferably, a rotation stopping groove 312 is formed on the driving screw 420. The rotation stopping groove 312 is a strip-shaped groove axially formed along the driving screw 420. A rotation stopping crank pin 313 corresponding to the rotation stopping groove 312 is installed on the fixing frame 410. One end of the rotation stopping crank pin 313 is installed on the fixing frame 410, and the other end is slidably inserted into the rotation stopping groove 312.

[0029] When the control ring 413 rotates on the rotating sleeve 412, it can drive the driving screw 420 to rotate relative to the carrying basket 430, causing the driving screw 420 to move relative to the fixing frame 410. Driven by the driving screw 420, the carrying basket 430 can move relative to the processing frame 210, prompting the silicon wafer to enter the processing frame 210 for silicon wafer processing such as etching and cleaning of the silicon wafer.

[0030] During the use of the above-mentioned silicon wafer cleaning device 100, before cleaning the silicon wafer, first prepare the corresponding processing frame 210. That is, different types of cleaning solutions can be stored in a part of the processing frame 210, and the other part of the processing frame 210 can be used for drying, purging, etc. According to the production process of the silicon wafer and the composition of the silicon wafer, adjust the composition of the cleaning solution, that is, prepare and debug a variety of cleaning solutions. Then place the silicon wafer to be cleaned on the carrier basket 430, and place the cleaning solutions into the processing frame 210 in sequence according to the cleaning order. Specifically, after the processing frame 210 is placed in the accommodation cavity 131, the code reader in the accommodation cavity 131 reads the code chip on the processing frame 210 to determine the composition of the cleaning solution placed in the corresponding accommodation cavity 131. Then move the moving frame 222 to make the carrier basket 430 carrying the silicon wafer move above the corresponding processing frame 210. By driving the driving screw 420, the carrier basket 430 can be driven to descend into the processing frame 210. After soaking and cleaning for a certain time, the carrier basket 430 is pulled out of the processing frame 210 again by the driving screw 420, and is moved to above the next processing frame 210 by means of the moving frame 222, repeating the descending cleaning process to complete the cleaning process of the silicon wafer in the carrier basket 430.

[0031] The use process of the above-mentioned silicon wafer cleaning device 100 can be algorithmically controlled by a computer program. Specifically, as Figure 5 shown, it includes the following steps:

[0032] Step S1: Input the silicon wafer information into the control terminal. The control terminal judges the cleaning order of the silicon wafer according to the silicon wafer information. Specifically, establish a composition database of various cleaning liquids according to the silicon wafer information. After the control terminal identifies the attribution information of the silicon wafer, screen and establish the corresponding cleaning program.

[0033] Step S2: The control terminal detects the cleaning liquids in each processing frame 210 according to the cleaning program and judges whether the cleaning liquids in each processing frame 210 meet the cleaning requirements. Specifically, the control terminal judges the composition of the cleaning liquid in the processing frame 210 through the code reader and the code chip, and compares the code chip information with the cleaning program information screened in step S1.

[0034] Step S3: According to the comparison result in step S2, clean the processing frame 221 that does not conform to the cleaning program information. Specifically, when the code chip information of the processing frame 210 does not conform to the cleaning program information, the moving frame 222 moves along the travel track plate 221 to above the processing frame 210 that does not conform to the cleaning program information. With the aid of the adjustment component 30 on the moving 222, the processing frame 210 is moved out until the processing frame 210 moves above the vacant accommodation cavity 130, and the moving frame 222 can place the processing frame 210 into the vacant accommodation cavity 130.

[0035] Step S4: Schedule the processing frames 210 in the accommodation cavity 130 of the carrier 10. According to the cleaning program information of the silicon wafers, the moving frame 222 moves successively above the corresponding processing frames 210 in the cleaning order, and according to the cleaning program information of the silicon wafers, the processing frames 210 are taken out of the original accommodation cavity 131 by means of the adjustment assembly 30 and are successively placed in the corresponding accommodation cavities 131 according to the cleaning order.

[0036] Step S5: The moving frame 222 carries the silicon wafers to be cleaned, moves above the corresponding processing frames 210 according to the cleaning program of the silicon wafers, and moves the silicon wafers into the processing frames 210 by means of the carrier basket 430 in the cleaning assembly 40 to perform cleaning processing on the silicon wafers.

[0037] Through the above algorithm control, before cleaning the silicon wafers, the operator classifies and marks the silicon wafers according to the processing types of the silicon wafers, arranges different cleaning orders according to the marks of the silicon wafers, stores the cleaning orders in the database in programming language, then the silicon wafers can be placed in the carrier basket 430, and the marks of the silicon wafers are input on the control terminal. According to the classification marks of the silicon wafers, the moving frame 222 can arrange the processing frames 210 on the carrier 10 until the arrangement order of the processing frames 210 on the carrier 10 meets the cleaning process of the silicon wafers. Then the moving frame 210 drives the carrier basket 430 and the silicon wafers to enter the processing frames 210 successively until the cleaning process of the silicon wafers is completed.

[0038] Inspired by the ideal embodiments of the present invention as described above, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An automatically replaceable silicon wafer cleaning device, characterized in that: The invention comprises a carrier frame, a cleaning pool assembly installed in the carrier frame, an adjusting assembly for adjusting the cleaning pool assembly and a cleaning assembly which can extend into the cleaning pool assembly, wherein a plurality of parallel accommodating cavities are arranged in the carrier frame, the cleaning pool assembly comprises a processing frame corresponding to the accommodating cavity and a control member arranged on the carrier frame, a position grating and a code reader are arranged on the cavity wall of the accommodating cavity, a code chip is attached to the side wall of the processing frame, the code reader reads the information of the code chip and confirms the function of the processing frame, the control member comprises a movable frame which moves along the carrier frame, the adjusting assembly comprises a pulling column installed in the processing frame, a cover tube arranged corresponding to the pulling column and a lifting plate, the lifting plate is movably installed on the movable frame, the cover tube is installed on the movable frame, after the lifting plate moves on the movable frame, the cover tube can be pluggably installed on the pulling column, the cleaning assembly comprises a movably mounted carrying basket on the movable frame, the carrying basket carries silicon wafers into the processing frame.

2. The automatic silicon wafer cleaning device according to claim 1, wherein: A control board is fixedly mounted on the carrier frame, the control board is arranged corresponding to the accommodating cavity, and the code reader is fixedly mounted on the control board.

3. The automatic silicon wafer cleaning device according to claim 2, wherein: A control block is installed on the processing frame, and the code reader is arranged corresponding to the control block.

4. The automatic silicon wafer cleaning device according to claim 1, characterized in that: The control component also includes a travel track plate, which is installed on both sides of the support frame. The travel track plate is protruded with a track bar, and the movable frame is movably installed on the track bar.

5. The automatic silicon wafer cleaning device according to claim 4, characterized in that: A plurality of sliding corner posts are installed on the movable frame, and the sliding corner posts can be slidably installed on the track bar.

6. The automatic silicon wafer cleaning device according to claim 1, wherein: The cleaning assembly also includes a fixed frame installed on the movable frame, a driving screw is rotatably inserted in the middle position of the fixed frame, one end of the driving screw rotatably passes through the movable frame, and the other end of the driving screw is fixedly inserted in the supporting basket. A driving member is installed on the fixed frame, and the driving member controls the movement of the driving screw relative to the fixed frame.

7. The automatic silicon wafer cleaning device according to claim 6, wherein: The driving member comprises a rotating sleeve fixedly mounted on the fixing frame and a control ring rotatably sleeved on the rotating sleeve, and the inner wall of the control ring is sleeved on the driving screw in a matching manner.

8. A silicon wafer cleaning device capable of automatic replacement according to claim 7, characterized in that: A rotation-stopping column is fixedly mounted on the fixing frame, a rotation-stopping groove is formed on the driving screw rod, and an end of the rotation-stopping column away from the fixing frame can be slidably inserted into the rotation-stopping groove.

9. A cleaning method for a silicon wafer, applied to the automatically replaceable silicon wafer cleaning device according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step S1: The silicon wafer information and the corresponding cleaning process are programmed into the control terminal; Step S2: the control terminal establishes a cleaning program according to the cleaning process of the silicon wafer, and compares the chip information of the processing frame to detect the processing frame in the carrier that does not meet the cleaning program; Step S3: driving the moving rack to move along the carrier rack, removing the processing frames that do not meet the cleaning procedure from the Take it out from the mobile rack; Step S4: driving the movable frame to move relative to the processing frame, using the adjustment components on the movable frame, Scheduling the processing frames in the carrier according to the cleaning procedure in step S2; Step S5: The mobile rack drives the silicon wafer to move in sequence between the processing frames through the carrying basket. Complete the cleaning process of the silicon wafer.

Images