Package structure

Abstract

The present invention discloses a packaging structure. The packaging structure includes a first electrode pair, a second electrode pair, a third electrode pair, and a body. The body covers the first electrode pair, the second electrode pair, and the third electrode pair. The body includes a first containing groove, a second containing groove, and a third containing groove, the first containing groove, the second containing groove, and the third containing groove respectively correspond to the positions of the first electrode pair, the second electrode pair, and the third electrode pair, and the opening area of ​​the first containing groove is larger than the opening areas of the second containing groove and the third containing groove.

Description

Technical Field

[0001] The invention relates to a packaging structure, in particular to a packaging structure suitable for being applied to a monitoring system for face capture or an identification system for license plate recognition. Background Art

[0002] In existing surveillance systems for face capture or license plate recognition, most use infrared light emitting diodes as sensing light sources. However, part of the light emitted by infrared light emitting diodes still falls within the red light range, so the appearance of traditional systems will have red bright spots (erythema phenomenon), which easily attracts people's attention, and cannot achieve the desired monitoring effect or affect the safety of passers-by.

[0003] In order to eliminate this red spot phenomenon, some industry insiders have tried to package infrared light emitting diodes and blue light emitting diodes in a single bowl-shaped PLCC6 bracket, and add phosphors to the packaging glue to form a light-emitting device. The blue light emitting diode and the phosphors form white light, which neutralizes the red spot produced by the red light emitting diode. However, in the design of this light-emitting device, the phosphors will also be laid on the red light emitting diode, causing red light energy loss. In addition, the traditional PLCC6 bracket is designed with bent pins, which is bulky and not conducive to the miniaturization of terminal products. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a packaging structure to address the deficiencies of the prior art.

[0005] One embodiment of the present invention discloses a packaging structure, which includes: a first electrode pair, a second electrode pair and a third electrode pair; and a main body, covering the first electrode pair, the second electrode pair and the third electrode pair, the main body includes a first receiving groove, a second receiving groove and a third receiving groove, the first receiving groove, the second receiving groove and the third receiving groove respectively correspond to the positions of the first electrode pair, the second electrode pair and the third electrode pair, and the opening area of ​​the first receiving groove is larger than the opening areas of the second receiving groove and the third receiving groove.

[0006] Optionally, the first containing groove, the second containing groove and the third containing groove further have a first opening, a second opening and a third opening, respectively; in the top view of the packaging structure, the area of ​​the first opening is 2 to 3 times that of the second opening, and the area of ​​the first opening is 2 to 3 times that of the third opening.

[0007] Optionally, an area of ​​the second opening is equal to an area of ​​the third opening.

[0008] Optionally, a shape of the second opening is 180 degrees symmetrical to a shape of the third opening.

[0009] Optionally, the main body further includes a first partition wall and a second partition wall, the first partition wall is located between the first containing groove and the second containing groove, the second partition wall is located between the first containing groove and the third containing groove, and the first partition wall and the second partition wall each have two curved sections.

[0010] Optionally, the height of the first partition wall is equal to the height of the second partition wall.

[0011] Optionally, one of the curved sections included in the first partition wall is bent toward the second containing groove, and the other curved section is bent toward the first containing groove; one of the curved sections included in the second partition wall is bent toward the third containing groove, and the other curved section is bent toward the first containing groove.

[0012] Optionally, the main body further includes a first low wall, a second low wall and a third low wall, and the first low wall, the second low wall and the third low wall are respectively arranged in the first containing groove, the second containing groove and the third containing groove.

[0013] Optionally, the main body includes an auxiliary low wall, the first electrode pair includes an auxiliary embedding portion, and the auxiliary low wall and the auxiliary embedding portion are embedded with each other and cover a portion of the first electrode pair.

[0014] Optionally, the width of the two end portions of the first containing groove is smaller than the width of the middle portion of the first containing groove.

[0015] Optionally, shapes of two sides of the first containing groove are geometrically matched with shapes of sides of the adjacent second containing groove and shapes of sides of the adjacent third containing groove.

[0016] Optionally, the width of the two end portions of the second containing groove is greater than the width of the middle portion of the second containing groove, and the width of the two end portions of the third containing groove is greater than the width of the middle portion of the third containing groove.

[0017] In summary, when the packaging structure of the present invention is applied to the light-emitting device in the monitoring system for face capture or the identification system for license plate recognition, since the opening area of ​​the first container is larger than the opening area of ​​the second container and the third container, and is used to accommodate the packaging glue, the problem of red light energy loss caused by the packaging glue with phosphor powder being laid on the red light-emitting diode in the light-emitting device in the conventional monitoring system for face capture or the identification system for license plate recognition will not occur.

[0018] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 , Figure 2 and Figure 3 Schematic diagrams of the light-emitting device of the present invention at different viewing angles.

[0020] Figure 4 It is a partial exploded schematic diagram of the light emitting device of the present invention.

[0021] Figure 5 It is a schematic diagram of the light emitting device of the present invention without the first encapsulation colloid, the second encapsulation colloid and the third encapsulation colloid.

[0022] Figure 6 for Figure 5 Schematic top view of .

[0023] Figure 7 Schematic diagram of the first electrode pair, the second electrode pair and the third electrode pair of the light-emitting device of the present invention.

[0024] Figure 8 for Figure 7 Top view of the .

[0025] Fig. 9 FIG. 4 is a schematic diagram of the first electrode pair, the second electrode pair and the third electrode pair of the light-emitting device of the present invention from another viewing angle.

[0026] Fig.10 For along Figure 5 Schematic diagram of the cross section after being cut through the section line X.

[0027] Fig.11 For along Figure 5 A schematic cross-sectional view of the section line XI.

[0028] Fig.12 For along Figure 5 Schematic diagram of the cross section after cutting along section line XII.

[0029] Fig.13 For along Figure 5 A schematic cross-sectional view of the section line XIII.

[0030] Fig.14 It is a schematic diagram of another embodiment of the light emitting device of the present invention, in which the first encapsulation colloid, the second encapsulation colloid and the third encapsulation colloid are not provided.

[0031] Fig.15 The figure is a top view schematically showing a first electrode pair, a second electrode pair and a third electrode pair of a plurality of light-emitting devices of the present invention during the manufacturing process. DETAILED DESCRIPTION

[0032] In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the related contents described in the subsequent description appear in the specific figure, but it does not limit the subsequent description to only refer to the specific figure.

[0033] Please also read Figures 1 to 6 , Figure 1 , Figure 2 and Figure 3 Schematic diagrams of different viewing angles of the light emitting device of the present invention, Figure 4 is a partial exploded schematic diagram of the light emitting device of the present invention, Figure 5 is a schematic diagram of a light emitting device of the present invention without the first encapsulating colloid, the second encapsulating colloid and the third encapsulating colloid, Figure 5 is a schematic diagram of a light emitting device of the present invention without the first encapsulating colloid, the second encapsulating colloid, and the third encapsulating colloid, Figure 6 for Figure 5 Schematic top view of .

[0034] The light emitting device S comprises a packaging structure S1, a first light emitting chip S2, a second light emitting chip S3, a third light emitting chip S4, a first packaging colloid S5, a second packaging colloid S6, a third packaging colloid S7 and a lens S8. In different embodiments, the light emitting device S may not have the lens S8.

[0035] The package structure S1 includes a body 1 and a first electrode pair 3, a second electrode pair 5 and a third electrode pair 7. The body 1 covers the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7, and the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 are electrically independent of each other. The body 1 includes a first container 11, a second container 12 and a third container 13, the first container 11, the second container 12 and the third container 13 are arranged in a row and at intervals, and the first container 11 is located between the second container 12 and the third container 13. In practical applications, the body 1 can be formed of epoxy molding compound (EMC), but is not limited thereto.

[0036] The first receiving groove 11, the second receiving groove 12 and the third receiving groove 13 are respectively arranged corresponding to the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7, and a portion of the first electrode pair 3, a portion of the second electrode pair 5 and a portion of the third electrode pair 7 are correspondingly exposed in the first receiving groove 11, the second receiving groove 12 and the third receiving groove 13, and a portion of the first electrode pair 3, a portion of the second electrode pair 5 and a portion of the third electrode pair 7 are correspondingly exposed on a bottom surface 14 (such as Figure 3). The first receiving groove 11, the second receiving groove 12 and the third receiving groove 13 respectively have a first opening 111, a second opening 121 and a third opening 131, and the area of ​​the first opening 111 is larger than the area of ​​the second opening 121, and the area of ​​the first opening 111 is larger than the area of ​​the third opening 131. In a preferred application, in the top view of the light emitting device S (as shown in FIG. Figure 6 ), the area of ​​the first opening 111 may be 2 to 3 times that of the second opening 121 and the third opening 131. Preferably, the second opening 121 and the third opening 131 are of equal size.

[0037] The first light-emitting chip S2, the second light-emitting chip S3 and the third light-emitting chip S4 are respectively disposed in the first containing groove 11, the second containing groove 12 and the third containing groove 13, and the first light-emitting chip S2, the second light-emitting chip S3 and the third light-emitting chip S4 are respectively electrically connected to the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7. The wavelength band of the light beam emitted by the first light-emitting chip S2 is different from the wavelength band of the light beam emitted by the second light-emitting chip S3, and the wavelength band of the light beam emitted by the first light-emitting chip S2 is different from the wavelength band of the light emitted by the third light-emitting chip S4. For example, the first light-emitting chip S2 can emit light in the invisible light band, preferably in the infrared light band, and the second light-emitting chip S3 and the third light-emitting chip S4 can emit light in the visible light band or the ultraviolet light band.

[0038] In practical applications, the wavelength band of the light beam emitted by the second light-emitting chip S3 may be substantially the same as the wavelength band of the light beam emitted by the third light-emitting chip S4, that is, the difference between the wavelengths of the light beam emitted by the second light-emitting chip S3 and the third light-emitting chip S4 is not greater than 5 nanometers (nm).

[0039] The first encapsulation colloid S5, the second encapsulation colloid S6 and the third encapsulation colloid S7 are respectively disposed in the first containing groove 11, the second containing groove 12 and the third containing groove 13, and the first encapsulation colloid S5, the second encapsulation colloid S6 and the third encapsulation colloid S7 respectively cover the first light-emitting chip S2, the second light-emitting chip S3 and the third light-emitting chip S4, and the light emitted by the first light-emitting chip S2, the second light-emitting chip S3 and the third light-emitting chip S4 respectively will pass through the first encapsulation colloid S5, the second encapsulation colloid S6 and the third encapsulation colloid S7 and then be emitted outward.

[0040] In some embodiments, the second encapsulating colloid S6 may contain a wavelength conversion substance, and the light (preferably blue light or near ultraviolet light) emitted by the second light-emitting chip S3 is partially converted and mixed into white light after passing through the second encapsulating colloid S6, for example, white light with a color temperature of 2500 Kelvin (K) to 6500 Kelvin (K). Similarly, the third encapsulating colloid S7 may contain a wavelength conversion substance, and the light (preferably blue light or near ultraviolet light) emitted by the third light-emitting chip S4 is partially converted and mixed into white light after passing through the third encapsulating colloid S7, for example, white light with a color temperature of 2500 Kelvin (K) to 6500 Kelvin (K). The wavelength conversion substance is, for example, phosphor.

[0041] like Figure 4 As shown, the upper surface S51 of the first encapsulant S5, the upper surface S61 of the second encapsulant S6, and the upper surface S71 of the third encapsulant S7 may be flush with the top surface 15 of the body 1, and the lens S8 is disposed on the top surface 15 of the body 1, and the lens S8 covers the upper surface S51 of the first encapsulant S5, the upper surface S61 of the second encapsulant S6, and the upper surface S71 of the third encapsulant S7. Figure 4 The appearance of the lens S8 shown in FIG. 1 is only one exemplary form. In actual applications, the appearance of the lens S8 may be changed according to requirements.

[0042] The light-emitting device S of the present invention can be applied to devices such as face capture and license plate recognition. Preferably, when the light-emitting device S of the present invention is applied to devices such as face capture and license plate recognition, the first light-emitting chip S2 can be a light-emitting diode that can emit infrared light (IR) with a wavelength of 750 nanometers (nm), 670 nanometers (nm), 850 nanometers (nm) or 940 nanometers (nm), and can be a part of the light beams emitted by the second light-emitting chip S3 and the third light-emitting chip S4, respectively, through the second encapsulation colloid S6 and the third encapsulation colloid S7 containing phosphor to generate white light with a color temperature of 3000K. In different embodiments, the first light-emitting chip S2 may be a vertical cavity surface emitting laser (VCSEL) that can emit light with a wavelength of 670 nanometers (nm) to increase the irradiation distance of the first light-emitting chip S2, while the second light-emitting chip S3 and the third light-emitting chip S4 may be light-emitting diodes that can emit blue light with a wavelength of 470 nanometers (nm), and the second encapsulation colloid S6 and the third encapsulation colloid S7 may be encapsulation colloids doped with fluorescent particles, so that part of the light beams emitted by the second light-emitting chip S3 and the third light-emitting chip S4 can be partially converted and mixed into white light after passing through the second encapsulation colloid S6 and the third encapsulation colloid S7.

[0043] It is worth mentioning that, as shown in the following table, the aforementioned packaging structure S1 can be applied in different fields, and depending on the different fields in which the packaging structure S1 is applied, different types of chips and wavelength conversion materials can be arranged in the first cavity, the second cavity and the third cavity of the packaging structure S1.

[0044]

[0045]

[0046] Please also read Figures 5 to 8 , Figure 6 for Figure 5 A top view of Figure 7 is a schematic diagram of a first electrode pair, a second electrode pair and a third electrode pair of the light emitting device (package structure S1) of the present invention, Figure 8 for Figure 7 The first electrode pair 3 includes two first electrode sheets 31, the second electrode pair 5 includes two second electrode sheets 51, and the third electrode pair 7 includes two third electrode sheets 71. The appearance and size of each first electrode sheet 31, each second electrode sheet 51, and each third electrode sheet 71 can be changed according to needs, and the figure shows only one exemplary form.

[0047] The two first electrode sheets 31 are spaced apart from each other and are covered by the body 1 , the two second electrode sheets 51 are spaced apart from each other and are covered by the body 1 , and the two third electrode sheets 71 are spaced apart from each other and are covered by the body 1 , and each first electrode sheet 31 , each second electrode sheet 51 and each third electrode sheet 71 are spaced apart from each other and are arranged in the body 1 .

[0048] like Figure 1 , Figure 2 and Figure 7As shown, each first electrode sheet 31 of the first electrode pair 3 may include a plurality of first extensions 311, and a portion of each first extension 311 is exposed from one of the side surfaces 16 of the body 1. Each second electrode sheet 51 of the second electrode pair 5 may include a plurality of second extensions 511, and a portion of each second extension 511 is exposed from one of the side surfaces 16 of the body 1. Each third electrode sheet 71 of the third electrode pair 7 may include at least one third extension 711, and a portion of each third extension 711 is exposed from one of the side surfaces 16 of the body 1. In particular, each first extension 311, each second extension 511, and each third extension 711 may be exposed from three different side surfaces 16 of the body 1, respectively. Each first extension 311, each second extension 511, and each third extension 711 exposed from the body 1 may be used to be electrically connected to various external microprocessors, and the microprocessor can thereby independently control the first light-emitting chip S2, the second light-emitting chip S3, and the third light-emitting chip S4.

[0049] Please also read Figure 5 , Figure 6 , Figure 7 and Fig.10 , Fig.10 The figure is a cross-sectional schematic diagram of the light emitting device of the present invention without the lens, the first encapsulating colloid, the second encapsulating colloid, and the third encapsulating colloid. The body 1 can be divided into an outer wall 17, a first partition wall 18, and a second partition wall 19. The outer wall 17, the first partition wall 18, and the second partition wall 19 are connected to each other to form the first containing groove 11, the second containing groove 12, and the third containing groove. That is, the first partition wall 18 is located between the first containing groove 11 and the second containing groove 12, and the second partition wall 19 is located between the first containing groove 11 and the third containing groove 13. Fig.10 As shown, the height H1 of the first partition wall 18 is higher than the height H2 of the first light-emitting chip S2, and the height H1 of the first partition wall 18 is also higher than the height H3 of the second light-emitting chip S3, the height H4 of the second partition wall 19 is higher than the height H2 of the first light-emitting chip S2, and the height H4 of the second partition wall 19 is also higher than the height H5 of the third light-emitting chip S4, and the first partition wall 18 is used to prevent the light emitted by the first light-emitting chip S2 from interfering with the light emitted by the second light-emitting chip S3, and the second partition wall 19 is used to prevent the light emitted by the first light-emitting chip S2 from interfering with the light emitted by the third light-emitting chip S4. In practical applications, the height H1 of the first partition wall 18 can be equal to the height H4 of the second partition wall 19, but it is not limited thereto. Among them, the thickness of the first partition wall 18 and the thickness of the second partition wall 19 can be substantially the same, but it is not limited thereto.

[0050] In the present invention, the first containing groove 11, the second containing groove 12 and the third containing groove 13 are presented in a closely arranged form, so the volume of the light emitting device (packaging structure) can be reduced. Figure 5 and Figure 6 As shown, the first partition wall 18 may also have two curved sections 181 and 182, and one of the curved sections 181 included in the first partition wall 18 is bent toward the second receiving groove 12, and the other curved section 182 is bent toward the first receiving groove 11. The second partition wall 19 may also have two curved sections 191 and 192, and one of the curved sections 191 included in the second partition wall 19 is bent toward the third receiving groove 13, and the other curved section 192 is bent toward the first receiving groove 11. Figure 6 As shown, in the top view of the main body 1, the first receiving groove 11 can be formed by two rectangles A and an octagon B. In plain words, the appearance of the first receiving groove 11 is fat in the middle and narrow at the top and bottom.

[0051] By making the first partition wall 18 have two curved sections 181, 182 and the second partition wall 19 have two curved sections 191, 192, the mechanical structural strength of the body 1 can be greatly improved. More specifically, in the embodiment where the first partition wall 18 is not provided with two curved sections 181, 182 and the second partition wall 19 is not provided with two curved sections 191, 192, when the light-emitting device S is hit by an unexpected external force, the two ends of the first partition wall 18 and the two ends of the second partition wall 19 will easily cause stress concentration and cracking. In contrast, if the first partition wall 18 has two curved sections 181, 182 and the second partition wall 19 has two curved sections 191, 192, the above problem is not likely to occur.

[0052] Please also read Figure 5 , Figure 6 , Fig.10 and Fig.11 , Fig.11 Another cross-sectional schematic diagram of the light emitting device of the present invention without the lens, the first encapsulating colloid, the second encapsulating colloid, and the third encapsulating colloid. The body 1 may further include a first low wall 20, a second low wall 21, and a third low wall 22. The first low wall 20 is located in the first containing groove 11, and the first low wall 20 is disposed on a top surface 31A (such as the first electrode sheet 31 of the first electrode pair 3 exposed in the first containing groove 11) Fig.11 ), and the height H6 of the first low wall 20 is less than the height H1 of the first partition wall 18 (as shown in Fig.10 The height H6 of the first low wall 20 is less than the height H4 of the second partition wall 19; the second low wall 21 is located in the second container 12, and the second low wall 21 is disposed on a top surface 51A (such as the second electrode sheet 51 of the second electrode pair 5 exposed in the second container 12) of the second container 12. Fig.12As shown), and the height H7 of the second low wall 21 (as shown Fig.12 ) is smaller than the height H1 of the first partition wall 18 (as shown Fig.10 The third short wall 22 is located in the third container 13, and the third short wall 22 is disposed on the third electrode sheet 71 of the third electrode pair 7 exposed to a top surface 71A of the third container 13 (as shown); Fig.13 As shown), and the height H8 of the third low wall 22 (as shown Fig.10 ) is smaller than the height H4 of the second partition wall 19 (as shown Fig.10 shown).

[0053] like Figure 5 As shown, in actual application, the second light-emitting chip S3 can be fixed to one of the second electrode sheets 51, and the second light-emitting chip S3 is electrically connected to the other second electrode sheet 51 through a wire, and the wire crosses the second low wall 21; the third light-emitting chip S4 can be fixed to one of the third electrode sheets 71, and the third light-emitting chip S4 is electrically connected to the other third electrode sheet 71 through a wire, and the wire crosses the third low wall 22.

[0054] In practical applications, in an embodiment where the main body 1 is molded to cover the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7, the design of the first partition wall 18, the first low wall 20, the second low wall 21 and the third low wall 22 can effectively improve the stability of the main body 1 during molding, and can also strengthen the mechanical connection strength between the main body 1 and the first electrode pair 3, the second electrode pair 5, and the third electrode pair 7, and can also reduce the probability of water vapor intrusion.

[0055] like Figures 6 to 8As shown, it is worth mentioning that the surfaces of the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 can also each include a coated area 312, 512, 712 and an uncoated area 313, 513, 713 (represented by areas with dots in each figure), the uncoated areas 313, 513, 713 are covered by the body 1, and each coated area 312, 512, 712 is provided with an auxiliary conductive layer S9 (represented by dots in each figure), the conductivity of the auxiliary conductive layer S9 is higher than the conductivity of the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7, and can be used to improve the electrical connection efficiency between the first light-emitting chip S2 and the first electrode pair 3, the second light-emitting chip S3 and the second electrode pair 5, and the third light-emitting chip S4 and the third electrode pair 7. At the same time, the auxiliary conductive layer S9 can also be used to reflect the light emitted by the first light-emitting chip S2, the second light-emitting chip S3 and the third light-emitting chip S4, thereby improving the utilization rate of the light beams emitted by the first light-emitting chip S2, the second light-emitting chip S3 and the third light-emitting chip S4. Specifically, the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 can be copper sheets, and the material of the auxiliary conductive layer S9 can include gold, silver, copper, iron, chromium, nickel, platinum, palladium and any combination thereof.

[0056] In practical applications, the area of ​​the two first electrode sheets 31 of the first electrode pair 3 exposed in the first container 11 can basically be the coating area 312 provided with the auxiliary conductive layer S9, the area of ​​the two second electrode sheets 51 of the second electrode pair 5 exposed in the second container 12 can basically be the coating area 512 provided with the auxiliary conductive layer S9, and the area of ​​the two third electrode sheets 71 of the third electrode pair 7 exposed in the third container 13 can basically be the coating area 712 provided with the auxiliary conductive layer S9. Through the provision of the auxiliary conductive layer S9, in addition to improving the electrical connection efficiency between the first light-emitting chip S2 and the first electrode pair 3, the second light-emitting chip S3 and the second electrode pair 5, and the third light-emitting chip S4 and the third electrode pair 7, the auxiliary conductive layer S9 can also be used to reflect the light emitted by the first light-emitting chip S2, the second light-emitting chip S3 and the third light-emitting chip S4, thereby improving the utilization rate of the light beams emitted by the first light-emitting chip S2, the second light-emitting chip S3 and the third light-emitting chip S4.

[0057] In addition, the surface roughness of the uncoated areas 313, 513, 713 of each first electrode sheet 31, each second electrode sheet 51 and each third electrode sheet 71 is greater than the surface roughness of the coated areas 312, 512, 712 of each first electrode sheet 31, each second electrode sheet 51 and each third electrode sheet 71, and the uncoated areas 313, 513, 713 can be used to strengthen the mechanical connection strength between each first electrode sheet 31, each second electrode sheet 51 and each third electrode sheet 71 and the main body 1. More specifically, in the actual production process of the light-emitting device S of the present invention, before using the injection molding technology to cover the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 with the main body 1, the uncoated areas 313, 513, 713 of each first electrode sheet 31, each second electrode sheet 51 and each third electrode sheet 71 may be surface roughened (for example, sandblasted), and an auxiliary conductive layer S9 may be formed on the coated areas 312, 512, 712 of each first electrode sheet 31, each second electrode sheet 51 and each third electrode sheet 71. In this way, when the injection molding technology is subsequently used to cover the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 with the main body 1, the uncoated areas 313, 513, 713 of each second electrode sheet 51 and each third electrode sheet 71 will have relatively better mechanical connection strength with each other.

[0058] like Figure 7 , Figure 8 and Fig.10 As shown, in the embodiment where the body 1 is formed on the two first electrode sheets 31 of the first electrode pair 3, the two second electrode sheets 51 of the second electrode pair 5, and the two third electrode sheets 71 of the third electrode pair 7 by injection molding, in order to strengthen the mechanical connection strength between the body 1, each first electrode sheet 31, each second electrode sheet 51, and each second electrode sheet 51, the second electrode pair 5 and the body may have a first interlocking portion 514 and a second interlocking portion 23 that can be interlocked with each other, and the third electrode pair 7 and the body 1 may have a first interlocking portion 714 and a second interlocking portion 24 that can be interlocked with each other. For example, the first interlocking portion 514 of each second electrode sheet 51 of the second electrode pair 5 may be a groove, and the first interlocking portion 714 of each third electrode sheet 71 of the third electrode pair 7 may be a groove, and when the body 1 is coated with the second electrode pair 5 and the third electrode pair 7 by injection molding, a part of the body 1 (i.e., the second interlocking portions 23, 24) will fill the groove. Of course, in different embodiments, the first embedding portion 514 of the second electrode pair 5 and the first embedding portion 714 of the third electrode pair 7 may also be protruding structures such as protruding columns, which is not limited here.

[0059] like Figure 7 and Figure 8 As shown, in a preferred embodiment, the engaging portion 514 of the second electrode pair 5 can be a water drop-shaped groove, and each second electrode sheet 51 is provided with a water drop-shaped groove, the engaging portion 714 of the third electrode pair 7 can be a water drop-shaped groove, and each third electrode sheet 71 is provided with a water drop-shaped groove; in addition, in the top view of the light-emitting device S (such as Figure 6 As shown in the figure, a portion of the interlocking portion 514 of each second electrode sheet 51 of the second electrode pair 5 is located in the second receiving groove 12, and a portion of the interlocking portion 714 of each third electrode sheet 71 of the third electrode pair 7 is located in the third receiving groove 13. In this way, the mechanical connection strength between each third electrode sheet 71 and each third electrode sheet 71 and the main body 1 can be further improved.

[0060] As described above, by providing each second electrode sheet 51 with a teardrop-shaped groove, and making the teardrop-shaped grooves of the two second electrode sheets 51 correspond to the two corners of the second receiving groove 12, the second encapsulating colloid S6 will not only be interconnected with the side walls forming the second receiving groove 12, but also be interconnected with the interlocking portion 23 of the main body 1 filled in the teardrop-shaped groove, thereby greatly improving the mechanical connection strength between the corners of the second encapsulating colloid S6 and the main body 1. Similarly, by providing each third electrode sheet 71 with a teardrop-shaped groove, and making the teardrop-shaped grooves of the two third electrode sheets 71 correspond to the two corners of the third containing groove 13, the third encapsulation colloid S7 will not only be interconnected with the side walls forming the third containing groove 13, but also be interconnected with the interlocking portion 24 of the main body 1 filled in the teardrop-shaped groove, thereby greatly improving the mechanical connection strength between the corners of the third encapsulation colloid S7 and the main body 1, and further reducing the intrusion of water vapor, thereby improving the reliability of the overall light-emitting device S.

[0061] Please also read Figure 5 and Fig.11 In practical applications, the main body 1 may further include an auxiliary short wall 25, the auxiliary short wall 25 is located in the first containing groove 11, and the auxiliary short wall 25 is located above one of the first electrode sheets 31 of the first electrode pair 3, and the auxiliary short wall 25 is mutually interlocked with an auxiliary interlocking portion 314 of the first electrode pair 3. Specifically, the auxiliary interlocking portion 314 of the first electrode sheet 31 may be a groove, and when the main body 1 is formed on the first electrode pair 3 by injection molding, a portion of the auxiliary short wall 25 will be correspondingly interlocked in the groove of the first electrode sheet 31, so that the mechanical connection strength between the first electrode pair 3 and the main body 1 can be improved. In addition, through the design of the auxiliary short wall 25, the mechanical connection strength between the reflective filler S10 and the main body 1 can also be improved at the same time.

[0062] Please also read Figures 10 to 13 , which is a cross-sectional schematic diagram of different positions of the light emitting device of the present invention without a lens, a first encapsulating colloid, a third encapsulating colloid, a third encapsulating colloid and a reflective filler. Fig.10 As shown, in actual application, the angle θ1 between the first partition wall 18 located on one side of the first containing groove 11 and the vertical plane can be between 15 and 25 degrees, and the angle θ2 between the second partition wall 19 located on one side of the first containing groove 11 and the vertical plane can be between 15 and 25 degrees. Preferably, the angle θ1 and the angle θ2 can be 21 degrees. In this way, the first partition wall 18 and the second partition wall 19 will not easily interfere with the light emitted by the first light-emitting chip S2, so that the light emitted by the first light-emitting chip S2 from the first containing groove 11 can have a good light output angle.

[0063] In addition, in the embodiment where a reflective filler S10 is disposed in the first containing groove 11, by making the angle θ1 and the angle θ2 between 15 and 25 degrees, it is possible to avoid the problem that when the reflective filler S10 is formed in the first containing groove 11, the reflective filler S10 overflows onto the surface of the first light-emitting chip S2, thereby affecting the light-emitting efficiency of the first light-emitting chip S2.

[0064] like Fig.10 As shown, the included angle θ3 between the outer side surface of the second containing groove 12 and the vertical plane can be between 15 and 20 degrees, and the included angle θ4 between the outer side surface of the third containing groove 13 and the vertical plane can be between 15 and 20 degrees. The included angle θ5 between the inner side surface of the second containing groove 12 and the vertical plane can be between 5 and 15 degrees, and the included angle θ6 between the inner side surface of the third containing groove 13 and the vertical plane can be between 5 and 15 degrees.

[0065] Preferably, angles θ3 and θ4 can be 17 degrees, and angles θ5 and θ6 can be 17 degrees. In this way, the light emitted by the second light-emitting chip S3 and the third light-emitting chip S4 through the second cavity 12 and the third cavity 13 respectively can have an optical design with a better light output angle.

[0066] In addition, please refer to Figure 6 In the embodiment where the second light-emitting chip S3 and the third light-emitting chip S4 can emit blue light respectively, and the second encapsulation colloid S6 and the third encapsulation colloid S7 are respectively doped with fluorescent powder, in the top view of the light-emitting device S, the outer side surface 12A forming the second containing groove 12 can be arc-shaped, and the outer side surface 13A forming the third containing groove 13 can be arc-shaped. In this way, the light mixing effect of the blue light emitted by the second light-emitting chip S3 and the third light-emitting chip S4 and the fluorescent powder doped in the second encapsulation colloid S6 and the third encapsulation colloid S7 can be enhanced.

[0067] Please also read Fig. 9 , Figures 11 to 13 , Fig. 9 is a schematic diagram of the first electrode pair, the second electrode pair and the third electrode pair of the light-emitting device of the present invention from another viewing angle, Fig.11 For along Figure 5 The schematic cross-sectional view of the section line XI after cutting, Fig.12 For along Figure 5 The schematic diagram of the cross section after the section line XII is cut, Fig.13 For along Figure 5 Schematic cross-sectional view after being cut along the section line XIII of . Each first electrode sheet 31 of the first electrode pair 3, each second electrode sheet 51 of the second electrode pair 5, and each third electrode sheet 71 of the third electrode pair 7 can also be formed with a concave structure 315, 515, 715, respectively, and the main body 1 can be correspondingly provided with auxiliary interlocking portions 26, 27, 28. Specifically, when the main body 1 is formed on the first electrode pair 3, the second electrode pair 5, and the third electrode pair 7 by injection molding, a portion of the main body 1 will be interlocked with the concave structure 315 of each first electrode sheet 31, the concave structure 515 of each second electrode sheet 51, and the concave structure 715 of each third electrode sheet 71, and the portion of the main body 1 interlocked with the auxiliary interlocking portions 26, 27, 28 is the auxiliary interlocking portions 26, 27, 28. The design of the concave structures 315 , 515 , 715 can strengthen the mechanical connection strength between each first electrode sheet 31 of the first electrode pair 3 , each second electrode sheet 51 of the second electrode pair 5 , and each third electrode sheet 71 of the third electrode pair 7 and the body 1 .

[0068] See also Fig.13 , which is a schematic diagram of another embodiment of the light emitting device of the present invention without the first encapsulating colloid, the second encapsulating colloid, and the third encapsulating colloid. Fig.13 ) and the aforementioned embodiment (as shown Figure 5The biggest difference between the first and second light emitting devices S10 and the first light emitting device S2 is that the light emitting device S may also include a reflective filler S10. The reflective filler S10 is filled in the first container 11, and the reflective filler S10 is located between the first packaging colloid S5 and the first electrode pair 3. The reflective filler S10 covers the first electrode pair 3 and covers the side surface S21 of the first light emitting chip S2. Preferably, the upper surface of the reflective filler S10 is slightly lower than or flush with the upper surface of the first light emitting chip S2. The reflective filler S10 can reflect the light emitted by the first light emitting chip S2, and the reflective filler S10 can make most of the light of the first light emitting chip S2 be emitted outward from the first opening 111 of the first container 11, thereby improving the use efficiency of the light emitted by the first light emitting chip S2. In actual tests, if the body 1 is made of a material that can reflect the light emitted by the first light emitting chip S2, the luminous efficiency of the first light emitting chip S2 provided with the reflective filler S10 is 10% higher than the luminous efficiency of the first light emitting chip S2 not provided with the reflective filler S10. For example, the reflective filler S10 may be titanium dioxide (TiO 2 ), silicon dioxide (SiO 2 ) or boron nitride (BN).

[0069] It is worth mentioning that in the embodiment in which a reflective filler S10 is provided in the first receiving groove 11, the first short wall 20 can be annular, and the first short wall 20 and one of the first electrode sheets 31 will jointly form a groove 221. When the reflective filler S10 is filled in the first receiving groove 11, part of the reflective filler S10 will be filled in the groove 221. In this way, the mechanical connection strength between the reflective filler S10 and the main body 1 can be improved.

[0070] See also Fig.15, which is a top view schematic diagram of the manufacturing process of the first electrode pair, the second electrode pair and the third electrode pair of multiple light-emitting devices (packaging structures) of the present invention. In practical applications, the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 of multiple light-emitting devices S (packaging structures S1) can be manufactured together, and each first electrode sheet 31 can have three first extensions 311, and the three first extensions 311 are respectively connected to the first extension 311 of the adjacent first electrode sheet 31, the second extension 511 of the adjacent second electrode sheet 51 and the third extension 711 of the adjacent third electrode sheet 71; that is, each first electrode sheet 31 is connected to the adjacent second electrode sheet 51 and the adjacent third electrode sheet 71 through the three first extensions 311, so that the island effect caused by the second electrode sheet 51 or the third electrode sheet 71 not being connected to other electrode sheets can be avoided. The second extension portion 511 of each second electrode sheet 51 can be connected to the second extension portion 511 of two adjacent second electrode sheets 51, or the second extension portion 511 of each second electrode sheet 51 can also be connected to the third extension portion 711 of two third electrode sheets 71; the third extension portion 711 of each third electrode sheet 71 can be connected to the third extension portion 711 of an adjacent third electrode sheet 71, or the third extension portion 711 of each third electrode sheet 71 can also be connected to the second extension portion 511 of an adjacent second electrode sheet 51. In this way, the stability of each first electrode sheet 31, each second electrode sheet 51 and each third electrode sheet 71 when the main body 1 is formed on each first electrode sheet 31, each second electrode sheet 51 and each third electrode sheet 71 can be greatly improved, and each first electrode sheet 31 will not have an island effect during the molding process of the main body 1. Of course, in practical applications, the connection method between each first electrode sheet 31 , each second electrode sheet 51 and each third electrode sheet 71 is not limited to the above description.

[0071] To sum up, when the packaging structure of the present invention is applied to devices for face capture and license plate recognition, the packaging structure of the present invention can enable the light-emitting device to have the advantage of a smaller volume compared to existing light-emitting devices, and can prevent the light emitted by the light-emitting chips of the light-emitting device using the present invention from interfering with each other, thereby having the advantage of better light-emitting effect compared to existing light-emitting devices.

[0072] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the description and drawings of the present invention are included in the protection scope of the present invention.

Claims

1. A packaging structure, characterized in that: The packaging structure comprises: a first electrode pair, a second electrode pair, and a third electrode pair; and A body, covering the first electrode pair, the second electrode pair and the third electrode pair, the body comprising a first containing groove, a second containing groove and a third containing groove, the first containing groove, the second containing groove and the third containing groove respectively correspond to the positions of the first electrode pair, the second electrode pair and the third electrode pair, the opening area of ​​the first containing groove is larger than the opening area of ​​the second containing groove and the third containing groove, and the first containing groove is located between the second containing groove and the third containing groove, the first containing groove can be used to accommodate a first light-emitting chip with an infrared light band, the second containing groove and the third containing groove can be used to accommodate a second light-emitting chip and a third light-emitting chip with a blue light band smaller than the size of the first light-emitting chip, and a packaging colloid covering the second light-emitting chip and the third light-emitting chip and doped with fluorescent powder; wherein, the second containing groove and the third containing groove are arc-shaped at the side walls away from the first containing groove and face the first containing groove.

2. The packaging structure according to claim 1, characterized in that: The first containing groove, the second containing groove and the third containing groove further have a first opening, a second opening and a third opening respectively; in the top view of the packaging structure, the area of ​​the first opening is 2 to 3 times that of the second opening, and the area of ​​the first opening is 2 to 3 times that of the third opening.

3. The packaging structure according to claim 2, characterized in that: The area of ​​the second opening is equal to the area of ​​the third opening.

4. The packaging structure according to claim 1, characterized in that: The body further includes a first partition wall and a second partition wall. The first partition wall is located between the first receiving groove and the second receiving groove. The second partition wall is located between the first receiving groove and the third receiving groove. The first partition wall and the second partition wall each have two curved sections.

5. The packaging structure according to claim 4, characterized in that: The height of the first partition wall is equal to the height of the second partition wall.

6. The packaging structure according to claim 4, characterized in that: One of the curved sections included in the first partition wall is bent toward the second containing groove, and the other curved section is bent toward the first containing groove; one of the curved sections included in the second partition wall is bent toward the third containing groove, and the other curved section is bent toward the first containing groove.

7. The packaging structure according to claim 1, characterized in that: The main body further comprises a first low wall, a second low wall and a third low wall, and the first low wall, the second low wall and the third low wall are respectively arranged in the first containing groove, the second containing groove and the third containing groove.

8. The packaging structure according to claim 1, characterized in that: The main body includes an auxiliary short wall, the first electrode pair includes an auxiliary embedding portion, and the auxiliary short wall and the auxiliary embedding portion are embedded with each other and cover a portion of the first electrode pair.

9. The packaging structure according to claim 1, characterized in that: The widths of the two end portions of the first containing groove are smaller than the width of the middle portion of the first containing groove.

10. The packaging structure according to claim 1, characterized in that: The shapes of the two sides of the first containing groove are geometrically matched with the side shapes of the adjacent second containing groove and the side shapes of the adjacent third containing groove.

11. The packaging structure according to claim 1, characterized in that: The width of the two end portions of the second containing groove is greater than the width of the middle portion of the second containing groove, and the width of the two end portions of the third containing groove is greater than the width of the middle portion of the third containing groove.

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