A method and apparatus for creating a component package

Abstract

The application discloses a component package creation method and device. The component package creation method comprises the following steps: obtaining a structure diagram of a component, wherein the component comprises a plurality of special-shaped pads; establishing an auxiliary pad file, the auxiliary pad file is created based on auxiliary pads, the auxiliary pads correspond to the special-shaped pads one by one, and the auxiliary pads do not exceed the corresponding special-shaped pads; and generating a component package based on the structure diagram of the component and the auxiliary pad file. In this way, the application can reduce the complexity of component package design with special-shaped pads and improve the packaging efficiency.

Description

Technical Field

[0001] This application relates to the field of circuit board design technology, and in particular to a method and apparatus for creating component packages. Background Technology

[0002] In circuit board design, such as PCB (Printed Circuit Board) or FPC (Flexible Printed Circuit), components need to have their packages created before being imported into the design. A package is essentially a model of the component, created by adding the necessary design elements based on the component's actual shape and dimensions. Currently, packages are manually created by the packaging engineer, who calculates the size and position of each element before adding them. This method of creating packages is time-consuming, especially for components using irregularly shaped pads, where the workload of creating the package is enormous, significantly increasing design time. Summary of the Invention

[0003] The main technical problem addressed by this application is to provide a method and apparatus for creating component packages, which can reduce the complexity of component package design with irregularly shaped pads and improve packaging efficiency.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a method for creating a component package, including obtaining a structural diagram of the component, the component including several irregular pads; creating an auxiliary pad file, the auxiliary pad file being created based on the auxiliary pads, the auxiliary pads corresponding one-to-one with the irregular pads, the auxiliary pads not exceeding the corresponding irregular pads; and generating a component package according to the component structural diagram and the auxiliary pad file.

[0005] Among them, the structures of several auxiliary pads are consistent. The creation of auxiliary pad files includes: creating an auxiliary pad file based on an auxiliary pad; and copying the auxiliary pad file to form several identical auxiliary pad files corresponding to the number of auxiliary pads.

[0006] Creating auxiliary pad files involves setting the shape and size of the auxiliary pads and creating auxiliary pad files using the Pad Designer feature in the PCB Editor software.

[0007] The component structure diagram includes the shape, size, and position of the irregular pads. Generating the component package based on the component structure diagram and auxiliary pad file includes: obtaining the auxiliary pad file, which includes the shape and size of the auxiliary pads, and placing the graphics of each auxiliary pad at the corresponding irregular pad position.

[0008] The process of generating component packages based on component structure diagrams and auxiliary pad files includes: determining the component's graphic based on the component's structure diagram (which is a .dxf file); creating the component's copper layer using PCBEditor software based on the component's graphic; and generating the component package based on the copper layer and auxiliary pad files.

[0009] The process of constructing the copper layer of a component using PCB Editor software includes: constructing the surface layer of the component; constructing the solder mask layer and stencil layer of the component based on the surface layer; wherein the solder mask layer is 4 mil larger than the surface layer, and the stencil layer is the same size as the surface layer.

[0010] The components are mounted on the circuit board, and several irregularly shaped solder pads are distributed on the surface of the circuit board.

[0011] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a device for creating component packages, including an acquisition module, a construction module, and a generation module. The acquisition module is used to acquire the structural diagram of the component, and the component includes a number of irregularly shaped pads. The construction module is used to create an auxiliary pad file, which is created based on a number of auxiliary pads. The auxiliary pads correspond one-to-one with the irregularly shaped pads, and the auxiliary pads do not exceed the corresponding irregularly shaped pads. The generation module is used to generate the component package according to the structural diagram of the component and the auxiliary pad file.

[0012] Among them, several auxiliary pads have the same structure; the building module is used to create an auxiliary pad file based on an auxiliary pad; and to copy the auxiliary pad file to form several identical auxiliary pad files corresponding to the number of auxiliary pads.

[0013] The component's structural diagram includes the shape, size, and position of the irregular pads; the auxiliary pad file includes the shape and size of the auxiliary pads; the generation module is used to obtain the auxiliary pad file and place the graphics of each auxiliary pad at the corresponding position of the irregular pad.

[0014] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a method for creating component packages. When creating a component package with irregularly shaped pads, instead of directly creating a pad file for the irregularly shaped pads, it utilizes auxiliary pads with regular shapes. The auxiliary pads, whose dimensions do not exceed the size of the irregularly shaped pad pattern, are used to create the pad file, and these auxiliary pads serve as the pins for the irregularly shaped pads of the component. This method satisfies the requirements for circuit connections without affecting the output, and also reduces the design complexity of component packages with irregularly shaped pads. Attached Figure Description

[0015] Figure 1This is a flowchart illustrating the method for creating component packages in the embodiments of this application;

[0016] Figure 2 This is a schematic diagram of a portion of the structure of a component in an embodiment of this application;

[0017] Figure 3 This is a schematic diagram of a partial structure of another component in an embodiment of this application;

[0018] Figure 4 This is a schematic diagram of a partial structure of another component in an embodiment of this application;

[0019] Figure 5 This is a schematic diagram of a portion of the structure of another component in the embodiments of this application;

[0020] Figure 6 This is a partial structural diagram of the component package created in the embodiments of this application. Detailed Implementation

[0021] To make the purpose, technical solution and effects of this application clearer and more explicit, the following describes this application in further detail with reference to the accompanying drawings and embodiments.

[0022] This application provides a method for creating component packages, applicable to the design of various circuit boards, such as component packages for PCB boards and component packages for FPC boards. Using this method, the complexity of creating component packages with irregularly shaped pads (PADs) can be reduced, improving package design efficiency.

[0023] Please see Figure 1 , Figure 1 This is a flowchart illustrating the method for creating a component package according to an embodiment of this application. In this embodiment, the method for creating a component package includes:

[0024] S110: Obtain the structural diagram of the components.

[0025] The components include several pads, which can be regular or irregular. The component structure diagram includes the size, shape, and position of the component's pads. Component structure diagrams can be created based on component datasheets to facilitate the subsequent generation of corresponding packages, ensuring that the component package matches the physical component's outline and further improving the efficiency of package creation.

[0026] S130: Create an auxiliary pad file.

[0027] Among them, the auxiliary pad file is created based on the auxiliary pad. The auxiliary pad is a pad with a regular shape. The auxiliary pad corresponds one-to-one with the irregular pad, and the size of the auxiliary pad does not exceed the graphic of the corresponding irregular pad.

[0028] Specifically, a pad is a pin in a component. They are essential components used to distinguish different pins and implement different functions. Pads generally come in regular and irregular shapes. Regular pads can be rectangular, triangular, rhomboid, hexagonal, octagonal, etc.; irregular pads, also called special-shaped pads, have various shapes and angles. Please refer to [link / reference]. Figure 2-5 , Figure 2 This is a partial structural schematic diagram of a component in an embodiment of this application. Figure 3 This is a partial structural schematic diagram of another component in an embodiment of this application. Figure 4 This is a partial structural schematic diagram of another component in the embodiments of this application. Figure 5 This is a partial structural diagram of another component in the embodiments of this application. The diagram shows various components, each including multiple pads of different shapes. As shown, the angles and shapes of each irregularly shaped PAD are different. When creating a component package, it is necessary to manually construct the pad file for each one, making component packaging a repetitive and labor-intensive task. This is especially true for components with a large number of irregularly shaped PADs, where creating a pad file for each one is complex, time-consuming, and results in significant design time consumption.

[0029] In the component package creation method provided in this application, instead of directly creating a pad file for the irregularly shaped PAD, a regularly shaped auxiliary pad is used. An auxiliary PAD with a size not exceeding the irregularly shaped PAD pattern is selected, and a pad file is created based on this auxiliary PAD. The auxiliary PAD serves as the pin lead-out for the irregularly shaped PAD. In other words, a surface copper pad smaller than the irregularly shaped PAD is placed on top as an auxiliary PAD, ensuring that the auxiliary PAD can be placed inside the irregularly shaped PAD pattern. Its function is to identify each irregularly shaped PAD as a pin, facilitating lead-out. This method satisfies the wiring connection requirements without affecting the lead-out process and reduces the complexity of component package design with irregularly shaped PADs. This is because the selected auxiliary PAD is a regularly shaped pad, making pad file creation relatively simple and improving the efficiency of component packaging.

[0030] S150: Generate component packages based on component structure diagrams and auxiliary pad files.

[0031] In this embodiment, when creating a component package with irregularly shaped PADs, the complexity of creating a component package with irregularly shaped PADs can be reduced and the package design efficiency can be improved by combining the component's structural diagram with a pad file built based on a regular-shaped PAD.

[0032] In one implementation, Cadence's PCB editor software can be used to design the circuit board. For example, a circuit board file (.brd) can be created as needed, and basic information such as the PCB outline dimensions and mounting holes can be set. Simultaneously, the component footprints are constructed, including pin order and dimensions. Component pins are connected to traces on the PCB via pads for signal transmission; the traces on the PCB can be designed based on the pad pin positions. Then, the component package is designed according to the component package specification.

[0033] Components need to have their packages created before being imported into the design. Creating a component package (.dra file) requires first creating a pad file for each component's pads to distinguish different pins. Pads are generally either regular or irregular in shape. Creating a pad file for a regular pad can be done directly by filling in the corresponding dimensions using the software, which is relatively simple.

[0034] In this embodiment, a pad file for a regular-shaped PAD can be created using the Pad Designer tool in the PCB Editor software. Specifically, open Pad Designer, enter the shape and size of the regular-shaped PAD in the interface, generate the corresponding pad file (.pad file), and then name and save it. The pad file includes the shape, size, and graphics of the auxiliary pads.

[0035] Furthermore, for regular-shaped pads, multiple regular-shaped pads with the same shape can reuse pad files. That is, after creating one pad file, it can be directly copied to generate more pad files without repeatedly creating them. In other words, the step of repeatedly creating pad files is unnecessary; simple copying can create more pad files, allowing for batch processing of multiple pad files simultaneously. Moreover, because the auxiliary pads have regular shapes, their size and position are easier to determine, improving the accuracy of pad placement when creating component packages.

[0036] When a component contains irregularly shaped pads, since each irregularly shaped pad has a different angle and shape, pad files cannot be reused between different irregularly shaped pads. That is, a new pad file must be created for each irregularly shaped pad with a different shape, and previous ones cannot be copied.

[0037] like Figure 5As shown, a component has a total of 671 pads, each with a different shape and angle, placed at gradually changing angles. Following the conventional steps for creating a component package, it would require creating separate pad files for each of these 671 pads, meaning 671 pad file creation operations would be needed. Then, each of the 671 pad graphics would be placed according to its corresponding angle and position (space) to create the component package. However, because the shapes, angles, and sizes of the irregularly shaped pads are irregular, they cannot be simply and explicitly input when creating pad files. A structural diagram of the irregularly shaped pads must first be constructed, and then the pad files must be created based on the diagram, further increasing the number of pad file creation operations. Furthermore, because the shapes, angles, and sizes of the irregularly shaped pads are irregular, errors in angle and position are prone to occur when placing the pad graphics, leading to decreased accuracy. Therefore, creating a component package in this way requires a significant amount of time and is largely repetitive, resulting in low efficiency.

[0038] Based on this, this application provides a method for creating component packages, which can quickly generate component packages by combining the component's structural diagram and the pad file constructed using auxiliary PADs.

[0039] In one embodiment, component packages are created using PCB Editor software, specifically including:

[0040] Step 1: Create a component structure diagram.

[0041] This involves creating component structure diagrams based on component datasheets. Component structure diagrams in AutoCAD software can be created using the component datasheets in DXF format. DXF format refers to the CAD data file format used for CAD data exchange between AutoCAD and other software. Setting the component structure diagram created from the component datasheet to DXF format allows for direct import and display in Cadence software, ensuring effective data retrieval. Each component includes multiple component pads, whose shapes and sizes can be identical or different. Component pads can be regular or irregularly shaped. The component structure diagram includes detailed information such as the shape, size, and placement of each pad. The component structure diagram only represents the component's external shape; further copper layer creation is required based on the component structure diagram.

[0042] Step 2: Construct the copper layer for the components.

[0043] In this process, the copper layer of the components can be created using PCB Editor software. Specifically, three layers of the copper layer need to be created: TOP layer, SOLADEMASK_TOP layer, and PASTEMASK_TOP layer.

[0044] For example, open the PCB Editor, select Package symbol mode, and build the component package .dra file.

[0045] Import the component structure diagram (.dxf file) in .dxf format and obtain the shape symbol of the copper layer. For example, it could be like... Figure 5 The diagram shown is an example of a component structure diagram. After importing, the PCB Editor can automatically recognize and obtain the PAD graphics and outline diagrams from the component structure diagram. For example, when the PAD graphics in the component structure diagram are circular, the diameter and position of the circle can be identified; when the PAD graphics in the component structure diagram are rectangular, the length, width, and position of the rectangle can be identified; and of course, when the PAD is irregularly shaped, its graphics and position can also be identified.

[0046] Since the DXF import is just an outline (hollow and not a copper layer), the next step is to construct a solid copper skin shape for the corresponding layer from the hollow outline, i.e., the top layer.

[0047] Then, in its mode, the Z-copy function is used to create the solder mask layer SOLADEMASK_TOP and the stencil layer PASTEMASK_TOP. The solder mask layer SOLADEMASK_TOP is 4 mil larger than the surface layer TOP, and the stencil layer PASTEMASK_TOP is the same size as the surface layer TOP.

[0048] Step 3: Create an auxiliary pad file.

[0049] The auxiliary pad file is created based on the auxiliary pads. The auxiliary pads are pads with regular shapes, such as circular pads, elliptical pads, rectangular pads, etc.

[0050] In this application, when creating a component package, the component package is constructed by combining the structural diagram of the component, which includes irregularly shaped pads, with pad files for auxiliary pads.

[0051] Specifically, a smaller-sized surface copper pad (i.e., an auxiliary pad) is placed on the component to serve as pin identification for irregularly shaped pads. In particular, pads with regular shapes are selected as auxiliary pads. This way, when creating pad files, they can be based on the auxiliary pads, transforming the construction of pad files for irregularly shaped pads into the construction of pad files for regular-shaped pads, thereby simplifying the complexity of package creation.

[0052] Specifically, the orthographic projection of the auxiliary pad onto the component pad should fall completely within the shape of the component pad to ensure that the auxiliary pad can be placed inside the shape of the component pad, thus avoiding connection abnormalities.

[0053] Each irregularly shaped pad corresponds to an auxiliary pad. The shape and size of the auxiliary pads for multiple irregularly shaped pads can be the same or different. It is possible that all selected auxiliary pads have the same shape and size; alternatively, several different sets of auxiliary pads can be selected based on the shape, size, and position of the irregularly shaped pads, with each auxiliary pad in each set having the same shape and size. When setting the size of the auxiliary pads, the smallest irregularly shaped pad should be used as a reference to ensure that the auxiliary pad can be placed inside the shape of the irregularly shaped pad.

[0054] For example, if all irregularly shaped pads have a diameter of 50μm, then an auxiliary pad with a diameter <50μm can be imported. The shape of the auxiliary pad is not restricted, as long as it is within the shape of the irregularly shaped pad. Generally, a circular pad can be selected as the auxiliary pad.

[0055] Because the auxiliary pads used have regular shapes, auxiliary PADs with the same shape can reuse pad files. In this way, it is no longer necessary to create multiple pad files according to the shape of irregularly shaped PADs, but to process them in batches according to the shape and number of auxiliary pads.

[0056] Step 4: Create component packages based on the component copper layer and auxiliary pad files.

[0057] Using the package symbol mode in the PCB editor software, the pad function is invoked to import the auxiliary pad file. The auxiliary pad patterns are then placed according to the positions of the irregularly shaped pads to create the component package. The positions of the auxiliary pads correspond to the positions of the irregularly shaped pads. For example... Figure 6 As shown, Figure 6 This is a partial structural diagram of the component package created in the embodiments of this application. Multiple auxiliary pads may be evenly distributed. In other embodiments, the component pads may be dispersed and placed in different locations according to their shape and position.

[0058] This method enables the normal import and use of packaged designs, saving the significant time required to create 671 shape symbols and 671 pad files, thus reducing the complexity of package designs for components with irregularly shaped pads. Furthermore, it makes it easier to determine pad placement, improving placement accuracy.

[0059] This method is not limited to any package type and can be applied to any component package with irregularly shaped pads, such as gold fingers with irregularly shaped pads, connectors with irregularly shaped pads, etc.

[0060] In other implementations, corresponding package identifiers can be added to the generated component package file. These identifiers can include the package name, PAD name, package height, and creation date, facilitating subsequent querying and retrieval. During querying and retrieval, keywords can be extracted from the PCB component package description file. These keywords include component model, mounting method, component shape, component length / width, number of pins, minimum feature pin spacing, pad coordinates, feature pad size, feature pad shape, pin position, and package description file number.

[0061] This application also provides a device for creating component packages. The device includes an acquisition module, a construction module, and a generation module. The acquisition module is used to acquire the structural diagram of the component, which includes a number of irregularly shaped pads. The construction module is used to create an auxiliary pad file, which is created based on a number of auxiliary pads. The auxiliary pads correspond one-to-one with the irregularly shaped pads, and the auxiliary pads do not exceed the corresponding irregularly shaped pads. The generation module is used to generate the component package based on the structural diagram of the component and the auxiliary pad file.

[0062] Among them, several auxiliary pads have the same structure; the building module is used to create an auxiliary pad file based on an auxiliary pad; and to copy the auxiliary pad file to form several identical auxiliary pad files corresponding to the number of auxiliary pads.

[0063] The component's structural diagram includes the shape, size, and position of the irregular pads; the auxiliary pad file includes the shape and size of the auxiliary pads; the generation module is used to obtain the auxiliary pad file and place the graphics of each auxiliary pad at the position of the corresponding irregular pad.

[0064] In the above embodiments, when creating a component package with irregularly shaped pads, the pad file for the irregularly shaped pads is not created directly based on the irregularly shaped pads. Instead, auxiliary pads with regular shapes are used, and the size of the auxiliary pads within the irregularly shaped pad pattern is selected. The pad file is then created based on the auxiliary pads, which serve as the pins for the irregularly shaped pads. This method satisfies the wiring connection requirements without affecting the output traces, and also reduces the complexity of component package design with irregularly shaped pads. This is because the selected auxiliary pads are regularly shaped, making pad file creation relatively simple and improving the efficiency of pad packaging.

[0065] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method of creating a component package, characterized by, The method comprises the following steps: obtaining a structure diagram of a component, the component comprising a plurality of irregular pads; establishing an auxiliary pad file, the auxiliary pad file being created based on a plurality of auxiliary pads, the auxiliary pads being pads with regular shapes, the auxiliary pads corresponding to the irregular pads one by one, and the auxiliary pads not exceeding the corresponding irregular pads; generating a component package according to the structure diagram of the component and the auxiliary pad file; wherein the step of generating the component package according to the structure diagram of the component and the auxiliary pad file comprises: determining a pattern of the component according to the structure diagram of the component, the structure diagram being a dxf file; constructing a copper layer of the component based on the pattern of the component by using a PCB Editor software; generating the component package based on the copper layer of the component and the auxiliary pad file; Meanwhile, the step of constructing the copper layer of the component by using the PCB Editor software comprises: constructing a surface layer of the component; constructing a solder mask layer and a screen layer of the component based on the surface layer, wherein the solder mask layer is 4 mil larger than the surface layer, and the screen layer is as large as the surface layer.

2. The component package creation method of claim 1, wherein The structure of the plurality of auxiliary pads is consistent, and the step of establishing the auxiliary pad file comprises: creating the auxiliary pad file based on one auxiliary pad; copying the auxiliary pad file to generate a plurality of auxiliary pad files that are identical to each other and correspond to the number of auxiliary pads.

3. The method of creating a component package according to claim 1 or 2, wherein The step of establishing the auxiliary pad file comprises: setting the shape and size of the auxiliary pads, and creating the auxiliary pad file by using a Pad Designer of the PCB Editor software.

4. The method of creating a component package of claim 1, wherein, The structure diagram of the component comprises the shape, size and position of the irregular pads, and the step of generating the component package according to the structure diagram of the component and the auxiliary pad file comprises: obtaining the auxiliary pad file, the auxiliary pad file comprising the shape and size of the auxiliary pads; placing the pattern of each auxiliary pad at the position of the corresponding irregular pad.

5. The method according to claim 1, wherein: the component is arranged on a circuit board, and the plurality of irregular pads are distributed on the surface of the circuit board.

6. An apparatus for creating a component package, characterized by comprising: The creating device is configured to perform the method according to any one of claims 1 to 5, and comprises: an obtaining module configured to obtain a structure diagram of a component, the component comprising a plurality of irregular pads; a constructing module configured to establish an auxiliary pad file, the auxiliary pad file being created based on a plurality of auxiliary pads, the auxiliary pads corresponding to the irregular pads one by one, and the auxiliary pads not exceeding the corresponding irregular pads; a generating module configured to generate a component package according to the structure diagram of the component and the auxiliary pad file.

7. The creating device according to claim 6, wherein: the structure of the plurality of auxiliary pads is consistent; and the constructing module is configured to create the auxiliary pad file based on one auxiliary pad, and copy the auxiliary pad file to generate a plurality of auxiliary pad files that are identical to each other and correspond to the number of auxiliary pads.

8. The component package creating apparatus according to claim 6, wherein the component layout includes shapes, sizes and positions of the special pads; the auxiliary pad file includes shapes and sizes of the auxiliary pads; and the generating module is arranged to acquire the auxiliary pad file and place a pattern of each of the auxiliary pads at a position of the special pad corresponding thereto.

9. The component package creating apparatus according to claim 6, wherein the component layout includes shapes, sizes and positions of the special pads; the auxiliary pad file includes shapes and sizes of the auxiliary pads; and the generating module is arranged to acquire the auxiliary pad file and place a pattern of each of the auxiliary pads at a position of the special pad corresponding thereto.

10. The component package creating apparatus according to claim 6, wherein the component layout includes shapes, sizes and positions of the special pads; the auxiliary pad file includes shapes and sizes of the auxiliary pads; and the generating module is arranged to acquire the auxiliary pad file and place a pattern of each of the auxiliary pads at a position of the special pad corresponding thereto. ​

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