Die bonder with a dispensing structure

Abstract

The present application relates to a die bonder with a dispensing structure, comprising: a mounting frame module; a dispensing module, the dispensing module is arranged on the mounting frame module, the dispensing module includes a glue pan structure and a dispensing structure capable of taking glue from the glue pan structure, the glue pan structure includes a glue pan and a squeegee, and the squeegee and the glue pan can rotate relative to each other to scrape the glue in the glue pan flat; a material waiting module, the material waiting module is arranged on the mounting frame module; a die bonding module, the die bonding module is arranged on the mounting frame module; a blanking module, the blanking module is arranged on the mounting frame module; a conveying module, the conveying module is arranged on the mounting frame module and can drive the carrier plate to pass through the dispensing module, the material waiting module, the die bonding module and the blanking module in sequence. The technical solution of the present application effectively solves the problems of low integration and low working efficiency of the die bonder in the prior art.

Description

Technical Field

[0001] This application relates to the technical field of die bonders, and particularly to a die bonder with a dispensing structure. Background Art

[0002] With the rapid development of modern electronic information technology, higher and higher requirements are put forward for the miniaturization, portability, multi-function, high reliability, and low cost of electronic products. At present, in order to meet the requirements of various electronic products, electronic packaging has gradually got rid of its subordinate position as a post-process of microelectronics manufacturing and become relatively independent. In response to the special requirements of various electronic products, a variety of packaging technologies have been developed, and a large number of new theories, new materials, new processes, new equipment, and new electronic products have emerged; electronic packaging test technology is working together with chip design and manufacturing to jointly promote the development of the information society.

[0003] In the prior art, the dispensing and die bonding of the die bonder for electronic packaging test technology are designed separately. For example, the dispensing structure is set at a certain position, the die bonding structure is set at a certain position, and the carrier structure is set between the dispensing structure and the die bonding structure. The above structure is not conducive to achieving integration and has low working efficiency. Summary of the Invention

[0004] This application provides a die bonder with a dispensing structure to solve the problems of low integration and working efficiency of the die bonder in the prior art.

[0005] To achieve the above object, this application provides a die bonder with a dispensing structure, including: a mounting frame module; a dispensing module, the dispensing module is arranged on the mounting frame module, the dispensing module includes a glue pan structure and a dispensing structure that can pick up glue from the glue pan structure, the glue pan structure includes a glue pan and a squeegee, and the squeegee and the glue pan can rotate relative to each other to scrape the glue in the glue pan flat; a waiting module, the waiting module is arranged on the mounting frame module; a die bonding module, the die bonding module is arranged on the mounting frame module; a blanking module, the blanking module is arranged on the mounting frame module; a conveying module, the conveying module is arranged on the mounting frame module and can drive the carrier plate to sequentially pass through the dispensing module, the waiting module, the die bonding module, and the blanking module.

[0006] Further, the mounting frame module includes a base assembly, a guide rail assembly, and a runner assembly. The guide rail assembly is fixed on the base assembly, the runner assembly is movably arranged on the guide rail assembly, and the carrier plate can be supported on the runner assembly.

[0007] Further, the runner assembly includes a limit support frame structure. The limit support frame structure includes a first limit support plate and a second limit support plate. There is an adjustable predetermined distance between the first limit support plate and the second limit support plate to form a runner, and both the first limit support plate and the second limit support plate extend along the moving direction of the carrier plate.

[0008] Further, the first limit support plate includes a first limit plate and a first support plate. The first support plate is located on the side of the first limit plate close to the second limit support plate. The upper surface of the first support plate is lower than the upper surface of the first limit plate to form a first stepped surface. The second limit support plate includes a second limit plate and a second support plate. The second support plate is located on the side of the second limit plate close to the first limit support plate. The upper surface of the second support plate is lower than the upper surface of the second limit plate to form a second stepped surface.

[0009] Further, the runner assembly further includes a runner driving structure, and the runner driving structure is connected to the limit support frame structure to drive the limit support frame structure to change the predetermined distance of the runner.

[0010] Further, the runner driving structure includes a first motor, a lead screw, and two connecting parts. The output shaft of the first motor is connected to the lead screw. The two ends of the lead screw are respectively connected to the two connecting parts by threads. The first limit support plate and the second limit support plate are respectively fixedly connected to the two connecting parts.

[0011] Further, the die bonder further includes a first pressing plate structure and a first top plate structure. The first pressing plate structure is fixedly connected to the limit support frame. The first top plate structure is arranged on the mounting frame module. The first pressing plate structure and the first top plate structure are arranged corresponding to each other, and the first pressing plate structure cooperates with the dispensing module.

[0012] Further, the first top plate structure includes a second motor, a first cam, a first transmission part, and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part. The top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressing plate structure have a pressing position close to each other or the first top plate and the first pressing plate structure have a disengaged position far from each other.

[0013] Further, the first transmission part includes a first fitting block and a first connecting plate. The bottom surface of the first fitting block has an arc surface that cooperates with the first cam.

[0014] Further, the first top plate structure further includes a first elastic member. One end of the first elastic member is connected to the base assembly, and the second end of the first elastic member is connected to the first top plate structure so that the first transmission part contacts the first cam.

[0015] Further, the first pressing plate structure includes a first pressing plate and a second elastic member. The second elastic member is arranged on the first pressing plate. When the first top plate and the first pressing plate structure are in the pressing position, the first top plate and the second elastic member jointly press the carrier plate.

[0016] Further, the second elastic member includes a first elastic sheet, and the first elastic sheet is fixed on the first pressing plate.

[0017] Further, the first elastic piece includes a second connecting plate and a first pressing foot. The first end of the first pressing foot is connected to the side of the second connecting plate. The first pressing plate has a hollow hole. The second connecting plate is connected to the surface of the first pressing plate away from the first top plate structure. The second end of the first pressing foot passes through the hollow hole.

[0018] Further, the angle between the plane of the second connecting plate and the plane of the first pressing foot is greater than 90° and less than 180°. The second end of the first pressing foot has an outward flanging, and the flanging is connected to the first pressing foot through an arc connecting portion.

[0019] Further, the conveying module includes a third motor, a conveyor belt, a driven wheel, and a carrier clamping structure. The third motor and the driven wheel are respectively arranged at both ends of the mounting module. The conveyor belt is matched with the third motor and the driven wheel. The carrier clamping structure is arranged on the conveyor belt.

[0020] Further, the carrier clamping structure includes a clamping mounting seat, a fixed clamping portion, a movable clamping portion, and a clamping driving portion. The clamping mounting seat is mounted on the conveyor belt. The fixed clamping portion is fixedly arranged on the clamping mounting seat. The clamping driving portion is arranged on the clamping mounting seat. The clamping driving portion is connected to the movable clamping portion to drive the movable clamping portion to approach the fixed clamping portion to be in the clamping position, or to drive the movable clamping portion away from the fixed clamping portion to be in the loosening position.

[0021] Further, the glue disk structure further includes a glue disk base and a stepping motor. The stepping motor is mounted on the glue disk base. The output shaft of the stepping motor is connected to the glue disk to drive the glue disk to rotate.

[0022] Further, the glue disk structure further includes a first moving arm. The first moving arm is movably mounted on the mounting frame module. The scraper is mounted on the first moving arm.

[0023] Further, the dispensing structure includes a dispensing head and a second moving arm. The dispensing head is mounted on the second moving arm.

[0024] The above technical solutions provided by the embodiments of the present application have the following advantages compared with the prior art:

[0025] In the technical solution of the present application, the carrier is sequentially dispensed through the dispensing module under the conveyance of the conveying module, and then enters the waiting material module for detection, such as detecting whether the dispensing is qualified. After passing through the waiting material module, it enters the die bonding module under the drive of the conveying module. After the die bonding module completes die bonding, it passes through the blanking module. Through the operation of the pipeline of this solution, dispensing, detection, and die bonding are completed, which greatly improves the working efficiency of the die bonder. The structure in which the glue disk and the scraper can rotate relative to each other can make the glue in the glue disk easy to be scraped flat, which greatly improves the dispensing accuracy. The technical solution of the present application effectively solves the problems of low integration and working efficiency of the die bonder in the prior art. Description of the Drawings

[0026] The accompanying drawings herein are incorporated into and constitute a part of this specification, showing embodiments in accordance with the present invention, and are used together with the specification to explain the principles of the present invention.

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other accompanying drawings can be obtained based on these accompanying drawings without creative efforts.

[0028] Figure 1 Shows a schematic perspective view of a die bonder according to an embodiment of the present application;

[0029] Figure 2 Shows Figure 1 a schematic diagram of the runner structure of the die bonder;

[0030] Figure 3 Shows Figure 1 a schematic diagram of the first pressing plate structure of the die bonder;

[0031] Figure 4 Shows Figure 1 a schematic diagram of the runner driving structure of the die bonder;

[0032] Figure 5 Shows Figure 1 a schematic diagram of the glue disk structure of the die bonder;

[0033] Figure 6 Shows Figure 1 a schematic diagram of the glue disk structure and the dispensing structure of the die bonder.

[0034] Among them, the above accompanying drawings include the following reference numerals:

[0035] 10. Mounting frame module; 11. Base assembly; 12. Guide rail assembly; 13. Runner assembly; 131. Limit support frame structure; 132. Runner driving structure; 20. Dispensing module; 21. Glue disk structure; 211. Glue disk; 212. Scraper; 22. Dispensing structure; 30. Waiting material module; 40. Die bonding module; 50. Discharging module; 60. Conveying module; 70. First pressing plate structure; 71. First pressing plate; 72. Second elastic member; 80. First top plate structure. Detailed implementation manners

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the scope of protection of this application.

[0037] As Figures 1 to 6 shown, a die bonder with a dispensing structure according to this embodiment includes: a mounting frame module 10, a dispensing module 20, a material waiting module 30, a die bonding module 40, a blanking module 50, and a conveying module 60. The dispensing module 20 is arranged on the mounting frame module 10. The dispensing module includes a glue pan structure 21 and a dispensing structure 22 that can pick up glue from the glue pan structure 21. The glue pan structure 21 includes a glue pan 211 and a squeegee 212. The squeegee 212 and the glue pan 211 can rotate relative to each other to level the glue in the glue pan 211. The material waiting module 30 is arranged on the mounting frame module 10. The die bonding module 40 is arranged on the mounting frame module 10. The blanking module 50 is arranged on the mounting frame module 10. The conveying module 60 is arranged on the mounting frame module 10 and can drive the carrier plate to sequentially pass through the dispensing module 20, the material waiting module 30, the die bonding module 40, and the blanking module 50.

[0038] In the technical solution of this embodiment, the carrier is sequentially dispensed through the dispensing module 20 under the conveyance of the conveying module 60, and then enters the material waiting module 30 for inspection, such as inspecting whether the dispensing is qualified. After passing through the material waiting module 30, it enters the die bonding module 40 under the drive of the conveying module 60. After the die bonding module completes the die bonding work, it passes through the blanking module 50. Through the pipeline operation of this solution, dispensing, inspection, and die bonding are completed, thus greatly improving the working efficiency of the die bonder. The structure in which the glue pan 211 and the squeegee 212 can rotate relative to each other can easily level the glue in the glue pan 211, thus greatly improving the dispensing accuracy. The technical solution of this embodiment effectively solves the problems of low integration and working efficiency of the die bonder in the prior art. The carrier plate includes a carrier plate body and an object on the carrier plate body. The leveling here does not necessarily mean a flat surface, and a flat arc surface is also acceptable.

[0039] As Figure 1 and Figure 2As shown, in the technical solution of this embodiment, the mounting frame module 10 includes a base assembly 11, a guide rail assembly 12, and a runner assembly 13. The guide rail assembly 12 is fixed on the base assembly 11, and the runner assembly 13 is movably arranged on the guide rail assembly 12. The carrier plate can be supported on the runner assembly 13. The runner assembly 13 moves on the guide rail assembly 12, which can accommodate carrier plates of different sizes and models, making the die bonder more versatile. It should be noted that the extending direction of the guide rail assembly 12 is perpendicular to the extending direction of the runner assembly 13. The die bonder of this embodiment further includes a guiding structure fixed on the mounting frame module 10. The runner assembly 13 cooperates with the guiding structure, enabling the runner assembly 13 to move more smoothly when adjusting the width of the runner. There are multiple guide rail assemblies, and each guide rail assembly is adapted to the limit support frame structure 131 and is located at the bottom of the limit support frame structure 131.

[0040] As Figure 2 shown, in the technical solution of this embodiment, the runner assembly 13 includes a limit support frame structure 131. The limit support frame structure 131 includes a first limit support plate and a second limit support plate. There is an adjustable predetermined distance between the first limit support plate and the second limit support plate to form a runner. Both the first limit support plate and the second limit support plate extend along the moving direction of the carrier plate. The limit structure includes a first limit support plate and a second limit support plate. By adjusting the distance between the first limit support plate and the second limit support plate, it is possible to accommodate carrier plates of different sizes. Such a structure has a low manufacturing cost and is convenient to operate. It should be noted that the guiding structure: a plurality of guide rods. Both the first limit support plate and the second limit support plate pass through each guide rod, and the extending direction of each guide rod is parallel to the guide rail assembly 12.

[0041] As Figure 2As shown, in the technical solution of this embodiment, the first limit support plate includes a first limit plate and a first support plate, the first support plate is located on the side of the first limit plate close to the second limit support plate, the upper surface of the first support plate is lower than the upper surface of the first limit plate to form a first step surface, and the second limit support plate includes a second limit plate and a second support plate, the second support plate is located on the side of the second limit plate close to the first limit support plate, and the upper surface of the second support plate is lower than the upper surface of the second limit plate to form a second step surface. The cooperation of the first step surface and the second step surface can realize the support of the carrier plate, so that the upward support force can be realized on the carrier plate, reducing the force on the conveying module 60. The side of the first limit plate and the side of the second limit plate cooperate to prevent the carrier plate from being separated from the flow channel, so that the carrier plate can be better moved along the predetermined track. The structure of the first limit support plate and the second limit support plate of this embodiment is simple and easy to operate. It should be noted that the height of the first step surface and the second step surface is the same. The first limiting plate includes a first limiting plate segment, a second limiting plate segment, a third limiting plate segment and a fourth limiting plate segment, and the second limiting plate includes a fifth limiting plate segment, a sixth limiting plate segment, a seventh limiting plate segment and an eighth limiting plate segment. The first support plate includes a first support plate segment, a second support plate segment, a third support plate segment and a fourth support plate segment, and the second support plate includes a fifth support plate segment, a sixth support plate segment, a seventh support plate segment and an eighth support plate segment. The first limiting plate segment and the first support plate segment are connected together, the second limiting plate segment and the second support plate segment are connected together, the third limiting plate segment and the third support plate segment are connected together, and so on. The first limiting plate section, the first supporting plate section, the fifth limiting plate section and the fifth supporting plate section have the same length and are all arranged corresponding to the dispensing module 20; the second limiting plate section, the second supporting plate section, the sixth limiting plate section and the sixth supporting plate section have the same length and are arranged corresponding to the waiting module 30; the third limiting plate section, the third supporting plate section, the seventh limiting plate section and the seventh supporting plate section have the same length and are arranged corresponding to the crystal fixing module 40; the fourth limiting plate section, the fourth supporting plate section, the eighth limiting plate section and the eighth supporting plate section have the same length and are arranged corresponding to the unloading module 50.

[0042] like Figure 2 and Figure 4 As shown, in the technical solution of this embodiment, the flow channel assembly 13 also includes a flow channel driving structure 132, and the flow channel driving structure 132 is connected to the limit support frame structure 131 to drive the limit support frame structure 131 to change the predetermined distance of the flow channel. The above structure is easy to set and operate.

[0043] like Figure 2 and Figure 4As shown, in the technical solution of this embodiment, the runner driving structure 132 includes a first motor, a lead screw, and two connecting parts. The output shaft of the first motor is connected to the lead screw, and both ends of the lead screw are threadedly connected to the two connecting parts respectively. The first limit support plate and the second limit support plate are fixedly connected to the two connecting parts respectively. The runner driving structure 132 with the above structure has a relatively low processing cost and applies a relatively balanced force. Specifically, both ends of the lead screw connected to the two connecting parts have the same thread, so that the force exerted by the lead screw on the two connecting parts is relatively balanced, and the two connecting parts can be moved synchronously and simultaneously. The two connecting parts drive the first limit support plate and the second limit support plate to move synchronously and simultaneously respectively. When the size of the carrier plate changes and the width of the runner needs to be adjusted, the first limit plate and the second limit plate on both sides of the carrier plate move towards the carrier plate simultaneously and synchronously. In this way, the working accuracy is improved both in terms of force and moving distance. The first limit support plate and the second limit support plate extend in parallel. The loading platform transports the carrier plate to the runner, and finally the unloading module 50 pushes the carrier out of the runner. Such a pipeline operation has a relatively high efficiency.

[0044] As Figure 1 and Figure 3 shown, in the technical solution of this embodiment, the die bonder further includes a first pressing plate structure 70 and a first top plate structure 80. The first pressing plate structure 70 is fixedly connected to the limit support frame. The first top plate structure 80 is arranged on the mounting frame module 10. The first pressing plate structure 70 and the first top plate structure 80 are arranged corresponding to each other, and the first pressing plate structure 70 cooperates with the dispensing module 20. By fixing the carrier plate through the first pressing plate structure 70 and the first top plate structure 80, multi-directional limiting and fixing of the carrier plate can be achieved, which further ensures the accuracy of the carrier plate during operation. The second pressing plate structure and the second top plate structure are arranged at corresponding positions of the die bonding module 40.

[0045] As Figure 1 、 Figure 3 and Figure 4 shown, in the technical solution of this embodiment, the first top plate structure 80 includes a second motor, a first cam, a first transmission part, and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part, and the top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressing plate structure 70 have a pressing position close to each other or the first top plate and the first pressing plate structure 70 have a separating position away from each other. The structure of the first cam ensures that when the first top plate presses the carrier plate, the applied force is relatively gentle. Similarly, when the first top plate moves from the pressing position to the separating position, it also leaves gently.

[0046] As Figure 4As shown, in the technical solution of this embodiment, the first transmission part includes a first mating block and a first connecting plate. The bottom surface of the first mating block has an arc surface that mates with the first cam. The bottom surface of the first mating block having an arc surface that mates with the first cam results in a relatively large contact surface between the first mating block and the first cam, so that the cooperation between the first mating block and the first cam is relatively stable. In addition, the structure of the first mating block being an arc surface can also ensure that the first transmission part moves at the desired speed.

[0047] In the technical solution of this embodiment, the first top plate structure 80 further includes a first elastic member. One end of the first elastic member is connected to the base assembly 11, and the second end of the first elastic member is connected to the first top plate structure 80 so that the first transmission part is in contact with the first cam. The setting of the first elastic member ensures that the first cam and the first mating block can have a pressing force against each other under the action of an external force, that is, the first transmission part always has a downward acting force under the action of the spring force. The first elastic member includes two springs, and the two springs are symmetrically located on both sides of the first cam to make the acting force between the first transmission part and the first cam balanced and uniform. Specifically, the two springs are in a stretched state.

[0048] As Figure 3 shown, in the technical solution of this embodiment, the first pressing plate structure 70 includes a first pressing plate 71 and a second elastic member 72. The second elastic member 72 is arranged on the first pressing plate 71. When the first top plate and the first pressing plate structure 70 are in the pressing position, the first top plate and the second elastic member 72 jointly press the carrier plate. The setting of the second elastic member 72 enables the carrier plate not to be rigidly pressed when jointly pressed by the first top plate structure 80 and the first pressing plate structure 70, and the carrier plate has a buffering acting force. Such a structure ensures that the carrier plate is not easily damaged.

[0049] As Figure 3 shown, in the technical solution of this embodiment, the second elastic member 72 includes a first elastic sheet, and the first elastic sheet is fixed on the first pressing plate 71. The above structure is compact and convenient to use.

[0050] As Figure 3 shown, in the technical solution of this embodiment, the first elastic sheet includes a second connecting plate and a first pressing foot. The first end of the first pressing foot is connected to the side of the second connecting plate. The first pressing plate 71 has a hollow hole. The second connecting plate is connected to the surface of the first pressing plate 71 away from the first top plate structure 80, and the second end of the first pressing foot passes through the hollow hole. The above structure is compact and the processing cost is relatively low. Specifically, the second connecting plate and the first pressing foot are of an integrally formed structure.

[0051] As Figure 3As shown, in the technical solution of this embodiment, the angle between the plane of the second connecting plate and the plane of the first pressing foot is greater than 90° and less than 180°. The second end of the first pressing foot has an outward flanging, and the flanging is connected to the first pressing foot through an arc connecting portion. The angle between the plane of the second connecting plate and the plane of the first pressing foot is greater than 90° and less than 180°, which ensures the convenience of using the first elastic piece. For example, when the first elastic piece moves downward, the force and elastic force on the carrier plate can be realized by the increase in the angle between the plane of the second connecting plate and the plane of the first pressing foot. The second elastic piece includes a third connecting plate and two second pressing feet. The two second pressing feet are relatively arranged on both sides of the third connecting plate. The structures of the second connecting plate and the third connecting plate are the same, and the structures of the first pressing foot and the second pressing foot are the same. When there are multiple hollow holes, adjacent hollow holes have connecting bridges. The third connecting plate is connected to the connecting bridge, and both ends of the third connecting plate have second pressing feet, so that both sides of the third connecting plate can elastically press the carrier plate. The first elastic piece is used for the positions of the hollow holes at both ends, and the second elastic piece is used for the position of the connecting bridge in the middle of two adjacent hollow holes.

[0052] In the technical solution of this embodiment, the blanking module 50 includes an anti-static push rod, which pushes the carrier plate away from the runner assembly, and the anti-static push rod can also prevent static electricity from damaging the carrier plate.

[0053] As Figure 1 shown, in the technical solution of this embodiment, the conveying module 60 includes a third motor, a conveyor belt, a driven wheel and a carrier plate clamping structure. The third motor and the driven wheel are respectively arranged at both ends of the installation module. The conveyor belt is matched with the third motor and the driven wheel, and the carrier plate clamping structure is arranged on the conveyor belt. The conveyor belt can ensure that the span of the conveying module 60 is relatively large. In the technical solution of this embodiment, there can be multiple carrier plate clamping structures, and multiple carrier plate clamping structures improve the efficiency. For example, the dispensing module 20 and the die bonding module 40 can work simultaneously and move different carrier plates at the same time. The second top plate structure includes a fourth motor, a second cam, a second transmission part and a second top plate.

[0054] In the technical solution of this embodiment, the carrier plate clamping structure includes a clamping mounting seat, a fixed clamping part, a movable clamping part and a clamping driving part. The clamping mounting seat is mounted on the conveyor belt, the fixed clamping part is fixedly arranged on the clamping mounting seat, the clamping driving part is arranged on the clamping mounting seat, and the clamping driving part is connected to the movable clamping part to drive the movable clamping part to approach the fixed clamping part to be in the clamping position, or drive the movable clamping part to move away from the fixed clamping part to be in the loosening position. The position where the carrier plate clamping structure cooperates with the carrier plate uses PEEK (polyether ether ketone) material, and the carrier plate clamping structure with the above structure is convenient to operate. The movable clamping part can be connected to a cylinder or a hydraulic cylinder or an electric push rod.

[0055] It should be noted that the die bonding machine of this embodiment has multiple cameras. For example, a camera (which can also be a camera as needed) is provided at the position of the material waiting module 30 to detect the result of dispensing. Both the dispensing module 20 and the die bonding module are provided with cameras to detect dispensing and die bonding. This embodiment is also provided with a mobile camera, which can be moved to the position required for detection as needed.

[0056] like Figure 5 and Figure 6 As shown, in the technical solution of this embodiment, the glue disc structure 21 also includes a glue disc base and a stepper motor, the stepper motor is installed on the glue disc base, and the output shaft of the stepper motor is connected to the glue disc 211 to drive the glue disc 211 to rotate. The glue disc 211 is driven to rotate by the stepper motor to realize the cooperation between the scraper 212 and the glue disc 211, which further improves the working efficiency of the glue dispensing module 20 and makes the glue dispensing module 20 have a higher degree of automation.

[0057] like Figure 5 and Figure 6 As shown, in the technical solution of this embodiment, the glue disc structure 21 also includes a first movable arm, which is movably mounted on the mounting frame module 10, and the scraper 212 is mounted on the first movable arm. When the scraper 212 needs to work, the first movable arm is moved to a position where the scraper 212 cooperates with the glue disc 211, and when the scraper 212 does not work, the scraper 212 is moved to an avoidance position by the first movable arm, which can improve the efficiency of glue dispensing.

[0058] like Figure 5 and Figure 6 As shown, in the technical solution of this embodiment, the dispensing structure 22 includes a dispensing head and a second moving arm, and the dispensing head is mounted on the second moving arm. It should be noted that the drive of the second moving arm motor can move along the X-axis direction, the Y-axis direction and the Z-axis direction, and the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other. This further improves the degree of automation of the movement of the dispensing head.

[0059] It should be noted that in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

[0060] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather to the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A die bonder with a dispensing structure, characterized in that, Comprising: A mounting frame module (10); A dispensing module (20), the dispensing module (20) being arranged on the mounting frame module (10), the dispensing module (20) including a glue tray structure (21) and a dispensing structure (22) capable of taking glue from the glue tray structure (21), the glue tray structure (21) including a glue tray (211) and a squeegee (212), the squeegee (212) and the glue tray (211) being relatively rotatable to level the glue in the glue tray (211); A material waiting module (30), the material waiting module (30) being arranged on the mounting frame module (10); A die bonding module (40), the die bonding module (40) being arranged on the mounting frame module (10); A blanking module (50), the blanking module (50) being arranged on the mounting frame module (10); A conveying module (60), the conveying module (60) being arranged on the mounting frame module (10) and capable of driving a carrier plate to sequentially pass through the dispensing module (20), the material waiting module (30), the die bonding module (40) and the blanking module (50); Wherein, the mounting frame module (10) includes a base assembly (11), a guide rail assembly (12) and a runner assembly (13), the guide rail assembly (12) being fixed on the base assembly (11), the runner assembly (13) being movably arranged on the guide rail assembly (12), and the carrier plate being supportable on the runner assembly (13); The runner assembly (13) includes a limit support frame structure (131), the limit support frame structure (131) including a first limit support plate and a second limit support plate, there being an adjustable predetermined distance between the first limit support plate and the second limit support plate to form a runner, and both the first limit support plate and the second limit support plate extending along the moving direction of the carrier plate; The die bonder further includes a first pressing plate structure (70) and a first top plate structure (80), the first pressing plate structure (70) being fixedly connected to the limit support frame, the first top plate structure (80) being arranged on the mounting frame module (10), the first pressing plate structure (70) being arranged corresponding to the first top plate structure (80), and the first pressing plate structure (70) cooperating with the dispensing module (20).

2. The die bonder according to claim 1, wherein, The first limit support plate includes a first limit plate and a first support plate, the first support plate being located on the side of the first limit plate close to the second limit support plate, the upper surface of the first support plate being lower than the upper surface of the first limit plate to form a first step surface, the second limit support plate includes a second limit plate and a second support plate, the second support plate being located on the side of the second limit plate close to the first limit support plate, and the upper surface of the second support plate being lower than the upper surface of the second limit plate to form a second step surface.

3. The die bonder according to claim 1, characterized in that, The flow channel assembly (13) further includes a flow channel driving structure (132). The flow channel driving structure (132) is connected to the limit support frame structure (131) to drive the limit support frame structure (131) to change the predetermined distance of the flow channel.

4. The die bonder according to claim 3, wherein, The flow channel driving structure (132) includes a first motor, a lead screw, and two connecting parts. The output shaft of the first motor is connected to the lead screw. The two ends of the lead screw are respectively connected to the two connecting parts by threads. The first limit support plate and the second limit support plate are respectively fixedly connected to the two connecting parts.

5. The die bonder according to claim 1, wherein, The first top plate structure (80) includes a second motor, a first cam, a first transmission part, and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part. The top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressing plate structure (70) have a pressing position close to each other or the first top plate and the first pressing plate structure (70) have a separating position far from each other.

6. The die bonder according to claim 5, wherein The first transmission part includes a first mating block and a first connecting plate. The bottom surface of the first mating block has an arc surface that cooperates with the first cam.

7. The die bonder according to claim 5, characterized in that, The first top plate structure (80) further includes a first elastic member. One end of the first elastic member is connected to the base assembly (11), and the second end of the first elastic member is connected to the first top plate structure (80) so that the first transmission part contacts the first cam.

8. The die bonder according to claim 5, wherein, The first pressing plate structure (70) includes a first pressing plate (71) and a second elastic member (72). The second elastic member (72) is arranged on the first pressing plate (71). When the first top plate and the first pressing plate structure (70) are in the pressing position, the first top plate and the second elastic member (72) jointly press the carrier plate.

9. The die bonder according to claim 8, wherein, The second elastic member (72) includes a first elastic sheet. The first elastic sheet is fixed on the first pressing plate (71).

10. The die bonder according to claim 9, characterized in that, The first elastic sheet includes a second connecting plate and a first pressing foot. The first end of the first pressing foot is connected to the side of the second connecting plate. The first pressing plate (71) has a hollow hole. The second connecting plate is connected to the surface of the first pressing plate (71) far from the first top plate structure (80). The second end of the first pressing foot passes through the hollow hole.

11. The die bonder according to claim 10, wherein The angle between the plane of the second connecting plate and the plane of the first pressing foot is greater than 90° and less than 180°. The second end of the first pressing foot has an outward flanging. The flanging is connected to the first pressing foot by an arc connecting part.

12. The die bonder according to claim 1, characterized in that, The conveying module (60) includes a third motor, a conveyor belt, a driven wheel, and a carrier plate clamping structure. The third motor and the driven wheel are respectively arranged at both ends of the mounting frame module. The conveyor belt cooperates with the third motor and the driven wheel. The carrier plate clamping structure is arranged on the conveyor belt.

13. The die bonder according to claim 12, characterized in that, The carrier plate clamping structure includes a clamping mounting base, a fixed clamping portion, a movable clamping portion, and a clamping driving portion. The clamping mounting base is mounted on the conveyor belt. The fixed clamping portion is fixedly arranged on the clamping mounting base. The clamping driving portion is arranged on the clamping mounting base, and the clamping driving portion is connected to the movable clamping portion to drive the movable clamping portion to approach the fixed clamping portion to be in the clamping position, or to drive the movable clamping portion to move away from the fixed clamping portion to be in the loosening position.

14. The die bonder according to any one of claims 1 to 13, characterized in that, The glue pan structure (21) further includes a glue pan base and a stepping motor. The stepping motor is mounted on the glue pan base, and the output shaft of the stepping motor is connected to the glue pan (211) to drive the glue pan (211) to rotate.

15. The die bonder according to claim 14, characterized in that, The glue pan structure (21) further includes a first moving arm. The first moving arm is movably mounted on the mounting frame module (10), and the squeegee (212) is mounted on the first moving arm.

16. The die bonder according to claim 14, wherein, The dispensing structure (22) includes a dispensing head and a second moving arm. The dispensing head is mounted on the second moving arm.

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