Crystal bonding machine with blue film component and crystal bonding method

Abstract

The present application relates to a die bonding machine and die bonding method having a blue film assembly, comprising: a mounting frame module; a dispensing module disposed on the mounting frame module; a material waiting module disposed on the mounting frame module; a die bonding module disposed on the mounting frame module, the die bonding module comprising a die bonding head structure, a robotic arm structure, and a blue film assembly, the robotic arm being mounted on the mounting frame module, the die bonding head structure being mounted on the robotic arm structure, the robotic arm structure being capable of driving the die bonding head structure to move, the blue film assembly comprising a blue film structure and a pin structure, the pin structure and the blue film structure being capable of relative movement so that the pin structure can lift up a chip on the blue film structure; a material unloading module being disposed on the mounting frame module; a conveying module being disposed on the mounting frame module and capable of driving a carrier plate to move between the dispensing module, the material waiting module, the die bonding module, and the material unloading module. The technical solution of the present application effectively solves the problems of low integration and working efficiency of die bonding machines in the prior art.

Description

Technical Field

[0001] The present application relates to the technical field of crystal bonding machines, and in particular to a crystal bonding machine having a blue film component and a crystal bonding method. Background Art

[0002] The rapid development of modern electronic information technology has placed increasing demands on electronic products for miniaturization, portability, multi-functionality, high reliability, and low cost. To meet the demands of various electronic products, electronic packaging has gradually emerged from its subordinate position as a post-process in microelectronics manufacturing, becoming relatively independent. A wide variety of packaging technologies have been developed to meet the specific requirements of various electronic products, resulting in the emergence of a large number of new theories, new materials, new processes, new equipment, and new electronic products. Electronic packaging and testing technologies, along with chip design and manufacturing, are driving the development of an information society.

[0003] In existing electronic packaging and testing technologies, die-bonding machines are designed with separate dispensing and die-bonding functions. For example, the dispensing mechanism is positioned at a specific location, the die-bonding mechanism is positioned at a specific location, and the carrier structure is positioned between the dispensing and die-bonding mechanisms. This structure is not conducive to achieving integration and has low efficiency. Summary of the Invention

[0004] The present application provides a die bonding machine and a die bonding method having a blue film component, so as to solve the problems of low integration and working efficiency of the die bonding machine in the prior art.

[0005] To achieve the above-mentioned objectives, on the one hand, the present application provides a crystal bonding machine with a blue film assembly, including: a mounting frame module; a dispensing module, the dispensing module is arranged on the mounting frame module; a waiting module, the waiting module is arranged on the mounting frame module; a crystal bonding module, the crystal bonding module is arranged on the mounting frame module, the crystal bonding module includes a crystal bonding head structure, a mechanical arm structure and a blue film assembly, the mechanical arm is installed on the mounting frame module, the crystal bonding head structure is installed on the mechanical arm structure, the mechanical arm structure can drive the crystal bonding head structure to move, the blue film assembly includes a blue film structure and a pin structure, the pin structure and the blue film structure can move relative to each other so that the pin structure can lift the chip on the blue film structure; a material unloading module, the material unloading module is arranged on the mounting frame module; and a conveying module, the conveying module is arranged on the mounting frame module and can drive the carrier to move between the dispensing module, the waiting module, the crystal bonding module and the material unloading module.

[0006] Furthermore, the mounting frame module includes a base assembly, a guide rail assembly and a flow channel assembly, the guide rail assembly is fixed on the base assembly, the flow channel assembly is movably arranged on the guide rail assembly, and the carrier plate can be supported on the flow channel assembly.

[0007] Furthermore, the flow channel assembly includes a limiting support frame structure, the limiting support frame structure includes a first limiting support plate and a second limiting support plate, and there is an adjustable predetermined distance between the first limiting support plate and the second limiting support plate to form a flow channel, and the first limiting support plate and the second limiting support plate both extend along the moving direction of the carrier plate.

[0008] Furthermore, the first limiting support plate includes a first limiting plate and a first support plate, the first support plate is located on the side of the first limiting support plate close to the second limiting support plate, the upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first step surface, and the second limiting support plate includes a second limiting plate and a second support plate, the second support plate is located on the side of the second limiting plate close to the first limiting support plate, the upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second step surface.

[0009] Furthermore, the flow channel assembly also includes a flow channel driving structure, which is connected to the limiting support frame structure to drive the limiting support frame structure to change the predetermined distance of the flow channel.

[0010] Furthermore, the flow channel driving structure includes a first motor, a screw and two connecting parts. The output shaft of the first motor is connected to the screw, and the two ends of the screw are respectively connected to the two connecting parts through threads. The first limit support plate and the second limit support plate are respectively fixedly connected to the two connecting parts.

[0011] Furthermore, the crystal bonding machine also includes a first pressure plate structure and a first top plate structure. The first pressure plate structure is fixedly connected to the limiting support frame, the first top plate structure is arranged on the mounting frame module, the first pressure plate structure is arranged corresponding to the first top plate structure, and the first pressure plate structure cooperates with the dispensing module.

[0012] Furthermore, the first top plate structure includes a second motor, a first cam, a first transmission part and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part. The top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressure plate structure have a pressing position close to each other or the first top plate and the first pressure plate structure have a disengagement position far away from each other.

[0013] Furthermore, the first transmission part includes a first matching block and a first connecting plate, and the bottom surface of the first matching block has an arc surface matching with the first cam.

[0014] Furthermore, the first top plate structure also includes a first elastic member, one end of the first elastic member is connected to the base assembly, and a second end of the first elastic member is connected to the first top plate structure so that the first transmission part contacts the first cam.

[0015] Furthermore, the first pressure plate structure includes a first pressure plate and a second elastic member, the second elastic member is arranged on the first pressure plate, and when the first top plate and the first pressure plate structure are in the pressing position, the first top plate and the second elastic member jointly press the carrier plate.

[0016] Furthermore, the second elastic member includes a first elastic piece, and the first elastic piece is fixed on the first pressing plate.

[0017] Furthermore, the first spring plate includes a first connecting plate and a first pressure foot, the first end of the first pressure foot is connected to the side of the first connecting plate, the first pressure plate has a hollow hole, the first connecting plate is connected to the surface of the first pressure plate away from the first top plate structure, and the second end of the first pressure foot passes through the hollow hole.

[0018] Furthermore, the angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90 degrees and less than 180 degrees, and the second end of the first presser foot has an outward flange, which is connected to the first presser foot through an arc-shaped connecting portion.

[0019] Furthermore, the conveying module includes a third motor, a conveyor belt, a driven wheel and a carrier plate clamping structure. The third motor and the driven wheel are respectively arranged at both ends of the installation module. The conveyor belt cooperates with the third motor and the driven wheel, and the carrier plate clamping structure is arranged on the conveyor belt.

[0020] Furthermore, the carrier plate clamping structure includes a clamping mounting seat, a fixed clamping portion, a movable clamping portion and a clamping drive portion. The clamping mounting seat is installed on the conveyor belt, the fixed clamping portion is fixedly arranged on the clamping mounting seat, the clamping drive portion is arranged on the clamping mounting seat, and the clamping drive portion is connected to the movable clamping portion to drive the movable clamping portion to be close to the fixed clamping portion in a clamping position, or drive the movable clamping portion away from the fixed clamping portion to be in a release position.

[0021] Furthermore, the die bonding head structure includes a die bonding head and a die bonding head connecting base. The die bonding head connecting base is fixed on the mechanical arm structure, and the die bonding head is mounted on the die bonding head connecting base through magnetic force.

[0022] Furthermore, the crystal bonding head includes a crystal bonding head body and a crystal bonding head mounting seat. The crystal bonding head mounting seat has a mounting hole, and the crystal bonding head body is mounted in the mounting hole.

[0023] Furthermore, the solid crystal head mounting seat includes a ferromagnetic body, a first mounting section, a limiting section and a second mounting section, the limiting section is located between the first mounting section and the second mounting section, the ferromagnetic body is located on the side of the first mounting section away from the limiting section, and the outer diameter of the limiting section is larger than the outer diameter of the first mounting section.

[0024] Furthermore, the die-bonding head connecting seat includes a seat body and a connecting pipe. The connecting pipe is arranged on a side wall of the seat body and can be communicated with the die-bonding head body.

[0025] Furthermore, the mounting hole extends from the end of the second mounting section away from the limiting section to the first mounting section, and the side wall of the first mounting section has a connecting hole, which connects the mounting hole and the connecting pipe.

[0026] Furthermore, the die-bonding head connection seat further includes a magnet, the seat body includes an accommodating space, and the magnet is arranged in the accommodating space.

[0027] Furthermore, the ferromagnetic body and the first installation section are located in the accommodation space, and a mutually matching limiting portion is provided between the first installation section and the wall surface of the accommodation space.

[0028] Furthermore, the die bonding module further comprises a die bonding head removal structure and a die bonding head storage structure, and both the die bonding head removal structure and the die bonding head storage structure are arranged on the mounting frame module.

[0029] According to another aspect of the present application, a die bonding method is provided, using the above-mentioned die bonding machine, the steps of which include:

[0030] S10 dispensing;

[0031] S20 post-dispensing inspection;

[0032] After S30 dispensing, those that pass the inspection will be bonded.

[0033] Furthermore, the die bonding process includes the following steps:

[0034] The S31 ejector pin structure is aligned with the blue film structure and moves to the chip position;

[0035] The S32 die bonding head structure aligns the blue film structure and moves to the chip position;

[0036] The S33 ejector pin structure adsorbs the blue film of the blue film structure;

[0037] The S34 ejector pin structure ejects the chip while the die bonding head of the die bonding head structure holds the chip in place.

[0038] The S35 die bonding head structure aligns the carrier, and the die bonding head moves to the corresponding position to complete the die bonding.

[0039] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0040] The technical solution of the present application is that the carrier is transported by the conveying module and sequentially passes through the dispensing module for dispensing, and then enters the waiting module for inspection, such as to check whether the dispensing is qualified. After passing through the waiting module, it enters the crystal bonding module under the drive of the conveying module. The mechanical arm structure in the crystal bonding module drives the crystal bonding head structure to pick up the chip on the blue film component and fix it to the carrier. After the crystal bonding module completes the crystal bonding, it passes through the unloading module. The operation of the assembly line of this solution completes the dispensing, inspection, and crystal bonding, which greatly improves the working efficiency of the crystal bonding machine. The technical solution of the present application effectively solves the problems of low integration and working efficiency of the crystal bonding machine in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0043] Figure 1 A schematic diagram of the three-dimensional structure of a die bonder according to an embodiment of the present application is shown;

[0044] Figure 2 Shown Figure 1 Schematic diagram of the flow channel structure of the die bonder;

[0045] Figure 3 Shown Figure 1 A schematic diagram of the first pressing plate structure of the die bonder;

[0046] Figure 4 Shown Figure 1 Schematic diagram of the flow channel driving structure of the die bonding machine;

[0047] Figure 5 Shown Figure 1 A partially enlarged schematic diagram of a die bonding module of a die bonding machine;

[0048] Figure 6 Shown Figure 1 Schematic diagram of the matching of the die bonding module of the die bonding machine;

[0049] Figure 7 Shown Figure 6 A schematic diagram of a die bonding head storage structure of a die bonding module;

[0050] Figure 8 Shown Figure 1 Schematic diagram of the die bonding structure of the die bonding machine;

[0051] Figure 9 Shown Figure 8 Schematic diagram of a die bonding head of a die bonding structure;

[0052] Figure 10 Shown Figure 1 Schematic diagram of the structure of the blue film component of the die bonding machine;

[0053] Figure 11 Shown Figure 10 Schematic diagram of the installation structure of the ejector pin structure of the blue membrane component;

[0054] Figure 12 Shown Figure 10 Schematic diagram of the structure of the ejector pin structure of the blue membrane component.

[0055] The above drawings include the following reference numerals:

[0056] 10. Mounting frame module; 11. Base assembly; 12. Guide rail assembly; 13. Runner assembly; 131. Limiting support frame structure; 132. Runner drive structure; 20. Dispensing module; 30. Waiting module; 40. Crystal bonding module; 41. Crystal bonding head structure; 411. Crystal bonding head; 412. Crystal bonding head connecting seat; 42. Robotic arm structure; 43. Blue film assembly; 431. Blue film structure; 432. Ejector pin structure; 44. Crystal bonding head storage structure; 50. Unloading module; 60. Conveying module; 70. First pressure plate structure; 71. First pressure plate; 72. Second elastic member; 80. First top plate structure. DETAILED DESCRIPTION

[0057] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0058] like Figures 1 to 12As shown, a die bonding machine of this embodiment includes: a mounting frame module 10, a dispensing module 20, a material waiting module 30, a die bonding module 40, a material unloading module 50 and a conveying module 60. The dispensing module 20 is arranged on the mounting frame module 10. The material waiting module 30 is arranged on the mounting frame module 10. The die bonding module 40 is arranged on the mounting frame module 10. The die bonding module 40 includes a die bonding head structure 41 and a mechanical arm structure 42. The mechanical arm is installed on the mounting frame module 10. The die bonding head structure 41 is installed on the mechanical arm structure 42. The mechanical arm structure 42 can drive the die bonding head structure 41 to move. The blue film assembly 43 includes a blue film structure 431 and a pin structure 432. The pin structure 432 and the blue film structure 431 can move relative to each other so that the pin structure 432 can lift the chip on the blue film structure 431. The unloading module 50 is arranged on the mounting frame module 10. The conveying module 60 is disposed on the mounting frame module 10 and can drive the carrier to move in the dispensing module 20 , the material waiting module 30 , the die bonding module 40 and the unloading module 50 .

[0059] In the technical solution of this embodiment, the carrier is transported by the conveying module 60 and sequentially passes through the dispensing module 20 for dispensing, and then enters the waiting module 30 for inspection, for example, to detect whether the dispensing is qualified. After passing through the waiting module 30, it enters the solidification module 40 under the drive of the conveying module 60. The mechanical arm structure in the solidification module drives the solidification head structure to pick up the chip on the blue film component and fix it to the carrier. After the solidification module completes the solidification work, it passes through the unloading module 50. The operation of the assembly line of this solution completes the dispensing, inspection, and solidification, which greatly improves the working efficiency of the solidification machine. The technical solution of this embodiment effectively solves the problems of integration and low working efficiency of the solidification machine in the prior art. The carrier includes a carrier body and an object on the carrier body.

[0060] It should be noted that the blue film assembly 43 is fixed to the mounting frame module 10. The blue film structure 431 and the ejector structure 432 share a blue film mounting seat. The blue film mounting seat is mounted on the mounting frame module 10. The ejector structure 432 is mounted on the blue film mounting seat via a walking structure. The movement of the ejector structure 432 can expand the working range of the ejector structure 432, thereby increasing the working efficiency of the ejector structure 432 and increasing the available space. There are four blue film structures 431, and the four blue film structures form a square. When the ejector structure 432 is idle, it is set in the middle of the four blue film structures 431.

[0061] like Figure 10 As shown, a blue film assembly 43 includes a blue film loading platform (blue film structure 431) and a ejector pin structure 432. The blue film loading platform is a fixed structure, and the ejector pin structure 432 can be adjusted in the x, y, and z directions according to the alignment conditions ( Figure 11 left, right, front, back, up, and down).

[0062] The blue film loading platform can accommodate wafers of varying sizes using mounting rings, adapter kits, and tool clips. Multiple wafers of varying sizes can be loaded simultaneously. Drawer-style slides are installed at both ends of the platform, allowing for easy extraction and replacement of wafers during operator control. Positioning cylinders are located at each end of the drawer slides to maintain the platform parallel to the marble surface. A square handle is located at the front of the platform for easy extraction. The alignment cylinders, equipped with a speed control valve and a cylinder sensor, assist in the movement of the drawer slides.

[0063] The ejector structure consists of a servo motor and a linear module. The servo motor and linear module are connected via a synchronous belt and pulley. The mounting plate is connected to the linear module's slider, which drives the entire ejector structure's initial z-direction movement. A stepper motor is connected to the ejector cover via a coupling and mounting plate. The ejector pins are mounted inside the cover to protect them from damage or foreign matter. The top of the cover has multiple suction holes. During wafer extraction, the cover holds the blue film, while the stepper motor drives the ejector head in further z-direction movement, enabling efficient and high-precision chip ejection.

[0064] The ejector structure is equipped with y-direction linear guides and linear motor movers on its left and right sides. The backplate is connected to the y-direction mounting plate, which is in turn connected to the y-direction slider. The slider drives the ejector structure in the y-direction. A grating scale and a grating scale reader are located inside the linear motor mover to reduce errors. Ejector structure 432 includes x-direction linear guides and linear motor movers located at the front and rear. A grating scale and a grating scale reader are located inside the linear motor mover to reduce errors. The x-direction linear guide slider drives the entire ejector structure in the x-direction.

[0065] like Figure 1 and Figure 2 As shown, in the technical solution of this embodiment, the mounting frame module 10 includes a base assembly 11, a guide rail assembly 12 and a flow channel assembly 13. The guide rail assembly 12 is fixed on the base assembly 11, the flow channel assembly 13 is movably arranged on the guide rail assembly 12, and the carrier plate can be supported on the flow channel assembly 13. The flow channel assembly 13 moves on the guide rail assembly 12 and can adapt to carrier plates of different sizes and models. Such a crystal bonding machine is more versatile. It should be noted that the extension direction of the guide rail assembly 12 is perpendicular to the extension direction of the flow channel assembly 13. The crystal bonding machine of this embodiment also includes a guide structure, which is fixed on the mounting frame module 10. The flow channel assembly 13 cooperates with the guide structure so that the flow channel assembly 13 moves more smoothly when adjusting the width of the flow channel. The guide rail assembly includes a plurality of guide rail assemblies, each guide rail assembly is adapted to the limiting support frame structure 131, and is located at the bottom of the limiting support frame structure 131.

[0066] like Figure 2As shown, in the technical solution of this embodiment, the flow channel assembly 13 includes a limiting support frame structure 131, and the limiting support frame structure 131 includes a first limiting support plate and a second limiting support plate. The first limiting support plate and the second limiting support plate have an adjustable predetermined distance between them to form a flow channel, and the first limiting support plate and the second limiting support plate both extend along the moving direction of the carrier plate. The limiting structure includes a first limiting support plate and a second limiting support plate. By adjusting the distance between the first limiting support plate and the second limiting support plate, it is possible to adapt to carrier plates of different sizes. Such a structure has a low manufacturing cost and is easy to operate. It should be noted that the guide structure: multiple guide rods, the first limiting support plate and the second limiting support plate both pass through each guide rod, and the extension direction of each guide rod is parallel to the guide rail assembly 12.

[0067] like Figure 2As shown, in the technical solution of this embodiment, the first limiting support plate includes a first limiting plate and a first support plate, the first support plate is located on the side of the first limiting support plate close to the second limiting support plate, and the upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first step surface, and the second limiting support plate includes a second limiting plate and a second support plate, the second support plate is located on the side of the second limiting plate close to the first limiting support plate, and the upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second step surface. The cooperation of the first step surface and the second step surface can achieve support for the carrier plate, thereby achieving an upward support force for the carrier plate and reducing the force on the conveying module 60. The side surface of the first limiting plate and the side surface of the second limiting plate cooperate to prevent the carrier plate from deviating from the flow channel, so that the carrier plate can move better along the predetermined track. The first limiting support plate and the second limiting support plate of this embodiment have a simple structure and are easy to operate. It should be noted that the heights of the first step surface and the second step surface are the same. The first limiting plate includes a first limiting plate segment, a second limiting plate segment, a third limiting plate segment, and a fourth limiting plate segment, and the second limiting plate includes a fifth limiting plate segment, a sixth limiting plate segment, a seventh limiting plate segment, and an eighth limiting plate segment. The first support plate includes a first support plate segment, a second support plate segment, a third supporting plate segment, and a fourth support plate segment, and the second support plate includes a fifth support plate segment, a sixth support plate segment, a seventh supporting plate segment, and an eighth support plate segment. The first limiting plate segment and the first support plate segment are connected together, the second limiting plate segment and the second support plate segment are connected together, the third limiting plate segment and the third support plate segment are connected together, and so on. The first limiting plate section, the first support plate section, the fifth limiting plate section and the fifth support plate section have the same length and are all arranged corresponding to the dispensing module 20; the second limiting plate section, the second support plate section, the sixth limiting plate section and the sixth support plate section have the same length and are arranged corresponding to the waiting module 30; the third limiting plate section, the third support plate section, the seventh limiting plate section and the seventh support plate section have the same length and are arranged corresponding to the crystal bonding module 40; the fourth limiting plate section, the fourth support plate section, the eighth limiting plate section and the eighth support plate section have the same length and are arranged corresponding to the blanking module 50.

[0068] like Figure 2 and Figure 4 As shown, in the technical solution of this embodiment, the flow channel assembly 13 further includes a flow channel driving structure 132, which is connected to the limit support frame structure 131 to drive the limit support frame structure 131 to change the predetermined distance of the flow channel. The above structure is easy to set and operate.

[0069] like Figure 2 and Figure 4As shown, in the technical solution of this embodiment, the flow channel drive structure 132 includes a first motor, a screw and two connecting parts. The output shaft of the first motor is connected to the screw, and the two ends of the screw are respectively connected to the two connecting parts by threads. The first limit support plate and the second limit support plate are respectively fixedly connected to the two connecting parts. The flow channel drive structure 132 of the above structure has a low processing cost and the applied force is relatively balanced. Specifically, the two ends of the screw connected to the two connecting parts have the same thread, so that the force exerted by the screw on the two connecting parts is relatively balanced, and the two connecting parts can be moved synchronously and simultaneously. The two connecting parts respectively drive the first limit support plate and the second limit support plate to move synchronously and simultaneously. When the size of the carrier plate changes and the width of the flow channel needs to be adjusted, the first limit plate and the second limit plate on both sides of the carrier plate are simultaneously and synchronously moved toward the carrier plate, thereby improving the working accuracy in terms of both force and movement distance.

[0070] like Figure 1 and Figure 3 As shown, in the technical solution of this embodiment, the die bonder also includes a first pressure plate structure 70 and a first top plate structure 80. The first pressure plate structure 70 is fixedly connected to the limit support frame. The first top plate structure 80 is arranged on the mounting frame module 10. The first pressure plate structure 70 and the first top plate structure 80 are arranged correspondingly. The first pressure plate structure 70 cooperates with the dispensing module 20. By fixing the carrier plate with the first pressure plate structure 70 and the first top plate structure 80, the carrier plate can be limited and fixed in multiple directions, which further ensures the accuracy of the carrier plate during operation. The second pressure plate structure and the second top plate structure are arranged at positions corresponding to the die bond module 40.

[0071] like Figure 1 、 Figure 3 and Figure 4 As shown, in the technical solution of this embodiment, the first top plate structure 80 includes a second motor, a first cam, a first transmission part, and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part. The top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressure plate structure 70 have a mutually close pressing position or a mutually separated disengaged position. The structure of the first cam ensures that the first top plate exerts a relatively gentle force when pressing the carrier plate. Similarly, when the first top plate moves from the pressing position to the disengaged position, it also moves smoothly.

[0072] like Figure 4As shown, in the technical solution of this embodiment, the first transmission portion includes a first mating block and a first connecting plate. The bottom surface of the first mating block has an arcuate surface that mates with the first cam. This arcuate surface on the bottom surface of the first mating block mates with the first cam, resulting in a relatively large contact surface between the first mating block and the first cam, thereby ensuring a more stable fit between the first mating block and the first cam. In addition, the arcuate surface of the first mating block also ensures that the first transmission portion moves at the desired speed.

[0073] In the technical solution of this embodiment, the first top plate structure 80 also includes a first elastic member, one end of which is connected to the base assembly 11, and the second end of the first elastic member is connected to the first top plate structure 80 so that the first transmission part is in contact with the first cam. The provision of the first elastic member ensures that the first cam and the first matching block can exert a force against each other under the action of an external force, that is, the first transmission part always maintains a downward force under the action of the spring force. The first elastic member includes two springs, which are symmetrically located on both sides of the first cam to ensure that the force between the first transmission part and the first cam is balanced and uniform. Specifically, the two springs are in a stretched state.

[0074] like Figure 3 As shown, in the technical solution of this embodiment, the first pressure plate structure 70 includes a first pressure plate 71 and a second elastic member 72. The second elastic member 72 is disposed on the first pressure plate 71. When the first top plate and the first pressure plate structure 70 are in the pressing position, the first top plate and the second elastic member 72 jointly press the carrier plate. The provision of the second elastic member 72 prevents the carrier plate from being rigidly pressed when the first top plate structure 80 and the first pressure plate structure 70 jointly press the carrier plate. Instead, the carrier plate has a buffering force, which ensures that the carrier plate is not easily damaged.

[0075] like Figure 3 As shown, in the technical solution of this embodiment, the second elastic member 72 includes a first elastic piece, and the first elastic piece is fixed on the first pressing plate 71. The above structure is compact and easy to use.

[0076] like Figure 3 As shown, in the technical solution of this embodiment, the first spring plate includes a first connecting plate and a first presser foot. The first end of the first presser foot is connected to the side of the first connecting plate. The first presser plate 71 has a hollow hole. The first connecting plate is connected to the surface of the first presser plate 71 away from the first top plate structure 80, and the second end of the first presser foot passes through the hollow hole. This structure is compact and has low processing costs. Specifically, the first connecting plate and the first presser foot are integrally formed.

[0077] like Figure 3As shown, in the technical scheme of the present embodiment, the angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90 degrees and less than 180 degrees, and the second end of the first presser foot has an outward flange, and the flange is connected to the first presser foot by an arc connecting portion. The angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90 degrees and less than 180 degrees, which ensures the convenience of use of the first elastic fragment. For example, when the first elastic fragment moves downward, the angle between the plane of the first connecting plate and the plane of the first presser foot increases, which can achieve the force and elastic force on the carrier plate. The second elastic fragment includes a second connecting plate and two second presser feet, and the two second presser feet are relatively arranged on both sides of the second connecting plate. The first connecting plate and the second connecting plate have the same structure, and the first presser foot and the second presser foot have the same structure. When there are multiple hollow holes, adjacent hollow holes have a connecting bridge, and the second connecting plate is connected on the connecting bridge. Both ends of the second connecting plate have the second presser foot, so that both sides of the second connecting plate can form elastic pressure on the carrier plate. The first elastic fragment is used for the position of the hollow holes at both ends, and the second elastic fragment is used for the position of the connecting bridge in the middle of two adjacent hollow holes.

[0078] In the technical solution of this embodiment, the unloading module 50 includes an anti-static push rod, which pushes the carrier plate away from the flow channel assembly and can also prevent static electricity from damaging the carrier plate.

[0079] like Figure 1 As shown, in the technical solution of this embodiment, the conveying module 60 includes a third motor, a conveyor belt, a driven wheel, and a carrier clamping structure. The third motor and driven wheel are respectively arranged at both ends of the installation module. The conveyor belt cooperates with the third motor and driven wheel, and the carrier clamping structure is arranged on the conveyor belt. The conveyor belt can ensure a large span of the conveying module 60. The technical solution of this embodiment can be multiple carrier clamping structures. Multiple carrier clamping structures improve efficiency. For example, the dispensing module 20 and the die bonding module 40 can operate simultaneously and move different carriers at the same time. The second top plate structure includes a fourth motor, a second cam, a second transmission unit, and a second top plate.

[0080] In the technical solution of this embodiment, the carrier plate clamping structure includes a clamping mounting seat, a fixed clamping portion, a mobile clamping portion, and a clamping drive portion. The clamping mounting seat is installed on the conveyor belt, the fixed clamping portion is fixedly arranged on the clamping mounting seat, and the clamping drive portion is arranged on the clamping mounting seat. The clamping drive portion is connected to the mobile clamping portion to drive the mobile clamping portion to approach the fixed clamping portion to be in a clamping position, or to drive the mobile clamping portion away from the fixed clamping portion to be in a loose position. The portion where the carrier plate clamping structure cooperates with the carrier plate is made of PEEK (polyetheretherketone). The carrier plate clamping structure with the above structure is easy to operate. The mobile clamping portion can be connected to a pneumatic cylinder, a hydraulic cylinder, or an electric push rod.

[0081] like Figures 5 to 9As shown, in the technical solution of this embodiment, the die-bonding head structure 41 includes a die-bonding head 411 and a die-bonding head connector 412. The die-bonding head connector 412 is fixed to the mechanical arm structure 42, and the die-bonding head 411 is mounted on the die-bonding head connector 412 via magnetic force. The mechanical arm structure 42 can drive the die-bonding head 411 to work, thus making the die-bonding operation more precise and highly automated. The die-bonding head 411 and the die-bonding head connector 412 are connected by magnetic force, which greatly improves the efficiency of assembly and disassembly. The die-bonding head 411 and the die-bonding head connector 412 are connected by magnetic force, reducing the process of installing and disassembling screws.

[0082] In the technical solution of this embodiment, the die bonding head 411 includes a die bonding head body and a die bonding head mounting base. The die bonding head mounting base has a mounting hole, and the die bonding head body is mounted in the mounting hole. The structure of the die bonding head body and the die bonding head mounting base facilitates maintenance and facilitates the configuration of a matching structure, such as the die bonding head mounting base being provided with a ferromagnetic member.

[0083] like Figure 9 As shown, in the technical solution of this embodiment, the solid crystal head mounting seat includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section. The limiting section is located between the first mounting section and the second mounting section. The ferromagnetic body is located on the side of the first mounting section away from the limiting section. The outer diameter of the limiting section is larger than the outer diameter of the first mounting section. The ferromagnetic body facilitates the mating connection between the solid crystal head body and the solid crystal head mounting seat. The limiting section allows the bottom edge of the solid crystal head mounting seat to abut against the upper surface of the limiting section. The limiting section is a circular plate. The upper part of the first mounting section is in the shape of a truncated cone, and the lower part is in the shape of a cylinder. Figure 9 The second mounting section is fixed to the die-bonding head body by a pin. The side wall of the second mounting end has a pin through hole. The side wall of the die-bonding head body has a groove corresponding to the pin hole. The pin passes through the pin through hole and into the groove.

[0084] like Figure 8 As shown, in the technical solution of this embodiment, the die bonding head connection base 412 includes a base body and a connecting tube. The connecting tube is arranged on the side wall of the base body and can be connected to the die bonding head body. This structure is compact and easy to connect. The negative pressure of the connecting tube is between 0.1kPa and 0.8kPa.

[0085] like Figure 8 and Figure 9 As shown, in the technical solution of this embodiment, the mounting hole extends from the end of the second mounting section away from the limiting section to the first mounting section. The side wall of the first mounting section has a connecting hole that connects the mounting hole and the connecting tube. The above structure is compact and easy to install. The main body of the die-bonding head is a hollow tube.

[0086] like Figure 8 and Figure 9As shown, in the technical solution of this embodiment, the die-bonding head connecting seat 412 also includes a magnet, the seat body includes a storage space, and the magnet is arranged in the storage space. The above structure is compact and has high assembly and disassembly efficiency. The magnet in this embodiment is a permanent magnet, and the ferromagnetic body is a permanent magnet. The connection between the die-bonding head 411 and the die-bonding head mounting seat is achieved by the attraction between the two magnets. When disassembly is required, the die-bonding head 411 is removed from the die-bonding head mounting seat by external force. The magnet can also be an electromagnet. When disassembly is required, the electromagnet is turned off and the die-bonding head 411 is removed under the action of gravity or external force.

[0087] like Figure 8 and Figure 9 As shown, in the technical solution of this embodiment, the ferromagnet and the first mounting section are located in the accommodating space, and there are mutually matching limiting parts between the first mounting section and the wall surface of the accommodating space. This makes the matching accuracy of the solid crystal head 411 and the solid crystal head connecting seat 412 higher. The first mounting section has a frustum that matches the frustum section, so that the matching accuracy of the seat body and the solid crystal head 411 is higher, and the processing cost of the above structure is lower. The accommodating space includes a first cylindrical section, a second cylindrical section, a frustum section and a cylindrical section in sequence from the side away from the solid crystal head 411 to the side close to the solid crystal head 411, and the magnet is installed in the seat body. The side wall of the first mounting seat has an anti-fool surface, the side wall of the seat body has a plane that matches the anti-fool surface, and the side wall of the seat body corresponding to the anti-fool surface has a fixing hole, and a pin shaft is used to fix the first mounting end to the seat body.

[0088] like Figure 8 and Figure 9 As shown, in the technical solution of this embodiment, the crystal bonding module 40 also includes a crystal bonding head removal structure and a crystal bonding head storage structure 44, and the crystal bonding head removal structure and the crystal bonding head storage structure 44 are both arranged on the mounting frame module 10. The above structure further improves the degree of automation of the crystal bonding machine. When the crystal bonding head 411 needs to be replaced, the crystal bonding head 411 is removed by removing the crystal bonding head structure, and then the crystal bonding head 411 of the crystal bonding head storage structure is automatically installed by magnetic force. The crystal bonding head removal structure can be a separately set structure or a system structure, for example, a connecting pipe blows out positive pressure gas, and the crystal bonding head 411 is removed by the force of the positive pressure gas.

[0089] It should be noted that the die bonder of this embodiment has multiple cameras. For example, a camera (which can also be a camera as needed) is installed at the position of the material module 30 to detect the dispensing results. The dispensing module 20 and the die bond module are both equipped with cameras to detect the dispensing and die bonding. This embodiment is also equipped with a mobile camera that can be moved to the position required for inspection as needed.

[0090] The present application also provides a method for bonding a crystal, which uses the above-mentioned bonding machine, and the steps include: S10 dispensing glue; S20 testing after dispensing glue; S30 bonding the crystal after the dispensing glue is qualified. Bonding includes the following steps: S31 the ejector pin structure aligns the blue film structure and moves to the taken chip position. S32 the bonding head structure aligns the blue film structure and moves to the taken chip position. S33 the ejector pin structure absorbs the blue film of the blue film structure. S34 while the ejector pin structure ejects the chip, the bonding head of the bonding head structure absorbs the chip. S35 the bonding head structure aligns the carrier (the carrier in this embodiment is a PCB product), the bonding head will move to the corresponding position and complete the bonding. This method is highly efficient, and the continuity of the operation is guaranteed through pipeline operations. PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board). After step S35 is completed, the detection camera takes a picture. When the die bonding position is offset, an alarm will be issued. When the die bonding position is not offset, the carrier will pass through the pushing structure in the flow channel and be transferred to the next process.

[0091] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0092] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A die bonder with a blue film assembly, characterized in that: include: Mounting frame module (10); a glue dispensing module (20), the glue dispensing module (20) being arranged on the mounting frame module (10); a material waiting module (30), the material waiting module (30) being arranged on the mounting frame module (10); A crystal bonding module (40), the crystal bonding module (40) is arranged on the mounting frame module (10), the crystal bonding module (40) includes a crystal bonding head structure (41), a mechanical arm structure (42) and a blue film assembly (43), the mechanical arm structure (42) is installed on the mounting frame module (10), the crystal bonding head structure (41) is installed on the mechanical arm structure (42), the mechanical arm structure (42) can drive the crystal bonding head structure (41) to move, the blue film assembly (43) includes a blue film structure (431) and a thimble structure (432), the thimble structure (432) and the blue film structure (431) can move relative to each other so that the thimble structure (432) can lift the chip on the blue film structure (431); a blanking module (50), the blanking module (50) being arranged on the mounting frame module (10); a conveying module (60), the conveying module (60) being arranged on the mounting frame module (10) and capable of driving the carrier to move on the dispensing module (20), the waiting module (30), the crystal bonding module (40) and the unloading module (50); The mounting frame module (10) comprises a base assembly (11), a guide rail assembly (12) and a flow channel assembly (13); the guide rail assembly (12) is fixed on the base assembly (11); the flow channel assembly (13) is movably arranged on the guide rail assembly (12); and the carrier plate can be supported on the flow channel assembly (13); The flow channel assembly (13) comprises a position-limiting support frame structure (131), the position-limiting support frame structure (131) comprising a first position-limiting support plate and a second position-limiting support plate, an adjustable predetermined distance being provided between the first position-limiting support plate and the second position-limiting support plate to form a flow channel, and the first position-limiting support plate and the second position-limiting support plate both extending along a moving direction of the carrier plate; The first position-limiting support plate includes a first position-limiting plate and a first support plate, the first support plate is located on a side of the first position-limiting support plate close to the second position-limiting support plate, the upper surface of the first support plate is lower than the upper surface of the first position-limiting plate to form a first step surface, the second position-limiting support plate includes a second position-limiting plate and a second support plate, the second support plate is located on a side of the second position-limiting plate close to the first position-limiting support plate, the upper surface of the second support plate is lower than the upper surface of the second position-limiting plate to form a second step surface; The flow channel assembly (13) further includes a flow channel driving structure (132), wherein the flow channel driving structure (132) is connected to the position-limiting support frame structure (131) to drive the position-limiting support frame structure (131) to change the predetermined distance of the flow channel; The flow channel driving structure (132) includes a first motor, a screw and two connecting parts, the output shaft of the first motor is connected to the screw, the two ends of the screw are respectively connected to the two connecting parts through threads, and the first limiting support plate and the second limiting support plate are respectively fixedly connected to the two connecting parts.

2. The die bonder according to claim 1, wherein: The crystal bonding machine also includes a first pressure plate structure (70) and a first top plate structure (80), wherein the first pressure plate structure (70) is fixedly connected to the limit support frame, and the first top plate structure (80) is arranged on the mounting frame module (10), and the first pressure plate structure (70) is arranged corresponding to the first top plate structure (80), and the first pressure plate structure (70) cooperates with the dispensing module (20).

3. The die bonder according to claim 2, wherein: The first top plate structure (80) includes a second motor, a first cam, a first transmission part and a first top plate, the second motor is connected to the first cam to drive the first cam to rotate, the first cam is matched with the bottom of the first transmission part, the top of the first transmission part is fixedly connected to the first top plate, the first top plate and the first pressure plate structure (70) have a pressing position close to each other or the first top plate and the first pressure plate structure (70) have a disengaged position away from each other.

4. The die bonder according to claim 3, characterized in that: The first transmission part includes a first matching block and a first connecting plate. The bottom surface of the first matching block has an arc surface matching with the first cam.

5. The die bonder according to claim 3, characterized in that: The first top plate structure (80) further includes a first elastic member, one end of which is connected to the base assembly (11), and a second end of which is connected to the first top plate structure (80) so that the first transmission part contacts the first cam.

6. The die bonder according to claim 3, characterized in that: The first pressure plate structure (70) comprises a first pressure plate (71) and a second elastic member (72), wherein the second elastic member (72) is arranged on the first pressure plate (71), and when the first top plate and the first pressure plate structure (70) are in the pressing position, the first top plate and the second elastic member (72) jointly press the carrier plate.

7. The die bonder according to claim 6, wherein: The second elastic member (72) comprises a first elastic piece, and the first elastic piece is fixed on the first pressing plate (71).

8. The die bonder according to claim 7, wherein: The first spring plate includes a first connecting plate and a first presser foot, wherein the first end of the first presser foot is connected to the side of the first connecting plate, the first presser plate (71) has a hollow hole, the first connecting plate is connected to the surface of the first presser plate (71) away from the first top plate structure (80), and the second end of the first presser foot passes through the hollow hole.

9. The die bonder according to claim 8, characterized in that: The angle between the plane of the first connecting plate and the plane of the first presser foot is greater than 90 degrees and less than 180 degrees. The second end of the first presser foot has an outward flange, and the flange is connected to the first presser foot through an arc-shaped connecting portion.

10. The die bonder according to claim 1, wherein: The conveying module (60) includes a third motor, a conveyor belt, a driven wheel and a carrier plate clamping structure. The third motor and the driven wheel are respectively arranged at two ends of the mounting frame module (10). The conveyor belt cooperates with the third motor and the driven wheel. The carrier plate clamping structure is arranged on the conveyor belt.

11. The die bonder according to claim 10, characterized in that: The carrier plate clamping structure includes a clamping mounting seat, a fixed clamping part, a movable clamping part and a clamping drive part. The clamping mounting seat is installed on the conveyor belt, the fixed clamping part is fixedly set on the clamping mounting seat, and the clamping drive part is set on the clamping mounting seat. The clamping drive part is connected to the movable clamping part to drive the movable clamping part to approach the fixed clamping part to be in a clamping position, or drive the movable clamping part away from the fixed clamping part to be in a release position.

12. The die bonder according to any one of claims 1 to 11, characterized in that: The crystal fixing head structure (41) comprises a crystal fixing head (411) and a crystal fixing head connecting seat (412); the crystal fixing head connecting seat (412) is fixed on the mechanical arm structure (42); and the crystal fixing head (411) is mounted on the crystal fixing head connecting seat (412) by magnetic force.

13. The die bonder according to claim 12, wherein: The crystal fixing head (411) comprises a crystal fixing head body and a crystal fixing head mounting seat, wherein the crystal fixing head mounting seat has a mounting hole, and the crystal fixing head body is mounted in the mounting hole.

14. The die bonder according to claim 13, wherein: The solid crystal head mounting base includes a ferromagnetic body, a first mounting section, a limiting section and a second mounting section. The limiting section is located between the first mounting section and the second mounting section. The ferromagnetic body is located on a side of the first mounting section away from the limiting section. The outer diameter of the limiting section is larger than the outer diameter of the first mounting section.

15. The die bonder according to claim 14, wherein: The crystal bonding head connection seat (412) comprises a seat body and a connection pipe, wherein the connection pipe is arranged on the side wall of the seat body and can be communicated with the crystal bonding head body.

16. The die bonder according to claim 15, characterized in that: The mounting hole extends from the end of the second mounting section away from the limiting section to the first mounting section. The side wall of the first mounting section has a connecting hole, which connects the mounting hole and the connecting pipe.

17. The die bonder according to claim 15, wherein: The crystal bonding head connection seat (412) further comprises a magnet, the seat body comprises a receiving space, and the magnet is arranged in the receiving space.

18. The die bonder according to claim 17, wherein: The ferromagnetic body and the first installation section are located in the accommodating space, and a mutually matching limiting portion is provided between the first installation section and the wall surface of the accommodating space.

19. The die bonder according to claim 12, wherein: The crystal bonding module (40) further comprises a crystal bonding head removal structure and a crystal bonding head storage structure, both of which are arranged on the mounting frame module (10).

20. A die bonding method, characterized in that: The die bonding machine according to any one of claims 1 to 19 is used, wherein the steps include: S10 dispensing; S20 post-dispensing inspection; After S30 dispensing, those that pass the inspection will be bonded.

21. The die bonding method according to claim 20, wherein: The solidification comprises the following steps: The S31 ejector pin structure is aligned with the blue film structure and moves to the chip position; The S32 die bonding head structure aligns the blue film structure and moves to the chip position; The S33 ejector pin structure adsorbs the blue film of the blue film structure; The S34 ejector pin structure ejects the chip while the die bonding head of the die bonding head structure holds the chip in place. The S35 die bonding head structure aligns the carrier, and the die bonding head moves to the corresponding position to complete the die bonding.

Images