Power semiconductor device, circuit board assembly, and electronic device

Abstract

This application provides a power semiconductor device, a circuit board assembly, and an electronic device. The power semiconductor device includes a device body and a first conductive connector and a second conductive connector connected to the device body. The first and second conductive connectors are stacked vertically and do not contact each other. The first conductive connector includes a first cut-out portion and a second cut-out portion. The second conductive connector includes a third cut-out portion aligned with the second cut-out portion. On the projection plane in the stacking direction, the projection of the third cut-out portion is located within the projection of the second cut-out portion. The power semiconductor device provided by this application, through the stacked arrangement of the first and second conductive connectors, can achieve a very small current loop area, reduce the inductance of the current loop, and thereby reduce the magnitude of peak voltage.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a power semiconductor device, circuit board assembly, and electronic device. Background Technology

[0002] During normal operation, power semiconductor devices switch on and off their current loops. Existing power semiconductor devices typically switch on and off very quickly, resulting in a large rate of current change, usually described by di / dt. This closed current loop generates an inductance, which suppresses current changes by producing a voltage. This voltage is generally called a spike voltage, and its value is equal to the product of the inductance and the rate of current change, expressed as L*di / dt, where L is the inductance value. Spike voltages increase switching losses in power semiconductor devices, affecting their switching speed. Excessively high spike voltages can even cause breakdown and damage to the power semiconductor device.

[0003] For the packaging design of power semiconductor devices, how to reduce the peak voltage generated by the power semiconductor device during the process of turning on and off the current loop has become a major problem that urgently needs to be solved. Summary of the Invention

[0004] This application provides a power semiconductor device, circuit board assembly, and electronic device that can reduce the magnitude of peak voltage.

[0005] A first aspect of this application provides a power semiconductor device, including a device body, a first conductive connector and a second conductive connector connected to the device body. The first conductive connector and the second conductive connector are stacked vertically and do not contact each other. The first conductive connector includes a first cut-out portion and a second cut-out portion, and the second conductive connector includes a third cut-out portion aligned with the second cut-out portion. On the projection plane in the stacking direction, the projection of the third cut-out portion is located within the projection of the second cut-out portion.

[0006] Using this technical solution, the first conductive connector and the second conductive connector are arranged in a conductive structure of stacked layers. The first conductive connector is provided with a first cut-off portion and a second cut-off portion, and the second conductive connector is provided with a third cut-off portion aligned with the second cut-off portion. The first conductive connector can be electrically connected to external components through the first cut-off portion, and the second conductive connector can be electrically connected to external components through the second cut-off portion and the third cut-off portion. The first conductive connector and the second conductive connector can achieve a very small current loop area, reduce the inductance of the current loop, thereby reducing the magnitude of the peak voltage, and can minimize the probability of power semiconductor devices being damaged by peak voltage breakdown.

[0007] In some embodiments, an insulating element is further provided between the first conductive connector and the second conductive connector.

[0008] This technical solution uses insulating components to electrically isolate the first conductive connector from the second conductive connector, thus meeting the requirements for insulation gap and creepage distance between the first and second conductive connectors.

[0009] In some embodiments, the insulating member includes a fourth cut-off portion aligned with the second cut-off portion, and the projection of the third cut-off portion is located within the projection of the fourth cut-off portion on the projection plane in the stacking direction.

[0010] With this technical solution, when the second conductive connector, the insulating component, and the first conductive connector are arranged in a stacked manner, the connecting structure (such as a screw) can pass through the third cut-out portion, the fourth cut-out portion, and the second cut-out portion, so that the second conductive connector can be electrically connected to external components, and the connecting structure can be prevented from contacting the first conductive connector, thus avoiding a short circuit between the first conductive connector and the second conductive connector.

[0011] In some embodiments, the second cut-out portion, the third cut-out portion, and the fourth cut-out portion are circular holes or polygonal holes, and the second cut-out portion, the third cut-out portion, and the fourth cut-out portion are coaxial.

[0012] This technical solution allows the connecting structure (such as a screw) to pass smoothly through the third cut-out portion, the fourth cut-out portion, and the second cut-out portion, thereby achieving electrical connection between the second conductive connector and external components.

[0013] In some embodiments, the first conductive connector and the second conductive connector extend from the surface of the device body to the outside of the device body along a first direction. Along the first direction, the first cut-out portion is located outside the second cut-out portion. The size of the second conductive connector is smaller than the size of the first conductive connector and smaller than the size of the insulating member. The size of the insulating member is smaller than or equal to the size of the first conductive connector.

[0014] By adopting this technical solution, when the second conductive connector, the insulating component, and the first conductive connector are arranged in a stacked manner, short circuits caused by contact between the first conductive connector and the second conductive connector can be avoided. Furthermore, the first cut-out portion is located outside the second cut-out portion, which facilitates the first conductive connector to be electrically connected to external components through a connecting structure (which passes through the first cut-out portion). The second conductive connector is electrically connected to external components through another connecting structure (which passes through the second cut-out portion, the third cut-out portion, and the fourth cut-out portion).

[0015] In some embodiments, the insulating member includes a planar portion and a protrusion portion. When the second conductive connector, the insulating member, and the first conductive connector are arranged in a stacked manner, the planar portion is located between the first conductive connector and the second conductive connector. The planar portion includes a fourth cut portion aligned with the second cut portion, and the protrusion portion is located between the first cut portion and the second cut portion.

[0016] This technical solution uses the flat portion of the insulating component to electrically isolate the first conductive connector from the second conductive connector, and the protrusion of the insulating component can further increase the insulation gap and creepage distance between the first conductive connector and the second conductive connector.

[0017] In some embodiments, the protrusion has a cuboid structure and is located at the end of the insulating member.

[0018] By adopting this technical solution, the cuboid protrusion at the end of the insulating component is located between the first cut-out portion and the second cut-out portion, which can increase the insulation gap and creepage distance between the first conductive connector and the second conductive connector.

[0019] In some embodiments, the insulating member includes a planar portion and a pouch portion. When the second conductive connector, the insulating member, and the first conductive connector are arranged in a stacked manner, the planar portion is located between the first conductive connector and the second conductive connector, and the pouch portion passes through the second cut-out portion and extends in a direction away from the planar portion.

[0020] By using this technical solution, the planar portion of the insulating component is used to electrically isolate the first conductive connector from the second conductive connector. The pouch portion of the insulating component is used to house the connecting structure (such as a screw or nut), which also electrically isolates the connecting structure from the first conductive connector. This further increases the insulation gap and creepage distance between the first and second conductive connectors.

[0021] In some embodiments, the bagging portion is a cylindrical structure with one end open.

[0022] This technical solution allows the bag section to be used to accommodate connecting structures (such as screws or nuts), and also provides electrical isolation between the connecting structures and the first conductive connector.

[0023] Secondly, embodiments of this application provide a circuit board assembly, including a circuit board, a first electronic component, a second electronic component, and the power semiconductor device described in the first aspect. The first electronic component, the second electronic component, and the power semiconductor device are disposed on the circuit board. A first conductive connector is electrically connected to the first electronic component via a first screw and a first cut-out portion, and a second conductive connector is electrically connected to the second electronic component via a second screw and a third cut-out portion.

[0024] Thirdly, embodiments of this application provide an electronic device including the circuit board assembly as described in the second aspect.

[0025] It is understood that the circuit board assembly described in the second aspect and the electronic device described in the third aspect correspond to the power semiconductor device described in the first aspect. Therefore, the beneficial effects they can achieve can be referred to the beneficial effects of the power semiconductor device described above, and will not be repeated here. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a power semiconductor device provided in an embodiment of this application.

[0027] Figure 2 This is a cross-sectional view of a power semiconductor device provided in an embodiment of this application.

[0028] Figure 3a This is a schematic diagram of the structure of the first conductive connector provided in an embodiment of this application.

[0029] Figure 3b This is a schematic diagram of the structure of the second conductive connector provided in an embodiment of this application.

[0030] Figure 3c This is a schematic diagram of the structure of an insulating component provided in an embodiment of this application.

[0031] Figure 3d This is a schematic diagram of a structure in which a first conductive connector, an insulating member, and a second conductive connector are stacked in an embodiment of this application.

[0032] Figure 4 This is a schematic diagram of the assembly of a first conductive connector and a second conductive connector with two sets of screws and nuts in a power semiconductor device according to an embodiment of this application.

[0033] Figure 5 This is a schematic diagram of the structure of an insulating component provided in another embodiment of this application.

[0034] Figure 6 This is a schematic diagram of the assembly of a second conductive connector and a set of screws and nuts in a power semiconductor device according to an embodiment of this application.

[0035] Figure 7 This is a schematic diagram of the structure of an insulating component provided in another embodiment of this application.

[0036] Figure 8 This is a schematic diagram of the assembly of a second conductive connector and a set of screws and nuts in a power semiconductor device according to another embodiment of this application.

[0037] Explanation of main component symbols

[0038] Device body 10

[0039] First conductive connector 11

[0040] First resection section 111

[0041] Second resection section 112

[0042] Second conductive connector 12

[0043] Third resection section 121

[0044] Insulating component 13

[0045] Fourth resection section 131

[0046] Packaging Department 132

[0047] First plane section 133

[0048] Protrusion 134

[0049] Second plane section 135

[0050] First screw 20

[0051] First nut 21

[0052] Second screw 22

[0053] Second nut 23

[0054] Power semiconductor devices 100

[0055] First direction X1 Detailed Implementation

[0056] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with preferred embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. In addition, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0057] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more. Directional terms such as "upper," "lower," "left," and "right" are defined relative to the indicated orientation of the components in the accompanying drawings. It should be understood that these directional terms are relative concepts used for relative description and clarification, and they may change accordingly depending on the orientation of the components in the accompanying drawings.

[0058] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0059] In the following detailed description of the embodiments in conjunction with the schematic diagrams, for ease of explanation, the diagrams showing the partial structure of the device will be enlarged locally without adhering to the usual scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this application.

[0060] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0061] Figure 1 A schematic diagram of the structure of a power semiconductor device provided in an embodiment of this application is shown.

[0062] Please see Figure 1 The power semiconductor device 100 includes a device body 10, a first conductive connector 11, and a second conductive connector 12. The internal circuit structure of the device body 10 is generally conventional in the art and will not be described in detail here. The first conductive connector 11 and the second conductive connector 12 are electrically connected to the internal circuit of the device body 10. The first conductive connector 11 and the second conductive connector 12 are arranged in a stacked manner, and the first conductive connector 11 and the second conductive connector 12 do not contact each other.

[0063] In some embodiments, the first conductive connector 11 and the second conductive connector 12 extend from the surface of the device body 10 along a first direction X1 toward the outside of the device body 10. The first conductive connector 11 and the second conductive connector 12 can serve as pins of the power semiconductor device 100, enabling the power semiconductor device 100 to be electrically connected to other electronic components. For example, the first conductive connector 11 and the second conductive connector 12 can be used as positive and negative terminals, positive terminals and neutral point terminals (zero point terminals), or negative terminals and neutral point terminals for connecting the power semiconductor device 100 to peripheral circuits.

[0064] In some embodiments, the power semiconductor device 100 may be a power element such as a bipolar transistor, a metal-oxide-semiconductor field-effect transistor, or a thyristor.

[0065] In some embodiments, an insulating member 13 is provided between the first conductive connector 11 and the second conductive connector 12. The insulating member 13 can be used to electrically isolate the first conductive connector 11 and the second conductive connector 12, thereby preventing a short circuit between the first conductive connector 11 and the second conductive connector 12.

[0066] In some embodiments, both the first conductive connector 11 and the second conductive connector 12 can be made of conductive materials, such as tin-plated copper wire, tin-plated iron wire, nickel-plated copper wire, etc. The insulating element 13 is made of insulating materials, such as rubber, resin, etc.

[0067] In some embodiments, the power semiconductor device 100 may include a plurality of first conductive connectors 11 and a plurality of second conductive connectors 12 (e.g., the power semiconductor device 100 is a chip integrating a plurality of metal-oxide-semiconductor field-effect transistors), and the number of first conductive connectors 11 may be the same as the number of second conductive connectors 12. The power semiconductor device 100 may also include conductive connectors for other purposes besides the first conductive connectors 11 and second conductive connectors 12. For example, the power semiconductor device 100 may also include a third conductive connector for controlling the conduction or cutoff between the first conductive connectors 11 and the second conductive connectors 12, which is not described or shown in detail herein or in the remaining figures for clarity.

[0068] For example, the power semiconductor device 100 is an insulated-gate bipolar transistor (IGBT). The first conductive connector 11 can be the collector or emitter of the IGBT, the second conductive connector 12 can be the emitter or collector of the IGBT, and the third conductive connector is the base of the IGBT. Alternatively, the power semiconductor device 100 can be a metal-oxide-semiconductor (MOSFET). The first conductive connector 11 can be the drain or source of the MOSFET, the second conductive connector 12 can be the source or drain of the MOSFET, and the third conductive connector is the gate of the MOSFET.

[0069] like Figure 2 As shown, the second conductive connector 12, the insulating component 13, and the first conductive connector 11 are stacked sequentially. The shape and size of the first conductive connector 11, the insulating component 13, and the second conductive connector 12 can be set and adjusted according to the application scenario and actual packaging requirements of the power semiconductor device 100. For example, the shapes of the first conductive connector 11, the second conductive connector 12, and the insulating component 13 can be roughly rectangular, T-shaped, etc.

[0070] For example, the size of the first conductive connector 11 can be set according to its overcurrent capability, overvoltage capability, etc., the size of the second conductive connector 12 can be set according to its overcurrent capability, overvoltage capability, etc., and the shape and size of the insulating member 13 can be set according to the shape and size of the first conductive connector 11 and the second conductive connector 12, so that the insulating member 13 can isolate the first conductive connector 11 and the second conductive connector 12.

[0071] In some embodiments, the insulating element 13 may be an insulating film, thereby making the gap between the first conductive connector 11 and the second conductive connector 12 smaller, and the first conductive connector 11 and the second conductive connector 12 overlap in the direction perpendicular to the first direction X1. The first conductive connector 11 and the second conductive connector 12 arranged vertically can achieve a very small current loop area, which can reduce the inductance of the current loop, thereby reducing the magnitude of the peak voltage and the probability of the power semiconductor device 100 being damaged by the peak voltage.

[0072] In some embodiments, to achieve electrical connection between the first conductive connector 11, the second conductive connector 12, and other electronic components or functional modules, the first conductive connector 11 includes two or more cut-out portions, the second conductive connector 12 includes at least one cut-out portion, and the insulating member 13 includes at least one cut-out portion. For example... Figure 3a , 3bAs shown in 3c, the following example will be used to illustrate the first conductive connector 11, which includes a first cut-out portion 111 and a second cut-out portion 112; the second conductive connector 12, which includes a third cut-out portion 121; and the insulating member 13, which includes a fourth cut-out portion 131.

[0073] The first cut-off portion 111 can be used to electrically connect the first conductive connector 11 to the conductive connectors of other electronic components via a first screw. The first screw can also cooperate with a first nut to improve the reliability of the electrical connection. The third cut-off portion 121 can be used to electrically connect the second conductive connector 12 to the conductive connectors of other electronic components via a second screw. The second screw can also cooperate with a second nut to improve the reliability of the electrical connection.

[0074] In some embodiments, such as Figure 3d As shown, when the second conductive connector 12, the insulating member 13, and the first conductive connector 11 are arranged in a stacked configuration, the third cut-out portion 121, the second cut-out portion 112, and the fourth cut-out portion 131 are aligned with each other and are coaxial. On a projection plane perpendicular to the first direction X1 or in the stacking direction, the projection of the third cut-out portion 121 is located within the projection of the fourth cut-out portion 131 and within the projection of the second cut-out portion 112.

[0075] In some embodiments, when the second conductive connector 12, the insulating member 13, and the first conductive connector 11 are arranged in a stacked configuration, along the first direction X1, the first cut-out portion 111 is located outside the second cut-out portion 112. The size of the second conductive connector 12 is smaller than the size of the first conductive connector 11 and smaller than the size of the insulating member 13. The size of the insulating member 13 is smaller than or equal to the size of the first conductive connector 11. In other embodiments, along the first direction X1, the size of the second conductive connector 12 may also be equal to the size of the insulating member 13.

[0076] When the second conductive connector 12 is electrically connected to the conductive connectors of other electronic components via the second screw and the second nut, the second cut-out portion 112 and the fourth cut-out portion 131 can avoid contact with the second screw or the second nut. When the second screw and the second nut are tightened, the second screw or the second nut can pass through the third cut-out portion 121, the fourth cut-out portion 131, and the second cut-out portion 112, and the second screw or the second nut does not contact the second cut-out portion 112 and the fourth cut-out portion 131. For example, there is a preset distance between the second screw or the second nut and the second cut-out portion 112 and the fourth cut-out portion 131 to meet the requirements of insulation gap and creepage distance.

[0077] For example, when the second screw passes through the second cut-out portion 112 and the fourth cut-out portion 131, the distance between the second screw and both the second cut-out portion 112 and the fourth cut-out portion 131 can be 3 to 5 mm. Similarly, when the second nut passes through the second cut-out portion 112 and the fourth cut-out portion 131, the distance between the second nut and both the second cut-out portion 112 and the fourth cut-out portion 131 can be 3 to 5 mm. In the actual use of power semiconductor devices, the distance between the second screw or second nut and the second cut-out portion 112 and the fourth cut-out portion 131 can be set according to the voltage level of the power semiconductor device's application scenario; the higher the voltage, the greater the distance.

[0078] In some embodiments, the size and shape of the first cut-out portion 111 can be set according to the shape and size of the first screw. This application does not limit this, but it must be ensured that the threaded portion of the first screw can pass through the first cut-out portion 111, so that the first conductive connector 11 and the conductive connectors of other electronic components can be electrically connected through the first screw and the first nut. Figure 3a In this example, the first cut-out portion 111 is a circular hole. In other embodiments, the first cut-out portion 111 can also be a polygonal hole such as a hexagonal hole or an octagonal hole.

[0079] The size and shape of the third cut-out portion 121 can be set according to the shape and size of the second screw. This application does not limit this, but it must be able to pass through the third cut-out portion 121 so that the second conductive connector 12 and the conductive connectors of other electronic components can be electrically connected through the second screw and the second nut. Figure 3b In this example, the third cut-out portion 121 is a circular hole. In other embodiments, the third cut-out portion 121 can also be a polygonal hole such as a hexagonal hole or an octagonal hole.

[0080] In some embodiments, the size and shape of the second cut-out portion 112 and the fourth cut-out portion 131 can also be set according to the shape and size of the second screw or the second nut, so that when the second screw or the second nut passes through the second cut-out portion 112 and the fourth cut-out portion 131, it will not come into contact with the second cut-out portion 112 and the fourth cut-out portion 131, thereby meeting the requirements of insulation gap and creepage distance. For example, the second cut-out portion 112 and the fourth cut-out portion 131 can have the same shape and size, and both the second cut-out portion 112 and the fourth cut-out portion 131 are hexagonal holes.

[0081] In some embodiments, the second cut-out portion 112 and the fourth cut-out portion 131 may also have different shapes and / or sizes. For example, the second cut-out portion 112 and the fourth cut-out portion 131 may have the same shape, but the size of the fourth cut-out portion 131 may be slightly smaller than the size of the second cut-out portion 112.

[0082] In some embodiments, when the second conductive connector 12 is electrically connected to the conductive connectors of other electronic components via the second screw and the second nut, to prevent a short circuit between the second conductive connector 12 and the first conductive connector 11, the second screw or the second nut is configured not to contact the second cut-off portion 112 when passing through it, thus meeting the requirements for insulation gap and creepage distance. When the second screw or the second nut passes through the fourth cut-off portion 131, it contacts the fourth cut-off portion 131, preventing a short circuit between the second conductive connector 12 and the first conductive connector 11. Alternatively, the second screw or the second nut can be configured not to contact the second cut-off portion 112 when passing through both the second cut-off portion 112 and the fourth cut-off portion 131, but it can contact the fourth cut-off portion 131. In this case, the size of the fourth cut-off portion 131 is smaller than the size of the second cut-off portion 112.

[0083] The power semiconductor device 100 provided in this application embodiment includes a first conductive connector 11, a second conductive connector 12, and an insulating member 13. The first conductive connector 11 is provided with a first cut-out portion 111 and a second cut-out portion 112, the second conductive connector 12 is provided with a third cut-out portion 121, and the insulating member 13 is provided with a fourth cut-out portion 131. The insulating member 13 is disposed between the first conductive connector 11 and the second conductive connector 12, forming a conductive structure arranged in upper and lower layers. The first cut-out portion 111 provides mounting space for a first screw, and the second cut-out portion 112, the third cut-out portion 121, and the fourth cut-out portion 131 provide mounting space for a second screw or a second nut. The second screw and the second nut do not contact the second cut-out portion 112, thus avoiding a short circuit between the first conductive connector 11 and the second conductive connector 12. The first conductive connector 11 and the second conductive connector 12 can achieve a very small current loop area, reducing the inductance of the current loop, thereby reducing the magnitude of the peak voltage, and minimizing the probability of the power semiconductor device 100 being damaged by the peak voltage.

[0084] Figure 4 This illustration shows a schematic diagram of the assembly of a first conductive connector and a second conductive connector with two sets of screws and nuts in a power semiconductor device according to an embodiment of this application.

[0085] When the power semiconductor device 100 is electrically connected to other components, the first conductive connector 11 of the power semiconductor device 100 can be electrically connected to the conductive connector of a certain component (which may also have a cut-off portion) through the first screw 20 and the first nut 21. For example, the threaded portion of the first screw 20 passes through the first cut-off portion 111 on the first conductive connector 11 and the cut-off portion of the conductive connector of the component, and the head of the first screw 20 cannot pass through the first cut-off portion 111 to prevent the first screw 20 from falling out of the first conductive connector 11. The first screw 20 and the first nut 21 are tightened so that the first conductive connector 11 and the conductive connector of the component are tightly fitted together, thereby achieving electrical connection.

[0086] In some embodiments, the second conductive connector 12 of the power semiconductor device 100 can be electrically connected to the conductive connector of a certain component (which may also have a cut-off portion) via a second screw 22 and a second nut 23. For example, the threaded portion of the second screw 22 passes through the cut-off portion of the conductive connector of the component, the third cut-off portion 121 on the second conductive connector 12, the fourth cut-off portion 131 on the insulating member 13, and the second cut-off portion 112 on the first conductive connector 11, and the head of the second screw 22 cannot pass through the cut-off portion of the conductive connector of the component to prevent the second screw 22 from falling out of the conductive connector of the component. The second screw 22 and the second nut 23 are tightened so that the second conductive connector 12 and the conductive connector of the component are tightly fitted together to achieve electrical connection. The second screw 22 and the second nut 23 must not contact the first conductive connector 11 to avoid short circuit between the first conductive connector 11 and the second conductive connector 12.

[0087] In some embodiments, the insulating member 13 may be designed as a structure including a pouch portion to accommodate the second screw 22 or the second nut 23, such that the second screw 22, the second nut 23, and the second conductive connector 12 are all electrically isolated from the first conductive connector 11, making it easy to meet the requirements of insulation gap and creepage distance between the first conductive connector 11 and the second conductive connector 12. Figure 5 As shown, the insulating member 13 includes a pouch portion 132 and a first flat portion 133. The pouch portion 132 is a cylindrical structure with an opening. The pouch portion 132 can be used to accommodate the second screw 22 or the second nut 23. The shape and size of the pouch portion 132 can be designed to match the second screw 22 or the second nut 23.

[0088] exist Figure 5In this example, the second nut 23 is housed in the bag section 132. The shape of the bag section 132 is the same as that of the second nut 23, and the second nut 23 can be completely housed in the bag section 132. When the second conductive connector 12, the insulating member 13, and the first conductive connector 11 are arranged in a stacked manner, the first flat portion 133 is located between the first conductive connector 11 and the second conductive connector 12. The bag section 132 passes through the second cut-out portion 112 and extends in a direction away from the first flat portion 133. The first conductive connector 11 and the second conductive connector 12, which are stacked in a stacked manner, are electrically isolated by the insulating member 13.

[0089] Figure 6 This illustration shows a schematic diagram of the assembly of a second conductive connector and a set of screws and nuts in a power semiconductor device according to an embodiment of this application.

[0090] The insulating member 13 is mounted on the first conductive connector 11 through the second cut-out portion 112. The first flat portion 133 is located on the other surface of the first conductive connector 11. The pouch portion 132 passes through the second cut-out portion 112 and extends in a direction away from the first flat portion 133. The second conductive connector 12 of the power semiconductor device 100 is electrically connected to the conductive connector of a certain component (which may also have a cut-out portion) through the second screw 22 and the second nut 23. For example, the threaded portion of the second screw 22 passes through the cut-out portion of the conductive connector of the component, the third cut-out portion 121 on the second conductive connector 12, and the second cut-out portion 112 on the first conductive connector 11, and is partially housed in the pouch portion 132. The head of the second screw 22 cannot pass through the cut-out portion of the conductive connector of the component to prevent the second screw 22 from falling out of the conductive connector of the component. By tightening the second screw 22 with the second nut 23 pre-placed in the bag section 132, the second conductive connector 12 is tightly attached to the conductive connector of the component, thereby achieving electrical connection.

[0091] In some embodiments, the insulating element 13 can also be designed to include a protruding structure, which increases the insulation gap and creepage distance, thereby reducing the design length of the first conductive connector 11 and the second conductive connector 12. For example... Figure 7 As shown, the insulating member 13 includes a protrusion 134 and a second planar portion 135, and the second planar portion 135 includes a fourth cut-out portion 131.

[0092] In some embodiments, the protrusion 134 may be located at the end of the insulating member 13. The shape and size of the protrusion 134 may be set according to the actual usage requirements of the power semiconductor device 100. For example, the protrusion 134 may be a cuboid structure.

[0093] like Figure 8As shown, when the first conductive connector 11, the insulating member 13 and the second conductive connector 12 are arranged in a stacked manner, the protrusion 134 is located between the first cut-out portion 111 and the second cut-out portion 112, the second flat portion 135 is located between the first conductive connector 11 and the second conductive connector 12, and the fourth cut-out portion 131 on the second flat portion 135 is aligned with the third cut-out portion 121.

[0094] This application also provides a circuit board assembly, including a circuit board, a first electronic component, a second electronic component, and the aforementioned power semiconductor device 100. The first electronic component, the second electronic component, and the power semiconductor device 100 can be disposed on the circuit board. The first conductive connector 11 can be electrically connected to the first electronic component through a first screw 20 (or the first screw 20 and the first nut 21) and a first cut-out portion 111. The second conductive connector 12 can be electrically connected to the second electronic component through a second screw 22 (or the second screw 22 and the second nut 23) and a third cut-out portion 121.

[0095] This application also provides an electronic device including the aforementioned circuit board assembly, enabling the electronic device to communicate with other electronic devices or servers. The electronic device may be a power supply device, a communication device, etc.

[0096] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be covered within the scope of this application.

Claims

1. A power semiconductor device, comprising a device body, characterized in that, It also includes a first conductive connector and a second conductive connector connected to the device body. The first conductive connector and the second conductive connector are arranged in a stacked manner, and the first conductive connector and the second conductive connector do not contact each other. The first conductive connector includes a first cut-off portion and a second cut-off portion. The second conductive connector includes a third cut-off portion aligned with the second cut-off portion. On the projection plane in the stacking direction, the projection of the third cut-off portion is located within the projection of the second cut-off portion. The first conductive connector and the second conductive connector extend from the surface of the device body to the outside of the device body along a first direction. Along the first direction, the first cut-off portion is located outside the second cut-off portion. The size of the second conductive connector is smaller than the size of the first conductive connector.

2. The power semiconductor device as described in claim 1, characterized in that, An insulating component is also provided between the first conductive connector and the second conductive connector.

3. The power semiconductor device as described in claim 2, characterized in that, The insulating member includes a fourth cut portion aligned with the second cut portion, and on the projection plane in the stacking direction, the projection of the third cut portion is located within the projection of the fourth cut portion.

4. The power semiconductor device as described in claim 3, characterized in that, The second, third, and fourth cut-off portions are circular or polygonal holes, and are coaxial.

5. The power semiconductor device as described in claim 3, characterized in that, Along the first direction, the size of the second conductive connector is smaller than the size of the insulating member, and the size of the insulating member is smaller than or equal to the size of the first conductive connector.

6. The power semiconductor device as described in claim 2, characterized in that, The insulating component includes a planar portion and a protruding portion. When the second conductive connector, the insulating component, and the first conductive connector are arranged in a stacked manner, the planar portion is located between the first conductive connector and the second conductive connector. The planar portion includes a fourth cut portion aligned with the second cut portion, and the protruding portion is located between the first cut portion and the second cut portion.

7. The power semiconductor device as described in claim 6, characterized in that, The protrusion has a cuboid structure and is located at the end of the insulating component.

8. The power semiconductor device as described in claim 2, characterized in that, The insulating component includes a planar portion and a bagged portion. When the second conductive connector, the insulating component, and the first conductive connector are arranged in a stacked manner, the planar portion is located between the first conductive connector and the second conductive connector, and the bagged portion passes through the second cut-out portion and extends in a direction away from the planar portion.

9. The power semiconductor device as described in claim 8, characterized in that, The bagging section is a cylindrical structure with one end open.

10. A circuit board assembly, comprising a circuit board, a first electronic component, and a second electronic component, characterized in that, It also includes the power semiconductor device as described in any one of claims 1 to 9; The first electronic component, the second electronic component, and the power semiconductor device are disposed on the circuit board. The first conductive connector is electrically connected to the first electronic component through a first screw and a first cut-out portion. The second conductive connector is electrically connected to the second electronic component through a second screw and a third cut-out portion.

11. An electronic device, characterized in that, Includes the circuit board assembly as described in claim 10.

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