Light source device, exposure apparatus, and object manufacturing method

Abstract

The present invention relates to a light source apparatus including a holder configured to hold a lamp including a metal base having a cylindrical surface, a condenser lens configured to condense light generated by the lamp, and a nozzle including an ejection hole configured to eject a gas so as to cool the metal base. A distance between a straight line including a central axis of the ejection hole and a central axis of the metal base is in a range from not less than 1 / 2 of a radius of the cylindrical surface to not more than the radius. The present invention also relates to an exposure apparatus and an article manufacturing method.

Description

TECHNICAL FIELD

[0001] The present application relates to a light source apparatus, an exposure apparatus, and an article manufacturing method. BACKGROUND

[0002] An exposure apparatus is used in a photolithography step for manufacturing devices such as semiconductor devices or display devices. A light source apparatus is included in the exposure apparatus, and the light source apparatus can include a replaceable lamp. The lamp includes, for example, a pair of metal bases, a light emitting tube arranged between the pair of metal bases, and a pair of electrodes arranged in the light emitting tube and connected to the pair of metal bases, respectively. Mercury or the like as a light emitting substance can be enclosed in the light emitting tube. When electric power is supplied between the pair of electrodes via the pair of metal bases, arc discharge occurs between the pair of electrodes, and thus the lamp can emit light. When the lamp emits light, the temperature of the metal bases is high, and the metal bases need to be cooled. Japanese Patent Laid-Open No. 2003-17003 describes a light source apparatus that includes fins configured to improve cooling efficiency in a portion of the metal bases and cools the portion of the metal bases by blowing cooling air toward the fins.

[0003] As the output of the lamp increases, the temperature of the metal bases tends to increase. In order to sufficiently cool the metal bases, it is necessary to blow a sufficient amount of gas toward the metal bases. However, when the light emitting tube is excessively cooled by the gas, the light emitting substance (e.g., mercury) in the light emitting tube cannot be sufficiently vaporized, and lighting failure of the lamp can occur. SUMMARY

[0004] The present application provides a technique that is advantageous in stabilizing light emission of a lamp.

[0005] A first aspect of the present application provides a light source apparatus including: a holder configured to hold a lamp including a metal base having a cylindrical surface; a condenser lens configured to condense light generated by the lamp; and a nozzle including a jet hole configured to jet gas so as to cool the metal base, wherein a distance between a straight line including a central axis of the jet hole and a central axis of the metal base ranges from not less than 1 / 2 to not more than a radius of the cylindrical surface.

[0006] A second aspect of the present application provides an exposure apparatus including: the light source apparatus as defined in the first aspect of the present application; an illumination optical system configured to illuminate a document using light from the light source apparatus; and a projection optical system configured to project a pattern of the document onto a substrate.

[0007] A third aspect of the present invention provides an article manufacturing method including: exposing a substrate using the exposure apparatus defined in the second aspect of the present invention; developing the substrate exposed in the exposing; and processing the substrate developed, so as to obtain an article.

[0008] Other features of the present invention will be apparent from the following description of example embodiments, with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 is a view schematically showing a configuration of an exposure apparatus according to a first embodiment;

[0010] Figure 2 is a view schematically showing a configuration of a light source apparatus according to the first embodiment;

[0011] Figure 3A and 3B is a view showing an arrangement example of a lead wire;

[0012] Figure 4A and 4B is a view schematically showing an arrangement example of a metal base and a nozzle in the light source apparatus according to the first embodiment;

[0013] Figure 5 is a view schematically showing a structure of a nozzle and a supply tube in the light source apparatus according to the first embodiment;

[0014] Figure 6A and 6B is a view for explaining an effect of the light source apparatus according to the first embodiment;

[0015] Figure 7 is a view for explaining an effect of the light source apparatus according to the first embodiment;

[0016] Figures 8A to 8D is a view for explaining an effect of the light source apparatus according to the first embodiment;

[0017] Figures 9A to 9D is a view for explaining an effect of the light source apparatus according to the first embodiment;

[0018] Figure 10 is a view for explaining an effect of the light source apparatus according to the first embodiment;

[0019] Figure 11A and 11B is a view schematically showing a configuration of a light source apparatus according to a second embodiment;

[0020] Figure 12A and 12Bis a view schematically showing a configuration of a light source device according to a third embodiment;

[0021] Figure 13A and 13B is a view schematically showing a configuration of a light source device according to a fourth embodiment. DETAILED DESCRIPTION

[0022] Embodiments will be described in detail below with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the appended claims. In the embodiments, multiple features are described; however, not all of the features are essential to the invention, and the features can be arbitrarily combined. In addition, in the drawings, the same reference numerals are used throughout the different drawings to designate the same or similar components, and repeated description of the components will be omitted. In the present specification and the drawings, directions are indicated on an XYZ coordinate system. In general, the Z axis indicates the vertical direction, and the X-Y plane indicates the horizontal direction. Hatched portions indicate cross sections.

[0023] Figure 1 An example of a configuration of an exposure apparatus 100 according to a first embodiment is shown. The exposure apparatus 100 can include, for example, a light source device 110, a shutter device 120, an illumination optical system 130, a document holder 140, a projection optical system 150, and a substrate holder 160. The light source device 110 can include a holder 20 that holds a lamp 10. The document holder 140 holds a document 142. The document holder 140 is positioned by a document positioning mechanism (not shown), so that the document 142 can be positioned. The substrate holder 160 holds a substrate 162. The substrate 162, to which a resist (photoresist) is applied by a resist application device, is supplied to the exposure apparatus 100. The substrate holder 160 is positioned by a substrate positioning mechanism (not shown), so that the substrate 162 can be positioned.

[0024] The shutter device 120 is arranged to be able to shield light in a light path between the light source device 110 and the document holder 140. The illumination optical system 130 illuminates the document 142 using light from the light source device 110. The projection optical system 150 projects a pattern of the document 142 illuminated by the illumination optical system 130 onto the substrate 162, thereby exposing the substrate 162. This forms a latent image pattern on the resist applied to the substrate 162. The latent image pattern is developed by a developing device (not shown), and a resist pattern is formed on the substrate 162.

[0025] Figure 2FIG. 1 shows an example of a configuration of a light source device 110. The light source device 110 can include a holder 20 that holds a lamp 10; a condenser lens 50 that condenses light generated by the lamp 10; and nozzles 42a and 42b that include injection holes that inject gas to cool the metal bases 11a and 11b of the lamp 10. Furthermore, the light source device 110 can include a power supplier (lamp power source) 30 that supplies power to the lamp 10 via lead wires (cables) 32a and 32b; and a gas supplier 40 that supplies gas to the nozzles 42a and 42b via supply pipes 41a and 41b, respectively.

[0026] The lamp 10 can be, for example, a short-arc lamp, such as a mercury lamp, a xenon lamp, or a metal halide lamp. The condenser 50 can be, for example, an elliptical reflector having two focal points FP1 and FP2. The light spot of the lamp 10 is arranged at or near the first focal point FP1, and the condenser 50 can reflect the light emitted from the light spot and converge it to the second focal point FP2. The diameter of the opening portion of the condenser 50 can depend on the size of the lamp 10, for example, 300 to 400 mm. In addition, the lamp 10 can be arranged on the optical axis OAX (the axis connecting the first focal point FP1 and the second focal point FP2) of the condenser 50. The nozzles 42a and 42b can be arranged to blow high-pressure air supplied by the gas supply 40 toward the metal bases 11a and 11b, respectively. This cools the metal bases 11a and 11b. To avoid obstructing the effective luminous flux 52 reflected by the condenser 50, the nozzle 42a can be arranged outside the effective luminous flux 52. To cool the metal bases 11 a and 11 b , another cooling medium, for example, a gas such as nitrogen or helium, may be used instead of air.

[0027] The lamp 10 can include: a pair of metal bases 11a and 11b; lamp stems 14a and 14b extending from the metal bases 11a and 11b, respectively; a light-emitting tube 13 disposed between the lamp stems 14a and 14b; and a pair of electrodes 12a and 12b disposed within the lamp stems 14a and 14b and the light-emitting tube 13. The lamp stems 14a and 14b and the light-emitting tube 13 can be integrally formed. In this example, the metal base 11a can be the anode-side metal base, the metal base 11b can be the cathode-side metal base, the electrode 12a can be the anode, and the electrode 12b can be the cathode.

[0028] The metal base 11a and the electrode 12a can be connected by a connecting portion such as a molybdenum foil. Similarly, the metal base 11b and the electrode 12b can be connected by a connecting portion such as a molybdenum foil. A rare gas (e.g., neon, xenon), a metal (e.g., mercury, sodium, scandium), or a mixture thereof can be enclosed in the light emitting tube 13. Light is emitted by arc discharge between the pair of electrodes 12a, 12b. The metal bases 11a and 11b can be connected to the power supply 30 by lead wires 32a and 32b, respectively. Figure 2 An example is shown in which the lead wires 32a and 32b are connected to side surfaces of the metal bases 11a and 11b, respectively. As shown in Figure 3A The lead wires 32a and 32b can be connected to end surfaces of the metal bases 11a and 11b, respectively, as shown in Figure 3B The lead wires 32a and 32b can be connected to the metal bases 11a and 11b by connectors 11c and 11d (e.g., lead wire connection terminals, adapters, or fixing fittings), respectively, as shown in

[0029] It should be noted that hereinafter, when the metal bases 11a and 11b are introduced without distinction, it will be expressed as metal base 11. The description regarding the metal base 11 is the description regarding the metal base 11a and / or the metal base 11b. Similarly, when the lead wires 32a and 32b are introduced without distinction, it will be expressed as lead wire 32. The description regarding the lead wire 32 is the description regarding the lead wire 32a and / or the lead wire 32b. Similarly, when the nozzles 42a and 42b are introduced without distinction, it will be expressed as nozzle 42. The description regarding the nozzle 42 is the description regarding the nozzle 42a and / or the nozzle 42b. Similarly, when the supply tubes 41a and 41b are introduced without distinction, it will be expressed as supply tube 41. The description regarding the supply tube 41 is the description regarding the supply tube 41a and / or the supply tube 41b.

[0030] Figure 4A and 4B An example of the arrangement of the metal base 11 and the nozzle 42 is shown schematically. Figure 4A A plan view, that is, an orthogonal projection with respect to the X-Y plane, is shown. Figure 4B A side view is shown. The metal base 11 can include a cylindrical surface CS. The nozzle 42 includes a jet hole 45 that jets gas so as to cool the metal base 11. The jet hole 45 has a central axis HAX. For example, when the jet hole 45 has a cylindrical shape, the central axis HAX of the jet hole 45 matches the central axis of the cylindrical shape. Gas flows jetted from the jet hole 45 are shown schematically as Fl, F2, F3.

[0031] The distance (hereinafter referred to as offset) d between the straight line Ll including the center axis HAX of the injection hole 45 and the center axis CAX of the metal base 11 can range from 1 / 2 radius R to the radius R of the cylindrical surface CS. Here, the center axis CAX of the metal base 11 is the center axis of the cylindrical surface CS. The center axis CAX of the cylindrical surface CS of the metal base 11 can match the optical axis of the condenser lens 50. The gas flow Fl injected from the nozzle 42 and blown toward the surface of the metal base 11, that is, the cylindrical surface CS, becomes a gas flow F2 along the cylindrical surface CS of the metal base 11, and then changes its direction due to the Coanda effect and becomes a gas flow F3, and is blown toward the lead wire 32. The metal base 11 can be cooled by the gas flows Fl, F2, and F3. The metal base 11 can include a plurality of annular fins surrounding the cylindrical surface CS. As shown in FIG. 5, the nozzle 42a is provided for the metal base 11a, and the nozzle 42b is provided for the metal base 11b. Figure 2 As shown in FIG. 5, the nozzle 42a is provided for the metal base 11a, and the nozzle 42b is provided for the metal base 11b.

[0032] The elevation angle of the center axis HAX of the injection hole 45 of the nozzle 42 can fall within the range of -10° to +10°, and the angle of the center axis CAX of the metal base 11 with respect to the vertical direction (Z-axis direction) can be within the range of -10° to +10°. In another perspective, on a plane including the center axis HAX of the injection hole 45 of the nozzle 42 and parallel to the center axis CAX of the metal base 11, the angle formed by the straight line Ll including the center axis HAX of the injection hole 45 and the plane perpendicular to the center axis CAX of the metal base 11 can be within the range of -10° to +10°.

[0033] Figure 5 The structure of the nozzle 42 and the supply pipe 41 is shown. The nozzle 42 can be combined or connected with the supply pipe 41 so that no leakage of air or gas occurs. The injection hole 45 of the nozzle 42 can be, for example, a circular opening having a diameter ΦD within the range of 1 mm to 2 mm. The flow rate distribution of the air or gas injected from the injection hole 45 can be axisymmetric with respect to the center axis HAX of the injection hole 45. The maximum flow rate of the air or gas injected from the injection hole 45 can be set within the range of, for example, 50 m / sec to 100 m / sec.

[0034] Examples according to the first embodiment will be described below with reference to Figure 6A , 6B , 7, 8A to 8D, 9A to 9D, and 10. FIG. 6 shows an experimental system for actually measuring the air flow injected from the nozzle 42. Figure 6A A plan view is shown. Figure 6BA side view is shown. It is assumed that d is a distance (offset) between a straight line Ll including a center axis HAX of the injection hole 45 and a center axis CAX of the metal base 11, Dl is a distance between a distal end of the nozzle 42 and a cylindrical surface CSl (corresponding to the cylindrical surface CS of the metal base 11) which is a side surface of the column CC. Also, it is assumed that F3 is an air flow after passing through the cylindrical surface CSl, and θ is an angle difference (refraction angle) between Fl and F3. In addition, a position at a distance D2 from the cylindrical surface CSl is a position for measuring a flow rate distribution, and a flow rate distribution in the H direction and the Z direction is measured. It should be noted that the H direction is a direction orthogonal to F3. The diameter Φ (= 2R) of the cylindrical surface CSl is set to 40 mm, the offset d is set to 0, 5, 10, and 15 mm, the air flow rate from the nozzle 42 is set to 50 L / min, the diameter ΦD of the injection hole 45 of the nozzle 42 is set to 1.5 mm, and the average flow rate in the injection hole 45 is set to 470 m / sec. Figure 6A

[0035] Figure 7 A result of measuring a flow rate distribution of air ejected from the nozzle 42 at a position at a distance Dl = 120 mm from the distal end of the nozzle 42 is shown. In the measurement, the column CC shown in Figure 6A is separated. The abscissa indicates a distance from the straight line Ll including the center axis HAX, and the ordinate indicates a flow rate of air. It can be seen that the flow rate distribution of air is symmetrical about the straight line Ll including the center axis HAX. The distance Dl = 120 mm is the minimum distance at which the distal end of the nozzle 42 does not shade the effective light flux 52 shown in Figure 2 in a case where the diameter of the condenser 50 is 300 mm and the diameter Φ of the cylindrical surface CS of the metal base 11 is 40 mm.

[0036] Figures 8A to 8D A result of measuring a flow rate distribution in the ±H direction at a position at a distance D2 = 100 mm from the cylindrical surface CSl is shown. Figures 9A to 9D A result of measuring a flow rate distribution in the ±Z direction at a position at a distance D2 = 100 mm from the cylindrical surface CSl is shown. It can be seen that the greater the offset d, the narrower the range of the flow rate distribution in the ±Z direction. It can be seen that when the offset d is 10 mm, that is, equal to or greater than 1 / 2 of the radius R of the cylindrical surface CSl, the range of the flow rate distribution in the ±Z direction can be suppressed within a narrow range. Figure 10 A result of measuring a refraction angle θ under the same conditions as the measurement shown in Figures 8A to 8D and Figures 9A to 9D is shown. It can be seen that the refraction angle θ becomes larger as the offset d increases, and that the refraction angle θ is about 45° when the offset d = 15 mm.

[0037] ​In the example, the distance in the height direction between the metal base 11 and the light emitting tube 13 in the lamp 10 (the length of the lamp stem 14) is about 80 mm or more, and the distance in the height direction (Z direction) between the upper metal base 11a and the upper end of the condenser 50 can be set to about 100 mm. Therefore, when the offset d is set in the range from 1 / 2 of the radius R of the cylindrical surface CS of the metal base 11 to the radius, the diffusion of the air blown to the metal base 11 to the range outside the metal base 11 can be suppressed. This makes it possible to suppress the light emitting tube 13 of the lamp 10 from being directly cooled by the air blown to the metal base 11 or the light emitting tube 13 from being indirectly cooled by the air flowing into the inner space of the condenser 50, and to prevent lighting failure or non-illumination due to excessive cooling of the lamp 10. Therefore, according to the first embodiment, it is possible to cause the lamp 10 to stably emit light.

[0038] In addition, as the output of the lamp 10 increases, the temperature of the lead 32a supplied with power to the metal base 11a can rise when the lead 32a is irradiated by the light flux reflected by the condenser 50, and oxidation and deterioration of the lead 32a can occur. When a dedicated air blowing mechanism is provided to cool the lead 32a, the operating cost of the exposure apparatus 100 can increase due to an increase in the cost of the light source device 110 or an increase in the air flow rate. When the air or gas flow F3 is formed in the portion of the lead 32a irradiated by the light flux (temperature rising portion), it is possible to cool the portion of the lead 32a at low cost.

[0039] Here, in order to effectively cool the lead 32a by the air or gas ejected from the nozzle 42, as shown in Figure 4A and 4B the metal base 11a is arranged between the ejection hole 45 and the connecting portion (between the metal base 11a and the lead 32a). In the orthogonal projection with respect to the X-Y plane in the XYZ coordinate system in which the central axis CAX of the metal base 11a is the Z axis and the axis parallel to the central axis HAX of the ejection hole 45 is the X axis, it is preferable that the ejection hole 45 be arranged in the second quadrant or the third quadrant. Also, at least the portion of the lead 32 irradiated by the effective light flux 52 from the condenser 50 is preferably arranged in the region formed by the first quadrant and the fourth quadrant.

[0040] The flow rate of the air or gas ejected from the nozzle 42 can be determined taking into account the attenuation of the flow rate caused by the metal base 11 and the lead 32 and the output of the lamp 10. In the example, the flow rate of the air or gas ejected from the nozzle 42 can be determined in the range from 50 m / sec to 600 m / sec.

[0041] Reference will be made to Figure 11A and 11BThe configuration of the light source device 110 in the exposure apparatus according to the second embodiment will be described. Matters not mentioned in the second embodiment can be consistent with the first embodiment. Figure 11A and 11B An example of the arrangement of the metal base 11 and the nozzle 42 in the light source device 110 according to the second embodiment is schematically shown. Figure 11A A plan view, that is, an orthogonal projection with respect to the X-Y plane is shown. Figure 11B A side view is shown.

[0042] In the second embodiment, the nozzle 42 of the first embodiment is replaced by two nozzles 42-1 and 42-2. The distance (offset) d-1 between the straight line LI-1 including the central axis HAX-1 of the ejection hole 45-1 of the first nozzle 42-1 and the central axis CAX of the metal base 11 can be in the range of 1 / 2 radius R or more to radius R or less of the cylindrical surface CS. The distance (offset) d-2 between the straight line LI-2 including the central axis HAX-2 of the ejection hole 45-2 of the second nozzle 42-2 and the central axis CAX of the metal base 11 can be in the range of 1 / 2 radius R or more to radius R or less of the cylindrical surface CS. The offset d-1 and the offset d-2 can be different from each other, or can be equal to each other. The straight line LI-1 and the straight line LI-2 can be arranged in parallel. The first nozzle 42-1 and the second nozzle 42-2 can be arranged so that the central axis CAX of the metal base 11 is arranged between the straight line LI-1 and the straight line LI-2. The first nozzle 42-1 and the second nozzle 42-2 can be arranged at the same height, or can be arranged at different heights from each other.

[0043] The gas flow F1-1 ejected from the first nozzle 42-1 and blown toward the surface of the metal base 11, that is, the cylindrical surface CS, becomes the gas flow F2-1 along the cylindrical surface CS of the metal base 11, then changes its direction due to the Coanda effect and becomes the gas flow F3-1, and is blown toward the lead wire 32. The gas flow F1-2 ejected from the second nozzle 42-2 and blown toward the surface of the metal base 11, that is, the cylindrical surface CS, becomes the gas flow F2-2 along the cylindrical surface CS of the metal base 11, then changes its direction due to the Coanda effect and becomes the gas flow F3-2, and is blown toward the lead wire 32. The gas flow F3-1 and the gas flow F3-2 can be merged. The flow rate of the gas ejected from the first nozzle 42-1 and the flow rate of the gas ejected from the second nozzle 42-2 can be equal to each other, or can be different from each other.

[0044] According to the second embodiment, the same effects as in the first embodiment can be obtained, and the cooling capability for the metal base 11 can be improved by increasing the area toward which air or gas is blown by the metal base 11.

[0045] The following will be described with reference to Figure 12Aand 12B The configuration of the light source device 110 in the exposure apparatus according to the third embodiment will be described. Matters not mentioned in the third embodiment can be consistent with the first embodiment. Figure 12A and 12B An example of the arrangement of the metal base 11 and the nozzles 42 in the light source device 110 according to the third embodiment is schematically shown. Figure 12A A plan view, that is, an orthogonal projection with respect to the X-Y plane, is shown. Figure 12B A side view is shown.

[0046] In the third embodiment, the nozzles 42 of the first embodiment are replaced by two nozzles 42-1 and 42-2. The distance (offset) d-1 between the straight line L1-1 including the central axis HAX-1 of the ejection hole 45-1 of the first nozzle 42-1 and the central axis CAX of the metal base 11 can be in the range of 1 / 2 radius R or more to radius R or less of the cylindrical surface CS. The distance (offset) d-2 between the straight line L1-2 including the central axis HAX-2 of the ejection hole 45-2 of the second nozzle 42-2 and the central axis CAX of the metal base 11 can be in the range of 1 / 2 radius R or more to radius R or less of the cylindrical surface CS. The offset d-1 and the offset d-2 can be different from each other, or can be equal to each other.

[0047] In an orthogonal projection with respect to a plane (X-Y plane) orthogonal to the central axis CAX of the metal base 11, the straight line L1-1 including the central axis HAX-1 of the ejection hole 45-1 of the first nozzle 42-1 and the second straight line L1-2 including the central axis HAX-2 of the second ejection hole 45-2 of the second nozzle 42-2 cross each other.

[0048] The gas flow F1-1 ejected from the first nozzle 42-1 and blown toward the surface of the metal base 11, that is, the cylindrical surface CS, becomes the gas flow F2-1 along the cylindrical surface CS of the metal base 11, then changes its direction due to the Coanda effect and changes into the gas flow F3-1, and is blown toward the lead wire 32. The gas flow F1-2 ejected from the second nozzle 42-2 and blown toward the surface of the metal base 11, that is, the cylindrical surface CS, becomes the gas flow F2-2 along the cylindrical surface CS of the metal base 11, then changes its direction due to the Coanda effect and changes into the gas flow F3-2, and is blown toward the lead wire 32.

[0049] In the example, the directions (directions of the central axes HAX-1 and HAX-2) of the first nozzle 42-1 and the second nozzle 42-2 can be determined in consideration of the refraction angle (the above-described θ) due to the Coanda effect so that the gas flows F3-1 and F3-2 are almost parallel. According to this configuration, stagnation caused by the gas flows F3-1 and F3-2 interfering with each other can be suppressed, and the metal base 11 and the lead wire 32 can be effectively cooled.

[0050] In order to prevent or reduce interference between the gas flows F1-1 and F1-2, a suitable distance zl is provided between the intersection between the straight line L1-1 and the cylindrical surface CS and the intersection between the straight line L1-2 and the cylindrical surface CS in a direction parallel to the central axis CAX of the metal base 11. The distance zl can be, for example, 10 mm or more. The upper limit of the distance zl can be determined by the size of the metal base 11 in the Z direction. The distance zl can be set to be, for example, less than the size of the metal base 11 in the Z direction. Alternatively, when the elevations of the central axes HAX-1 and HAX-2 of the injection holes 45-1 and 45-2 of the nozzles 42-1 and 42-2 are equal to each other, the height difference between the nozzles 42-1 and 42-2 can be 10 mm or more. The upper limit of the height difference between the nozzles 42-1 and 42-2 can be determined by the size of the metal base 11 in the Z direction, and the height difference can be set to be, for example, less than the size of the metal base 11 in the Z direction.

[0051] Reference will be made to Figure 13A and 13B The configuration of the light source device 110 in the exposure apparatus according to the fourth embodiment will be described below. The fourth embodiment is a modification of the second embodiment, and matters not mentioned in the fourth embodiment can be consistent with the second embodiment. Figure 13A and 13B An example of the arrangement of the metal base 11 and the nozzles 42 in the light source device 110 according to the fourth embodiment is schematically shown. Figure 13A A plan view, that is, an orthogonal projection with respect to the X-Y plane, is shown. Figure 13B A side view is shown.

[0052] In the light source device 110 according to the fourth embodiment, the first flow restrictor 46-1 and the second flow restrictor 46-2 serve as adjustment mechanisms that adjust the flow rates of the gases to be supplied from the air supply 40 to the first nozzle 42-1 and the second nozzle 42-2. The first flow restrictor 46-1 and the second flow restrictor 46-2 can be provided midway through the supply pipes 41a and 41b, or can be included in the air supply 40.

[0053] In the example, the first flow restrictor 46-1 and the second flow restrictor 46-2 can adjust or control such that the flow rate of the gas flow F1-1 is greater than the flow rate of the gas flow F1-2. In this case, the direction of the gas flow F after the gas flows F3-1 and F3-2 merge is closer to the gas flow F3-1 (compared to the gas flow F3-2). The first flow restrictor 46-1 and the second flow restrictor 46-2 can be manual flow restrictors, or can be flow restrictors that can be controlled by a controller (not shown). The fourth embodiment is advantageous in adjusting or controlling the direction of the gas flow F in the case where the arrangement of the nozzles 42-1 and 42-2 and / or the arrangement of the lead lines 32 is limited.

[0054] An article manufacturing method according to the embodiment will be described below. The article manufacturing method is suitable for manufacturing an article such as a device (a semiconductor element, a magnetic storage medium, a liquid crystal display element, or the like) or a color filter. The article manufacturing method can include an exposure step of exposing a substrate (on which a photoresist is applied) using the exposure apparatus described above, a development step of developing the substrate exposed in the exposure step, and a processing step of processing the substrate subjected to the development step, so as to obtain an article. The processing step can include, for example, known processes (such as oxidation, deposition, vapor deposition, doping, planarization, etching, resist removal, dicing, bonding, and packaging). The article manufacturing method according to the present embodiment is advantageous in at least one of performance, quality, productivity, and production cost of an article, compared to a conventional method.

[0055] While the present application has been described with reference to example embodiments, it is to be understood that the application is not limited to the disclosed example embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all the variations and equivalents.

Claims

1. A light source device, comprising: a holder configured to hold a lamp including a metal base having a cylindrical surface; a condenser lens configured to concentrate light generated by the lamp; as well as a nozzle including a spray hole configured to spray a gas so as to cool the metal base; wherein a distance between a straight line including a central axis of the injection hole and a central axis of the metal base ranges from not less than 1 / 2 of a radius of the cylindrical surface to not more than the radius; The gas ejected from the nozzle flows along the cylindrical surface and then flows to the lead wire connected to the metal base.

2. The light source device according to claim 1, further comprising: a second nozzle including a second spray hole configured to spray gas so as to cool the metal base, Here, a distance between a second straight line including a central axis of the second injection hole and a central axis of the metal base ranges from not less than 1 / 2 of a radius of the cylindrical surface to not more than the radius.

3. The light source device according to claim 2, wherein: The straight line including the central axis of the injection hole and the second straight line including the central axis of the second injection hole are parallel to each other.

4. The light source device according to claim 2, wherein: The central axis of the metal base is arranged between the straight line including the central axis of the injection hole and the second straight line including the central axis of the second injection hole.

5. The light source device according to claim 2, wherein: The straight line including the central axis of the injection hole and the second straight line including the central axis of the second injection hole intersect each other in an orthogonal projection with respect to a plane perpendicular to the central axis of the metal base.

6. The light source device according to claim 5, wherein: A distance between an intersection point between the straight line and the cylindrical surface and an intersection point between the second straight line and the cylindrical surface in a direction parallel to a central axis of the metal base is not less than 10 mm.

7. The light source device according to claim 2, further comprising: A regulating mechanism configured to regulate a flow rate of the gas supplied to the nozzle and a flow rate of the gas supplied to the second nozzle.

8. The light source device according to claim 1, wherein: The metal base is arranged between the injection hole and a connection portion between the metal base and the lead wire.

9. The light source device according to claim 8, wherein: In an orthogonal projection on an XY plane in an XYZ coordinate system, the injection hole is arranged in one of the second quadrant and the third quadrant, and at least a portion of the lead illuminated by the light flux from the condenser lens is arranged in an area formed by the first quadrant and the fourth quadrant. In the XYZ coordinate system, the central axis of the metal base is the Z axis, and the axis parallel to the central axis of the injection hole is the X axis.

10. The light source device according to claim 1, wherein: The nozzle is arranged outside an effective light flux emitted from the lamp and reflected by the condenser mirror.

11. The light source device according to claim 1, wherein: The flow velocity distribution of the gas injected from the injection hole is axisymmetric about a central axis of the injection hole.

12. The light source device according to claim 11, wherein: The injection hole is a circular opening, the diameter of the circular opening falls within the range of not less than 1 mm to not more than 2 mm, and the maximum flow rate of the gas injected from the injection hole falls within the range of not less than 50 m / sec to not more than 100 m / sec.

13. The light source device according to claim 1, wherein: The condenser mirror is an elliptical reflector.

14. The light source device according to claim 13, wherein: The central axis of the cylindrical surface of the metal base matches the optical axis of the condenser lens.

15. A light source device, comprising: a holder configured to hold a lamp including a metal base having a cylindrical surface; a condenser lens configured to concentrate light generated by the lamp; a first nozzle including a first spray hole configured to spray a gas so as to cool the metal base; as well as a second nozzle including a second spray hole configured to spray a gas so as to cool the metal base; wherein a distance between a first straight line including a central axis of the first injection hole and a central axis of the metal base ranges from not less than 1 / 2 of a radius of the cylindrical surface to not more than the radius; The central axis of the metal base is arranged between the first straight line including the central axis of the first injection hole and the second straight line including the central axis of the second injection hole.

16. A light source device, comprising: a holder configured to hold a lamp including a metal base having a cylindrical surface; a condenser lens configured to concentrate light generated by the lamp; a first nozzle including a first spray hole configured to spray a gas so as to cool the metal base; as well as a second nozzle including a second spray hole configured to spray a gas so as to cool the metal base; wherein a distance between a first straight line including a central axis of the first injection hole and a central axis of the metal base ranges from not less than 1 / 2 of a radius of the cylindrical surface to not more than the radius; Here, in an orthogonal projection with respect to a plane perpendicular to a central axis of the metal base, the first straight line including the central axis of the first injection hole and the second straight line including the central axis of the second injection hole intersect each other.

17. A light source device, comprising: a holder configured to hold a lamp including a metal base having a cylindrical surface; a condenser lens configured to concentrate light generated by the lamp; as well as a nozzle including a spray hole configured to spray a gas so as to cool the metal base; wherein a distance between a straight line including a central axis of the injection hole and a central axis of the metal base ranges from not less than 1 / 2 of a radius of the cylindrical surface to not more than the radius; wherein the lead is connected to the metal base, and the metal base is arranged between the injection hole and the connection portion between the metal base and the lead; In which, in the orthogonal projection with respect to the XY plane in the XYZ coordinate system, the injection hole is arranged in one of the second quadrant and the third quadrant, at least the portion of the lead illuminated by the light flux from the condenser is arranged in the area formed by the first quadrant and the fourth quadrant, and in the XYZ coordinate system, the central axis of the metal base is the Z axis, and the axis parallel to the central axis of the injection hole is the X axis.

18. A light source device comprising: a holder configured to hold a lamp including a metal base having a cylindrical surface; a condenser lens configured to concentrate light generated by the lamp; as well as a nozzle including a spray hole configured to spray a gas so as to cool the metal base; wherein a distance between a straight line including a central axis of the injection hole and a central axis of the metal base ranges from not less than 1 / 2 of a radius of the cylindrical surface to not more than the radius; wherein the flow velocity distribution of the gas ejected from the ejection hole is axisymmetric about the central axis of the ejection hole; The injection hole is a circular opening, the diameter of the circular opening falls within the range of not less than 1 mm to not more than 2 mm, and the maximum flow rate of the gas injected from the injection hole falls within the range of not less than 50 m / sec to not more than 100 m / sec.

19. An exposure device comprising: The light source device according to any one of claims 1 to 18; an illumination optical system configured to illuminate a document using light from the light source device; as well as A projection optical system is configured to project the pattern of the original onto a substrate.

20. A method of manufacturing an article, comprising: exposing a substrate using the exposure apparatus according to claim 19; developing the substrate exposed in the exposing; as well as The developed substrate is processed to obtain an article.

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