Wafer cleaning, drying and detecting integrated device based on space saving function combination

Abstract

The application discloses a wafer cleaning, drying and detecting integrated device based on space saving function combination, which comprises a machine body, a wafer drying mechanism, an ultrasonic cleaning mechanism, a wafer boat swing arm mechanism, a wafer boat overturning mechanism, a wafer detecting mechanism and a drying water tank; the wafer drying mechanism and the ultrasonic cleaning mechanism are installed side by side on the machine body, the wafer boat swing arm mechanism is installed on the machine body, and the wafer boat overturning mechanism is installed on the wafer drying mechanism; the wafer detecting mechanism is arranged on a table top of the machine body, and the drying water tank is arranged on the machine body. The application is based on modular design, three kinds of processes are integrated on one machine, full-automatic action is realized, manual contact is avoided, and carrying is reduced.

Description

Technical Field

[0001] This invention relates to the field of wafer post-processing technology, and in particular to an integrated wafer cleaning, drying, and inspection device based on space-saving functionality. Background Technology

[0002] In semiconductor manufacturing, existing wafer cleaning, drying, inspection, and processing equipment lacks integration, resulting in low automation in post-processing. This necessitates manual handling between each process step, inevitably leading to scratches, wear, and dust accumulation during transport. Traditional equipment requires three separate units for post-processing, increasing production costs.

[0003] The main technical challenge is to adopt modular integration technology to integrate various processes into one device, thereby avoiding long-distance manual handling between each process and improving the automation level of the post-processing equipment.

[0004] In 2018, Xu Zhenjie et al. invented a wafer cleaning and drying device, authorized announcement number: (CN105470177B). This invention provides a wafer cleaning and drying device. This device adopts a dual-fluid disk structure, which is placed on the upper and lower sides of the wafer, and can dry both sides of the wafer. However, the wafer is still dried individually, and only one process can be completed. If the next process is required, it must be manually handled.

[0005] In 2020, Shen Linghan invented a wafer cleaning and drying device (authorization announcement number: CN111092036B). This invention provides a wafer cleaning and drying device that uses a spray pipe installed at the top of a water tank. The drying method employs the Marangoni drying method, using the spray pipe to spray drying gas onto the cleaned wafer to dry the wafer surface. However, the invention does not mention the wafer cleaning process, so it can only achieve the wafer drying process. Furthermore, when drying wafers, only single wafers can be dried, resulting in low drying efficiency.

[0006] In summary, although existing wafer post-processing methods can complete wafer cleaning, drying, and inspection, the problem of integrating post-processing technologies remains unsolved. Summary of the Invention

[0007] The purpose of this invention is to overcome the defects of the prior art and provide an integrated wafer cleaning, drying and inspection device based on space-saving functions. This solves the problem that existing wafer cleaning, drying and inspection equipment does not integrate the three processes, and can realize the integration and automation of post-processing.

[0008] The objective of this invention is achieved in one aspect as follows: an integrated wafer cleaning, drying, and testing device based on space-saving functionality, comprising a main body, a wafer drying mechanism, an ultrasonic cleaning mechanism, a wafer boat swing arm mechanism, a wafer boat flipping mechanism, a wafer testing mechanism, and a drying water tank; the wafer drying mechanism and the ultrasonic cleaning mechanism are mounted side-by-side on the main body, the wafer boat swing arm mechanism is mounted on the main body, and the wafer boat flipping mechanism is mounted on the wafer drying mechanism; the wafer testing mechanism is disposed on the table surface of the main body, and the drying water tank is disposed on the main body.

[0009] The crystal boat swing arm mechanism can serve not only as a crystal boat carrying mechanism but also as a crystal boat transport mechanism, undertaking the transport work between cleaning and drying. The crystal boat swing arm mechanism includes a connecting plate, a rotating rod, a connecting rod, and a lifting frame. The connecting plate is mounted on the machine body, the rotating rod passes through the connecting rod to achieve rotational movement, the upper end of the lifting frame is pin-connected to the connecting rod, and the lifting frame has two slots for placing the crystal boat.

[0010] To save space, the traditional robotic gripper is abandoned. The crystal boat flipping mechanism includes a guide rail plate, a sliding plate, a left gripper, a lead screw mechanism, a right gripper, a shim, and cylindrical guide rails. The rear end of the guide rail plate is connected to and installed on the frame plate of the crystal boat drying mechanism, allowing it to move up and down. The left gripper is mounted on the guide rail plate, and a pivot is installed between the left gripper and the sliding plate, allowing it to rotate 90° to change the position of the crystal boat. The right gripper is connected by two cylindrical guide rails and uses a lead screw mechanism to close and grip the crystal boat.

[0011] In order to remove contaminants from the wafer surface, the wafer is rinsed a second time to greatly clean the wafer surface. The ultrasonic cleaning mechanism includes an ultrasonic cleaning water tank and spray pipes. An ultrasonic device is installed inside the ultrasonic cleaning water tank, and the spray pipes are installed on both sides of the ultrasonic cleaning water tank.

[0012] The present invention adopts the above technical solution, and its beneficial effects compared with the prior art are as follows: The present invention can realize the integration of three post-processing processes: wafer cleaning, drying and inspection. The present invention is based on modular design and integrates the three processes into one machine, realizing fully automated operation. In order to realize the position transfer of the wafer boat, a wafer boat flipping mechanism is designed, which can move the wafer boat out of the drying mechanism, and then flip it 90° and place it in the inspection mechanism, avoiding manual contact, reducing handling, and greatly realizing the automation of the post-processing process. Attached Figure Description

[0013] Figure 1 Overall structural diagram of the present invention.

[0014] Figure 2 A diagram of the crystal boat swing arm mechanism of the present invention.

[0015] Figure 3 A diagram of the crystal boat flipping mechanism of the present invention.

[0016] Figure 4 A diagram of the ultrasonic cleaning mechanism of this invention.

[0017] Figure 5 A diagram of the wafer inspection mechanism of this invention.

[0018] The components include: 1. Machine body; 2. Wafer drying mechanism; 3. Ultrasonic cleaning mechanism; 31. Ultrasonic cleaning water tank; 32. Ultrasonic device; 33. Spray pipe; 4. Crystal boat swing arm mechanism; 41. Connecting plate; 42. Rotating rod; 43. Connecting rod; 44. Lifting frame; 5. Crystal boat flipping mechanism; 51. Guide rail plate; 52. Slide plate; 53. Left gripper; 54. Lead screw mechanism; 55. Right gripper; 56. Shim; 57. Cylindrical guide rail; 6. Wafer inspection mechanism; 61. Base plate; 62. Wafer pull-out mechanism; 63. Wafer return mechanism; 64. CDD industrial camera mechanism; 65. Crystal boat lifting mechanism; 66. Wafer ejection mechanism; 7. Drying water tank; 8. Crystal boat; 9. Wafer. Detailed Implementation

[0019] like Figure 1 The space-saving integrated wafer cleaning, drying, and inspection device shown includes a body 1, a wafer drying mechanism 2, an ultrasonic cleaning mechanism 3, a wafer boat swing arm mechanism 4, a wafer boat flipping mechanism 5, a wafer inspection mechanism 6, and a drying water tank 7. The wafer drying mechanism 2 and the ultrasonic cleaning mechanism 3 are mounted side by side on the body 1, the wafer boat swing arm mechanism 4 is mounted on the body 1, and the wafer boat flipping mechanism 5 is mounted on the wafer drying mechanism 2. The wafer inspection mechanism 6 is set on the table of the body 1, and the drying water tank 7 is set on the body 1.

[0020] like Figure 2 As shown, the wafer boat swing arm mechanism 4 is used to hold the wafer boat 8, realizing the transfer of the cleaned wafer along with the wafer boat to the next wafer drying process, forming an automated action. The wafer boat swing arm mechanism 4 includes a connecting plate 41, a rotating rod 42, a connecting rod 43, and a lifting frame 44; the connecting plate 41 is mounted on the machine body 1, the rotating rod 42 passes through the connecting rod 43 to realize the rotational movement, the upper end of the lifting frame 44 is pin connected to the connecting rod 43, and the lifting frame 44 is provided with two slots to facilitate the simultaneous placement of two wafer boats 8.

[0021] like Figure 3 As shown, the crystal boat flipping mechanism 5 includes a guide rail plate 51, a slide plate 52, a left gripper 53, a lead screw mechanism 54, a right gripper 55, a shim 56, and a cylindrical guide rail 57. The rear end of the guide rail plate 51 is connected to and installed on the shelf of the wafer drying mechanism 2, and can move up and down. The left gripper 53 is installed on the guide rail plate 51, and a rotating shaft is installed between the left gripper 53 and the slide plate 52, which can rotate 90° to change the position of the crystal boat. The right gripper 55 is connected by two cylindrical guide rails 57 and is clamped by the lead screw mechanism 54.

[0022] like Figure 4 As shown, the ultrasonic cleaning mechanism 3 includes an ultrasonic cleaning water tank 31 and a spray pipe 33. An ultrasonic device 32 is installed inside the ultrasonic cleaning water tank 31. When the crystal boat 8 filled with wafers is placed into the cleaning water tank, the ultrasonic device 32 starts to work and can clean away contaminants on the surface of the wafer. The spray pipe 33 is installed on both sides of the ultrasonic cleaning water tank 31. When the crystal boat 8 is lifted out of the water, the spray pipe 33 starts to spray and wash the wafer, performing a secondary rinse on the wafer, which can greatly clean the surface of the wafer.

[0023] like Figure 5 As shown, the wafer inspection mechanism 6 includes a base plate 61, a wafer ejection mechanism 62, a wafer return mechanism 63, a CCD industrial camera mechanism 64, a wafer boat lifting mechanism 65, a wafer ejection mechanism 66, and a U-shaped tray; the wafer ejection mechanism 62, the CCD industrial camera mechanism 64, the wafer boat lifting mechanism 65, and the wafer ejection mechanism 66 are all mounted on the base plate 61; the wafer return mechanism 63 is mounted on the wafer ejection mechanism 62. During testing, the wafer boat is raised and lowered to a specific height by the lifting mechanism 65, and the wafer ejection mechanism 66 ejects a wafer 9 from the wafer boat 8; the suction cup holds the wafer 9; the wafer lifting mechanism 62 completely removes the wafer 9 from the wafer boat 8, and the CCD industrial camera 64 takes pictures of the surface of the wafer 9. After taking pictures, the wafer 9 is sent back into the wafer boat 8 by the suction cup; finally, the long arm of the wafer lifting mechanism 62 is raised for fine adjustment, and the wafer return mechanism 63 pushes the wafer 9 back into the wafer boat 8, completing the wafer testing.

[0024] The wafer drying mechanism includes an atomizer, a wafer ejection mechanism, a wafer boat swaying mechanism, and a lifting mechanism. The atomizer is located on top of the drying water tank 7. The wafer boat swaying mechanism and the wafer ejection mechanism are respectively installed on the lifting mechanism. The wafer boat 8 carrying the wafer 9 is placed in the wafer boat swaying mechanism. The wafer ejection mechanism ejects the wafer 9 from the wafer boat 8 and the wafer boat swaying mechanism is used to sway the wafer boat to ensure that all parts of the wafer 9 are thoroughly dried.

[0025] In operation, two wafer boats 8 are placed on the wafer boat swing arm mechanism 4. The wafer boats 8 are then first fed into the wafer ultrasonic cleaning mechanism 3 for ultrasonic cleaning. Next, the wafer boat swing arm mechanism 4 carries the wafer boats 8 above the wafer drying mechanism 2. At this time, the atomizer of the wafer drying mechanism 2 moves to the left. Then, the wafer boat flipping mechanism 5 picks up the wafer boats 8 and places them into the drying water tank 7 for drying. Finally, the wafer boat flipping mechanism 5 picks up the wafer boats 8 again, rotates them 90°, and places them on the right-side wafer inspection mechanism 6 for inspection.

[0026] This invention provides an integrated device for wafer cleaning, drying, and inspection processes. Compared to current single-function post-processing devices, the device designed in this invention has the advantage of integration, combining wafer cleaning, drying, and inspection processes into one device, avoiding manual intervention during processing, and greatly automating the post-processing process.

[0027] This invention is not limited to the above embodiments. Based on the technical solutions disclosed in this invention, those skilled in the art can make some substitutions and modifications to some of the technical features without creative effort, and all such substitutions and modifications are within the protection scope of this invention.

Claims

1. An integrated wafer cleaning, drying, and inspection device based on space-saving functionality, characterized in that, The device includes a main body (1), a wafer drying mechanism (2), an ultrasonic cleaning mechanism (3), a wafer boat swing arm mechanism (4), a wafer boat flipping mechanism (5), a wafer inspection mechanism (6), and a drying water tank (7). The wafer drying mechanism (2) and the ultrasonic cleaning mechanism (3) are mounted side by side on the main body (1), the wafer boat swing arm mechanism (4) is mounted on the main body (1), and the wafer boat flipping mechanism (5) is mounted on the wafer drying mechanism (2). The wafer inspection mechanism (6) is located on the table of the main body (1), and the drying water tank (7) is located on the main body (1). The crystal boat swing arm mechanism (4) includes a connecting plate (41), a rotating rod (42), a connecting rod (43), and a lifting frame (44); the connecting plate (41) is installed on the body (1), the rotating rod (42) passes through the connecting rod (43) to achieve rotational movement, the upper end of the lifting frame (44) is connected to the connecting rod (43) by a pin, and the lifting frame (44) is provided with two pits for placing the crystal boat; The crystal boat flipping mechanism (5) includes a guide rail plate (51), a sliding plate (52), a left gripper (53), a lead screw mechanism (54), a right gripper (55), a shim (56), and a cylindrical guide rail (57). The rear end of the guide rail plate (51) is connected to and installed on the frame plate of the crystal boat drying mechanism (2), and can move up and down. The left gripper (53) is installed on the guide rail plate (51), and a rotating shaft is installed between the left gripper (53) and the sliding plate (52), which can rotate 90° to change the position of the crystal boat. The right gripper (55) is connected by two cylindrical guide rails (57) and is clamped by the lead screw mechanism (54). The ultrasonic cleaning mechanism (3) includes an ultrasonic cleaning water tank (31) and a spray pipe (33); an ultrasonic device (32) is installed inside the ultrasonic cleaning water tank (31), and the spray pipe (33) is installed on both sides of the ultrasonic cleaning water tank (31). During operation, two crystal boats (8) are placed on the crystal boat swing arm mechanism (4). Then, the crystal boats (8) are first sent into the wafer ultrasonic cleaning mechanism (3) for ultrasonic cleaning. Then, the crystal boat swing arm mechanism (4) brings the crystal boats (8) to the top of the wafer drying mechanism (2). At this time, the atomizer of the wafer drying mechanism (2) moves to the left. Then, the crystal boat flipping mechanism (5) picks up the crystal boats (8) and puts them into the drying water tank (7) for drying. Then, the crystal boat flipping mechanism (5) picks up the crystal boats (8) again and rotates them 90° to place them on the right wafer inspection mechanism (6) for inspection.

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