Display device

Abstract

According to an example embodiment of the disclosure, a display device includes a display panel divided into a display area and a non-display area and including a substrate, a transistor disposed above the substrate and disposed in the display area, a flexible film disposed on a side surface of the non-display area and connected to the substrate, and a conductive layer disposed below the substrate and applied with a low potential power voltage from the flexible film to improve edge aging due to polarization by canceling positive charges in a polyimide substrate.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0128935, filed on October 6, 2020, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to a display device, and more specifically, to a display device using a flexible substrate. Background Technology

[0004] As display devices used for computer monitors, televisions, or mobile phones, there are organic light-emitting display (OLED) devices that are self-emissive devices and liquid crystal display (LCD) devices that require a separate light source.

[0005] The applications of display devices are diversifying to personal digital assistants, computer monitors, and televisions, and research is underway on display devices with large display areas and reduced size and weight.

[0006] Recently, flexible display devices, which are manufactured by forming display elements and wiring on a flexible substrate made of a plastic material such as polyimide (PI) as a flexible material, have attracted attention as the next generation of display devices. Summary of the Invention

[0007] One objective of this disclosure is to provide a display device that improves edge burn-in in flexible display devices based on polyimide (PI) substrates.

[0008] The purpose of this disclosure is not limited to the purposes mentioned above, and other purposes not mentioned above will be clearly understood by those skilled in the art through the following description.

[0009] To achieve the above objectives, according to one aspect of this disclosure, a display device includes: a display panel divided into a display area and a non-display area and including a substrate; a transistor disposed above the substrate and disposed in the display area; a flexible film disposed on a side surface of the non-display area and connected to the substrate; and a conductive layer disposed below the substrate and having a low potential power supply voltage applied from the flexible film.

[0010] According to another aspect of this disclosure, a display device includes: a display panel divided into a display area and a non-display area and including a substrate; a transistor disposed above the substrate and disposed in the display area; a flexible film disposed on a side surface of the non-display area and connected to the substrate; a conductive layer disposed below the substrate and subjected to a low-potential power supply voltage; and a connecting member disposed on a side surface of the display panel, wherein the conductive layer includes: a first conductive layer formed below the display panel to form a side contact with the connecting member; and a plurality of second conductive layers, the plurality of second conductive layers being separate from the first conductive layer and extending vertically.

[0011] Further details of exemplary embodiments are included in the detailed description and accompanying drawings.

[0012] According to this disclosure, a flexible display device is manufactured by forming display elements and wiring on a flexible substrate made of a plastic material such as polyimide (PI), which is a flexible material. In a flexible display device based on a polyimide (PI) substrate, the positive charge in the polyimide substrate is neutralized to improve edge aging caused by polarization.

[0013] The effects of this disclosure are not limited to those illustrated above, and this specification includes many more effects. Attached Figure Description

[0014] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0015] Figure 1A and Figure 1B This is a perspective view of a display device according to a first exemplary embodiment of the present disclosure;

[0016] Figure 2 This is a plan view of a display device according to a first exemplary embodiment of the present disclosure;

[0017] Figure 3 It is along Figure 2 A cross-sectional view taken from line II-II';

[0018] Figure 4 This is a plan view of a display panel according to a first exemplary embodiment of the present disclosure;

[0019] Figure 5A and Figure 5B yes Figure 4 A magnified view of region A;

[0020] Figure 6A and Figure 6BThis is a cross-sectional view of a sub-pixel according to a first exemplary embodiment of the present disclosure;

[0021] Figure 7 It is along Figure 4 A cross-sectional view taken from line III-III';

[0022] Figure 8 It is along Figure 4 A cross-sectional view taken by line IV-IV';

[0023] Figure 9 This is a plan view of a display panel according to a second exemplary embodiment of the present disclosure;

[0024] Figure 10A It is along Figure 9 A cross-sectional view taken by line VIII-VIII';

[0025] Figure 10B It is along Figure 9 A cross-sectional view taken by line IX-IX';

[0026] Figure 11 This is a plan view of a display panel according to a third exemplary embodiment of the present disclosure;

[0027] Figures 12A to 12C It is a graph showing the degree of edge aging according to the driving time;

[0028] Figures 13A to 13C It is a graph showing the degree of edge aging according to the driving time; and

[0029] Figure 14 This is a table showing the evaluation results during the initial drive. Detailed Implementation

[0030] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the exemplary embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, and will be implemented in various forms. The exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure. Therefore, this disclosure will be limited only by the scope of the appended claims.

[0031] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0032] Even if not explicitly stated, components are interpreted as including the normal tolerance range.

[0033] When using terms such as “on,” “above,” “below,” and “adjacent” to describe the positional relationship between two components, one or more components may be located between the two components unless these terms are used in conjunction with the terms “immediately adjacent” or “directly.” Furthermore, according to the orientations shown in the illustrated embodiments, the terms “above” and “below” may refer to the orientation or location of an aspect of this disclosure. Therefore, although the orientations of two components shown in the illustrated embodiments are described as “above” or “below” each other, this disclosure can also be considered as depending on the orientation of the embodiment in use, with the two components in front, behind, to the left, or to the right of each other.

[0034] When an element or layer is placed "on" another element or layer, the other layer or element may be placed directly on or between the other element.

[0035] Although the terms "first," "second," etc., are used to describe individual components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below can be a second component in the technical concept of this disclosure.

[0036] Throughout the specification, the same reference numerals generally denote the same elements.

[0037] For ease of description, the dimensions and thickness of each component shown in the accompanying drawings are illustrated, and this disclosure is not limited to the dimensions and thickness of the components shown.

[0038] Features of various embodiments of this disclosure may be attached or combined with each other in part or in whole, and may be interlocked and operated in various technical ways, and the embodiments may be performed independently of each other or in association with each other.

[0039] In the following, exemplary embodiments according to this disclosure will be described in detail with reference to the accompanying drawings.

[0040] A rollable display device can also be described as a display device that can display images even when rolled up. Compared to general display devices in related technologies, rollable display devices can have high flexibility. The shape of a rollable display device can be freely changed depending on whether it is used. Specifically, when not in use, the rollable display device is rolled up for storage with a reduced volume. Conversely, when in use, the rolled-up display device is unfolded for use.

[0041] However, this disclosure is not limited to rollable display devices, but can be applied to any plastic-based flexible display device, such as a foldable display device. However, in the following description, a rollable display device will be exemplified as a display device.

[0042] Figure 1A and Figure 1B This is a perspective view of a display device according to a first exemplary embodiment of the present disclosure.

[0043] Reference Figure 1A and Figure 1B The display device 100 according to the first exemplary embodiment of the present disclosure includes a display unit DP (which may also be referred to herein as a display component DP) and a housing unit HP (which may also be referred to herein as a housing HP).

[0044] A display unit (DP) is a configuration for displaying images to a user, and for example, display elements and circuits, wiring, components, etc. for driving the display elements can be set in the display unit (DP).

[0045] As described above, the display device 100 according to the first exemplary embodiment of this disclosure is a rollable display device 100, and the display unit DP can be configured to be wound and unfolded. For example, the display unit DP according to the first exemplary embodiment of this disclosure can be formed of a display panel and a back cover, both of which are flexible enough to be wound or unfolded. Reference will be made below. Figure 2 and Figure 3 A more detailed description of the display unit (DP), display panel, and back cover.

[0046] The housing unit HP is a box that houses the display unit DP. The display unit DP can be wound up to be housed in the housing unit HP, and the display unit DP can be unwound to be disposed outside the housing unit HP or extend from the housing unit HP.

[0047] The housing unit HP has an opening HPO to allow the display unit DP to move inside and outside the housing unit HP. The display unit DP can move vertically through the opening HPO passing through the housing unit HP.

[0048] The display unit DP of the display device 100 can switch from a fully unfolded state to a fully wrapped state or from a fully wrapped state to a fully unfolded state.

[0049] Figure 1A The fully extended display unit DP of the display device 100 is shown as an example, and in the fully extended state, the display unit DP of the display device 100 is located outside the housing unit HP. That is, in order for a user to view an image through the display device 100, it can be defined as the fully extended state when the display unit DP is extended as far as possible to be located outside the housing unit HP and cannot be extended further.

[0050] Figure 1B The fully wound display unit DP of the display device 100 is shown as an example, and in the fully wound state, the display unit DP of the display device 100 is housed within the housing unit HP and cannot be further wound. That is, from an aesthetic point of view, it is advantageous for the display unit DP not to be located outside the housing unit HP when the user is not viewing an image through the display device 100. Therefore, when the display unit DP is wound to be housed within the housing unit HP, it is defined as the fully wound state.

[0051] When the display unit DP is fully wound to be housed in the housing unit HP, the volume of the display device 100 is reduced and the display device 100 can be easily carried.

[0052] In order to switch the display unit DP to a fully unfolded state or a fully wrapped state, the display device 100 may include a drive unit (which may also be referred to herein as a drive component) for wrapping or unfolding the display unit DP.

[0053] Figure 2 This is a plan view of a display device according to a first exemplary embodiment of the present disclosure.

[0054] Figure 3 It is along Figure 2 The cross-sectional view taken from line II-II'.

[0055] Reference Figure 2 and Figure 3 The display unit DP according to the first exemplary embodiment of the present disclosure includes a back cover 110, a display panel 120, a flexible film 130, and a printed circuit board 140.

[0056] Display panel 120 is a panel used to display images to the user.

[0057] Display panel 120 may include display elements for displaying images, driving elements for driving the display elements, and wiring for transmitting various signals to the display elements and driving elements. The display elements can be defined differently depending on the type of display panel 120. For example, when display panel 120 is an organic light-emitting display panel, the display element may be an organic light-emitting diode (OLED) including an anode, an organic light-emitting layer, and a cathode. For example, when display panel 120 is a liquid crystal display panel, the display element may be a liquid crystal display element. The following description assumes that display panel 120 is an organic light-emitting display panel; however, display panel 120 is not limited to organic light-emitting display panels, and the concepts of this disclosure can be equivalently applied to liquid crystal display panels and other types of display panels. Furthermore, since the display device 100 according to the first exemplary embodiment of this disclosure is a rollable display device, display panel 120 can be implemented as a flexible display panel to be wound around or unwound from roller 151.

[0058] The display panel 120 includes a display area AA and a non-display area NA.

[0059] Display area AA is the area in display panel 120 where images are displayed.

[0060] Within a display area AA, multiple sub-pixels constituting multiple pixels and circuitry for driving these sub-pixels can be configured. The multiple sub-pixels are the smallest unit constituting the display area AA, and display elements can be disposed within each of the multiple sub-pixels. Multiple sub-pixels can constitute a pixel. For example, an organic light-emitting diode (OLED) comprising an anode, an organic light-emitting layer, and a cathode can be disposed within each of the multiple sub-pixels, but is not limited thereto. Furthermore, the circuitry for driving the multiple sub-pixels can include driving elements, wiring, etc. For example, the circuitry can be constructed from thin-film transistors, storage capacitors, gate lines, data lines, etc., but is not limited thereto.

[0061] The non-display area NA is the area where no image is displayed.

[0062] In the non-display area NA, various wiring, circuits, etc., are provided for driving the organic light-emitting diodes of the display area AA. For example, in the non-display area NA, link lines for transmitting signals to multiple sub-pixels and circuits of the display area AA, and driver integrated circuits (“ICs”) such as gate driver ICs or data driver ICs may be provided, but are not limited thereto.

[0063] The flexible film 130 is a film in which various components are disposed on a base film with elasticity. Specifically, the flexible film 130 is a film that provides signals to multiple sub-pixels and circuits in the display area AA and is electrically connected to the display panel 120. The flexible film 130 is disposed at one end of the non-display area NA of the display panel 120 to provide power voltage, data voltage, etc., to the multiple sub-pixels and circuits in the display area AA. Even Figure 2 Four flexible membranes 130 are shown, but the number of flexible membranes 130 can vary depending on the design and is not limited to this.

[0064] Simultaneously, driver ICs, such as gate driver ICs or data driver ICs, can be disposed on the flexible film 130. The driver IC is a component that processes data for displaying images and drive signals for processing that data. Depending on the mounting method, the driver IC can be disposed via chip-on-glass (COG), chip-on-film (COF), tape-on-carrier (TCP), etc. However, for ease of description, the driver IC is described as being mounted on the flexible film 130 via a chip-on-film method, but it is not limited to this.

[0065] A printed circuit board 140 is disposed at one end of the flexible film 130 and connected to the flexible film 130. The printed circuit board 140 is a component that provides signals to the driver IC. The printed circuit board 140 provides various signals to the driver IC, such as drive signals or data signals. For example, a data driver that generates data signals can be mounted in or on the printed circuit board 140, and the generated data signals can be provided to multiple sub-pixels and circuits of the display panel 120 through the flexible film 130. Meanwhile, even... Figure 2 The diagram shows a printed circuit board 140. The number of printed circuit boards 140 may vary depending on the design, but is not limited thereto.

[0066] A back cover 110 is disposed on the rear surface of the display panel 120, the flexible film 130, and the printed circuit board 140 to support the display panel 120, the flexible film 130, and the printed circuit board 140. Therefore, the size of the back cover 110 can be larger than the size of the display panel 120. Thus, the back cover 110 can protect other configurations of the display unit DP from the outside or from the rear. Even if the back cover 110 is formed of a rigid material, at least a portion of the back cover 110 can be flexible to be wound or unfolded together with the display panel 120. For example, the back cover 110 can be formed of a metallic material such as steel or plastic using stainless steel (SUS) or Invar. However, various materials can be used, and are not limited to these, as long as the material of the back cover 110 meets physical conditions such as thermal strain, radius of curvature, and rigidity.

[0067] Meanwhile, on the substrate 121 of the display panel 120 ( Figure 4 A conductive layer 128 is provided below it.

[0068] The conductive layer 128 can be disposed below the substrate 121 to suppress EA (earthquake embrittlement) in the edge region of the display panel 120. Figure 4 Edge aging at ( ).

[0069] The conductive layer 128 can be formed from the edge of the substrate 121 inward at a predetermined or selected distance on three surfaces of the display panel 120, excluding the lower portion on which the flexible film 130 is disposed. However, it is not limited to this. In some non-limiting examples, the conductive layer 128 can be formed on all sides or surfaces of the display panel, only on three sides or surfaces of the display panel 120, only on two sides or surfaces of the display panel 120, or only on one side or surface of the display panel 120. Furthermore, the side or surface of the display panel 120 including the conductive layer 128 can be selected as any side or surface of the display panel 120.

[0070] Reference Figure 3 The display panel 120 includes a substrate 121, a buffer layer 122, a pixel unit 123 (which may also be referred to as pixel assembly 123 in the text), an encapsulation layer 124, an encapsulation substrate 125, a barrier film 126, and a polarizing plate 127.

[0071] The substrate 121 is a base component supporting various parts of the display panel 120 and may be constructed of or include an insulating material. The substrate 121 may be formed of a material that is flexible to allow the display panel 120 to be wound or unfolded, and may be formed, for example, of a plastic material such as polyimide (PI) or other similar materials that allow the display panel 120 to be wound or unfolded.

[0072] The buffer layer 122 can suppress the diffusion of moisture and / or oxygen that permeates from the outside of the substrate 121 through the display panel 120. The buffer layer 122 can be constructed as a single layer or a double layer of silicon oxide (SiOx) and silicon nitride (SiNx), but is not limited thereto.

[0073] Pixel unit 123 includes a plurality of organic light-emitting diodes (OLEDs) and a pixel driving circuit for driving the OLEDs. Pixel unit 123 may be a region corresponding to display area AA. The OLED may include an anode, an organic light-emitting layer, and a cathode.

[0074] The anode can provide holes to the organic light-emitting layer and is formed of a conductive material with a high work function. For example, the anode can be formed of tin oxide (TO), indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), etc., but is not limited to these.

[0075] The organic light-emitting layer emits light by receiving holes from the anode and electrons from the cathode. Depending on the color of the light emitted, the organic light-emitting layer can be formed as a red, green, blue, or white organic light-emitting layer. When the organic light-emitting layer is white, color filters of various colors can be additionally provided.

[0076] The cathode can provide electrons to the organic light-emitting layer and is formed of a conductive material with a low work function. For example, the cathode can be formed of any or more metals selected from the group consisting of, but not limited to, magnesium (Mg), silver (Ag), and aluminum (Al) and their alloys.

[0077] Depending on the direction of light emission from the organic light-emitting diode, the display panel 120 can be configured as either a top-emitting or bottom-emitting type.

[0078] According to the top-emitting type, light emitted from the organic light-emitting diode is emitted onto the substrate 121, forming the upper portion of the organic light-emitting diode. In the case of the top-emitting type, a reflective layer can be formed below the anode to allow light emitted from the organic light-emitting diode to travel to the upper portion of the substrate 121, i.e., towards the cathode.

[0079] According to the bottom-emitting type, light emitted from the organic light-emitting diode is emitted onto the substrate 121, forming the lower portion of the organic light-emitting diode. In the case of the bottom-emitting type, the anode can be formed only of a transparent conductive material, and the cathode can be formed of a metallic material with high reflectivity to allow light emitted from the organic light-emitting diode to travel to the lower portion of the substrate 121.

[0080] In the following description, for ease of description, the display device 100 according to the first exemplary embodiment of the present disclosure will be described by assuming that it is a bottom-emitting display device, but is not limited thereto.

[0081] A circuit for driving an organic light-emitting diode is provided in the pixel unit 123. This circuit can be formed by thin-film transistors, storage capacitors, gate lines, data lines, power lines, etc., but it can vary in various forms depending on the design of the display device 100.

[0082] An encapsulation layer 124 is disposed above the pixel unit 123, covering the pixel unit 123. The encapsulation layer 124 seals the organic light-emitting diode of the pixel unit 123. The encapsulation layer 124 can protect the organic light-emitting diode of the pixel unit 123 from external moisture, oxygen, impact, etc. The encapsulation layer 124 can be formed by alternately stacking multiple inorganic layers and multiple organic layers. For example, the inorganic layers can be formed of inorganic materials such as silicon nitride SiNx, silicon oxide SiOx, and aluminum oxide AlOx, and the organic layers can be formed of epoxy resin or acrylic polymer, but they are not limited to these.

[0083] An encapsulation substrate 125 is disposed above the encapsulation layer 124. The encapsulation substrate 125, together with the encapsulation layer 124, protects the organic light-emitting diode (OLED) of the pixel unit 123. The encapsulation substrate 125 protects the OLED of the pixel unit 123 from external moisture, oxygen, and impact. The encapsulation substrate 125 can be formed of a metallic material (e.g., aluminum (Al), nickel (Ni), chromium (Cr), and alloys of iron (Fe) and nickel) that has high corrosion resistance and is easily processed into foil or thin film form. Therefore, since the encapsulation substrate 125 is formed of a metallic material, it can be implemented as an ultrathin film and has high resistance to external impacts and scratches.

[0084] A first adhesive layer AD1 may be disposed between the encapsulation layer 124 and the encapsulation substrate 125. The first adhesive layer AD1 can bond the encapsulation layer 124 and the encapsulation substrate 125 together. The first adhesive layer AD1 is formed of a material with adhesive properties and may be a thermosetting or naturally curing adhesive. For example, the first adhesive layer AD1 may be formed of an optically transparent adhesive (OCA), a pressure-sensitive adhesive (PSA), etc., but is not limited thereto.

[0085] Simultaneously, the first adhesive layer AD1 can be configured to surround the encapsulation layer 124 and the pixel unit 123. That is, the pixel unit 123 can be sealed by the buffer layer 122 and the encapsulation layer 124, and the encapsulation layer 124 and the pixel unit 123 can be sealed by the buffer layer 122 and the first adhesive layer AD1. The first adhesive layer AD1, together with the encapsulation layer 124 and the encapsulation substrate 125, can protect the organic light-emitting diode of the pixel unit 123 from external moisture, oxygen, and impact. The first adhesive layer AD1 may also include an absorbent. The absorbent can be hygroscopic particles that absorb moisture and oxygen from the outside to minimize the penetration of moisture and oxygen into the pixel unit 123.

[0086] A barrier film 126 is disposed beneath the substrate 121. The barrier film 126 protects the display panel 120 from external impacts, moisture, heat, etc. The barrier film 126 may be constructed from a polymer resin with lightweight and shatter-resistant properties. For example, the barrier film 126 may be constructed from a cyclic olefin polymer (COP), but is not limited thereto, and may also be constructed from materials such as polyimide (PI), polycarbonate (PC), and polyethylene terephthalate (PET).

[0087] The conductive layer 128 can be placed between the substrate 121 and the barrier film 126.

[0088] The conductive layer 128 can be disposed on the substrate 121. Figure 4 Below this is to suppress edge aging in the edge area EA of the display panel 120.

[0089] The conductive layer 128 can be formed from the edge of the substrate 121 inward at a predetermined or selected distance on three surfaces, excluding the lower portion on which the flexible film 130 is disposed, but is not limited thereto. Referring below... Figures 4 to 8 The conductive layer 128 is described in more detail.

[0090] A polarizing plate 127 (which may also be referred to as polarizing plate 127 in this document) is disposed on the rear surface of the blocking film 126 or below the blocking film 126.

[0091] The polarizer 127 is configured to suppress the reflection of external light incident on the display device 100, making it visible. For example, the polarizer 127 includes a surface layer 127f, a first protective layer 127e, a polarizing layer 127d, a second protective layer 127c, a phase retardation layer 127b, and an adhesive layer 127a.

[0092] Surface layer 127f is disposed on the outermost part of polarizer 127 or facing the polarizer 127. Figure 3 The polarizer 127 is positioned on the side of the polarizer 127, indicating the viewing direction, to enhance the mechanical strength of the polarizer 127 and suppress glare and reflection, thereby improving the visibility of the display device 100. The surface layer 127f can be formed by a layer or film formed by surface treatment methods such as anti-glare AG, semi-glare SG, low-reflection LR, and anti-glare and low-reflection AGLR, but is not limited thereto.

[0093] An adhesive layer 127a is disposed at the uppermost or innermost side of the polarizer 127 furthest from the surface layer 127f to bond the polarizer 127 to the barrier film 126. The adhesive layer 127a may be formed of a pressure-sensitive adhesive (PSA), but is not limited thereto.

[0094] The phase retardation layer 127b can have a transmission axis of -45 degrees or +45 degrees relative to the angle at which external light is polarized by the polarization layer 127d. Therefore, external light incident on the phase retardation layer 127b is circularly polarized after passing through the phase retardation layer 127b.

[0095] The polarizing layer 127d can linearly polarize light incident from the outside of the display device 100. Therefore, the polarizing layer 127d can be formed of an oriented film of a polyvinyl alcohol (PVA)-based polymer film containing iodine or dichroic dyes, but is not limited thereto.

[0096] The first protective layer 127e and the second protective layer 127c can be disposed on both surfaces of the polarization layer 127d. The polarization layer 127d is formed of a moisture-absorbing polyvinyl alcohol-based material, such that the first protective layer 127e and the second protective layer 127c are disposed on both surfaces of the polarization layer 127d. Therefore, damage to the polarization layer 127d due to heat or moisture can be suppressed. The first protective layer 127e and the second protective layer 127c can be formed of a material without phase difference so as not to affect the polarization state of the polarization layer 127d. For example, the first protective layer 127e and the second protective layer 127c can be formed of a material such as triacetyl cellulose (TAC), but are not limited thereto.

[0097] A back cover 110 may be disposed above the encapsulation substrate 125. The back cover 110 is configured to contact the encapsulation substrate 125 of the display panel 120 to protect the display panel 120. To protect the display panel 120, the back cover 110 may be formed of a rigid material.

[0098] Meanwhile, the back cover 110 may include multiple openings 111.

[0099] Multiple openings 111 allow the back cover 110 to be flexible. The multiple openings 111 can be flexibly deformed and allow the back cover 110 to be wound around or unfolded from the roller together with the display panel 120.

[0100] The second adhesive layer AD2 can be disposed between the encapsulation substrate 125 and the back cover 110. The second adhesive layer AD2 can bond the encapsulation substrate 125 and the back cover 110 together. The second adhesive layer AD2 is formed of a material with adhesive properties and can be a thermosetting or naturally curing adhesive. For example, the second adhesive layer AD2 can be formed of an optically transparent adhesive (OCA), a pressure-sensitive adhesive (PSA), etc., but is not limited thereto.

[0101] Even in Figure 3The diagram shows that multiple openings 111 of the back cover 110 are not filled with the second adhesive layer AD2. The second adhesive layer AD2 may also fill some or all of the multiple openings 111. If the second adhesive layer AD2 fills the multiple openings 111 of the back cover 110, the contact area between the second adhesive layer AD2 and the back cover 110 is increased, thus preventing... Figure 3 The separation or separation phenomenon of layers or components shown in the figure.

[0102] This disclosure also relates to a flexible display device based on a polyimide substrate 121, wherein a conductive layer 128 is formed beneath the substrate 121 to counteract positive charges in the polyimide substrate 121 to improve edge aging. This will be described in more detail with reference to the accompanying drawings.

[0103] Figure 4 This is a plan view of a display panel according to a first exemplary embodiment of the present disclosure.

[0104] Figure 5A and Figure 5B yes Figure 4 A magnified view of region A.

[0105] Figure 6A and Figure 6B This is a cross-sectional view of a subpixel according to a first exemplary embodiment of the present disclosure.

[0106] Figure 7 It is along Figure 4 The cross-sectional view taken from line III-III'.

[0107] Figure 8 It is along Figure 4 A cross-sectional view taken from line IV-IV'.

[0108] Figure 5A A portion of a display panel according to a comparative embodiment excluding the conductive layer 128 of this disclosure is shown as an example, and Figure 5B A portion of a display panel 120, including the conductive layer 128 of the present disclosure, is shown as an example of a first exemplary embodiment.

[0109] Figure 6A A portion of a cross-section of a sub-pixel according to a comparative embodiment excluding the conductive layer 128 of this disclosure is shown as an example. Figure 6B A portion of a cross-section of a sub-pixel of a first exemplary embodiment of the conductive layer 128 including the present disclosure is shown as an example.

[0110] exist Figure 6A , Figure 6B , Figure 7 as well as Figure 8For ease of description, the blocking film 126 and / or polarizing plate 127 are not shown.

[0111] Even in Figure 6A and Figure 6B The diagram shows a first transistor T1, a second transistor T2, and a third transistor, but it is not limited to these. Furthermore, in... Figure 6A and Figure 6B For ease of description, only a portion of the second transistor T2 and the third transistor are shown in the diagram.

[0112] exist Figure 7 and Figure 8 For convenience, pixel unit 123 and various insulating layers are collectively referred to as pixel layer 129.

[0113] Reference Figure 4 According to a first exemplary embodiment of the present disclosure, the display panel 120 includes a display area AA and a non-display area NA.

[0114] Display area AA is the area in display panel 120 where images are displayed.

[0115] Within a display area AA, multiple sub-pixels constituting multiple pixels and circuitry for driving these sub-pixels can be configured. The multiple sub-pixels are the smallest unit constituting the display area AA, and display elements can be disposed within each of the multiple sub-pixels. Multiple sub-pixels can constitute a pixel. For example, an organic light-emitting diode (OLED) comprising an anode, an organic light-emitting layer, and a cathode can be disposed within each of the multiple sub-pixels, but is not limited thereto. Furthermore, the circuitry for driving the multiple sub-pixels can include driving elements, wiring, etc. For example, the circuitry can be constructed from thin-film transistors, storage capacitors, gate lines, data lines, etc., but is not limited thereto.

[0116] A portion of the edge of the display area AA can be defined as the edge area EA.

[0117] The edge region EA can have a width of 1 cm or more or less extending inward from the outermost edge of the display region AA adjacent to the non-display region NA, but is not limited to this. The width can vary depending on the pixel design, and a width of 1 cm can correspond to the width of approximately twelve sub-pixels.

[0118] The edge region EA corresponds to the edge of the display region AA.

[0119] The non-display area NA is the area where no image is displayed.

[0120] In the non-display area NA, various wiring, circuits, etc., are provided for driving the organic light-emitting diodes in the display area AA. For example, in the non-display area NA, link lines that transmit signals to multiple sub-pixels and circuits in the display area AA, or driver ICs such as gate driver ICs, data driver ICs, etc., may be provided, but are not limited to these.

[0121] The non-display area NA may include an onboard gate in panel (GIP) area in which a gate driver is disposed.

[0122] The non-display area NA can be adjacent to one or more side surfaces of the display area AA.

[0123] exist Figure 4 The image shows a rectangular display area AA surrounded by a non-display area NA as an example. However, the shape of the display area AA and the shape and arrangement of the non-display area NA adjacent to the display area AA are not limited to this example. Figure 4 Examples are shown below. The display area AA and the non-display area NA can have shapes suitable for the design of an electronic device including the display device 100. Therefore, exemplary shapes of the display area AA can include pentagons, hexagons, circles, ellipses, etc.

[0124] Each pixel in the display area AA may include pixel driving circuitry. Pixel driving circuitry may include one or more switching transistors and one or more driving transistors. Additionally, pixel driving circuitry may include one or more sensing transistors. Each pixel driving circuitry may be electrically connected to gate lines and data lines to communicate with gate drivers, data drivers, etc., located in the non-display area NA.

[0125] The gate driver and data driver can be implemented by thin-film transistors (TFTs) in the non-display area NA. This driver is called a GIP or on-board gate driver circuit. In addition, some components, such as the data driver IC, are mounted on a separate printed circuit board and coupled to connection interfaces (pads, bumps, pins, etc.) located in the non-display area NA by means of circuit films such as flexible printed circuit boards (FPCBs), chip-on-film (COF), or tape-on-carrier packages (TCPs).

[0126] The display device 100 may also include various additional components to generate various signals or drive pixels in the display area AA. Additional components for driving pixels may include inverter circuits, multiplexers, electrostatic discharge circuits, etc. The display device 100 may also include additional components associated with functions other than pixel driving functions. For example, the display device 100 may include additional components providing touch sensing functions, user authentication functions (e.g., fingerprint recognition), multi-level pressure sensing functions, haptic feedback functions, etc. The aforementioned additional components may be located in external circuitry connected to the non-display area NA and / or connection interfaces.

[0127] Meanwhile, the display device 100 according to the first exemplary embodiment of this disclosure applies a voltage to or through the conductive layer 128 formed under the substrate 121 of the display panel 120, such voltage being equal to the voltage applied to the gate electrode of the transistor in the display area AA. By doing so, edge aging can be improved.

[0128] In other words, the conductive layer 128 according to the first exemplary embodiment of this disclosure is formed under the substrate 121 to apply a voltage equal to the voltage applied to the gate electrode of the transistor in the display area AA. Therefore, the positive charge in the substrate 121 is canceled out to improve edge aging.

[0129] For example, the conductive layer 128 according to the first exemplary embodiment of the present disclosure may be formed from the edge of the substrate 121 inward at a predetermined distance on three surfaces other than the underside of the display panel 120 on which the flexible film 130 is disposed, but is not limited thereto.

[0130] The conductive layer 128 can be supplied with a low-potential power supply voltage from the flexible film 130 of the COF via power lines 153. This low-potential power supply voltage can be substantially equal to the gate low voltage. For this purpose, conductive electrodes 151 are disposed on the upper surface of the display panel 120 and electrically connected to the power lines 153. Furthermore, the conductive electrodes 151 can be electrically connected to the conductive layer 128 beneath the substrate 121 via connecting members 152 disposed on the side surface of the display panel 120. That is, the connecting members 152 extend from the side surface of the display panel 120 to the upper edge of the display panel 120 to electrically connect the side surface of the conductive layer 128 and the upper surface of the conductive electrodes 151.

[0131] The conductive electrode 151 and the connecting member 152 can be disposed between the flexible membrane 130.

[0132] The conductive electrode 151 may include, but is not limited to, any of the group consisting of metallic materials such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), palladium (Pd), magnesium (Mg), copper (Cu), and alloys thereof.

[0133] The conductive electrode 151 can have various shapes, including rectangular shapes.

[0134] For example, when the conductive electrode 151 has a rectangular shape, the size can be approximately 10 mm x 1.5 mm, but is not limited to this.

[0135] The connecting member 152 can be formed by applying silver (Ag), but is not limited to this. The resistance of each connecting member 152 can be 10kΩ or lower.

[0136] The connecting member 152 can be formed to cover the entire width of the conductive electrode 151.

[0137] For example, connecting members 152 can be formed between the flexible membranes 130 to have a width of 14.5 mm to 20 mm.

[0138] Specifically, in a display device 100 that uses polyimide as the substrate 121, edge aging of the display panel 120 becomes a problem. For example, a rollable display device 100 uses polyimide as the substrate 121 to ensure rollability.

[0139] Polyimides are essentially composed of solvents and solids, and after curing, mobile charges are generated due to chemical bonding. (See reference...) Figure 5A When an electric field is applied (driving) to the display panel 120, the moving charges of the polyimide move. In the display device 100, the presence of the light-shielding layer LS between the display area AA and the non-display area NA structurally creates a difference in the electric field. That is, referring to... Figure 6A When the display panel 120 is driven, a (+) electric field is continuously formed on the light-shielding layer LS below the first transistor T1, and polarized mobile charges are formed on the surface of the polyimide substrate 121 due to the electric field. (-) charges accumulate on the surface of the substrate 121 below the light-shielding layer LS, while in other areas, namely below the second transistor T2 and / or the third transistor, (+) charges accumulate relatively. In contrast, no light-shielding layer or only a small amount of light-shielding layer is provided in the GIP region of the non-display area NA, and (+) and (-) signals are applied alternately.

[0140] During initial and long-term operation, (-) charges move beneath the light-shielding layer LS, which has a strong electric field, while (+) charges are trapped in other areas. Compared to the edge area EA, the entire display panel 120 achieves an electrical equilibrium state through the strong electric field of the other display areas AA, preventing edge aging in the other display areas AA. For reference only, "other display areas AA" refers to a portion of the display areas AA excluding the edge area EA.

[0141] However, upon re-driving after driving is complete, the (+) charges trapped in the edge region EA are counteracted (neutralized) by the (-) charges generated again during re-driving, and the regenerated (+) charges move near the lower portion of the light-shielding layer LS. This causes a negative shift in the Vth of the second transistor T2 to identify aging caused by the brightness difference between the edge region EA and other display regions AA. In other words, due to the electric field difference generated during the driving of the display panel 120, the distribution of moving charges inside and outside the display region AA changes, causing the trapped (+) charges to result in a negative shift in the Vth of the second transistor T2. Therefore, edge aging occurs in the edge region EA where the charge imbalance is most significant.

[0142] Furthermore, the degree of aging increases when the display panel is repeatedly left to stand at room temperature for 24 hours after being driven at high temperatures and then redriven. A 10-hour continuous drive reduces the degree of aging, but aging may reappear when the display panel is redriven after a 24-hour period. Edge defects can occur not only during the initial drive but also during re-drive after prolonged periods of inactivity.

[0143] Therefore, based on the contents of this disclosure, and referring to Figure 5B as well as Figure 6B A conductive layer 128 is formed under the substrate 121 of the display panel 120 to apply a low potential power supply voltage to the conductive layer 128 to counteract the (+) charge trapped under the second transistor T2 and / or the third transistor.

[0144] For example, when -6V is applied to the second gate electrode GE2 of the third transistor and / or the second transistor T2, which serves as a switching transistor and / or a sensing transistor, and 8V is applied to the light-shielding layer LS, a low potential power supply voltage as a constant DC voltage can be applied to the conductive layer 128 below the substrate 121. For example, -6V, equal to the voltage applied to the second gate electrode GE2, can be applied to the conductive layer 128, but is not limited thereto.

[0145] In the bottom-emitting type, the conductive layer 128 can be constructed from a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), or doped amorphous silicon, but is not limited thereto. In this case, considering transmittance and electro-optic properties, the thickness of the conductive layer 128 can be formed to be relatively thin.

[0146] In contrast, in the case of the top-emitting type, the conductive layer 128 can be formed of an opaque conductive material.

[0147] The conductive layer 128 can be electrically connected to the connecting member 152 by means of a side contact.

[0148] Simultaneously, when the conductive layer 128 is formed on the entire lower portion of the substrate 121, an interruption occurs between the conductive layer 128 and the encapsulation substrate 125 or between the conductive layer 128 and a mechanical tool, resulting in leakage current in the conductive layer 128. Therefore, the conductive layer 128 of the first exemplary embodiment of this disclosure can, for example, be formed from the edge of the substrate 121 inward at a predetermined distance on three surfaces other than the lower surface of the display panel 120 that forms a side contact with the connecting member 152. For example, the conductive layer 128 can be formed from approximately 3 millimeters (mm) inward from the edge of the substrate 121, or between 2.5 mm and 3.5 mm, but is not limited thereto. For example, the distance between the outermost edge of the substrate 121 and the conductive layer can be more or less than 3 mm, such as less than 1, 1, 2, 4, 5, 6, or more millimeters. It is to be understood that the range of this distance includes all numbers between the stated integers. For example, the aforementioned range can include distances of 2.47 mm and 4.105 mm.

[0149] The encapsulation substrate 125 and the encapsulation layer 124 may be formed from 0.1 mm to 1.1 mm or more or less inward from the edge of the substrate 121, such that the conductive layer 128 may be formed further inward from the edge of the substrate 121 than the encapsulation substrate 125 and the encapsulation layer 124 (see [reference]). Figure 4 ).

[0150] Reference Figure 6B , Figure 7 as well as Figure 8 The display panel 120 according to the first exemplary embodiment of the present disclosure may include a substrate 121 on which thin film transistors T1 and T2 and an organic light-emitting diode 160 are disposed, an encapsulation substrate 125, a barrier film 126, etc.

[0151] The substrate 121 can be a glass or plastic substrate. When the substrate is a plastic substrate, a polyimide-based material or a polycarbonate-based material is used, which allows the substrate to be flexible. Specifically, polyimide can be used in high-temperature processes and can be coated, making polyimide frequently used in plastic substrates.

[0152] Buffer layer 122 is a functional layer that protects the transistor from impurities such as alkali ions, moisture, and / or oxygen leaking from the substrate 121 or its underlying layers. Buffer layer 122 may be constructed from a single layer of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof, but is not limited thereto. Buffer layer 122 may include multiple buffer layers and / or active buffer layers. Multiple buffer layers may be constructed by alternating layers of silicon oxide (SiOx) and silicon nitride (SiNx) and perform the function of delaying the diffusion of moisture and / or oxygen into the substrate 121. Active buffer layers perform the function of protecting the active layers ACT1, ACT2, and ACT3 of transistors T1 and T2 and blocking various types of defects entering from the substrate 121.

[0153] Pixel unit 123 includes an organic light-emitting diode 160 and a pixel driving circuit for driving the organic light-emitting diode 160. Pixel unit 123 may be a region corresponding to display area AA.

[0154] The organic light-emitting diode 160 includes an anode 161, an organic layer 162, and a cathode 163.

[0155] At least one first transistor T1, a second transistor T2, and a third transistor may be disposed on the buffer layer 122. The first transistor T1 may be a driving transistor, the second transistor T2 may be a sensing transistor, and the third transistor may be a switching transistor, but is not limited thereto.

[0156] The first transistor T1 includes a first active layer ACT1, a first gate electrode GE1, a first source electrode SE1, and a first drain electrode DE1.

[0157] The second transistor T2 includes a second active layer ACT2, a second gate electrode GE2, a second source electrode SE2, and a second drain electrode.

[0158] The third transistor may include a third active layer ACT3, a third gate electrode, a third source electrode, and a third drain electrode.

[0159] The light-shielding layer LS can be set on the buffer layer 122.

[0160] The light-shielding layer LS is configured to overlap with the first active layer ACT1 of the first transistor T1 to protect the first transistor T1 from externally introduced light or moisture, thereby minimizing the deformation of the device characteristics of the first transistor T1. Even when Figure 6B The diagram shows that the light-shielding layer LS is electrically connected to the first drain electrode DE1. The light-shielding layer LS can also be floated, so that it is not limited to this.

[0161] A first insulating layer 115a can be provided on the light-shielding layer LS.

[0162] The first insulating layer 115a can be configured as a single layer or multiple layers of silicon nitride SiNx or silicon oxide SiOx.

[0163] The first active layer ACT1, the second active layer ACT2, and the third active layer ACT3 can be disposed on the first insulating layer 115a. The first active layer ACT1, the second active layer ACT2, and the third active layer ACT3 can be formed of an oxide semiconductor material.

[0164] However, it is not limited to this, so that the first active layer ACT1, the second active layer ACT2 and the third active layer ACT3 can be formed of amorphous silicon a-Si or various organic semiconductor materials such as pentacene.

[0165] A gate insulating layer 115b is provided on the first active layer ACT1 and the second active layer ACT2, and a first gate electrode GE1 and a second gate electrode GE2 can be provided on the gate insulating layer 115b.

[0166] The gate insulating layer 115b can be configured as a single layer or multiple layers of silicon nitride (SiNx) or silicon oxide (SiOx).

[0167] The first gate electrode GE1 and the second gate electrode GE2 can be formed of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof, but are not limited thereto.

[0168] A second insulating layer 115c can be provided on the first gate electrode GE1 and the second gate electrode GE2.

[0169] The second insulating layer 115c is an interlayer insulating layer and may be formed of an insulating inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx) or an insulating organic material. The second insulating layer 115c and / or the first insulating layer 115a are selectively removed to form a contact hole through which the light-shielding layer LS, the second gate electrode GE2, and the source and drain regions of the first active layer ACT1 are exposed.

[0170] A first source electrode SE1 and a first drain electrode DE1 can be disposed on the second insulating layer 115c. The first source electrode SE1 and the first drain electrode DE1, which are disposed spaced apart from each other, can be electrically connected to the first active layer ACT1. In addition, the first drain electrode DE1 can also be electrically connected to the light-shielding layer LS.

[0171] A second source electrode SE2 can be disposed on the second insulating layer 115c. The second source electrode SE2 can be electrically connected to the second gate electrode GE2 and the third active layer ACT3.

[0172] A third insulating layer 115d can be provided on the first source electrode SE1, the first drain electrode DE1, and the second source electrode SE2.

[0173] The third insulating layer 115d is a planarization layer that protects transistors T1 and T2 and planarizes their upper portions. The third insulating layer 115d can be constructed in various forms, such that it can be formed using organic insulating layers such as benzocyclobutene (BCB) or acrylic, or inorganic insulating layers such as silicon oxide (SiOx) or silicon nitride (SiNx), or it can be formed as a single layer, double layer, or multiple layers.

[0174] An organic light-emitting diode 160 can be disposed on the third insulating layer 115d.

[0175] The organic light-emitting diode 160 includes an anode 161, an organic layer 162 formed on the anode 161, and a cathode 163 formed on the organic layer 162.

[0176] The organic light-emitting diode 160 can be configured with a single light-emitting layer structure that emits a single type of light, or it can be configured with a structure consisting of multiple light-emitting layers to emit white light. A color filter can also be provided when the organic light-emitting diode 160 emits white light. The organic light-emitting diode 160 can be disposed in the center of the substrate 121 corresponding to the display area AA.

[0177] The anode 161 can be disposed on the third insulating layer 115d. The anode 161 can be electrically connected to the first drain electrode DE1 of the first transistor T1 via a contact hole.

[0178] The anode 161 provides holes to the light-emitting layer, allowing the anode to be formed of a conductive material with a high work function. For example, the anode 161 can be formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

[0179] As described above, the display device 100 can be implemented as either a top-emitting or bottom-emitting type. When the display device is a top-emitting type, a reflective layer formed of a metallic material with excellent reflectivity, such as aluminum (Al) or silver (Ag), can be added below the anode 161. Therefore, light emitted from the light-emitting layer is reflected from the anode 161 and directed upwards, i.e., to the cathode 163. In contrast, when the display device 100 is a bottom-emitting type, the anode 161 can be formed solely of a transparent conductive material.

[0180] The organic layer 162 can be disposed between the anode 161 and the cathode 163.

[0181] The organic layer 162 is a region that emits light through the coupling of electrons and holes supplied from the anode 161 and the cathode 163.

[0182] Meanwhile, various organic light-emitting diode (OLED) structures were proposed to improve the efficiency and lifespan of OLEDs and reduce power consumption, thereby improving the quality and productivity of organic light-emitting display devices.

[0183] Therefore, an organic light-emitting diode (OLED) with a series structure using multiple stacks, i.e., multiple electroluminescent units, is proposed to achieve improved efficiency and lifetime characteristics, as well as an OLED using a single stack, i.e., a single electroluminescent unit (EL unit). However, this disclosure is not limited to the series structure. In the following description, the series structure will be described as an example for ease of description.

[0184] In an organic light-emitting diode (OLED) with a dual-stacked structure, i.e., using a first electroluminescent unit and a second electroluminescent unit in series, an emitting region that emits light through the recombination of electrons and holes is disposed in each of the first and second electroluminescent units. Therefore, compared to an OLED with a single-stacked structure, light emitted from the first emitting layer of the first electroluminescent unit and the second emitting layer of the second electroluminescent unit causes constructive interference to provide high brightness.

[0185] The stacked structure may include, for example, a charge-generating layer disposed between an anode 161 and a cathode 163, a first stack disposed between the charge-generating layer and the anode 161, and a second stack disposed between the cathode 163 and the charge-generating layer. The charge-generating layer is disposed between the first stack and the second stack to generate charge. The charge-generating layer may be formed using a structure of stacked p-type charge-generating layers and n-type charge-generating layers. That is, the charge-generating layer may be constructed from p-type charge-generating layers and n-type charge-generating layers that generate positive and negative charges in two directions and essentially serve as electrodes.

[0186] Each of the first stack and the second stack may include at least one light-emitting layer and includes a common layer in its upper and lower portions, with each light-emitting layer located therebetween.

[0187] A dam 115e may be provided above the anode 161 and the third insulating layer 115d.

[0188] Dike 115e is an insulating layer disposed between multiple sub-pixels to divide the multiple sub-pixels.

[0189] The dam 115e may include an opening that exposes a portion of the anode 161. The dam 115e may be an organic insulating material configured to cover the edge or boundary of the anode 161. For example, the dam 115e may be formed of polyimide resin, acrylic resin, or benzocyclobutene (BCB) resin, but is not limited thereto.

[0190] An organic layer 162 may be disposed on the anode 161. The organic layer 162 may include an emissive layer disposed in each of the plurality of sub-pixels and a common layer disposed together in the plurality of sub-pixels. The emissive layer is an organic layer that emits light of a specific color, and different emissive layers are disposed in the first sub-pixel, the second sub-pixel, and the third sub-pixel, respectively. However, this disclosure is not limited thereto, such that multiple emissive layers are disposed in all sub-pixels to emit white light.

[0191] A common layer is an organic layer that is configured to improve the luminous efficiency of the light-emitting layer. The common layer can be formed as a single layer above multiple sub-pixels. That is, the common layers of multiple sub-pixels are interconnected to form a single unit. The common layer may include, but is not limited to, hole injection layers, hole transport layers, electron transport layers, electron injection layers, charge generation layers, etc.

[0192] A cathode 163 is disposed on the organic layer 162.

[0193] The cathode 163 is the electrode that provides electrons to the organic light-emitting diode 160.

[0194] The cathode 163 is formed of a material having a low work function. The cathode 163 may include a transparent conductive material. For example, the cathode 163 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. Alternatively, the cathode 163 may include any one of the group consisting of metallic materials such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), and alloys thereof. For example, the cathode 163 may be formed of an alloy of magnesium (Mg) and silver (Ag). Alternatively, the cathode 163 may be constructed by stacking layers formed of a transparent conductive material such as ITO, IZO, or IGZO and layers formed of metallic materials such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), or alloys thereof, but is not limited thereto.

[0195] Cathode 163 is electrically connected to a low-potential power line to be supplied with a low-potential power supply voltage.

[0196] An encapsulation layer 124 can be disposed on the cathode 163. The encapsulation layer 124 can be disposed above the embankment 115e and the organic light-emitting diode 160. The encapsulation layer 124 can prevent oxygen and moisture from penetrating into the display device 100 from the outside. For example, when the display device 100 is exposed to moisture or oxygen, pixel shrinkage (emitting area shrinkage) or dead pixels may occur in the emitting area. The encapsulation layer 124 blocks oxygen and moisture to protect the display device 100.

[0197] The encapsulation layer 124 may include a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer.

[0198] The first encapsulation layer is disposed on the cathode 163 and can suppress the permeation of moisture or oxygen. The first encapsulation layer may be formed of an inorganic material such as silicon nitride (SiNx), silicon oxide nitride (SiNxOy), or aluminum oxide (AlyOz), but is not limited thereto.

[0199] A second encapsulation layer is disposed on the first encapsulation layer to planarize the surface. Furthermore, the second encapsulation layer can cover foreign matter or particles that may be generated during the manufacturing process of the display device. The second encapsulation layer can be formed of organic materials such as silicon oxide carbon (SiOxCz), acrylic resin, or epoxy resin, but is not limited thereto.

[0200] The third encapsulation layer is disposed on the second encapsulation layer and can inhibit the penetration of moisture or oxygen, just like the first encapsulation layer. The third encapsulation layer can be formed of inorganic materials such as silicon nitride (SiNx), silicon oxide nitride (SiNxOy), silicon oxide (SiOx), or aluminum oxide (AlyOz), but is not limited to these.

[0201] A packaging substrate 125 is disposed on the packaging layer 124.

[0202] The encapsulation substrate 125, together with the encapsulation layer 124, protects the organic light-emitting diode 160. The encapsulation substrate 125 protects the organic light-emitting diode 160 of the pixel unit 123 from external moisture, oxygen, and impact. The encapsulation substrate 125 can be formed of a metallic material with high corrosion resistance and easy processing into foil or thin film form, such as aluminum (Al), nickel (Ni), chromium (Cr), and alloys of iron (Fe) and nickel. Therefore, since the encapsulation substrate 125 is formed of a metallic material, it can be implemented as an ultrathin film and has high resistance to external impacts and scratches, but is not limited thereto.

[0203] Meanwhile, as described above, the conductive layer 128 can be disposed under the substrate 121 to suppress edge aging in the edge region EA of the display panel 120.

[0204] The conductive layer 128 can be formed from the edge of the substrate 121 inward at a predetermined distance on three surfaces of the display panel 120, excluding the underside of the display panel 120 on which the flexible film 130 is disposed, but is not limited thereto. That is, referring to... Figure 7 A conductive layer 128 is formed on the display panel 120 on the underside where the flexible film 130 is disposed, to match the edge of the substrate 121. In other words, in some embodiments, the conductive layer 128 may extend to the edge of the substrate 121 on the underside of the display panel 120 corresponding to the flexible film 130. Furthermore, referring to… Figure 8On the three surfaces of the display panel 120 other than the bottom side (i.e., the upper part and two side parts of the display panel 120), a conductive layer 128 is formed from the edge of the substrate 121 inward at a predetermined distance.

[0205] For example, the conductive layer 128 can be formed 3 mm inward from the edge of the substrate 121, but is not limited thereto. For example, the encapsulation substrate 125 and the encapsulation layer 124 can be formed 0.1 mm to 1.1 mm inward from the edge of the substrate 121, such that the conductive layer 128 can be formed further inward from the edge of the substrate 121 than the encapsulation substrate 125 and the encapsulation layer 124.

[0206] The conductive layer 128 can have various shapes, including rectangular.

[0207] As described above, the conductive layer 128 can be supplied with a low potential power supply voltage from the flexible film 130 of the COF via the power lines 153. That is, the conductive electrode 151 electrically connected to the power lines 153 is disposed on the upper surface of the display panel 120 and electrically connected to the power lines 153 via the connecting member 152 disposed on the side surface of the display panel 120.

[0208] The connecting member 152 extends from the side surface of the display panel 120 to the upper edge of the display panel 120 to electrically connect the side surface of the conductive layer 128 at the edge of the substrate 121 and the upper surface of the conductive electrode 151.

[0209] The connecting member 152 can be formed by dotting silver Ag, but is not limited thereto.

[0210] The connecting member 152 may be formed to cover the entire width of the conductive electrode 151. In some embodiments, the connecting member 152 covers only a portion of the width of the conductive electrode 151.

[0211] Simultaneously, a sealing layer 155 can be formed above the conductive electrode 151 to suppress moisture penetration and minimize defects during subsequent processes. The sealing layer 155 can be constructed using microseismic techniques, but is not limited to this.

[0212] The sealing layer 155 can be configured to cover one end of the conductive electrode 151.

[0213] The sealing layer 155 can be configured to surround the display area AA in the non-display area NA, and is also configured to surround the encapsulation layer 124 and the encapsulation substrate 125.

[0214] The connecting member 152 may be formed on the sealing layer 155 and also formed to cover the other end of the conductive electrode 151 that is not covered by the sealing layer 155 and one end of the sealing layer 155.

[0215] The connecting member 152 may be formed only to a predetermined height of the barrier membrane 126.

[0216] The connecting member 152 may be formed below the sealing layer 155.

[0217] Meanwhile, a thin glass substrate can be added below the polyimide substrate as a support substrate to suppress moisture penetration, which will be described in more detail with reference to the second exemplary embodiment of this disclosure below.

[0218] Figure 9 This is a plan view of a display panel according to a second exemplary embodiment of the present disclosure.

[0219] Figure 10A It is along Figure 9 The cross-sectional view taken by line VIII-VIII'.

[0220] Figure 10B It is along Figure 9 The cross-sectional view taken by line IX-IX'.

[0221] and Figure 4 Compared to the display panel 120, only based on Figure 9 The support substrate 270 of the display panel 220 in the second exemplary embodiment of this disclosure has a different configuration, while other configurations are substantially the same, so further description will be omitted. The same configurations will be indicated by the same reference numerals.

[0222] exist Figure 10A and Figure 10B In this context, for convenience, pixel unit 123 and various insulating layers are collectively referred to as pixel layer 129 and polarizing plate 127 is not shown.

[0223] Reference Figure 9 , Figure 10A as well as Figure 10B The display panel 220 according to the second exemplary embodiment of the present disclosure may include a display area AA and a non-display area NA.

[0224] A portion of the edge of the display area AA can be defined as the edge area EA.

[0225] According to a second exemplary embodiment, similar to the first exemplary embodiment described above, a conductive layer 128 is formed beneath the polyimide substrate 121 to apply a voltage equal to the voltage applied to the gate electrode of the transistor in the display area AA, such as a low-potential power supply voltage. This improves edge aging.

[0226] For example, in a second exemplary embodiment of this disclosure, the conductive layer 128 may be formed from the edge of the substrate 121 inward at a predetermined distance on three surfaces other than the underside of the display panel 220 that contacts the side of the connecting member 152.

[0227] The conductive layer 128 can be supplied with a low potential voltage from the flexible film 130 of the COF by means of the electric field lines 153.

[0228] The conductive layer 128 can be electrically connected to the connecting member 152 by means of a side contact.

[0229] The connecting member 152 extends from the side surface of the display panel 220 to the upper edge of the display panel 220 to electrically connect the side surface of the conductive layer 128 and the upper surface of the conductive electrode 151.

[0230] The connecting member 152 can be formed by dotting silver Ag, but is not limited thereto.

[0231] The connecting member 152 can be formed to cover the entire width of the conductive electrode 151.

[0232] Meanwhile, a sealing layer 155 can be formed above the conductive electrode 151 to suppress moisture penetration and minimize defects during subsequent processes.

[0233] The sealing layer 155 can be configured to cover one end of the conductive electrode 151.

[0234] The sealing layer 155 can be configured to surround the display area AA in the non-display area NA, and is also configured to surround the encapsulation layer 124 and the encapsulation substrate 125.

[0235] The connecting member 152 may be formed on the sealing layer 155 and also formed to cover the other end of the conductive electrode 151 that is not covered by the sealing layer 155 and one end of the sealing layer 155.

[0236] The connecting member 152 may be formed below the sealing layer 155.

[0237] The support substrate 270 can be disposed below the conductive layer 128.

[0238] The support substrate 270 can be configured to suppress moisture penetration and support the substrate 121.

[0239] The support substrate 270 may be made of glass, but is not limited to this.

[0240] When glass is used as the support substrate 270, its thickness is partially etched to suit the flexible display device. That is, after glass with a first thickness is disposed below the conductive layer 128, a predetermined thickness is etched to form the support substrate 270 with a second thickness.

[0241] For example, the first thickness T1 of the support substrate 270 at the edge of the support substrate 270 may be 0.7T and the second thickness T2 of the support substrate 270 from the edge of the support substrate 270 inward may be 0.08T, but is not limited thereto.

[0242] The support substrate 270 can be located on the underside of the display panel 220 where the flexible film 130 is disposed, i.e., within the pad unit, and has its original thickness. Therefore, the support substrate 270 can be constructed from a first support substrate 270a having a first thickness T1 and a second support substrate 270b having a second thickness T2.

[0243] The first support substrate 270a is not etched so that its width is the original width and the package substrate 125 is located inside the first support substrate 270a. In other words, the package substrate 125 extends to be disposed on at least a portion of the first support substrate 270a.

[0244] In contrast, the second support substrate 270b is also etched in the width direction, so that the second support substrate 270b is positioned inward from the outer edge of the package substrate 125.

[0245] The first support substrate 270a is formed to match the edge of the substrate 121, and the second support substrate 270b can be formed from the edge of the substrate 121 inward at a predetermined distance (such as 1 mm to 10 mm or any distance more or less).

[0246] The conductive layer 128 above the first support substrate 270a matches the edge of the substrate 121 below the display panel 220, and can be formed inward from the edge of the substrate 121 on the two side surfaces of the display panel 220.

[0247] Furthermore, the conductive layer 128 above the second support substrate 270b can be formed from the edge of the substrate 121 inward at a predetermined distance on three surfaces of the display panel 220, excluding the lower side.

[0248] The connecting member 152 may be formed only to a predetermined height of the support substrate 270.

[0249] Additionally, the conductive layer of this disclosure may be located only below the switching transistor and / or sensing transistor, as will be described in detail with reference to the third exemplary embodiment of this disclosure below.

[0250] Figure 11 This is a plan view of a display panel according to a third exemplary embodiment of the present disclosure.

[0251] and Figure 9 Compared to the display panel 220, only based on Figure 11The configuration of the conductive layer 328 of the display panel 320 in the third exemplary embodiment of this disclosure differs, while other configurations are substantially the same; therefore, redundant descriptions will be omitted. Identical configurations will be indicated by the same reference numerals.

[0252] Reference Figure 11 The display panel 320 according to the third exemplary embodiment of the present disclosure may include a display area AA and a non-display area NA.

[0253] A portion of the edge of the display area AA can be defined as the edge area EA.

[0254] According to a third exemplary embodiment of this disclosure, similar to the first and second exemplary embodiments described above, a conductive layer 328 is formed beneath the polyimide substrate 121 to apply a voltage equal to the voltage applied to the gate electrode of the transistor in the display area AA, such as a low-potential power supply voltage. This improves edge aging.

[0255] The conductive layer 328 of the third exemplary embodiment of this disclosure may be constructed from a first conductive layer 328a formed below the display panel 320 to form side contact with the connecting member 152 and a plurality of second conductive layers 328b extending vertically from the first conductive layer 328a. However, it is not limited thereto.

[0256] The second conductive layer 328b can be disposed below the substrate 121, below the switching transistor and / or the sensing transistor T2. The second conductive layer 328b can be configured to sufficiently block the switching transistor and / or the sensing transistor T2. For example, when the switching transistor and / or the sensing transistor T2 is configured to be vertically parallel to the display panel 320, the second conductive layer 328b is also configured to be vertically parallel.

[0257] The first conductive layer 328a can be supplied with a low potential voltage from the flexible film 130 by means of the electric field line 153.

[0258] The first conductive layer 328a can be electrically connected to the connecting member 152 by means of a side contact.

[0259] The connecting member 152 extends from the side surface of the display panel 320 to the upper edge of the display panel 320 to electrically connect the side surface of the first conductive layer 328a and the upper surface of the conductive electrode 151.

[0260] The connecting member 152 can be formed by dotting silver Ag, but is not limited thereto.

[0261] The connecting member 152 can be formed to cover the entire width of the conductive electrode 151.

[0262] The support substrate 270 is disposed below the conductive layer 328.

[0263] The support substrate 270 may be made of glass, but is not limited to this.

[0264] When glass is used as the support substrate 270, its thickness is partially etched to suit the flexible display device.

[0265] The support substrate 270 can be located on the underside of the display panel 320 where the flexible film 130 is disposed, i.e., within the pad unit, and has its original thickness. Therefore, the support substrate 270 can be constructed from a first support substrate 270a having a first thickness and a second support substrate 270b having a second thickness.

[0266] The first support substrate 270a is not etched so that its width is the original width and the encapsulation substrate 125 is located inside the first support substrate 270a.

[0267] In contrast, the second support substrate 270b is also etched in the width direction, so that the second support substrate 270b is positioned inward from the packaging substrate 125.

[0268] The first support substrate 270a is formed to match the edge of the substrate 121, and the second support substrate 270b can be formed from the edge of the substrate 121 inward at a predetermined distance.

[0269] At this time, the first conductive layer 328a above the first support substrate 270a matches the edge of the substrate 121 below the display panel 320, and can be formed inward from the edge of the substrate 121 on the two side surfaces of the display panel 320.

[0270] Furthermore, the second conductive layer 328b above the second support substrate 270b can be formed on three surfaces of the display panel 320, excluding the lower side, in the display area AA of the display panel 320.

[0271] Figures 12A to 12C It is a graph showing the degree of edge aging according to the driving time.

[0272] Figures 12A to 12C This shows the degree of edge aging relative to driving at high temperature for 1000 hours.

[0273] Figure 12A The results of comparing the display devices of the embodiments are shown. Figure 12B The results of Experiment Example 1 with the conductive layer grounded are shown, and Figure 12C The results of Experiment Example 2, in which a low-potential power supply voltage was applied to the conductive layer, are shown.

[0274] exist Figures 12A to 12CIn the diagram, line 32G shows the measurement results for 32 gray levels as an example, and line 64G shows the measurement results for 64 gray levels.

[0275] Reference Figure 12A According to the comparative embodiment, the (-) charges in the edge region flow in the display area due to the strong electric field in the display area with a high density of the light-shielding layer, and the remaining (+) charges are trapped due to electric field stress. Therefore, the edge aging degree is relatively high, and it should be understood that the edge aging degree increases to 4 to 5 with increasing driving time.

[0276] In comparison, refer to Figure 12B In Experimental Example 1, due to the small charge and the reduced potential difference beneath the switching transistor and / or sensing transistor, the electric field stress decreased, resulting in a reduction in trapped (+) charge. Therefore, the edge aging degree was relatively low, and it should be understood that the edge aging degree remained between 1 and 2 as the driving time increased.

[0277] Reference Figure 12C In Experimental Example 2, since there is almost no charge and no potential difference beneath the switching transistor and / or sensing transistor, there is no electric field stress, resulting in almost no trapping of (+) charge. Therefore, the edge aging degree is relatively low, and it should be understood that the edge aging degree remains between 0 and 1 as the driving time increases.

[0278] Figures 13A to 13C This is a graph showing the results of measuring edge aging based on the driving time.

[0279] Figure 13A The degree of edge aging is shown relative to the driving time, and Figure 13B The deviation of the threshold voltage Vth between the edge region and other regions based on the driving time is shown. Furthermore, Figure 13C The width of the edge region is shown, and edge aging is shown within the edge region based on the driving time.

[0280] Figures 13A to 13C The results of comparative embodiments, experimental example 1 in which the conductive layer is grounded, and experimental example 2 in which a low potential power supply voltage is applied to the conductive layer are shown.

[0281] Figures 13A to 13C An example of measurement results at 32 gray levels is shown.

[0282] Reference Figure 13A It should be understood that, as described above, compared to the comparative implementation, the degree of edge aging in Experimental Example 1 is relatively low, and the degree of edge aging remains between 0 and 1 as the driving time increases. Furthermore, it should be understood that in Experimental Example 1, the degree of edge aging remains 0 regardless of the driving time.

[0283] Reference Figure 13B It should be understood that in the comparative implementation, the deviation of the threshold voltage Vth between the edge region and other regions is 0.4V to 1V, but in Experimental Example 1, the deviation is reduced to 0V to 0.5V. Furthermore, it should be understood that in Experimental Example 2, regardless of the driving time, there is no deviation of the threshold voltage Vth between the edge region and other regions.

[0284] Reference Figure 13C It should be understood that in the comparative embodiment, the width of the edge region where edge aging occurs is 2 mm to 8 mm, but in Experimental Example 1, the width of the edge region is reduced to 0 mm to 3 mm. Furthermore, it should be understood that in Experimental Example 2, there is no edge aging regardless of the driving time, therefore the width of the edge region where edge aging occurs is 0 mm.

[0285] Figure 14 This is a table showing the evaluation results during the initial drive.

[0286] Reference Figure 14 In the comparative implementation, as the drive time increases from 0 to 1 hour, the deviation ΔVth of the threshold voltage Vth increases from 0.2V to 0.5V and the edge aging degree is 1 during the one-hour drive time, so it should be understood that a defect is generated.

[0287] In contrast, in Experimental Example 1, it should be understood that as the drive time increased from 0 to 30 minutes, the deviation of the threshold voltage Vth did not change at 0V, and there was no edge aging during the 30-minute drive time.

[0288] In Experiment 2, it should be understood that as the drive time increases from 0 to 30 minutes, the deviation of the threshold voltage Vth does not change at 0V, and there is no edge aging during the 30-minute drive time.

[0289] Exemplary embodiments of this disclosure can also be described as follows:

[0290] According to one aspect of this disclosure, a display device is provided. The display device includes: a display panel divided into a display area and a non-display area and including a substrate; a transistor disposed above the substrate and disposed in the display area; a flexible film disposed on a side surface of the non-display area and connected to the substrate; and a conductive layer disposed below the substrate and subjected to a low-potential power supply voltage from the flexible film.

[0291] The display device may also include a barrier film disposed beneath the conductive layer.

[0292] The display device may also include a support substrate disposed beneath the conductive layer.

[0293] The conductive layer can be formed from the edge of the substrate inward on the remaining side surfaces except for one side surface of the non-display area.

[0294] The display device may also include an encapsulation substrate disposed above a substrate, wherein a conductive layer may be formed from the edge of the encapsulation substrate inward.

[0295] The substrate can be constructed of polyimide and the supporting substrate can be constructed of glass.

[0296] The support substrate may include a first support substrate that is configured to face one side surface of the non-display area and has a first thickness, and a second support substrate that is configured to face the other side surfaces of the non-display area and has a second thickness less than the first thickness.

[0297] The side surface of the first support substrate can match the edge of the substrate, and the side surface of the encapsulation substrate can be positioned inward from the first support substrate.

[0298] The side surface of the second support substrate can be positioned inward from the packaging substrate.

[0299] The side surface of the conductive layer above the first support substrate can match the edge of the substrate on one side surface of the non-display area, and the conductive layer can be formed from the edge of the substrate inward on the two side surfaces that are in contact with the one side surface.

[0300] The conductive layer above the second support substrate can be formed from the edge of the substrate inward on the other side surface of the non-display area.

[0301] The conductive layer can be applied with a voltage equal to the voltage applied to the gate electrode of the transistor.

[0302] The display device may further include: power lines disposed on the upper surface of the display panel and connected to a flexible film to which a low potential power supply voltage is applied; conductive electrodes disposed between the flexible films on the upper surface of the display panel and connected to the power lines; and connecting members disposed from the side surface of the display panel to the upper surface to cover the upper surface of the conductive electrodes.

[0303] The connecting member can be electrically connected to the side surface of the conductive layer and the top surface of the conductive electrode.

[0304] The conductive layer may include a first conductive layer disposed on a side surface of a non-display area to contact the side of the connecting member, and a plurality of second conductive layers separated from the first conductive layer and extending vertically.

[0305] The second conductive layer can be disposed below the substrate, below the switching transistor and / or sensing transistor in the transistor.

[0306] The first conductive layer can be supplied with a low-potential power supply voltage from the flexible film via electric field lines.

[0307] The connecting member can be disposed from the side surface of the display panel to the upper edge of the display panel to be electrically connected to the side surface of the first conductive layer and the upper surface of the conductive electrode.

[0308] The conductive layer can be formed from a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO) or zinc oxide (ZnO) or doped amorphous silicon.

[0309] The display device may also include a back cover disposed above the display panel and rollers connected to the back cover to wind or unwind the back cover and the display panel.

[0310] A display device includes: a display panel divided into a display area and a non-display area and including a substrate; a transistor disposed above the substrate and disposed in the display area; a flexible film disposed on a side surface of the non-display area and connected to the substrate; a conductive layer disposed below the substrate and subjected to a low-potential power supply voltage; and a connecting member disposed on a side surface of the display panel, wherein the conductive layer includes: a first conductive layer formed below the display panel to form a side contact with the connecting member; and a plurality of second conductive layers, the plurality of second conductive layers being separate from the first conductive layer and extending vertically.

[0311] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are exemplary in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within their equivalents should be understood to fall within the scope of the present disclosure.

Claims

1. A display device, comprising: The display panel is divided into a display area and a non-display area and includes a substrate; A transistor is disposed above the substrate and in the display area; A flexible film is disposed on the side surface of the non-display area and connected to the substrate; A connecting member is disposed from the outermost side surface of the display panel to the upper surface of the display panel and is electrically connected to the flexible film; as well as A conductive layer is disposed beneath the substrate and electrically connected to the connecting member. The connecting member is configured to distribute a low-potential power supply voltage from the flexible membrane to the conductive layer.

2. The display device according to claim 1, further comprising: A barrier film is disposed beneath the conductive layer.

3. The display device according to claim 1, further comprising: A support substrate is disposed below the conductive layer.

4. The display device according to claim 3, wherein, The conductive layer is formed from the edge of the substrate inward on the remaining side surfaces other than one side surface of the non-display area.

5. The display device according to claim 4, further comprising: A packaging substrate, which is disposed above the substrate. The conductive layer is formed from the edge of the packaging substrate inward.

6. The display device according to claim 5, wherein, The substrate is made of polyimide, and the supporting substrate is made of glass.

7. The display device according to claim 6, wherein, The supporting substrate includes: A first support substrate, which is configured to face a side surface of the non-display area and has a first thickness; and The second support substrate is configured to be opposite to the other side surface of the non-display area and has a second thickness that is less than the first thickness.

8. The display device according to claim 7, wherein, The side surface of the first support substrate matches the edge of the substrate, and the side surface of the encapsulation substrate is positioned inward from the first support substrate.

9. The display device according to claim 7, wherein, The side surface of the second support substrate is positioned inward from the encapsulation substrate.

10. The display device according to claim 7, wherein, The side surface of the conductive layer above the first support substrate matches the edge of the substrate on one side surface of the non-display area, and the conductive layer is formed inward from the edge of the substrate on two side surfaces that are in contact with the one side surface.

11. The display device according to claim 7, wherein, The conductive layer above the second support substrate is formed inward from the edge of the substrate on the other side surface of the non-display area.

12. The display device according to claim 1, wherein, The conductive layer is subjected to a voltage equal to the voltage applied to the gate electrode of the transistor.

13. The display device according to claim 1, further comprising: Power lines are disposed on the upper surface of the display panel and connected to the flexible film to be applied with a low potential power supply voltage. Conductive electrodes are disposed between the flexible films on the upper surface of the display panel and connected to the power lines. The connecting member is disposed from the outermost side surface of the display panel to the upper surface to cover the upper surface of the conductive electrode.

14. The display device according to claim 13, wherein, The connecting member is electrically connected to the side surface of the conductive layer and the upper surface of the conductive electrode.

15. The display device according to claim 13, wherein, The conductive layer includes: A first conductive layer is disposed on a side surface of the non-display area to contact the side of the connecting member; and Multiple second conductive layers, which are separated from the first conductive layer and extend vertically.

16. The display device according to claim 15, wherein, The second conductive layer is disposed below the substrate, below the switching transistor and / or sensing transistor in the transistor.

17. The display device according to claim 15, wherein, The first conductive layer is supplied with the low potential power supply voltage from the flexible film via the power lines.

18. The display device according to claim 15, wherein, The connecting member is disposed from the side surface of the display panel to the upper edge of the display panel to be electrically connected to the side surface of the first conductive layer and the upper surface of the conductive electrode.

19. The display device according to claim 1, wherein, The conductive layer is formed of a transparent conductive material or doped amorphous silicon.

20. The display device according to claim 19, wherein, The transparent conductive material includes indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), or zinc oxide (ZnO).

21. The display device according to claim 1, further comprising: A back cover, which is positioned above the display panel; as well as A roller, which is connected to the back cover to wrap around or unfold the back cover and the display panel.

22. A display device, comprising: The display panel is divided into a display area and a non-display area and includes a substrate; A transistor is disposed above the substrate and in the display area; A flexible film is disposed on the side surface of the non-display area and connected to the substrate; A connecting member is disposed on the side surface of the display panel; as well as A conductive layer is disposed beneath the substrate and electrically connected to the connecting member. The connecting member is configured to distribute a low-potential power supply voltage from the flexible film to the conductive layer, and The conductive layer includes: A first conductive layer is formed beneath the display panel to form a lateral contact with the connecting member; and Multiple second conductive layers, which are separated from the first conductive layer and extend vertically.

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