Electronic housing component including a heat sink and associated adjustment method

Abstract

An electronic housing element (1) intended to be fastened to a circuit board (2) having a component (3) to be cooled, comprising: a frame (11) made of plastic material, having a rigid surround (11a) and an upper wall (11b), and a heat sink (12) intended to cool the component (3), the heat sink having: a clamping portion (12a) protruding from the upper wall (11b) of the frame (11) and designed to engage with a clamping claw (81) of a clamping device (8); and a retaining portion (12b) engaged with the upper wall (11b) of the frame (11). The upper wall (11b) of the frame is formed of a material having a load deflection temperature and is designed to deform so as to allow the orientation of the heat sink (12) to be adjusted when the upper wall (11b) reaches the load deflection temperature.

Description

Technical Field

[0001] The present disclosure relates to the field of cooling electronic components in environments that are subject to particularly strong vibrations, such as for example the automotive field. Background Art

[0002] In the automotive sector, especially due to the development of new functions, such as for example driver assistance or autonomous driving, high-power electronic components are increasingly used. Therefore, there is a need to provide a solution for cooling these components which may be subject to severe vibrations while protecting them from their external environment.

[0003] The proposed cooling solution must make it possible to cool the component effectively while ensuring good integrity of the component and of the circuit board to which it is fastened. To this end, it is necessary to limit the stresses to which the circuit board is subjected, which makes it possible in particular to avoid the breakage of solder joints or traces, and to limit structural weaknesses by using maximum rigidity connections and avoiding the occurrence of natural resonant frequencies. Furthermore, it is also desirable to limit production costs by limiting the number of assembly steps, as well as storage costs by limiting the number of components to be assembled.

[0004] Various solutions have been proposed in an attempt to address these problems.

[0005] A first solution consists in fastening the circuit board to a base and in enclosing the circuit board and the components to be cooled in a rigid housing fastened to the base so as to form an electronic housing. With a heat sink, intended to be in thermal contact with the components to be cooled, rigidly fastened to the inside of the housing, a layer of thermal interface material, such as thermal paste, grease or pad, is placed between the heat sink and the components to ensure thermal contact. Due to the mechanical tolerances between the components and the heat sink, the thickness of the thermal interface material layer varies from one electronic housing to another. Therefore, the cooling performance varies and this may lead to overheating of the components on the circuit board or other sensitive components. Therefore, this solution is not satisfactory in terms of thermal performance.

[0006] To overcome this drawback, it has been proposed to also screw the heat sink to the circuit board on either side of the component to be cooled. Thus, the thickness of the deposited thermal interface material is reproducible and has a controlled thickness. However, this additional mechanical coupling adds additional loads that can locally bend the circuit board. This second solution is not satisfactory because it creates additional stresses on the circuit board.

[0007] To overcome this drawback, in a third solution, it has been proposed to fasten the heat sink directly to the circuit board. This third solution is not satisfactory since it involves an additional subassembly step and, therefore, the storage of an additional component. Moreover, since the heat sink generally weighs about 50 to 200 grams for the intended application, in case of vibrations, soldering or traces may break. Furthermore, the circuit board is subjected to dynamic stresses generated at each vertical acceleration, for example when the vehicle passes through a pothole, which also has an impact on the integrity of the circuit board in terms of cyclic fatigue.

[0008] To overcome this drawback, in a fourth solution, it has been proposed to fasten the heat sink to the circuit board and the cover. Since the cover is rigid, this improves the structural stability of the assembly. However, with this solution, the position of the circuit board inside the rigid housing is difficult to adjust, since it is defined by the cover / circuit board / cooler assembly. It is therefore necessary to add new tolerances by enlarging, for example, holes intended to accommodate connectors in the housing of the frame. This solution is not feasible, since the penetration of solid and liquid foreign bodies into the circuit board must be limited. This can be equally problematic if it is intended to directly connect several circuit boards together using connectors fastened to each circuit board.

[0009] Therefore, a cooling solution that is compatible with all these issues is needed. Summary of the invention

[0010] It is an object of the present disclosure to overcome at least some of the disadvantages of the prior art.

[0011] The object of the present disclosure is in particular to propose an electronic housing element comprising a heat sink intended to cool components of a circuit board, which heat sink is easy to mount on the circuit board while ensuring that the circuit board is effectively sealed relative to the electronic housing.

[0012] An electronics housing element is proposed which is intended to be fastened to a circuit board having components to be cooled in order to form an electronics housing, the electronics housing element comprising:

[0013] - a frame made of plastic material having a rigid surround and an upper wall, and

[0014] - a heat sink intended for cooling said component when said component is in thermal contact with said heat sink, said heat sink having:

[0015] * a clamping portion protruding from the upper wall of the frame, the clamping portion being designed to be engageable with the clamping claws of the clamping device,

[0016] * a retaining portion intended to engage with the upper wall of the frame,

[0017] The upper wall of the frame is formed of a material having a deflection temperature under load and is designed to deform to allow the orientation of the heat sink to be adjusted relative to the surround of the frame when the upper wall reaches the deflection temperature under load.

[0018] The proposed housing element has the advantage that, when the upper wall of the frame made of thermoplastic material is heated above its load deflection temperature, it allows to adjust the orientation of the heat sink intended to be in contact with the component to be cooled. This therefore ensures that the lower surface of the heat sink is appropriately parallel to the component to be cooled and that the thickness of the thermal interface material is therefore appropriately uniform. Furthermore, if necessary, the distance between the lower surface of the heat sink and the component can also be adjusted in order to ensure that the thickness of the thermal interface material layer is thin enough to ensure suitable thermal performance in terms of cooling.

[0019] Furthermore, since the upper wall deforms when its temperature is greater than or equal to its load deflection temperature, after cooling, permanent deformation is achieved without risk of cracking and without generating residual stresses in the frame.

[0020] According to one embodiment, the frame is formed by overmolding on the holding portion of the heat sink.

[0021] The use of an overmolding process on the holding portion of the radiator for the manufacture of the frame makes it possible to obtain a strong connection suitable for the severe vibrations to which the connection between the radiator and the frame may be subjected. Furthermore, the manufacture of the electronic housing elements is simplified, and in particular the mounting of the radiator on the upper wall of the frame is simplified. Furthermore, the use of an overmolding process makes it possible to ensure an effective seal, limiting the penetration of dust and water into the electronic housing. Advantageously, a thermoplastic resin is used for the production of the frame by overmolding.

[0022] According to one embodiment, the upper wall has a corrugated wall portion, and has a portion at the center thereof configured to cooperate with a holding portion of the heat sink.

[0023] Such a wall can be easily formed by overmolding, making it possible to have a good connection with the holding part of the heat sink. Furthermore, the small thickness of the wall and its wavy shape make it possible to limit the heat transfer to the rest of the frame when the upper wall is heated. In this way, deformations of the rest of the frame are avoided. Furthermore, the small thickness of the upper wall makes it possible to quickly reach the load deflection temperature, thus supporting a saving of time and energy.

[0024] Advantageously, the material forming the upper wall of the frame is selected such that its load deflection temperature is greater than the temperature reached by the electronics housing during operation.

[0025] This avoids the situation that the upper wall of the frame is inadvertently deformed when the electronic housing is installed and in operation. Misalignment of the heat sink is thus avoided when the housing is installed and in operation.

[0026] In one embodiment, the retaining portion and the clamping portion of the heat sink are formed of a thermally conductive material.

[0027] Thus, the retaining portion and the clamping portion are in thermal contact, thereby allowing the heat sink to dissipate heat better by increasing the surface area for heat exchange.

[0028] In one embodiment, the retaining portion of the heat sink is in thermal contact with the upper wall of the frame.

[0029] Thus, the upper wall of the frame may be heated by conduction through the holding portion of the heated heat sink.

[0030] According to another aspect, a method for adjusting the orientation of a heat sink included in an electronic housing element as described above is proposed, comprising:

[0031] - inserting the electronics housing element into a suitable holding device,

[0032] - measuring the orientation of the lower surface of the heat sink relative to a reference plane,

[0033] - clamping the clamping part of the heat sink with the clamping claws of the clamping device,

[0034] - heating the clamping jaws of the clamping device so as to heat the upper wall of the frame by means of the radiator and monitoring the temperature of the upper wall of the frame,

[0035] - adjusting the orientation of the heat sink by means of the clamping device when the upper wall of the frame reaches the load deflection temperature,

[0036] - Stopping the heating and cooling of the jaws while maintaining the adjusted orientation of the heat sink.

[0037] The proposed adjustment method makes it possible to easily and inexpensively obtain an electronic housing with a heat sink, the lower surface of which is oriented parallel to a reference plane, which corresponds, for example, to the subsequent position of the surface of the component when a circuit board with the component is mounted. In particular, the proposed adjustment method is cheaper than producing and selecting housing elements corresponding to positioning tolerances, which are more demanding and cannot be achieved in the current situation. The proposed adjustment method is also easier and faster to perform than methods involving material removal. In particular, it is not necessary to carry out the steps of grinding, cleaning lubricants and removing grinding residues by ultrasound. In addition, the adjustment method can be easily integrated into an assembly line and can be performed before the circuit board and the cover are fastened to the frame.

[0038] According to another aspect, a device for implementing the above method is proposed, the device comprising:

[0039] - a holding device intended to accommodate and hold an electronic housing element as described above,

[0040] a detector configured to measure the orientation of a lower surface of said heat sink intended to be in thermal contact with a component to be cooled relative to a reference plane,

[0041] - a temperature sensor configured to measure the temperature of the upper wall of the frame,

[0042] - A clamping device comprising:

[0043] * clamping claws designed to mate with the clamping portion of the heat sink, and

[0044] * a system for heating and cooling the jaws, the system being designed to heat the clamping jaws to a temperature greater than the load deflection temperature of the upper wall of the frame,

[0045] The clamping device is configured to adjust the orientation of the heat sink relative to a reference plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Further features, details and advantages will become apparent from reading the following detailed description and from studying the accompanying drawings, in which:

[0047] Figure 1A shows a cross-sectional view of the electronics housing element before adjustment,

[0048] Figure 1B shows a top view of an electronic housing element according to one embodiment,

[0049] Figure 2A A method for adjusting the Figure 1A and Figure 1B The steps of a method of orienting a heat sink within an electronic housing component,

[0050] Figure 2B A method for adjusting the Figure 1A and Figure 1B The steps of a method of orienting a heat sink within an electronic housing component,

[0051] Figure 2C A method for adjusting the Figure 1A and Figure 1B The steps of the method for orienting a heat sink within an electronic housing component, and

[0052] Figure 2D A method for adjusting the Figure 1A and Figure 1B The steps of a method of orienting a heat sink within an electronic housing component,

[0053] Figure 3 A cross-sectional view of the electronics housing element of FIG. 1 positioned on a circuit board after adjustment is shown according to one embodiment. DETAILED DESCRIPTION

[0054] The following drawings and descriptions mainly contain elements of certain characters. Therefore, they can not only be used to better understand the present disclosure, but also can contribute to its definition according to possible specific circumstances.

[0055] Reference now Figure 1A and Figure 1B . Figure 1A A housing element 1 is shown which is intended to be mounted on a circuit board 2 having components 3 to be cooled, the circuit board 2 being shown for greater clarity in a slightly offset position below the housing element 1. The electronics housing element 1 is intended to be closed by a cover (not shown) in order to form an enclosure surrounding the circuit board 2 and the components 3, i.e. an electronics housing.

[0056] The electronic housing element 1 comprises a frame 11 and a heat sink 12 which is intended for heat dissipation when the component 3 is in thermal contact with the heat sink, for example via Figure 1A The component is cooled by a thermal interface layer 4 schematically shown in FIG.

[0057] Especially Figure 1B As can be seen more particularly in FIG. 1 , the frame 11 is made of plastic material and has a rigid surround 11a and an upper wall 11b. The upper wall 11b has a central opening in which the heat sink 12 can be mounted.

[0058] like Figure 1A As can be seen more specifically in , the heat sink 12 comprises a clamping portion 12a and a retaining portion 12b which are thermally continuous with each other. The heat sink 12 is formed of a thermally conductive material such as metal, for example. The retaining portion 12b is located on the outer wall at the periphery of the heat sink 12 and is intended to engage with the upper wall 11b of the frame 11. The clamping portion 12a protruding from the electronic housing element is intended to cooperate with the clamping claws of the clamping device, as can be seen more specifically with reference to Figures 2b and 2c. Therefore, the clamping portion 12a is designed to be able to engage with the clamping claws of the clamping device. As shown in Figure 1B As can be seen more particularly in FIG. 1 , the heat sink 12 has a recess on the portion protruding from the electronics housing element, which recess is intended to increase the surface area for heat exchange with the surrounding air in order to cool the component 3 .

[0059] In the embodiment described here, the upper wall 11 b has a wavy shape and advantageously has a thickness that is much smaller than its length and much smaller than the height of one of the wavy shapes of the upper wall.

[0060] The small thickness and the wavy shape of the upper wall 11b make it possible to limit the heat transfer to the rest of the frame when the upper wall is heated. When the radiator exhibits rotational symmetry, as is the case here, the upper wall 11b has concentric circles around a central orifice on which the radiator 12 is mounted, as in Figure 1B More specifically visible in.

[0061] like Figure 1A As shown in , it is apparent that the lower surface of the heat sink 12 is inclined relative to the plane of the component 3 and the circuit board 2. This can cause problems, especially when applying a low-viscosity thermal paste or grease, which spreads out of the desired thermal contact area between the component 3 and the heat sink 12. In addition, since the distance between the lower surface of the heat sink 12 and the surface of the component 3 is not constant, the cooling performance is not satisfactory, as described above.

[0062] To overcome this problem, the proposed solution makes it possible to adjust the orientation of the heat sink 12 so that when the component is mounted on the electronic housing element, its lower surface is substantially parallel to the surface of the component within the allowed mechanical tolerances.

[0063] Thus, when the material forming the upper wall 11b of the frame is heated to a temperature greater than or equal to the load deflection temperature inherent to the material used and then cooled, this material is capable of permanent deformation. Thus, by applying a load to the radiator by means of a clamping device, it is possible to move the radiator so as to adjust its orientation relative to the surrounding of the frame, more specifically relative to the reference plane P, and to fix this position when the upper wall 11b has cooled, as shown in reference FIG. 2A to FIG. 2D The reference plane may correspond, for example, to a reference orientation of the surface of the component 3 when the circuit board 2 is mounted on the frame 11 .

[0064] In the embodiment described here, the frame 11 is made of thermoplastic resin and is formed by overmolding on the retaining portion 12b of the radiator 12. It can be made of, for example, polypropylene, PC / ABS (polycarbonate / acrylonitrile-butadiene-styrene) mixture or polycarbonate. As shown in Figure 1, the upper wall 11b has a wavy wall portion and has a fastening portion 11c at its center, which is configured to cooperate with the retaining portion 12b of the radiator 12. In the example described here, the retaining portion 12b of the radiator has a shape complementary to the shape of the fastening portion 11c of the upper wall 11b. One of the fastening portion 11c and the retaining portion 12b has a recess, while the other of the fastening portion 11c and the retaining portion 12b has a protrusion accommodated in the corresponding recess. Therefore, manufacturing the frame by overmolding makes it possible to obtain a solid connection between the radiator and the upper wall of the frame, which also shows a good seal. In this way, the penetration of water and dust at the height of the component is limited, while ensuring the appropriate solidity of the connection during vibration.

[0065] Advantageously, the thermoplastic resin used has a load deflection temperature greater than the highest temperature that can be reached during use of the component. For example, for this purpose, a thermoplastic resin having a load deflection temperature greater than 105° C. is selected in order to avoid misalignment of the heat sink under nominal operating conditions, in particular when the temperature in the housing environment is 85° C. and the component contributes to a temperature increase of 20° C. at the upper wall of the frame during its operation.

[0066] In an embodiment variant, the surround and the upper wall of the frame may be made of polycarbonate. Its load deflection temperature is 120° C., which is much higher than the temperature that can be reached when the electronic housing is installed in its operating environment and the components operate as described above.

[0067] FIG. 2A to FIG. 2D Different steps in a method for adjusting the orientation of the heat sink 12 relative to the frame 11 are shown.

[0068] First, if Figure 2AAs shown in , the electronic housing element 1 is inserted into a suitable holding device 5, and then the detector 6 measures the orientation of the lower surface of the heat sink 12 relative to the reference plane P. The measurement of the orientation of the lower surface of the heat sink 12 relative to the reference plane P makes it possible to determine whether there is a difference between the orientation of the lower surface of the heat sink and the provided orientation of the surface of the component 3 when the circuit board 2 is mounted on the frame 11. The detector 6 has, for example, three sensor heads 61 and a control and detection unit 62. The sensor heads 61 are configured to output light pulses and measure the intensity received after the light pulses have been reflected on the lower surface of the heat sink. The control and detection unit 62 is configured to determine the flight time of each reflection of the signal output by each head and to infer therefrom the orientation of the inner surface of the heat sink 12 relative to the reference plane P. The reference plane P may correspond to, for example, a reference orientation of the surface of the component 3 or the circuit board 2.

[0069] When the inner surface of the heat sink 12 is not oriented along the reference plane P, that is, when at least one of the three angles defining the orientation of the lower surface of the heat sink 12 relative to the reference plane P is greater than a threshold value, the step of adjusting the orientation of the heat sink is implemented, as shown in FIG. Figure 2B and Figure 2C as described.

[0070] First, the clamping device 8 is actuated so that the clamping claw 81 engages with the clamping portion 12a of the heat sink 12 ( Figure 2B ).

[0071] Next, the clamping claws 81 are heated. The heat-conducting clamping claws 81 make it possible to heat the radiator 12 by conduction, and then heat the upper surface 11b of the frame. This is possible because the clamping portion 12a and the retaining portion 12b are thermally continuous with each other, and the retaining portion 12b is in thermal contact with the upper wall 11b of the frame. In addition, due to the small thickness of the upper wall, the load deflection temperature is quickly reached. It will be noted that here the radiator 12 is only in thermal contact with the upper wall 11b of the frame. Therefore, heat can only be transmitted to the rest of the frame via the upper wall 11b. In addition, since the upper wall 11b is relatively thin (e.g., about 0.7 to 1.5mm), the heat transferred to the surrounding piece 11a of the frame is relatively small. Therefore, the deformation of the surrounding piece of the frame caused by the release effect of the stress fixed during overmolding is avoided.

[0072] During heating, the temperature of the upper wall 11b of the frame 11 is monitored by at least one temperature sensor 7. In the example described here, two temperature sensors 7 are located at Figure 2B These may be, for example, infrared detectors 71 , which are each connected to a control and measuring unit 72 .

[0073] When the load deflection temperature is reached, the gripping device 8 is actuated so as to adjust the orientation of the lower surface of the heat sink 12. It will be noted that the values ​​measured by the control and detection unit 62 of the orientation detector 6 are transmitted to the control unit of the robot gripper for feedback control of the orientation of the gripping device and its movement according to possible circumstances.

[0074] When the orientation of the heat sink is adjusted ( Figure 2C ), that is, when the orientation detector 6 detects that the orientation of the lower surface of the heat sink 12 corresponds to the orientation of the reference plane P, the heating of the clamping jaws is stopped, and then the upper wall 11b of the frame can be cooled so as to fix the new orientation of the heat sink 12 relative to the frame. In particular, the deformation of the upper wall 11b under stress caused by the clamping device becomes permanent during the cooling period. In order to accelerate the cooling, the clamping jaws 81 are thermally coupled to the cooling system. Advantageously, the temperature of the upper wall 11b is measured during the cooling period, so that when the temperature of the upper wall 11b is less than a threshold value, the clamping jaws 81 can be separated from the clamping portion 12a of the heat sink ( Figure 2D ). In addition, the orientation of the heat sink is verified, for example during a final test before mounting the circuit board 2 on the electronic housing element 1 to form the electronic housing 10, as shown in reference Figure 3 As shown.

[0075] Already referenced FIG. 2A to FIG. 2D An apparatus for implementing the above-mentioned adjustment method is described in part. In one embodiment, the apparatus comprises:

[0076] - a holding device 5 intended to receive and hold the electronic housing element 1,

[0077] said detector 6 being configured to measure the orientation of the lower surface of said heat sink intended to be in thermal contact with the component to be cooled relative to said reference plane P,

[0078] - at least one temperature sensor 7 configured to measure the temperature of the upper wall 11b of the housing,

[0079] - A clamping device 8 comprising:

[0080] * clamping claws 82 intended to cooperate with the clamping portion 12a of the heat sink, and

[0081] * A system for heating and cooling the jaws (not shown), the system being designed to heat the clamping jaws 81 to a temperature greater than the load deflection temperature of the upper wall of the frame. The clamping jaws 81 are made of a thermally conductive material and are thermally coupled to the heating and cooling system. The heating and cooling system may include a system for circulating a heated or cooled fluid. The heating and cooling system may also include a heating and cooling element. The heating and cooling element may also be in direct thermal contact with the clamping jaws.

[0082] The clamping device 8 further comprises a control unit (not shown) configured to control the movement of the clamping jaws 81 and the clamping device 8 so as to adjust the orientation of the heat sink 12 relative to the reference plane P. The control unit is also configured to control the temperature of the clamping jaws 81 via a heating and cooling system.

[0083] Advantageously, the clamping device 8, and more particularly its control unit, is connected to the control and detection unit 62 of the detector 6 and to the control and measurement unit 72 of the temperature sensor 7. Thus, the control unit of the clamping device 8 is also configured to monitor the temperature of the upper wall 11b and the orientation of the lower surface of the heat sink 12.

[0084] Figure 3 shows the use of reference FIG. 2A to FIG. 2D The described adjustment method positions the electronic housing component 1 on the circuit board 2 after adjusting the orientation of the heat sink 12 relative to the reference plane P.

[0085] In the embodiment described here, the circuit board 2 comes to bear on the lower surface of the surround 11a and is intended to be fastened to the surround 11a, for example to a wall formed by a recess 11d provided for this purpose, via screws or clips (not shown), as in Figure 1B More specifically visible in.

[0086] The mounting of the circuit board 2 on the electronic housing element is simplified, since it is not necessary to fasten the heat sink 12 to the circuit board 2, as proposed in the prior art, and since the position of the circuit board 2 is defined relative to the frame. Furthermore, since the heat sink 12 is already mounted on the housing element, the number of components to be kept in stock and the number of steps to be performed when mounting the electronic housing are limited.

[0087] This solution is therefore particularly suitable for cooling components mounted on small circuit boards. It will be noted that this solution is also particularly suitable if it is intended to connect several circuit boards directly together using connectors fastened to each circuit board, since the position of the heat sink is defined relative to the frame.

[0088] The present disclosure is not limited to the above references Figure 1B The example of a heat sink exhibiting rotational symmetry and an upper wall with concentric circles is described only as an example, but all variants that can be imagined by a person skilled in the art within the desired scope of protection are encompassed.

Claims

1. An electronic housing element (1) intended to be fastened to a circuit board (2) having a component (3) to be cooled in order to form an electronic housing (10), the electronic housing element (1) comprising: a frame (11) made of plastic material having a rigid surround (11a) and an upper wall (11b), and A heat sink (12) intended for cooling the component (3) when the component (3) is in thermal contact with the heat sink, the heat sink having: a clamping portion (12a) protruding from an upper wall (11b) of the frame (11), the clamping portion (12a) being designed to be engageable with a clamping claw (81) of a clamping device (8), a retaining portion (12b) intended to engage with an upper wall (11b) of said frame (11), The upper wall (11b) of the frame is formed of a material having a load deflection temperature and is designed to deform so as to allow the orientation of the heat sink (12) relative to the surround (11a) of the frame (11) to be adjusted when the upper wall (11b) reaches the load deflection temperature.

2. The electronic housing element (1) according to claim 1, wherein: The frame (11) is formed by overmolding on the holding portion (12b) of the heat sink (12).

3. The electronic housing element (1) according to claim 2, wherein: The upper wall (11b) has a corrugated wall portion, and has a portion (11c) at the center thereof configured to cooperate with the holding portion (12b) of the heat sink (12).

4. The electronic housing element (1) according to any one of claims 1 to 3, wherein: The material forming the upper wall (11b) of the frame (11) is selected so that its load deflection temperature is greater than the temperature reached by the electronic housing (10) during operation.

5. The electronic housing element (1) according to any one of claims 1 to 3, wherein: The holding portion (12b) and the clamping portion (12a) of the heat sink (12) are formed of a thermally conductive material.

6. Electronic housing element (1) according to claim 5, wherein: The holding portion (12b) of the heat sink (12) is in thermal contact with the upper wall (11b) of the frame (11).

7. A method for adjusting the orientation of a heat sink (12) included in an electronic housing element (1) according to any one of claims 1 to 6, comprising: Inserting the electronics housing element (1) into a suitable holding device (5), measuring the orientation of the lower surface of the heat sink (12) relative to a reference plane (P), The clamping claw (81) of the clamping device (8) clamps the clamping portion (12a) of the heat sink (12), heating the clamping claw (81) of the clamping device (8) so as to heat the upper wall (11b) of the frame through the heat sink (12) and monitoring the temperature of the upper wall (11b) of the frame, When the upper wall (11b) of the frame reaches the load deflection temperature, the orientation of the heat sink (12) is adjusted by means of the clamping device (8), Heating and cooling of the clamping jaws (81) are stopped while maintaining the adjusted orientation of the heat sink (12).

8. A device for implementing the method according to claim 7, the device comprising: A holding device (5) intended to accommodate and hold an electronic housing element according to any one of claims 1 to 4, a detector (6) configured to measure the orientation of the lower surface of the heat sink intended to be in thermal contact with the component to be cooled relative to a reference plane (P), a temperature sensor (7) configured to measure the temperature of the upper wall (11b) of the frame, The clamping device (8) comprises: a clamping claw (81) intended to cooperate with the clamping portion (12a) of the heat sink (12), and a system for heating and cooling the clamping jaws (81), the system being designed to heat the clamping jaws (81) to a temperature greater than the load deflection temperature of the upper wall (11b) of the frame (11), The clamping device (8) is configured to be able to adjust the orientation of the heat sink (12) relative to the reference plane (P).

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