Equipment and methods for alignment devices in LIDAR systems

Abstract

Apparatus and methods for aligning circuit boards (e.g., for LIDAR systems) are disclosed. According to one embodiment, an electronic device includes a secondary device and a connection means coupled to the secondary device. The connection means includes a plurality of conductive members, including a first conductive member and a second conductive member. Each of the conductive members includes a first end configured to be electrically and mechanically coupled to a primary circuit board and a second end configured to be electrically and mechanically coupled to the secondary device. A second end of the first conductive member is coupled to a first side of the secondary device, and a second end of the second conductive member is coupled to a second side of the secondary device. The second side of the secondary device is opposite to the first side of the secondary device.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to U.S. Provisional Patent Application No. 62 / 851,447 (Attorney’s File No. VLI-029PR), entitled “Conductive Alignment Element for LIDAR Systems”, filed on May 22, 2019, which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure generally relates to circuit board interconnection, and more specifically to a conductive alignment device that enables alignment between a light emitter (e.g., a laser) and a corresponding light receiver (e.g., a photodetector) after they have been mechanically and electrically connected to their respective printed circuit boards. Background Technology

[0004] Light detection and ranging (“LIDAR”) systems measure properties of the surrounding environment (e.g., the target's shape, outline, distance to the target, etc.) by illuminating a target with a pulsed laser and using sensors to measure the reflected pulses. The difference in laser return time and wavelength can then be used to create a digital 3D representation of the surrounding environment. LIDAR technology can be used in a variety of applications, including autonomous vehicles, advanced driver assistance systems (ADAS), mapping, security, surveying, robotics, geology and soil science, agriculture, and drones. Depending on the application and the associated field of view, multi-channel or laser beams can be used to produce images at the desired resolution. LIDAR systems with a greater number of channels can generate a greater number of pixels.

[0005] In a multi-channel LiDAR device, light emitters are paired with light receivers to form multiple “channels.” During operation, the emitter of each channel transmits a light signal (e.g., laser) into the device’s environment and detects a portion of the signal reflected back to the receiver of that channel from the surrounding environment. In this way, each channel provides a “point” measurement of the environment, which can be aggregated with point measurements provided by other channels to form a “point cloud” of environmental measurements.

[0006] Measurements collected by the LiDAR channel can be used to determine the path length (“distance”) from the device to a surface in the environment that reflects the transmitted light signal from the channel back to the channel’s receiver, as well as the reflectivity of that surface. The distance to the surface can be determined based on the time of flight of the channel’s signal (e.g., the time elapsed from when the transmitter emits the light signal to when the receiver receives the returned signal reflected by the surface). The reflectivity of the surface can be determined based on the intensity of the returned signal, which typically depends not only on the surface’s reflectivity but also on the distance to the surface, the glancing angle of the emitted signal relative to the surface, the power level of the channel’s transmitter, the alignment of the channel’s transmitter and receiver, and other factors.

[0007] The foregoing examples and limitations of the related art are intended to be illustrative and not exclusive, and are not to be considered "prior art." Other limitations of the related art will become apparent to those skilled in the art after reading the specification and studying the accompanying drawings. Summary of the Invention

[0008] Apparatus and methods for aligning circuit boards (e.g., for LIDAR systems) are disclosed. According to one embodiment, an electronic device includes a secondary device and a connection means coupled to the secondary device. The connection means includes a plurality of conductive members, each including at least a first conductive member and a second conductive member. Each of the conductive members includes a first end configured to be electrically and mechanically coupled to a primary circuit board and a second end configured to be electrically and mechanically coupled to the secondary device. A second end of the first conductive member is coupled to a first side of the secondary device, and a second end of the second conductive member is coupled to a second side of the secondary device. The second side of the secondary device is opposite to the first side of the secondary device.

[0009] According to another embodiment, a circuit board alignment method includes connecting a plurality of secondary devices to a primary circuit board via respective plurality of connection devices. Each of the connection devices includes a respective plurality of conductive members. Connecting a secondary device to the primary circuit board includes electrically and mechanically connecting a first end of each of the conductive members to the primary circuit board. A second end of each of the conductive members is electrically and mechanically connected to a corresponding secondary device. After connecting the secondary devices to the primary circuit board, each of the secondary devices is aligned relative to the primary circuit board and relative to one or more of the secondary devices, while maintaining the electrical and mechanical connections between the primary circuit board and each of the secondary devices. Aligning each of the secondary devices includes adjusting the position and / or orientation of each of the secondary devices.

[0010] The above and other preferred features, including various novel details of the embodiments and combinations thereof, will now be described in more detail with reference to the accompanying drawings and pointed out in the claims. It will be understood that the particular systems and methods described herein are shown by way of illustration only and are not intended to be limiting. As will be understood by those skilled in the art, the principles and features described herein may be employed in many and numerous embodiments without departing from the scope of any of the inventions. As will be appreciated from the foregoing and the following description, each and every feature described herein, as well as various combinations of two or more such features, are included within the scope of this disclosure, provided that the features included in such combinations are not contradictory. Furthermore, any feature or combination of features may be expressly excluded from any embodiment of any of the inventions.

[0011] The foregoing description of the invention (including the description of some embodiments, their motivation and / or advantages) is intended to help the reader understand this disclosure and does not in any way limit the scope of any of the claims. Attached Figure Description

[0012] The accompanying drawings, which are included as part of this specification, illustrate presently preferred embodiments and, together with the general description given above and the detailed description of preferred embodiments given below, serve to explain and teach the principles described herein.

[0013] Figure 1 (“Figure”) depicts a simplified block diagram of a first circuit board connected to a plurality of secondary devices via respective conductive alignment devices according to some embodiments.

[0014] Figure 2 depicts a side view of a first circuit board connected to multiple secondary devices according to an example.

[0015] Figure 3 A perspective view depicting a first circuit board connected to a plurality of secondary circuit boards according to one or more embodiments.

[0016] Figure 4 An enlarged perspective view depicting a conductive alignment device between a first circuit board and a corresponding secondary circuit board according to one or more embodiments.

[0017] Figure 5 A side view depicting a conductive alignment device between one of a first circuit board and a secondary circuit board according to one or more embodiments.

[0018] Figure 6 A front view depicting a conductive alignment device between a first circuit board and a corresponding secondary circuit board according to one or more embodiments.

[0019] Figure 7A perspective view depicting a first circuit board connected to a plurality of secondary circuit boards according to one or more additional embodiments of the present invention.

[0020] Figure 8A depicts an enlarged perspective view of a second conductive alignment device between a first circuit board and a corresponding secondary circuit board according to an additional embodiment.

[0021] Figure 8B depicts a perspective view of a second conductive alignment device with a body and multiple elements according to some embodiments.

[0022] Figure 9 A perspective view depicting a first circuit board coupled to a plurality of secondary submounted devices according to one or more embodiments.

[0023] Figure 10 This is a flowchart of a process for connecting and aligning multiple secondary devices at a circuit board level, according to one or more embodiments.

[0024] Figure 11 This is a flowchart of a process for connecting and aligning multiple secondary devices at a block level, according to one or more embodiments.

[0025] While this disclosure is readily adaptable to various modifications and alternatives, specific embodiments thereof have been illustrated by way of example in the accompanying drawings and will be described in detail herein. This disclosure should be understood as not being limited to the specific forms disclosed; rather, the invention will cover all modifications, equivalents, and alternatives falling within the spirit and scope of this disclosure. Detailed Implementation

[0026] Apparatus and methods for alignment devices in a LIDAR system are disclosed. It will be appreciated that, for the sake of simplicity and clarity of illustration, reference numerals may be repeated in the drawings where deemed appropriate to indicate corresponding or similar elements. Furthermore, numerous specific details are set forth to provide a thorough understanding of the exemplary embodiments described herein. However, those skilled in the art will understand that the exemplary embodiments described herein can be practiced without these specific details.

[0027] Measurements, sizes, quantities, etc., are presented herein in range format. This range format is for convenience and brevity only and should not be construed as an inflexible limitation on the scope of the invention. Therefore, the description of ranges should be considered as specifically disclosing all possible subranges and the individual values ​​within those ranges. For example, a description of a range such as 10-20 inches should be considered as specifically disclosing the following subranges: such as 10-11 inches, 10-12 inches, 10-13 inches, 10-14 inches, 11-12 inches, 11-13 inches, etc.

[0028] When the specification refers to "an embodiment" or "an embodiment," it is intended to indicate that a particular feature, structure, characteristic, or function described in connection with the discussed embodiment is included in at least one contemplated embodiment. Therefore, the phrase "in one embodiment" appearing in different places in the specification does not constitute multiple references to a single embodiment.

[0029] Furthermore, the connections between the components or systems shown in the accompanying drawings are not intended to be limited to direct connections. Instead, the data or signals between these components may be modified, reformatted, or otherwise altered by intermediate components. Additionally, additional or fewer connections may be used. It should also be noted that the terms “link,” “connection,” or “communicationally linked” should be understood to include direct connections, indirect connections via one or more intermediate devices, and wireless connections.

[0030] Motivation and benefits of some embodiments

[0031] A crucial process in building a LiDAR system is properly aligning each transmitter (e.g., a laser) with one or more corresponding receivers (e.g., photodetectors). In some examples, this alignment process includes a first step of aligning each optical module before mechanically securing it to a printed circuit board. In one example, the laser module is aligned with its corresponding detector before being mechanically secured to the board. Once proper alignment is achieved, the laser module is secured to the board using epoxy resin, which holds the module in place to help maintain alignment during use. This alignment process can be very time-consuming because it is performed before each module is secured to its associated board. This alignment procedure can be even more complex if a large array of lasers and detectors is deployed within a LiDAR system. It is highly desirable that the mounting of these optical modules (which may be implemented in or mounted on multiple thin secondary circuit boards) during deployment operations is time-efficient, allows for precise alignment, and is mechanically robust enough to withstand vibration or shock.

[0032] Therefore, what is needed are systems and methods for more efficient and less time-consuming technologies that facilitate the alignment of laser modules and detector modules within a LIDAR system.

[0033] Specific embodiments of the apparatus and methods disclosed herein can be implemented to achieve one or more of the following advantages. Some embodiments facilitate the mechanical and electrical connection of the secondary devices to a circuit board prior to adjusting the alignment of the secondary devices relative to each other, which can result in faster and more precise assembly of the electronic devices. Other advantages of the disclosed subject matter will become apparent from the description, drawings, and claims.

[0034] Some technologies used in alignment devices for LIDAR systems

[0035] Figure 1 A simplified block diagram of a first circuit board 110 is depicted, connected via respective conductive alignment devices 122a-122n to a plurality of secondary devices 120a-120n (e.g., packages, circuit boards, submounted devices, etc.). In one or more embodiments, the first circuit board 110 may be the motherboard of a LiDAR device, and each of the secondary devices 120a-120n may include a light emitter or photodetector supported by the motherboard. The light emitter or detector may be mounted on a corresponding thin circuit board or submount, which allows mounting on a motherboard for a compact configuration. Prior to operation, the light emitter or detector may be aligned in a desired direction to enhance (e.g., optimize) performance. The alignment step may utilize the electrical connection between the secondary devices 120a-120n and the first circuit board 110. After alignment is performed, the conductive alignment devices 122a-122n can stably hold the secondary devices 120a-120n in the aligned position. In some embodiments, the conductive alignment device facilitates the installation of multiple thin devices in a time-saving, easy-to-precise alignment manner and mechanically robust to withstand vibrations or shocks during deployment operations.

[0036] To emphasize the improvements to the alignment process made by using a conductive alignment device, Figure 2 is a side view of a first circuit board 210 connected to secondary circuit boards 220, 230 using an alternative connection method. In the example of Figure 2, the secondary circuit board 220 is electrically connected to the first circuit board 210 via multiple flexible wires 222, 224 (the flexible wires 222, 224 are soldered to corresponding pins 212, 214, etc.), allowing the secondary circuit board 220 to be energized for alignment. Once aligned, the secondary circuit board 220 is held in the aligned position and glued to the first circuit board 210 for a secure mechanical connection. The glue may require a UV curing process to ensure a secure mechanical connection. Once the glue has cured, the secondary circuit board is fixed in the aligned position, and further adjustments are impractical or impossible.

[0037] This process is time-consuming, partly due to the UV curing time required for the adhesive, and thus reduces the alignment efficiency of LIDAR device deployment. Furthermore, once the adhesive has cured, the mechanical connections are fixed. Therefore, the LIDAR device cannot undergo a realignment or recalibration process.

[0038] To overcome the above problems, embodiments of the new coupling device disclosed herein provide improvements in assembly efficiency, performance, and maintainability.

[0039] Figure 3 It is a perspective view of a first circuit board 310 connected to a plurality of secondary circuit boards 320, 330, etc., according to one or more embodiments. Figures 4 to 6 Describe respectively corresponding to Figure 3 Enlarged perspective, side, and front views of some embodiments of the conductive alignment device configured between a first circuit board and multiple secondary circuit boards. In one or more embodiments, each of the secondary circuit boards may include optical components 322 (e.g., a light emitter including a laser diode for light transmission, or a photodetector including a photodiode for light detection).

[0040] As in Figures 3 to 6 As shown, the secondary circuit board 320 is coupled to the first circuit board 310 via a conductive alignment device 400, which includes a plurality of discrete conductive elements (e.g., “bars”) 410, 420, 430, and 440 providing both mechanical and electrical connections between the two circuit boards. The conductive alignment device 400 may include any suitable number of discrete conductive elements, such as between two and eight (e.g., four). In some embodiments, elements 410, 420, 430, and 440 are substantially parallel to each other, but may have a variety of relative positions, which may be determined based on an alignment process. Each element has a first end (412, 422, 432, or 442) electrically connected to the first board and a second end (414, 424, 434, or 444) electrically connected to the secondary board. The electrical connection between the conductive element and the circuit board can be secured (e.g., permanently secured) by soldering the element to a pin on the circuit board (e.g., the first or secondary circuit board). In one or more embodiments, the length of each element is predetermined such that a gap exists between the secondary circuit board and the first circuit board to allow space for the secondary circuit board to move during the alignment process, thereby aligning pairs of optical components on adjacent secondary circuit boards.

[0041] In one or more embodiments, each of the conductive elements includes a semi-rigid metal or metal alloy rod (e.g., a semi-rigid metal or metal alloy cable) that provides a robust electrical connection (e.g., a reliable electrical connection suitable for use in a circuit) between a first circuit board and a secondary circuit board. In some embodiments, the rod of the conductive element comprises at least 75% tin and up to 25% of (multiple) other metals (e.g., copper, lead, etc.). In one specific embodiment, the rod of the conductive element comprises at least 99% tin and up to 1% of (multiple) other metals (e.g., copper, lead, etc.). The rod of the conductive element may have any suitable shape, including but not limited to cylindrical, rectangular, or any other shape that allows the conductive element to provide a semi-rigid connection as described in the specification. In some examples, the rod is cylindrical in shape and has a diameter between 0.25 mm and 0.75 mm. In one specific embodiment, the rod has a diameter of approximately 0.5 mm. The conductive element can be formable or flexible under applied mechanical stress above a threshold stress level and can maintain this form after the mechanical force is withdrawn, while the mechanical stress remains below the threshold stress level. In one or more embodiments, the conductive element can be made of one or more soft metallic elements, such as tin, silver, copper, etc. The semi-rigidity of the conductive element allows the secondary circuit board to be securely electrically connected to the first circuit board first, and then precisely aligned at the desired position or angle after a secure electrical connection has been established. This configuration greatly simplifies the assembly and alignment process of the LIDAR device.

[0042] In some embodiments, during the manufacture of an apparatus comprising a primary circuit board and one or more secondary circuit boards, semi-rigid rods are bent to align with a light emitter and / or detector. After bending, the rods maintain their electrical connection between the primary and secondary circuit boards and physically remain in place within alignment tolerances of the optical components.

[0043] In addition, the advantages of semi-rigid conductive alignment devices may include, but are not limited to: consistency of secondary circuit board positions between channels; the ability to “realign / rework” cells downstream, which significantly reduces scrap costs and rework time; the ability to “adjust” the device as needed (e.g., realign secondary circuit boards); improved maintainability and performance of LIDAR devices; elimination of unpredictability involved in adhesives and UV curing; and / or a reduction in the number of manufacturing tools / equipment required for manufacturing; and so on.

[0044] In one or more embodiments, a first circuit board is sandwiched between first ends of the rods of the conductive alignment device elements, wherein the first end of at least one rod is disposed on a first side of the first circuit board, and the first end of at least another rod is disposed on an opposite second side of the first circuit board. For example, the conductive alignment device may include four conductive elements, with the first ends of two rods disposed on the first side of the first circuit board and the first ends of two rods disposed on an opposite second side of the first circuit board. Examples of this configuration are shown in... Figure 4 As shown in the diagram, each of the first ends of the connecting elements can be connected to the side of the first circuit board via a corresponding solder point.

[0045] Similarly, for balanced mechanical connection, the secondary circuit board may be sandwiched between the second ends of the rods of the conductive alignment device elements, wherein the second end of at least one rod is disposed on a first side of the secondary circuit board, and the second end of at least another rod is disposed on the opposite second side of the secondary circuit board. For example, the conductive alignment device may include four conductive elements, wherein the second ends of two rods are disposed on a first side of the secondary circuit board, and the second ends of two rods are disposed on the opposite second side of the secondary circuit board. An example of this configuration is... Figure 4 As shown in the diagram, each of the second ends of the connecting element can be connected to the side of the secondary circuit board via a corresponding solder point.

[0046] Other configurations are also possible. For example, the paired conductive elements may have their first ends connected to the same side of the first circuit board 310 and their second ends connected to the opposite side of the secondary circuit board 320. Alternatively, the paired conductive elements may have their first ends connected to the opposite side of the first circuit board 310 and their second ends connected to the same side of the secondary circuit board 320.

[0047] In one or more embodiments, a plurality of conductive elements of the conductive alignment device provide at least two isolated electrical paths for a closed electrical connection between a first circuit board and a secondary circuit board. In one or more embodiments, one or more connection pins on the first circuit board (and / or one or more conductive elements of the conductive alignment device) are used only for mechanical support, not for establishing electrical paths. In one or more embodiments, all conductive elements of the conductive alignment device 400 are used to establish one or more electrical paths between the first circuit board and the secondary circuit board.

[0048] In one or more embodiments, the plurality of conductive elements of the conductive alignment device may be arranged such that, for each conductive element, the side of the first circuit board (on which a first end of the conductive element is disposed) and the side of the secondary circuit board (on which a second end of the conductive element is disposed) are substantially perpendicular to each other. Such a configuration is, for example, in... Figure 4As shown in the diagram. This configuration facilitates the compact arrangement of multiple secondary circuit boards, which are attached to the first circuit board via corresponding conductive alignment devices. The multiple secondary boards can be aligned individually or jointly in one or two dimensions for desired tilting and deflection.

[0049] Figure 7 Figure 8A depicts a perspective view and an enlarged view of a first circuit board 310 coupled to a plurality of secondary circuit boards 320, 330, etc., according to one or more embodiments. Figure 8B depicts a perspective view of another embodiment of the conductive alignment device 500 without circuit boards for a clear structural view. Similar to the first embodiment of the coupling device 400, the second embodiment of the coupling device 500 includes a plurality of discrete conductive elements (e.g., “bars”) 510, 520, 530, and 540 that provide both mechanical and electrical connections between the two circuit boards. The conductive alignment device 500 may include any suitable number (e.g., four) of discrete conductive elements, for example, between two and eight. Each conductive element has a first end electrically connected to the first board and a second end electrically connected to the secondary board. The electrical connection between the conductive element and the circuit board can be fixed (e.g., permanently fixed) by soldering the element to pins on the circuit board (e.g., the first or secondary circuit board).

[0050] In one or more embodiments, a plurality of conductive elements of the conductive alignment device 500 provide two or more isolated electrical paths between the first circuit board and the secondary circuit board. In one or more embodiments, one or more connection pins on the first circuit board (and / or one or more conductive elements of the conductive alignment device) are used only for mechanical support and do not establish electrical paths. In one or more embodiments, all conductive elements of the conductive alignment device 500 are used to establish one or more electrical paths between the first circuit board and the secondary circuit board.

[0051] When the conductive elements of the conductive alignment device (400, 500) provide one or more electrical paths between the first circuit board and the secondary circuit board, the circuit boards can use these electrical paths to send and receive electrical signals (e.g., electrical signals that encode messages). For example, the primary circuit board can use the conductive elements to send signals to optical devices on the secondary circuit board (e.g., to configure and / or control the operation of the optical devices) and / or receive signals from the optical devices (e.g., signals indicating the characteristics of the optical signals received by the optical devices or indicating the characteristics of the environment of the optical devices, including but not limited to distance to a reflective target, reflectivity of the reflective target, optical signal strength, etc.).

[0052] Unlike the configuration of some conductive elements in the first embodiment of the conductive alignment device 400, the conductive elements 510, 520, 530, and 540 in the second embodiment of the conductive alignment device 500 are substantially non-parallel to each other. Instead, as can be seen in... Figure 7 As seen in Figure 8B, the conductive elements are bent inwards (e.g., the middle portions of selected pairs of conductive elements are closer to each other than the first and / or second ends of identical pairs of conductive elements) for improved mechanical support. In some configurations, the first ends of the pairs of conductive elements bent inwards relative to each other may be connected to the opposite side of the first circuit board 310, and their second ends to the same side of the secondary circuit board 320. Examples of such pairs of conductive elements are shown in Figure 8A (e.g., conductive elements 510 and 530, or conductive elements 520 and 540). Other configurations are possible. For example, the first ends of the pairs of conductive elements bent inwards relative to each other may be connected to the same side of the first circuit board 310, and their second ends to the opposite side of the secondary circuit board 320. Alternatively, the first ends of the pairs of conductive elements bent inwards relative to each other may be connected to the opposite side of the first circuit board 310, and their second ends to the opposite side of the secondary circuit board 320. Furthermore, the filler 550 may be disposed within the internal space defined by the conductive elements of the conductive alignment device. In one or more embodiments, the filler 550 is elastic or semi-elastic to further enhance the mechanical strength of the conductive alignment device and / or help absorb vibrations or shocks during deployment operations.

[0053] Although both the first embodiment of the conductive alignment device 400 and the second embodiment of the conductive alignment device 500 are shown as having four conductive elements for balancing the connection, those skilled in the art will recognize that other numbers of conductive elements (e.g., 2-8) can be used for the connection. In some embodiments, the conductive elements may have an outward curvature rather than an inward curvature (e.g., the middle portion of a selected pair of conductive elements may be further away from each other than the first and / or second ends of the same pair of conductive elements). All such variations fall within the scope of some embodiments of the conductive alignment device.

[0054] An example has been described in which a conductive alignment device (400, 500) is used to connect a secondary circuit board to a primary circuit board. In some embodiments, the conductive alignment device is used to connect other secondary devices (e.g., secondary packages, secondary sub-mount devices, etc.) to the primary circuit board. Figure 9This is a perspective view of a first circuit board 910 according to one or more embodiments, which is connected to a plurality of secondary sub-mounting devices 920a-920d via corresponding conductive alignment devices 900a-900d. In one or more embodiments, each of the secondary devices 920 may include a sub-mount 950 and a mounted component 960. Some embodiments of the sub-mount and mounted component are further described in detail below.

[0055] Any suitable sub-mount 950 can be used. In some embodiments, the sub-mount 950 includes a base layer 952 and (optionally) a protective cap 954. The base layer 952 may include any suitable layer of material providing mechanical support for the mounting component 960. Via holes may be formed in the base layer 952, and these via holes may be plated and / or filled with a conductive material (e.g., copper or aluminum) to form vias. Contact pads electrically connected to the vias may be formed on the opposite side of the base layer 952, for example by plated metal traces and forming a metal trace pattern. In this way, a conductive path can be formed from one side of the base layer 952 to the other side. The sub-mount 950 may also include features providing electrical connections (e.g., die attach pads, traces, etc.), features dissipating heat, features providing optical functions (e.g., reflectors and / or lenses), and / or features providing other functions.

[0056] The protective cap 954 protects the mounting component 960 from environmental damage (e.g., oxidation, contamination due to dust and / or moisture, etc.). In some embodiments, the protective cap hermetically seals the upper surfaces of the mounting component 960 and the substrate 952. In some embodiments, the protective cap 954 is a layer of material formed over the mounting component 960 and the substrate 952. In some embodiments, the protective cap is formed separately relative to the substrate and attached (e.g., sealed) to the substrate after the component 960 is mounted. The protective cap 954 may be formed of any suitable material that protects the mounting component without interfering with its operation (e.g., without interfering with the transmission and / or detection of optical signals).

[0057] Any suitable component 960 (e.g., electronic component, optical component, optoelectronic component, etc.) may be mounted on the bottom layer 952 of the sub-mount 950. In some embodiments, the mounting component 960 includes a light emitter and / or a light detector, the light emitter including a laser diode for light transmission, and the light detector including a photodiode for light detection. In some embodiments, the mounting component 960 is electrically connected to one or more vias formed in the bottom layer of the sub-mount 950 (e.g., through contact pads formed on the top side of the bottom layer).

[0058] exist Figure 9In the example, secondary device 920 is coupled to first circuit board 910 via conductive alignment device 900, which includes a plurality of discrete conductive elements (e.g., "bars") 901, 902 providing both mechanical and electrical connections between secondary device 920 and first circuit board 910. Some embodiments of the conductive alignment device have been described above. In some embodiments, the conductive bars (901, 902) of conductive alignment device 900 are electrically connected to vias in underlying layer 952 (e.g., via contact pads formed on the bottom side of the underlying layer). Figure 9 In the example, grooves (911, 912) are formed in the first circuit board 910, and the conductive rods of the conductive alignment device 920 can be inserted into the grooves to establish a stable mechanical connection between the first circuit board 910 and the secondary device 920.

[0059] Figure 10 and Figure 11 Methods for coupling and aligning a plurality of secondary devices are described according to one or more embodiments. Those skilled in the art will recognize that in some embodiments of the disclosed methods: (1) certain steps may be omitted; (2) certain steps may be performed in a different order than the particular order set forth herein; and (3) certain steps may be performed simultaneously.

[0060] Figure 10 A method 1000 for coupling and aligning a plurality of secondary devices at a device level is described according to one or more embodiments. In step 1005, a first circuit board is coupled to one or more secondary devices via one or more respective conductive alignment devices for coarse alignment. Each of the conductive alignment devices may be a coupling device 400, 500, 900, or other variations. After all secondary devices have been coupled to the first circuit board, in step 1010, the first circuit board and the coupled secondary devices are finely aligned at the device level such that each secondary device is in a desired position relative to the first circuit board and relative to other secondary devices. In one or more embodiments, fine alignment may involve applying a predetermined force (e.g., by pushing, pulling, and / or twisting the conductive elements of one or more secondary devices and / or one or more conductive alignment devices) to move one or more secondary devices to the desired alignment position. Once the predetermined force is withdrawn, the conductive alignment devices are able to hold one or more secondary devices in the alignment position due to the aforementioned semi-rigid structure of the conductive alignment devices.

[0061] In some cases, electronic devices (e.g., LIDAR sensors) may include blocks containing a group of first circuit boards, which may be arranged in a stacked configuration. Figure 11 A method 1100 for connecting and aligning a plurality of secondary devices at a block level is described according to one or more embodiments.

[0062] In step 1105, two or more first circuit boards are coupled to corresponding groups of one or more secondary devices via respective conductive alignment devices for coarse alignment. In step 1110, two or more circuit boards with their respective groups of coarsely aligned secondary devices are stacked to form a block. This block may be a light emitter block, a light detector block, or a combination of light emitter and detector blocks. In step 1115, the secondary devices are finely aligned relative to each other and relative to the first circuit boards, such that each secondary device is in a desired position relative to the first circuit boards and other secondary devices. Similar to... Figure 10 The process illustrated, where fine alignment at the block level may involve applying a predetermined force (e.g., by pushing, pulling, and / or twisting one or more secondary devices and / or the conductive elements of one or more conductive alignment devices) to move one or more secondary devices to a desired alignment position. Once the predetermined external mechanical force is withdrawn, the conductive alignment device is able to hold the secondary devices in their alignment position due to the aforementioned semi-rigid structure of the conductive alignment device.

[0063] Further description of some embodiments

[0064] While this specification contains numerous specific implementation details, these should not be construed as limiting the scope of what may be claimed, but rather as descriptions of specific features of particular embodiments. Certain features described in the context of individual embodiments in this specification may also be implemented in combination in a single embodiment. Conversely, multiple features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments. Furthermore, although features may be described above as operating in certain combinations, and even initially claimed in this way, in some cases one or more features from the claimed combination may be removed from that combination, and the claimed combination may involve sub-combinations or variations thereof.

[0065] Specific embodiments of this subject matter have been described. Other embodiments are within the scope of the appended claims. For example, the actions listed in the claims may be performed in a different order and still achieve the desired result. As an example, the processes depicted in the drawings do not necessarily require the specific order or sequence shown to achieve the desired result. Other steps or stages may be provided from the described process, or steps or stages may be omitted from the described process. Therefore, other implementations are within the scope of the appended claims.

[0066] the term

[0067] The wording and terminology used in this document are for descriptive purposes and should not be considered restrictive.

[0068] The terms “approximately,” “approximately equal to,” and other similar phrases (e.g., “X has a value of approximately Y” or “X is approximately equal to Y”) used in the specification and claims shall be understood to indicate that a value (X) is within a predetermined range of another value (Y). Unless otherwise indicated, the predetermined range may be plus or minus 20%, 10%, 5%, 3%, 1%, 0.1%, or less than 0.1%.

[0069] Unless explicitly stated otherwise, the indefinite articles “a” and “an” as used in the specification and claims shall be understood to mean “at least one”. The phrase “and / or” as used in the specification and claims shall be understood to mean “one or both” of the elements so combined, i.e., elements that exist in combination in some cases and separately in others. Multiple elements listed using “and / or” shall be interpreted in the same manner, i.e., “one or more” of the elements so combined. In addition to the elements specifically identified by the “and / or” clause, other elements may optionally exist, whether related to or unrelated to those specifically identified elements. Thus, as a non-limiting example, when used in conjunction with open-ended language such as “comprising,” in one embodiment, a reference to “A and / or B” may refer only to A (optionally including elements other than B); in another embodiment, only to B (optionally including elements other than A); in yet another embodiment, both A and B (optionally including other elements); and so on.

[0070] As used in the specification and claims, “or” should be understood to have the same meaning as “and / or” as defined above. For example, when separating items in a list, “or” or “and / or” should be interpreted as inclusive, that is, including at least one of a plurality of or listed elements, but also including more than one, and optionally including additional unlisted items. Only terms that explicitly indicate the opposite (such as “only one of…” or “exact one of…” or, when used in the claims, “consisting of…”) will refer to exactly one of a plurality of or listed elements. Generally, when preceded by an exclusive term such as “any,” “one of…,” “only one of…” or “exact one of…”, the term “or” as used should only be interpreted as indicating an exclusive alternative (i.e., “one or the other, but not both”). When used in the claims, “consisting substantially of…” should have the ordinary meaning as it is used in the field of patent law.

[0071] As used in the specification and claims, when referring to a list of one or more elements, the phrase "at least one" should be understood to mean at least one element selected from any one or more elements in the list, but does not necessarily include every and at least one of the elements specifically listed in the list, and does not exclude any combination of elements in the list. This definition also allows for the optional presence of elements other than those specifically identified in the list of elements referred to by the phrase "at least one," whether related to or unrelated to those specifically identified elements. Therefore, as a non-limiting example, "at least one of A and B" (or equivalently, "at least one of A or B", or equivalently, "at least one of A and / or B") in one embodiment may refer to at least one (optionally including more than one) A, wherein B is absent (and optionally includes elements other than B); in another embodiment, it may refer to at least one (optionally including more than one) B, wherein A is absent (and optionally includes elements other than A); in yet another embodiment, it may refer to at least one (optionally including more than one) A and at least one (optionally including more than one) B (and optionally includes other elements); and so on.

[0072] The use of “including,” “containing,” “having,” “containing,” “involving,” and their variations is intended to cover the items listed thereafter and any additional items.

[0073] The use of ordinal numbers such as "first," "second," and "third" to modify claim elements in the claims does not indicate any priority, order of precedence, or sequence of actions of a method relative to another claim element. Ordinal numbers are used solely as labels to distinguish one claim element with a specific name from another element with the same name (other than the use of ordinal numbers), thus differentiating claim elements.

[0074] Therefore, having described various aspects of at least one embodiment of the invention, it should be appreciated that many changes, modifications, and alterations will readily occur to those skilled in the art. These changes, modifications, and alterations are intended to be part of this disclosure and are intended to remain within the spirit and scope of the invention. Therefore, the foregoing description and drawings are merely illustrative.

Claims

1. An electronic device comprising: Secondary devices; and A connecting device, which is connected to the secondary device. The connecting device includes multiple conductive components, and the multiple conductive components include at least a first conductive component and a second conductive component. Each of the conductive components includes a first end configured to be electrically and mechanically connected to a primary circuit board and a second end configured to be electrically and mechanically connected to the secondary device. Wherein, the second end of the first conductive member is connected to the first side of the secondary device, and the second end of the second conductive member is connected to the second side of the secondary device, the second side of the secondary device being opposite to the first side of the secondary device. The shape and / or orientation of each of the plurality of conductive members can be adjusted in response to a corresponding force applied to the corresponding conductive member above a corresponding threshold level, and each of the plurality of conductive members is configured to retain its adjusted shape and / or orientation after the corresponding force is removed.

2. The electronic device according to claim 1, characterized in that, Each of the plurality of conductive components includes a corresponding semi-rigid rod.

3. The electronic device according to claim 1, characterized in that, The electronic device also includes the primary circuit board.

4. The electronic device according to claim 3, characterized in that, The plurality of conductive components provide at least two electrical paths between the primary circuit board and the secondary device.

5. The electronic device according to claim 3, characterized in that, The secondary device includes an optical transmitter or an optical receiver.

6. The electronic device according to claim 3, characterized in that, The electronic device further includes a plurality of secondary devices comprising the secondary device, wherein each of the secondary devices includes a corresponding light emitter or a corresponding light receiver.

7. The electronic device according to claim 3, characterized in that, The first end of the first conductive member is connected to the first side of the primary circuit board, and the first end of the second conductive member is connected to the second side of the primary circuit board, the second side of the primary circuit board being opposite to the first side of the primary circuit board.

8. The electronic device according to claim 7, characterized in that, The plurality of conductive components apply force to the secondary device to maintain a stable position and orientation of the secondary device relative to the primary circuit board.

9. The electronic device according to claim 8, characterized in that, The stable position and orientation of the secondary device relative to the primary circuit board are determined based on multiple characteristics of the conductive member, including: the position of a corresponding region on the secondary device near a corresponding second end of the conductive member, the position of a corresponding region on the primary circuit board near a corresponding first end of the conductive member, and the corresponding length, shape, and orientation of the conductive member.

10. The electronic device according to claim 8, characterized in that, The respective shapes and / or orientations of the plurality of conductive components are adjustable to change the stable position and stable orientation of the secondary device relative to the primary circuit board.

11. The electronic device according to claim 8, characterized in that, The plurality of conductive members maintain a gap location between the end of the secondary device and the adjacent end of the primary circuit board, the gap location being oriented in a plane substantially parallel to the end plane of the secondary device, and wherein the plurality of conductive members extend across the gap location.

12. The electronic device according to claim 1, characterized in that, The secondary device includes optical components mounted on a secondary circuit board or a sub-mount.

13. An alignment method, comprising: Multiple secondary devices are connected to a primary circuit board via corresponding multiple connection devices, wherein each of the connection devices includes corresponding multiple conductive members, wherein connecting the secondary devices to the primary circuit board includes electrically and mechanically connecting a first terminal of each of the conductive members to the primary circuit board, and wherein a second terminal of each of the conductive members is electrically and mechanically connected to a corresponding secondary device; and After the secondary devices are connected to the primary circuit board, each of the secondary devices is aligned relative to the primary circuit board and relative to one or more of the secondary devices, while maintaining the electrical and mechanical connections between the primary circuit board and each of the secondary devices, wherein aligning each of the secondary devices includes adjusting the position and / or orientation of each of the secondary devices.

14. The alignment method according to claim 13, characterized in that, Each conductive component in each group of multiple conductive components includes a corresponding semi-rigid rod.

15. The alignment method according to claim 13, characterized in that, Each secondary device includes either an optical transmitter or an optical receiver.

16. The alignment method according to claim 13, characterized in that, The plurality of conductive members maintain gap locations between the plurality of ends of the secondary device and adjacent ends of the primary circuit board, wherein the gap locations are oriented in a plane substantially parallel to the end plane of the secondary device, and wherein the plurality of conductive members extend across the gap locations.

17. The alignment method according to claim 13, characterized in that: The plurality of secondary devices includes specific secondary devices. The plurality of connection devices includes specific connection devices for connecting the specific secondary device to the primary circuit board. The specific connection device includes at least a first conductive member and a second conductive member, wherein the second end of the first conductive member is connected to the first side of the secondary device, and The second end of the second conductive member is connected to the second side of the secondary device, which is opposite to the first side of the secondary device.

18. The alignment method according to claim 17, characterized in that, The specific connection device has multiple conductive components that provide at least two electrical paths between the primary circuit board and the specific secondary device.

19. The alignment method according to claim 17, characterized in that, The first end of the first conductive member is connected to the first side of the primary circuit board, and the first end of the second conductive member is connected to the second side of the primary circuit board, the second side of the primary circuit board being opposite to the first side of the primary circuit board.

20. The alignment method according to claim 19, characterized in that, Multiple conductive components of the specific connection device apply force to the specific secondary device to maintain a stable position and orientation of the specific secondary device relative to the primary circuit board.

21. The alignment method according to claim 20, characterized in that, The stable position and orientation of the specific secondary device relative to the primary circuit board are determined based on multiple characteristics of the conductive components of the specific connection device, including: The location of a corresponding region on the secondary device near the corresponding second end of the conductive member of the specific connection device, and the location of a corresponding region on the primary circuit board near the corresponding first end of the conductive member of the specific connection device, and The corresponding length, shape, and orientation of the conductive components of the specific connection device.

22. The alignment method according to claim 20, characterized in that, The respective shapes and / or orientations of the multiple conductive components of the particular connection device are adjustable to change the stable position and stable orientation of the particular secondary device relative to the primary circuit board.

23. The alignment method according to claim 22, characterized in that, The shape and / or orientation of each of the plurality of conductive elements of the particular connection device can be adjusted in response to a corresponding force applied to the corresponding conductive element of the particular connection device above a corresponding threshold level, and wherein each of the plurality of conductive elements of the particular connection device is configured to retain its adjusted shape and / or orientation after the corresponding force is removed.

24. The alignment method according to claim 13, characterized in that, Each of the secondary devices includes optical components mounted on a secondary circuit board or a sub-mount.

Images