Atomizing core, atomizer and electronic atomization device

Abstract

The present application discloses an atomization core, an atomizer and an electronic atomization device. The atomization core includes a substrate, a heating element and a conductor lead. The substrate has an atomization surface and a through hole extending to the atomization surface; the substrate is used to guide the aerosol generating matrix to the atomization surface; the heating element is disposed on the atomization surface and is used to heat and atomize the aerosol generating matrix to generate aerosol; the conductor lead is disposed in the through hole and is fixedly formed with the substrate into an integral structure. Wherein, the first end of the conductor lead is electrically connected to the heating element, and the second end is used to connect to a power supply component. By arranging the conductor lead inside the substrate, the present application changes the direction of connection between the heating element and the power supply, avoids the lead from blocking the atomization surface, solves the problem that the contact stability between the conductor lead and the substrate of the ceramic atomization core is poor and is easily damaged, and maximally improves the atomization conversion efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of atomizers, and specifically relates to an atomization core, an atomizer and an electronic atomization device. Background Art

[0002] In related technologies, an electronic atomization device mainly consists of an atomizer and a power supply component. Among them, the atomization core in the atomizer is a core component, and the atomization core mainly includes a ceramic atomization core and a liquid guiding cotton atomization core. The traditional ceramic atomization core is a ceramic substrate with a heating film resistor screen-printed and sintered on its surface and a set of conductor leads connected to the power supply sintered thereon. However, the contact stability between the conductor leads and the substrate of the ceramic atomization core is poor and it is easy to be damaged. Summary of the Invention

[0003] In view of this, the present application provides an atomization core, an atomizer and an electronic atomization device to solve the problem that the contact stability between the conductor leads and the substrate of the ceramic atomization core in the prior art is poor and it is easy to be damaged.

[0004] To solve the above technical problems, the first technical solution provided by the present application is: to provide an atomization core, including a substrate, a heating element and conductor leads. The substrate has an atomization surface and a through hole extending to the atomization surface; the substrate is used for guiding an aerosol generating matrix to the atomization surface; the heating element is arranged on the atomization surface and is used for heating and atomizing the aerosol generating matrix to generate an aerosol; the conductor leads are arranged in the through hole and are fixed to form an integral structure with the substrate; wherein, the first end of the conductor leads is electrically connected to the heating element, and the second end is used for connecting to a power supply component.

[0005] Wherein, the side wall of the conductor leads has a protrusion, and the side wall of the through hole has a recess, and the protrusion is embedded in the recess.

[0006] Wherein, the conductor leads are solid conductors, or the conductor leads have pores inside.

[0007] Wherein, the solid part of the conductor leads accounts for more than 50% of the volume of the through hole.

[0008] Wherein, the substrate has a first surface and a second surface arranged opposite to each other, and the first surface is the atomization surface; the through hole extends from the first surface to the second surface.

[0009] Wherein, the through hole is a straight through hole perpendicular to the first surface.

[0010] Wherein, the atomization core further includes an electrode and a pad. The electrode is arranged on the first surface and is electrically connected to the heating element; the pad is arranged on the second surface and is used for connecting to a power supply component;

[0011] Wherein, the first end of the conductor lead is electrically connected to the electrode, and the second end is electrically connected to the pad.

[0012] Wherein, the wire diameter of the conductor lead is 0.1 - 1 mm; and / or, the material used for the conductor lead is one or more of Ag, Cu, and Au.

[0013] Wherein, the substrate is a porous substrate; the porosity of the substrate is 30 - 80%; and / or, the pore diameter range of the pores of the substrate is 10 - 200 μm.

[0014] Wherein, the conductor lead is prepared by a method of filling a conductive paste in the through - hole and then sintering.

[0015] Wherein, the substrate has a first surface and a second surface which are oppositely arranged, and a side surface connecting the first surface and the second surface; the first surface is the atomizing surface; the through - hole extends from the first surface to the side surface.

[0016] To solve the above - mentioned technical problems, the second technical solution provided by this application is: to provide an atomizer, including a housing and an atomization core. The housing has a receiving cavity; the atomization core is arranged in the receiving cavity and cooperates with the housing to form a liquid storage cavity; the atomization core is used for heating and atomizing the aerosol - generating matrix from the liquid storage cavity when powered on to form an aerosol; wherein, the atomization core is the atomization core described in any one of the above.

[0017] To solve the above - mentioned technical problems, the third technical solution provided by this application is: to provide an electronic atomization device, including an atomizer and a power supply component; wherein, the atomizer is the atomizer described in any one of the above; the power supply component is electrically connected to the conductor lead of the atomizer and is used for supplying power to the atomizer.

[0018] The beneficial effects of this application: Different from the prior art, the atomization core of this application includes a substrate, a heating element, and a conductor lead. The substrate has an atomizing surface and a through - hole extending to the atomizing surface; the substrate is used for guiding the aerosol - generating matrix to the atomizing surface; the heating element is arranged on the atomizing surface and is used for heating and atomizing the aerosol - generating matrix to generate an aerosol; the conductor lead is arranged in the through - hole and is fixedly formed as an integral structure with the substrate; wherein, the first end of the conductor lead is electrically connected to the heating element, and the second end is used for connecting to the power supply component. By arranging the conductor lead in the substrate to form an integral structure with the substrate, this application changes the connection direction between the heating element and the power supply, avoids the lead from blocking the atomizing surface, solves the problem that the contact stability between the conductor lead and the substrate of the ceramic atomization core is poor and is easily damaged, and maximally improves the atomization conversion efficiency. Description of the Drawings

[0019] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0020] Figure 1 is a schematic structural diagram of an electronic atomization device provided by the present application;

[0021] Figure 2 is a schematic structural diagram of an atomizer provided by the present application;

[0022] Figure 3 is a schematic structural diagram of an atomization core in an embodiment provided by the present application;

[0023] Figure 4 is Figure 3 a front view structural diagram of the atomization core provided;

[0024] Figure 5 is Figure 3 a bottom view structural diagram of the atomization core provided;

[0025] Figure 6 is Figure 5 a sectional view of the first embodiment of the atomization core in the A-A direction provided;

[0026] Figure 7 is Figure 5 a sectional view of the second embodiment of the atomization core in the A-A direction provided;

[0027] Figure 8 is Figure 5 a sectional view of the third embodiment of the atomization core in the A-A direction provided;

[0028] Figure 9 is Figure 5 a sectional view of the fourth embodiment of the atomization core in the A-A direction provided;

[0029] Figure 10 is a schematic structural diagram of an atomization core in another embodiment provided by the present application;

[0030] Figure 11 is a side sectional view of the connection between a conductor lead and a substrate in an embodiment provided by the present application;

[0031] Figure 12 is a structural sectional view of the first embodiment of the conductor lead provided by the present application;

[0032] Figure 13 is a structural sectional view of the second embodiment of the conductor lead provided by the present application;

[0033] Figure 14 It is a structural cross-sectional view of the third embodiment of the conductor lead provided by the present application;

[0034] Figure 15 It is a cross-sectional view of the connection structure of the substrate and the conductor lead provided by the present application. Specific Embodiments

[0035] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0036] The terms "first", "second" in the present application are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one of the features. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0037] Referring to "embodiment" herein means that a specific feature, structure or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0038] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of the electronic atomization device provided by the present application.

[0039] The electronic atomization device includes an atomizer 1 and a power supply component 2. The power supply component 2 is connected to the atomizer 1 and is used to supply power to the atomizer 1. The electronic atomization device can be used for the atomization of liquid matrices. The atomizer 1 is used to store the liquid aerosol generating matrix and atomize the aerosol generating matrix to form an aerosol for the user to inhale. The liquid aerosol generating matrix can be a liquid matrix such as a medicinal solution, a plant leaf aerosol generating matrix, etc. The atomizer 1 can be specifically used in different fields, such as medical treatment, beauty, and recreational inhalation. The power supply component 2 includes a battery (not shown in the figure), an air flow sensor (not shown in the figure), a controller (not shown in the figure), etc.; the battery is used to supply power to the atomizer 1 and control the heating power, heating duration, etc. of the atomizing core 20, so that the atomizer 1 can atomize the aerosol generating matrix to form an aerosol. The air flow sensor is used to detect the air flow change in the electronic atomization device, and the controller starts the electronic atomization device according to the air flow change detected by the air flow sensor. The atomizer 1 and the power supply component 2 can be integrally provided or detachably connected, and are designed according to specific needs.

[0040] Please refer to Figure 2 , Figure 2 which is a schematic structural diagram of the atomizer provided by this application.

[0041] The atomizer 1 includes a housing 10 and an atomizing core 20. The housing 10 has a receiving cavity 11. The atomizing core 20 and the housing 10 can be integrally provided and non-detachably connected, or can be detachably connected. In this embodiment, the atomizing core 20 and the housing 10 are detachably connected, and the atomizing core 20 is directly connected to the housing 10, so that a detachable connection can be achieved between the atomizing core 20 and the housing 10 without introducing an additional conduit, reducing the volume of the atomizer 1 and making it more convenient to use. It can be understood that the atomizer 1 of this application is a portable atomizer. The atomizing core 20 is disposed in the receiving cavity 11 and cooperates with the housing 10 to form a liquid storage cavity 12 for storing the aerosol generating matrix. The atomizing core 20 can be used in different fields, such as drug atomization, oil leaf flower liquid atomization, etc., and is used to heat and atomize the aerosol generating matrix from the liquid storage cavity 12 to form an aerosol when powered on. The atomizer 1 can also include a mounting seat (not labeled in the figure) for mounting the atomizing core 20.

[0042] Specifically, a protrusion (not shown in the figure) is provided on the outer wall surface of the atomization core 20, a sliding groove (not shown in the figure) is provided on the outer wall surface of the housing 10, and a limiting block (not shown in the figure) is provided in the sliding groove; the protrusion on the atomization core 20 is aligned with the sliding groove on the housing 10 and inserted, and the atomization core 20 or the housing 10 is rotated so that the protrusion is limited by the limiting block in the sliding groove, thereby realizing the fixation of the atomization core 20 and the housing 10, and further realizing the detachable connection between the atomization core 20 and the housing 10. It can be understood that a protrusion can also be provided on the outer wall surface of the housing 10, a sliding groove can be provided on the outer wall surface of the atomization core 20, and a limiting block can be provided in the sliding groove to realize the detachable connection between the atomization core 20 and the housing 10; the detachable connection between the atomization core 20 and the housing 10 can also be realized by means of magnetic attraction; as long as the detachable connection between the atomization core 20 and the housing 10 is realized, the specific implementation manner is not limited.

[0043] In one embodiment, the atomization surface of the atomization core 20 faces upward, which can increase the atomization amount. When the atomization surface faces upward, the pins (not shown in the figure) of the atomization core 20 can be provided at any position of the atomization core 20, and in this embodiment, the pins are arranged downward, which can facilitate the automated assembly of the atomizer 1. A suction channel 30 is provided on the side of the atomization core 20 away from the power supply assembly 2, and the suction channel 30 communicates with the atomization chamber 201. The suction port 31 on the side of the suction channel 30 away from the power supply assembly 2 communicates with the atmosphere, so that the aerosol in the atomization chamber 201 can flow out through the suction channel 30 and be provided to the user for inhalation from the suction port 31.

[0044] Please refer to Figure 3 and Figure 4 , Figure 3 is a schematic structural diagram of an atomization core in an embodiment provided by the present application, Figure 4 is Figure 3 a front view structural diagram of the atomization core provided by

[0045] In one embodiment, the atomization core 20 includes a base body 21, a heating element 22, and a conductor lead 23.

[0046] Specifically, the base body 21 can be a porous base body or a perforated dense base body. Among them, the porous base body can specifically be a porous ceramic base body, and the perforated dense base body can be a perforated glass base body or a dense ceramic base body, etc. The base body 21 in this embodiment is a porous ceramic. Porous ceramic materials are generally ceramic materials sintered at high temperature from components such as aggregates, binders, and pore-forming agents, and have a large number of pore structures that communicate with each other and with the material surface inside. Due to the excellent properties of porous ceramic materials such as high porosity, stable chemical properties, large specific surface area, small volume density, low thermal conductivity, and high temperature and corrosion resistance, they have many applications in the fields of metallurgy, biology, energy, environmental protection, etc.

[0047] The substrate 21 can be in the shape of a flat plate or a stepped shape, etc., and the present application does not make specific limitations thereto. The substrate 21 has a first surface 213 and a second surface 214. The first surface 213 is the surface of the substrate 21 facing the liquid storage cavity 12, and the second surface 214 is the surface of the substrate 21 facing away from the first surface 213. Both the first surface 213 and the second surface 214 can be flat planes, and the first surface 213 and the second surface 214 can also be non-regular surfaces such as curved surfaces. The present application does not make specific limitations thereto. For example, if a groove (not shown in the figure) is provided on one side of the first surface 213 of the substrate 21, the surface of the groove also belongs to the first surface 213.

[0048] The substrate 21 has an atomization surface 211 and through holes 212 extending to the atomization surface 211. The substrate 21 is used to guide the aerosol generating matrix to the atomization surface 211. In this embodiment, the porosity of the substrate 21 is 30-80%, and / or the pore diameter range of the pores of the substrate 21 is 10-200 um; it can be understood that the higher the porosity of the substrate 21, the faster its liquid guiding speed; at the same time, the pore diameter of the pores of the substrate 21 is related to the protrusion of the conductor lead 23. This range can make the matching rate between the conductor lead 23 and the substrate 21 the highest, and at the same time facilitate the conduction of the conductor lead 23 and the substrate 21 to guide the aerosol generating matrix. In this embodiment, the aperture of the through hole 212 is 0.1-1 mm. In other embodiments, the aperture of the through hole 212 and the porosity of the substrate 21 can be set as required, and the present application does not make limitations thereto.

[0049] Please refer to Figures 5 to 8 , Figure 5 is Figure 3 the schematic bottom view structure of the atomization core provided, Figure 6 is Figure 5 the sectional view of the first embodiment of the atomization core in the A-A direction provided, Figure 7 is Figure 5 the sectional view of the second embodiment of the atomization core in the A-A direction provided, Figure 8 is Figure 5 the sectional view of the third embodiment of the atomization core in the A-A direction provided, Figure 9 is Figure 5 the sectional view of the fourth embodiment of the atomization core in the A-A direction provided.

[0050] In one embodiment, the substrate 21 has a first surface 213, a second surface 214, and a side surface 215. The second surface 214 is disposed opposite to the first surface 213, and the side surface 215 connects the first surface 213 and the second surface 214. Generally, the first surface 213 can be used to contact an aerosol - generating matrix communicating with the liquid storage cavity 12, and the second surface 214 can be used to contact a gas. The gas contact here can be that the second surface 214 contacts external air, contacts the air in the atomization cavity 201, or contacts the air in the suction channel 30, etc.

[0051] In this embodiment, the aerosol - generating matrix on one side of the second surface 214 of the substrate 21 penetrates through a large number of pore structures that communicate with each other and with the material surface inside the substrate 21 to the side where the first surface 213 of the substrate 21 is located. The heating element 22 is disposed on the first surface 213 to atomize the aerosol - generating matrix that penetrates to the first surface 213. The side surface 215 is also communicated with the pore structure, so the side surface 215 can also be used for liquid conduction or ventilation.

[0052] As Figure 3 and Figure 4 shown, in the first embodiment, the substrate 21 has a relatively - disposed first surface 213 and second surface 214, and the first surface 213 is the atomization surface 211. The through - hole 212 extends from the first surface 213 to the second surface 214. The substrate 21 can absorb liquid from the side surface 215 for aerosol atomization, and can also absorb liquid from the second surface 214 for aerosol atomization.

[0053] In the first embodiment, the through - hole 212 is a straight through - hole perpendicular to the first surface 213, which is convenient for preparing the through - hole. When the through - hole 212 is a straight through - hole perpendicular to the first surface 213, it is convenient to perform multi - hole punching on the raw material at one time, and then cut it into multiple substrates 21. At the same time, it is also convenient for mold preparation, with high efficiency.

[0054] In the second embodiment, the substrate 21 also has a relatively - disposed first surface 213 and second surface 214, and a side surface 215 connecting the first surface 213 and the second surface 214; wherein, the first surface 213 is the atomization surface 211, and the through - hole 212 can extend from the first surface 213 to the side surface 215. Specifically, as Figure 7 shown, the through - hole 212 can extend to the side surface 215 in the structure of an inclined hole, that is, the through - hole 212 is a straight hole with a direction facing the side surface 215.

[0055] As Figure 8As shown, in the third embodiment, the through-hole 212 can also be a cornered through-hole connecting the first surface 213 and the side surface 215. When drilling the through-hole 212 from the first surface 213 to the side surface 215, it is not easy to demold the mold, and multi-hole drilling cannot be carried out simultaneously, resulting in relatively low drilling efficiency. However, the structure of the through-hole 212 extending from the first surface 213 to the side surface 215 can achieve liquid absorption from the second surface 214 and is suitable for atomizers with downward atomization. In actual use, it can be set according to needs, and the present application does not limit this.

[0056] As Figure 9 shown, in the fourth embodiment, the through-hole 212 can also be a straight through-hole / non-straight through-hole at a certain oblique angle with the first surface 213 or the side surface 215. When the through-hole 212 is a straight through-hole / non-straight through-hole at a certain oblique angle, similarly, it is not easy to demold the mold, and multi-hole drilling cannot be carried out simultaneously, resulting in low drilling efficiency. However, it can absorb liquid from the second surface 214 and is suitable for atomizers with downward atomization, and can be specifically set according to needs. It can be understood that the through-hole 212 can be one or more, and the extension directions can be parallel or non-parallel, as long as they match the number of conductor leads 23, and the present application does not limit this.

[0057] As Figure 3 and Figure 4 shown, the heating element 22 is disposed on the atomization surface 211, and the heating element 22 is used to atomize the aerosol-generating matrix derived from the substrate 21. The atomization surface 211 absorbs the heat of the heating element 22, so as to heat and atomize the aerosol-generating matrix to generate aerosol when powered on. In this embodiment, the heating element 22 adopts a metal heating film, which has good heat conduction effect. In other embodiments, the heating element 22 can also be at least one of a heating coating, a heating circuit, a heating sheet or a heating mesh, and the present application does not limit this.

[0058] In this embodiment, a porous ceramic material is selected to make the substrate 21. The aerosol-generating matrix on one side of the substrate 21 penetrates through a large number of pore structures that are interconnected with each other and communicate with the material surface inside the porous ceramic material to the other side of the substrate 21, and contacts the heating element 22 disposed on one side surface of the substrate 21, so as to atomize the aerosol-generating matrix into aerosol.

[0059] As Figure 3As shown, in one embodiment, the heating element 22 is in an S shape. The heating element 22 can be an integrally formed structure or a detachable structure, which can be specifically set according to needs. In this embodiment, the metal heating film used for the heating element 22 has a thickness of 50 - 120 um, with high heating efficiency and high thermal conductivity, which can improve the atomization efficiency of the aerosol generating matrix. In other embodiments, the heating element 22 can also be rectangular, oval, circular, etc., and the thickness, size, quantity, etc. of the heating element 22 can all be set according to needs, and this application does not limit this.

[0060] As Figure 3 shown, in one embodiment, the atomization core 20 further includes an electrode 24 and a pad 25. The electrode 24 is disposed on the first surface 213 and is electrically connected to the heating element 22. The pad 25 is disposed on the second surface 214 and is used to connect to the power supply assembly 2.

[0061] Specifically, the electrode 24 includes a first electrode 241 and a second electrode 242. The first electrode 241 and the second electrode 242 are spaced apart and are both connected to the heating element 22. The heating element 22 is used to atomize the aerosol generating matrix led out by the substrate 21. Specifically, the heating element 22 can be at least one of a heating coating, a heating circuit, a heating sheet, or a heating mesh. The heating element 22 is electrically connected to the power supply assembly 2 through the electrode 24. The first electrode 241 and the second electrode 242 can be disposed in a part of the area on the atomization surface 211 or can extend to the edge of the atomization surface 211, and this application does not limit this.

[0062] Specifically, as Figure 3 shown, the pad 25 can be set to one or more, and can be set to be cylindrical or cuboid, which can be specifically set according to needs, but needs to match the quantity of the conductor leads 23. One end of the conductor lead 23 is connected to the electrode 24, and the other end is connected to the pad 25. In this embodiment, the pad 25 is two, including a first pad 251 and a second pad 252, and the first pad 251 and the second pad 252 are spaced apart. The first pad 251 and the second pad 252 are respectively connected to the two conductor leads 23, and the conductor leads 23 penetrate through the electrode 24 and the pad 25 up and down. Specifically, the conductor lead 23 includes a first conductor lead 233 and a second conductor lead 234. The first conductor lead 233 penetrates through the first electrode 241 and the first pad 251 up and down, and the second conductor lead 234 penetrates through the second electrode 242 and the second pad 252 up and down, and both ends of the first conductor lead 233 and the second conductor lead 234 are electrically connected to the first electrode 241 / the second electrode 242 and the first pad 251 / the second pad 252 respectively. In other embodiments, the pad 25 can also be disposed on the side surface 215. This setting method can avoid the bending of the conductor leads 23 and the blocking of the liquid absorption of the second surface 214. Therefore, the specific position of the pad 25 can be set according to specific needs, and this application does not limit this.

[0063] Please refer to Figure 10 , Figure 10 which is a schematic structural view of an atomizing core in another embodiment provided by the present application.

[0064] As Figure 10 shown, in another embodiment, the heating element 22 is waist-shaped with wide ends and gradually decreasing in the middle. The two ends of the heating element 22 are respectively connected to the first electrode 241 and the second electrode 242. The first electrode 241 and the second electrode 242 are arranged at intervals and are both connected to the two ends of the waist-shaped heating element 22. In addition, a first pad 251 and a second pad 252 are provided on the second surface 214 of the base 21, wherein the first pad 251 and the second pad 252 are arranged at intervals. The first conductor lead 233 is respectively connected to the first electrode 241 and the first pad 251, and the second conductor lead 234 is respectively connected to the second electrode 242 and the second pad 252. In this embodiment, the metal heating film of the waist-shaped heating element 22 has a thickness of 10-50um, with high heating efficiency and high thermal conductivity, which can improve the atomization efficiency of the aerosol generation matrix.

[0065] Optionally, the first electrode 241 and the first pad 251 can be electrodes and pads of the same size in projection lamination, or electrodes and pads of different sizes. Preferably, they are of the same structural setting in projection lamination, and these two areas can be printed through the same printing screen, which is convenient for preparation.

[0066] As Figure 3 , Figure 4 and Figure 10 shown, in an embodiment, the conductor lead 23 is arranged in the through hole 212. The conductor lead 23 includes a first end 231 and a second end 232. The first end 231 is electrically connected to the electrode 24, and the second end 232 is used to connect to the power supply component 2. Specifically, the first end 231 of the conductor lead 23 is electrically connected to the electrode 24, and the second end 232 is electrically connected to the pad 25.

[0067] Please refer to Figures 11 to 15 , Figure 11 which is a schematic side cross-sectional view of the connection between the conductor lead and the base provided by the present application, Figure 12 which is a structural cross-sectional view of the first embodiment of the conductor lead provided by the present application, Figure 13 which is a structural cross-sectional view of the second embodiment of the conductor lead provided by the present application, Figure 14 which is a structural cross-sectional view of the third embodiment of the conductor lead provided by the present application, Figure 15 which is a structural cross-sectional view of the connection between the base and the conductor lead provided by the present application.

[0068] As Figures 11 to 15As shown, in one embodiment, the conductor lead 23, the electrode 24, and the pad 25 are all disposed in the through-hole 212, and are all prepared by a method of sintering after filling the through-hole 212 with a conductive paste. Optionally, the wire diameter of the conductor lead 23 is 0.1 - 1 mm. The material of the conductor lead 23 is one or more of Ag, Cu, and Au, and can be specifically designed according to needs, and the present application does not limit this.

[0069] Specifically, in this embodiment, a metal or alloy material with the best conductivity, such as one or more combinations of Ag, Cu, Au, etc., is used. By screen-printing the metal wire in the form of a paste of this metal or alloy material into the through-hole 212 and co-firing it with the porous ceramic matrix 21, an integrated structure of the conductor lead 23, the electrode 24, and the pad 25 with the matrix 21 is formed. This integrated structure can be a non-detachable structure. Specifically, this integrated structure is not a structure of punching and inserting a lead, nor a structure of clamping the matrix 21 with the conductor lead 23. At the same time, this integrated structure can be an inseparable and non-detachable structure formed by co-sintering the matrix 21 with the metal or alloy material in the form of a paste.

[0070] The characteristics presented by the conductor lead 23 after co-firing are as follows: The conductor lead 23 penetrates up and down to connect the electrode 24 and the pad 25, and the DC resistance is below 0.1 Ω; the wire diameter of the conductor lead 23 is 0.1 - 1 mm. The solid part of the conductor lead 23 occupies more than 50% of the volume of the through-hole 212, that is, the conductor lead 23 can be a hollow or solid conductor, but the minimum filling rate is 50%. Specifically, the inside of the conductor lead 23 can be a dense structure, such as Figure 12 shown. The inside of the conductor lead 23 can also have pores 235. These pores 235 are natural bubbles formed during the process of filling the through-hole 212 with the metal wire in the form of a paste of the metal or alloy material to form the conductor lead 23. The conductor lead 23 and the matrix 21 of the porous ceramic structure are co-fired to form an integrated structure. After forming, the through-hole 212 of the conductor lead 23 and the matrix 21 is in a co-fired and inlaid form, and it cannot be disassembled or fall off after co-firing and shaping, greatly improving the reliability of the conductor lead 23. Different from the prior art where the lead is disposed outside the matrix 21, or partially disposed inside the matrix 21 and partially disposed outside the matrix 21, the problem that the conductor lead 23 is easily broken or damaged by pulling during the production and assembly processes is solved.

[0071] The pores 235 can be through-holes or blind holes, such as Figure 13 shown, and the pores 235 can be in an irregular pore shape existing in the conductor lead 23. Such as Figure 14As shown, the pore 235 can exist on the surface of the conductor lead 23 or inside the conductor lead 23, and is a bubble naturally formed by sintering the paste-shaped metal wire of a metal or alloy material filled into the through-hole 212. Its shape and size can be in any form, and the present application does not limit this.

[0072] As Figure 15 shown, since the substrate 21 is a porous structure, the side walls of the through-holes 212 formed inside it are in an uneven state. In one embodiment, the side wall of the conductor lead 23 has a protrusion 236, and the side wall of the through-hole 212 has a depression 2121. The protrusion 236 is embedded in the depression 2121, so that the edge where the conductor lead 23 is combined with the substrate 21 is a rough burr, and the combination is more firm, preventing the conductor lead 23 from falling off the substrate 21, and having high stability. It can be understood that since the protrusion 236 is embedded in the pores of the substrate 21, the height of the protrusion 236 is basically the same as the pore diameter of the substrate 21, and the height of the protrusion 236 is 10 - 200 um. In other embodiments, the side walls of the conductor lead 23 and the through-hole 212 can also be in a smooth state, and the present application does not limit this.

[0073] In this embodiment, as Figure 2 、 Figure 3 and Figure 11 shown, a thimble 26 in direct contact with the pad 25 is provided at the bottom of the pad 25 for conducting the heating element 22 and the power supply assembly 2. When the thimble 26 is working, the force application direction thereof is longitudinal, that is, in the direction from the first surface 213 to the second surface 214. When a force is applied to the thimble 26, the interlocking structure of the substrate 21 and the conductor lead 23 can play a limiting role, enhancing the stability of the conductive contact between the two, and at the same time having excellent mechanical properties, preventing the conductor lead 23 from falling off the substrate 21, and the conduction is also more stable.

[0074] The atomization core disclosed in the present application includes a substrate, a heating element, and a conductor lead. The substrate has an atomization surface and through-holes extending to the atomization surface; the substrate is used to guide the aerosol generating matrix to the atomization surface; the heating element is arranged on the atomization surface and is used to heat and atomize the aerosol generating matrix to generate aerosol; the conductor lead is arranged in the through-holes and is fixedly formed with the substrate into an integral structure; wherein, the first end of the conductor lead is electrically connected to the heating element, and the second end is used to connect to the power supply assembly. By arranging the conductor lead inside the substrate to form an integral structure with the substrate, the present application changes the connection direction between the heating element and the power supply, avoids the lead from blocking the atomization surface, solves the problem that the contact stability between the conductor lead and the substrate of the ceramic atomization core is poor and is easily damaged, and maximally improves the atomization conversion efficiency.

[0075] The above are only the embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. An atomization core, characterized in that, Comprising: A substrate having an atomizing surface and a through-hole extending to the atomizing surface; The substrate is used to guide the aerosol-generating matrix to the atomizing surface; A heating element disposed on the atomizing surface for heating and atomizing the aerosol-generating matrix to generate an aerosol; A conductor lead disposed in the through-hole and fixedly formed with the substrate into an integral structure; wherein, the first end of the conductor lead is electrically connected to the heating element, and the second end is used to connect to a power supply component; wherein, the side wall of the conductor lead has a protrusion, and the side wall of the through-hole has a depression, and the protrusion is embedded in the depression, so that the conductor lead and the substrate are combined to form an interlocking structure with uneven edges; when an external force is applied to the atomization core, the interlocking structure limits the conductor lead and the substrate.

2. The atomization core according to claim 1, characterized in that The conductor lead is a solid conductor; or the conductor lead has pores inside.

3. The atomization core according to claim 1, wherein, The solid part of the conductor lead occupies more than 50% of the volume of the through-hole.

4. The atomization core according to claim 1, wherein The substrate has a first surface and a second surface disposed opposite to each other, and the first surface is the atomizing surface; the through-hole extends from the first surface to the second surface.

5. The atomizing core according to claim 4, characterized in that, The through-hole is a straight through-hole perpendicular to the first surface.

6. The atomization core according to claim 4, characterized in that, Further comprising: An electrode disposed on the first surface and electrically connected to the heating element; A pad disposed on the second surface for connecting to a power supply component; Wherein, the first end of the conductor lead is electrically connected to the electrode, and the second end is electrically connected to the pad.

7. The atomization core according to claim 1, characterized in that, The wire diameter of the conductor lead is 0.1-1 mm; and / or, The material used for the conductor lead is one or more of Ag, Cu, and Au.

8. The atomization core according to claim 1, wherein, The substrate is a porous substrate; the porosity of the substrate is 30-80%; And / or, the pore diameter range of the pores of the substrate is 10-200 μm.

9. The atomization core according to claim 1, wherein The conductor lead is prepared by a method of filling a conductive paste in the through-hole and then sintering.

10. The atomization core according to claim 1, characterized in that, The substrate has a first surface and a second surface disposed opposite to each other, and a side surface connecting the first surface and the second surface; the first surface is the atomizing surface; the through-hole extends from the first surface to the side surface.

11. An atomizer, characterized in that, Comprising: A housing having a receiving cavity; An atomization core disposed in the receiving cavity and cooperating with the housing to form a liquid storage cavity; the atomization core is used to heat and atomize the aerosol-generating matrix from the liquid storage cavity to form an aerosol when powered on; wherein, the atomization core is the atomization core according to any one of claims 1-10.

12. An electronic atomization device, characterized in that, Comprising: An atomizer; wherein, the atomizer is the atomizer according to claim 11; A power supply component electrically connected to the conductor lead of the atomizer for supplying power to the atomizer.

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