A highly adjustable bonding apparatus and method of operation thereof

Abstract

The application discloses a height-adjustable bonding device and a working method thereof. The bonding device comprises a bottom plate, a cylinder fixing plate for mounting a jacking cylinder, which is fixedly mounted on the bottom plate through a supporting column, a vacuum adsorption sink fixedly mounted on the bottom plate through a guide shaft, a lifting plate located below the cylinder fixing plate, a bottom part of the lifting plate being connected with an output end of the jacking cylinder through a connecting piece and moving up and down along the guide shaft under the drive of the jacking cylinder, a conveying belt line fixedly mounted on the lifting plate, a transport carrier translating along a conveying direction of the conveying belt under the drive of the conveying belt, and a pressing plate fixedly mounted on the lifting plate through a pressing plate mounting frame and arranged above the conveying belt line. The jacking cylinder drives the lifting plate to move linearly, and then drives the conveying belt line fixedly connected with the lifting plate, the transport carrier carrying a product to be bonded and the pressing plate to move up and down together, so that the height adjustment of the bonding device is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical equipment, and in particular to a height-adjustable bonding device and a working method thereof, which are used for clamping and positioning products with different bonding heights. BACKGROUND

[0002] In microelectronic assembly, wire bonding is a complex assembly and manufacturing technology, which is a key technology for improving the performance of general microelectronic devices, special integrated circuits, thin and thick film hybrid integrated circuits, multi-chip assemblies, system integrated circuits and other microelectronic circuits. In the bonding process, an automatic bonding machine is often used to fix the device to be processed on a clamp, and the bonding head of the automatic bonding machine is used to bond the device to be processed to form a product. However, the vertical stroke distance of the bonding head of the automatic bonding machine is fixed, and the height of the device to be processed is too high or too low to adapt to the height of the bonding head, so it is necessary to manually adjust the position of the clamp multiple times, and the precision control cannot be closed-loop controlled, which has the risk of not being adjusted in place, and after adjustment, manual test needs to be performed multiple times to confirm the effect. In addition, the existing single bonding machine cannot be adjusted in height and cannot be compatible with multiple products for bonding. SUMMARY

[0003] The present application relates to the technical field of mechanical equipment, and in particular to a height-adjustable bonding device and a working method thereof, which are used for clamping and positioning products with different bonding heights.

[0004] To achieve the above-mentioned purpose, the following technical solutions are adopted in the present application:

[0005] The first aspect of the present application provides a height-adjustable bonding device, comprising:

[0006] a bottom plate;

[0007] a cylinder fixing plate, the bottom of which is fixedly installed on the bottom plate through a support column, and a jacking cylinder is fixedly installed on the cylinder fixing plate, and the output end of the jacking cylinder penetrates the cylinder fixing plate downward;

[0008] a vacuum adsorption sink, which is located above the jacking cylinder and is fixedly installed on the bottom plate through a guide shaft; a plurality of adsorption units are arranged on the upper surface of the vacuum adsorption sink, and the adsorption units are in communication with a vacuum circuit through vacuum adsorption holes;

[0009] a lifting plate, which is located below the cylinder fixing plate and is provided with a circular through slot, a linear bearing is arranged in the circular through slot, and the middle part of the guide shaft penetrates the linear bearing; the bottom of the lifting plate is connected to the output end of the jacking cylinder through a connecting piece, and the lifting plate can reciprocate up and down along the guide shaft under the drive of the jacking cylinder;

[0010] The conveying belt line comprises conveying installation plates fixedly installed on the lifting plate and symmetrically arranged on both sides of the vacuum adsorption sink, and the inner side of the conveying installation plate is provided with a conveying belt.

[0011] The transport carrier is used for carrying the product to be bonded and is translated along the conveying direction of the conveying belt under the driving of the conveying belt.

[0012] The pressing plate is erected above the conveying belt line, and the lower surface of the pressing plate is opposite to the upper end surface of the vacuum adsorption sink, and the pressing plate is fixedly installed on the lifting plate through a pressing plate installation frame.

[0013] The conveying belt line conveys the transport carrier to the space between the vacuum adsorption sink and the pressing plate, the lifting cylinder drives the lifting plate to move vertically downward, and then drives the conveying belt line, the transport carrier carrying the product to be bonded and the pressing plate to move vertically downward and press together on the vacuum adsorption sink.

[0014] Preferably, one side of the bottom plate is provided with a side plate arranged vertically to the bottom plate, and a plurality of vacuum pressure gauges are arranged on the side plate, the vacuum pressure gauges are connected with the vacuum circuit, and are used for detecting and displaying the vacuum pressure value in the vacuum circuit; and the vacuum pressure gauges are also electrically connected with the controller.

[0015] Preferably, the vacuum adsorption holes are arranged in a rectangular array on the adsorption unit.

[0016] Preferably, the vacuum circuit is installed below the vacuum adsorption sink, and a vacuum connection hole is arranged on the vacuum circuit, and the vacuum connection hole is connected with a vacuum generating device through a vacuum pipe.

[0017] Preferably, a plurality of positioning pins are arranged on the upper end surface of the vacuum adsorption sink, and a plurality of positioning holes are arranged on the lower end surface of the transport carrier, and the positioning pins are matched with the positioning holes for positioning.

[0018] Preferably, the lifting plate is a rectangular frame, and a hollow area is arranged in the middle of the lifting plate, and the supporting column of the vacuum adsorption sink penetrates the hollow area from top to bottom and is fixedly connected with the bottom plate.

[0019] Preferably, the number of the lifting cylinders is two, and the two lifting cylinders are respectively arranged at the two ends of the cylinder fixing plate.

[0020] Preferably, the conveying belt is arranged on the inner side wall of the conveying installation plate through a belt wheel installed on the conveying installation plate.

[0021] More preferably, the conveying installation plate comprises oppositely arranged first and second conveying installation plates, the first conveying installation plate is provided with a first conveying belt on the inner side wall thereof, and the second conveying installation plate is provided with a second conveying belt on the inner side wall thereof, the first and second conveying belts extend in the same direction and rotate synchronously.

[0022] Further, the outer side of the first and second conveying belts is provided with a set of opposite photoelectric sensors, when the photoelectric sensors sense the presence of a transport carrier, the first and second conveying belts stop conveying.

[0023] Preferably, a support strip is arranged below the conveying belt, when the transport carrier is pressed onto the conveying belt, the support strip supports the conveying belt and the transport carrier.

[0024] Preferably, the bottom of the conveying installation plate is fixedly installed on the lifting plate through an I-shaped block.

[0025] Preferably, the bottom of the lifting plate is further provided with a stroke adjuster, the stroke adjuster is installed on the bottom plate through an adjuster fixing block, the stroke adjuster is a bolt screwed on the adjuster fixing block; when the lower surface of the lifting plate abuts against the stroke adjuster, the stroke adjuster blocks the descent of the lifting plate.

[0026] Preferably, the pressing plate is provided with a hollow unit, the hollow unit corresponds to the bonding area of the transport carrier.

[0027] The second aspect of the present application provides a working method of a height-adjustable bonding device, applied to the height-adjustable bonding device described above, the working method comprises:

[0028] Placing the product to be bonded on the transport carrier, placing the transport carrier on the conveying belt line, and driving the transport carrier to translate along the conveying direction of the conveying belt to the bonding station to stop by the conveying belt line, at this time, the transport carrier is located between the pressing plate and the vacuum adsorption sink;

[0029] The lifting plate is driven by the jacking cylinder to move vertically downward, thereby driving the conveying belt line fixedly connected with the lifting plate, the transport carrier carrying the product to be bonded, and the pressing plate to move vertically downward along the guide shaft; during the descending process, the lower surface of the transport carrier first contacts the vacuum adsorption sink, the product to be bonded contacts the surface of the vacuum adsorption sink, and the transport carrier completes positioning;

[0030] With the continuous descent of the lifting plate, the transport carrier is separated from the conveying belt line, and the state is zero contact;

[0031] The lifting cylinder drives the conveying belt line and the pressing plate to further descend until reaching a preset lower limit position and then stopping descending, at this time, the pressing plate exerts pressure on the product to be bonded to press the warped part of the product to be bonded to be horizontal;

[0032] The vacuum adsorption sink is started to adsorb the lower surface of the transport carrier, and when the value of the vacuum pressure gauge is greater than 85kpa, the bonding is started.

[0033] Compared with the prior art, the technical scheme of the application has the following beneficial effects:

[0034] The application provides a height-adjustable bonding device, which drives the lifting plate to move linearly by a lifting cylinder, and then drives the conveying belt line fixedly connected with the lifting plate, the transport carrier carrying the product to be bonded and the pressing plate to move up and down together, so that the height adjustment of the bonding device is realized, and the bonding device can be compatible with products of different thicknesses and bonding processes of different bonding heights. BRIEF DESCRIPTION OF DRAWINGS

[0035] The accompanying drawings, which form a part of this application, are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and explain various implementations of the application, and do not limit the application. In the drawings:

[0036] Fig. 1 It is a perspective view of a height-adjustable bonding device;

[0037] Fig. 2 It is a perspective view of a height-adjustable bonding device from another angle;

[0038] Fig. 3 It is an exploded structural view of a height-adjustable bonding device;

[0039] Fig. 4 It is an exploded structural view of a height-adjustable bonding device from another angle;

[0040] Fig. 5 It is an exploded structural view of a height-adjustable bonding device from another angle;

[0041] Fig. 6 It is a perspective view of a height-adjustable bonding device from another angle (without a pressing plate, a conveying belt line and a transport carrier).

[0042] LEGEND:

[0043] 1 bottom plate; 2 cylinder fixing plate; 3 support column; 4 jacking cylinder; 5 vacuum adsorption sink; 6 guide shaft; 7 lifting plate; 8 linear bearing; 9 conveying belt line; 10 conveying belt; 11 support strip; 12 I-shaped block; 13 reflection sensor; 14 transport carrier; 15 pressing plate; 16 pressing plate mounting frame; 17 side plate; 18 vacuum pressure gauge; 19 stroke adjuster; 20 adjuster fixing block; 21 conveying mounting plate. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical scheme and effect of the present application more clear and explicit, the present application is further described in detail below with reference to the drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0045] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence, and it should be understood that such data can be interchanged under appropriate circumstances. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not necessarily limit to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0046] Embodiment:

[0047] Reference Figs. 1-6 As shown in the figure, a height-adjustable bonding device comprises a bottom plate 1, a cylinder fixing plate 2, a vacuum adsorption sink 5, a lifting plate 6, a conveying belt line 9, a transport carrier 14 and a pressing plate 15.

[0048] The bottom of the cylinder fixing plate 2 is fixedly installed on the bottom plate 1 by four support columns 3, and two jacking cylinders 4 are fixedly installed on the cylinder fixing plate 2, with the two jacking cylinders 4 respectively located at the two ends of the cylinder fixing plate 2, and the output end of the jacking cylinder 4 downwardly penetrating the cylinder fixing plate 2.

[0049] The vacuum adsorption sink 5 is located above the jacking cylinder 4, and its bottom is fixedly installed on the bottom plate 1 through four guide shafts 6. The upper surface of the vacuum adsorption sink 5 is provided with a plurality of adsorption units, and a plurality of vacuum adsorption holes are arranged in a rectangular array on each adsorption unit. The adsorption unit is in communication with the vacuum circuit through the vacuum adsorption hole. The vacuum circuit is installed below the vacuum adsorption sink 5, and the vacuum circuit is provided with a vacuum connection hole. The vacuum connection hole is connected with a vacuum generating device through a vacuum pipe. Only by controlling the opening and closing of the vacuum generating device through a switch, the opening and closing of the adsorption function can be realized.

[0050] The lifting plate 6 is located below the cylinder fixing plate 2, and the lifting plate 6 is provided with a circular through slot, and a linear bearing 8 is arranged in the circular through slot. The middle part of the guide shaft 6 penetrates through the linear bearing 8. The bottom of the lifting plate 6 is connected with the output end of the jacking cylinder 4 through a connecting piece, and the lifting plate 6 can reciprocate up and down along the guide shaft 6 under the drive of the jacking cylinder 4. The lifting plate 6 is in the shape of a rectangular frame, and the middle part is provided with a hollow area. The four supporting columns 3 of the vacuum adsorption sink 5 penetrate through the hollow area from top to bottom and are fixedly connected with the bottom plate 1.

[0051] The conveying belt line 9 is used to convey the transport carrier 14, and the transport carrier 14 carries the products to be bonded. The conveying belt line 9 drives the transport carrier 14 to translate along the conveying direction of the conveying belt 10. The conveying belt line 9 includes a conveying mounting plate 21 fixedly mounted on the lifting plate 6 and symmetrically arranged on both sides of the vacuum adsorption sink 5. The inner side of the conveying mounting plate 21 is rotatably mounted with a pulley, and the conveying belt 10 is arranged on the inner side wall of the conveying mounting plate 21 through the pulley. Specifically, the conveying mounting plate 21 includes a first conveying mounting plate and a second conveying mounting plate arranged oppositely, and the first conveying mounting plate and the second conveying mounting plate are respectively fixedly mounted on the lifting plate 6 through a plurality of I-shaped blocks 12. The inner side wall of the first conveying mounting plate is mounted with a first conveying belt, and the inner side wall of the second conveying mounting plate is mounted with a second conveying belt. The first conveying belt and the second conveying belt extend in the same direction and rotate synchronously. In a preferred embodiment, the lower side of the first conveying belt and the lower side of the second conveying belt are both provided with a support strip 11. When the transport carrier 14 is pressed onto the conveying belt 10, the support strip 11 supports the conveying belt 10 and the transport carrier 14. When the products to be bonded on the transport carrier 14 are bonded, the two sides of the transport carrier 14 are supported by the support strip 11, so that the conveying belt 10 is not damaged due to excessive pressure. In a preferred embodiment, the outer side of the first conveying belt and the outer side of the second conveying belt are provided with a set of opposite photoelectric sensors 13 arranged oppositely. When the opposite photoelectric sensors 13 sense the transport carrier 14, the first conveying belt and the second conveying belt stop conveying.

[0052] The upper end surface of the vacuum adsorption sink 5 is provided with a plurality of positioning pins, and the lower end surface of the transport carrier 14 is provided with a plurality of positioning holes. The positioning pins and the positioning holes are matched and positioned.

[0053] The pressing plate 15 is arranged above the conveying belt line 9, and the lower surface of the pressing plate 15 faces the upper end surface of the vacuum adsorption sink 5. The two sides of the pressing plate 15 are respectively fixedly mounted on the lifting plate 6 through a pressing plate mounting frame 16. The pressing plate 15 is provided with a hollow unit, and the hollow unit corresponds to the bonding area of the transport carrier 14.

[0054] In a preferred embodiment, one side of the bottom plate 1 is also provided with a side plate arranged perpendicularly to the bottom plate 1. A plurality of vacuum pressure gauges 18 are arranged on the side plate 17. The vacuum pressure gauges 18 are connected with the vacuum circuit and are used to detect and display the vacuum pressure value in the vacuum circuit. The vacuum pressure gauges 18 are also electrically connected with the controller.

[0055] In a preferred embodiment, the bottom of the lifting plate 6 is further provided with a stroke adjuster 19, which is installed on the bottom plate 1 through an adjuster fixing block 20. The stroke adjuster 19 is a bolt screwed on the adjuster fixing block 20, and the predetermined position of the lower limit of the lifting plate 6 can be adjusted by manually rotating the bolt, and the adjustment range is about 20mm. When the lower surface of the lifting plate 6 abuts against the stroke adjuster 19, the stroke adjuster 19 blocks the descent of the lifting plate 6.

[0056] The working principle of the height-adjustable bonding device of the present application is as follows:

[0057] The product to be bonded is placed on the transport carrier 14, and the transport carrier 14 is placed on the conveying belt line 9, which is the carrier of the product to be bonded; the conveying belt line 9 drives the transport carrier 14 to translate along the conveying direction of the conveying belt 10 to the bonding station by friction, and at this time, the transport carrier 14 is located between the pressing plate 15 and the vacuum suction sink 5. The lifting cylinder 4 drives the lifting plate 6 to move vertically downward, and then drives the conveying belt line 9 fixedly connected with the lifting plate 6, the transport carrier 14 carrying the product to be bonded, and the pressing plate 15 to move vertically downward along the guide shaft 6, and the linear bearing 8 cooperates with the guide shaft 6 to ensure the coarse positioning of the lifting action during the descending process. The descending process is divided into two stages: the first stage, during the descending process, the lower surface of the transport carrier 14 first contacts the vacuum suction sink 5, and is positioned by the positioning pin on the vacuum suction sink 5 and the positioning hole on the transport carrier 14, and the product to be bonded contacts the surface of the vacuum suction sink 5; the second stage, after the positioning of the transport carrier 14 is completed, the transport carrier 14 is in a zero-contact state with the conveying belt line 9, the lifting cylinder 4 drives the conveying belt line 9 and the pressing plate 15 to continue to descend until it contacts the stroke adjuster 19, and stops after being blocked by the adjuster fixing block 20, at this time, the pressing plate 15 exerts a certain pressure on the product to be bonded to press the warped part of the product to be bonded to be horizontal. At this time, the vacuum suction sink 5 starts the vacuum suction action to firmly adsorb the lower surface of the transport carrier 14, and the bonding starts when the value of the vacuum pressure gauge 18 is greater than 85kpa.

[0058] In summary, the present application provides a height-adjustable bonding device, which drives the lifting plate 6 to move linearly by the lifting cylinder 4, and then drives the conveying belt line 9 fixedly connected with the lifting plate 6, the transport carrier 14 carrying the product to be bonded, and the pressing plate 15 to move up and down together, thereby realizing the height adjustment of the bonding device, and making the bonding device compatible with products of different thicknesses and bonding processes of different bonding heights. The present application has the advantages of simple structure, convenient use, space saving, and cost saving, and solves the technical problem that a single bonding machine cannot bond multiple products.

[0059] The above detailed description of the application is only as an example, and the application is not limited to the above described specific embodiments. Any equivalent modifications and substitutions made by those skilled in the art to the application are also within the scope of the application. Therefore, equivalent transformations and modifications made without departing from the spirit and scope of the application should be covered within the scope of the application.

Claims

1. A height-adjustable bonding apparatus characterized by comprising: The utility model relates to a kind of vacuum suction and pressing device, including: Base plate; Cylinder fixing plate, bottom is fixedly installed on the base plate by support column, top-up cylinder is fixedly installed on the cylinder fixing plate, the output end of the top-up cylinder is downward through the cylinder fixing plate; Vacuum adsorption sink, located above the top-up cylinder, bottom is fixedly installed on the base plate by guide shaft;The upper surface of the vacuum adsorption sink is equipped with a plurality of adsorption units, and the adsorption unit is communicated with vacuum circuit through vacuum adsorption hole; Lifting plate, located below the cylinder fixing plate, the lifting plate is equipped with circular through slot, linear bearing is arranged in the circular through slot, and the middle part of the guide shaft penetrates the linear bearing;The bottom of the lifting plate is connected with the output end of the top-up cylinder by connecting piece, and the lifting plate can reciprocate up and down along the guide shaft under the drive of the top-up cylinder; Conveying belt line, including conveying installation plate fixedly installed on the lifting plate and symmetrically arranged on both sides of the vacuum adsorption sink, the inner side of the conveying installation plate is equipped with conveying belt; Transportation carrier, under the drive of conveying belt, translation along the conveying direction of the conveying belt, the transportation carrier is used to carry product to be bonded; Pressing plate, erected above the conveying belt line, and the lower surface of the pressing plate is opposite to the upper end surface of the vacuum adsorption sink, and the pressing plate is fixedly installed on the lifting plate by pressing plate mounting frame; Wherein, the conveying belt line conveys the transportation carrier to between the vacuum adsorption sink and the pressing plate, the top-up cylinder drives the lifting plate to move vertically downward, and then drives the conveying belt line, the transportation carrier carrying product to be bonded and the pressing plate to move vertically downward and press together on the vacuum adsorption sink.

2. A height adjustable bonding apparatus according to claim 1, wherein, One side of the base plate is equipped with side plate which is vertically arranged with the base plate, and a plurality of vacuum pressure gauges are arranged on the side plate, the vacuum pressure gauge is connected with the vacuum circuit, for detecting and displaying the vacuum pressure value in the vacuum circuit;The vacuum pressure gauge is also electrically connected with the controller.

3. The height adjustable bonding apparatus of claim 1, wherein, The upper end surface of the vacuum adsorption sink is provided with a plurality of positioning pins, and the lower end surface of the transportation carrier is provided with a plurality of positioning holes, the positioning pin is matched with the positioning hole.

4. The height adjustable keying device of claim 1, wherein, The lifting plate is rectangular frame shape, and the middle part is equipped with hollow area, and the support column of the vacuum adsorption sink penetrates the hollow area from top to bottom and is fixedly connected with the base plate.

5. The height adjustable keying device of claim 1, wherein, The conveying installation plate includes oppositely arranged first conveying installation plate and second conveying installation plate, the inner side wall of the first conveying installation plate is provided with the first conveying belt, and the inner side wall of the second conveying installation plate is provided with the second conveying belt, and the first conveying belt and the second conveying belt extend in the same direction and rotate synchronously;The outer side of the first conveying belt and the second conveying belt is equipped with a pair of opposite infrared sensors, when the infrared sensor senses that there is transportation carrier, the first conveying belt and the second conveying belt stop conveying.

6. The height adjustable linkage of claim 1, wherein, The lower side of the conveying belt is provided with support strip, when the transportation carrier is pressed to the conveying belt, the support strip supports the conveying belt and the transportation carrier.

7. The height adjustable linkage of claim 1, wherein, The vacuum circuit is installed below the vacuum adsorption sink, and a vacuum connection hole is arranged on the vacuum circuit.

8. The height adjustable linkage of claim 1, wherein, The bottom of the lifting plate is further provided with a stroke adjuster, which is installed on the bottom plate through an adjuster fixing block.

9. The height adjustable linkage of claim 1, wherein, The pressing plate is provided with a hollow unit corresponding to the bonding area of the transport carrier.

10. A method of operating a height-adjustable bonding apparatus according to claim 1, characterized by, The method comprises the following steps: The product to be bonded is placed on the transport carrier, and the transport carrier is placed on the conveying belt line. The lifting cylinder drives the lifting plate to move vertically downward, and then drives the conveying belt line, the transport carrier carrying the product to be bonded, and the pressing plate fixedly connected with the lifting plate to move vertically downward along the guide shaft. During the descending process, the lower surface of the transport carrier first contacts the vacuum adsorption sink, and the product to be bonded contacts the surface of the vacuum adsorption sink, and the transport carrier completes positioning. With the continuous descent of the lifting plate, the transport carrier is separated from the conveying belt line, and the state is zero contact. The lifting cylinder drives the conveying belt line and the pressing plate to further descend until it reaches the preset lower limit position and stops descending, at which time the pressing plate exerts pressure on the product to be bonded to press the warped part of the product to be bonded to be horizontal. The vacuum adsorption sink starts the vacuum adsorption action to firmly adsorb the lower surface of the transport carrier, and the bonding starts when the value of the vacuum pressure gauge is greater than 85kpa.

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