Wafer cleaning apparatus for reducing crystal build-up

Abstract

The application discloses a wafer cleaning device capable of reducing crystal accumulation, which comprises a cleaning bin, a wafer bearing table arranged in the cleaning bin, a first blowing mechanism arranged on the upper surface of the wafer bearing table and provided with a plurality of first blowing ports, a rotating support mechanism connected with the wafer bearing table and used for driving the rotation of the wafer bearing table, an exhaust mechanism with a suction end arranged at the lower part of the cleaning bin and used for exhausting the gas in the cleaning bin, and a cleaning mechanism provided with a cleaning nozzle arranged directly above the wafer bearing table. Through the application of the wafer cleaning device, the airflow state in the cleaning bin can be kept stable under the cooperation of the first blowing mechanism and the exhaust mechanism, the crystal accumulation of the cleaning liquid on the edge or the bottom of the wafer is reduced as much as possible, and the cleaning quality of the wafer is further ensured.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and more particularly to a wafer cleaning apparatus for reducing crystal buildup. Background Technology

[0002] In the process of cleaning a single wafer, the wafer typically rotates on a support mechanism while cleaning fluid is sprayed onto its upper surface during rotation. This ensures the cleaning fluid is fully distributed across the wafer's surface. As the support mechanism continues to rotate, the cleaning fluid is propelled outwards by centrifugal force. However, existing wafer cleaning equipment often includes a gas introduction section, which results in unstable airflow within the equipment. This leads to crystallization and accumulation of cleaning fluid at the bottom or edges of the wafer, significantly impacting the cleaning quality. Summary of the Invention

[0003] In view of this, in order to solve the above problems, the object of the present invention is to provide a wafer cleaning apparatus for reducing crystal buildup, comprising:

[0004] Cleaning chamber;

[0005] A wafer carrier stage, wherein the wafer carrier stage is disposed within the cleaning chamber;

[0006] A first air blowing mechanism is disposed on the upper surface of the wafer carrier stage, and the first air blowing mechanism is provided with a plurality of first air blowing ports.

[0007] A rotating support mechanism is connected to the wafer carrier stage and is used to drive the rotation of the wafer carrier stage;

[0008] An exhaust mechanism, wherein the intake end of the exhaust mechanism is located at the lower part of the cleaning chamber, and the exhaust mechanism is used to exhaust the gas in the cleaning chamber;

[0009] A cleaning mechanism having a cleaning nozzle positioned directly above the wafer carrier stage.

[0010] In another preferred embodiment, the inner wall of the cleaning chamber is provided with a smooth curved surface.

[0011] In another preferred embodiment, the upper end of the curved surface is bent inward, the lower end of the curved surface is bent inward, and the middle part of the curved surface protrudes outward relative to the upper and lower ends of the curved surface.

[0012] In another preferred embodiment, the outer contour of the first air blowing mechanism is a flat frustum-shaped structure, and an annular surface is formed on the outer edge of the frustum-shaped structure. The outer diameter of the upper end of the annular surface is smaller than the outer diameter of the lower end of the annular surface, and a plurality of first air blowing ports are provided on the annular surface.

[0013] In another preferred embodiment, a plurality of the first air inlets are uniformly arranged along the outer edge of the annular surface.

[0014] In another preferred embodiment, the axis of each of the air inlets is inclined upward, and the axis of each of the air inlets is directed toward the outer edge of the lower surface of the wafer carrier.

[0015] In another preferred embodiment, the device further includes a first air delivery device, which is connected to the first air blowing mechanism via a pipeline.

[0016] In another preferred embodiment, the device further includes a second air blowing mechanism, which is mounted on the cleaning device and has a plurality of second air blowing ports, each of which faces the upper surface of the support platform.

[0017] In another preferred embodiment, a plurality of second air inlets are evenly arranged along the outer edge of the second air blowing mechanism, and the axis of each second air inlet is inclined downward.

[0018] In another preferred embodiment, the exhaust mechanism includes: a shielding ring, an exhaust device body, and a plurality of exhaust nozzles. The shielding ring is disposed on the lower part of the inner wall of the cleaning chamber, and the inner edge of the shielding ring extends inward and downward. The plurality of exhaust nozzles are evenly disposed at the bottom of the shielding ring, and each exhaust nozzle is connected to the exhaust device body through a pipeline.

[0019] The present invention, by adopting the above-mentioned technical solution, has the following positive effects compared with the prior art: through the application of the present invention, the airflow state in the cleaning chamber is kept stable by the cooperation of the first blowing mechanism and the exhaust mechanism in the cleaning chamber, which minimizes the crystal accumulation of cleaning fluid on the edge or bottom of the wafer, and further ensures the cleaning quality of the wafer. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a wafer cleaning apparatus for reducing crystal buildup according to the present invention.

[0021] In the attached image:

[0022] 1. Cleaning chamber; 2. Wafer carrier stage; 3. First air blowing mechanism; 4. First air blowing port; 5. Rotary support mechanism; 6. Exhaust mechanism; 7. Cleaning mechanism; 8. Cleaning nozzle; 9. First air supply device; 10. Second air blowing mechanism; 11. Shielding ring; 12. Exhaust device body; 13. Exhaust nozzle. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0024] like Figure 1 The image shows a preferred embodiment of a wafer cleaning apparatus for reducing crystal buildup, comprising: a cleaning chamber 1; a wafer support stage 2 disposed within the cleaning chamber 1; a first air blowing mechanism 3 disposed on the upper surface of the wafer support stage 2, and having a plurality of first air blowing ports 4; a rotating support mechanism 5 connected to the wafer support stage 2, the rotating support mechanism 5 being used to drive the rotation of the wafer support stage 2; an exhaust mechanism 6 having its intake end disposed at the lower part of the cleaning chamber 1, the exhaust mechanism 6 being used to exhaust gas from the cleaning chamber 1; and a cleaning mechanism 7 having a cleaning nozzle 8 disposed directly above the wafer support stage 2. Furthermore, a corresponding wafer is placed on the wafer carrier stage 2, and there is a certain gap between the lower surface of the wafer and the upper surface of the wafer carrier stage 2. During the cleaning process of the wafer, the wafer rotates under the drive of the rotating support mechanism 5, and the first blowing mechanism 3 blows air while controlling the exhaust mechanism 6 to exhaust air synchronously, so as to guide the airflow in the cleaning chamber 1 and thus enhance the stability of the airflow state in the cleaning chamber 1.

[0025] Furthermore, as a preferred embodiment, the inner wall of the cleaning chamber 1 is provided with a smooth curved surface.

[0026] Furthermore, as a preferred embodiment, the upper end of the cleaning chamber 1 has an open structure.

[0027] Furthermore, as a preferred embodiment, a cavity is formed inside the cleaning chamber 1, and the inner contour of the cavity is set in an ellipsoidal structure with the upper part cut off.

[0028] Furthermore, as a preferred embodiment, the horizontal cross-section of the aforementioned ellipsoidal structure is circular.

[0029] Furthermore, as a preferred embodiment, the vertical height of the ellipsoidal structure described above is smaller than the horizontal diameter of the ellipsoidal structure.

[0030] Furthermore, as a preferred embodiment, the upper end of the curved surface is bent inward, the lower end of the curved surface is bent inward, and the middle part of the curved surface protrudes outward relative to the upper and lower ends of the curved surface.

[0031] Furthermore, as a preferred embodiment, the outer contour of the first air blowing mechanism 3 is a flat frustum-shaped structure, and an annular surface is formed on the outer edge of the frustum-shaped structure. The outer diameter of the upper end of the annular surface is smaller than the outer diameter of the lower end of the annular surface, and a plurality of first air blowing ports 4 are opened on the annular surface.

[0032] Furthermore, as a preferred embodiment, a plurality of first air inlets 4 are evenly arranged along the outer edge of the annular surface.

[0033] Furthermore, as a preferred embodiment, the axis of each air blowing port is inclined upward, and the axis of each air blowing port is directed toward the outer edge of the lower surface of the wafer carrier stage 2.

[0034] The above are merely preferred embodiments of the present invention and are not intended to limit the implementation methods and protection scope of the present invention.

[0035] In addition to the above, the present invention also has the following embodiments:

[0036] In a further embodiment of the present invention, it further includes: a first air supply device 9, which is connected to the first air blowing mechanism 3 via a pipeline.

[0037] In a further embodiment of the present invention, the first air supply device 9 is disposed at the lower part of the rotary support mechanism 5.

[0038] In a further embodiment of the present invention, the first air supply device 9 passes through the rotating support mechanism 5 and is connected to the first air blowing mechanism 3 via a first air supply pipe.

[0039] In a further embodiment of the present invention, it further includes: a second air blowing mechanism 10, which is mounted on the cleaning device. The second air blowing mechanism 10 is provided with a plurality of second air blowing ports, each of which is disposed facing the upper surface of the support platform.

[0040] In a further embodiment of the present invention, a plurality of second air inlets are evenly arranged along the outer edge of the second air blowing mechanism 10, and the axis of each second air inlet is inclined downward.

[0041] In a further embodiment of the present invention, the second blowing mechanism 10 is arranged in a ring shape, and the diameter of the upper edge of the outer side of the second blowing mechanism 10 is greater than the diameter of the lower edge of the outer side of the second blowing mechanism 10.

[0042] In a further embodiment of the present invention, a second air supply device is also included, which is connected to the second air blowing mechanism 10 via a second air supply pipe.

[0043] In a further embodiment of the present invention, both the first gas supply device 9 and the second gas supply device are used to provide air or nitrogen with a certain intensity.

[0044] In a further embodiment of the present invention, the cleaning chamber 1 includes an upper cavity and a lower cavity arranged vertically.

[0045] In a further embodiment of the present invention, a lifting device is further included, which is connected to the upper cavity and is used to drive the upper cavity to move up and down. Furthermore, the lifting device causes the upper cavity and the lower cavity to separate or close relative to each other, thereby facilitating the removal or placement of the wafer.

[0046] In a further embodiment of the present invention, the horizontal height of the connection between the upper cavity and the lower cavity is at the same level as the upper surface of the wafer carrier stage 2.

[0047] In a further embodiment of the present invention, an opening is formed in the upper part of the upper cavity, and the inner diameter of the opening is smaller than the outer diameter of the wafer carrier stage 2.

[0048] In a further embodiment of the present invention, the exhaust mechanism 6 includes: a shielding ring 11, an exhaust device body 12, and a plurality of exhaust nozzles 13. The shielding ring 11 is disposed on the lower part of the inner wall of the cleaning chamber 1, and the inner edge of the shielding ring 11 extends inward and downward. The plurality of exhaust nozzles 13 are evenly disposed on the bottom of the shielding ring 11, and each exhaust nozzle 13 is connected to the exhaust device body 12 through a pipeline.

[0049] In a further embodiment of the present invention, a waste liquid recovery device is further included, which is connected to the bottom of the lower cavity via a recovery pipeline. Furthermore, the waste liquid recovery device is used to discharge the cleaning fluid ejected from the wafers into the cleaning chamber 1.

[0050] The above description is merely a preferred embodiment of the present invention and does not limit the implementation and protection scope of the present invention. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer cleaning apparatus for reducing crystal buildup, characterized in that, include: Cleaning chamber; A wafer carrier stage, wherein the wafer carrier stage is disposed within the cleaning chamber; A first air blowing mechanism is disposed on the upper surface of the wafer carrier stage, and the first air blowing mechanism is provided with a plurality of first air blowing ports. A rotating support mechanism is connected to the wafer carrier stage and is used to drive the rotation of the wafer carrier stage; An exhaust mechanism, wherein the intake end of the exhaust mechanism is located at the lower part of the cleaning chamber, and the exhaust mechanism is used to exhaust the gas in the cleaning chamber; A cleaning mechanism having a cleaning nozzle positioned directly above the wafer carrier stage; It also includes: a second air blowing mechanism, which is installed on the cleaning device. The second air blowing mechanism is provided with a plurality of second air blowing ports, each of which faces the upper surface of the support platform; the plurality of second air blowing ports are evenly arranged along the outer edge of the second air blowing mechanism, and the axis of each second air blowing port is inclined downward. The inner wall of the cleaning chamber is designed with a smooth curved surface; The upper end of the curved surface is bent inward, the lower end of the curved surface is bent inward, and the middle part of the curved surface protrudes outward relative to the upper and lower ends of the curved surface. The exhaust mechanism includes: a shielding ring, an exhaust device body, and a plurality of exhaust nozzles. The shielding ring is disposed on the lower part of the inner wall of the cleaning chamber. The inner edge of the shielding ring extends inward and downward. The plurality of exhaust nozzles are evenly disposed on the bottom of the shielding ring. Each exhaust nozzle is connected to the exhaust device body through a pipeline. The cleaning chamber includes an upper cavity and a lower cavity arranged vertically. An open opening is formed at the top of the upper cavity, and the inner diameter of the open opening is smaller than the outer diameter of the wafer carrier stage.

2. The wafer cleaning apparatus for reducing crystal buildup according to claim 1, characterized in that, The outer contour of the first air blowing mechanism is a flat frustum-shaped structure. The outer edge of the frustum-shaped structure forms an annular surface. The outer diameter of the upper end of the annular surface is smaller than the outer diameter of the lower end of the annular surface. A plurality of first air blowing ports are opened on the annular surface.

3. The wafer cleaning apparatus for reducing crystal buildup according to claim 2, characterized in that, Several first air inlets are evenly arranged along the outer edge of the annular surface.

4. The wafer cleaning apparatus for reducing crystal buildup according to claim 1, characterized in that, The axis of each air inlet is inclined upward, and the axis of each air inlet is directed toward the outer edge of the lower surface of the wafer carrier.

5. The wafer cleaning apparatus for reducing crystal buildup according to claim 1, characterized in that, Also includes: The first air supply device is connected to the first air blowing mechanism via a pipeline.

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