A semiconductor component processing and molding device

Abstract

The present invention discloses a semiconductor element processing and molding equipment, including a base, a supporting device; a central transmission belt passing through the center of the base; a graphite boat placed on the central transmission belt for transmission, and the graphite boat is provided with a mounting groove capable of evenly placing multiple bases along the traveling direction of the central transmission belt; a bracket mounted above the base; a crossbar, two of the crossbars are arranged above the bracket in parallel with each other and perpendicular to the central transmission belt; a glue injection assembly fixedly mounted above the central transmission belt between the two crossbars; a fixed seat assembly arranged at the center of the base, dividing the central transmission belt into two parts, and located directly below the glue injection assembly. Compared with the prior art, the present invention uses a fixed needle to fix the chip and the base before glue injection, thereby improving the chip's position accuracy. Since the connecting rod is moved down and rotated by the repulsive force of the same-direction magnetic pole, the collision of the glue injection needle is prevented, which causes the fixed needle to damage the chip or shift it.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, in particular to a device for processing and molding semiconductor elements. Background Art

[0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields. After the semiconductor chip material is produced, it needs to be fixed in the base to lead out the pins for processing and shaping so that it can be installed in the circuit. The base and the chip material can be fixed by injecting glue. The existing glue injection equipment injects glue in the base, which will cause the chip to shift due to the action of the fluid, which may cause the pins to be misaligned and make the semiconductor component scrapped.

[0003] Therefore, it is necessary to provide a semiconductor element processing and molding equipment to solve the problems raised in the above background technology. Summary of the invention

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a semiconductor element processing and molding device, comprising:

[0005] Base, support device;

[0006] A central conveyor belt passes through the center of the base;

[0007] A graphite boat is placed on the central conveyor belt for transmission, and the graphite boat is provided with mounting grooves capable of evenly placing a plurality of bases along the traveling direction of the central conveyor belt;

[0008] A bracket is mounted above the base;

[0009] Cross bars, two of which are arranged above the bracket in parallel with each other and perpendicular to the central conveyor belt;

[0010] The glue injection assembly is fixedly mounted above the center conveyor belt between the two cross bars;

[0011] The fixed seat assembly is arranged at the center of the base, divides the central conveyor belt into two parts, and is located directly below the glue injection assembly.

[0012] Furthermore, as a preference, transverse conveyor belts perpendicular to the central conveyor belt are symmetrically arranged on both sides of the central conveyor belt below the transverse bar at the front end of the central conveyor belt's traveling direction, and a transverse conveyor belt is also arranged on one side of the central conveyor belt below the transverse bar at the rear end of the central conveyor belt's traveling direction.

[0013] Further, as a preference, a servo-driven lead screw slider is respectively arranged in the position of each of the cross bars corresponding to each of the cross conveyor belts, each of the lead screw sliders is connected to a vertical linear module, and a suction cup is arranged at the output end of the linear module;

[0014] Side conveyor belts are respectively arranged in the gaps between the two sides of the central conveyor belt and the transverse conveyor belt.

[0015] Further, as a preference, a visual module is fixed on each of the cross bars at a position corresponding to the central conveyor belt, and the visual module can feedback control the central conveyor belt to align the suction cup with the mounting groove of the graphite boat.

[0016] Further, as a preference, the glue injection component comprises:

[0017] The three-axis robotic arm is fixed above the central conveyor belt and can servo move along the XYZ axes respectively;

[0018] The glue injection needle is vertically fixed at the output end of the three-axis robot arm, which can heat and inject the glue, and its upper end is connected to the feed conduit.

[0019] Further, as a preference, the fixing seat assembly comprises:

[0020] The center column is fixed vertically on the base as support;

[0021] The support plate is fixed above the central column and is located directly below the glue injection assembly, and separates the central conveyor belt into conveyor belts running independently at both ends, and a certain gap is left between the support plate and the central conveyor belt.

[0022] Further, as a preference, the support plate is provided with at least two transmission rollers passing through its upper surface in a servo-rotatable manner, and the rotation direction of the transmission rollers is the same as the traveling direction of the central transmission belt;

[0023] Moreover, the distance between the transmission roller and the central transmission belt is smaller than the length of the graphite boat, and the upper surface of the transmission roller and the upper surface of the central transmission belt are in the same plane.

[0024] Furthermore, as a preference, a sliding sleeve is provided in the center column below the support disk so as to slide up and down and rotate, a "C"-shaped connecting rod is fixed to the edge of the sliding sleeve, the upper end of the connecting rod extends from the edge of the support disk to the center of a circle above the support disk, and a fixing pin is provided at the center of the circle.

[0025] Further, as a preference, a horizontal downward pressure magnet is fixedly provided above the injection needle, a driven magnet is fixedly provided at a position above the transmission roller on the connecting rod, and the lower surface of the downward pressure magnet and the upper surface of the driven magnet have the same magnetic pole direction;

[0026] Furthermore, a support spring is provided between the sliding sleeve and the base, and the support spring provides elastic force to keep the fixing needle away from the support disk.

[0027] Furthermore, as a preference, a plurality of guide magnets are distributed circumferentially below the pressing magnet, and the magnetic poles on the periphery of the guide magnets are the same as the magnetic poles on the sides of the driven magnets.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] In the present invention, the carrier on each transverse conveyor belt can be transferred to the side conveyor belt in the corresponding direction, and the suction cup is controlled by the lead screw slider and the linear module to transfer the material on the carrier to the graphite boat of the central conveyor belt. When the graphite boat moves to the front cross bar, the base and chip on the transverse conveyor belt are transferred to the mounting groove of the graphite boat in turn. After the glue injection assembly is injected, the rear cross bar transfers the cover plate on the transverse conveyor belt to the mounting groove of the graphite boat, so that the semiconductor is processed and formed, and the empty carrier is sent away for recycling through the side conveyor belt.

[0030] In the present invention, when the graphite boat is moved to the support plate through the relay of the transmission roller, glue is injected into the base of each mounting groove in turn. When the three-axis robot drives the glue injection needle to move downward, it drives the connecting rod to move downward, so that the fixed needle supports the chip, which can prevent the chip from shifting when the glue injection needle injects glue in the base around the chip. When the glue injection needle moves around the periphery of the chip, it drives the connecting rod and the sliding sleeve to rotate, so that the connecting rod avoids the glue injection needle and maintains the pressure of the fixed needle on the chip. In this process, the connecting rod moves downward and rotates due to the repulsive force of the same-direction magnetic poles, which prevents the fixed needle from damaging the chip or shifting it due to the collision of the glue injection needle. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of a semiconductor component processing and molding equipment;

[0032] Figure 2 It is a structural schematic diagram of the glue injection component;

[0033] In the figure: 1. base; 2. center transmission belt; 3. graphite boat; 4. bracket; 5. cross bar; 6. glue injection assembly; 7. fixed seat assembly; 8. screw slider; 9. linear module; 10. suction cup; 11. horizontal transmission belt; 12. side transmission belt; 13. visual module; 61. three-axis robot arm; 62. glue injection needle; 63. downward pressure magnet; 64. guide magnet; 71. center column; 72. support plate; 73. transmission roller; 74. sliding sleeve; 75. connecting rod; 76. driven magnet; 77. fixing needle; 78. support spring. DETAILED DESCRIPTION

[0034] See also Figure 1In an embodiment of the present invention, a semiconductor element processing and molding device includes:

[0035] Base 1, supporting device;

[0036] A central conveyor belt 2 passes through the center of the base 1;

[0037] A graphite boat 3 is placed on the central conveyor belt 2 for transmission, and a mounting groove is provided on the graphite boat 3 for evenly placing a plurality of bases along the traveling direction of the central conveyor belt 2;

[0038] A bracket 4 is mounted above the base 1;

[0039] Cross bars 5, two of the cross bars 5 are arranged above the bracket 4 in parallel and perpendicular to the central conveyor belt 2;

[0040] The glue injection assembly 6 is fixedly mounted above the central conveyor belt 2 between the two cross bars 5;

[0041] The fixing seat assembly 7 is arranged at the center of the base 1 , divides the central conveyor belt 2 into two parts, and is located directly below the glue injection assembly 6 .

[0042] In this embodiment, transverse conveyor belts 11 perpendicular to the central conveyor belt 2 are symmetrically arranged on both sides of the central conveyor belt 2 below the transverse bar 5 at the front end of the central conveyor belt 2 in the direction of travel, and a transverse conveyor belt 11 is also arranged on one side of the central conveyor belt 2 below the transverse bar 5 at the rear end of the central conveyor belt 2 in the direction of travel;

[0043] The two transverse conveyor belts 11 at the front end respectively convey the carriers on which the base and the chip are placed, and the transverse conveyor belt 11 at the rear end conveys the carrier on which the cover plate is placed.

[0044] In this embodiment, a servo-driven lead screw slider 8 is respectively arranged at the position of each cross bar 5 corresponding to each cross conveyor belt 11, and a vertical linear module 9 is connected to each lead screw slider 8, and a suction cup 10 is arranged at the output end of the linear module 9;

[0045] Side conveyor belts 12 are respectively arranged in the gaps between the two sides of the central conveyor belt 2 and the transverse conveyor belt 11;

[0046] That is to say, the carrier on each transverse conveyor belt 11 can be transferred to the side conveyor belt 12 in the corresponding direction, and the lead screw slider 8 and the linear module 9 control the suction cup 10 to transfer the material on the carrier to the graphite boat 3 of the central conveyor belt 2. In this embodiment, when the graphite boat 3 moves to the front cross bar 5, the base and the chip on the transverse conveyor belt 11 are transferred to the installation groove of the graphite boat 3 in turn, and after the glue injection component 6 injects glue, the rear cross bar 5 transfers the cover plate on the transverse conveyor belt 11 to the installation groove of the graphite boat 3, so that the semiconductor is processed and formed;

[0047] The empty carrier is sent away for recycling via the side conveyor belt 12 .

[0048] In this embodiment, a visual module 13 is fixed on each of the cross bars 5 at a position corresponding to the central conveyor belt 2 , and the visual module 13 can feedback control the central conveyor belt 2 to align the suction cup 10 with the mounting groove of the graphite boat 3 .

[0049] See also Figure 2 In this embodiment, the glue injection component 6 includes:

[0050] A three-axis robot arm 61 is fixedly mounted above the central conveyor belt 2 and can be servo-moved along the XYZ axes respectively;

[0051] The glue injection needle 62 is vertically fixed at the output end of the three-axis robot arm 61, and can heat and inject glue. Its upper end is connected to the feed conduit. In this embodiment, the glue connected to it is preferably epoxy resin.

[0052] In this embodiment, the fixing seat assembly 7 includes:

[0053] A central column 71 is vertically fixed on the base 1 as a support;

[0054] The support plate 72 is fixed above the central column 71 and is located directly below the glue injection assembly 6 , and separates the central conveyor belt 2 into conveyor belts running independently at both ends, and a certain gap is left between the support plate 72 and the central conveyor belt 2 .

[0055] In this embodiment, the support plate 72 is provided with at least two transmission rollers 73 passing through its upper surface in a servo-rotatable manner, and the rotation direction of the transmission rollers 73 is the same as the traveling direction of the central transmission belt 2;

[0056] Moreover, the distance between the transmission roller 73 and the central transmission belt 2 is smaller than the length of the graphite boat 3 , and the upper surface of the transmission roller 73 and the upper surface of the central transmission belt 2 are in the same plane, that is, the support plate 72 can relay the graphite boat 3 between two sections of the central transmission belt 2 .

[0057] In this embodiment, a sliding sleeve 74 is provided in the center column 71 below the support plate 72 so as to slide up and down and rotate. A "C"-shaped connecting rod 75 is fixed to the edge of the sliding sleeve 74. The upper end of the connecting rod 75 extends from the edge of the support plate 72 to the center of the circle above the support plate 72, and a fixing pin 77 is provided at the center of the circle.

[0058] In this embodiment, a horizontal pressing magnet 63 is fixedly sleeved above the injection needle 62, and a driven magnet 76 is fixedly mounted on the connecting rod 75 above the transmission roller 73, and the lower surface of the pressing magnet 63 and the upper surface of the driven magnet 76 have the same magnetic pole direction;

[0059] Furthermore, a support spring 78 is provided between the sliding sleeve 74 and the base 1, and the support spring 78 provides an elastic force to keep the fixing needle 77 away from the support plate 72;

[0060] That is to say, when the injection needle 62 moves downward, it drives the connecting rod 75 downward, so that the fixing needle 77 supports the chip, which can prevent the chip from shifting when the injection needle 62 injects glue in the base around the chip. In addition, the repulsive force of the same-direction magnetic poles causes the connecting rod 75 to move downward, preventing the fixing needle 77 from damaging the chip or shifting it due to collision.

[0061] In this embodiment, a plurality of guide magnets 64 are distributed circumferentially below the pressing magnet 63, and the magnetic poles on the periphery of the guide magnet 64 are the same as the magnetic poles on the side of the driven magnet 76;

[0062] That is to say, when the injection needle 62 moves around the periphery of the chip, it drives the connecting rod 75 and the sliding sleeve 74 to rotate, so that the connecting rod 75 avoids the injection needle 62 and maintains the pressure of the fixing needle 77 on the chip. In this process, the connecting rod 75 rotates due to the repulsive force of the same-direction magnetic poles, preventing the fixing needle 77 from damaging the chip or shifting it due to collision.

[0063] In specific implementation, an empty graphite boat 3 is placed in the central conveyor belt 2 for transmission and movement, and the two transverse conveyor belts 11 at the front end respectively transmit the carriers with the base and the chip, and the transverse conveyor belt 11 at the rear end transmits the carrier with the cover plate;

[0064] Take one of the graphite boats 3 as an example. When it moves to the position of the front transverse conveyor belt 11, under the feedback control of the visual module 13, the base and the chip on the transverse conveyor belt 11 are transferred to the installation groove of the graphite boat 3 in sequence through the suction cup 10.

[0065] When the graphite boat 3 is moved to the support plate 72 through the relay of the transmission roller 73, glue is injected into the base of each installation slot in turn. When the three-axis robot arm 61 drives the glue injection needle 62 to move downward, it drives the connecting rod 75 to move downward, so that the fixed needle 77 supports the chip, which can prevent the chip from shifting when the glue injection needle 62 injects glue in the base around the chip. When the glue injection needle 62 moves around the periphery of the chip, it drives the connecting rod 75 and the sliding sleeve 74 to rotate, so that the connecting rod 75 avoids the glue injection needle 62 and maintains the pressure of the fixed needle 77 on the chip. In this process, the connecting rod 75 moves downward and rotates due to the repulsive force of the same-direction magnetic poles, which prevents the fixed needle 77 from damaging the chip or shifting it due to the collision of the glue injection needle 62.

[0066] After the glue injection assembly 6 injects glue, the graphite boat 3 moves to the rear end crossbar 5, and the corresponding suction cup 10 transfers the cover plate on the horizontal conveyor belt 11 to the installation groove of the graphite boat 3, and the empty carrier is sent away for recycling through the side conveyor belt 12;

[0067] After the semiconductor is processed and formed, it is sent to an oven through a central conveyor belt 2 to solidify the colloid so that the base, chip and cover plate become a whole.

[0068] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor component processing and molding device, characterized in that: include, Base (1), support device; A central conveyor belt (2) passing through the center of the base (1); A graphite boat (3) is placed on the central conveyor belt (2) for transport, and the graphite boat (3) is provided with mounting grooves capable of evenly placing a plurality of bases along the travel direction of the central conveyor belt (2); A bracket (4) is mounted above the base (1); Cross bars (5), two cross bars (5) are arranged above the bracket (4) in parallel with each other and are perpendicular to the central conveyor belt (2); A glue injection assembly (6) is fixedly mounted above the central conveyor belt (2) between the two cross bars (5); A fixed seat assembly (7) is arranged at the center of the base (1), divides the central conveyor belt (2) into two parts, and is located directly below the glue injection assembly (6); The glue injection component (6) comprises: A three-axis robotic arm (61) is fixedly mounted above the central conveyor belt (2) and can be servo-driven to move along the X, Y, and Z axes respectively; A glue injection needle (62) is vertically fixed to the output end of the three-axis mechanical arm (61), capable of heating and injecting glue, and its upper end is connected to a feed conduit; The fixing seat assembly (7) comprises: A central column (71) is vertically fixed on the base (1) as a support; The support plate (72) is fixed above the central column (71) and is located directly below the glue injection assembly (6), and separates the central conveyor belt (2) into conveyor belts running independently at both ends, and a certain gap is left between the support plate and the central conveyor belt (2); A sliding sleeve (74) is provided in the center column (71) below the support plate (72) so as to be able to slide up and down and to rotate. A "C"-shaped connecting rod (75) is fixed to the edge of the sliding sleeve (74). The upper end of the connecting rod (75) extends from the edge of the support plate (72) to the center of a circle above the support plate (72), and a fixing pin (77) is provided at the center of the circle.

2. The semiconductor component processing equipment according to claim 1, characterized in that: Transverse conveyor belts (11) perpendicular to the central conveyor belt (2) are symmetrically arranged on both sides of the central conveyor belt (2) below the transverse bar (5) at the front end of the central conveyor belt (2) in the direction of travel, and a transverse conveyor belt (11) is also arranged on one side of the central conveyor belt (2) below the transverse bar (5) at the rear end of the central conveyor belt (2) in the direction of travel.

3. The semiconductor component processing equipment according to claim 2, characterized in that: A servo-driven lead screw slider (8) is respectively arranged at a position of each of the cross bars (5) corresponding to each of the cross conveyor belts (11); a vertical linear module (9) is connected to each of the lead screw sliders (8); and a suction cup (10) is arranged at the output end of the linear module (9); Side conveyor belts (12) are respectively arranged in the gaps between the two sides of the central conveyor belt (2) and the transverse conveyor belt (11).

4. The semiconductor component processing equipment according to claim 1, characterized in that: A visual module (13) is fixed at a position corresponding to the central conveyor belt (2) on each of the cross bars (5), and the visual module (13) can feedback control the central conveyor belt (2) so that the suction cup (10) is aligned with the mounting groove of the graphite boat (3).

5. The semiconductor component processing equipment according to claim 1, characterized in that: The support plate (72) is provided with at least two transmission rollers (73) passing through its upper surface in a servo-rotatable manner, and the rotation direction of the transmission rollers (73) is the same as the travel direction of the central transmission belt (2); Furthermore, the distance between the transmission roller (73) and the central transmission belt (2) is less than the length of the graphite boat (3), and the upper surface of the transmission roller (73) and the upper surface of the central transmission belt (2) are in the same plane.

6. The semiconductor component processing equipment according to claim 1, characterized in that: A horizontal downward pressing magnet (63) is fixedly sleeved above the injection needle (62), a driven magnet (76) is fixedly mounted on the connecting rod (75) above the transmission roller (73), and the lower surface of the downward pressing magnet (63) and the upper surface of the driven magnet (76) have the same magnetic pole direction; Furthermore, a support spring (78) is provided between the sliding sleeve (74) and the base (1), and the support spring (78) provides an elastic force to keep the fixing needle (77) away from the support plate (72).

7. The semiconductor component processing equipment according to claim 6, characterized in that: A plurality of guide magnets (64) are distributed circumferentially below the downward pressing magnet (63), and the magnetic poles on the periphery of the guide magnets (64) are the same as the magnetic poles on the sides of the driven magnets (76).

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