Electronic device and method for manufacturing first and second electronic devices from combined components

Abstract

The present invention relates to an electronic device and a method for manufacturing a first electronic device and a second electronic device from components of a composite component, wherein the electronic device has a cooling body, the cooling body has a contact surface, a power module is arranged on the contact surface, a frame part of the electronic device is arranged on the contact surface, the power module is received in the frame part, and the frame part is defined by a raised portion of the cooling body protruding at the edge of the contact surface.

Description

Technical Field

[0001] The present invention relates to an electronic device and a method for producing a first electronic device and a second electronic device from a component / module. Background Art

[0002] Electronic devices having a cooling element / heat sink are generally known.

[0003] As the closest prior art, a cooling assembly having a fastening frame is known from US 2004 / 0 252 461 A1.

[0004] A component for shielding against unwanted electromagnetic radiation is known from US 2001 / 0 026 440 A1.

[0005] A cooling assembly having a plurality of fastening points is known from US Pat. No. 6,639,800 B1.

[0006] From document DE 10 2019 001 113 A1 an electronics assembly is known which comprises electronics which can be fastened to a carrier element.

[0007] A positioning device for a cooling fin is known from DE 20 2008 001 996 U1.

[0008] A cooling assembly for an integrated circuit is known from US Pat. No. 6,442,045 B1.

[0009] A heat sink / heat sink is known from US 837 753 S

[0010] An electronic device, in particular a converter, is known from DE 10 2011 010 429 A1. Summary of the Invention

[0011] It is therefore an object of the present invention to provide an electronic device which can be manufactured at low cost.

[0012] According to the invention, this object is solved in an electronic device and a method according to the features described below.

[0013] An important feature of the present invention in an electronic device, in particular an inverter or a converter, is that the electronic device comprises a heat sink / radiator having a contact surface, a power module being arranged on the heat sink, and in particular a thermal paste being arranged between the contact surface and the power module.

[0014] wherein a frame part of the electronic device is arranged, in particular placed, on the contact surface, wherein the power module is accommodated in the frame part,

[0015] The frame part is delimited by a raised portion of the heat sink that projects at the edge of the contact surface.

[0016] In particular, the heat sink is made of metal, while the frame part is made of plastic, in particular is embodied as an injection-molded part.

[0017] The advantage here is that a wide variety of electronic devices can be produced from a modular assembly having only a few components. By using a frame part—which can be arranged on the contact surface without the frame part—smaller power modules can be introduced onto the contact surface.

[0018] In an advantageous embodiment, the power module is electrically connected to a printed circuit board arranged on a side of the power module facing away from the contact surface.

[0019] In particular, the contacts of the power module are arranged to press onto the conductor tracks / conductor paths of the printed circuit board for electrical contact. Advantageously, the electrical contact is established by pressing the printed circuit board onto the elastically embodied or supported contacts of the power module. This eliminates the need for soldering connections, allowing the power module to be arranged on the contact surface in a first manufacturing step, and the printed circuit board to be placed and screwed to the heat sink in a subsequent second manufacturing method step, and / or the retaining plate to be placed on the printed circuit board and pressed in place using the screw heads of screws screwed into threaded holes in the power module. The power module can be positioned relative to the printed circuit board using protruding positioning pins formed on the power module, wherein the positioning pins and screws extend through respective recesses in the printed circuit board.

[0020] In one advantageous embodiment, a retaining plate is arranged on the side of the circuit board facing away from the power module. This retaining plate—in particular, the screw heads of screws at least partially screwed into threaded holes in the power module—is pressed onto the circuit board, and in particular, the circuit board is thus pressed onto the power module. This advantageously allows the contacts of the power module to be pressed onto the conductor tracks of the circuit board in a simple manner.

[0021] In an advantageous embodiment, the frame part has a projection, in particular a nose, on its inner side, which protrudes toward the power module.

[0022] In particular, multiple contacts in the projections contact the power module. Advantageously, the projections can approximately achieve point contact and are arranged elastically, thereby enabling the power module to be elastically centered on the contact surface.

[0023] In one advantageous design, the power module is accommodated on the inner side of the frame member, while the outer side of the frame member is accommodated by the heat sink, in particular, by the raised portion. Advantageously, the frame member is positioned between the raised portion, which extends intermittently around the contact surface, and the power module. Thus, the frame member rests on the contact surface, supported by the positioning pins, on the circuit board and centered thereon. Conversely, the frame member is supported on the raised portion, which extends intermittently around the contact surface, by means of the raised portion that enables point contact. Consequently, the raised portion is not continuous around the contact surface in the circumferential direction, but rather has interruptions.

[0024] In an advantageous embodiment, in which each projection is formed on a respective web, the web delimiting the corresponding gap,

[0025] Especially wherein, corresponding slit is less than extending on the direction perpendicular to this direction from the slit pointing to the projection. Advantageously, the web is very thin and therefore elastically deformable, thereby the projection also can be elastically deformed.

[0026] In an advantageous embodiment, the frame part has a projection, in particular a nose, on its outer side, which projects toward the elevation formed on the heat sink.

[0027] In particular, the plurality of contact ridges in the raised portion,

[0028] Especially wherein, bulge is multi-partial, ie multi-piece-type. Advantageously here, bulge is arranged elastically and thus forms elastic centering / centering.

[0029] In an advantageous embodiment, the frame element has a positioning pin area, which is supported on the circuit board, in particular on a side of the circuit board facing away from the holding plate. Advantageously, the frame element is arranged in a restricted manner in all spatial directions.

[0030] In an advantageous embodiment, the frame element has two spaced-apart slots on at least one shortest connecting line between the power module and the raised portion, wherein a first of the two slots is closer to the power module than a second of the two slots. Advantageously, the slots are longitudinal slots oriented parallel to the surface closest to them.

[0031] In an advantageous embodiment, the power module comprises controllable semiconductor switches of the inverter, in particular IGBTs or MOSFETs. Advantageously, a three-phase voltage can be provided for the electric machine.

[0032] In an advantageous embodiment, the raised portion is spaced apart from the printed circuit board, and the power module contacts both the heat sink, in particular the contact surface of the heat sink, and the printed circuit board. Advantageously, the power module can be centrally positioned in a simple manner.

[0033] In an advantageous embodiment, the contact surface is flat, which advantageously enables a low heat transfer resistance between the contact surface and the power module.

[0034] In an advantageous embodiment, the contact surface is parallel to the circuit board.

[0035] In particular, the positioning pins are oriented perpendicularly to the contact surface. Advantageously, the positioning pins are subjected to pressure in the direction of the normal to the circuit board plane.

[0036] In an advantageous embodiment, the cooling air flow conveyed by the fan is guided along the side of the heat sink facing away from the contact surface. This advantageously allows for efficient cooling of the heat-generating power modules, since the heat is dissipated to the ambient air on the other side by means of the conveyed air flow.

[0037] In one advantageous embodiment, components of the signal electronics are arranged on the side of the printed circuit board facing away from the power module. The signal electronics generate the drive signals for driving the controllable semiconductor switches of the power module. Advantageously, the signal electronics are thermally separated from the power module by the printed circuit board, which acts as a thermal barrier or at least as a thermal resistor. In particular, the base material of the printed circuit board has a considerable thermal resistance, which is reduced by the plated-through holes. Nevertheless, the printed circuit board still achieves a thermal resistance that creates a temperature drop between the spatial regions of the power module and the signal electronics.

[0038] An important feature of the method of manufacturing a first electronic device and a second electronic device from combined components is that, optionally,

[0039] - the first electronic device is made of a frame part, a cooling body and a first power module,

[0040] - Alternatively, the second electronic device is made of a second power module and a cooling body,

[0041] In particular, the assembly comprises a first power module and a second power module, a frame part and a heat sink having a contact surface,

[0042] In particular, each electronic device is a corresponding inverter or converter,

[0043] (i) wherein, in order to produce the first electronic device, a first power module is arranged on a heat sink having a contact surface, and in particular, a thermal paste is arranged between the contact surface and the first power module,

[0044] wherein the frame part is arranged, in particular placed, on the contact surface, wherein the first power module is accommodated in the frame part,

[0045] The frame part is delimited by a raised portion of the heat sink that projects at the edge of the contact surface.

[0046] (ii) wherein, in order to produce the second electronic device, a further power module is arranged on the heat sink having the contact surface, in particular a thermal paste is arranged between the contact surface and the power module,

[0047] In this case, the second power module is delimited by a raised portion of the heat sink that protrudes at the edge of the contact surface.

[0048] The advantage here is that a wide variety of electronic devices can be manufactured from a small number of components. This is because the smaller first power module—just like the second power module—can be arranged on the same contact surface of the heat sink using a small frame. The frame can be cost-effectively implemented as an injection-molded part, making its cost contribution negligible. However, only a single type of heat sink needs to be available in the component, i.e., in the warehouse of the facility for manufacturing electronic devices. This allows for a larger number of heat sinks and, therefore, allows for cost-effective production of the heat sinks.

[0049] In one advantageous embodiment, the surface area of ​​the contact surface where the first power module contacts the contact surface is smaller than the surface area of ​​the contact surface where the second power module contacts the contact surface. Advantageously, two power modules of different sizes can be selectively arranged on the same contact surface. Consequently, only one type of heat sink needs to be stocked in the assembly used to manufacture this series of electronic devices. This means that the same heat sink that was originally used for power modules of larger dimensions can be used for power modules of smaller dimensions.

[0050] The present invention is not limited to the above-mentioned feature combinations. For a person skilled in the art, further meaningful combinations of the above-mentioned feature combinations and / or individual features and / or features described below and / or features of the drawings will appear to be inferred, in particular from the stated objectives and / or objectives arising from a comparison with the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The present invention is explained in more detail below with reference to the schematic diagram:

[0052] Figure 1 A cutaway oblique view of a converter according to the present invention is shown, the converter comprising a power module 5 , a frame element 4 and a printed circuit board 6 ;

[0053] Figure 2An exploded oblique view of the power module 5 and the frame member 4 on the converter is shown, wherein the circuit board 6 is hidden;

[0054] Figure 3 An oblique view of a cutaway converter is shown, wherein the circuit board 6 is hidden;

[0055] Figure 4 4 shows a top view of the frame member;

[0056] Figure 5 1 and 2 show an oblique view of the frame part 4. DETAILED DESCRIPTION

[0057] As shown in the figure, the converter comprises a housing 1 which is connected to a heat sink 3 having a flat, in particular finely machined, contact surface arranged toward the interior.

[0058] The contact surface is oriented parallel to the printed circuit board 6 , which is spaced apart from the contact surface.

[0059] Boundary projections 25 projecting above the heat sink 3 are formed on the edge of the contact surface, which is in particular substantially rectangular. These boundary projections 25 project upward, ie towards the printed circuit board 6 .

[0060] A frame element 4 is placed on the contact surface. The frame element 4 is designed as a rectangular frame and has a longitudinal slot extending therethrough in the normal direction of the plane receiving the circuit board. This means that the frame element 4 has very little material in the area surrounding the longitudinal slot, so that the frame element can be elastically deflected in a direction perpendicular to the normal direction and the slot direction.

[0061] The longitudinal gaps are delimited by thin webs of material, wherein, when the associated gap region is arranged closer to the interior of the frame part than to the outer edge of the frame part, the webs lie on the inner edge of the frame part and have inwardly projecting projections 21 , in particular noses.

[0062] However, if the gap regions are arranged closer to the outside than to the inner edge of the frame part, the webs rest against the outer edge of the frame part 4 and have outwardly directed projections 23 , in particular noses.

[0063] At the edge of the contact surface, the elevation rises at least partially in the normal direction, but is exceeded by a boundary projection 25 .

[0064] The degree to which the raised portion rises in the normal direction is at least equal to or greater than the wall thickness of the frame member 4 in the normal direction.

[0065] The frame part 4 is thus delimited at its circumferential edge. A positioning pin region 22 is formed on the frame part 4 for delimitation in the normal direction, and is supported on the circuit board 6 .

[0066] The frame part 4 contacts the heat sink 3 via the projections 23, wherein the projections 23 are supported on ridges of the heat sink 3. The projections 23 are formed on the webs delimiting the longitudinal slot and are therefore arranged on the frame part 4 in an elastically resilient manner.

[0067] The frame part 4 is therefore fixed in all spatial directions between the contact surface of the heat sink 3 and the printed circuit board 6 .

[0068] The power module 5 includes controllable semiconductor switches of an inverter, which are configured to supply power to the electric motor. The controllable semiconductor switches are arranged in parallel-connected half-bridges and supplied with a DC voltage, particularly an intermediate circuit voltage. Each of the half-bridges supplies the motor with a phase voltage of an AC voltage, particularly a three-phase voltage, provided by the inverter, at its center tap.

[0069] The power module 5 is accommodated in an inner region of the frame part 4 , such that the power module 5 is surrounded by the frame part 4 in a direction perpendicular to the normal direction, wherein the power module 5 projects beyond the frame part 4 in the normal direction.

[0070] The power module 5 is placed on the contact surface, and in particular a thermal paste is arranged between the power module and the contact surface.

[0071] Protrusions 21 , in particular noses, which protrude inwardly toward the power module 5 on the inner side of the frame part 4 contact the power module 5 and assist in positioning the power module 5 .

[0072] The power module 5 has positioning pins 20 on its side facing away from the contact surface. The positioning pins extend through corresponding recesses, in particular holes, in the circuit board 6 into recesses in the holding plate 2 and thus position the power module 5 relative to the circuit board 6 .

[0073] The retaining plate 2, which is arranged on the side of the circuit board 6 facing away from the power module 5, is screwed into the threaded hole of the power module 5 using screws that pass through the circuit board 6. The screw heads then press the retaining plate 2 onto the circuit board 6 and the circuit board onto the side of the power module 5 facing away from the contact surface. As a result, the circuit board 6 and the power module are also pressed against each other.

[0074] The frame part 4 has at least a discrete rotational symmetry about a rotational axis of symmetry of 180°, wherein the rotational axis of symmetry is oriented parallel to the normal direction and passes through the center of gravity of the frame part 4 .

[0075] As in Figure 4It is clearly shown in the figure that the projections 21, 23 are respectively arranged on respective webs that delimit the corresponding gap, wherein the gap has its smallest extension in the direction from the gap to the corresponding projection and has its largest extension in a direction perpendicular to this direction, that is, in particular in the transverse direction.

[0076] Not all projections 23 rest against the ridges, especially because the ridges do not circumferentially extend continuously but rather intermittently. Therefore, the frame element 4 can also be used in other converters in which projections 23 not shown in the figure are used, i.e., projections that rest against other shaped ridges.

[0077] In a further embodiment according to the invention, the housing 1 and the heat sink 3 are designed integrally, ie in one piece, in particular as an aluminum casting.

[0078] In another embodiment according to the present invention, a power module that is larger than the power module 5 is used, so that the frame part 4 is not required, and the power module can be placed directly on the contact surface, and a protruding boundary protrusion 25 formed and protruding at the edge of the contact surface on the heat sink 3 limits the power module and / or centers the power module.

[0079] In another embodiment of the present invention, the converter is designed solely as an inverter, i.e., it has a DC voltage-side connection for supplying the controllable semiconductor switches of the power module. If necessary, rectifier diodes not used for rectifying the voltage of the AC power supply network are also arranged on the power module. Instead of a converter or inverter, the present invention also encompasses other electronic devices having a power module.

[0080] List of reference numerals:

[0081] 1 Housing

[0082] 2 retaining plates

[0083] 3 Cooling element with a flat, in particular finely machined, contact surface

[0084] 4 frame pieces

[0085] 5 Power Module

[0086] 6 Circuit Board

[0087] 20 positioning pins

[0088] 21 raised portion, especially nose

[0089] 22 locating pin area of ​​frame member 4

[0090] 23 raised portion, especially nose

[0091] 24 Border nose

[0092] 25 Boundary protrusion.

Claims

1. An electronic device, in, The electronic device comprises a cooling body having a contact surface, on which a power module is arranged. It is characterized in that The frame of the electronic device is placed on the contact surface, and the power module is received in the frame. The frame part is delimited by a raised portion of the heat sink that projects at the edge of the contact surface. The power module is received on the inner side of the frame member, and the outer side of the frame member is received by the ridge. The frame part has on its outer side an outwardly directed projection which projects toward a bulge formed on the heat sink. Each of the projections projecting toward the bulge is formed on a respective web delimiting the corresponding slot, so that it is arranged on the frame part in an elastically resilient manner.

2. The electronic device according to claim 1, wherein The electronic device is an inverter or a converter.

3. The electronic device according to claim 1, wherein Thermally conductive paste is arranged between the contact surface and the power module.

4. The electronic device according to claim 1, wherein: The cooling element is made of metal and the frame part is made of plastic.

5. The electronic device according to claim 4, characterized in that The frame part is designed as an injection-molded part.

6. The electronic device according to any one of claims 1 to 5, It is characterized in that The power module is electrically connected to a printed circuit board arranged on a side of the power module facing away from the contact surface. The contacts of the power module are arranged to be pressed onto conductor tracks of the circuit board for electrical contacting.

7. The electronic device according to claim 6, It is characterized in that A holding plate is arranged on the side of the printed circuit board facing away from the power module, said holding plate being pressed onto the printed circuit board, which is thus pressed onto the power module.

8. The electronic device according to claim 7, wherein: The retaining plate is pressed onto the printed circuit board by the screw heads of screws that are at least partially screwed into threaded holes in the power module.

9. The electronic device according to any one of claims 1 to 5, It is characterized in that The frame member has a protrusion on its inner side that protrudes toward the power module, wherein the protrusion protruding toward the power module is a protruding nose. A plurality of the protrusions protruding toward the power module contact the power module.

10. The electronic device according to claim 9, It is characterized in that Each of the protrusions protruding toward the power module is formed on a respective tab, which defines a corresponding gap. The respective slot extends less in a direction from the slot toward the projection protruding toward the power module than in a direction perpendicular to this direction.

11. The electronic device according to any one of claims 1 to 5, It is characterized in that The raised part is the nose. a plurality of contact ridges in the raised portion, The elevation is multi-part, ie, multi-part.

12. The electronic device according to claim 7, It is characterized in that The frame part has a latching region which is supported on the printed circuit board, the latching region being supported on the side of the printed circuit board facing away from the holding plate.

13. The electronic device according to any one of claims 1 to 5, It is characterized in that The frame member has two gaps spaced apart from each other on at least one shortest connecting line between the power module and the raised portion. The first of the two slots is arranged closer to the power module than the second of the two slots.

14. The electronic device according to claim 6, It is characterized in that The power module has controllable semiconductor switches of the inverter, which are IGBTs or MOSFETs. and / or The elevation is spaced apart from the printed circuit board, and the power module contacts both the contact surface of the heat sink and the printed circuit board.

15. The electronic device according to claim 12, It is characterized in that The contact surface is implemented in a flat manner, and / or The contact surface is parallel to the circuit board, The locating pin is perpendicular to the contact surface.

16. The electronic device according to any one of claims 1 to 5, It is characterized in that The cooling air flow conveyed by the fan is guided along the side of the heat sink facing away from the contact surface.

17. The electronic device according to claim 6, It is characterized in that Components of the signal electronics system are arranged on a side of the printed circuit board facing away from the power module, wherein the signal electronics system generates driver signals for driving controllable semiconductor switches of the power module.

18. A method for manufacturing a first electronic device and a second electronic device from components of a combined component, The assembly comprises as its components a first power module and a second power module, a frame part and a heat sink having a contact surface. in, - The first electronic device is assembled from a frame member, a cooling body and a first power module, - The second electronic device is assembled from the second power module and the cooling body, (i) to manufacture a first electronic device, - arranging a first power module on a heat sink having a contact surface, The frame is placed on the contact surface, and the first power module is received in the frame. The frame part is defined by a raised portion of the heat sink that protrudes at the edge of the contact surface, wherein the first power module is received on the inner side of the frame part, and the outer side of the frame part is received by the raised portion. The frame part has, on its outer side, outwardly directed protrusions that protrude toward the raised portion formed on the heat sink, each of the protrusions that protrude toward the raised portion is formed on a respective tab that delimits a corresponding gap, and is thus arranged on the frame part in an elastically resilient manner. (ii) for manufacturing a second electronic device, - arranging a second power module on a heat sink having a contact surface, The second power module is delimited by a projection of the heat sink that projects at the edge of the contact surface.

19. The method according to claim 18, characterized in that The first electronic device and the second electronic device are inverters or converters respectively.

20. The method according to claim 18, wherein Thermal paste is disposed between the contact surface and the first power module.

21. The method according to claim 18, wherein Thermal paste is disposed between the contact surface and the second power module.

22. The method according to any one of claims 18 to 21, It is characterized in that The area of ​​the surface region of the contact surface where the first power module is in contact with the contact surface is smaller than the area of ​​the surface region of the contact surface where the second power module is in contact with the contact surface.

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