Wafer rotation driving device and method of driving wafer rotation

Abstract

The application provides a wafer rotating driving device and a method for driving wafer rotation, wherein the wafer rotating driving device comprises a lifting bracket and a guide piece; the lifting bracket is used for supporting a wafer and moving the wafer along a first direction; the first direction includes a downward direction; a path calibration surface is defined in the wafer rotating driving device, the path calibration surface is vertically perpendicular to the surface of the wafer supported by the lifting bracket, and the center of gravity of the wafer supported by the lifting bracket is in the path calibration surface; the guide piece is located on one side of the path calibration surface; when the lifting bracket moves the wafer along the first direction, the lifting bracket makes the bottom end of the wafer contact the guide piece, and the guide piece is used for pushing the wafer to roll towards the other side of the path calibration surface. The application can drive the wafer to rotate, thereby improving the cleaning effect of the wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a wafer rotation driving device and a method for driving wafer rotation. Background Technology

[0002] As integrated circuit feature sizes enter the deep submicron stage, the requirements for cleaning control in wafer manufacturing processes are becoming increasingly stringent, and cleaning uniformity has become a challenging issue.

[0003] In existing wafer cleaning processes, the nozzles rinse the wafer from one side, and the wafer's position relative to the nozzle remains fixed. This can easily cause a difference in cleaning effect between the end of the wafer closer to the nozzle and the end farther away from the nozzle, which is detrimental to semiconductor manufacturing. Summary of the Invention

[0004] To solve the above problems, the present invention provides a wafer rotation drive device and a method for driving wafer rotation. The wafer is moved downward by a lifting bracket and the wafer comes into contact with a guide member, so that the guide member pushes the wafer to roll to one side, thereby facilitating the cleaning of the wafer by the nozzle from different angles.

[0005] In a first aspect, the present invention provides a wafer rotation driving device, comprising: a lifting bracket and a guide member;

[0006] The lifting bracket is used to support the wafer and drive the wafer to move along the first direction;

[0007] The component of the first direction includes the downward direction;

[0008] The wafer rotation drive device defines a path calibration surface, which is vertically perpendicular to the surface of the wafer supported by the lifting bracket, and the center of gravity of the wafer supported by the lifting bracket is within the path calibration surface.

[0009] The guide is located on one side of the path calibration surface;

[0010] When the lifting bracket moves the wafer along the first direction, the lifting bracket brings the bottom of the wafer into contact with the guide member, which is used to push the wafer to roll toward the other side of the path calibration surface.

[0011] Optionally, the wafer rotation drive device further includes: a support member;

[0012] The support is located on the other side of the path calibration surface;

[0013] When the guide pushes the wafer to roll a specified angle toward the other side of the path calibration surface, the wafer comes into contact with the support, which is used to stop the wafer from rolling toward the other side of the path calibration surface.

[0014] Optionally, the lifting bracket is provided with a slot;

[0015] When the lifting bracket supports the wafer, the lifting bracket is inserted into the wafer through the slot.

[0016] Optionally, when the lifting bracket moves the wafer along the first direction, the center of gravity of the wafer supported by the lifting bracket is within the path calibration plane;

[0017] The wafer rotation driving device further includes: a driving component;

[0018] The drive component is connected to the lifting bracket;

[0019] When the wafer contacts the support member, the drive member is used to drive the lifting bracket to move so that the wafer is disengaged from the slot;

[0020] When the wafer is disengaged from the slot, the drive unit is also used to drive the lifting bracket to move so that the wafer is inserted into the lifting bracket through the slot;

[0021] When the wafer and the support member change from a disengaged state to an engaged state, the driving member is also used to move the lifting bracket to the initial position;

[0022] When the lifting bracket moves the wafer to its initial position, the center of gravity of the wafer supported by the lifting bracket is within the path calibration plane.

[0023] Optionally, the lifting bracket drives the wafer to move along a first direction, and the wafer comes into contact with a first contact point of the guide.

[0024] When the guide pushes the wafer to roll toward the other side of the path marking surface and the wafer comes into contact with the support, the wafer comes into contact with the second contact point of the support;

[0025] The wafer rotation driving device defines a split surface, the distance of the split surface from the first contact point is equal to the distance of the split surface from the second contact point, and the split surface is parallel to or coincides with the path calibration surface;

[0026] The position of the first contact point is higher than or higher than the position of the second contact point.

[0027] Optionally, the wafer rotation drive device further includes: a chassis;

[0028] Both the support member and the guide member are located inside the chassis.

[0029] Optionally, the wafer rotation drive device further includes: a nozzle;

[0030] The nozzle is fixedly connected to the chassis, and the nozzle is used to rinse the wafer.

[0031] In a second aspect, the present invention provides a method for driving a wafer to rotate, comprising:

[0032] A lifting bracket and a guide are provided, wherein a path calibration surface is defined during the movement of the lifting bracket, the path calibration surface is vertically perpendicular to the surface of the wafer supported by the lifting bracket, and the center of gravity of the wafer is within the path calibration surface, and the guide is located on one side of the path calibration surface.

[0033] The drive lifting bracket moves the wafer along a first direction so that the bottom of the wafer contacts the guide member, the first direction including a downward direction.

[0034] Optionally, the support is located on the other side of the path calibration surface;

[0035] When the guide pushes the wafer to roll towards the other side of the path calibration surface by a specified angle, the wafer contacts the support and stops rolling towards the other side of the path calibration surface;

[0036] The method further includes:

[0037] When the wafer comes into contact with the support member, the lifting bracket is driven to move along the first direction so that the lifting bracket separates from the wafer and the support member supports the wafer with the cooperation of the guide member;

[0038] After the lifting bracket separates from the wafer, the lifting bracket is driven to move so that the wafer separates from the support member and the guide member, and the lifting bracket supports the wafer through the slot;

[0039] The drive lift bracket moves the wafer to its initial position;

[0040] When the lifting bracket moves the wafer to its initial position, the center of gravity of the wafer supported by the lifting bracket is within the path calibration plane.

[0041] Optionally, the lifting bracket can move along a second direction and a third direction;

[0042] The second direction includes: the fourth direction and the first opposite direction;

[0043] The third direction includes: the fourth reverse direction and the first reverse direction;

[0044] Alternatively, the third direction may include: a fourth reverse direction;

[0045] The first reverse direction is opposite to the first direction, and the fourth direction is a direction perpendicular to the path calibration surface and toward the support member; the fourth reverse direction is opposite to the fourth direction.

[0046] The steps of driving the lifting bracket to move after the lifting bracket separates from the wafer, so as to separate the wafer from the support member and the guide member, and the lifting bracket supporting the wafer, and the steps of driving the lifting bracket to move the wafer to the initial position, include:

[0047] After the lifting bracket separates from the wafer, the lifting bracket moves in the second direction to a designated transfer position;

[0048] When the lifting bracket moves to the intermediate position along the second direction, the lifting bracket moves to the initial position along the third direction;

[0049] Before the lifting bracket moves to the initial position, the lifting bracket supports the wafer.

[0050] The wafer rotation drive device and method for driving wafer rotation provided in this embodiment of the invention drive the wafer downward by lifting the support and making the wafer come into contact with the guide member. The guide member uses the inertia of the wafer moving downward to push the wafer to one side and roll it. In this way, the angle between the wafer and the nozzle can be changed without adjusting the position of the nozzle relative to the wafer, so that the nozzle can clean the wafer from different angles and thus improve the cleaning effect of the nozzle on the wafer. Attached Figure Description

[0051] Figure 1 This is a structural diagram of a wafer rotation drive device according to an embodiment of the present application, in which the lifting bracket is in its initial position, the position of one contact point is higher than the position of the second contact point, and the path marking surface coincides with the split surface.

[0052] Figure 2 This is a structural diagram of a wafer rotation drive device according to an embodiment of the present application, in which the lifting bracket is in its initial position, the position of one contact point is higher than the position of the second contact point, and the path marking surface coincides with the split surface.

[0053] Figure 3 This is a structural diagram of a wafer rotation drive device according to an embodiment of the present application, in which the lifting bracket drives the wafer to only contact the guide member, and the position of one contact point is higher than the position of the second contact point, and the path marking surface coincides with the split surface.

[0054] Figure 4 This is a structural diagram of a wafer rotation drive device according to an embodiment of this application, in which the support member and guide member jointly support the wafer, the lifting bracket is separated from the wafer, the position of one contact point is higher than the position of the second contact point, and the path marking surface coincides with the split surface.

[0055] Figure 5 This is a structural diagram of a wafer rotation drive device according to an embodiment of the present application, in which a support member and a guide member jointly support the wafer, and a lifting bracket moves to directly below the wafer, with one contact point higher than the position of the second contact point, and the path marking surface coinciding with the split surface.

[0056] Figure 6 This is a structural diagram of a wafer rotation drive device according to an embodiment of the present application, in which the lifting bracket supports the wafer again, and the position of one contact point is higher than the position of the second contact point, and the path marking surface coincides with the split surface.

[0057] Figure 7 This is a structural diagram of a wafer rotation drive device according to an embodiment of the present application, in which a lifting bracket moves a wafer to a position equal to its initial position, a first contact point is higher than the second contact point, and the path marking surface coincides with the split surface.

[0058] Figure 8 This is a structural diagram of a wafer rotation drive device according to an embodiment of the present application, in which the lifting bracket is in its initial position, the position of one contact point is higher than the position of the second contact point, and the path marking surface is parallel to the split surface.

[0059] Figure 9 This is a structural diagram of a wafer rotation drive device according to an embodiment of the present application, in which the lifting bracket is in its initial position, the position of the first contact point is at the same height as the position of the second contact point, and the path marking surface is parallel to the split surface.

[0060] Figure Labels

[0061] 1. Wafer; 2. Lifting bracket; 21. Claw; 3. Guide component; 4. Drive component; 5. Infusion tube; 6. Chassis; 7. Support component; 81. Path calibration surface; 82. Centering surface. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0063] In a first aspect, the present invention provides a wafer rotation driving device, combined with Figure 1 and Figure 2 The wafer rotation drive device includes: a lifting bracket 2, a guide 3, a support 7, a drive 4, a housing 6, and a nozzle. The support 7 and guide 3 are both located inside the housing 6. The nozzle is fixedly connected to the housing 6 and is used to rinse the wafer 1. The lifting bracket 2 supports the wafer 1 and drives it to move along a first direction, the first direction including a downward component. The lifting bracket 2 has a slot. When the lifting bracket 2 supports the wafer 1, it engages with the wafer 1 through the slot. The wafer rotation drive device defines a path calibration surface 81, which is vertically perpendicular to the surface of the wafer 1 supported by the lifting bracket 2. When the lifting bracket 2 drives the wafer 1 to move along the first direction, the center of gravity of the wafer 1 supported by the lifting bracket 2 is within the path calibration surface 81. The guide 3 is located on one side of the path calibration surface 81, and the support 7 is located on the other side of the path calibration surface 81.

[0064] Specifically, the lifting bracket 2 can move the wafer 1 downward in a vertical direction or in a direction with a certain angle to the vertical direction; and when the lifting bracket 2 supports the wafer 1, the wafer 1 is placed vertically and inserted into the claw 21 at the bottom of the lifting bracket 2 through the slot, or the wafer 1 is placed vertically at a certain angle and inserted into the claw 21 at the bottom of the lifting bracket 2 through the slot.

[0065] In this embodiment, the wafer 1 is placed vertically and inserted into the claw 21 at the bottom of the lifting bracket 2 through the slot; the first direction is the vertical downward direction; the guide 3 is located on the right side of the path calibration surface 81, and the support 7 is located on the left side of the path calibration surface 81.

[0066] Combination Figure 3 When the lifting bracket 2 moves the wafer 1 downwards, the lifting bracket 2 causes the bottom end of the wafer 1 to first contact the top of the guide member 3. This allows the wafer 1 to roll counterclockwise to the left under its own weight and the action of the guide member 3. Consequently, the wafer 1 rotates relative to its own center compared to when it was not in contact with the guide member 3. The specific angle of rotation of the wafer 1 when pushed by the guide member 3 is determined by the curvature of the wafer 1 and the relative position of the support member 7 and the guide member 3; this invention does not impose specific limitations on this. In this way, without adjusting the position of the nozzle relative to the wafer 1, the nozzle can clean the wafer 1 from different angles, thereby improving the cleaning effect of the nozzle on the wafer 1.

[0067] Combination Figure 4 When the guide 3 pushes the wafer 1 to roll to the left at a specified angle, the bottom of the wafer 1 comes into contact with the support 7, thereby stopping the wafer 1 from rolling and allowing the wafer 1 to be supported by the support 7 and the guide 3 together.

[0068] Combination Figure 1 and Figure 2 In this embodiment, two infusion tubes 5 are provided at the bottom of the chassis 6. The two infusion tubes 5 are located on the opposite outer sides of the guide 3 and the support 7, and each infusion tube 5 is provided with multiple nozzles. The drive unit 4 is a lifting motor, and the housing of the lifting motor is fixedly connected to the chassis 6. The output shaft of the lifting motor is fixedly connected to the lifting bracket 2. The support 7 and the guide 3 are both vertically placed plate structures, and the bottom of the support 7 and the guide 3 are fixedly connected to the bottom wall of the chassis 6. The claws 21 of the lifting bracket 2 are arrayed with multiple slots along a direction perpendicular to the surface of the wafer 1, so that the wafer rotation drive device can drive multiple wafers 1 to rotate simultaneously.

[0069] Furthermore, in combination Figure 4 , Figure 5 and Figure 1 When the wafer 1 contacts the support member 7, the drive member 4 is also used to drive the lifting bracket 2 to move downward so that the wafer 1 is disengaged from the slot; when the wafer 1 is disengaged from the slot, the drive member 4 is also used to drive the lifting bracket 2 to move so that the wafer 1 is inserted into the lifting bracket 2 through the slot; when the wafer 1 and the support member 7 change from a disengaged state to an inserted state, the drive member 4 is also used to drive the lifting bracket 2 to move to the initial position; when the lifting bracket 2 drives the wafer 1 to move to the initial position, the center of gravity of the wafer 1 supported by the lifting bracket 2 is within the path calibration surface 81.

[0070] Combination Figure 4 , Figure 5 and Figure 1 During the rolling rotation of wafer 1 driven by guide member 3, the center of gravity of wafer 1 shifts to the left. At this point, the claw 21 of the lifting bracket 2 can no longer stably support wafer 1. When wafer 1 contacts support member 7, the driving member 4 continues to drive the lifting bracket 2 downward, so that wafer 1 separates from the claw 21 of the lifting bracket 2; combined with Figure 6 Then, the lifting bracket 2 continues to move. By adjusting the position angle of the claw 21 of the lifting bracket 2 relative to the wafer 1, the claw 21 can stably lift the wafer 1 again and move the wafer 1 to the vertical space where the initial position is located. In this embodiment, the initial position is the initial position of the wafer 1 when it moves along the first direction. When the lifting bracket 2 moves the wafer 1 to the initial position, the nozzle sprays cleaning fluid onto the surface of the wafer 1 to clean it. In this way, the driving member 4 can repeatedly drive the wafer 1 to contact the guide member 3 and rotate the wafer 1 again by a certain angle. This repetitive process can achieve a 360-degree rotation of the wafer 1, so that the nozzle can clean the wafer 1 from different angles, ensuring the uniformity of the cleaning degree of the wafer 1 and thus improving the cleaning efficiency of the wafer 1.

[0071] Furthermore, the drive component 4 can also drive the lifting bracket 2 to move along a second direction and a third direction. The second direction includes a fourth direction and a first opposite direction; the third direction includes a fourth opposite direction and a first opposite direction, or the third direction includes a fourth opposite direction; the first opposite direction is vertically upward, the fourth direction is to the left, and the fourth opposite direction is to the right.

[0072] After the lifting bracket 2 separates from the wafer 1, there are many possible drive paths for the drive unit 4 to move the lifting bracket 2 back to its initial position, as it is simultaneously in contact with the support member 7 and the guide member 3. Several typical drive paths are listed here.

[0073] Combination Figures 4 to 7 and Figure 1 Path 1: After the lifting bracket 2 separates from the wafer 1, firstly, the driving component 4 drives the lifting bracket 2 to move to the left so that the claw 21 is directly below the wafer 1; then, the driving component 4 drives the lifting bracket 2 to move upward, and during this process, the lifting bracket 2 separates the wafer 1 from the support component 7 and the guide component 3, and the bottom of the wafer 1 is once again inserted into the claw 21 through the slot; when the height to which the lifting bracket 2 moves upward is the same as the height of the initial position, the driving component 4 drives the lifting bracket 2 to move to the right so that the lifting bracket 2 moves the wafer 1 to the initial position.

[0074] Path 2: After the lifting bracket 2 separates from the wafer 1, firstly, the driving component 4 drives the lifting bracket 2 to move to the upper left, so that during the movement of the claw 21, the lifting bracket 2 separates the wafer 1 from the support component 7 and the guide component 3, and the bottom of the wafer 1 is inserted into the claw 21 again through the slot; then, when the height to which the lifting bracket 2 moves upward is the same as the height of the initial position, the driving component 4 drives the lifting bracket 2 to move to the right, so that the lifting bracket 2 moves the wafer 1 to the initial position.

[0075] Path 3: After the lifting bracket 2 separates from the wafer 1, firstly, the driving component 4 drives the lifting bracket 2 to move upward and to the left; then, the driving component 4 drives the lifting bracket 2 to move upward and to the right, so that the lifting bracket 2 moves the wafer 1 to the initial position. Either of the above two steps can be selected to complete the action of the lifting bracket 2 separating the wafer 1 from the support component 7 and the guide component 3, and to allow the bottom of the wafer 1 to re-engage with the claw 21 through the slot. Further details are omitted here.

[0076] Path 4: After the lifting bracket 2 separates from the wafer 1, firstly, the driving component 4 drives the lifting bracket 2 to move to the left so that the claw 21 is located at the lower left of the wafer 1; then, the driving component 4 drives the lifting bracket 2 to move to the upper right so that the lifting bracket 2 moves the wafer 1 to the initial position, and during this process, the bottom of the wafer 1 is once again inserted into the claw 21 through the slot.

[0077] Path 5: After the lifting bracket 2 separates from the wafer 1, firstly, the driving component 4 drives the lifting bracket 2 to move to the left so that the claw 21 is directly below the wafer 1; then, the driving component 4 drives the lifting bracket 2 to move upward until the bottom of the wafer 1 is inserted into the claw 21 again through the slot; after that, the driving component 4 drives the lifting bracket 2 to move to the upper right so that the lifting bracket 2 moves the wafer 1 to the initial position.

[0078] In this embodiment, the lifting bracket 2 drives the wafer 1 to move along the first direction, and the wafer 1 contacts the first contact point of the guide member 3. That is, the first contact point is the position where the guide member 3 first contacts the wafer 1 when the wafer 1 moves along the first direction. When the guide member 3 pushes the wafer 1 to roll toward the other side of the path marking surface 81, and the wafer 1 contacts the support member 7, the wafer 1 contacts the second contact point of the support member 7. That is, the second contact point is the position where the wafer 1 contacts the guide member 3 when the wafer 1 rolls to the left. A split surface 82 is defined in the wafer rotation drive device. The distance of the split surface 82 from the first contact point is equal to the distance of the split surface 82 from the second contact point. The split surface 82 is parallel to or coincides with the path marking surface 81.

[0079] Specifically, when the dividing surface 82 is parallel to the path calibration surface 81, the position of the first contact point is equal to or higher than the position of the second contact point, meaning the length of the support member 7 is equal to or greater than the length of the guide member 3. When the dividing surface 82 coincides with the path calibration surface 81, the position of the first contact point is higher than the position of the second contact point, meaning the length of the support member 7 is greater than the length of the guide member 3.

[0080] Specifically, in combination Figure 8 When the dividing surface 82 is parallel to the path calibration surface 81, and the position of the first contact point is equal to or higher than the position of the second contact point, the dividing surface 82 is located to the left of the path calibration surface 81; combined with Figure 9 When the dividing surface 82 is parallel to the path calibration surface 81 and the position of the first contact point is higher than the position of the second contact point, the dividing surface 82 is located to the left or right of the path calibration surface 81.

[0081] In a second aspect, the present invention provides a method for driving a wafer to rotate, comprising:

[0082] A lifting bracket 2 and a guide 3 are provided. During the movement of the lifting bracket 2, a path calibration surface 81 is defined. The path calibration surface 81 is vertically perpendicular to the surface of the wafer 1 supported by the lifting bracket 2, and the center of gravity of the wafer 1 is within the path calibration surface 81. The guide 3 is located to the right of the path calibration surface 81.

[0083] The drive lifting bracket 2 moves the wafer 1 along a first direction so that the bottom end of the wafer 1 contacts the guide member 3. The first direction includes a downward direction.

[0084] In this embodiment, the support member 7 is located on the left side of the path calibration surface 81; when the guide member 3 pushes the wafer 1 to roll towards the other side of the path calibration surface 81 at a specified angle, the wafer 1 comes into contact with the support member 7, and the wafer 1 stops moving under the combined action of the support member 7 and the guide member 3.

[0085] The method also includes:

[0086] When the wafer 1 comes into contact with the support member 7, the lifting bracket 2 is driven to move along the first direction so that the lifting bracket 2 separates from the wafer 1 and the support member 7 supports the wafer 1 with the cooperation of the guide member 3.

[0087] After the lifting bracket 2 separates from the wafer 1, the lifting bracket 2 is driven to move so that the wafer 1 separates from the support member 7 and the guide member 3, and the lifting bracket 2 supports the wafer 1 through the slot.

[0088] The drive lifting bracket 2 moves the wafer 1 to its initial position.

[0089] When the lifting bracket 2 moves the wafer 1 to the initial position, the center of gravity of the wafer 1 supported by the lifting bracket 2 is at the initial position, and the nozzle is activated to clean the wafer 1.

[0090] Specifically, the lifting bracket 2 can move along a second direction and a third direction; the second direction includes: a fourth direction and a first opposite direction; the third direction includes: a fourth opposite direction and a first opposite direction, or, the third direction includes: a fourth opposite direction; the first opposite direction is opposite to the first direction, the fourth direction is perpendicular to the path calibration plane 81 and toward the support member 7, and the fourth opposite direction is opposite to the fourth direction;

[0091] The steps of driving the lifting bracket 2 to move after it separates from the wafer 1, so that the wafer 1 separates from the support member 7 and the guide member 3, and the lifting bracket 2 supports the wafer 1, and driving the lifting bracket 2 to move the wafer 1 to the initial position, include: after the lifting bracket 2 separates from the wafer 1, the lifting bracket 2 moves in a second direction to a designated intermediate position; when the lifting bracket 2 moves in the second direction to the intermediate position, the lifting bracket 2 moves in a third direction to the initial position; wherein, before the lifting bracket 2 moves to the initial position, the lifting bracket 2 supports the wafer 1.

[0092] The method of driving the wafer to rotate can intermittently drive the wafer 1 to rotate at a certain angle. In this way, the angle between the wafer 1 and the nozzle can be changed without adjusting the position of the nozzle relative to the wafer 1. This makes it easier for the nozzle to clean the wafer 1 from different angles, ensuring the uniformity of the cleaning of the wafer 1 by the nozzle, and thus improving the cleaning effect of the nozzle on the wafer 1.

[0093] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A wafer rotation driving device, characterized in that, include: Support components, lifting brackets, and guide components; The lifting bracket is used to support the wafer and drive the wafer to move along the first direction; The component of the first direction includes the downward direction; The wafer rotation drive device defines a path calibration surface, which is vertically perpendicular to the surface of the wafer supported by the lifting bracket, and the center of gravity of the wafer supported by the lifting bracket is within the path calibration surface. The guide is located on one side of the path calibration surface; When the lifting bracket moves the wafer along the first direction, the lifting bracket makes the bottom end of the wafer contact the guide member, and the guide member is used to push the wafer to roll toward the other side of the path calibration surface; The support is located on the other side of the path calibration surface; When the guide pushes the wafer to roll a specified angle toward the other side of the path calibration surface, the wafer comes into contact with the support, which is used to stop the wafer from rolling toward the other side of the path calibration surface.

2. The wafer rotation driving device according to claim 1, characterized in that, The lifting bracket is provided with a slot; When the lifting bracket supports the wafer, the lifting bracket is inserted into the wafer through the slot.

3. The wafer rotation driving device according to claim 2, characterized in that, When the lifting bracket moves the wafer along the first direction, the center of gravity of the wafer supported by the lifting bracket is within the path calibration plane. The wafer rotation driving device further includes: a driving component; The drive component is connected to the lifting bracket; When the wafer contacts the support member, the drive member is used to drive the lifting bracket to move so that the wafer is disengaged from the slot; When the wafer is disengaged from the slot, the drive unit is also used to drive the lifting bracket to move so that the wafer is inserted into the lifting bracket through the slot; When the wafer and the support member change from a disengaged state to an engaged state, the driving member is also used to move the lifting bracket to the initial position; When the lifting bracket moves the wafer to its initial position, the center of gravity of the wafer supported by the lifting bracket is within the path calibration plane.

4. The wafer rotation driving device according to claim 1, characterized in that, The lifting bracket drives the wafer to move along a first direction, and the wafer comes into contact with the first contact point of the guide. When the guide pushes the wafer to roll toward the other side of the path calibration surface and the wafer comes into contact with the support, the wafer comes into contact with the second contact point of the support; The wafer rotation driving device defines a split surface, the distance of the split surface from the first contact point is equal to the distance of the split surface from the second contact point, and the split surface is parallel to or coincides with the path calibration surface; The position of the first contact point is higher than or higher than the position of the second contact point.

5. The wafer rotation driving device according to claim 1, characterized in that, The wafer rotation drive device further includes: a chassis; Both the support member and the guide member are located inside the chassis.

6. The wafer rotation driving device according to claim 5, characterized in that, The wafer rotation drive device further includes: a nozzle; The nozzle is fixedly connected to the chassis, and the nozzle is used to rinse the wafer.

7. A method for driving a wafer to rotate, characterized in that, include: A lifting bracket and a guide are provided. During the movement of the lifting bracket, a path calibration surface is defined, which is vertically perpendicular to the surface of the wafer supported by the lifting bracket, and the center of gravity of the wafer lies within the path calibration surface. The guide is located on one side of the path calibration surface, and a support is located on the other side. When the guide pushes the wafer to roll towards the other side of the path calibration surface by a specified angle, the wafer contacts the support, and the wafer stops rolling towards the other side of the path calibration surface. The drive lifting bracket moves the wafer along a first direction so that the bottom of the wafer contacts the guide member, the first direction including a downward direction.

8. The method according to claim 7, characterized in that, The lifting bracket is provided with a slot; The method further includes: When the wafer comes into contact with the support member, the lifting bracket is driven to move along the first direction so that the lifting bracket separates from the wafer and the support member supports the wafer with the cooperation of the guide member; After the lifting bracket separates from the wafer, the lifting bracket is driven to move so that the wafer separates from the support member and the guide member, and the lifting bracket supports the wafer through the slot; The drive lift bracket moves the wafer to its initial position; When the lifting bracket moves the wafer to its initial position, the center of gravity of the wafer supported by the lifting bracket is within the path calibration plane.

9. The method according to claim 8, characterized in that, The lifting bracket can move along a second direction and a third direction; The second direction includes: the fourth direction and the first opposite direction; The third direction includes: the fourth reverse direction and the first reverse direction; Alternatively, the third direction may include: a fourth reverse direction; The first reverse direction is opposite to the first direction, and the fourth direction is a direction perpendicular to the path calibration surface and toward the support member; the fourth reverse direction is opposite to the fourth direction. The steps of driving the lifting bracket to move after the lifting bracket separates from the wafer, so as to separate the wafer from the support member and the guide member, and the lifting bracket supporting the wafer, and the steps of driving the lifting bracket to move the wafer to the initial position, include: After the lifting bracket separates from the wafer, the lifting bracket moves in the second direction to a designated transfer position; When the lifting bracket moves to the intermediate position along the second direction, the lifting bracket moves to the initial position along the third direction; Before the lifting bracket moves to the initial position, the lifting bracket supports the wafer.

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