A C-band all-solid-state broadband high-power amplifier

Abstract

The present invention discloses a C-band all-solid-state broadband high-power amplifier, which belongs to the field of communication technology. It includes a splitter, a power amplifier, and a combiner; the splitter and the combiner are realized by radial power synthesis; the power amplifier and the combiner are installed on the same bottom radiator; the signal after power division by the splitter enters the power amplifier through a radio frequency cable and is amplified, and then output to the broadband combiner through a coaxial interface; the combiner performs power synthesis and then outputs. The present invention realizes a broadband high-power amplifier by adopting a combiner with an easy-to-assemble coaxial interface and a modular power amplifier module, thereby improving the maintainability of the equipment and enhancing the stability of the system.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a C-band all-solid-state broadband high-power amplifier. Background Art

[0002] With the development of scatter communication technology, the requirements for the transmission power of C-band communication systems are getting higher and higher. At present, the hundreds of watts of solid-state power amplifiers widely used in the C-band of scatter communication systems usually use about a dozen or so power amplifier tubes of tens of watts for power synthesis. The existing amplifier bandwidth is relatively narrow, about 600MHz, which cannot meet the high-speed and miniaturization requirements of scatter communication. Summary of the invention

[0003] In view of this, the present invention provides a C-band all-solid-state broadband high-power amplifier. The power capacity of the present invention can reach 500W, and the bandwidth reaches 2100MHz, and the size is small, the weight is light, and the heat dissipation efficiency is high.

[0004] In order to achieve the above object, the technical solution adopted by the present invention is:

[0005] A C-band all-solid-state broadband high-power amplifier comprises a plurality of power amplifiers, a splitter and a combiner, wherein one end of the power amplifier is connected to the splitter and the other end is connected to the combiner, and the plurality of power amplifiers are connected in parallel; the power amplifier comprises a cylindrical shell structure with a cylindrical cavity inside, the bottom of the cylindrical cavity is a circular surface, an output matching cone is arranged at the center of the circular surface, and the top of the output matching cone is exposed from the cylindrical shell; a cylindrical ring structure as an output coaxial interface is also arranged at the top of the cylindrical shell, the inner ring of the cylindrical ring is directly opposite to the output matching cone exposed at the top, and the inner diameter of the cylindrical ring is the same as the diameter of the top of the output matching cone;

[0006] A plurality of output matching blocks arranged in a circular array are arranged in the cylindrical cavity, and the center of the circular array coincides with the center of the circular surface; uniformly arranged input coaxial interfaces are provided on the side wall of the cylindrical shell, and the inner conductor of the input coaxial interface passes through the cylindrical shell and is welded to one end of the input matching block.

[0007] Furthermore, the input matching block is a step structure, and the step height decreases from its input end to its output end.

[0008] Furthermore, the power amplifier and the combiner are both fixed on the upper surface of the high heat flux density heat sink, and the power amplifier is radially distributed around the combiner with the combiner as the center, and is connected to the combiner through a coaxial connector.

[0009] Furthermore, the input coaxial interfaces of the power amplifier and the splitter correspond one to one, and the input coaxial interfaces are connected one to one with the input matching blocks.

[0010] The beneficial effects of the above technical solution of the present invention are:

[0011] (1) The present invention adopts three-dimensional assembly of circuit modules to realize the integration of input power amplification and output power synthesis, so that the power amplifier module parts with concentrated heat density are evenly distributed above the heat sink, thereby improving the heat dissipation efficiency;

[0012] (2) The combiner of the present invention is a high-power broadband radial combiner, which is small in size and light in weight, and does not require high processing and manufacturing precision, thereby improving system reliability and manufacturability;

[0013] (3) The splitter and combiner of the present invention are realized by an assembled structure, which is convenient for processing and reduces the influence of human factors in assembly, reduces the assembly process, improves the equipment quality, and enhances the stability of the system;

[0014] (4) The power capacity of each power amplifier module of the present invention can reach 100W, and the power output capacity of the entire C-band power amplifier can reach 500W. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a block diagram of a power amplifier implementation of the present invention;

[0016] Figure 2 It is a schematic diagram of the structure of the power amplifier of the present invention;

[0017] Figure 3 It is a diagram of the internal structure of the combiner of the present invention.

[0018] In the figure: 1. splitter, 2. power amplifier, 3. combiner, 4. high heat flux density heat sink, 3-1. input coaxial interface, 3-2. input matching block, 3-3. output matching block, 3-4. output coaxial interface, 3-5. combiner cavity. DETAILED DESCRIPTION

[0019] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] A C-band high-power solid-state power amplifier comprises a splitter 1, power amplifiers 2 (1 to 6), a combiner 3, and a heat sink 4. The splitter 1 divides an input signal into 6 equal-amplitude and in-phase signals to drive the power amplifiers 2 (6 channels). The 6 channels of signals output by the power amplifiers are output after being power-combined by the combiner 3.

[0022] The power amplifier 2 (1 to 6) adopts an SMA-K input interface and an SMA-J output interface and is fastened to the heat sink 4 by four fastening screws.

[0023] The splitter 1 and the combiner 3 use the same structure, in which the splitter and the combiner are dual structures. The splitter 1 and the combiner 3 are implemented with a coaxial radial structure. The combiner output matching cylindrical cone 3-3 and the combiner cavity 3-5 are formed by precision CNC turning of aluminum alloy blanks; the combiner input matching block 3-2 is formed by CNC milling and welded to the combiner cavity 3-5. Through composite processing and assembly, the influence of human factors is reduced, the accuracy of the combiner is improved, and the quality of the equipment is enhanced.

[0024] The power amplifier 2 and the combiner 3 are connected via a coaxial interface. The six power amplifiers 2 and the combiner 3 are fastened to the high heat flux density radiator 4 only by fastening screws so that the heat generated during operation is evenly and quickly conducted to the high heat flux density radiator 4. When a power amplifier 2 fails, it can be replaced by simply removing the screw fasteners connecting it to the combiner 3.

[0025] Figure 1 The present invention is a C-band all-solid-state broadband high-power amplifier implementation block diagram. The present invention is a C-band all-solid-state broadband high-power amplifier, comprising a splitter 1, a power amplifier 2, and a combiner 3; a driving signal is divided into 6 equal-amplitude and in-phase signals by the splitter 1 to drive the power amplifier 2 (6 channels), and the signal amplified by the amplifier is input into the combiner 3 for power synthesis and then output.

[0026] Figure 2 This is a schematic diagram of the structure of the C-band all-solid-state broadband high-power amplifier of the present invention, in which the power amplifier and the combiner are designed in one plane through an integrated design. The C-band all-solid-state broadband high-power amplifier is a two-layer structure, and the bottom layer is a high heat flux density heat sink 4; the power amplifier 2 (6-way) and the combiner 3 are fastened to the heat sink 4 by screws; the power amplifier 2 is radially distributed around the combiner with the combiner 3 as the center, and is connected to the combiner 3 through a coaxial connector. This assembly method can not only reduce the connection cables between the power amplifier 2 and the combiner 3, reduce unnecessary additional losses, but also facilitate the modularization of the vulnerable module power amplifier 2. The power amplifier 2 module can be individually disassembled by tightening the screws, thereby improving manufacturability and maintainability.

[0027] Figure 3 It is the combiner 3 of the present invention, the input and output are both coaxial interfaces, the output coaxial interface 3-4 is output at the center of the combiner cavity 3-5, and the input coaxial interface 3-1 is radially evenly distributed at the edge of the combiner cavity 3-5. The combiner 3 is mainly composed of 5 parts, the input coaxial interface 3-1, the input matching block 3-2, the output matching block 3-3, the output coaxial interface 3-4 and the combiner cavity 3-5. The combiner cavity 3-2 and the output matching block 3-3 are formed by turning, the inner conductor of the input coaxial interface 3-1 is welded to the input matching block 3-2, the input matching block 3-2 is welded to the combiner cavity 3-5, and the output coaxial interface 3-4 is welded to the output matching block 3-3.

[0028] Brief working principle of the present invention:

[0029] The RF signal is divided into 6 RF drive signals with equal amplitude and phase by splitter 1; the 6 RF drive signals after power division enter power amplifier 2 for power amplification respectively; the amplified power signal enters combiner 3 again for power synthesis and then output.

Claims

1. A C-band all-solid-state broadband high-power amplifier, comprising a plurality of power amplifiers, characterized in that: It also includes a splitter and a combiner, one end of the power amplifier is connected to the splitter, and the other end is connected to the combiner, and multiple power amplifiers are connected in parallel; the power amplifier includes a cylindrical shell structure with a cylindrical cavity inside, the bottom of the cylindrical cavity is a circular surface, an output matching cone is arranged at the center of the circular surface, and the top of the output matching cone is exposed from the cylindrical shell; the top of the cylindrical shell is also provided with a cylindrical ring structure as an output coaxial interface, the inner ring of the cylindrical ring is directly opposite to the output matching cone exposed at the top, and the inner diameter of the cylindrical ring is the same as the diameter of the top of the output matching cone; A plurality of input matching blocks arranged in a circular array are arranged in the cylindrical cavity, and the center of the circular array coincides with the center of the circular surface; uniformly arranged input coaxial interfaces are arranged on the side wall of the cylindrical shell, and the inner conductor of the input coaxial interface passes through the cylindrical shell and is welded to one end of the input matching block; The input matching block is a step structure, and the step height decreases from its input end to its output end; The power amplifier and the combiner are both fixed on the upper surface of the high heat flux density heat sink, and the power amplifier is radially distributed around the combiner with the combiner as the center, and is connected to the combiner through a coaxial connector; The power amplifier and the input coaxial interface of the splitter correspond to each other one by one, and the input coaxial interface is connected to the input matching block one by one.

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