First-in-first-out transport equipment and method of using the same

Abstract

The embodiment of the present application is about a first-in-first-out transport device and a method of using the same, which is used for two or more substrates. The first-in-first-out transport device includes a clamping and stacking device, a robotic arm, and a material picking device. The clamping and stacking device transfers each substrate to each clamp, and drives each clamp to clamp each substrate to form a substrate clamp assembly, and then stacks two or more substrate clamp assemblies in sequence from 1 to N on a first movable support frame along a predetermined direction; the robotic arm transfers two or more substrate clamp assemblies to the material picking device; the material picking device transfers two or more substrate clamp assemblies in sequence from 1 to N to a second movable support frame along a predetermined direction, and a substrate picking mechanism is arranged corresponding to the second movable support frame. The substrate picking mechanism drives each clamp to release from each substrate, and then transfers each substrate from each clamp to a substrate collection table.

Description

Technical Field

[0001] The present application relates to a transport device for circuit boards, and more particularly to a first-in-first-out transport device and a method of using the same. Background Art

[0002] As the demand for various printed circuit boards increases, manufacturers must also increase production to meet the demand. Therefore, in recent years, many factories have gradually introduced automated equipment to carry out production to reduce the burden of manpower and obtain a large amount of output in a shorter period of time. At the same time, because the machine does not get tired, the defect rate can be reduced a lot compared to manual production.

[0003] However, during the production process, printed circuit boards need to go through a drying process in a baking oven. Therefore, if an automated drying process is to be introduced, the printed circuit boards must be stacked in batches to improve the drying efficiency. However, how to control the production time of each batch of stacked circuit boards to be the same so that the finished product of each circuit board is consistent is a key point that needs to be improved urgently.

[0004] In view of this, the inventor of the present application has devoted himself to studying the above-mentioned prior art and has applied theoretical knowledge to try his best to solve the above-mentioned problems, which has become the goal of the inventor of the present application. Summary of the invention

[0005] The embodiment of the present application provides a first-in-first-out transport device and a method for using the same, which utilizes two or more substrates to perform each process in sequence from 1 to N along a predetermined direction, thereby facilitating subsequent tracking of the relationship between product problems and substrate process conditions.

[0006] In an embodiment of the present application, the present application provides a first-in-first-out transport device for two or more substrates, the first-in-first-out transport device comprising: a clamping and stacking device, including: two or more clamps; a clamp conveying platform, which sequentially transfers the two or more clamps; a substrate feeding platform, which sequentially transfers the two or more substrates; a first transfer mechanism, which is arranged between the clamp conveying platform and the substrate feeding platform, and the first transfer mechanism includes a first moving support frame; and an assembling mechanism, which is arranged corresponding to the first moving support frame, and the assembling mechanism is used to first move each of the clamps out of the clamp conveying platform, and then transfer each of the substrates from the substrate feeding platform to each of the clamps, and then drive each of the clamps to be clamped on each of the substrates to form a substrate clamp assembly, and then make the two or more substrate clamp assemblies move from 1 to N are sequentially stacked on the first movable support; a robotic arm; and a material taking device, comprising: a placing mechanism, the robotic arm is used to transfer two or more substrate clamp components sequentially stacked from 1 to N along the predetermined direction to the placing mechanism; a second transfer mechanism, comprising a second movable support corresponding to the placing mechanism, the configuration position of the second movable support relative to the placing mechanism is the same as the configuration position of the first movable support relative to the assembling mechanism, the placing mechanism is used to transfer two or more substrate clamp components sequentially from 1 to N along the predetermined direction to the second movable support; a substrate collection table; and a substrate taking mechanism, which is set corresponding to the second movable support, the substrate taking mechanism is used to drive each of the clamps to release from each of the substrates, and then transfer each of the substrates from each of the clamps to the substrate collection table.

[0007] In an embodiment of the present application, the present application provides a method for using a first-in-first-out transport device, the steps of which include: a) providing a clamping and stacking device, the clamping and stacking device includes two or more clamps and a clamp conveying platform, the clamp conveying platform sequentially transfers the two or more clamps; b) providing two or more substrates, the clamping and stacking device further includes a substrate feeding platform, the substrate feeding platform sequentially transfers the two or more substrates; c) the clamping and stacking device further includes a first transfer mechanism and an assembly mechanism, the first transfer mechanism includes a first moving support frame, the assembly mechanism first moves each of the clamps out of the clamp conveying platform, then transfers each of the substrates from the substrate feeding platform to each of the clamps, and drives each of the clamps to be clamped on each of the substrates to form a substrate clamp assembly, and then the two or more substrate clamp assemblies are moved along a predetermined direction by 1 to N are stacked in sequence on the first movable support; d) a robot arm and a material picking device are provided, the material picking device includes a placement mechanism, the robot arm transfers two or more substrate clamp components stacked in sequence from 1 to N along the predetermined direction to the placement mechanism; e) the material picking device further includes a second transfer mechanism, the second transfer mechanism includes a second movable support, the configuration position of the second movable support relative to the placement mechanism is the same as the configuration position of the first movable support relative to the assembly mechanism, the placement mechanism transfers two or more substrate clamp components from 1 to N along the predetermined direction to the second movable support; and f) the material picking device further includes a substrate collection table and a substrate picking mechanism, the substrate picking mechanism drives each clamp to release from each substrate, and then transfers each substrate from each clamp to the substrate collection table.

[0008] Based on the above, a clamping and stacking device is used to first assemble two or more substrates and two or more clamps into two or more substrate clamp assemblies that are stacked in sequence from 1 to N along a predetermined direction. The robotic arm then transports the substrate into a baking furnace or other process station through the clamps of the substrate clamp assemblies. Finally, a material picking device is used to separate the two or more substrate clamp assemblies into two or more substrates and two or more clamps in sequence from 1 to N along a predetermined direction. This allows the production time of each stacked substrate to be the same and the order of entry and exit to remain unchanged, so that the finished products of each substrate maintain the same order and enter subsequent process processing.

[0009] Based on the above, each fixture includes an abutting alignment structure, and any two adjacent substrate fixture components are separated by the abutting alignment structure to prevent the fixtures from being stacked skewed or causing the substrate to be crushed by the upper fixture. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a flowchart of the steps of the method for using the first-in-first-out transport equipment of an embodiment of the present application.

[0011] Figure 2 It is a three-dimensional schematic diagram of the first-in-first-out transport equipment of an embodiment of the present application.

[0012] Figure 3 It is a three-dimensional schematic diagram of the clamp according to an embodiment of the present application.

[0013] Figure 4 It is another three-dimensional schematic diagram of the clamp according to the embodiment of the present application.

[0014] Figure 5 It is a side sectional view of the clamp according to an embodiment of the present application.

[0015] Figure 6 It is a three-dimensional schematic diagram of the clamps of the embodiment of the present application before being overlapped.

[0016] Figure 7 It is a side sectional view of the clamps of the embodiment of the present application when they are stacked.

[0017] Figure 8 It is a three-dimensional schematic diagram of the clamps of the embodiment of the present application when they are overlapped.

[0018] Fig. 9 It is a three-dimensional schematic diagram of the clamping and stacking device of an embodiment of the present application.

[0019] Fig.10 It is another three-dimensional schematic diagram of the clamping and stacking device according to an embodiment of the present application.

[0020] Figures 11 to 18 These are the usage status diagrams (I) to (VIII) of the clamping and stacking device according to the embodiment of the present application.

[0021] Figure 19 to Figure 21 These are the usage status diagrams (I) to (III) of the robotic arm of an embodiment of the present application.

[0022] Fig. 22 It is a three-dimensional schematic diagram of a material taking device according to an embodiment of the present application.

[0023] Fig.23 It is another three-dimensional schematic diagram of the material taking device of an embodiment of the present application.

[0024] Figure 24 to Figure 34 These are the usage status diagrams (I) to (X) of the material taking device according to the embodiment of the present application.

[0025] Description of reference numerals:

[0026] 100: Clamping and stacking device;

[0027] 200: Robotic arm;

[0028] 300: material taking device;

[0029] 400: substrate fixture assembly;

[0030] 10: Clamp;

[0031] 11: Carrying plate;

[0032] 12: Clamping structure;

[0033] 121: fixed plate;

[0034] 122: Clamping shrapnel;

[0035] 1221: clamping part;

[0036] 1222: pressing part;

[0037] 13: Top-to-bottom alignment structure;

[0038] 131: Connecting parts;

[0039] 1311: pad body;

[0040] 1312: latch;

[0041] 132: receiving parts;

[0042] 1321: Column;

[0043] 1322: jack;

[0044] 14: Limiting piece;

[0045] 20: fixture conveying platform;

[0046] 30: Substrate feeding table;

[0047] 40: first transfer mechanism;

[0048] 41: first movable support frame;

[0049] 411: Stacking rack;

[0050] 412: rack;

[0051] 4121: card slot;

[0052] 50: assembly mechanism;

[0053] 51: fixture transfer structure;

[0054] 511: Gripper;

[0055] 52: Substrate fixture assembly structure;

[0056] 521: nozzle;

[0057] 522: Collapsible push rod;

[0058] 53: driving structure;

[0059] 60: placement mechanism;

[0060] 61: first pair of claw hooks;

[0061] 62: second pair of claw hooks;

[0062] 70: second transfer mechanism;

[0063] 71: second movable support frame;

[0064] 80: Substrate collecting table;

[0065] 90: substrate taking mechanism;

[0066] 91: Get the substrate structure;

[0067] 911: Suction nozzle;

[0068] 912: Collapsible push rod;

[0069] 92: Mobile structure;

[0070] A: substrate;

[0071] B: Baking oven;

[0072] d: predetermined direction;

[0073] Steps a~f. DETAILED DESCRIPTION

[0074] The detailed description and technical contents of the embodiments of the present application will be described below with the help of the accompanying drawings. However, the drawings are only for illustrative purposes and are not intended to limit the embodiments of the present application.

[0075] Please refer to Figures 1 to 34 As shown, an embodiment of the present application provides a first-in-first-out transport device and a method of using the same. The first-in-first-out transport device mainly includes a clamping and stacking device 100, a robot arm 200 and a material picking device 300, and the first-in-first-out transport device is used for two or more substrates A.

[0076] like Figure 1 As shown, the steps of the method for using the first-in-first-out transport device of the embodiment of the present application are as follows. First, Figure 2 As shown, the robot arm 200 of the first-in-first-out transport device of the embodiment of the present application moves between the clamping and stacking device 100, two or more baking ovens B and the material taking device 300.

[0077] In addition, if Figures 3 to 8As shown, the clamp 10 is used to clamp and fix the substrate A. The clamp 10 includes a carrying plate 11, two or more clamping structures 12 and abutting alignment structures 13. The two or more clamping structures 12 are installed on the carrying plate 11 and are used to clamp the substrate A. The abutting alignment structures 13 are connected to the carrying plate 11 and formed on the outer side of the substrate A.

[0078] Further explanation is as follows: two or more limiting members 14 are convexly provided on the carrier plate 11, and each limiting member 14 is used to jointly limit the substrate A within the area surrounded by each limiting member 14, and the substrate A is a printed circuit board. Each clamping structure 12 includes a fixing plate 121 and a clamping spring 122, and the fixing plate 121 is connected to the carrier plate 11 so that each clamping structure 12 is fixed on the carrier plate 11. The clamping spring 122 is provided with a clamping portion 1221 and a pressing portion 1222. The clamping portion 1221 is a bar-shaped block and is located at the front end of the clamping spring 122, and can clamp the substrate A together with the carrier plate 11 through its own elastic force when closed. The pressing portion 1223 is located at the rear end of the clamping spring 122, and when the pressing portion 1223 is pushed downward by an external force, it will drive the clamping portion 1221 to open for the substrate A to be placed.

[0079] The abutting alignment structure 13 includes two or more connecting parts 131 and two or more receiving parts 132. Each receiving part 132 is respectively provided for each connecting part 131. Each connecting part 131 includes a pad 1311 and a pin 1312 passing through the pad 1311. Each receiving part 132 includes a column 1321 and a plug hole 1322 provided on the column 1321. Figures 4 to 6 As shown, each column 1321 is respectively attached to each pad 1311, and each pin 1312 is respectively inserted into each insertion hole 1322, so that each clamp 10 will not be too skewed or slip after being stacked, and each clamp 10 can be separated to prevent the substrate A from being directly contacted by the clamp 10 above and damaged.

[0080] Afterwards, the steps of the method for using the first-in-first-out transport device of the embodiment of the present application are as follows. First, Figure 1 Step a, Figure 2 and Figures 9 to 11 As shown, a clamping and stacking device 100 is provided. The clamping and stacking device 100 includes the above-mentioned two or more clamps 10 and a clamp conveying platform 20. The clamp conveying platform 20 sequentially transfers the two or more clamps 10.

[0081] The first-in-first-out transport device of the embodiment of the present application is used to transport two or more fixtures 10 arranged in a horizontal stack, and the fixture conveying platform 20 is a load-bearing platform that can be raised and lowered and is used to stack two or more fixtures 10 .

[0082] Second, if Figure 1Step b, Figure 2 and Figures 9 to 11 As shown, two or more substrates A are provided, and the clamping and stacking device 100 further includes a substrate feeding table 30 , and the substrate feeding table 30 sequentially transfers the two or more substrates A.

[0083] Third, if Figure 1 Step c, Figure 2 and Figures 12 to 18 As shown, the clamping and stacking device 100 further includes a first transfer mechanism 40 and an assembly mechanism 50. The first transfer mechanism 40 includes a first movable support frame 41. The assembly mechanism 50 first moves each clamp 10 out of the clamp conveying platform 20, and then transfers each substrate A from the substrate feeding platform 30 to each clamp 10, and drives each clamp 10 to be clamped on each substrate A to form a substrate clamp assembly 400, and then two or more substrate clamp assemblies 400 are stacked in sequence from 1 to N along a predetermined direction d on the first movable support frame 41, and any two adjacent substrate clamp assemblies 400 are separated by abutting alignment structures 13.

[0084] The details are as follows. The fixture conveying platform 20 and the substrate feeding platform 30 are respectively disposed on the left and right sides of the first movable support frame 41 . The first movable support frame 41 includes a stacking frame 411 that can be raised and lowered and is used to stack two or more substrate fixture assemblies 400 .

[0085] In addition, the assembly mechanism 50 includes a fixture transfer structure 51 , a substrate fixture assembly structure 52 and a driving structure 53 . The fixture transfer structure 51 and the substrate fixture assembly structure 52 are disposed on the driving structure 53 and are simultaneously moved laterally by the driving structure 53 .

[0086] Furthermore, if Fig.12 As shown, the fixture transfer structure 51 transfers each fixture 10 from the fixture conveying platform 20 to the first movable support 41. The fixture transfer structure 51 includes two or more clamping claws 511. The two or more clamping claws 511 are used to clamp each substrate A together for transfer.

[0087] Again, if Figures 13 to 15 As shown, the substrate clamp assembly structure 52 transfers each substrate A from the substrate feeding platform 30 to each clamp 10 , and then drives each clamp 10 to clamp each substrate A to form a substrate clamp assembly 400 .

[0088] Among them, the substrate clamp assembly structure 52 includes two or more suction nozzles 521 and two or more collapsible push rods 522, each suction nozzle 521 is used to jointly adsorb the substrate A, and each collapsible push rod 522 is used to jointly push each pressing part 1222 of each clamping spring 122 to open each clamping structure 12 to place the substrate A.

[0089] The operation process of the clamping and stacking device 100 of the embodiment of the present application is as follows: Fig.11 , the fixture transfer structure 51 first clamps the fixture 10 at the top of the fixture conveying platform 20 through the driving structure 53 and transfers it to the top of the first transfer mechanism 40, and at the same time, the substrate fixture assembly structure 52 is also moved to the top of the substrate feeding platform 30 through the driving structure 53, and the fixture conveying platform 20 will rise up by the distance of one fixture 10 for the next clamping; Fig.12 Then, the fixture transfer structure 51 moves the fixture 10 downward onto the first movable support frame 41, and at the same time, the substrate fixture assembly structure 52 absorbs the substrate A on the substrate feeding table 30 downward; Fig.13 The fixture transfer structure 51 and the substrate fixture assembly structure 52 then rise simultaneously and move to above the fixture conveying platform 20 and the first movable support frame 41 through the driving structure 53 .

[0090] like Fig.14 Then, the fixture transfer structure 51 moves downward for a second clamping to clamp the fixture 10 at the top of the fixture conveying platform 20, and at the same time, the substrate fixture assembly structure 52 moves downward to place the adsorbed substrate A on the fixture 10 on the first movable support 41. When the substrate fixture assembly structure 52 moves downward, each collapsible push rod 522 first pushes the pressing portion 1222 of each clamping spring sheet 122 downward to open each clamping portion 1221 to place the substrate A. Fig.15 Then, the substrate fixture assembly structure 52 places the substrate A on the fixture 10 . At this time, each collapsible push rod 522 will collapse upward and continue to push each pressing portion 1222 .

[0091] like Fig.16 , the fixture transfer structure 51 then lifts up the clamped fixture 10, and at the same time, the substrate fixture assembly structure 52 separates upward from the fixture 10 on the first movable support frame 41; Fig.17 At this time, the fixture conveying platform 20 will rise up by the distance of one fixture 10 for the next clamping, and the first movable support frame 41 will drop down by the distance of one fixture 10 for the next placement; Fig.18 By repeating this process, the substrates A can be placed into the fixtures 10 in sequence, and the assembled substrate fixture components 400 can be stacked on the first transfer mechanism 40 .

[0092] Fourth, if Figure 1 Step d, Figure 20 to Figure 21 and Figure 22 to Figure 24 As shown, a robot arm 200 and a material taking device 300 are provided. The material taking device 300 includes a placing mechanism 60 . The robot arm 200 transfers two or more substrate clamping assemblies 400 stacked in sequence from 1 to N along a predetermined direction d to the placing mechanism 60 .

[0093] Among them, the robot arm 200 first transfers two or more substrate clamp assemblies 400 stacked in sequence from 1 to N along a predetermined direction d from the first movable support 41 to the baking furnace B for baking, and then transfers two or more substrate clamp assemblies 400 stacked in sequence from 1 to N along the predetermined direction d from the baking furnace B to the placement mechanism 60.

[0094] Fifth, if Figure 1 Step e, Figure 20 to Figure 21 and Figure 25 to Figure 26 As shown, the material picking device 300 further includes a second transfer mechanism 70, and the second transfer mechanism 70 includes a second movable support frame 71. The configuration position of the second movable support frame 71 relative to the placement mechanism 60 is the same as the configuration position of the first movable support frame 41 relative to the assembly mechanism 50. The placement mechanism 60 transfers two or more substrate clamp assemblies 400 to the second movable support frame 71 in sequence from 1 to N along a predetermined direction d.

[0095] The placement mechanism 60 of the embodiment of the present application is disposed above the second movable support frame 71 , and the placement mechanism 60 includes a first pair of claw hooks 61 and a second pair of claw hooks 62 , which clamp two or more substrate clamp assemblies 400 in turn.

[0096] In addition, the configuration position of the second movable support 71 relative to the placement mechanism 60 is the same as the configuration position of the first movable support 41 relative to the assembly mechanism 50, that is, when the first movable support 41 is configured below the assembly mechanism 50, the second movable support 71 is also configured below the placement mechanism 60, so that two or more substrate clamp assemblies 400 can be transferred from the first movable support 41 to the second movable support 71 in a stacked state from 1 to N along a predetermined direction d.

[0097] Further explanation is as follows: Figures 24 to 34 As shown, the first pair of claw hooks 61 clamps the first substrate clamp assembly 400 in the order, the second pair of claw hooks 62 clamps the second substrate clamp assembly 400 in the order, the first pair of claw hooks 61 releases the first substrate clamp assembly 400 and transfers it to the second movable support frame 71, then the first pair of claw hooks 61 clamps the third substrate clamp assembly 400, the second pair of claw hooks 62 releases the second substrate clamp assembly 400 and transfers it to the second movable support frame 71, so that each substrate clamp assembly 400 can be transferred to the second movable support frame 71 in sequence from 1 to N along the predetermined direction d.

[0098] Sixth, if Figure 1 Step f, Figure 20 to Figure 21 and Figures 27 to 34As shown, the material taking device 300 further includes a substrate collecting table 80 and a substrate taking mechanism 90 . The substrate taking mechanism 90 drives each clamp 10 to release each substrate A, and then transfers each substrate A from each clamp 10 to the substrate collecting table 80 .

[0099] The second movable support frame 71 and the substrate collecting table 80 of the embodiment of the present application are arranged side by side on the left and right sides of each other. The second movable support frame 71 can be lifted up and down and used to stack two or more clamps 10 .

[0100] The detailed description is as follows. The substrate picking mechanism 90 includes a substrate picking structure 91 and a moving structure 92 that drives the substrate picking structure 91 to move between the second moving support frame 71 and the substrate collection table 80. The substrate picking structure 91 is used to drive each clamp 10 to release each substrate A, and then each substrate A is transferred to the substrate collection table 80 by each clamp 10.

[0101] In addition, the substrate removal structure 91 includes two or more suction nozzles 911 and two or more collapsible push rods 912. Each suction nozzle 911 is used to jointly adsorb the substrate A, and each collapsible push rod 912 is used to jointly push each pressing portion 1222 of each clamping spring 122 to open each clamping structure 12 to place the substrate A.

[0102] Thus, the first-in-first-out transport equipment provided in the embodiment of the present application utilizes a clamping and stacking device 100 to first assemble two or more substrates A and two or more clamps 10 into two or more substrate clamp assemblies 400 that are stacked in sequence from 1 to N along a predetermined direction d. The robot arm 200 then transports the substrate A into a baking furnace B or other process station through the clamp 10 of the substrate clamp assembly 400. Finally, the two or more substrate clamp assemblies 400 are separated into two or more substrates A and two or more clamps 10 in sequence from 1 to N along a predetermined direction d through a material taking device 300. This allows the production time of each stacked substrate A to be the same and the entry and exit order to remain unchanged, so that the finished product of each substrate A maintains the same order and enters the subsequent process, thereby facilitating the subsequent tracking of the relationship between product problems and substrate process conditions.

[0103] In addition, when the clamps 10 are stacked, they are separated by the abutting alignment structure 13 to prevent the clamps 10 from being stacked crookedly or causing the substrate A to be crushed by the upper clamp 10 .

[0104] Furthermore, each clamping structure 12 can clamp the substrate A on the carrier plate 11, and each limit member 14 can limit the substrate A within the limit members 14 to prevent sliding, and the pin 1312 on the connecting member 131 and the socket 1322 on the receiving member 131 can prevent the clamp 10 from being too skewed or slipping when folded.

[0105] In summary, the first-in-first-out transport equipment and the method of use thereof provided in the embodiments of the present application can indeed achieve the intended purpose of use, thereby solving the problems of the prior art.

[0106] The above description is only a preferred feasible embodiment of the present application, which does not limit the protection scope of the present application. Therefore, all changes in equivalent technologies, means, etc. using the contents of the present application specification and drawings are also included in the protection scope of the present application.

Claims

1. A first-in-first-out transport device for two or more substrates, characterized in that: The first-in-first-out transport equipment includes: The clamping and stacking device comprises: Two or more clamps; A fixture conveying platform for sequentially transferring two or more of the fixtures; A substrate feeding table is used to sequentially transfer two or more substrates; A first transfer mechanism is disposed between the fixture conveying platform and the substrate feeding platform, wherein the first transfer mechanism includes a first movable support frame; and An assembly mechanism is provided corresponding to the first movable support, and the assembly mechanism is used to first move each of the clamps out of the clamp conveying platform, then move each of the substrates from the substrate feeding platform to each of the clamps, and then drive each of the clamps to clamp each of the substrates to form a substrate clamp assembly, and then stack two or more of the substrate clamp assemblies in order from 1 to N along a predetermined direction on the first movable support; Robotic arms; and The material taking device comprises: A placement mechanism, wherein the robot arm is used to transfer two or more substrate clamp assemblies stacked in sequence from 1 to N along the predetermined direction to the placement mechanism; A second transfer mechanism comprises a second movable support frame arranged corresponding to the placement mechanism, wherein the configuration position of the second movable support frame relative to the placement mechanism is the same as the configuration position of the first movable support frame relative to the assembly mechanism, and the placement mechanism is used to sequentially transfer two or more substrate clamping assemblies from 1 to N along the predetermined direction to the second movable support frame; a substrate collection table; and The substrate taking mechanism is arranged corresponding to the second movable support frame, and is used for driving each of the clamps to release each of the substrates, and then transferring each of the substrates from each of the clamps to the substrate collecting table.

2. The first-in-first-out transport device according to claim 1, characterized in that: Each of the clamps includes abutment and alignment structure, and any two adjacent substrate clamp components are separated by the abutment and alignment structure. Each of the clamps further includes a carrying plate and two or more clamping structures installed on the carrying plate. Each of the abutment and alignment structures is connected to each of the carrying plates and formed on the outer side of each of the substrates.

3. The first-in-first-out transport device according to claim 2, characterized in that: The fixture conveying platform and the substrate feeding platform are respectively arranged on the left and right sides of the first movable support frame, the fixture conveying platform is a load-bearing platform that can be lifted up and down and is used to stack two or more fixtures, and the first movable support frame includes a stacking rack that can be lifted up and down and is used to stack two or more substrate fixture assemblies.

4. The first-in-first-out transport device according to claim 3, characterized in that: The assembly mechanism includes a fixture transfer structure and a substrate fixture assembly structure. The fixture transfer structure transfers each fixture from the fixture conveying platform to the first movable support frame. The substrate fixture assembly structure transfers each substrate from the substrate feeding platform to each fixture, and then drives each fixture to be clamped on each substrate to form the substrate fixture assembly.

5. The first-in-first-out transport device according to claim 4, characterized in that: Each of the clamping structures includes a fixing plate and a clamping spring, wherein the fixing plate is connected to the carrying plate, and the clamping spring can clamp the substrate by its own elastic force, and the clamping spring is provided with a clamping portion and a pressing portion, wherein the clamping portion is a strip block and is located at one end of the clamping spring, and the pressing portion is located at the other end of the clamping spring, and the clamp transfer structure includes two or more clamping claws, and the two or more clamping claws are used to jointly clamp each of the substrates for transfer, and the substrate clamp assembly structure includes two or more suction nozzles and two or more collapsible push rods, each of the suction nozzles is used to jointly adsorb the substrate, and each of the collapsible push rods is used to jointly push each of the pressing portions of the clamping springs to open each of the clamping structures to place the substrate.

6. The first-in-first-out transport device according to claim 5, characterized in that: The assembling mechanism further comprises a driving structure, the fixture transfer structure and the substrate fixture assembling structure are arranged on the driving structure, and are simultaneously moved laterally by the driving structure.

7. The first-in-first-out transport device according to claim 2, characterized in that: The second movable support frame and the substrate collecting platform are arranged side by side on the left and right sides of each other, and the second movable support frame can be lifted up and down and used to stack two or more clamps.

8. The first-in-first-out transport device according to claim 7, characterized in that: The placement mechanism is arranged above the second movable support frame, and the placement mechanism includes a first pair of claw hooks and a second pair of claw hooks. The first pair of claw hooks and the second pair of claw hooks clamp two or more substrate clamp components in turn and transfer each substrate clamp component to the second movable support frame in sequence from 1 to N along the predetermined direction.

9. The first-in-first-out transport device according to claim 8, characterized in that: The substrate picking mechanism includes a substrate picking structure and a moving structure that drives the substrate picking structure to move between the second moving support frame and the substrate collection table. The substrate picking structure is used to drive each of the clamps to release from each of the substrates, and then transfer each of the substrates from each of the clamps to the substrate collection table.

10. A method for using a first-in-first-out transport device, characterized in that: The steps include: a) providing a clamping and stacking device, the clamping and stacking device comprising two or more clamps and a clamp conveying platform, the clamp conveying platform sequentially transferring the two or more clamps; b) providing two or more substrates, wherein the clamping and stacking device further comprises a substrate feeding table, and the substrate feeding table sequentially transfers the two or more substrates; c) the clamping and stacking device further comprises a first transfer mechanism and an assembly mechanism, wherein the first transfer mechanism comprises a first movable support frame, wherein the assembly mechanism first moves each of the clamps out of the clamp conveying platform, then transfers each of the substrates from the substrate feeding platform to each of the clamps, and then drives each of the clamps to clamp each of the substrates to form a substrate clamp assembly, and then arranges two or more of the substrate clamp assemblies in a stacked order from 1 to N along a predetermined direction on the first movable support frame; d) providing a robot arm and a material taking device, wherein the material taking device comprises a placing mechanism, and the robot arm transfers two or more substrate clamping assemblies arranged in a stacked order from 1 to N along the predetermined direction to the placing mechanism; e) the material taking device further comprises a second transfer mechanism, the second transfer mechanism comprises a second mobile support, the configuration position of the second mobile support relative to the placement mechanism is the same as the configuration position of the first mobile support relative to the assembly mechanism, the placement mechanism transfers two or more substrate clamping assemblies from 1 to N in sequence along the predetermined direction to the second mobile support; and f) The material taking device further comprises a substrate collecting table and a substrate taking mechanism, wherein the substrate taking mechanism drives each of the clamps to release from each of the substrates, and then transfers each of the substrates from each of the clamps to the substrate collecting table.

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