An X-ray imaging method for the dynamic fragmentation behavior of laser-loaded materials and a target structure

Abstract

The present invention discloses an X-ray imaging method for the dynamic fragmentation behavior of laser-loaded materials and a target structure. The target structure includes a backlight wire target, a support plate, a target holder, and a loading target. The target holder includes a backlight part and a loading part. The backlight wire target is arranged on the support plate, the support plate is arranged on the backlight part, and the loading target is arranged on the loading part. The backlight wire target points to the loading target, and the backlight wire target and the loading target are on the same axis. Compared with the target structure used in the traditional pinhole-assisted imaging method, by using the backlight wire target structure instead of the pinhole structure, the size of the backlight source can be constrained to 10-15 μm. Compared with the backlight source size of about 50 μm after the traditional pinhole constraint, a uniform secondary light field distribution can be obtained by using this target structure, thereby improving the accuracy of the high spatio-temporal resolution X-ray imaging effect of the material dynamic fragmentation behavior. The high time resolution of this target structure for the X-ray imaging effect can reach the fs-ns level, the high spatial resolution can reach the μm level, and the photon energy has the characteristic of flexible adjustment.

Description

Technical Field

[0001] The present invention relates to the field of X-ray imaging technology, and particularly to an X-ray imaging method and a target structure for the dynamic fragmentation behavior of laser-loaded materials. Background Art

[0002] In X-ray imaging technology, the pinhole-assisted imaging method is currently commonly used to assist in completion. This method adds a small hole on the side of the X-ray exit surface of the backlight target. Since the initial size of the backlight source is relatively large, the role of the pinhole is to restrict the size of the backlight source, and through the auxiliary effect of the pinhole, the high-resolution imaging effect of a small-size light source can be achieved. To achieve a good restriction effect, the pinhole needs to have a certain thickness. To avoid the plasma hole-blocking effect, the minimum size of the pinhole can only be made to about 50 μm. In addition, since the X-rays generated by the backlight source have inconsistent penetration depths when passing through the center and the edge of the pinhole, it will ultimately lead to a serious non-uniformity in the distribution of the secondary light field after being restricted by the pinhole, resulting in the problem of low imaging result accuracy. Summary of the Invention

[0003] The purpose of the present invention is to provide an X-ray imaging method and a target structure for the dynamic fragmentation behavior of laser-loaded materials, improve the accuracy of the high spatio-temporal resolution X-ray imaging effect of the material dynamic fragmentation behavior, and utilize the backlight wire target structure to obtain a smaller diameter backlight source size and a uniform secondary light field distribution.

[0004] The present invention is achieved through the following technical solutions:

[0005] An X-ray imaging target structure for the dynamic fragmentation behavior of laser-loaded materials includes a backlight wire target, a support plate, a target holder, and a loading target. The target holder includes a backlight part and a loading part. The backlight wire target is arranged on the support plate, the support plate is arranged on the backlight part, and the loading target is arranged on the loading part; the backlight wire target points to the loading target, and the backlight wire target and the loading target are on the same axis. To solve the above technical problems and achieve the corresponding technical effects, compared with the target structure used in the traditional pinhole-assisted imaging method, in the present invention, the backlight wire target structure is used instead of the pinhole structure, and the size of the backlight source can be restricted to 10 - 15 μm. Compared with the backlight source size of about 50 μm restricted by the traditional pinhole, a uniform secondary light field distribution can be obtained by using this target structure, thereby improving the accuracy of the high spatio-temporal resolution X-ray imaging effect of the material dynamic fragmentation behavior. The high time resolution of this target structure for the X-ray imaging effect can reach the fs - ns level, the high spatial resolution can reach the μm level, and the photon energy has the characteristic of being flexibly adjustable.

[0006] Further technical solutions:

[0007] The target structure further includes a light guiding sheet, which is also disposed on the support plate, and the light guiding sheet is disposed on the side of the backlight wire target close to the backlight laser source;

[0008] Furthermore: The light guiding sheet is a semi-transparent thin sheet structure.

[0009] Furthermore: The diameter of the fine wires in the backlight wire target is 10 - 15 μm, and the thickness of the light guiding sheet is adapted to the diameter of the fine wires.

[0010] Furthermore: The target structure further includes a light limiting hole, which is attached to the surface of the loading target and is disposed on the side of the loading target close to the loading laser source.

[0011] Furthermore: The backlight wire target is disposed at the bottom of the support plate along the midline of the bottom surface of the support plate.

[0012] Furthermore: One end of the backlight wire target close to the loading target protrudes from the edge of the support sheet;

[0013] Furthermore: One end of the light guiding sheet close to the loading target also protrudes from the edge of the support sheet, and the protruding length of the light guiding sheet is not less than the protruding length of the backlight wire target.

[0014] Furthermore: The backlight part is provided with a slit for clamping the support plate, and the distance between the backlight wire target and the backlight part is adjustable.

[0015] Furthermore: The loading part is provided with a slot for installing the loading target and the light limiting hole;

[0016] Furthermore: The slot is a countersunk hole with a gradually decreasing diameter from top to bottom.

[0017] Furthermore: The target frame is a frame structure made of a material with a low atomic number.

[0018] Furthermore: The target structure further includes a target rod for connecting an auxiliary target aiming system, and the target rod is fixed to the target frame.

[0019] An X-ray imaging method for the dynamic fragmentation behavior of a laser-loaded material includes the following steps:

[0020] Step S1: Preparation of the target structure, including the preparation and assembly of each component in the target structure;

[0021] Step S2: Installation of the target structure in the target chamber, and fixing the entire target structure to the auxiliary target aiming system of the laser device through the target frame;

[0022] Step S3: Installation of the imaging detector and adjustment of its cooperative positional relationship with the target structure;

[0023] Step S4: Turn on the loading laser source, and the loading laser source acts uniformly on the loading target;

[0024] Step S5: Turn on the backlight laser source, the backlight laser source acts on the backlight wire target, and X-ray is generated at the tip of the wire;

[0025] Step S6: X-ray imaging, the X-ray penetrates the loading target and forms an image on the imaging detector. For the above X-ray imaging method of the dynamic fragmentation behavior of a laser-loaded material, compared with the target structure used in the traditional pinhole-assisted imaging method, in the present invention, the backlight wire target structure is used instead of the pinhole structure, and the size of the backlight source can be constrained to 10-15 μm. Compared with the backlight source size of about 50 μm after the traditional pinhole constraint, a uniform secondary light field distribution can be obtained using this target structure, thereby improving the accuracy of the high spatio-temporal resolution X-ray imaging effect of the material dynamic fragmentation behavior. The high time resolution of this target structure for the X-ray imaging effect can reach the fs-ns level, the high spatial resolution can reach the μm level, and the photon energy has the characteristic of flexible adjustment.

[0026] Further technical solution:

[0027] The preparation of the target structure in Step S1 includes the following steps:

[0028] S11: Use short-pulse laser technology to process the backlight wire target, light guide plate, support plate, target frame, light-limiting hole, loading target and target rod;

[0029] S12: Immerse the backlight wire target, light guide plate, support plate, target frame, light-limiting hole, loading target and target rod in alcohol or acetone;

[0030] S13: Dry the immersed backlight wire target, light guide plate, support plate, target frame, light-limiting hole, loading target and target rod;

[0031] S14: After drying, start the assembly of the target structure. Bond the backlight wire target and the light guide plate to the support plate, and then install the support plate bonded with the backlight wire target and the light guide plate to the backlight part of the target frame;

[0032] Place the loading target in the slot opened on the loading part of the target frame, and then set the light-limiting hole on the loading target;

[0033] Install the target rod at the top of the target frame.

[0034] Further: In Step S3, after adjusting the positional relationship between the imaging detector and the target structure, the backlight wire target, the loading target and the imaging detector are on the same axis, and an opaque filter is provided in front of the imaging detector.

[0035] Further: In step S4, the laser source is evenly loaded onto the loading target through the action of the light-limiting aperture. At this time, spallation and fragmentation phenomena occur on the loading target.

[0036] Further: In step S5, the backlight laser source first irradiates the light-guiding sheet, and through the light-guiding action of the light-guiding sheet, the backlight laser source is guided to the backlight wire target. At this time, the backlight wire target is completely within the aiming field of view of the light-guiding sheet;

[0037] The backlight laser source guided to the backlight wire target excites X-ray radiation at the tip of the wire.

[0038] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0039] 1. In the X-ray imaging method and target structure for the dynamic fragmentation behavior of laser-loaded materials in the present invention, the backlight wire target structure is used instead of the pinhole structure, and the size of the backlight source can be constrained to 10 - 15 μm. Compared with the backlight source size of about 50 μm after traditional pinhole constraint, a uniform secondary light field distribution can be obtained using this target structure, thereby improving the accuracy of the high spatio-temporal resolution X-ray imaging effect for the dynamic fragmentation behavior of materials;

[0040] 2. In the X-ray imaging method and target structure for the dynamic fragmentation behavior of laser-loaded materials in the present invention, the high time resolution of this target structure for the X-ray imaging effect can reach the fs - ns level, the high spatial resolution can reach the μm level, and the photon energy has the characteristic of being flexibly adjustable;

[0041] 3. In the X-ray imaging method and target structure for the dynamic fragmentation behavior of laser-loaded materials in the present invention, since the tip size of the backlight wire target is extremely small, it is extremely difficult to quickly and accurately find the tip in a large laser target chamber. Therefore, by setting up the light-guiding sheet structure, during use, the target structure is first adjusted through the target aiming system so that the backlight laser source finds the light-guiding sheet, and the backlight laser source is guided to the tip of the backlight wire target through the light-guiding sheet, and the X-rays required for the experiment are obtained at the tip.

[0042] 4. In the X-ray imaging method and target structure for the dynamic fragmentation behavior of laser-loaded materials in the present invention, the light-limiting aperture structure is used to constrain the size of the laser beam loaded onto the loading target, avoiding uneven loading at the edge of the laser beam. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts. In the drawings:

[0044] Figure 1 Schematic diagram of the target structure of the present invention;

[0045] Figure 2 Schematic diagram of the installation structure of the backlight wire target of the present invention Figure 1 ;

[0046] Figure 3 Schematic diagram of the installation structure of the backlight wire target of the present invention Figure 2 ;

[0047] Figure 4 Schematic diagram of the X-ray imaging principle using the target structure of the present invention.

[0048] Labels in the drawings and corresponding component names:

[0049] 1 - backlight wire target, 2 - light guide plate, 3 - support plate, 4 - target holder, 5 - collimator hole, 6 - loading target, 7 - target rod, 8 - filter, 9 - image detector, 10 - backlight laser source, 11 - loading laser source, 41 - backlight part, 42 - loading part. Detailed implementation manners

[0050] To make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below with reference to the embodiments and the drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0051] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to those of ordinary skill in the art that: it is not necessary to employ these specific details to practice the present invention. In other embodiments, well-known structures, circuits, materials or methods have not been specifically described in order to avoid obscuring the present invention.

[0052] Throughout the specification, references to "one embodiment", "embodiment", "one example" or "example" mean that the specific features, structures or characteristics described in connection with the embodiment or example are included in at least one embodiment of the present invention. Thus, the phrases "one embodiment", "embodiment", "one example" or "example" appearing throughout the specification are not necessarily all referring to the same embodiment or example. Additionally, the specific features, structures or characteristics may be combined in any suitable combination and / or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art should understand that the diagrams provided herein are for illustrative purposes only and are not necessarily drawn to scale. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0053] In the description of the present invention, the orientation or positional relationship indicated by terms such as "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the protection scope of the present invention.

[0054] Embodiment 1

[0055] As Figures 1 to 4 shown, a target structure for X-ray imaging of the dynamic fragmentation behavior of laser-loaded materials according to the present invention includes a backlight wire target 1, a support plate 3, a target holder 4, and a loading target 6. The target holder 4 includes a backlight part 41 and a loading part 42. The backlight wire target 1 is disposed on the support plate 3, the support plate 3 is disposed on the backlight part 41, and the loading target 6 is disposed on the loading part 42. The backlight wire target 1 points to the loading target 6, and the backlight wire target 1 and the loading target 6 are on the same axis. In this embodiment, the target holder 4 is divided into a backlight part 41 and a loading part 42, which can be respectively used for installing the backlight wire target 1 and the loading target 6, and ensure that the tip of the backlight wire target 1 after installation points to the loading target 6. At this time, the X laser excited at the tip of the backlight wire target 1 can effectively irradiate on the loading target 6, and an image detector 9 is used to detect and record the X-ray image absorbed by the loading target 6 (layered fragmented material). In this embodiment, the filament size of the backlight wire target 1 can reach about 10 μm, so that the size of the backlight source can be constrained to about 10 μm. Compared with the backlight source size of about 50 μm after traditional pinhole constraint, the target structure provided in this embodiment can obtain a uniform secondary light field distribution, thereby improving the accuracy of the high spatio-temporal resolution X-ray imaging effect of the material dynamic fragmentation behavior. Among them, the high time resolution of the X-ray imaging effect can reach the fs-ns level, the high spatial resolution can reach the μm level, and the photon energy has the characteristic of flexible adjustment.

[0056] It also includes a light guide sheet 2, which is also arranged on the support plate 3, and the light guide sheet 2 is arranged on the side of the backlight wire target 1 close to the backlight laser source 10; the light guide sheet 2 is a semi-transparent thin sheet structure. Since the tip size of the fine wires in the backlight wire target 1 is extremely small, it is extremely difficult to quickly and accurately find the wire tip in a large laser target chamber. Therefore, by setting the light guide sheet 2 structure, during use, first adjust the target structure through the target aiming system so that the backlight laser source 10 finds the light guide sheet 2, and the backlight laser source 10 is guided to the wire tip of the backlight wire target 1 through the light guide sheet 2. And the thickness of the light guide sheet 2 is the same as the diameter of the fine wires in the backlight wire target 1. At this time, when the backlight laser source 10 reaches the wire tip, the X-rays required for the experiment can be obtained. And in this embodiment, the light guide sheet 2 is a semi-transparent thin sheet structure. At this time, the backlight laser source 10 can more easily pass through the light guide sheet 2 and excite X-rays at the wire tip of the backlight wire target 1 for experiments. The prerequisite for achieving the above effect is that the distance from the light guide sheet 2 to the backlight wire target 1 is such that the backlight wire target 1 is completely within the aiming field of view of the light guide sheet 2.

[0057] The diameter of the fine wires in the backlight wire target 1 is 10 - 15 μm, and the thickness of the light guide sheet 2 is adapted to the diameter of the fine wires. In this embodiment, the diameter of the fine wires of the backlight wire target 1 can be 10 - 15 μm. At this time, the diameter of the X-rays constrained by the backlight wire target 1 can reach 10 - 15 μm. Compared with the traditional target structure, the diameter of the X-rays generated by the constraint of the backlight wire target 1 is smaller. The uniform secondary light field distribution can be obtained by using this target structure, thereby improving the accuracy of the high spatio-temporal resolution X-ray imaging effect on the dynamic fragmentation behavior of materials.

[0058] It also includes a light limiting hole 5, which is attached to the surface of the loading target 6 and is arranged on the side of the loading target 6 close to the loading laser source 11. In this embodiment, the light limiting hole 5 structure is used to constrain the size of the loading laser beam loaded on the loading target 6 to avoid uneven loading at the edge of the laser beam, thereby affecting the normal progress of the experiment.

[0059] As Figure 2 described, the backlight wire target 1 is arranged at the bottom of the support plate 3 along the midline of the bottom surface of the support plate 3. The advantage of this installation method is that it can keep the backlight wire target 1, the loading target 6 and the image detector 9 on the same axis, ensuring the X-ray imaging effect. At the same time, as Figure 3 shown, the backlight wire target 1 is arranged at the bottom edge of the support plate 3 along the bottom surface edge of the support plate 3. This installation method is simpler than the previous one. At this time, although it may cause the problem that the backlight wire target 1, the loading target 6 and the image detector 9 are not on the same axis, when the thickness of the support plate 3 is very small, this influence on the imaging effect is negligible.

[0060] One end of the backlight wire target 1 close to the loading target 6 protrudes beyond the edge of the support sheet 3. In this embodiment, this section of the backlight wire target 1 protruding beyond the edge of the support sheet 3 serves as the X-ray excitation section. To ensure that the X-rays excited by the backlight wire target 1 can effectively act on the loading target 6, at this time, the protruding part needs to meet the requirement that it will not deform under the influence of its own gravity or other factors, resulting in the backlight wire target 1 and the loading target 6 not being on the same axis, thereby having a negative impact on the imaging effect.

[0061] One end of the light guide sheet 2 close to the loading target 6 also protrudes beyond the edge of the support sheet 3, and the protruding length of the light guide sheet 2 is not less than the protruding length of the backlight wire target 1. In this embodiment, the protruding length of the light guide sheet 2 not being less than the protruding length of the backlight wire target 1 is to ensure that the distance from the light guide sheet 2 to the backlight wire target 1 enables the backlight wire target 1 to be completely within the aiming field of view of the light guide sheet 2.

[0062] The backlight part 41 is provided with a slit for clamping the support plate 3, and the distance between the backlight wire target 1 and the backlight part 41 is adjustable. In this embodiment, the slit provided on the support plate 3 can provide a place for the installation of the support plate 3, and the distance between the backlight wire target 1 connected below the support plate 3 and the backlight part 41 can be adjusted by changing the connection point of the support plate 3 at the slit, so as to direct the backlight laser beam onto the backlight wire target 1 and excite X-rays at its wire tip for imaging experiments.

[0063] The loading part 42 is provided with a slot for installing the loading target 6 and the collimator hole 5. In this embodiment, the setting of the slot is to facilitate the installation of the loading target 6 and the collimator hole 5. The setting of the collimator hole 5 can restrict the size of the loading laser beam loaded onto the loading target and avoid uneven loading at the edge of the laser beam. And in this embodiment, the slot is a countersunk hole with a gradually decreasing diameter from top to bottom. The slot of this structural form can gradually restrict the size of the loading laser beam, thereby enhancing its restraint effect on the size of the loading laser beam and more effectively avoiding the occurrence of uneven loading at the edge of the laser beam.

[0064] The target holder 4 is a frame structure made of a material with a low atomic number. In this embodiment, the target holder 4 is made of a material with a low atomic number, which can avoid the interaction between the X-rays excited by the fine tip of the backlight wire target 1 and the target holder 4 to generate secondary X-rays with higher energy.

[0065] It further includes a target rod 7 for connecting the auxiliary target aiming system, and the target rod 7 is fixed to the target holder 4. In this embodiment, the target rod 7 is mainly used for connecting the target structure and the target aiming system, so as to facilitate the adjustment of the position of the target structure in the target chamber using the target aiming system and ensure that the X-ray imaging experiment can be correctly and effectively completed.

[0066] Embodiment 2

[0067] This embodiment further describes an X-ray imaging method using the target structure described in Embodiment 1.

[0068] As Figures 1 to 4 shown, an X-ray imaging method for the dynamic fragmentation behavior of a laser-loaded material includes the following steps:

[0069] Step S1: Preparation of the target structure, including the preparation and assembly of each component in the target structure; in this embodiment, the filament size of the backlight wire target 1 of the target structure can reach about 10 μm, so that the size of the backlight source can be constrained to about 10 μm. Compared with the backlight source size of about 50 μm after traditional pinhole constraint, using this target structure can obtain a uniform secondary light field distribution, thereby improving the accuracy of the high spatio-temporal resolution X-ray imaging effect on the dynamic fragmentation behavior of the material. Among them, the high time resolution of the X-ray imaging effect can reach the fs-ns level, the high spatial resolution can reach the μm level, and the photon energy has the characteristic of flexible adjustment.

[0070] Step S2: Installation of the target structure in the target chamber, and the entire target structure is fixed to the auxiliary target aiming system of the laser device through the target holder 4; in this embodiment, the target structure is connected to the auxiliary target aiming system through the target rod 7, and then the position of the target structure in the target chamber can be adjusted through the auxiliary target aiming system to meet the experimental requirements.

[0071] Step S3: Installation of the imaging detector 9 and adjustment of its cooperative position relationship with the target structure; in this embodiment, after adjustment by the auxiliary target aiming system, the backlight wire target 1, the loading target 6, and the imaging detector 9 of the target structure are on the same axis. At this time, the X-ray rays excited on the backlight wire target 1 can form a clear and accurate X-ray image on the imaging detector 9 after passing through the loading target 6, which is convenient for analyzing the dynamic fragmentation behavior of the loaded material.

[0072] Step S4: Turn on the loading laser source 11, and the loading laser source 11 acts uniformly on the loading target 6; in this embodiment, the loading laser source 11 can be uniformly loaded onto the loading target 6 and stimulate the spallation fragmentation behavior of the loading target 6.

[0073] Step S5: Turn on the backlight laser source 10, the backlight laser source 10 acts on the backlight wire target 1, and X-ray rays are generated at the tip of the wire; in this embodiment, the backlight laser source 10 first irradiates the light guiding sheet 2, and then the backlight laser source 10 is guided to the tip of the backlight wire target 1 through the light guiding sheet 2, and X-ray rays for the experiment are excited at the tip.

[0074] Step S6: X-ray imaging. The X-ray penetrates the loading target 6 and is imaged on the imaging detector 9. In this embodiment, when the X-ray penetrates the loading target 6, the imaging detector 9 detects and records the X-ray image absorbed by the loading target 6, and then information such as the external contour, internal details, and areal density distribution of the target can be obtained through further image processing.

[0075] The preparation of the target structure in step S1 includes the following steps:

[0076] S11: Processing the backlight wire target 1, light guide sheet 2, support plate 3, target holder 4, collimator hole 5, loading target 6, and target rod 7 using short-pulse laser technology; in this embodiment, the backlight wire target 1, light guide sheet 2, support plate 3, target holder 4, collimator hole 5, loading target 6, and target rod 7 processed by short-pulse laser technology have higher precision and can better meet the precision requirements of the experiment for the target structure, achieving the purpose of obtaining a uniform secondary light field distribution, thereby improving the precision of the high spatio-temporal resolution X-ray imaging effect on the dynamic fragmentation behavior of materials. At the same time, the high time resolution of the X-ray imaging effect can reach the fs - ns level, the high spatial resolution can reach the μm level, and the photon energy has the characteristic of being flexibly adjustable.

[0077] S12: Immersing the backlight wire target 1, light guide sheet 2, support plate 3, target holder 4, collimator hole 5, loading target 6, and target rod 7 in alcohol or acetone; in this embodiment, using alcohol or acetone to soak each component of the target structure can remove the surface impurities and residues attached to the surface during production and processing.

[0078] S13: Drying the soaked backlight wire target 1, light guide sheet 2, support plate 3, target holder 4, collimator hole 5, loading target 6, and target rod 7; in this embodiment, the requirement for drying is that after drying, there are no liquid traces on the surface of each component, so as to ensure that the light conduction of each component is not affected.

[0079] After drying, start assembling the target structure. Bond the backlight wire target 1 and the light guide sheet 2 to the support plate 3, and then install the support plate 3 bonded with the backlight wire target 1 and the light guide sheet 2 to the backlight part 41 of the target holder 4;

[0080] Place the loading target 6 in the slot formed on the loading part 42 of the target holder 4, and then place the collimator hole 5 on the loading target 6;

[0081] Install the target rod 7 at the top of the target holder 4.

[0082] In step S3, after adjusting the positional relationship between the imaging detector 9 and the target structure, the backlight wire target 1, the loading target 6, and the imaging detector 9 are on the same axis, and an opaque filter 8 is provided in front of the imaging detector 9. In this embodiment, the provision of the filter 8 can, on the one hand, prevent the debris generated by laser loading from impacting the imaging detector 9 and causing damage to it. On the other hand, through the combined optimization of the material and thickness of the filter 8, low-energy and some high-energy X-ray rays can be attenuated, improving the monochromaticity level of the light source.

[0083] In step S4, the loading laser source 11 is evenly loaded onto the loading target 6 through the action of the aperture 5. At this time, the loading target 6 exhibits spallation and fragmentation. In this embodiment, when the loading target undergoes spallation and fragmentation, it is necessary to constrain the diameter of the laser beam loaded onto the loading target 6 through the aperture 5 and avoid the uneven loading at the beam edge from affecting the spallation and fragmentation effect of the loading target 6.

[0084] In step S5, the backlight laser source 10 first irradiates the light guide plate 2, and through the light guiding action of the light guide plate 2, the backlight laser source 10 is guided to the backlight wire target 1. At this time, the backlight wire target 1 is completely within the aiming field of view of the light guide plate 2;

[0085] The backlight laser source 10 guided to the backlight wire target 1 excites X-ray rays at the tip of the wire.

[0086] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. An X-ray imaging target structure for the dynamic fragmentation behavior of laser-loaded materials, characterized in that, It includes a backlight wire target (1), a support plate (3), a target holder (4), and a loading target (6). The target holder (4) includes a backlight part (41) and a loading part (42). The backlight wire target (1) is arranged on the support plate (3), the support plate (3) is arranged on the backlight part (41), and the loading target (6) is arranged on the loading part (42); The backlight wire target (1) points to the loading target (6), and the backlight wire target (1) and the loading target (6) are on the same axis. It further includes a light guide sheet (2). The light guide sheet (2) is also arranged on the support plate (3), and the light guide sheet (2) is arranged on the side of the backlight wire target (1) close to the backlight laser source (10); The light guide sheet (2) is a semi-transparent thin sheet structure. The diameter of the fine wire in the backlight wire target (1) is 10 - 15 μm, and the thickness of the light guide sheet (2) is adapted to the diameter of the fine wire. The distance from the light guide sheet (2) to the backlight wire target (1) is such that the backlight wire target (1) is completely within the aiming field of view of the light guide sheet (2).

2. The target structure for X-ray imaging of the dynamic fragmentation behavior of a laser-loaded material according to claim 1, characterized in that, It further includes a light limiting hole (5). The light limiting hole (5) is attached to the surface of the loading target (6) and is arranged on the side of the loading target (6) close to the loading laser source (11).

3. The target structure for X-ray imaging of the dynamic fragmentation behavior of a laser-loaded material according to claim 1, characterized in that, It further includes a target rod (7) for connecting an auxiliary target aiming system. The target rod (7) is fixed to the target holder (4).

4. An X-ray imaging method for the dynamic fragmentation behavior of a laser-loaded material, using the target structure described in any one of claims 1 to 3, characterized in that, It includes the following steps: Step S1: Preparation of the target structure, including the preparation and assembly of each component in the target structure; Step S2: Installation of the target structure in the target chamber. The entire target structure is fixed to the auxiliary target aiming system of the laser device through the target holder (4); Step S3: Installation of the imaging detector (9) and adjustment of its cooperative positional relationship with the target structure; Step S4: Turn on the loading laser source (11), and the loading laser source (11) acts uniformly on the loading target (6); Step S5: Turn on the backlight laser source (10). The backlight laser source (10) acts on the backlight wire target (1) and generates X-ray rays at the tip of the wire; Step S6: X-ray imaging. The X-ray rays penetrate the loading target (6) and are imaged on the imaging detector (9).

5. The X-ray imaging method for the dynamic fragmentation behavior of a laser-loaded material according to claim 4, characterized in that, Step S1, the preparation of the target structure includes the following steps: S11: Process the backlight wire target (1), light guide sheet (2), support plate (3), target holder (4), light limiting hole (5), loading target (6), and target rod (7) using short pulse laser technology; S12: Immerse the backlight wire target (1), light guide sheet (2), support plate (3), target holder (4), light limiting hole (5), loading target (6), and target rod (7) in alcohol or acetone; S13: Dry the immersed backlight wire target (1), light guide sheet (2), support plate (3), target holder (4), light limiting hole (5), loading target (6), and target rod (7); S14: After drying, start the assembly of the target structure. Bond the backlight wire target (1) and the light guide sheet (2) to the support plate (3), and then install the support plate (3) bonded with the backlight wire target (1) and the light guide sheet (2) to the backlight part (41) of the target holder (4); Place the loading target (6) in the slot formed in the loading part (42) of the target holder (4), and then place the collimator aperture (5) on the loading target (6). Install the target rod (7) at the top of the target holder (4).

6. The X-ray imaging method for the dynamic fragmentation behavior of a laser-loaded material according to claim 4, wherein In step S3, after adjusting the positional relationship between the imaging detector (9) and the target structure, the backlight wire target (1), the loading target (6), and the imaging detector (9) are on the same axis, and an opaque filter (8) is provided in front of the imaging detector (9).

7. An X-ray imaging method for the dynamic fragmentation behavior of a laser-loaded material according to claim 4, characterized in that In step S4, the loading laser source (11) is evenly loaded onto the loading target (6) through the action of the collimator aperture (5).

8. An X-ray imaging method for the dynamic fragmentation behavior of a laser-loaded material according to claim 4, characterized in that In step S5, the backlight laser source (10) first irradiates the light guiding plate (2), and through the light guiding action of the light guiding plate (2), the backlight laser source (10) is guided to the backlight wire target (1). At this time, the backlight wire target (1) is completely within the aiming field of view of the light guiding plate (2). The backlight laser source (10) guided to the backlight wire target (1) excites X-ray rays at the tip of the wire.

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