Wafer script setting method, device, equipment and storage medium

Abstract

The present application provides a wafer script setting method, device, equipment and storage medium. If the demand unit determines that the necessary conditions for executing the script to be executed meet the business requirements based on the parameter information, the platform unit obtains the batch identification of the script to be executed and the corresponding production information. When the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit checks whether the first production information corresponding to the first wafer meets the necessary conditions for execution. If so, the platform unit sets the parameter information and assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit, so that the material execution unit performs the corresponding operation. Without modifying the script process, the instant setting of the script to be executed can be achieved, and the script to be executed that does not meet the necessary conditions for execution is avoided from the source, avoiding the risk of batch scrapping of wafers, and the setting process is independent of the batch quantity and will not affect the overall production efficiency.

Description

Technical Field

[0001] The present application relates to the field of integrated circuits and semiconductor technology, and in particular to a wafer script setting method, device, equipment and storage medium. Background Art

[0002] With the rapid development of computer technology and Internet technology, the integrated circuit industry is facing an important period of opportunity and challenge for development. In the actual production conditions of wafers, due to business needs, the applicants often need to adjust the wafer execution script according to the actual situation and propose modification requirements to the script setter.

[0003] In the prior art, when the applicant proposes a modification requirement, the setter needs to execute the script corresponding to the modification requirement. When changing the execution script, only the batch identifier provided by the applicant is modified accordingly. Not only can the change not be made in real time, but the production information of the current batch of wafers cannot be verified. It is very easy to cause batches of wafers to be scrapped due to errors in the modification script. In addition, in the existing solution, the applicant needs to submit the corresponding information to the setter every time for the modification requirement, which is time-consuming. Especially when the number of wafers in the same batch is large, it will cause the script execution process to be lengthened, affecting the overall performance of the production system.

[0004] It can be seen that a solution is urgently needed for the above problems existing in the existing solutions. Summary of the invention

[0005] The present application provides a wafer script setting method, device, equipment and storage medium, which are used to solve technical problems such as the existing wafer execution script setting scheme taking a long time to change the wafer script, the risk of wafer scrapping and affecting the overall performance of the production system.

[0006] In a first aspect, the present application provides a wafer script setting method, which is applied to a manufacturing execution system, wherein the system includes a demand unit, a setting unit, a platform unit, and a material execution unit; the method includes:

[0007] If the demand unit determines that the execution necessary conditions of the script to be executed meet the business requirements according to the parameter information, the platform unit obtains the batch identification of the script to be executed and the corresponding production information, and the execution necessary conditions are the corresponding conditions set by the setting unit for the script to be executed according to the business requirements;

[0008] If the demand unit determines that the wafer corresponding to the script to be executed is executing the script to be executed for the first time, the platform unit checks whether the first production information corresponding to the first wafer meets the necessary execution condition, and the first wafer is the wafer selected by the demand unit and imported into the platform unit for executing the script to be executed for the first time;

[0009] If the inspection result is yes, the platform unit sets the parameter information and the assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit, so that the material execution unit performs corresponding operations.

[0010] In a possible design, if the demand unit determines that the wafer is not executing the script to be executed for the first time, the method further includes:

[0011] The platform unit determines an execution status according to a batch identifier corresponding to the second wafer and the second production information, where the execution status includes having passed an execution site or not having passed an execution site.

[0012] In a possible design, if it is determined that the execution status is the passed execution site, the platform unit sets first marking information for the second wafer to prohibit a disqualification operation on the second wafer; or

[0013] If it is determined that the execution status is the unexecuted site, the platform unit sets second marking information for the second wafer to allow a disqualification operation to be performed on the second wafer.

[0014] In one possible design, the allowing a disqualification operation to be performed on the second wafer includes:

[0015] The platform unit deletes the parameter information to cancel the corresponding qualification of the second wafer to execute the corresponding script; or

[0016] The platform unit changes the parameter information so that the changed parameter information does not satisfy the necessary execution condition.

[0017] In a possible design, if the requirement unit determines, based on the parameter information, that the necessary execution condition of the script to be executed does not meet the business requirement, the method further includes:

[0018] The requirement unit determines error information of the execution prerequisite and displays the error information to the user unit.

[0019] In a possible design, after the platform unit obtains the batch identification of the script to be executed and the corresponding production information, the method further includes:

[0020] The platform unit determines the batch quantity of wafers corresponding to the script to be executed, and determines the batch quantity that can be added according to the maximum batch quantity;

[0021] If the platform unit determines that the batch quantity of the third wafer is greater than the batch quantity that can be added, the demand unit modifies the batch quantity of the third wafer so that the corresponding batch quantity is less than or equal to the batch quantity that can be added, and the third wafer is the wafer selected by the demand unit for the first execution of the script to be executed;

[0022] If the platform unit determines that the batch quantity of the third wafer is not greater than the addable batch quantity, the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit through the list to be imported.

[0023] In a possible design, before the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit through the to-be-imported list, the method further includes:

[0024] The setting unit sets column item content and generates at least one data import template according to the column item content, wherein the column item content is used to characterize characteristic information of the batch identification and production information corresponding to the third wafer;

[0025] The demand unit determines a corresponding template matching the first wafer from the at least one data import template, and determines the corresponding template as the list to be imported.

[0026] In a possible design, if the inspection result is negative, the demand unit modifies the first wafer so that the platform unit re-inspects it.

[0027] In a possible design, before the requirement unit determines, according to the parameter information, that the necessary execution condition of the script to be executed meets the business requirement, the method further includes:

[0028] The setting unit sets the parameter information and the necessary execution conditions according to the business requirements;

[0029] The execution necessary conditions include at least one of the batch type, batch product number, corresponding execution site, sub-batch script execution status, maximum batch quantity, and batch level corresponding to the script to be executed;

[0030] The parameter variable information is associated with the execution necessary condition.

[0031] In a second aspect, the present application provides a wafer script setting device, comprising:

[0032] An acquisition module, configured to obtain, by the platform unit, a batch identifier and corresponding production information of the script to be executed if the demand unit determines, based on the parameter variable information, that the necessary execution conditions of the script to be executed meet the business requirements, wherein the necessary execution conditions are corresponding conditions set by the setting unit for the script to be executed according to the business requirements;

[0033] A verification module, configured to verify, by the platform unit, whether first production information corresponding to a first wafer satisfies the necessary execution condition if the demand unit determines that the wafer corresponding to the script to be executed is executing the script to be executed for the first time, wherein the first wafer is a wafer selected by the demand unit and imported into the platform unit for executing the script to be executed for the first time;

[0034] A setting module is used for, if the inspection result is yes, the platform unit sets the parameter information and assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit so that the material execution unit performs the corresponding operation.

[0035] In a possible design, if the demand unit determines that the wafer is not executing the script to be executed for the first time, the device further includes:

[0036] The first processing module is used for the platform unit to determine the execution status according to the batch identification corresponding to the second wafer and the second production information, and the execution status includes passing the execution site or not passing the execution site. The second wafer is not the wafer that executes the script to be executed for the first time.

[0037] In a possible design, the first processing module includes:

[0038] The first processing sub-unit is configured to, if it is determined that the execution status is the passed execution site, cause the platform unit to set first marking information for the second wafer to prohibit a disqualification operation from being performed on the second wafer; or

[0039] The second processing sub-unit is used for, if it is determined that the execution status is the unexecuted site, the platform unit setting second marking information for the second wafer to allow a disqualification operation to be performed on the second wafer.

[0040] In one possible design, the device further includes: a second processing module;

[0041] The second processing module is used to:

[0042] The platform unit deletes the parameter information to cancel the corresponding qualification of the second wafer to execute the corresponding script; or

[0043] The platform unit changes the parameter information so that the changed parameter information does not satisfy the necessary execution condition.

[0044] In one possible design, the device further includes:

[0045] A display module is used for the requirement unit to determine the error information of the necessary execution condition and display the error information to the user unit.

[0046] In one possible design, the device further includes: a third processing module;

[0047] The third processing module is used for:

[0048] The platform unit determines the batch quantity of wafers corresponding to the script to be executed, and determines the batch quantity that can be added according to the maximum batch quantity;

[0049] If the platform unit determines that the batch quantity of the third wafer is greater than the batch quantity that can be added, the demand unit modifies the batch quantity of the third wafer so that the corresponding batch quantity is less than or equal to the batch quantity that can be added, and the third wafer is the wafer selected by the demand unit for the first execution of the script to be executed;

[0050] If the platform unit determines that the batch quantity of the third wafer is not greater than the addable batch quantity, the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit through the list to be imported.

[0051] In one possible design, the device further includes: a fourth processing module;

[0052] The fourth processing module is used for:

[0053] The setting unit sets column item content and generates at least one data import template according to the column item content, wherein the column item content is used to characterize characteristic information of the batch identification and production information corresponding to the third wafer;

[0054] The demand unit determines a corresponding template matching the first wafer from the at least one data import template, and determines the corresponding template as the list to be imported.

[0055] In one possible design, the device further includes:

[0056] A fifth processing module is used for, if the inspection result is negative, the demand unit to modify the first wafer so that the platform unit re-inspects it.

[0057] In one possible design, the device further includes:

[0058] A sixth processing module, used for the setting unit to set the parameter information and the necessary execution conditions according to the business requirements;

[0059] The execution necessary conditions include at least one of the batch type, batch product number, corresponding execution site, sub-batch script execution status, maximum batch quantity, and batch level corresponding to the script to be executed;

[0060] The parameter variable information is associated with the execution necessary condition.

[0061] In a third aspect, the present application provides an electronic device, including:

[0062] at least one processor; and

[0063] A memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the wafer script setting method described in the first aspect and any one of the optional schemes of the first aspect.

[0064] In a fourth aspect, the present application provides a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable the computer to execute the wafer script setting method described in the first aspect and any one of the optional schemes of the first aspect.

[0065] The present application provides a wafer script setting method, device, equipment and storage medium, which are applied to a manufacturing execution system, which includes a demand unit, a setting unit, a platform unit and a material execution unit. The wafer script setting method provided by the present application, if the demand unit determines that the execution necessary conditions of the script to be executed meet the business requirements based on the parameter information, the platform unit obtains the batch identification of the script to be executed and the corresponding production information, wherein the execution necessary conditions are the corresponding conditions set by the setting unit for the script to be executed according to the business requirements. Then, if the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit checks whether the first production information corresponding to the first wafer meets the execution necessary conditions, and the first wafer is the wafer selected by the demand unit and imported into the platform unit for the first execution of the script to be executed. After inspection by the platform unit, if the inspection result is yes, the platform unit sets the parameter information and assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit, so that the material execution unit performs the corresponding operation. Based on the platform unit and the necessary conditions for execution, the script to be executed for the wafer can be set immediately without modifying the script process, and the production information of the wafer submitted by the demand unit can be checked to see whether it meets the necessary conditions for execution. The script to be executed that does not meet the necessary conditions for execution is avoided from the source, and the risk of batch scrapping of wafers due to script setting errors is avoided. The wafer script setting method provided by the present application can take effect once it is set, the implementation process is short, and the setting process is independent of the batch number and will not affect the overall production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0067] Figure 1 A schematic diagram of an application scenario provided for an embodiment of the present application;

[0068] Figure 2 A schematic diagram of a process flow of a wafer script setting method provided in an embodiment of the present application;

[0069] Figure 3 A flowchart of another wafer script setting method provided in an embodiment of the present application;

[0070] Figure 4 A flowchart of another wafer script setting method provided in an embodiment of the present application;

[0071] Figure 5A flowchart of another wafer script setting method provided in an embodiment of the present application;

[0072] Figure 6 A schematic diagram of the structure of a wafer script setting device provided in an embodiment of the present application;

[0073] Figure 7 A schematic diagram of the structure of another wafer script setting method provided in an embodiment of the present application;

[0074] Figure 8 A schematic diagram of the structure of a first processing module provided in an embodiment of the present application;

[0075] Fig. 9 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0076] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of methods and devices consistent with some aspects of the present application as detailed in the appended claims.

[0077] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0078] At present, the production process of wafers is often implemented based on the Manufacturing Execution System (MES). In actual working conditions, the applicants often adjust the wafer execution script according to the actual working conditions. For example, the process of the existing solution is roughly as follows: the applicant submits the corresponding bill of lading information to the setter for each demand, and the setter makes corresponding modifications to the execution script according to the batch identification (Lot ID) in the bill of lading information. Not only can real-time changes not be achieved, but also the changes in the execution script cannot be verified. It is very easy to cause batches of wafers to be scrapped due to errors in modifying the script. In addition, every time the applicant of the existing solution proposes a modification requirement, the corresponding execution process must be modified, which takes a long time, especially when the number of batches is large, affecting the performance of the entire production system.

[0079] In view of the above problems in the prior art, the present application provides a wafer script setting method, device, equipment and storage medium. The wafer script setting method provided by the present application, first, the demand unit determines the corresponding conditions set by the setting unit for the script to be executed according to the parameter information, that is, whether the execution necessary conditions meet the business requirements. If they meet the requirements, the platform unit obtains the batch identification of the script to be executed and the corresponding production information. Then, when the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit verifies whether the first production information of the first wafer selected by the demand unit and imported into the platform unit meets the execution necessary conditions. When the verification result is yes, the platform unit automatically sets the parameter information and assignment information for the first wafer, and sends the first wafer after the setting information to the material execution unit for the material execution unit to perform the corresponding operation. Based on the platform unit and the execution necessary conditions, the instant setting of the script to be executed of the wafer can be realized without modifying the script process, and the production information can be checked to see whether it meets the execution necessary conditions. The script to be executed that does not meet the execution necessary conditions is avoided from the source, and the risk of batch scrapping of wafers due to script setting errors is avoided. The wafer script setting method provided in the present application can take effect once set, the implementation process is short, and the setting process is independent of the batch quantity and will not affect the overall production efficiency.

[0080] The following is an introduction to exemplary application scenarios of the embodiments of the present application.

[0081] The wafer script setting method provided in the embodiment of the present application can be executed by the wafer script setting device provided in the embodiment of the present application. The wafer script setting method provided in the embodiment of the present application can be applied to the manufacturing execution system (Manufacturing Execution System, referred to as MES), which mainly involves the production data setting system (Specification Manager, referred to as SM) and the material execution system (Material Manager, referred to as MM) in MES. Figure 1 A schematic diagram of an application scenario provided in an embodiment of the present application, such as Figure 1 As shown, the wafer script setting method provided in the embodiment of the present application applies MES, which includes a demand unit 11, a setting unit 12, a platform unit 13 and a material execution unit 14, wherein the setting unit 12 can be configured in SM, and the material execution unit 14 can be configured in MM. The demand applicant provides business requirements and / or modification requirements through the demand unit 11, and the setting unit 12 performs corresponding script settings according to the requirements provided by the demand unit 11. The platform unit 13 implements the corresponding settings of the wafer script by executing the corresponding steps in the wafer script setting method provided in the embodiment of the present application, and synchronizes the wafer after the setting information to the material execution unit 14, so that the material execution unit 14 performs the corresponding operation. It should be noted that in MES, the data interaction between the demand unit 11, the setting unit 12, the platform unit 13 and the material execution unit 14 can be realized through the network as the medium of the communication link, and the network can include various connection types, such as wired, wireless communication links or optical fiber cables, etc. In addition, the platform unit 13 can write corresponding programs in programming languages ​​such as C#, VB, C++, etc. to execute the corresponding methods configured for it. The module device corresponding to the platform unit 13 can be an electronic device such as a computer or a server, and the type of the electronic device is not limited in the embodiment of the present application. The demand unit 11, the setting unit 12, and the material execution unit 14 can configure the electronic device according to the actual situation of the MES in the actual working conditions, and the implementation of the present application does not limit this.

[0082] It is worth noting that the above application scenarios are merely illustrative, and the wafer script setting method provided in the embodiments of the present application includes but is not limited to the above application scenarios.

[0083] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0084] Figure 2A schematic diagram of a wafer script setting method provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, the wafer script setting method provided in this embodiment includes:

[0085] S100: The requirement unit determines whether the execution requirements of the script to be executed meet the business requirements according to the parameter information. If yes, step S101 is executed; if not, step S102 is executed.

[0086] S101: If the demand unit determines, based on the parameter information, that the necessary conditions for executing the script to be executed meet the business requirements, the platform unit obtains the batch identification of the script to be executed and the corresponding production information.

[0087] The necessary execution conditions are corresponding conditions set by the setting unit for the execution script according to business requirements.

[0088] The demand unit proposes corresponding script requirements for the wafers to be executed according to business needs, and the setting unit sets corresponding conditions for the wafers to be executed according to business needs, that is, the necessary conditions for execution. For example, at least one of the lot type (LotType), the lot product number (Lot Product), the corresponding execution site, the execution status of the parent-child batch script, the maximum batch quantity, and the batch level is used as the necessary execution condition corresponding to the script to be executed. Among them, the corresponding execution site is the site that executes the script to be executed, and the execution status of the parent-child batch script can be whether the parent-child batch wafers corresponding to the script to be executed execute the script to be executed. For example, a necessary execution condition set can be "ABC+OPER: 005: Parameter name: XXX, value: Yes", that is, the 005th site under the ABC process must execute the script to be executed with the condition that the value of XXX is equal to Yes.

[0089] At the same time, the setting unit sets unique parameter information for the demand unit, and associates the parameter information with the execution necessary condition, so that the demand unit can query the execution necessary condition associated with it according to the parameter information. The parameter information can be embodied in at least one form of letters, numbers, symbols, characters, and sentences, such as "Y", "," and "@!".

[0090] After the setter sets the necessary conditions and parameter information of the script to be executed, the demand unit determines whether the necessary conditions for the execution of the script to be executed meet the business requirements based on the parameter information provided by the setter, that is, the demand unit determines whether the necessary conditions for the execution set by the setting unit meet the business requirements based on the parameter information. After the determination, if it is determined to be satisfied, the platform unit obtains the batch identification and corresponding production information corresponding to the script to be executed to implement the subsequent setting information setting steps. Among them, in this step, the demand unit judges whether the necessary conditions for the execution meet the business requirements based on the parameter information in order to ensure that the subsequent script setting of the platform unit for this batch of wafers meets the business requirements of the demand unit.

[0091] Correspondingly, if the requirement unit determines according to the parameter information that the execution prerequisite does not meet the business requirement, it indicates that there is error information in the set execution prerequisite, and step S102 is executed.

[0092] S102: The demand unit determines error information of the execution necessary condition and displays the error information to the user unit.

[0093] When the demand unit determines that the necessary conditions for execution do not meet the business requirements, the demand unit further determines the error information in the necessary conditions for execution and displays the error information to the user unit. For example, the error information is displayed to the user unit through at least one of the pop-up window, alarm, annotation and pop-up window modes, so that the user unit can promptly know that there is error information in the necessary conditions for execution, and avoid the error information being stuck at the current stage and affecting the production process. Display error information. It should be noted that the user unit in this step can be understood as an operation and maintenance personnel unit or an external monitoring unit in the MES, etc., so as to be a unit that can monitor and know the current operating status of the MES in a timely manner, and this is not limited in the embodiments of the present application.

[0094] S103: If the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit checks whether the first production information corresponding to the first wafer meets the necessary execution conditions.

[0095] The first wafer is a wafer selected by the demand unit and imported into the platform unit for executing the script to be executed for the first time.

[0096] When the demand unit determines that the necessary conditions for executing the script to be executed meet the business requirements, the platform unit obtains the batch identification and corresponding production information corresponding to the script to be executed. At this time, the demand unit also determines whether the wafer corresponding to the script to be executed is the first time to execute the script to be executed. When it is determined to be the first time, the demand unit selects the wafer that executes the script to be executed for the first time, for example, checks and confirms it, and imports the selected wafer of the script to be executed, that is, the wafer of the script to be executed that is checked and confirmed, into the platform unit. Therefore, the wafer selected by the demand unit and imported into the platform unit for the first execution of the script to be executed is the first wafer, and its corresponding production information is the first production information. Specifically, the platform unit only needs to determine the production information of the script to be executed selected and imported by the demand unit from the production information corresponding to the script to be executed obtained in step S101, that is, determine the first production information. Among them, the first production information can be at least one of the current batch type, current batch product number, corresponding execution site, maximum batch quantity and batch level corresponding to the first wafer. It can be understood that the first production information is used to feedback the actual production status information of the first wafer when the material execution unit executes the script.

[0097] Further, the platform unit checks whether the first production information meets the necessary execution conditions. If the check result is yes, step S104 is executed; if the check result is no, step S105 is executed.

[0098] The platform unit verifies whether the first production information meets the necessary conditions for execution, so as to determine whether there is a script to be executed for a wafer that does not meet the necessary conditions for execution based on the production information, so as to avoid the first wafer that does not meet the necessary conditions for execution from the source.

[0099] S104: If the inspection result is yes, the platform unit sets parameter information and value assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit, so that the material execution unit performs corresponding operations.

[0100] After the platform unit verifies whether the first production information meets the necessary conditions for execution, if the verification result is yes, that is, the first production information meets the necessary conditions for execution, then the platform unit sets the parameter information and assignment information for the first wafer. The assignment information is the assignment agreed upon by the platform unit and the script to be executed corresponding to the first wafer. The first wafer after the setting information is synchronized to the material execution unit, so that the material execution unit performs the corresponding operation according to the first wafer after the setting information.

[0101] At this point, the platform unit has realized the setting of parameter information and assignment information for the first wafer, and can ensure that the first wafer after the setting information meets the corresponding requirements put forward by the demand unit, and there is no risk of wafer scrapping. When the demand unit puts forward the setting requirements, there is no need to modify the script process for each setting requirement. Instead, based on the necessary conditions for execution, the script of at least one batch of wafers is set and takes effect immediately. It takes less time, is simple and easy to implement, and has nothing to do with the number of wafer batches. The script setting process will not affect the overall performance of the production system.

[0102] S105: If the inspection result is negative, the demand unit modifies the first wafer so that the platform unit re-inspects it.

[0103] If the platform unit verifies that the first production information does not meet the necessary conditions for execution, for example, due to the system's operating time difference, the first production information has passed the station and does not meet the previously set necessary conditions for execution. Therefore, the demand unit makes corresponding modifications to the first wafer, and after the modification, the platform unit re-determines the corresponding first production information, and re-verifies whether the re-determined first production information meets the necessary conditions for execution, and executes subsequent corresponding steps according to the verification results.

[0104] The wafer script setting method provided in the present application, the setting unit sets parameter information and necessary conditions for execution according to the business requirements provided by the demand unit. First, the demand unit determines whether the necessary conditions for the execution of the script to be executed meet the business requirements based on the parameter information. If the determination result is yes, the platform unit obtains the batch identification and corresponding production information of the script to be executed. If the determination result is no, the demand unit determines the corresponding error information and feeds back the error information to the user unit through the corresponding display method. After determining that the necessary conditions for execution meet the business requirements, if the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit checks whether the first production information corresponding to the first wafer meets the necessary conditions for execution, wherein the first wafer is the wafer selected by the demand unit and imported into the platform unit for the first execution of the script to be executed. The platform unit performs an inspection and judgment. If the inspection result is yes, the platform unit sets the parameter information and assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit, so that the material execution unit performs the corresponding operation. Based on the platform unit and the necessary conditions for execution, the script to be executed for the wafer can be set immediately without modifying the script process, and the script to be executed that does not meet the necessary conditions for execution can be avoided from the source through the inspection step, thus avoiding the risk of batch scrapping of wafers due to script setting errors. The wafer script setting method provided by the present application can take effect once it is set, the implementation process is short, and the setting process is independent of the batch number and will not affect the overall production efficiency.

[0105] In the above embodiment, step S103 describes that if the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit checks whether the first production information meets the necessary execution conditions. On the other hand, if the demand unit determines that the wafer corresponding to the script to be executed is not the first time to execute the script to be executed, the following is executed: Figure 3 The steps shown in the embodiment, Figure 3 A flow chart of another wafer script setting method provided in an embodiment of the present application is shown as follows: Figure 3 As shown, if the demand unit determines that the wafer corresponding to the script to be executed is not executing the script to be executed for the first time, the wafer script setting method provided in this embodiment includes:

[0106] S200: The platform unit determines an execution status according to a batch identifier corresponding to the second wafer and second production information.

[0107] The execution status includes having passed the execution site or not having passed the execution site, and the second wafer is a wafer that is not executing the script to be executed for the first time.

[0108] If the demand unit determines that the wafer corresponding to the script to be executed is not the first time to execute the script to be executed, it indicates that it is possible to cancel the execution qualification operation for the wafer corresponding to the current script to be executed. Therefore, the platform unit determines the current execution status of the corresponding script to be executed based on the batch identification and production information corresponding to the second wafer to clarify whether the execution qualification operation can be canceled, wherein the second wafer is a wafer that is not the first time to execute the script to be executed, and the second production information is the production information corresponding to the second wafer, that is, the wafer that is not the first time to execute the script to be executed. Specifically, the platform unit can determine whether the execution status of the second wafer has passed the execution site or has not passed the execution site based on the batch identification and the second production information of the script to be executed corresponding to the second wafer.

[0109] S201: If it is determined that the execution status is passed the execution site, the platform unit sets first marking information for the second wafer to prohibit the disqualification operation on the second wafer.

[0110] When the platform unit determines that the execution status is passed the execution site based on the batch identification and the second production information corresponding to the script to be executed of the second wafer, it means that the wafer with the batch identification has executed the corresponding script to be executed, and the execution qualification of the second wafer cannot be cancelled. Therefore, the platform unit will set the first marking information for the corresponding second wafer, such as marking the first marking information such as the background pattern on the corresponding batch identification and the second production information, to indicate that the disqualification operation is prohibited for the wafer corresponding to the current batch identification. Specifically, the platform unit displays the batch identification and production information corresponding to the second wafer, and prohibits the demand unit from checking the corresponding option for the second wafer, that is, prohibits the disqualification operation for the second wafer.

[0111] S202: If it is determined that the execution status is not passed the execution site, the platform unit sets second marking information for the second wafer to allow a disqualification operation to be performed on the second wafer.

[0112] When the platform unit determines that the execution status is not passed the execution site according to the batch identification and the second production information corresponding to the script to be executed of the second wafer, it means that the wafer with the batch identification has not executed the corresponding script to be executed and can be disqualified from execution. Therefore, the platform unit will set the second annotation information for the script to be executed corresponding to the corresponding second wafer to indicate that the disqualification operation is allowed for the wafer corresponding to the current batch identification. Specifically, the platform unit displays the batch identification and production information corresponding to the second wafer, allowing the demand unit to check and identify the second wafer accordingly, that is, allowing the disqualification operation for the second wafer.

[0113] It is worth noting that there may still be an executing site in the execution status, and in actual working conditions, due to the card control of the MES production system, the parameter information and production information of the wafer being produced cannot be edited. Therefore, the steps in step S201 can be adopted, that is, the platform unit will set the first marking information for the second wafer in the execution status at the executing site, such as marking the first marking information such as the background pattern of the corresponding batch identification and the second production information, to indicate that the disqualification operation is prohibited for the wafer corresponding to the current batch identification. Specifically, the platform unit will display the batch identification and production information of the corresponding wafer, and prohibit the demand unit from checking and identifying the corresponding wafer, that is, prohibiting the disqualification operation for the corresponding wafer.

[0114] In the wafer script setting method provided in the above embodiment, if the demand unit determines that the script to be executed is not the first script to be executed, the platform unit can determine the execution status as having passed the execution site or not passed the execution site according to the batch identification corresponding to the script to be executed and the second production information, and determine which wafers that are not the first to execute the script to be executed can be disqualified according to the different determined execution states. Thus, the platform unit implements the function of disqualifying batches of wafers, saving manpower and time, and avoiding the risk of scrapping batches of wafers due to artificial disqualification.

[0115] In one possible design, the above Figure 3 In the illustrated embodiment, one possible implementation method of allowing the disqualification operation of the second wafer is that the platform unit deletes the parameter information to disqualify the second wafer from executing the corresponding script. Specifically, the platform unit deletes the parameter information so that the script to be executed of the second wafer does not have the parameter information attribute, thereby achieving the purpose of disqualifying the second wafer from executing the corresponding script.

[0116] Another possible implementation method is that the platform unit changes the parameter information so that the changed parameter information does not meet the necessary conditions for execution. Specifically, the platform unit changes the parameter information so that the changed parameter information does not match the necessary conditions for execution, that is, does not meet the necessary conditions for execution. At this time, the material execution unit does not execute the current script to be executed because the changed parameter information does not meet the necessary conditions for execution, thereby achieving the purpose of canceling the execution qualification.

[0117] In a possible design, after step S101, the wafer script setting method provided in the embodiment of the present application further includes: Figure 4 Steps shown. Figure 4 A flowchart of another wafer script setting method provided in an embodiment of the present application is shown as follows: Figure 4 As shown, the wafer script setting method provided in this embodiment, after the platform unit obtains the batch identification of the script to be executed and the corresponding production information, further includes:

[0118] S301: The platform unit determines the batch quantity of wafers corresponding to the script to be executed, and determines the batch quantity that can be added according to the maximum batch quantity.

[0119] After the platform unit obtains the batch identification and corresponding production information of the script to be executed, the platform unit further obtains the batch quantity of the wafers corresponding to the script to be executed, wherein the batch quantity can be understood as the number of batch wafers that the MES system allows to execute the script to be executed. After determining the batch quantity of the wafers of the current script to be executed, by comparing it with the maximum batch quantity, the number of batches that can be added can be determined, that is, the number of batches can be added.

[0120] S302: If the platform unit determines that the batch quantity of the third wafer is greater than the batch quantity that can be added, the demand unit modifies the batch quantity of the third wafer so that the batch quantity corresponding to the third wafer is less than or equal to the batch quantity that can be added.

[0121] The third wafer is the wafer selected by the demand unit for executing the script to be executed for the first time.

[0122] After determining the number of batches that can be added, if the platform unit determines that the batch number of the third wafer is greater than the number of batches that can be added, where the third wafer is the wafer selected by the demand unit to be imported into the platform unit for the first execution of the script to be executed, the demand unit modifies the batch number of the selected wafer, that is, the batch number of the third wafer, so that its batch number is less than or equal to the number of batches that can be added. After that, the modified third wafer and its corresponding batch identification and production information are imported into the platform unit.

[0123] S303: If the platform unit determines that the batch quantity of the third wafer is not greater than the batch quantity that can be added, the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit through the list to be imported.

[0124] On the other hand, if the platform unit determines that the batch quantity of the third wafer selected by the demand unit to be imported into the platform unit does not exceed the batch quantity that can be added, the demand unit will import the third wafer and the batch identification corresponding to the third wafer and its production information into the platform unit through the list to be imported, so that the platform unit can obtain the first wafer.

[0125] In the wafer script setting method provided in the embodiment of the present application, the platform unit determines whether the batch quantity of the wafer selected by the demand unit for the first execution of the script to be executed, that is, the third wafer, exceeds the batch quantity that can be added. If it exceeds, the demand unit makes corresponding modifications. If it does not exceed the batch quantity that can be added, the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit, and the imported third wafer is the first wafer. This ensures that the subsequent platform unit performs verification and the information setting process smoothly, so as to improve the efficiency of wafer script setting, and thus improve the overall efficiency of the production system.

[0126] Figure 4 In the illustrated embodiment, the demand unit imports the third wafer and its corresponding batch identification and production information into the platform unit through the list to be imported. Therefore, in a possible design, a possible implementation method of determining the list to be imported is as follows: Figure 5 As shown, Figure 5 A flowchart of another wafer script setting method provided in an embodiment of the present application is shown as follows: Figure 5 As shown, the wafer script setting method provided in this embodiment further includes: before the demand unit imports the third wafer and its corresponding batch identification and production information into the platform unit through the list to be imported:

[0127] S401: The setting unit sets column item content and generates at least one data import template according to the column item content.

[0128] The column item content is used to characterize the characteristic information of the batch identification and production information corresponding to the third wafer.

[0129] The setting unit sets the column item content according to the characteristic information of the batch identification and production information corresponding to the third wafer, and then generates at least one data import template according to the set column item content. Among them, the column item content may include various characteristic information that can characterize the third wafer and its batch identification and production information. The column item content can also be understood as various information that may be included in the batch identification and production information of the corresponding wafer, which is not limited to this embodiment of the present application. After the column item content is set, based on this, at least one data import template is generated, wherein the data import template includes one or more column item contents.

[0130] S402: The demand unit determines a corresponding template matching the first wafer from at least one data import template, and determines the corresponding template as a list to be imported.

[0131] After generating at least one data import template, the demand unit determines a corresponding template matching the first wafer from the at least one data import template, and then determines the determined corresponding template as a list to be imported, so as to import the corresponding wafer and its information into the platform unit through the list to be imported.

[0132] The wafer script setting method provided in the embodiment of the present application requires that before the demand unit imports the selected wafer for the first execution of the script to be executed, that is, the third wafer and its corresponding information into the platform unit through the list to be imported, the import list needs to be determined. First, the setting unit sets the column item content, and generates at least one data import template according to the column item content, wherein the column item content is used to characterize the characteristic information of the batch identification and production information corresponding to the third wafer, and then the demand unit determines the corresponding template matching the first wafer from at least one data import template, and determines it as the list to be imported, so as to import the corresponding wafer and its corresponding information into the platform unit. Thus, by determining the list to be imported from at least one data import template set by the setting unit, the integrity and stability of the wafer script setting in the MES are improved, the subsequent platform unit verification and the smooth progress of the information setting process are ensured, the efficiency of the wafer script setting is improved, and the overall efficiency of the production system is improved.

[0133] The following is an embodiment of the device of the present application, which can be used to execute the embodiment of the method of the present application. For details not disclosed in the embodiment of the device of the present application, please refer to the embodiment of the method of the present application.

[0134] Figure 6 A schematic diagram of the structure of a wafer script setting device provided in an embodiment of the present application, such as Figure 6 As shown, the wafer script setting device 500 provided in this embodiment includes:

[0135] The acquisition module 501 is used for the platform unit to acquire the batch identification and corresponding production information of the script to be executed if the demand unit determines that the execution necessary conditions of the script to be executed meet the business requirements according to the parameter information.

[0136] The necessary execution conditions are corresponding conditions set by the setting unit for the execution script according to business requirements.

[0137] The inspection module 502 is used for, if the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit inspects whether the first production information corresponding to the first wafer meets the necessary execution conditions.

[0138] The first wafer is a wafer selected by the demand unit and imported into the platform unit for executing the script to be executed for the first time.

[0139] The setting module 503 is used for, if the inspection result is yes, the platform unit sets parameter information and assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit, so that the material execution unit performs corresponding operations.

[0140] exist Figure 6 Based on the embodiment shown, Figure 7 A structural diagram of another wafer script setting method provided in an embodiment of the present application, such as Figure 7 As shown, the wafer script setting device 500 provided in this embodiment further includes: a first processing module 504.

[0141] If the demand-side unit determines that the wafer is not executing the script for the first time, the first processing module 504 is used by the platform unit to determine the execution status according to the batch identification corresponding to the second wafer and the second production information, and the execution status includes whether it has passed the execution site or not passed the execution site.

[0142] exist Figure 7 Based on the embodiment shown, Figure 8 A structural diagram of a first processing module provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, the first processing module 504 of the wafer script setting device 500 provided in this embodiment includes: a first processing sub-unit 5041 or a second processing sub-unit 5042.

[0143] The first processing sub-unit 5041 is used for, if it is determined that the execution status is passed the execution site, the platform unit sets first marking information for the second wafer to prohibit the disqualification operation on the second wafer.

[0144] The second processing sub-unit 5042 is used for, if it is determined that the execution status is not passed the execution site, the platform unit sets second marking information for the second wafer to allow a disqualification operation to be performed on the second wafer.

[0145] In a possible design, the wafer script setting device 500 further includes: a second processing module.

[0146] Wherein, the second processing module is used for:

[0147] The platform unit deletes the parameter information to cancel the corresponding qualification of the second wafer to execute the corresponding script; or

[0148] The platform unit changes the parameter information so that the changed parameter information does not satisfy the necessary execution conditions.

[0149] In a possible design, the wafer script setting device 500 further includes: a display module.

[0150] The display module is used for the requirement unit to determine the error information of the necessary conditions for execution and display the error information to the user unit.

[0151] In a possible design, the wafer script setting device 500 further includes: a third processing module.

[0152] Wherein, the third processing module is used for:

[0153] The platform unit determines the batch quantity of wafers corresponding to the script to be executed, and determines the batch quantity that can be added according to the maximum batch quantity;

[0154] If the platform unit determines that the batch quantity of the third wafer is greater than the batch quantity that can be added, the demand unit modifies the batch quantity of the third wafer so that the corresponding batch quantity is less than or equal to the batch quantity that can be added;

[0155] The third wafer is the wafer selected by the demand unit for executing the script to be executed for the first time.

[0156] If the platform unit determines that the batch quantity of the third wafer is not greater than the batch quantity that can be added, the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit through the list to be imported.

[0157] In a possible design, the wafer script setting device 500 further includes: a fourth processing module.

[0158] Wherein, the fourth processing module is used for:

[0159] The setting unit sets column item content and generates at least one data import template according to the column item content, wherein the column item content is used to characterize characteristic information of a batch identification and production information corresponding to the third wafer;

[0160] The demand unit determines a corresponding template matching the first script to be executed from at least one data import template, and determines the corresponding template as a list to be imported.

[0161] In a possible design, the wafer script setting device 500 further includes:

[0162] The fifth processing module is used for, if the inspection result is negative, requiring the unit to modify the first wafer so that the platform unit can re-inspect it.

[0163] In a possible design, the wafer script setting device 500 further includes:

[0164] The sixth processing module is used for the setting unit to set parameter information and execution necessary conditions according to business requirements;

[0165] The necessary conditions for execution include at least one of the batch type, batch product number, corresponding execution site, sub-batch script execution status, maximum batch quantity, and batch level corresponding to the script to be executed;

[0166] The parameter information is associated with the execution prerequisites.

[0167] The above-mentioned device embodiments provided in the present application are merely illustrative, and the module division therein is merely a logical function division, and there may be other division methods in actual implementation. For example, multiple modules may be combined or integrated into another system. The coupling between the modules may be achieved through some interfaces, which are usually electrical communication interfaces, but it is not excluded that they may be mechanical interfaces or other forms of interfaces. Therefore, the modules described as separate components may or may not be physically separated, and may be located in one place or distributed to different locations of the same or different devices.

[0168] It is worth noting that the wafer script setting device provided in the above-mentioned embodiment is applied to MES, including a demand unit, a setting unit, a platform unit and a material execution unit to execute the corresponding steps of the wafer script setting provided in the above-mentioned embodiment. The specific implementation method, principle and technical effect are similar to those of the aforementioned method embodiment and will not be repeated here.

[0169] Fig. 9 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application is shown in FIG. Fig. 9 As shown, the electronic device 600 provided in this embodiment includes:

[0170] at least one processor 601; and

[0171] A memory 602 is communicatively connected to at least one processor 601; wherein,

[0172] The memory 602 stores instructions that can be executed by at least one processor 601. The instructions are executed by at least one processor 601 so that at least one processor 601 can execute each step of the wafer script setting method in the above method embodiment. For details, please refer to the relevant description in the above method embodiment.

[0173] Optionally, the memory 602 may be independent or integrated with the processor 601 .

[0174] When the memory 602 is a device independent of the processor 601, the electronic device 600 may further include:

[0175] The bus 603 is used to connect the processor 601 and the memory 602 .

[0176] In addition, the embodiments of the present application also provide a non-transient computer-readable storage medium storing computer instructions, which are used to cause a computer to execute each step of the wafer script setting method in the above embodiments. For example, the readable storage medium may be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device.

[0177] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the claims.

[0178] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A wafer script setting method, characterized in that: Applied to a manufacturing execution system, the system includes a demand unit, a setting unit, a platform unit and a material execution unit; the method includes: If the demand unit determines that the execution necessary conditions of the script to be executed meet the business requirements according to the parameter information, the platform unit obtains the batch identification of the script to be executed and the corresponding production information, and the execution necessary conditions are the corresponding conditions set by the setting unit for the script to be executed according to the business requirements; If the demand unit determines that the wafer corresponding to the script to be executed is executing the script to be executed for the first time, the platform unit checks whether the first production information corresponding to the first wafer meets the necessary execution condition, and the first wafer is the wafer selected by the demand unit and imported into the platform unit for executing the script to be executed for the first time; If the inspection result is yes, the platform unit sets the parameter information and the assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit, so that the material execution unit performs corresponding operations.

2. The wafer script setting method according to claim 1, characterized in that: If the demand unit determines that the wafer is not executing the script to be executed for the first time, the method further includes: The platform unit determines the execution status according to the batch identification corresponding to the second wafer and the second production information, the execution status including having passed the execution site or not having passed the execution site, and the second wafer is not the wafer that executes the script to be executed for the first time.

3. The wafer script setting method according to claim 2, characterized in that: If it is determined that the execution status is the passed execution site, the platform unit sets first marking information for the second wafer to prohibit a disqualification operation from being performed on the second wafer; or If it is determined that the execution status is the unexecuted site, the platform unit sets second marking information for the second wafer to allow a disqualification operation to be performed on the second wafer.

4. The wafer script setting method according to claim 3, characterized in that: The allowing the second wafer to be disqualified includes: The platform unit deletes the parameter information to cancel the corresponding qualification of the second wafer to execute the corresponding script; or The platform unit changes the parameter information so that the changed parameter information does not satisfy the necessary execution condition.

5. The wafer script setting method according to any one of claims 1 to 4, characterized in that: If the requirement unit determines, according to the parameter information, that the necessary execution condition of the script to be executed does not meet the business requirement, the method further includes: The requirement unit determines error information of the execution prerequisite and displays the error information to the user unit.

6. The wafer script setting method according to claim 5, characterized in that: After the platform unit obtains the batch identification of the script to be executed and the corresponding production information, the method further includes: The platform unit determines the batch quantity of wafers corresponding to the script to be executed, and determines the batch quantity that can be added according to the maximum batch quantity; If the platform unit determines that the batch quantity of the third wafer is greater than the batch quantity that can be added, the demand unit modifies the batch quantity of the third wafer so that the corresponding batch quantity is less than or equal to the batch quantity that can be added, and the third wafer is the wafer selected by the demand unit for the first execution of the script to be executed; If the platform unit determines that the batch quantity of the third wafer is not greater than the batch quantity that can be added, the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit through the list to be imported, and the imported third wafer is the first wafer.

7. The wafer script setting method according to claim 6, characterized in that: Before the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit through the list to be imported, the method further includes: The setting unit sets column item content and generates at least one data import template according to the column item content, wherein the column item content is used to characterize characteristic information of the batch identification and production information corresponding to the third wafer; The demand unit determines a corresponding template matching the first wafer from the at least one data import template, and determines the corresponding template as the list to be imported.

8. The wafer script setting method according to claim 7, characterized in that: If the inspection result is negative, the demand unit modifies the first wafer so that the platform unit re-inspects it.

9. The wafer script setting method according to claim 8, characterized in that: Before the requirement unit determines, according to the parameter information, that the necessary execution condition of the script to be executed meets the business requirement, the method further includes: The setting unit sets the parameter information and the necessary execution conditions according to the business requirements; The execution necessary conditions include at least one of the batch type, batch product number, corresponding execution site, sub-batch script execution status, maximum batch quantity, and batch level corresponding to the script to be executed; The parameter variable information is associated with the execution necessary condition.

10. A wafer script setting device, characterized in that: include: An acquisition module, configured to obtain, by the platform unit, a batch identifier and corresponding production information of the script to be executed if the demand unit determines, based on the parameter variable information, that the necessary execution conditions of the script to be executed meet the business requirements, wherein the necessary execution conditions are corresponding conditions set by the setting unit for the script to be executed according to the business requirements; A verification module, configured to verify, by the platform unit, whether first production information corresponding to a first wafer satisfies the necessary execution condition if the demand unit determines that the wafer corresponding to the script to be executed is executing the script to be executed for the first time, wherein the first wafer is a wafer selected by the demand unit and imported into the platform unit for executing the script to be executed for the first time; A setting module is used for, if the inspection result is yes, the platform unit sets the parameter information and assignment information for the first wafer, and synchronizes the first wafer after the setting information to the material execution unit so that the material execution unit performs the corresponding operation.

11. An electronic device, characterized in that: include: at least one processor; as well as A memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the wafer script setting method described in any one of claims 1-9.

12. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to enable the computer to execute the wafer script setting method according to any one of claims 1 to 9.

Images