Laser marking method and system, device, electronic device and storage medium

Abstract

The present disclosure relates to a laser marking method, system, device, electronic device, and storage medium. The method comprises: obtaining a three-dimensional surface model of an object to be marked; mapping a specified pattern onto the three-dimensional surface model to obtain a three-dimensional pattern model corresponding to the pattern; segmenting the three-dimensional pattern model based on the focal area of ​​a laser beam emitted by a laser marking device to obtain at least two segmented marking areas, each of which is smaller than or equal to the focal area; and moving the object to be marked based on the first spatial position corresponding to each marking area on the three-dimensional surface model and the second spatial position of the focal area, so as to mark the pattern on the object in blocks using the laser marking device. Embodiments of the present disclosure can achieve improved marking effects on the object.

Description

Technical Field

[0001] The present disclosure relates to the field of computer technology, and in particular to a laser marking method and system, device, electronic device, and storage medium. Background Art

[0002] Galvanometer scanning laser marking equipment uses optical refraction, reflection, and focusing to direct a high-energy laser beam onto an object for processing. When marking curved surfaces, the laser beam can easily extend beyond the focal zone (the focal zone is defined as the spatial area within which the laser beam can be focused). Any area beyond the focal zone is unable to focus, affecting the marking effect on the curved surface. For example, the portion of the pattern outside the focal zone cannot be marked. Summary of the Invention

[0003] The present disclosure proposes a laser marking technology solution.

[0004] According to one aspect of the present disclosure, a laser marking method is provided, comprising: obtaining a three-dimensional surface model of an object to be marked; mapping a specified pattern onto the three-dimensional surface model to obtain a three-dimensional pattern model corresponding to the pattern; segmenting the three-dimensional pattern model according to a focal area of ​​a laser beam emitted by a laser marking device to obtain at least two segmented marking areas, each marking area being smaller than or equal to the focal area; and moving the object to be marked according to a first spatial position corresponding to each marking area on the three-dimensional surface model and a second spatial position of the focal area, so as to mark the pattern on the object to be marked in blocks by the laser marking device.

[0005] In one possible implementation, the laser marking device is provided with a movable image acquisition device, and obtaining the three-dimensional surface model of the object to be marked includes: controlling the image acquisition device to move to multiple positions, and controlling the image acquisition device to respectively acquire an image of the object to be marked at each position; performing three-dimensional reconstruction of the object to be marked based on the multiple positions and the multiple images acquired at each position to obtain the three-dimensional surface model of the object to be marked.

[0006] In a possible implementation, the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas, including: when the coverage range of the three-dimensional pattern model is greater than the area range of the focal area, and the coverage depth of the three-dimensional pattern model is less than or equal to the area depth of the focal area, the three-dimensional pattern model is segmented horizontally and vertically according to the area range of the focal area to obtain at least two first marking areas, wherein the area range of each first marking area is less than or equal to the area range of the focal area, and the marking area includes the first marking area.

[0007] In a possible implementation, the segmenting of the three-dimensional pattern model according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas includes: when the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focal area, and the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focal area, performing depth segmentation on the three-dimensional pattern model according to the regional depth of the focal area to obtain at least two second marking areas, wherein the regional depth of each second marking area is less than or equal to the regional depth of the focal area, and the marking area includes the second marking area.

[0008] In a possible implementation, the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas, including: when the coverage range of the three-dimensional pattern model is larger than the area range of the focal area, and the coverage depth of the three-dimensional pattern model is greater than the area depth of the focal area, the three-dimensional pattern model is segmented horizontally and vertically and in depth according to the area range of the focal area and the area depth of the focal area to obtain multiple third marking areas; wherein the area range of each third marking area is smaller than or equal to the area range of the focal area, and the area depth of each third marking area is smaller than or equal to the area depth of the focal area, and the marking area includes the third marking area.

[0009] In a possible implementation, the object to be marked is moved according to the first spatial position corresponding to each marking area on the three-dimensional surface model and the second spatial position of the focusing area, so as to mark the pattern in blocks on the object to be marked by the laser marking device, including: determining the marking order of each marking area according to the first spatial position of each marking area; and moving the object to be marked according to the relative position relationship between adjacent marking areas indicated by the marking order and the second spatial position of the focusing area, so as to mark the pattern in blocks on the object to be marked by the laser marking device.

[0010] In one possible implementation, marking the pattern in blocks on the object to be marked by the laser marking device includes: for any marking area, when the object to be marked moves to a point where a mapping area of ​​the marking area on the object to be marked coincides with the focus area, marking a local pattern indicated by the marking area on the object to be marked by the laser marking device, the pattern including the local pattern.

[0011] According to one aspect of the present disclosure, a laser marking device is provided, comprising: an acquisition module for acquiring a three-dimensional surface model of an object to be marked; a mapping module for mapping a specified pattern onto the three-dimensional surface model to obtain a three-dimensional pattern model corresponding to the pattern; a segmentation module for segmenting the three-dimensional pattern model according to a focal area of ​​a laser beam emitted by a laser marking device to obtain at least two marking areas after segmentation, each marking area being smaller than or equal to the focal area; and a movement module for moving the object to be marked according to a first spatial position corresponding to each marking area on the three-dimensional surface model and a second spatial position of the focal area, so as to mark the pattern on the object to be marked in blocks by the laser marking device.

[0012] In one possible implementation, the laser marking device is provided with a movable image acquisition device, and the acquisition module includes: a control submodule, used to control the image acquisition device to move to multiple positions, and control the image acquisition device to respectively acquire an image of the object to be marked at each position; a reconstruction submodule, used to perform three-dimensional reconstruction of the object to be marked based on the multiple positions and the multiple images acquired at each position, to obtain a three-dimensional surface model of the object to be marked.

[0013] In one possible implementation, the segmentation module includes: a first segmentation submodule, configured to, when the coverage range of the three-dimensional pattern model is greater than the area range of the focus area and the coverage depth of the three-dimensional pattern model is less than or equal to the area depth of the focus area, perform horizontal and vertical segmentation on the three-dimensional pattern model according to the area range of the focus area to obtain at least two first marking areas, wherein the area range of each first marking area is less than or equal to the area range of the focus area, and the marking area includes the first marking area.

[0014] In one possible implementation, the segmentation module includes: a second segmentation submodule, configured to perform depth segmentation on the three-dimensional pattern model according to the regional depth of the focus area when the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focus area and the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focus area, so as to obtain at least two second marking areas, wherein the regional depth of each second marking area is less than or equal to the regional depth of the focus area, and the marking area includes the second marking area.

[0015] In one possible implementation, the segmentation module includes: a third segmentation submodule, which is used to perform horizontal and vertical segmentation and depth segmentation on the three-dimensional pattern model according to the area range of the focus area and the area depth of the focus area when the coverage range of the three-dimensional pattern model is greater than the area range of the focus area and the coverage depth of the three-dimensional pattern model is greater than the area depth of the focus area, so as to obtain multiple third marking areas; wherein the area range of each third marking area is less than or equal to the area range of the focus area, and the area depth of each third marking area is less than or equal to the area depth of the focus area, and the marking area includes the third marking area.

[0016] In one possible implementation, the moving module includes: a sequence determination submodule, used to determine the marking sequence of each marking area based on the first spatial position of each marking area; and a moving submodule, used to move the object to be marked based on the relative position relationship between adjacent marking areas indicated by the marking sequence and the second spatial position of the focusing area, so as to mark the pattern on the object to be marked in blocks by the laser marking device.

[0017] In one possible implementation, marking the pattern in blocks on the object to be marked by the laser marking device includes: for any marking area, when the object to be marked moves to a point where a mapping area of ​​the marking area on the object to be marked coincides with the focus area, marking a local pattern indicated by the marking area on the object to be marked by the laser marking device, the pattern including the local pattern.

[0018] According to one aspect of the present disclosure, a laser marking system is provided, comprising: a computing device, a robotic arm, and a laser marking device; wherein the computing device is configured as described above to control the robotic arm and the laser marking device; the robotic arm is used to fix and move an object to be marked; and the laser marking device is used to mark a pattern on the object to be marked.

[0019] According to one aspect of the present disclosure, an electronic device is provided, comprising: a processor; and a memory for storing processor-executable instructions; wherein the processor is configured to call the instructions stored in the memory to execute the above method.

[0020] According to one aspect of the present disclosure, a computer-readable storage medium is provided, on which computer program instructions are stored. When the computer program instructions are executed by a processor, the above method is implemented.

[0021] In an embodiment of the present disclosure, a three-dimensional surface model of an object to be marked is obtained, a specified pattern is mapped onto the three-dimensional surface model to obtain a three-dimensional pattern model, and the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam to obtain at least two marking areas. The object to be marked is moved according to the first spatial position corresponding to each marking area on the three-dimensional surface model and the second spatial position of the focal area. This enables the pattern to be marked in blocks according to the focal area of ​​the laser beam, which is beneficial to improving the marking effect of the pattern on the object to be marked. In addition, since the three-dimensional pattern model obtained by mapping the three-dimensional surface model of the object to be marked is segmented, it can adapt to different objects to be marked with different surfaces.

[0022] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, rather than limiting the present disclosure. Other features and aspects of the present disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present disclosure and, together with the specification, are used to explain the technical solutions of the present disclosure.

[0024] Figure 1A flow chart of a laser marking method according to an embodiment of the present disclosure is shown.

[0025] Figure 2 A schematic diagram showing a three-dimensional pattern model according to an embodiment of the present disclosure is shown.

[0026] Figure 3 A schematic diagram illustrating a focus area according to an embodiment of the present disclosure.

[0027] Figure 4 A schematic diagram of a laser marking device according to an embodiment of the present disclosure is shown.

[0028] Figure 5 A schematic diagram of horizontal and vertical segmentation according to an embodiment of the present disclosure is shown.

[0029] Figure 6 A schematic diagram illustrating depth segmentation according to an embodiment of the present disclosure is shown.

[0030] Figure 7 A schematic diagram of a laser marking device according to an embodiment of the present disclosure is shown.

[0031] Figure 8 A block diagram of a laser marking device according to an embodiment of the present disclosure is shown.

[0032] Figure 9 A block diagram of an electronic device 1900 according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0033] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0034] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0035] The term "and / or" herein simply describes an association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent the existence of three situations: A alone, A and B simultaneously, and B alone. Furthermore, the term "at least one" herein refers to any combination of at least two of any one or more of a plurality of items. For example, "at least one of A, B, and C" can represent any one or more elements selected from the set consisting of A, B, and C.

[0036] In addition, numerous specific details are provided in the following detailed description to better illustrate the present disclosure. Those skilled in the art will appreciate that the present disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art are not described in detail in order to highlight the main points of the present disclosure.

[0037] Current laser marking equipment typically includes two-dimensional marking equipment and three-dimensional marking equipment. It's well known that the mechanical structure of the laser emitting device in a laser marking device is fixed. The laser emitting device includes a laser emitter and a galvanometer assembly, so the laser beam has a fixed focal area in space. The focal area can be understood as the spatial area that the laser beam can focus on, or the spatial area that the laser beam's focal point can scan. The laser beam cannot focus beyond the focal area, and therefore cannot mark the portion of the pattern outside the focal area on the surface of the object.

[0038] Two-dimensional marking equipment can be understood as laser marking equipment that marks on two-dimensional surfaces. This type of marking equipment is low-cost, fast, and has a wide range of applications. However, if a two-dimensional marking equipment is used to mark curved surfaces, manual focusing is required, otherwise the laser beam will easily exceed the focal area, affecting the marking effect. Although existing three-dimensional marking equipment can achieve three-dimensional marking and automatic focusing on curved surfaces through an external mobile laser emission device, this type of marking equipment is expensive, large in size, and cannot recognize objects. It is usually used for batch marking on factory assembly lines.

[0039] In some scenarios, ordinary users may need to mark patterns on curved surfaces, such as printing patterns on sneakers. However, current two-dimensional marking equipment may not be able to achieve laser marking on such curved surfaces, and existing three-dimensional marking equipment is not suitable for ordinary users. Laser marking equipment that applies the laser marking method of the embodiments of the present disclosure can not only easily adapt to various curved surfaces to be marked, but also achieve three-dimensional laser marking at a low cost, making it accessible to ordinary users.

[0040] Figure 1 The flowchart of the laser marking method according to the embodiment of the present disclosure is shown. The laser marking method can be performed by electronic devices such as laser marking equipment, user equipment (UE), mobile devices, user terminals, terminals, cellular phones, cordless phones, personal digital assistants (PDAs), handheld devices, computing devices, vehicle-mounted devices, wearable devices, etc. The method can be implemented by the processor of the electronic device calling the computer-readable instructions stored in the memory. Figure 1 As shown, the laser marking method includes:

[0041] In step S11 , a three-dimensional surface model of the object to be marked is obtained.

[0042] The 3D surface model of the object to be marked can be obtained by 3D reconstruction of the object to be marked, or can be drawn using 3D drawing software, which is not limited in the present embodiment. It should be understood that the 3D surface model of the object to be marked can reflect the complete outline of the object to be marked, or it can reflect the partial outline of the object to be marked.

[0043] In step S12, the designated pattern is mapped onto the three-dimensional surface model to obtain a three-dimensional pattern model corresponding to the pattern.

[0044] The designated pattern can be understood as the pattern that the user desires to process on the object to be marked. In one possible implementation, the user can use an application known in the art, such as various 3D image processing software, to import the designated pattern and the 3D surface model, and map the pattern onto the 3D surface model. Figure 2 A schematic diagram of a three-dimensional pattern model according to an embodiment of the present disclosure is shown as follows: Figure 2 The three-dimensional pattern model shown is consistent with the outline of the corresponding mapping area of ​​the three-dimensional pattern model on the object to be marked.

[0045] It should be understood that the user can also manually adjust the position, size, angle, number, etc. of the pattern on the three-dimensional surface model according to actual needs, and this is not limited to the embodiments of the present disclosure. Among them, mapping the pattern to the three-dimensional surface model to obtain the three-dimensional pattern model corresponding to the pattern can be understood as mapping the pattern from two-dimensional data to three-dimensional data according to the three-dimensional surface model. After the pattern is mapped to the three-dimensional surface model, the position of the three-dimensional pattern model relative to the three-dimensional surface model is known, or in other words, the actual position of the pattern on the object to be marked is known.

[0046] In step S13, the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas, each of which is smaller than or equal to the focal area.

[0047] In one possible implementation, the laser marking equipment may include at least a laser emitting device, which includes at least a galvanometer assembly and a laser emitter, wherein the laser emitter is used to emit a laser beam, and the galvanometer assembly is used to optically refract, reflect, etc. the laser beam emitted by the laser emitter, thereby increasing the horizontal and vertical ranges of the laser marking.

[0048] Among them, the position of the laser emitting device in the laser marking equipment can be fixed, and the mechanical structure of the galvanometer assembly in the laser emitting device is fixed, which means that the horizontal and vertical ranges in which the laser beam can be focused are known, and the distance between the focus of the laser beam emitted by the laser emitter in the laser emitting device and the laser emitting point is known, which means that the depth range in which the laser beam can be focused is known. Therefore, the spatial area in which the laser beam can be focused is also known, that is, the focal area of ​​the laser beam is known, or in other words, the area range and area depth of the focal area are known. The area range can be understood as the length and width of the focal area in the horizontal and vertical directions, and the area depth can be understood as the depth of the focal area in the vertical direction.

[0049] It should be understood that the distance between the focal point and the laser emission point of the laser beam emitted by different models of laser emitters can be different. For example, the distance between the focal point and the laser emission point of the laser beam emitted by one laser emitter is between 200mm and 208mm, while the distance between the focal point and the laser emission point of the laser beam emitted by another laser emitter is between 3000mm and 3400mm. In addition, the mechanical structure of the galvanometer assembly is different, so the focal area of ​​the laser marking equipment using different laser emitters and different galvanometer assemblies is also different. The embodiments of the present disclosure do not limit the model of the laser emitter in the laser marking equipment, the mechanical structure of the galvanometer assembly, the position of the laser emitting device in the laser emitting equipment, etc.

[0050] Figure 3 A schematic diagram showing a focus area according to an embodiment of the present disclosure is shown in FIG. Figure 3 As shown, the focal area of ​​the laser beam can be Figure 3 The space area in the shaded part. It should be noted that Figure 3 The focal area shown is an implementation method provided by the present disclosure. Those skilled in the art can design various laser emitting devices according to actual needs to obtain focal areas of different shapes and sizes, and the present disclosure does not limit this embodiment.

[0051] In one possible implementation, segmenting the three-dimensional pattern model according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas may include: segmenting the three-dimensional pattern model horizontally and vertically and / or depth-segmenting the three-dimensional pattern model according to the area range and / or area depth of the focal area of ​​the laser beam emitted by the laser marking device to obtain the at least two segmented marking areas. The area range of each marking area is less than or equal to the area range of the focal area, and the area depth of each marking area is less than or equal to the area depth of the focal area.

[0052] In step S14, the object to be marked is moved according to the first spatial positions corresponding to the respective marking areas on the three-dimensional surface model and the second spatial position of the focus area, so as to mark patterns on the object to be marked in blocks by the laser marking device.

[0053] As described above, the three-dimensional surface model can be obtained by three-dimensional reconstruction of the object to be marked, wherein the coordinate system used for the three-dimensional reconstruction can be a three-dimensional coordinate system set with a fixed position on the laser marking device as the origin. Then, the spatial position of the three-dimensional surface model reconstructed based on the three-dimensional coordinate system in space is known, or the three-dimensional coordinates of the object to be marked in the three-dimensional coordinate system are known.

[0054] Since the spatial position of the three-dimensional surface model in space is known, and the three-dimensional pattern model is obtained by mapping the pattern onto the three-dimensional surface model, the first spatial position corresponding to each marking area on the three-dimensional surface model is also known, or in other words, the three-dimensional coordinates of each marking area in the above-mentioned three-dimensional coordinate system are known.

[0055] As described above, the positions of the galvanometer assembly and the laser emitter in the laser marking device can be fixed, so the second spatial position of the focusing area in space is known. The second spatial position of the focusing area in space can include the three-dimensional coordinates of the center point or boundary point of the focusing area in the above-mentioned three-dimensional coordinate system.

[0056] Considering that the marking area may be an irregular shape, in order to enable the focus area to conveniently cover the entire marking area, in one possible implementation, the first spatial position of each marking area can be the three-dimensional coordinates of the center point of each marking area in the above-mentioned three-dimensional coordinate system; the second spatial position of the focus area can be the three-dimensional coordinates of the center point of the focus area in the above-mentioned three-dimensional coordinate system. In this way, the movement of the object to be marked can be effectively controlled. Of course, the first spatial position can also be the three-dimensional coordinates of the boundary points of each marking area, and the second spatial position can also be the three-dimensional coordinates of the boundary points of the focus area, and this is not limited in the embodiments of the present disclosure.

[0057] In one possible implementation, the object to be marked is moved according to the first spatial positions corresponding to the respective marking areas on the three-dimensional surface model and the second spatial position of the focusing area so as to mark the pattern in blocks on the object to be marked. This may include: for any marking area, according to the first spatial position of the marking area and the second spatial position of the focusing area, moving the object to be marked until the mapping area of ​​the marking area on the object to be marked coincides with the center of the focusing area.

[0058] The mapping area of ​​the marking area on the object to be marked can be understood as the actual area to be marked on the surface of the object to be marked, mapped to the local pattern indicated by the marking area. In one possible implementation, the laser marking equipment can be provided with a mechanical structure such as a robotic arm or a slide rail. The object to be marked can be grasped by a clamp on the robotic arm, or placed on the slide rail. Thus, the movement of the object to be marked can be flexibly controlled by controlling the movement of the robotic arm or the slide rail. This is not limited in the present embodiment.

[0059] Among them, using a robotic arm or a slide rail to move the object to be marked is an implementation method provided by the example of the present disclosure. In fact, those skilled in the art can use any known method to control the movement of the object to be marked, and the embodiment of the present disclosure is not limited to this.

[0060] It should be understood that moving the object to be marked to the point where the mapping area of ​​the marking area on the object to be marked coincides with the center of the focusing area can be understood as moving the center point of the mapping area on the object to be marked to the center point of the focusing area. The first spatial position of any marking area can be understood as the starting position of the mapping area of ​​the marking area on the object to be marked, and the second spatial position of the focusing area can be understood as the end position of the mapping area of ​​the marking area on the object to be marked. Knowing the starting position and the end position, it is possible to move the object to be marked to the point where the mapping area of ​​the marking area on the object to be marked coincides with the focusing area. For example, the center point of the mapping area may coincide with the center point of the focusing area, or the boundary point of the mapping area may coincide with the boundary point of the focusing area. This is not limited in the embodiments of the present disclosure.

[0061] Marking a pattern in blocks on the object to be marked using a laser marking device can be understood as using the laser marking device to process the local patterns indicated by each marking area on the object to be marked one by one. In one possible implementation, marking a pattern in blocks on the object to be marked includes: for any marking area, when the object to be marked is moved to a point where the mapping area of ​​the marking area on the object to be marked coincides with the focus area, using the laser marking device to mark the local pattern indicated by the marking area on the object to be marked, wherein the pattern includes the local pattern. In this way, block marking of the pattern can be effectively achieved.

[0062] Among them, the mapping area and the focus area overlap, which can include the center point of the mapping area overlapping with the center point of the focus area, so that the focus area can cover the mapping area as much as possible; of course, the boundary points of the mapping area and the boundary points of the focus area can also overlap, which is not limited in this embodiment of the present disclosure.

[0063] In an embodiment of the present disclosure, a three-dimensional surface model of an object to be marked is obtained, a specified pattern is mapped onto the three-dimensional surface model to obtain a three-dimensional pattern model, and the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam to obtain at least two marking areas. The object to be marked is moved according to the first spatial position corresponding to each marking area on the three-dimensional surface model and the second spatial position of the focal area. This enables the pattern to be marked in blocks according to the focal area of ​​the laser beam, which is beneficial to improving the marking effect of the pattern on the object to be marked. In addition, since the three-dimensional pattern model obtained by mapping the three-dimensional surface model of the object to be marked is segmented, it can adapt to different objects to be marked with different surfaces.

[0064] As described above, the three-dimensional surface model of the object to be marked can be obtained by three-dimensionally reconstructing the object to be marked. In one possible implementation, a movable image acquisition device is provided on the laser marking device. In step S11, the three-dimensional surface model of the object to be marked is obtained, including:

[0065] The image acquisition device is controlled to move to multiple positions, and the image acquisition device is controlled to respectively acquire images of the object to be marked at each position; based on the multiple positions and the multiple images acquired at each position, the object to be marked is three-dimensionally reconstructed to obtain a three-dimensional surface model of the object to be marked.

[0066] The image acquisition device can be any of various cameras, and this is not limited in the embodiments of the present disclosure. It should be understood that in order to achieve three-dimensional reconstruction of the object to be marked, it is usually necessary to capture images of the object to be marked at multiple angles. In one possible implementation, multiple positions can be pre-set so that the image acquisition device can be automatically controlled to move to each position to capture multiple images of the object to be marked at different angles. Of course, the image acquisition device can also be automatically or manually controlled to randomly move to multiple positions, and the coordinates of each position can be synchronously recorded when capturing images at each randomly moved position. This is not limited in the embodiments of the present disclosure.

[0067] As shown above, the laser marking equipment may be provided with mechanical structures such as a robotic arm or a slide rail. In one possible implementation, the image acquisition device may be provided on the robotic arm or on the slide rail so as to control the movement of the robotic arm or the slide rail to move the image acquisition device to multiple positions.

[0068] It should be understood that controlling the movement of the image acquisition device using a robotic arm or a slide rail is one implementation method provided by the present disclosure. In fact, those skilled in the art can use implementation methods known in the art to control the movement of the image acquisition device to multiple positions, and the present disclosure does not limit this. In particular, when moving to multiple positions to capture images, the coordinate position corresponding to the currently captured image should be recorded synchronously to facilitate the three-dimensional reconstruction of the object to be marked.

[0069] Figure 4 A schematic diagram of a laser marking device according to an embodiment of the present disclosure is shown. Figure 4 The laser marking device shown in the figure can be provided with a robotic arm, and an image acquisition device can be provided on the top of the robotic arm. The robotic arm can move to multiple positions in the direction of the arrow, and the image acquisition device on the top of the robotic arm can capture the object to be marked (such as Figure 4 It should be understood that a scanning area can be set in the laser marking device, and when the user places the object to be marked in the scanning area, it can start to collect multiple images of the object to be marked and perform 3D reconstruction of the object to be marked.

[0070] As described above, the coordinate system used for 3D reconstruction can be a 3D coordinate system set with a fixed position on the laser marking device as the origin. The above-mentioned multiple positions can be 3D coordinates specified based on this 3D coordinate system. Controlling the image acquisition device to capture images of the object to be marked at each position can be understood as controlling the image acquisition device to capture images of the object to be marked while moving the image acquisition device to each position.

[0071] In one possible implementation, 3D reconstruction techniques known in the art, such as Simultaneous Localization And Mapping (SLAM) and Structure from Motion (SFM), can be used to perform 3D reconstruction of the object to be marked based on multiple positions and multiple images collected at each position, thereby obtaining a 3D surface model of the object to be marked.

[0072] Among them, the known positions of the image acquisition device when acquiring each image is equivalent to the known precise camera extrinsic parameters of the image acquisition device when acquiring each image. Then, based on the camera imaging principle adopted in the three-dimensional reconstruction technology, the pre-calibrated camera intrinsic parameters, the camera extrinsic parameters corresponding to each image, and the pixel coordinates of the object to be marked in each image are known. The spatial coordinates of the object to be marked in the above-mentioned three-dimensional coordinate system (that is, the world coordinate system) can be calculated, that is, the three-dimensional reconstruction of the object to be marked is realized, and a three-dimensional surface model is obtained.

[0073] In the embodiment of the present disclosure, since the image acquisition device is controlled to move to multiple positions, when three-dimensional reconstruction of the object to be marked is performed, it is equivalent to having obtained the camera extrinsic parameters of the image acquisition device, that is, obtaining the coordinate position of the image acquisition device in the above-mentioned three-dimensional coordinate system. Therefore, the amount of calculation required to infer the camera extrinsic parameters of the image acquisition device when capturing each image is reduced, and since the three-dimensional coordinates of each position are accurate, this also improves the accuracy and speed of three-dimensional reconstruction of the object to be marked.

[0074] It should be understood that since the focal area of ​​the laser beam has a certain range and depth, while the coverage range and coverage depth of the three-dimensional pattern model are different, there may be multiple segmentation situations. In one possible implementation, in step S13, the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas, including:

[0075] When the coverage range of the three-dimensional pattern model is larger than the area range of the focus area, and the coverage depth of the three-dimensional pattern model is less than or equal to the area depth of the focus area, the three-dimensional pattern model is divided horizontally and vertically according to the area range of the focus area to obtain at least two first marking areas, wherein the area range of each first marking area is less than or equal to the area range of the focus area, and the marking area includes the first marking area.

[0076] In one possible implementation, the coverage of a 3D pattern model can be understood as the length and width of the 3D pattern model in the horizontal and vertical directions, and the coverage depth of the 3D pattern model can be understood as the depth of the 3D pattern model in the vertical direction. The area range of a focus area can be understood as the length and width of the focus area in the horizontal and vertical directions, and the area depth of the focus area can be understood as the depth of the focus area in the vertical direction.

[0077] Among them, the coverage range of the three-dimensional pattern model is larger than the regional range of the focus area, and the coverage depth of the three-dimensional pattern model is less than or equal to the regional depth of the focus area. It can be understood that the three-dimensional pattern model exceeds the focus area in length and / or width, while the three-dimensional pattern model does not exceed the focus area in depth. Therefore, the three-dimensional pattern model can be divided horizontally and vertically according to the regional range of the focus area to obtain at least two first marking areas.

[0078] Partitioning the three-dimensional pattern model horizontally and vertically according to the range of the focus area can be understood as dividing the three-dimensional pattern model into at least two first marking areas in the horizontal and vertical directions (i.e., the height direction and / or the depth direction). In one possible implementation, partitioning the three-dimensional pattern model horizontally and vertically according to the range of the focus area to obtain at least two first marking areas may include: if the height of the three-dimensional pattern model is greater than the height of the focus area, partitioning the three-dimensional pattern model into at least two first marking areas according to the height of the focus area; or if the length of the three-dimensional pattern model is greater than the length of the focus area, partitioning the three-dimensional pattern model into at least two first marking areas according to the length of the focus area; or if the height of the three-dimensional pattern model is greater than the height of the focus area and the length of the three-dimensional pattern model is greater than the length of the focus area, partitioning the three-dimensional pattern model into multiple first marking areas according to the length and width of the focus area.

[0079] Figure 5 A schematic diagram of horizontal and vertical segmentation according to an embodiment of the present disclosure is shown as follows: Figure 5 As shown, the length direction can be Figure 2 The three-dimensional pattern model shown is divided into two first marking areas, namely Figure 5 The two areas indicated by "slash" and "backslash".

[0080] In the embodiment of the present disclosure, it is possible to divide the three-dimensional pattern model horizontally and vertically according to the area range of the focal area of ​​the laser beam, which is beneficial for achieving block marking of the pattern when the length and / or width of the three-dimensional pattern model is greater than the focal area, so as to improve the marking effect of the pattern on the object to be marked.

[0081] As described above, since the area range and area depth of the focal area of ​​the laser beam are fixed, while the coverage range and coverage depth of the three-dimensional pattern model are different, in one possible implementation, in step S13, the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas, including:

[0082] When the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focus area, and the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focus area, the three-dimensional pattern model is depth-segmented according to the regional depth of the focus area to obtain at least two second marking areas, wherein the regional depth of each second marking area is less than or equal to the regional depth of the focus area, and the marking area includes the second marking area.

[0083] Among them, the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focus area, and the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focus area. It can be understood that the three-dimensional pattern model does not exceed the focus area in length and width, but exceeds the focus area in depth. Therefore, the three-dimensional pattern model can be depth-segmented according to the regional depth of the focus area to obtain at least two second marking areas.

[0084] In particular, performing depth segmentation on the three-dimensional pattern model based on the regional depth of the focus area can be understood as segmenting the three-dimensional pattern model into at least two second marking areas in the vertical direction (i.e., the depth direction and the height direction). In one possible implementation, performing depth segmentation on the three-dimensional pattern model based on the regional depth of the focus area to obtain at least two second marking areas may include: segmenting the three-dimensional pattern into at least two second marking areas in the height direction according to the regional depth of the focus area.

[0085] Figure 6 A schematic diagram of depth segmentation according to an embodiment of the present disclosure is shown as follows: Figure 6 As shown, in the height direction, that is, in the depth direction, Figure 2 The three-dimensional pattern model shown is divided into a plurality of second marking areas. Figure 6 The areas indicated by the same grayscale value are areas at the same depth, or in other words, the areas indicated by the same grayscale value are areas at the same height.

[0086] In the embodiment of the present disclosure, it is possible to perform depth segmentation on the three-dimensional pattern model according to the regional depth of the focal area of ​​the laser beam, which is beneficial for realizing block marking of the pattern when the depth of the three-dimensional pattern model is greater than the focal area, so as to improve the marking effect of the pattern on the object to be marked.

[0087] As described above, since the area range and area depth of the focal area of ​​the laser beam are fixed, while the coverage range and coverage depth of the three-dimensional pattern model are different, in one possible implementation, in step S13, the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas, including:

[0088] When the coverage range of the three-dimensional pattern model is larger than the regional range of the focus area, and the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focus area, the three-dimensional pattern model is horizontally and vertically segmented and depth segmented according to the regional range of the focus area and the regional depth of the focus area to obtain multiple third marking areas; wherein the regional range of each third marking area is smaller than or equal to the regional range of the focus area, and the regional depth of each third marking area is smaller than or equal to the regional depth of the focus area, and the marking area includes the third marking area.

[0089] Among them, the coverage range of the three-dimensional pattern model is greater than the regional range of the focus area, and the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focus area. It can be understood that the three-dimensional pattern model exceeds the focus area in length and / or width, and the three-dimensional pattern model exceeds the focus area in depth. Therefore, the three-dimensional pattern model can be deeply segmented according to the regional range and regional depth of the focus area to obtain multiple third marking areas.

[0090] In one possible implementation, the three-dimensional pattern model is divided horizontally and vertically and in depth according to the area range of the focus area and the area depth of the focus area to obtain multiple third marking areas. This may include: dividing the three-dimensional pattern model horizontally and vertically according to the area range of the focus area to obtain at least two first marking areas; performing depth segmentation on the at least two first marking areas according to the area depth of the focus area to obtain multiple third marking areas; or it may also include: performing depth segmentation on the three-dimensional pattern model according to the area depth of the focus area to obtain at least two second marking areas; performing horizontal and vertical segmentation on the at least two second marking areas according to the area range of the focus area to obtain multiple third marking areas.

[0091] Here, the depth segmentation of the three-dimensional pattern model can be referred to above, and the depth segmentation of the at least two first marking areas can be achieved based on the depth of the focus area; and the horizontal and vertical segmentation of the three-dimensional pattern model can be referred to above, and the horizontal and vertical segmentation of the at least two second marking areas can be achieved based on the range of the focus area. It will not be described in detail here. It should be understood that the embodiment of the present disclosure does not limit the order of executing the depth segmentation and the horizontal and vertical segmentation.

[0092] In the embodiment of the present disclosure, it is possible to perform horizontal and vertical segmentation and depth segmentation on the three-dimensional pattern model according to the regional depth and regional range of the focal area of ​​the laser beam, which is conducive to realizing block marking patterns to improve the marking effect of the pattern on the object to be marked.

[0093] It should be understood that in actual situations, there may be a situation where the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focus area, and the coverage depth of the three-dimensional pattern model is less than or equal to the regional depth of the focus area, that is, the three-dimensional pattern model as a whole is smaller than the focus area; in this case, the object to be marked can be directly moved to the mapping area of ​​the three-dimensional pattern model on the object to be marked so that it coincides with the center of the focus area according to the first spatial position corresponding to the three-dimensional pattern model on the three-dimensional drawing model and the second spatial position of the focus area, so as to directly process the pattern on the object to be marked.

[0094] Considering that there are usually multiple marking areas, in order to more conveniently move the object to be marked and more efficiently process the pattern on the object to be marked, in one possible implementation, in step S14, according to the first spatial position corresponding to each marking area on the three-dimensional surface model and the second spatial position of the focus area, the object to be marked is moved, so that the laser marking device can mark the pattern on the object to be marked in blocks, including:

[0095] Step S141: determining the marking order of each marking area according to the first spatial position of each marking area.

[0096] Determining the marking order of each marking area based on the first spatial position of each marking area may include determining the marking order of each marking area based on the first spatial position of each marking area relative to the three-dimensional surface model in at least one of the following ways: from left to right, from top to bottom, and from high to low. Of course, the marking order of each marking area may also be determined in a manner such as from right to left, from bottom to top, or from low to high.

[0097] For example, Figure 5 The three-dimensional pattern model under the horizontal and vertical segmentation shown can be determined from left to right that the area indicated by the "slash" on the left is the first marking area for the first marking, and the area indicated by the "backslash" on the right is the first marking area for the second marking, that is, Figure 5 The marking sequence of the two first marking areas is shown. Figure 6 The depth-segmented 3D pattern model shown can be used to determine the marking order of each second marking area from high to low. That is, the local pattern indicated by the second marking area with the highest marking height on the object to be marked is marked first, and the local pattern indicated by the second marking area with the lowest marking height is marked last. Second marking areas at the same height can be marked from left to right.

[0098] Step S142: moving the object to be marked according to the relative position relationship between adjacent marking areas indicated by the marking sequence and the second spatial position of the focus area, so as to mark patterns on the object to be marked in blocks by the laser marking device.

[0099] The adjacent marking areas indicated by the marking order can be understood as the marking order used to indicate the adjacent marking areas in at least two marking areas. For example, Figure 5 The two first marking areas may be adjacent marking areas, Figure 6 The second marking areas of the first marking and the second marking may be adjacent marking areas, the second marking areas of the second marking and the second marking areas of the third marking may be adjacent marking areas, and so on.

[0100] It should be understood that although the object to be marked is moving, the relative positional relationship between adjacent marking areas remains unchanged. In other words, the relative positional relationship between adjacent marking areas and their corresponding adjacent mapping areas on the object to be marked remains unchanged. Therefore, if the first spatial position of the marking area of ​​the first marking (i.e., the starting position of the movement of the object to be marked), the relative positional relationship between adjacent marking areas, and the second spatial position of the focus area (i.e., the end position of each marking area's mapping area on the object to be marked) are known, the movement of the object to be marked can be controlled. The coordinate difference between adjacent marking areas can be used to represent the relative positional relationship between adjacent marking areas.

[0101] For example, assuming that marking area a and marking area b are adjacent marking areas, the first spatial position of the center point of marking area a is (x1, y1, z1), the first spatial position of the center point of marking area b is (x2, y2, z2), the relative position relationship between marking area a and marking area b is (x2-x1, y2-y1, z2-z1), and the spatial position of the center point of the focus area is (x0, y0, z0);

[0102] For the first marking, the object to be marked can be moved so that the mapping area of ​​marking area a on the object to be marked coincides with the focus area. That is, the center point (x1, y1, z1) of the mapping area of ​​marking area a on the object to be marked is moved to the center point (x0, y0, z0) of the focus area. At this time, the coordinates of the center point of the mapping area corresponding to marking area b on the object to be marked are (x2-x1+x0, y2-y1+y0, z2-z1+z0);

[0103] For the second marking, the object to be marked can be moved so that the mapping area of ​​marking area b on the object to be marked overlaps with the focus area. That is, the center point (x2-x1+x0, y2-y1+y0, z2-z1+z0) of the mapping area corresponding to marking area b on the object to be marked is moved to the center point (x0, y0, z0) of the focus area. It should be understood that when there are multiple marking areas, the third and fourth markings can be performed in the same manner.

[0104] Figure 7 A schematic diagram of a laser marking device according to an embodiment of the present disclosure is shown. Figure 7 As shown, the laser emitting device emits a laser beam, and the robotic arm grabs the object to be marked ( Figure 7 Medium cup) along Figure 7 Move in the direction of the middle arrow to mark the pattern in blocks.

[0105] It should be understood that, when the coverage range of the three-dimensional pattern model is larger than the regional range of the focus area, and the coverage depth of the three-dimensional pattern model is less than or equal to the regional depth of the focus area, when the object to be marked is moved in step S14, the object to be marked is moved in the horizontal and vertical directions, that is, it moves in the length and / or width direction; when the coverage depth of the three-dimensional pattern model is larger than the regional depth of the focus area, and the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focus area, when the object to be marked is moved in step S14, the object to be marked is moved in the depth direction, that is, it moves in the vertical direction or height direction; when the coverage range of the three-dimensional pattern model is larger than the regional range of the focus area, and the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focus area, when the object to be marked is moved in step S14, the object to be marked is moved not only in the horizontal and vertical directions, but also in the depth direction.

[0106] In the embodiment of the present disclosure, the movement of the object to be marked can be effectively controlled according to the first spatial position of the marking area and the second spatial position of the focus area, so as to realize the block marking of the pattern on the object to be marked.

[0107] An embodiment of the present disclosure also proposes a laser marking system, comprising: a computing device, a robotic arm, and a laser marking device; wherein the computing device is configured to execute the above-mentioned laser marking method, and is used to control the robotic arm and the laser marking device; the robotic arm is used to fix and move the object to be marked; and the laser marking device is used to mark a pattern on the object to be marked.

[0108] In one possible implementation, the computing device may be an electronic device with computing and storage capabilities; the robotic arm and the laser marking device are respectively connected to the computing device by wires, and the computing device may control the robotic arm to move the object to be marked according to the above-mentioned laser marking method, and control the laser marking device to mark patterns in blocks on the object to be marked according to the above-mentioned laser marking method; the robotic arm may be provided with an angle for fixing the object to be marked.

[0109] According to the laser marking system of the embodiment of the present disclosure, it can not only conveniently adapt to various curved surfaces of objects to be marked, that is, realize marking patterns on various curved surfaces of objects to be marked, but also realize three-dimensional laser marking at a lower cost, and is open to ordinary users with a lower threshold.

[0110] If the technical solution of this application involves personal information, the product that applies the technical solution of this application has clearly informed the personal information processing rules and obtained the individual's voluntary consent before processing personal information. If the technical solution of this application involves sensitive personal information, the product that applies the technical solution of this application has obtained the individual's separate consent before processing sensitive personal information, and at the same time meets the "explicit consent" requirement. For example, on personal information collection devices such as cameras, a clear and prominent sign is set to inform that the personal information collection scope has been entered and personal information will be collected. If the individual voluntarily enters the collection scope, it is deemed that they agree to the collection of their personal information; or on the personal information processing device, when the personal information processing rules are notified by obvious signs / information, the individual's authorization is obtained through pop-up information or by asking the individual to upload their personal information; among which, the personal information processing rules may include information such as the personal information processor, the purpose of personal information processing, the processing method, and the type of personal information processed.

[0111] It is understood that the above-mentioned various method embodiments mentioned in this disclosure can be combined with each other to form combined embodiments without violating the principle logic. Due to space limitations, this disclosure will not go into details. It is understood by those skilled in the art that in the above-mentioned methods of specific implementation, the specific execution order of each step should be determined by its function and possible internal logic.

[0112] In addition, the present disclosure also provides a laser marking device, an electronic device, a computer-readable storage medium, and a program, all of which can be used to implement any laser marking method provided by the present disclosure. The corresponding technical solutions and descriptions are referred to the corresponding records in the method section and will not be repeated here.

[0113] Figure 8 A block diagram of a laser marking device according to an embodiment of the present disclosure is shown as follows: Figure 8 As shown, the device includes:

[0114] An acquisition module 101 is used to acquire a three-dimensional surface model of an object to be marked;

[0115] A mapping module 102 is configured to map a specified pattern onto the three-dimensional surface model to obtain a three-dimensional pattern model corresponding to the pattern;

[0116] a segmentation module 103 for segmenting the three-dimensional pattern model according to a focal area of ​​a laser beam emitted by a laser marking device to obtain at least two segmented marking areas, each marking area being smaller than or equal to the focal area;

[0117] The moving module 104 is used to move the object to be marked according to the first spatial positions corresponding to the respective marking areas on the three-dimensional surface model and the second spatial position of the focus area, so as to mark the pattern on the object to be marked in blocks by the laser marking device.

[0118] In one possible implementation, the laser marking device is provided with a movable image acquisition device, and the acquisition module 101 includes: a control submodule, used to control the image acquisition device to move to multiple positions, and control the image acquisition device to respectively acquire an image of the object to be marked at each position; and a reconstruction submodule, used to perform three-dimensional reconstruction of the object to be marked based on the multiple positions and the multiple images acquired at each position, to obtain a three-dimensional surface model of the object to be marked.

[0119] In one possible implementation, the segmentation module 103 includes: a first segmentation submodule, configured to segment the three-dimensional pattern model horizontally and vertically according to the area range of the focus area when the coverage range of the three-dimensional pattern model is greater than the area range of the focus area and the coverage depth of the three-dimensional pattern model is less than or equal to the area depth of the focus area, so as to obtain at least two first marking areas, wherein the area range of each first marking area is less than or equal to the area range of the focus area, and the marking area includes the first marking area.

[0120] In one possible implementation, the segmentation module 103 includes: a second segmentation submodule, configured to perform depth segmentation on the three-dimensional pattern model according to the regional depth of the focus area when the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focus area and the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focus area, so as to obtain at least two second marking areas, wherein the regional depth of each second marking area is less than or equal to the regional depth of the focus area, and the marking area includes the second marking area.

[0121] In one possible implementation, the segmentation module 103 includes: a third segmentation submodule, which is used to perform horizontal and vertical segmentation and depth segmentation on the three-dimensional pattern model according to the area range of the focus area and the area depth of the focus area when the coverage range of the three-dimensional pattern model is greater than the area range of the focus area and the coverage depth of the three-dimensional pattern model is greater than the area depth of the focus area, so as to obtain multiple third marking areas; wherein the area range of each third marking area is less than or equal to the area range of the focus area, and the area depth of each third marking area is less than or equal to the area depth of the focus area, and the marking area includes the third marking area.

[0122] In one possible implementation, the moving module 104 includes: a sequence determination submodule, used to determine the marking sequence of each marking area according to the first spatial position of each marking area; and a moving submodule, used to move the object to be marked according to the relative position relationship between adjacent marking areas indicated by the marking sequence and the second spatial position of the focusing area, so as to mark the pattern on the object to be marked in blocks by the laser marking device.

[0123] In one possible implementation, marking the pattern in blocks on the object to be marked by the laser marking device includes: for any marking area, when the object to be marked moves to a point where a mapping area of ​​the marking area on the object to be marked coincides with the focus area, marking a local pattern indicated by the marking area on the object to be marked by the laser marking device, the pattern including the local pattern.

[0124] In an embodiment of the present disclosure, a three-dimensional surface model of an object to be marked is obtained, a specified pattern is mapped onto the three-dimensional surface model to obtain a three-dimensional pattern model, and the three-dimensional pattern model is segmented according to the focal area of ​​the laser beam to obtain at least two marking areas. The object to be marked is moved according to the first spatial position corresponding to each marking area on the three-dimensional surface model and the second spatial position of the focal area. This enables the pattern to be marked in blocks according to the focal area of ​​the laser beam, which is beneficial to improving the marking effect of the pattern on the object to be marked. In addition, since the three-dimensional pattern model obtained by mapping the three-dimensional surface model of the object to be marked is segmented, it can adapt to different objects to be marked with different surfaces.

[0125] In some embodiments, the functions or modules included in the device provided by the embodiments of the present disclosure can be used to execute the method described in the above method embodiment. Its specific implementation can refer to the description of the above method embodiment. For the sake of brevity, it will not be repeated here.

[0126] The present disclosure also provides a computer-readable storage medium having computer program instructions stored thereon, wherein the computer program instructions implement the above method when executed by a processor. The computer-readable storage medium may be a volatile or non-volatile computer-readable storage medium.

[0127] An embodiment of the present disclosure further proposes an electronic device, comprising: a processor; and a memory for storing instructions executable by the processor; wherein the processor is configured to call the instructions stored in the memory to execute the above method.

[0128] An embodiment of the present disclosure also provides a computer program product, including computer-readable code, or a non-volatile computer-readable storage medium carrying computer-readable code. When the computer-readable code runs in a processor of an electronic device, the processor in the electronic device executes the above method.

[0129] The electronic device may be provided as a terminal, a server, the aforementioned computing device, or a device in other forms.

[0130] Figure 9 1 shows a block diagram of an electronic device 1900 according to an embodiment of the present disclosure. For example, the electronic device 1900 can be provided as a server, a terminal device or the above-mentioned computing device. Figure 9 The electronic device 1900 includes a processing component 1922, which further includes one or more processors, and a memory resource represented by a memory 1932 for storing instructions executable by the processing component 1922, such as applications. The applications stored in the memory 1932 may include one or more modules, each corresponding to a set of instructions. In addition, the processing component 1922 is configured to execute the instructions to perform the above-described method.

[0131] The electronic device 1900 may further include a power supply component 1926 configured to perform power management of the electronic device 1900, a wired or wireless network interface 1950 configured to connect the electronic device 1900 to a network, and an input / output (I / O) interface 1958. The electronic device 1900 may operate based on an operating system stored in the memory 1932, such as a Microsoft Server operating system (Windows Server 2003). TM ), a graphical user interface operating system launched by Apple (Mac OSX TM ), a multi-user, multi-process computer operating system (Unix TM ), a free and open source Unix-like operating system (Linux TM ), an open-source Unix-like operating system (FreeBSD TM ) or similar.

[0132] In an exemplary embodiment, a non-volatile computer-readable storage medium is also provided, such as a memory 1932 including computer program instructions that can be executed by the processing component 1922 of the electronic device 1900 to perform the above method.

[0133] The present disclosure may be a system, method and / or computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present disclosure.

[0134] Computer-readable storage media can be a tangible device that can hold and store the instructions used by the instruction execution device. Computer-readable storage media can be, for example, (but not limited to) an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination thereof. More specific examples (non-exhaustive list) of computer-readable storage media include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, for example, a punch card or a convex structure in a groove on which instructions are stored, and any suitable combination thereof. Computer-readable storage media used herein is not interpreted as a transient signal itself, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagated by waveguides or other transmission media (for example, light pulses by fiber optic cables), or electrical signals transmitted by wires.

[0135] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions to be stored in the computer-readable storage medium in each computing / processing device.

[0136] The computer program instructions for performing the operations of the present disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, and conventional procedural programming languages ​​such as "C" language or similar programming languages. Computer-readable program instructions may be executed entirely on a user's computer, partially on a user's computer, as an independent software package, partially on a user's computer, partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., utilizing an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may be personalized by utilizing the state information of the computer-readable program instructions. The electronic circuit may execute the computer-readable program instructions, thereby realizing various aspects of the present disclosure.

[0137] Various aspects of the present disclosure are described herein with reference to flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present disclosure. It should be understood that each block of the flowcharts and / or block diagrams, and combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer-readable program instructions.

[0138] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device is generated that implements the functions / actions specified in one or more blocks in the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium, where these instructions cause the computer, programmable data processing device, and / or other device to operate in a specific manner. Thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing various aspects of the functions / actions specified in one or more blocks in the flowchart and / or block diagram.

[0139] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operational steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more blocks in the flowchart and / or block diagram.

[0140] The flow charts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present disclosure. In this regard, each box in the flow chart or block diagram can represent a part of a module, program segment or instruction, and the part of the module, program segment or instruction includes one or more executable instructions for realizing the prescribed logical function. In some alternative implementations, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs the prescribed function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0141] The computer program product may be implemented in hardware, software, or a combination thereof. In one embodiment, the computer program product is implemented as a computer storage medium. In another embodiment, the computer program product is implemented as a software product, such as a software development kit (SDK).

[0142] While various embodiments of the present disclosure have been described above, the above descriptions are illustrative, non-exhaustive, and not intended to be limiting of the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or improvements to existing technologies, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A laser marking method, characterized in that: include: Obtain a three-dimensional surface model of the object to be marked; Mapping a specified pattern onto the three-dimensional surface model to obtain a three-dimensional pattern model corresponding to the pattern; Segmenting the three-dimensional pattern model according to a focal area of ​​a laser beam emitted by a laser marking device to obtain at least two segmented marking areas, each marking area being smaller than or equal to the focal area; According to the first spatial positions corresponding to the respective marking areas on the three-dimensional curved surface model and the second spatial position of the focus area, the object to be marked is moved so as to mark the pattern on the object to be marked in blocks by the laser marking device; The three-dimensional pattern model is segmented according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas, including: In a case where the coverage range of the three-dimensional pattern model is larger than the area range of the focus area, and the coverage depth of the three-dimensional pattern model is less than or equal to the area depth of the focus area, the three-dimensional pattern model is divided horizontally and vertically according to the area range of the focus area to obtain at least two first marking areas, wherein the area range of each first marking area is less than or equal to the area range of the focus area, and the marking areas include the first marking areas; or In a case where the coverage range of the three-dimensional pattern model is larger than the regional range of the focus area, and the coverage depth of the three-dimensional pattern model is larger than the regional depth of the focus area, the three-dimensional pattern model is segmented horizontally and vertically and in depth according to the regional range of the focus area and the regional depth of the focus area to obtain a plurality of third marking areas; wherein the regional range of each third marking area is smaller than or equal to the regional range of the focus area, and the regional depth of each third marking area is smaller than or equal to the regional depth of the focus area, and the marking area includes the third marking area; or, When the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focal area, and the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focal area, the three-dimensional pattern model is depth-segmented according to the regional depth of the focal area to obtain at least two second marking areas, wherein the regional depth of each second marking area is less than or equal to the regional depth of the focal area, and the marking area includes the second marking area.

2. The method according to claim 1, characterized in that The laser marking device is provided with a movable image acquisition device, and the acquisition of the three-dimensional surface model of the object to be marked includes: Controlling the image acquisition device to move to a plurality of positions, and controlling the image acquisition device to respectively acquire an image of the object to be marked at each position; The object to be marked is three-dimensionally reconstructed according to the multiple positions and the multiple images collected at each position to obtain a three-dimensional surface model of the object to be marked.

3. The method according to claim 1 or 2, characterized in that The method of moving the object to be marked according to the first spatial position corresponding to each marking area on the three-dimensional curved surface model and the second spatial position of the focus area, so as to mark the pattern on the object to be marked in blocks by the laser marking device, includes: Determining a marking order for each marking area according to the first spatial position of each marking area; According to the relative positional relationship between adjacent marking areas indicated by the marking sequence and the second spatial position of the focus area, the object to be marked is moved so as to mark the pattern in blocks on the object to be marked by the laser marking device.

4. The method according to claim 1 or 2, characterized in that The step of marking the pattern on the object to be marked in blocks by the laser marking device includes: For any marking area, when the object to be marked moves to the marking area and the mapping area on the object to be marked coincides with the focus area, the laser marking device marks a local pattern indicated by the marking area on the object to be marked, and the pattern includes the local pattern.

5. A laser marking system, characterized in that: include: Computing equipment, robotic arms, and laser marking equipment; Wherein, the computing device is configured to execute the method according to any one of claims 1 to 4, for controlling the robotic arm and the laser marking device; The robotic arm is used to fix and move the object to be marked; and the laser marking device is used to mark a pattern on the object to be marked.

6. A laser marking device, characterized in that: include: An acquisition module, used to obtain a three-dimensional surface model of the object to be marked; A mapping module, configured to map a specified pattern onto the three-dimensional surface model to obtain a three-dimensional pattern model corresponding to the pattern; a segmentation module, configured to segment the three-dimensional pattern model according to a focal area of ​​a laser beam emitted by a laser marking device, to obtain at least two segmented marking areas, each marking area being smaller than or equal to the focal area; a moving module, configured to move the object to be marked according to the first spatial positions corresponding to the respective marking areas on the three-dimensional curved surface model and the second spatial position of the focus area, so as to mark the pattern on the object to be marked in blocks by the laser marking device; The three-dimensional pattern model is segmented according to the focal area of ​​the laser beam emitted by the laser marking device to obtain at least two segmented marking areas, including: In a case where the coverage range of the three-dimensional pattern model is larger than the area range of the focus area, and the coverage depth of the three-dimensional pattern model is less than or equal to the area depth of the focus area, the three-dimensional pattern model is divided horizontally and vertically according to the area range of the focus area to obtain at least two first marking areas, wherein the area range of each first marking area is less than or equal to the area range of the focus area, and the marking areas include the first marking areas; or In a case where the coverage range of the three-dimensional pattern model is larger than the regional range of the focus area, and the coverage depth of the three-dimensional pattern model is larger than the regional depth of the focus area, the three-dimensional pattern model is segmented horizontally and vertically and in depth according to the regional range of the focus area and the regional depth of the focus area to obtain a plurality of third marking areas; wherein the regional range of each third marking area is smaller than or equal to the regional range of the focus area, and the regional depth of each third marking area is smaller than or equal to the regional depth of the focus area, and the marking area includes the third marking area; or, When the coverage depth of the three-dimensional pattern model is greater than the regional depth of the focal area, and the coverage range of the three-dimensional pattern model is less than or equal to the regional range of the focal area, the three-dimensional pattern model is depth-segmented according to the regional depth of the focal area to obtain at least two second marking areas, wherein the regional depth of each second marking area is less than or equal to the regional depth of the focal area, and the marking area includes the second marking area.

7. An electronic device, characterized in that: include: processor; a memory for storing processor-executable instructions; The processor is configured to call the instructions stored in the memory to execute the method according to any one of claims 1 to 4.

8. A computer-readable storage medium having computer program instructions stored thereon, characterized in that: When the computer program instructions are executed by a processor, the method according to any one of claims 1 to 4 is implemented.

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