A power semiconductor module and its application

Abstract

This invention discloses a power semiconductor module and its application. The power semiconductor module includes a package shell, a substrate, a chip, power terminals, and a position adjustment mechanism. The package shell includes a first shell, a second shell, and a third shell, with the second and third shells stacked within the first shell. The substrate, the first shell, and the second shell form a package cavity. The chip and power terminals are disposed on the substrate and located within the package cavity. The second shell has multiple first through holes, and the third shell has multiple second through holes. The position adjustment mechanism can adjust the relative positions of the second and third shells so that the aperture of the power terminal through hole formed by the mating of a first through hole and a corresponding second through hole varies between a first aperture and a second aperture. The power semiconductor module provided by this invention has the power terminals fixed relative to the package shell, preventing deformation or even breakage of the power terminals due to stress conditions such as collisions and vibrations.

Description

Technical Field

[0001] This invention specifically relates to a power semiconductor module and its application, belonging to the field of power semiconductor module manufacturing technology. Background Technology

[0002] Power semiconductor modules are groups of semiconductor components used in power electronic circuits, typically in automotive, solar, and industrial applications such as inverters and rectifiers.

[0003] Power semiconductor modules typically include IGBT (Insulated Gate Metal Oxide Semiconductor Transistor) chips or MOSFET (Metal Oxide Field Effect Transistor) chips, DBC (Metal Ceramic Clad) substrates, pins and pin bases for connection, and a protective package. Some also have a bottom heatsink for heat dissipation, additional semiconductor diodes for overvoltage protection, and NTC components for overheat protection.

[0004] Commonly used power semiconductor module packaging structures include 62mm modules, EASY modules, and ECONO modules. However, these power semiconductor modules all have the following problems during use: 1. The power terminal pins are relatively long, and they are prone to breakage due to stress during actual use; 2. The upper end of the pin is not fixed relative to the module but is fixed to the drive circuit board after installation. If the module and the drive circuit board are relatively displaced during vibration, the pins and the base are prone to detachment and deformation. Summary of the Invention

[0005] The main objective of this invention is to provide a power semiconductor module and its application to overcome the shortcomings of the prior art.

[0006] To achieve the aforementioned objectives, the technical solution adopted by this invention includes:

[0007] One aspect of the present invention provides a power semiconductor module comprising:

[0008] The encapsulation housing includes a first housing, a second housing, and a third housing, wherein the second housing and the third housing are detachably disposed sequentially within the first housing along an axial direction, the second housing has a plurality of first through holes, and the third housing has a plurality of second through holes;

[0009] A substrate is circumferentially connected to one end of the first housing and together with the first housing and the second housing to form an encapsulation chamber;

[0010] The chip and power terminal are disposed on the substrate and located in the packaging cavity, and the diameter of the power terminal is smaller than the diameter of either the first through hole or the second through hole.

[0011] A position adjustment mechanism is used to adjust the relative position of the second housing and the third housing so that the diameter of the power terminal through hole formed by a first through hole and a corresponding second through hole varies between a first hole diameter and a second hole diameter, wherein the first hole diameter is larger than the second hole diameter and the second hole diameter is greater than or equal to the diameter of the power terminal.

[0012] Another aspect of the present invention provides a semiconductor component comprising the power semiconductor module described above, a heat sink, and a drive circuit board, wherein the heat sink is thermally connected to the power semiconductor module, and the drive circuit board is electrically connected to the power semiconductor module.

[0013] Compared with the prior art, the advantages of the present invention include:

[0014] 1) The present invention provides a power semiconductor module whose package shell is composed of three parts: a first shell, a second shell, and a third shell. The three shell parts are connected by a special connection structure, which enables the disassembly, replacement, and recycling of the second shell and the third shell.

[0015] 2) The power semiconductor module provided by the present invention has a second housing and a third housing designed with a large through hole diameter for the power terminal before installation. This ensures that the power terminal will not deform due to its fixed position during transportation, and reduces the difficulty of the pin insertion and potting process, making it easier to manufacture. After installation, the second housing and the third housing are moved relative to each other by an elastic element, which reduces the through hole diameter for the power terminal, reduces the swing range of the power terminal or even fixes it completely, and ensures that the power terminal will not fall off or deform due to stress during use, thus preventing the module from losing its function.

[0016] 3) The power semiconductor module provided by the present invention only requires inserting pins, attaching dies (chips) and wire bonding operations on the metal-clad ceramic substrate. Then, it only needs to be placed in the first housing for dispensing glue, and then the second and third housings are snapped on after potting to complete the assembly, thus obtaining the finished product, which can save processing costs. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a power semiconductor module provided in an embodiment of the present invention;

[0019] Figure 2 yes Figure 1 A schematic diagram of the four-fold magnified structure at point I;

[0020] Figure 3 This is a top view of the first housing provided in an embodiment of the present invention;

[0021] Figure 4 This is a front view of the first housing provided in an embodiment of the present invention;

[0022] Figure 5 This is a top view of the second housing provided in an embodiment of the present invention;

[0023] Figure 6 This is a front view of the second housing provided in an embodiment of the present invention;

[0024] Figure 7 This is a schematic diagram of the structure of a power semiconductor module after installation, provided in an embodiment of the present invention. Detailed Implementation

[0025] In view of the deficiencies of the prior art, the inventors of this invention, through long-term research and extensive practice, have proposed the technical solution of this invention. Addressing the problem that power terminals of integrated power semiconductor modules in the prior art are easily damaged during use, this invention provides a novel power semiconductor module with relatively fixed power terminals, which can prevent the power terminal pins from displacing relative to the drive circuit board, thus preventing detachment, deformation, or breakage. The following will further explain and illustrate this technical solution, its implementation process, and its principles.

[0026] This invention provides a power semiconductor module, which includes a package housing. The package housing includes a first housing, a second housing, and a third housing. The second housing and the third housing are detachably disposed sequentially within the first housing along an axial direction. The second housing has a plurality of first through holes, and the third housing has a plurality of second through holes.

[0027] A substrate is circumferentially connected to one end of the first housing and together with the first housing and the second housing to form an encapsulation chamber;

[0028] The chip and power terminal are disposed on the substrate and located in the packaging cavity, and the diameter of the power terminal is smaller than the diameter of either the first through hole or the second through hole.

[0029] A position adjustment mechanism is used to adjust the relative position of the second housing and the third housing so that the diameter of the power terminal through hole formed by a first through hole and a corresponding second through hole varies between a first hole diameter and a second hole diameter, wherein the first hole diameter is larger than the second hole diameter and the second hole diameter is greater than or equal to the diameter of the power terminal.

[0030] In some embodiments, the substrate includes a metal-clad ceramic substrate, and the chip, the conductive metal layer on the metal-clad ceramic substrate, and the power terminals are electrically connected by metal wires.

[0031] Furthermore, the position adjustment mechanism includes an elastic element disposed between at least one of the second housing and the third housing and the first housing, wherein the power terminal through hole has a first aperture when the elastic element does not apply force to either the second housing or the third housing, and has a second aperture when the elastic element applies force to at least one of the second housing and the third housing.

[0032] In some embodiments, the elastic element is provided at least between the first side of the second housing and the inner wall of the first housing, and at least between the first side of the third housing and the inner wall of the first housing, wherein the first side of the second housing and the first side of the third housing are arranged opposite each other in the radial direction.

[0033] In some embodiments, the elastic element is provided between the first side and the second side of the second housing and the inner wall of the first housing, and between the first side and the second side of the third housing and the inner wall of the first housing. The first side of the second housing is adjacent to the second side, and the first side of the third housing is adjacent to the second side. The second side of the second housing and the second side of the third housing are arranged opposite each other in the radial direction. The first side and the second side of the second housing are engaged with the inner wall of the first housing, and the first side and the second side of the third housing are engaged with the inner wall of the first housing through a snap-fit ​​structure or a tenon structure.

[0034] In some embodiments, protrusions are provided on the first and second sides of the second housing and the first and second sides of the third housing, and the protrusions cooperate with a first groove structure formed on the inner wall of the first housing.

[0035] In some embodiments, the inner wall of the first housing is further provided with a second groove structure, the first groove structure is in communication with the second groove structure, and the second housing and the third housing are disposed within the second groove structure.

[0036] In some embodiments, the elastic element includes a spring fixedly disposed within the second groove structure.

[0037] Furthermore, the power semiconductor module also includes a locking structure for preventing the second housing and the third housing from falling out of the second groove structure.

[0038] Furthermore, the power semiconductor module further includes a locking mechanism for fixing the first housing relative to the second and third housings, and ensuring that the power terminal through-hole has the first aperture. The locking mechanism may be a locking pin inserted between the first and second through-holes to maintain the aperture of the power terminal through-hole at the first aperture and to keep the spring in a compressed state.

[0039] The technical solution will now be clearly and completely described with reference to the accompanying drawings and specific embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Furthermore, unless otherwise specified, the metal-clad ceramic substrate, chip, power terminals, pins, heat sink, and driver circuit board included in the embodiments of this invention are all components known to those skilled in the art. It should be understood that the embodiments of this invention primarily protect the structure of the power semiconductor module, while the processes used to connect the various components within the structure of the power semiconductor module are not specifically limited.

[0040] See also Figure 1-2 The present invention provides a power semiconductor module comprising a package shell, a metal-clad ceramic substrate 4, power terminals 5, a chip 7, and a position adjustment mechanism. The package shell includes a first housing 1, a second housing 2, and a third housing 3. The second housing 2 and the third housing 3 are detachably stacked sequentially within the first housing 1 along the axial direction. The metal-clad ceramic substrate 4 is circumferentially connected to one end of the first housing 1 and together with the first housing 1 and the second housing 2, forms a package cavity. The chip 7 and the power terminals 5 are disposed on the metal-clad ceramic substrate 4 and located within the package cavity.

[0041] Specifically, conductive metal layers are provided on both the front and back sides of the metal-coated ceramic substrate 4. The chip 7, the conductive metal layer on the front side of the metal-coated ceramic substrate 4, and the power terminal 5 are electrically connected by a metal wire 9. The back side of the metal-coated ceramic substrate 4 is fixedly connected to the first housing 1 by dispensing adhesive.

[0042] More specifically, the chip 7 and the power terminal 5 can be connected to the front conductive metal layer of the metal-clad ceramic substrate 4 by reflow soldering or sintering silver. The chip 7, the front conductive metal layer of the metal-clad ceramic substrate 4 and the power terminal are interconnected by a metal line 9. The metal line 9 can transmit control signals and power signals. Its material includes Al, Cu, Ag or Al-coated Cu, but is not limited to these.

[0043] The power terminal 5 includes a base 10 and a pin 6 fixedly connected to the base 10. The base 10 is fixedly welded to the conductive metal layer on the front side of the metal-clad ceramic substrate 4, and the pin 6 extends out to the outside of the package housing.

[0044] For further details, please refer to Figure 3-4 The first shell 1 is a hollow cuboid structure, and a first groove structure 16 is provided at the center of the four inner walls of the first shell 1. At the same time, a second groove structure 15 is also provided around the inner wall of the first shell 1. The first groove structure 16 and the second groove structure 15 are connected.

[0045] For further details, please refer to Figure 5-6 The figure shows a top view and a front view of the second shell 2. It should be noted that the third shell 3 (not shown in the figure) has the same structure as the second shell 2 and is generally square. Specifically, as... Figure 5 As shown, the second housing 2 is provided with a plurality of first through holes 22, and correspondingly, the third housing 3 is provided with a plurality of second through holes. The diameter of the pin 6 of the power terminal 5 is smaller than the diameter of either the first through hole 22 or the second through hole. When the second housing 2 and the third housing 3 are stacked sequentially in the first housing 1 along the axial direction, one of the first through holes 22 and a corresponding second through hole can cooperate to form a power terminal through hole through which the pin 6 of the power terminal 5 passes.

[0046] Meanwhile, the second housing 2 and the third housing 3 each have a protrusion 17 on their adjacent first and second sides. The protrusion 17 can engage with the first groove structure 16 on the inner wall of the first housing 1, allowing the second housing 2 and the third housing 3 to be sequentially stacked within the second groove structure 15 of the first housing 1. Furthermore, the dimension of the second groove structure 15 along the thickness direction of the first housing 1 is equal to the sum of the thicknesses of the second housing 2 and the third housing 3, while its dimension along the plane of the first housing 1 is slightly larger than the dimensions of the second housing 2 and the third housing 3, to allow for thermal expansion and contraction.

[0047] The first side of the second housing 2 is radially opposite to the first side of the third housing 3, and the second side of the second housing 2 is radially opposite to the second side of the third housing 3.

[0048] Furthermore, the position adjustment mechanism includes an elastic element, which may specifically be a spring 11 fixedly disposed within the second groove structure 15. When the second housing 2 and the third housing 3 are sequentially stacked in the second groove structure 15, the spring 11 cooperates with the protrusion 17, and the relative position of the second housing 2 and the third housing 3 is adjusted by the elastic force of the spring 11, so that the aperture of the power terminal through hole formed by each first through hole 22 cooperating with a corresponding second through hole gradually decreases from the first aperture to the second aperture. Here, the first aperture can be understood as the aperture of the first through hole 22 of the second housing 2 or the second through hole of the third housing 3, while the second aperture is slightly larger than or equal to the diameter of the pin 6 of the power terminal 5. This makes the power terminal 5 and the pin 6 relatively fixed to the package shell of the power semiconductor module, which can prevent the pin 6 from breaking or deforming when the power semiconductor module and the drive circuit board are relatively displaced after the pin 6 of the power terminal 5 is connected to the drive circuit board, or the base 10 from falling off the metal-clad ceramic substrate 4.

[0049] For further details, please refer to the following: Figure 7 As shown, the first housing 1 also has fixing parts 14 on both sides for fixing the power semiconductor module to the heat sink 24. The fixing parts 14 are connected to the first housing 1 through the connecting parts 13. The fixing parts 14 are provided with through holes 18 for screws 23 to pass through. The through holes 18 are generally oblong or circular holes. The power semiconductor module is threaded to the heat sink 24 by the screws 23, and the gap between the power semiconductor module and the heat sink 24 is filled with thermal grease 25 to achieve thermal conductivity connection between the two.

[0050] Furthermore, the end of the fixing part 14 away from the first housing 1 also has a notch 12 and a reinforcing part 21, which are used to strengthen the structural strength of the fixing part.

[0051] In addition, four fixing holes 19 are symmetrically provided at the four corners of the first housing 1 for fixing the power semiconductor module to the drive circuit board by screws.

[0052] For further information, please refer to [link / reference]. Figure 3 The power semiconductor module also includes a detachable locking structure 20, which is disposed at the junction of the first groove structure 16 and the second groove structure 15, and can be used to prevent the second housing 2 and the third housing 3 from falling out of the second groove structure 15.

[0053] Furthermore, the power semiconductor module also includes a detachable locking mechanism (not shown in the figure) for fixing the first housing 1 relative to the second housing 2 and the third housing 3. Specifically, the locking mechanism can be a columnar structure that is inserted between the first through hole and the second through hole before the power semiconductor module is installed, so that the power terminal through hole has the first aperture. Even if the first through hole of the second housing 2 and the second through hole of the third housing 3 are aligned, it is convenient to perform pin insertion operation and keep the elastic element in a compressed state.

[0054] In this embodiment, the first housing 1, the second housing 2, and the third housing 3 are all injection molded components, and their materials are typically reinforced glass fiber PBT and PPS.

[0055] For further information, please refer to [link / reference]. Figure 7 The present invention provides a semiconductor component comprising the power semiconductor module described above, a heat sink 24, and a drive circuit board (not shown in the figure). The heat sink 24 is thermally connected to the power semiconductor module, and the drive circuit board is electrically connected to the power semiconductor module.

[0056] Specifically, the gap between the heat sink 24 and the power semiconductor module is filled with thermal grease 25, the power semiconductor module is electrically connected to the drive circuit board through the pins 6 of the power terminal 5, and the encapsulation cavity of the package shell is filled with silicone gel 26 to protect the chip 7, the metal-ceramic substrate 4, the power terminal 5, and the metal wire 9, etc.

[0057] Furthermore, this embodiment also provides an installation method for the power semiconductor module, which mainly includes the following steps:

[0058] 1) Remove the second locking structure, causing the second housing 2 and the third housing 3 to move relative to each other under the rebound force of the elastic element, thereby reducing the diameter of the power terminal through hole and fixing the pin 6 of the power terminal 5 relative to the package shell of the power semiconductor module.

[0059] 2) Install the driver circuit board;

[0060] 3) Connect the side of the power semiconductor module away from the power terminal to the heat sink 24, and fill the space between the power semiconductor module and the heat sink with thermal grease 25;

[0061] 4) Connect the pin 6 of the power terminal 5 to the drive circuit board.

[0062] In summary, the power semiconductor module provided by the present invention has a packaged shell consisting of three parts: a first shell, a second shell, and a third shell. The three shell parts are connected by a special connection structure, which enables the disassembly, replacement, and recycling of the second and third shells.

[0063] Meanwhile, the second and third housings are designed with larger through-hole diameters for the power terminals before installation, ensuring that the power terminals will not deform due to their fixed position during transportation. This also reduces the difficulty of the pin insertion and potting process, making manufacturing easier. After installation, the second and third housings are moved relative to each other by elastic elements, reducing the through-hole diameter for the power terminals and decreasing or even fixing the swing range of the power terminals. This ensures that the power terminals will not detach or deform due to stress during use, thus preventing the module from losing its function.

[0064] The present invention provides a power semiconductor module in which, after the metal-clad ceramic substrate has undergone pin insertion, die bonding, and wire bonding operations, it only needs to be placed in the first housing for dispensing, and then the second and third housings are snapped on after potting to complete the assembly, thus obtaining the finished product, which can save processing costs.

[0065] It should be understood that the technical solutions of the present invention are not limited to the specific embodiments described above. Any technical modifications made to the technical solutions of the present invention without departing from the spirit and scope of the claims are within the scope of protection of the present invention.

Claims

1. A power semiconductor module, characterized in that, include: The encapsulation housing includes a first housing (1), a second housing (2) and a third housing (3), the second housing (2) and the third housing (3) being detachably disposed in the first housing (1) in sequence along the axial direction, the second housing (2) having a plurality of first through holes, and the third housing (3) having a plurality of second through holes; The substrate (4) is connected to one end of the first housing (1) and forms an encapsulation chamber with the first housing (1) and the second housing (2); The chip (7) and power terminal (5) are disposed on the substrate (4) and located in the packaging cavity, and the diameter of the power terminal (5) is smaller than the diameter of either the first through hole or the second through hole. A position adjustment mechanism is provided for adjusting the relative position of the second housing (2) and the third housing (3) so that the diameter of a power terminal through hole formed by a first through hole and a corresponding second through hole varies between a first diameter and a second diameter, wherein the first diameter is larger than the second diameter and the second diameter is greater than or equal to the diameter of the power terminal (5). The position adjustment mechanism includes an elastic element disposed between at least one of the second housing (2) and the third housing (3) and the first housing. When the elastic element does not apply force to either the second housing (2) or the third housing (3), the power terminal through hole has a first diameter, and when the elastic element applies force to at least one of the second housing (2) and the third housing (3), the power terminal through hole has a second diameter.

2. The power semiconductor module according to claim 1, characterized in that, The elastic element is provided at least between the first side of the second housing (2) and the inner wall of the first housing (1) and at least between the first side of the third housing (3) and the inner wall of the first housing (1), wherein the first side of the second housing (2) and the first side of the third housing (3) are arranged opposite each other in the radial direction.

3. The power semiconductor module according to claim 2, characterized in that, The elastic element is provided between the first and second sides of the second housing (2) and the inner wall of the first housing (1), and between the first and second sides of the third housing (3) and the inner wall of the first housing (1). The first and second sides of the second housing (2) are adjacent to each other, and the first and second sides of the third housing (3) are adjacent to each other. The second side of the second housing (2) and the second side of the third housing (3) are arranged opposite to each other in the radial direction. The first and second sides of the second housing (2) and the inner wall of the first housing (1) and the first and second sides of the third housing (3) and the inner wall of the first housing (1) are engaged with each other by a snap-fit ​​structure or a tenon structure.

4. The power semiconductor module according to claim 3, characterized in that, The second housing (2) and the third housing (3) are provided with protrusions (17) on the first and second sides, respectively, and the protrusions (17) cooperate with the first groove structure (16) formed on the inner wall of the first housing (1).

5. The power semiconductor module according to claim 4, characterized in that, The inner wall of the first housing (1) is also provided with a second groove structure (15), the first groove structure (16) is connected to the second groove structure (15), and the second housing (2) and the third housing (3) are disposed in the second groove structure (15).

6. The power semiconductor module according to claim 5, characterized in that, The elastic element includes a spring (11) fixedly disposed within the second groove structure (15).

7. The power semiconductor module according to claim 6, characterized in that, Also includes: A first locking structure (22) is used to prevent the second housing and the third housing from falling out of the second groove structure (15).

8. The power semiconductor module according to claim 1, characterized in that, It also includes a second locking mechanism for fixing the first housing (1) relative to the second housing (2) and the third housing (3), and for giving the power terminal through hole the first aperture.

9. A semiconductor component, characterized in that, include: The power semiconductor module according to any one of claims 1-8; A heat sink is thermally connected to the power semiconductor module; A drive circuit board, which is electrically connected to the power semiconductor module.

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