Easy-to-test PCB and an electronic device

By setting up a test structure on the PCB board and using test lines with gradually increasing width to detect back drill hole offset, the problem of difficult monitoring of back drill hole offset is solved, thereby improving product quality and user experience.

CN114449728BActive Publication Date: 2025-11-28APCB ELECTRONICS SHENZHEN CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202011207432.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-11-03
Publication Date
2025-11-28
Estimated Expiration
2040-11-03

AI Technical Summary

Technical Problem

During PCB manufacturing, the inability to effectively monitor back-drill hole offset leads to signal integrity issues and makes it impossible to promptly eliminate defective products.

Method used

A test structure is set up on the PCB board, including a test line with gradually increasing width that surrounds the copper hole along the axial direction. The continuity of the line is detected by a test instrument to determine the offset of the back drill hole.

Benefits of technology

This enables convenient measurement of back-drilling offset, ensuring product quality and improving the reliability of electronic devices and user experience.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN114449728B_ABST
    Figure CN114449728B_ABST
Patent Text Reader

Abstract

The application discloses a PCB (Printed Circuit Board) easy to test, which comprises a body with copper-plated holes, the body comprising a plurality of layer boards arranged in a stack and a test structure inlayed on the layer boards; the test structure comprising a plurality of test lines directly connectable to a testing instrument, the plurality of test lines being sequentially arranged around the outer wall of the copper-plated holes in the axial direction of the copper-plated holes, the plurality of test lines being inlayed on the layer boards, and the width of the plurality of test lines being sequentially increased. Since the test structure comprises a plurality of test lines with different widths, when a back-drilling hole is made on the copper-plated hole, the test lines are likely to be cut off due to the fact that the test lines are arranged around the outer wall of the copper-plated holes. The wider the test line is, the less likely the test line is to be cut off. The test lines are tested by the testing instrument. If the test line is cut off, the test line is disconnected; if the test line is not cut off, the test line is not disconnected. The continuity of the test line is judged, and thus the offset of the back-drilling hole can be conveniently judged.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB processing, and in particular to a PCB easy to test and an electronic device. BACKGROUND

[0002] The PCB generally has a plurality of layers of material, and a through hole is formed in the PCB, and the through hole is subjected to copper plating to form a copper-plated hole, and the plurality of layers of material are electrically connected through the copper-plated hole.

[0003] Research shows that, in addition to design, material, transmission line, connector, chip packaging and other factors, the copper-plated hole has a great influence on signal integrity of a signal system of the PCB. The back drilling function is to drill off the copper-plated section that does not play any connection or transmission role, so as to avoid causing reflection, scattering, delay and other phenomena of high-speed signal transmission, and to bring "distortion" to the signal.

[0004] However, the back drilling hole offset cannot be detected in the production process, and cannot be well monitored, which causes great trouble to the production. SUMMARY

[0005] In view of the above problems, the present application provides a PCB easy to test and an electronic device, which is easy to test the offset of the back drilling hole.

[0006] According to a first aspect of the present application, a PCB easy to test is provided, comprising a body having a copper-plated hole, the body comprising a plurality of layers of material stacked and a test structure inlaid on the layers of material;

[0007] The test structure comprises a plurality of test lines directly connectable to a test instrument, the plurality of test lines are sequentially arranged around the outer wall of the copper-plated hole in the axial direction of the copper-plated hole, the plurality of test lines are inlaid on the layers of material, and the widths of the plurality of test lines sequentially increase.

[0008] As an embodiment of the present application, the test line comprises a test end point, and the test end point is arranged at both ends of the test line.

[0009] As an embodiment of the present application, the test end point extends out of the layers of material.

[0010] As an embodiment of the present application, the test structure comprises three test lines, which are sequentially a first test line, a second test line and a third test line, and the widths of the first test line, the second test line and the third test line sequentially increase.

[0011] As an embodiment of the present application, the width of the first test line is 3 mil, the width of the second test line is 4 mil, and the width of the third test line is 5 mil.

[0012] As an embodiment of the present application, at least one of the several layers of the material plate is provided with the test structure.

[0013] As an embodiment of the present application, the body comprises at least 8 layers of the material plate stacked in sequence, and the test structure is arranged on the third layer of the material plate or the fourth layer of the material plate from the back-drilling starting end of the body.

[0014] As an embodiment of the present application, the body comprises a plurality of copper plating holes, and each of the test lines is sequentially arranged on the outer wall of each of the copper plating holes.

[0015] According to a second aspect of the present application, an electronic device is provided, characterized by comprising the easily tested PCB plate as in any one of the above embodiments.

[0016] The embodiments of the present application have at least the following beneficial effects:

[0017] Since the test structure comprises several test lines with different widths, and the several test lines are sequentially arranged on the outer wall of the copper plating hole in the axial direction of the copper plating hole and embedded on the material plate, when the back-drilling hole is made on the basis of the copper plating hole, since the test line is arranged on the outer wall of the copper plating hole, the test line may be cut off, and the wider the test line is, the less likely it is to be cut off. By testing the test line by a testing instrument, if the test line is cut off, it indicates that the test line is cut off, and if the test line is not cut off, it indicates that the test line is not cut off. By judging the continuity of the test line, the offset of the back-drilling hole can be conveniently judged. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Among them:

[0020] Figure 1 It is a structural schematic diagram of the easily tested PCB plate in an embodiment;

[0021] Figure 2 It is Figure 1 It is a partial enlarged schematic diagram of A in

[0022] Figure 3Fig. 1 is a sectional view of a part of a PCB board easy to test in the prior art. Figure 1 Fig. 1 is a sectional view of a part of a PCB board easy to test in the prior art.

[0023] Fig. 1 is a sectional view of a part of a PCB board easy to test in the prior art. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0025] It should be noted that all directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directionality indications also change accordingly.

[0026] In addition, the description of "first", "second", etc. in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0027] Please refer to Figures 1-3 In an embodiment of the present application, a PCB board easy to test is provided. The PCB board in the embodiment includes a body 10 having a copper hole 11. The body 10 includes a plurality of layer boards (not shown in the figure) arranged in layers and a test structure 100 inlaid on the layer boards. The copper hole 11 is used to conduct between the layer boards.

[0028] In order to reduce the distortion of the copper hole 11 to the system signal of the PCB board, the copper segment of the copper hole 11 that does not play any connection or transmission role needs to be drilled away by back drilling, and then a back drilling hole is formed. The offset of the back drilling hole needs to be measured in the production process. The test structure 100 in the embodiment can conveniently measure the offset of the back drilling hole.

[0029] Please refer toFigures 1-3 The test structure 100 in the embodiment includes a plurality of test lines 110 which can be directly connected to the test instrument, the plurality of test lines 110 are sequentially arranged around the outer wall of the copper plating hole 11 in the axial direction of the copper plating hole 11, the plurality of test lines 110 are inlaid on the material plate, and the width of the plurality of test lines 110 is sequentially increased. Further, when the back drilling hole is drilled on the basis of the copper plating hole 11, since the test lines 110 are arranged around the outer wall of the copper plating hole 11, the test lines 110 can be cut off, the test lines 110 with larger width are less likely to be cut off, the test instrument is used to test the test lines 110, and the disconnection indicates that the test lines 110 are cut off, and the non-disconnection indicates that the test lines 110 are not cut off, the continuity of the test lines 110 is judged, and then the offset of the back drilling hole can be conveniently judged.

[0030] Specifically, the test instrument can be a multimeter or an ammeter.

[0031] Please refer to Figure 2 In an embodiment, the test line 110 includes a wire 111 and a test end point 112, and specifically, the wire 111 is a non-closed wire 111, and the test end point 112 is arranged at both ends of the wire 111.

[0032] Preferably, both ends of the wire 111 extend out of the material plate, and then the test instrument can be conveniently tested.

[0033] Of course, the test end point 112 can also not extend out of the material plate and be plugged through a jack.

[0034] In an embodiment, the cross section of the wire 111 perpendicular to the axial direction is circular, and then the width of the wire 111 is the diameter of the wire 111.

[0035] It should be noted that when the cross section of the wire 111 perpendicular to the axial direction is other shapes, the width of the wire 111 refers to the distance between the farthest end of the wire 111 and the outer wall of the copper plating hole 11 in the radial direction of the copper plating hole 11, and it should be noted that the width of the wire 111 at different positions is consistent.

[0036] Please refer to Figure 3 In an embodiment, the test structure 100 includes three test lines 110, the three test lines 110 are sequentially a first test line 113, a second test line 114 and a third test line 115, and the width of the first test line 113, the second test line 114 and the third test line 115 is sequentially increased.

[0037] Preferably, the width a of the first test line 113 is 3 mil, the width b of the second test line 114 is 4 mil, and the width c of the third test line 115 is 5 mil.

[0038] It should be noted that the widths of the first test line 113, the second test line 114 and the third test line 115 can also be other values, for example, the width of the first test line 113 is 2.5 mil, the width b of the second test line 114 is 3.5 mil, and the width c of the third test line 115 is 4.5 mil.

[0039] It should also be noted that the test structure 100 can also include four or five or other number of test lines 110.

[0040] In an embodiment, at least one of the several layers of the board is provided with the test structure 100.

[0041] Preferably, the body 10 includes at least 8 layers of the board, and the test structure 100 is arranged on the third layer of the board from the back drilling starting end or the fourth layer of the board. Generally, the depth of the back drilling hole is to the fourth layer of the board or the fifth layer of the board, and thus the test structure 100 is arranged on the third layer of the board from the back drilling starting end or the fourth layer of the board, so that the determination of the offset of the back drilling hole can be completed through the test structure 100 in most cases.

[0042] Of course, the test structure 100 can also be arranged on each of the several layers of the board.

[0043] In an embodiment, the body 10 includes a plurality of copper filled holes 11, and each test line 110 is arranged on the outer wall of each copper filled hole 11. In this embodiment, the offset of the plurality of back drilling holes can be detected through one test line 110.

[0044] In an embodiment of the present application, an electronic device is also provided. The electronic device in this embodiment includes the PCB board easy to test in any of the above embodiments. Due to the PCB board, the offset of the back drilling hole can be conveniently measured, and thus the PCB board with unqualified back drilling hole offset can be timely eliminated, and thus the quality of the electronic device using the PCB board in the above embodiments can be ensured, and the user experience is better.

[0045] The above only discloses the preferred embodiments of the present application, and of course cannot limit the scope of the rights of the present application, and thus the equivalent changes made according to the claims of the present application still fall within the scope of the present application.

Claims

1. A PCB board easy to test, characterized in that, The body comprising a copper-plated hole, the body comprising a plurality of layers of material sheets and test structures inlaid on the material sheets; The test structure comprising a plurality of test lines directly connectable to a test instrument, the test lines being inlaid on the material sheets in a direction along an axis of the copper-plated hole, and the test lines having widths gradually increasing. The test line is a wire structure for being cut off by back drilling, and the back drilling offset is determined by detecting the continuity of the test line.

2. The PCB board easy to test according to claim 1, characterized in that, The test line comprises a wire and a test end point, and the test end point is arranged at both ends of the wire.

3. The PCB board easy to test according to claim 2, characterized in that, The test end point extends out of the material sheet.

4. The PCB board of claim 1, wherein, The test structure comprises three test lines, and the three test lines are a first test line, a second test line and a third test line in sequence, and the widths of the first test line, the second test line and the third test line gradually increase.

5. The PCB board easy to test according to claim 4, characterized in that, The width of the first test line is 3 mil, the width of the second test line is 4 mil, and the width of the third test line is 5 mil.

6. The easy-to-test PCB board according to any one of claims 1-5, characterized in that, At least one of the plurality of layers of material sheets is provided with the test structure.

7. The PCB board easy to test according to claim 6, characterized in that, The body comprises at least 8 layers of material sheets in sequence, and the test structure is arranged on the third layer of material sheets or the fourth layer of material sheets from a back drilling starting end of the body.

8. The easy-to-test PCB board according to any one of claims 1-5, characterized in that, The body comprises a plurality of copper-plated holes, and each of the test lines is arranged on the outer wall of each of the copper-plated holes.

9. An electronic device, comprising: The PCB board is easy to test, and comprises any one of the PCB boards according to claims 1-8. The body comprising a copper-plated hole, the body comprising a plurality of layers of material sheets and test structures inlaid on the material sheets; The test structure comprising a plurality of test lines directly connectable to a test instrument, the test lines being inlaid on the material sheets in a direction along an axis of the copper-plated hole, and the test lines having widths gradually increasing. The test line is a wire structure for being cut off by back drilling, and the back drilling offset is determined by detecting the continuity of the test line. The test line comprises a wire and a test end point, and the test end point is arranged at both ends of the wire. The test end point extends out of the material sheet. The test structure comprises three test lines, and the three test lines are a first test line, a second test line and a third test line in sequence, and the widths of the first test line, the second test line and the third test line gradually increase. The width of the first test line is 3 mil, the width of the second test line is 4 mil, and the width of the third test line is 5 mil. At least one of the plurality of layers of material sheets is provided with the test structure. The body comprises at least 8 layers of material sheets in sequence, and the test structure is arranged on the third layer of material sheets or the fourth layer of material sheets from a back drilling starting end of the body. The body comprises a plurality of copper-plated holes, and each of the test lines is arranged on the outer wall of each of the copper-plated holes. The PCB board is easy to test, and comprises any one of the PCB boards according to claims 1-8.

Citation Information

Patent Citations

  • Multilayer circuit board, manufacturing method thereof and method for detecting alignment of circuit board

    CN101662895A