Printed circuit board and method for manufacturing the same

Abstract

The embodiment of the present application relates to a printed circuit board and a method for making the same, and belongs to the field of printed circuit boards. The embodiment of the present application aims to solve the problem of large graphic offset between the daughter board and the mother board in the related art. The method for making a printed circuit board of the embodiment of the present application comprises: fusing a mother board with a receiving through hole, a first semi-cured sheet and a first core board; placing the daughter board into the receiving through hole, and the daughter board and the mother board form a second core board; pre-pressing the second core board, the first semi-cured sheet and the first core board to obtain a pre-pressed board; stacking the pre-pressed board with the third core board, and placing the second semi-cured sheet between the pre-pressed board and the third core board; pressing the pre-pressed board, the second semi-cured sheet and the third core board to obtain a printed circuit board. The method for making a printed circuit board provided by the embodiment of the present application can reduce the graphic offset between the daughter board and the mother board, and improve the yield of the printed circuit board.

Description

Technical Field

[0001] The embodiments of the present application belong to the technical field of printed circuit boards, and in particular, relate to a printed circuit board and a method for manufacturing the same. Background Art

[0002] Printed Circuit Board (PCB) is an important component of the electronics industry and is the carrier for electrical interconnection of electronic components. With the development of the electronics industry, in order to meet the requirements of applicable frequency ranges in technical fields such as radio frequency, 5G, microwave, and radar, printed circuit boards need to be made of high-frequency materials.

[0003] In the related art, a part of the area of ​​at least one core board in a printed circuit board is usually set to high-frequency material to reduce the amount of high-frequency material used and reduce the cost of the printed circuit board. The core board includes a motherboard made of ordinary material and a daughter board made of high-frequency material. The motherboard is provided with a receiving through hole, and the daughter board is placed in the receiving through hole, and there is a gap between the daughter board and the hole wall of the receiving through hole. When making a printed circuit board, in the process of stacking the core boards, the daughter board is placed in the receiving through hole of the mother board, and then the stacked core boards are fused, pressed, etc. to obtain a printed circuit board.

[0004] However, when the above method is used to manufacture a printed circuit board, the pattern offset between the daughter board and the mother board is large, resulting in a large layer offset of the printed circuit board, which cannot meet the requirements of the printed circuit board and reduces the yield of the printed circuit board. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a printed circuit board and a method for manufacturing the same to solve the technical problem of large pattern offset between a daughter board and a mother board.

[0006] In a first aspect, an embodiment of the present application provides a method for manufacturing a printed circuit board, comprising:

[0007] Stacking a motherboard with a receiving through hole, a first prepreg, and a first core board in sequence, and fusing an edge of the motherboard and an edge of the first core board in a first fusion region;

[0008] Put the daughter board into the receiving through hole, there is a gap between the daughter board and the hole wall of the receiving through hole, and the daughter board and the mother board form a second core board;

[0009] Pre-pressing the second core board, the first prepreg, and the first core board to obtain a pre-pressed board;

[0010] The pre-pressed plate and the third core plate are stacked, and a second prepreg is placed between the pre-pressed plate and the third core plate;

[0011] The pre-pressed plate, the second prepreg sheet and the third core plate are pressed together to obtain a printed circuit board.

[0012] The method for manufacturing a printed circuit board of an embodiment of the present application first fuses the edge of the motherboard with the edge of the first core board in the first fusion area through the first semi-cured sheet to position the motherboard. Then the daughter board is placed in the accommodating through hole on the motherboard, and the daughter board and the motherboard form a second core board, and then the second core board and the first core board are pre-pressed to obtain a pre-pressed plate. The pre-pressing method can make the daughter board generate a bonding force through the first semi-cured sheet and the motherboard, and will not change the performance of the first semi-cured sheet, the first semi-cured sheet will not flow, and the daughter board will not move due to the first semi-cured sheet, so that the daughter board can be positioned, thereby reducing the graphic offset between the daughter board and the motherboard, reducing the layer deviation of the printed circuit board, so that the printed circuit board meets the requirements of the layer deviation, and improves the yield of the printed circuit board.

[0013] In some embodiments that may include the above-mentioned embodiments, when pre-pressing the second core panel, the first semi-cured sheet and the first core panel, the pre-pressing parameters include pre-pressing pressure, pre-pressing temperature and pre-pressing time, the pre-pressing pressure is 100PSI, the pre-pressing temperature is 70-90°C, and the pre-pressing time is 90-100S.

[0014] In some embodiments that may include the above embodiments, after the sub-board is placed in the accommodating through hole, a pin gauge is inserted into the gap between the sub-board and the hole wall of the accommodating through hole to adjust the position of the sub-board.

[0015] In some embodiments that may include the above embodiments, a diameter of the pin gauge is 0.3-0.5 mil smaller than a preset gap width between the daughter board and the hole wall of the receiving through hole.

[0016] In some embodiments that may include the above embodiments, after placing a second prepreg between the pre-pressed plate and the third core plate, an edge of the pre-pressed plate and an edge of the third core plate are fused in a second fusion region.

[0017] In some embodiments, which may include the above embodiments, a projection of the second fusion region on the first core plate does not intersect with a projection of the first fusion region on the first core plate.

[0018] In some embodiments that may include the above embodiments, before stacking the pre-compression plate and the third core plate, positioning through holes are provided on the pre-compression plate and the third core plate, and the pre-compression plate and the third core plate are both mounted on positioning pins through the positioning through holes.

[0019] In some embodiments that may include the above embodiments, there are a plurality of the third core plates and a plurality of the second prepregs, and a second prepreg is disposed between every two adjacent third core plates.

[0020] In a second aspect, an embodiment of the present application further provides a printed circuit board, which is manufactured by the printed circuit board manufacturing method described in any one of the above items, wherein the printed circuit board includes a plurality of core boards, at least one of the plurality of core boards includes a motherboard and a daughterboard, the motherboard is provided with an accommodating through hole, the material of the daughterboard is a high-frequency material, the daughterboard is placed in the accommodating through hole, and there is a gap between the daughterboard and the hole wall of the accommodating through hole.

[0021] Since the printed circuit board of the embodiment of the present application is manufactured by using any of the printed circuit board manufacturing methods described above, the printed circuit board of the embodiment of the present application has the advantage of a small graphic offset between the daughter board and the mother board, and the embodiment of the present application is not described in detail here.

[0022] In some embodiments that may include the above embodiments, the material of the sub-plate includes at least one of hydrocarbon resin, polytetrafluoroethylene, liquid crystal polymer, polypropylene and polyphenylene ether. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. It is obvious that the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A schematic diagram of a process for manufacturing a printed circuit board according to an embodiment of the present application;

[0025] Figure 2 for Figure 1 A schematic diagram of the structure when the motherboard, the first prepreg sheet and the first core board are stacked in step 1;

[0026] Figure 3 for Figure 1 A schematic diagram of the structure of placing the daughter board into the receiving through hole in step 2;

[0027] Figure 4 A schematic diagram of the structure of inserting the needle gauge into the gap between the daughter board and the hole wall accommodating the through hole in step 2;

[0028] Figure 5 for Figure 1 A schematic diagram of the structure of pre-pressing the second core board, the first prepreg and the first core board in step 3;

[0029] Figure 6 for Figure 1 A schematic diagram of a structure in which the pre-pressed plate, the second prepreg sheet and the third core plate are stacked in step 4;

[0030] Figure 7 for Figure 1 Another structural schematic diagram of stacking the pre-pressed plate, the second prepreg sheet and the third core plate in step 4;

[0031] Figure 8 This is a structural schematic diagram of fusing the pre-compression plate and the third core plate in the second fusion region in step 4 of the implementation method of the first embodiment of the present application;

[0032] Fig. 9 is a schematic diagram of the positional relationship between the second fusion region and the first fusion region;

[0033] Fig.10 A top view of the bogie cone sleeve disassembly device provided in step 4;

[0034] Fig.11 This is a structural schematic diagram of a step 4 in which the pre-pressing plate and the third core plate are both sleeved on the positioning pins through the positioning through holes in another implementation method of the embodiment of the present application;

[0035] Fig.12 This is a slice diagram of the printed circuit board with the largest layer deviation in group A printed circuit boards;

[0036] Fig.13 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group B;

[0037] Fig.14 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group C;

[0038] Fig.15 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group D;

[0039] Fig.16 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group E;

[0040] Fig.17 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group F;

[0041] Fig.18 It is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group G;

[0042] Fig.19 It is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group H;

[0043] Fig. 20A slice diagram of a printed circuit board having the largest layer deviation in group I of printed circuit boards;

[0044] Fig.21 A slice diagram of a printed circuit board having the largest layer deviation in group J printed circuit boards;

[0045] Fig. 22 A slice diagram of a printed circuit board having the largest layer deviation in group K of printed circuit boards;

[0046] Fig.23 This is a slice diagram of the printed circuit board with the largest layer deviation in the L group of printed circuit boards.

[0047] Description of reference numerals:

[0048] 100-a first core board;

[0049] 200- second core board;

[0050] 210-motherboard; 211-accommodating through hole; 220-daughterboard;

[0051] 300-first prepreg;

[0052] 400-needle gauge;

[0053] 500-pre-pressed plate;

[0054] 600-third core board;

[0055] 700-second prepreg;

[0056] 800- positioning through hole;

[0057] 900-Location pin. DETAILED DESCRIPTION

[0058] In the related art, at least one core board in a printed circuit board includes a motherboard and a daughterboard. The motherboard is provided with a receiving through hole. The daughterboard is a high-frequency material, and the daughterboard is located in the receiving through hole of the motherboard, and there is a gap between the daughterboard and the hole wall of the receiving through hole. When making a printed circuit board, the core boards are first stacked, that is, the core boards are stacked, and a semi-cured (Prepreg, referred to as PP) sheet is stacked between each adjacent two core boards. In the process of stacking the core boards, the daughterboard is placed in the receiving through hole of the motherboard. Then, the stacked core boards are fused, pressed, etc. to obtain a printed circuit board.

[0059] However, during the lamination process, the prepregs between adjacent core boards will melt, and the melted prepregs will flow, causing the sub-board to move relative to the motherboard as the prepregs flow, thereby causing a positional offset between the sub-board and the motherboard, increasing the graphic offset between the sub-board and the motherboard, and increasing the layer offset of the printed circuit board. For example, in the related art, the layer offset of the printed circuit board is generally required to be less than or equal to 3 mil, but the printed circuit board manufactured by the above method has a layer offset of more than 5 mil, and a defective rate of 15%, which reduces the yield of the printed circuit board.

[0060] In response to the above technical problems, the printed circuit board manufacturing method of the embodiment of the present application pre-presses the daughter board and the mother board, positions the daughter board and the mother board, and then presses the pre-pressed mother board with other core boards to reduce the displacement of the daughter board caused by the flow of the molten semi-cured sheet, thereby reducing the graphic offset between the daughter board and the mother board, and then reducing the layer deviation of the printed circuit board, so that the printed circuit board meets the layer deviation requirements and improves the yield of the printed circuit board.

[0061] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0062] refer to Figure 1 An embodiment of the present application provides a method for manufacturing a printed circuit board, comprising:

[0063] S1: stacking a motherboard with a receiving through hole, a first prepreg, and a first core board in sequence, and fusing an edge of the motherboard and an edge of the first core board in a first fusion region.

[0064] For example, reference Figure 2 , a motherboard 210 is provided, and a receiving through hole 211 is provided on the motherboard 210. A first prepreg 300 and a first core board 100 are provided. The motherboard 210, the first prepreg 300 and the first core board 100 are stacked in sequence. When stacking, the first core board 100 can be placed at the bottom, and the first prepreg 300 and the motherboard 210 can be stacked on the first core board 100 in sequence.

[0065] Then, the edge of the motherboard 210 and the edge of the first core board 100 can be fused in the first fusion area A, so that the motherboard 210 and the first core board 100 can be bonded through the portion of the first semi-cured sheet 300 located in the first fusion area A, so that the motherboard 210 can be positioned to prevent misalignment between the motherboard 210 and the first core board 100 during the subsequent production process, thereby ensuring the positional accuracy between the motherboard 210 and the first core board 100.

[0066] Exemplarily, the first fusion region A can be set in the non-circuit pattern area of ​​the motherboard 210 and the first core board 100. When the first fusion region A fuses the motherboard 210 and the first core board 100, it will not affect the circuit patterns on the motherboard 210 and the first core board 100, thereby ensuring the product quality of the printed circuit board. The number of first fusion regions A can be one or more. Exemplarily, when the number of first fusion regions A is multiple, the multiple first fusion regions A can be randomly arranged around the edge of the first core board 100, can be evenly arranged, or can be arranged in other ways.

[0067] The number of the first prepreg sheets 300 may be one or more, and the embodiment of the present application does not limit the number of the first prepreg sheets 300.

[0068] S2: Place the daughter board into the receiving through hole, with a gap between the daughter board and the hole wall of the receiving through hole, and the daughter board and the mother board form a second core board.

[0069] For example, reference Figure 3 , the daughter board 220 is placed in the receiving through hole 211 of the mother board 210, and a gap is provided between the daughter board 220 and the hole wall of the receiving through hole 211, thereby obtaining the second core board 200. The width of the gap can be specifically set according to the printed circuit board.

[0070] For example, reference Figure 4 After placing the daughter board 220 into the receiving through hole 211, the pin gauge 400 can be inserted into the gap between the daughter board 220 and the hole wall of the receiving through hole 211 to adjust the position of the daughter board 220 so that the daughter board 220 can be located in the center position of the receiving through hole 211, thereby reducing the graphic offset between the daughter board 220 and the mother board 210, thereby reducing the layer offset of the printed circuit board.

[0071] Exemplarily, the diameter of the pin gauge 400 may be 0.3-0.5 mil smaller than the preset gap width between the daughter board and the hole wall of the accommodating through hole. For example, the diameter of the pin gauge 400 may be 0.3 mil, 0.4 mil or 0.5 mil smaller than the preset gap width.

[0072] It should be noted that the preset gap width refers to the preset gap width between the sub-board 220 and the hole wall of the accommodating through hole 211, that is, the design value of the gap width between the sub-board 220 and the hole wall of the accommodating through hole 211. The preset gap width can be specifically set according to different printed circuit boards.

[0073] S3: pre-pressing the second core board, the first prepreg sheet and the first core board to obtain a pre-pressed board.

[0074] For example, reference Figure 5 , the second core plate 200, the first prepreg sheet 300 and the first core plate 100 can be placed in a hot press for pre-pressing to obtain a pre-pressed plate 500. For example, the hot press can be Figure 5 The arrow direction shown in FIG. 2 applies pressure to the second core board 200 , the first prepreg 300 , and the first core board 100 .

[0075] The method for manufacturing a printed circuit board of the embodiment of the present application first fuses the edge of the motherboard 210 with the edge of the first core board 100 in the first fusion area A through the first prepreg 300 to position the motherboard 210. Then, the daughter board 220 is placed in the receiving through hole 211 on the motherboard 210 to obtain the second core board 200, and then the second core board 200 and the first core board 100 are pre-pressed to obtain the pre-pressed board 500. By pre-pressing, the daughter board 20 can generate a bonding force through the first prepreg 300 and the motherboard 210, and the performance of the first prepreg 300 will not be changed, the first prepreg 300 will not flow, and the daughter board 220 will not move due to the first prepreg 300, so that the daughter board 220 can be positioned, thereby reducing the graphic offset between the daughter board 220 and the motherboard 210, reducing the layer deviation of the printed circuit board, so that the printed circuit board meets the layer deviation requirements, and improves the yield of the printed circuit board.

[0076] Exemplarily, when the second core plate 200, the first prepreg sheet 300 and the first core plate 100 are pre-pressed, the pre-pressing parameters include pre-pressing pressure, pre-pressing temperature and pre-pressing time, and the pre-pressing pressure may be 100PSI. The pre-pressing temperature may be 70 to 90°C, for example, 70°C, 75°C, 80°C, 85°C or 90°C. The pre-pressing time may be 90 to 100S, for example, 90S, 91S, 92S, 93S, 94S, 95S, 96S, 97S, 98S, 99S or 100S, etc.

[0077] S4: stacking the pre-pressed plate and the third core plate, and placing a second prepreg between the pre-pressed plate and the third core plate.

[0078] The number of the third core plates can be one or more. When there are more than one third core plates, there are also more than one second prepreg sheets, and a second prepreg sheet is disposed between each two adjacent third core plates. Figure 6 , the pre-pressed plate 500 and the third core plate 600 are stacked, and the second prepreg sheet 700 is placed between the pre-pressed plate 500 and the adjacent third core plate 600, and between two adjacent third core plates 600. The pre-pressed plate 500 may be located at the top of the third core plate 600. Figure 7 , the pre-compression plate 500 may also be located between two third core plates 600 .

[0079] In some implementations of the embodiments of the present application, reference is made to Figure 8 After placing the second semi-cured sheet between the pre-pressed plate and the third core plate, the edge of the pre-pressed plate 500 and the edge of the third core plate 600 can also be fused in the second fusion area B, so that the pre-pressed plate 500 and the third core plate 600 can be bonded through the portion of the second semi-cured sheet 700 located in the second fusion area B, thereby positioning the pre-pressed plate 500 and the adjacent third core plate 600 and the adjacent third core plate 600, preventing the pre-pressed plate 500 and the third core plate 600 from being misaligned during the subsequent pressing process, reducing the graphic offset between the pre-pressed plate 500 and the third core plate, and ensuring the quality of the printed circuit board.

[0080] Exemplarily, the second fusion region B can be provided in the non-circuit pattern region of the first core plate 100, the second core plate 200 and the third core plate 600. When the second fusion region B fuses the pre-pressing plate 500 and the third core plate 600, it will not affect the circuit patterns on the first core plate 100, the second core plate 200 and the third core plate 600, further ensuring the product quality of the printed circuit board.

[0081] For example, reference Fig. 9, the projection of the second fusion region B on the first core plate 100 may not intersect with the projection of the first fusion region A on the first core plate 100. When the mother plate 210 and the first core plate 100 are fused in the first fusion region A, the mother plate 210 and the first core plate 100 are bonded through the portion of the first prepreg 300 located in the first fusion region A. When the pre-pressing plate 500 and the third core plate 600 are subsequently fused, the viscosity of the portion of the first prepreg 300 in the first fusion region A is weakened, which will reduce the bonding force between the mother plate 210 and the first core plate 100. Therefore, when the pre-compression plate 500 and the third core plate 600 are fused in the second fusion area B, the projection of the second fusion area B on the first core plate 100 does not intersect with the projection of the first fusion area A on the first core plate 100, that is, the second fusion area B and the first fusion area A are staggered from each other, so that the mother plate 210 and the first core plate 100 can also be bonded through the part of the first semi-cured sheet 300 located in the second fusion area B, thereby ensuring the bonding force between the mother plate 210 and the first core plate 100 and preventing the mother plate 210 and the first core plate 100 from being misaligned.

[0082] It is understandable that the number of the second fusion region B may be one or more. For example, when the number of the first fusion region A is more than one, the multiple first fusion regions A may be randomly arranged around the edge of the first core plate 100, or may be evenly arranged, or may be arranged in other ways. The second fusion region B and the first fusion region A may also be spaced apart from each other.

[0083] In some other implementations of the embodiments of the present application, reference is made to Fig.10 Before stacking the pre-pressing plate 500 and the third core plate 600, positioning holes 800 can be provided on both the pre-pressing plate 500 and the third core plate 600, and the pre-pressing plate 500 and the third core plate 600 are sleeved on the positioning pins 900 through the positioning holes 800. The positioning pins 900 can position the pre-pressing plate 500 and the third core plate 600, ensure the relative position between the pre-pressing plate 500 and the third core plate 600, and prevent the pre-pressing plate 500 and the third core plate 600 and the two third core plates 600 from being misaligned during subsequent pressing.

[0084] S5: Pressing the pre-pressed plate, the second prepreg and the third core plate to obtain a printed circuit board.

[0085] For example, reference Fig.11 The pre-pressed plate 500, the second prepreg sheet 700 and the third core plate 600 can be pressed together by a hot press. The hot press can be Fig.11 The pre-pressing plate 500 , the second prepreg sheet 700 , and the third core plate 600 are pressed in the direction of the arrows shown in FIG.

[0086] Exemplarily, the pre-pressing plate 500 and the third core plate 600 can be pressed in a segmented pressing manner. It should be noted that the segmented pressing manner means that the pressing parameter curve when the pre-pressing plate 500, the second semi-cured sheet 700 and the third core plate 600 are pressed is a step curve. For example, the pressing parameters may include pressing pressure, pressing temperature and pressing time, and the pressing pressure and pressing temperature may change in a step curve with the pressing time. It is understandable that other pressing methods may also be used to press the pre-pressing plate 500 and the third core plate 600, and the pressing method may be specifically set according to different printed circuit boards.

[0087] Exemplarily, the embodiment of the present application adopts the above method to manufacture a printed circuit board. The printed circuit board is a ten-layer board, including a second core board, a first core board and three third core boards stacked in sequence. The second core board is located at the bottom layer, that is, the second core board is the ninth and tenth layers of the printed circuit board. The material of the motherboard is S1000-2 material, and the material of the daughterboard is RO4350B high-frequency material. A total of 12 groups of printed circuit boards are manufactured in the embodiment of the present application, namely A, B, C, D, E, F, G, H, I, J, K and L, and each group includes 30 printed circuit boards. The 12 groups of printed circuit boards are measured by the slicing measurement method to measure the layer deviation of the daughterboard and the layer deviation CPK. Among them, the layer deviation of the daughterboard refers to the layer deviation of the printed circuit board at the location of the daughterboard, which can be used to reflect the graphic offset between the daughterboard and the motherboard. Layer deviation CPK refers to the layer deviation process capability index, which is used to characterize the ability of the process to ensure quality. The larger the value, the better the quality of the printed circuit board.

[0088] The preloading parameters and measurement results of each group of printed circuit boards are shown in Tables 1 and 2.

[0089] Table 1

[0090]

[0091]

[0092] Table 2

[0093]

[0094]

[0095] It can be seen from Table 1 and Table 2 that the pre-pressing pressure of groups A, B, C and D is 100PSI, the pre-pressing temperature is within 70-90℃, and the pre-pressing time is between 90-100S. After measurement, the sub-board layer deviation of the printed circuit boards of groups A, B, C and D is within 3mil, which meets the requirements of layer deviation, and the yield of the printed circuit boards is high. At the same time, the layer deviation CPK of the printed circuit boards of groups A, B, C and D is greater than 1, indicating that when making the printed circuit boards of groups A, B, C and D, the manufacturing process capability is stable and can effectively guarantee the yield of the printed circuit boards.

[0096] The pre-pressing pressure of groups E, F, G, H, I, J, K and L is 100PSI, the pre-pressing temperature exceeds 70-90℃, and the pre-pressing time exceeds 90-100S. After measurement, the sub-board layer deviation of the printed circuit boards of groups E, F, G, H, I, J, K and L exceeds 3mil, which does not fully meet the requirements of the sub-board layer deviation, and the yield of the printed circuit boards is low. At the same time, the layer deviation CPK of the printed circuit boards of groups E, F, G, H, I, J, K and L is less than 1, indicating that when making the printed circuit boards of groups E, F, G, H, I, J, K and L, the manufacturing process capacity is unstable and the yield of the printed circuit boards cannot be effectively guaranteed.

[0097] The printed circuit board slice with the largest layer deviation in each group of printed circuit boards is shown in the figure below: Figures 12 to 23 As shown. Among them, Fig.12 This is a slice diagram of the printed circuit board with the largest layer deviation in group A printed circuit boards; Fig.13 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group B;

[0098] Fig.14 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group C; Fig.15 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group D; Fig.16 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group E; Fig.17 This is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group F; Fig.18 It is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group G; Fig.19 It is a slice diagram of the printed circuit board with the largest layer deviation in the printed circuit boards of group H; Fig. 20 A slice diagram of a printed circuit board having the largest layer deviation in group I of printed circuit boards; Fig.21 A slice diagram of a printed circuit board having the largest layer deviation in group J printed circuit boards; Fig. 22 A slice diagram of a printed circuit board having the largest layer deviation in group K of printed circuit boards; Fig.23 This is a slice diagram of the printed circuit board with the largest layer deviation in the L group of printed circuit boards.

[0099] Another embodiment of the present application provides a printed circuit board, which is manufactured using the printed circuit board manufacturing method of the above embodiment. The printed circuit board includes multiple core boards, at least one of the multiple core boards includes a motherboard and a daughterboard, the motherboard is provided with an accommodating through hole, the material of the daughterboard is a high-frequency material, the daughterboard is placed in the accommodating through hole, and there is a gap between the daughterboard and the hole wall of the accommodating through hole.

[0100] Since the printed circuit board of the embodiment of the present application is manufactured by the printed circuit board manufacturing method of the above embodiment, the printed circuit board of the embodiment of the present application has the advantage of small pattern offset between the daughter board and the mother board, which will not be described in detail here.

[0101] Exemplarily, the material of the motherboard may be FR-4 material, such as S1000-2 material. FR-4 is a code for the grade of flame-resistant material, which means that the material must be able to extinguish itself after burning. FR-4 material refers to a material that can meet the FR-4 specification. The material of the daughterboard may be a high-frequency material, which may include at least one of hydrocarbon resin, polytetrafluoroethylene, liquid crystal polymer, polypropylene and polyphenylene ether, for example, RO4350B high-frequency material.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for manufacturing a printed circuit board, characterized in that: include: Stacking a motherboard with a receiving through hole, a first prepreg, and a first core board in sequence, and fusing an edge of the motherboard and an edge of the first core board in a first fusion region; Put the daughter board into the receiving through hole, there is a gap between the daughter board and the hole wall of the receiving through hole, insert a pin gauge into the gap between the daughter board and the hole wall of the receiving through hole, and adjust the position of the daughter board so that the daughter board is at the center of the receiving through hole; wherein the daughter board and the mother board form a second core board; Pre-pressing the second core board, the first prepreg, and the first core board to obtain a pre-pressed board; The pre-pressed plate and the third core plate are stacked, and a second prepreg is placed between the pre-pressed plate and the third core plate, and the edge of the pre-pressed plate and the edge of the third core plate are fused in a second fusion region, wherein the projection of the second fusion region on the first core plate does not intersect with the projection of the first fusion region on the first core plate; The pre-pressed plate, the second prepreg sheet and the third core plate are pressed together to obtain a printed circuit board.

2. The method for manufacturing a printed circuit board according to claim 1, characterized in that: When pre-pressing the second core board, the first prepreg sheet and the first core board, the pre-pressing parameters include pre-pressing pressure, pre-pressing temperature and pre-pressing time. The pre-pressing pressure is 100PSI, the pre-pressing temperature is 70-90°C, and the pre-pressing time is 90-100S.

3. The method for manufacturing a printed circuit board according to claim 1, characterized in that: The diameter of the pin gauge is 0.3-0.5 mil smaller than the preset gap width between the sub-plate and the hole wall of the receiving through hole.

4. The method for manufacturing a printed circuit board according to claim 1, characterized in that: Before stacking the pre-pressing plate and the third core plate, positioning through holes are provided on the pre-pressing plate and the third core plate, and the pre-pressing plate and the third core plate are sleeved on positioning pins through the positioning through holes.

5. The method for manufacturing a printed circuit board according to claim 1, characterized in that: There are a plurality of the third core plates and a plurality of the second prepregs, and a second prepreg is disposed between every two adjacent third core plates.

6. A printed circuit board, characterized in that: The printed circuit board is manufactured by the method for manufacturing a printed circuit board according to any one of claims 1 to 5, wherein the printed circuit board comprises a plurality of core boards, at least one of the plurality of core boards comprises a motherboard and a daughterboard, the motherboard is provided with an accommodating through hole, the material of the daughterboard is a high-frequency material, the daughterboard is placed in the accommodating through hole, and there is a gap between the daughterboard and the hole wall of the accommodating through hole.

7. The printed circuit board according to claim 6, characterized in that: The material of the sub-plate includes at least one of hydrocarbon resin, polytetrafluoroethylene, liquid crystal polymer, polypropylene and polyphenylene ether.

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