Interdigital capacitor assembly and sensing device

Abstract

The present invention provides a forked finger capacitor component and a sensing device, the forked finger capacitor component comprising: a substrate, comprising an input end and an output end, the input end being made of insulating material; a forked finger capacitor, mounted on the input end, comprising a first electrode and a second electrode, the first electrode and the second electrode both being coiled on a first side surface of the substrate, the second electrode being arranged in a gap between the first electrode and staggered with the first electrode in a comb-teeth shape; a transmission circuit, the first end of which is connected to the forked finger capacitor electrode, and the second end extending to the output end. The forked finger capacitor component and the sensing device provided by the present invention, by arranging the forked finger capacitor at the input end of the substrate, using the first and second electrodes staggered in a comb-teeth shape to form the forked finger capacitor, and using the output end to derive an electrical signal, can improve the sensing sensitivity, improve the anti-interference ability, and improve the sensing ability of the approaching object and the sensing ability of pressure with a simple and light structure.

Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to an interdigital capacitor component and a sensing device. Background Art

[0002] As the largest sensory organ, the skin has a large number of complex sensory receptors and can receive multimodal sensations. With the development of science and technology, devices with bionic skin devices are gradually emerging, such as wearable devices, bionic robots, smart prostheses, or VR / AR devices. These devices have the ability to simulate or surpass the perception of the skin, mainly because they have bionic skin devices composed of various sensors.

[0003] The current bionic skin devices have a relatively complex structure, weak ability to perceive approaching objects, and poor anti-interference ability, making it difficult to achieve non-contact perception of objects. Summary of the invention

[0004] The present invention provides an interdigital capacitor assembly and a sensing device, which are used to solve the defects of bionic skin devices in the prior art, such as complex structure, weak ability to sense approaching objects, poor anti-interference ability, and difficulty in achieving non-contact sensing of objects. The present invention uses a simple and light structure to improve the sensing sensitivity, improve the anti-interference ability, and improve the ability to sense approaching objects.

[0005] The present invention provides an interdigital capacitor assembly, comprising:

[0006] A substrate, the substrate comprising an input end and an output end, the input end being made of an insulating material;

[0007] An interdigital capacitor, the interdigital capacitor is installed at the input end, the interdigital capacitor comprises a first electrode and a second electrode, the first electrode and the second electrode are both coiled on the first side of the substrate, the second electrode is arranged in the gap of the first electrode, and is staggered with the first electrode in a comb-teeth shape, and the distance between the second electrode and the first electrode is less than the target distance;

[0008] A transmission circuit, wherein a first end of the transmission circuit is electrically connected to the interdigital capacitor, and a second end of the transmission circuit extends to the output end.

[0009] The interdigital capacitor assembly provided by the present invention further includes:

[0010] a shielding head, the shielding head being disposed on the second side surface of the substrate and covering a portion of the input end located on the second side surface;

[0011] A shielded circuit, wherein a first end of the shielded circuit is electrically connected to the shielding head, and a second end of the shielded circuit is arranged at the output end.

[0012] The interdigital capacitor assembly provided by the present invention further includes:

[0013] A circuit layer is arranged on the second side of the substrate, a part of the circuit layer is arranged between the interdigital capacitor and the shielding head, and another part of the circuit layer is arranged between the input end and the output end, and the transmission circuit is arranged on the circuit layer.

[0014] According to the interdigital capacitor assembly provided by the present invention, the substrate comprises: a first shielding layer, the first shielding layer is connected to the input end, the first shielding layer comprises the output end, and the first shielding layer is coated on one side of the circuit layer;

[0015] The interdigital capacitor assembly further includes: a second shielding layer, the second shielding layer is connected to the shielding head, and the second shielding layer is coated on the other side of the circuit layer.

[0016] According to the interdigital capacitor assembly provided by the present invention, the first shielding layer, the second shielding layer and the shielding head all include a plurality of hollow patterns arranged in a grid shape, and the substrate is made of a flexible material.

[0017] The interdigital capacitor assembly provided by the present invention further includes:

[0018] A shielding line is provided in the circuit layer, and the shielding line is provided between two adjacent transmission circuits.

[0019] According to the interdigital capacitor assembly provided by the present invention, the first shielding layer, the second shielding layer and the shielding head are all made of metal materials, and the first shielding layer, the second shielding layer, the shielding head and the shielding wire are all connected to the shielding line.

[0020] According to the interdigital capacitor assembly provided by the present invention, there are a plurality of interdigital capacitors, and the plurality of interdigital capacitors are arranged in an array on the input end.

[0021] The interdigital capacitor assembly provided by the present invention further includes:

[0022] A dielectric film, wherein a working side of the dielectric film has a plurality of micro-pyramid structures, and the working side of the dielectric film is mounted in contact with the first side of the substrate.

[0023] The present invention also provides a sensing device, comprising:

[0024] An interdigital capacitor assembly as described in any one of the above;

[0025] A capacitance acquisition chip and a microprocessor, wherein the microprocessor is electrically connected to the interdigital capacitance assembly via the capacitance acquisition chip, and the microprocessor is configured to output a capacitance value change to an external device based on the electrical signal acquired by the interdigital capacitance assembly, and the capacitance value change is used by the external device to determine the proximity of an object.

[0026] The interdigital capacitor assembly and sensing device provided by the present invention, by arranging an interdigital capacitor at the input end of the substrate, using the first electrode and the second electrode arranged in a comb-like staggered manner to form the interdigital capacitor, and using the output end to derive the electrical signal, can improve the sensing sensitivity, improve the anti-interference ability, and improve the perception ability of the approaching object with a simple and light structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 This is one of the structural schematic diagrams of the interdigital capacitor assembly provided by the present invention;

[0029] Figure 2 This is the second structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0030] Figure 3 This is the third structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0031] Figure 4 This is the fourth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0032] Figure 5 This is the fifth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0033] Figure 6 This is the sixth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0034] Figure 7 This is the seventh structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0035] Figure 8 This is the eighth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0036] Fig. 9 This is the ninth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0037] Fig.10This is the tenth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0038] Fig.11 This is the eleventh structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0039] Fig.12 It is a schematic structural diagram of a dielectric film of an interdigital capacitor assembly provided by the present invention;

[0040] Fig.13 This is the twelfth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0041] Fig.14 This is the thirteenth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0042] Fig.15 This is the fourteenth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0043] Fig.16 This is the fifteenth structural schematic diagram of the interdigital capacitor assembly provided by the present invention;

[0044] Fig.17 is a schematic diagram of the structure of the sensing device provided by the present invention;

[0045] Fig.18 It is a schematic diagram of the principle of the sensing device provided by the present invention.

[0046] Reference numerals:

[0047] 10: substrate; 11: input end; 12: output end; 13: first side; 15: first shielding layer; 20: interdigital capacitor; 21: first electrode; 22: second electrode; 30: shielding head; 31: shielding line; 32: second shielding layer; 40: line layer; 41: shielding line; 42: transmission circuit; 50: dielectric film; 51: micro-pyramid structure; 60: LC oscillation matching circuit; 61: capacitor acquisition chip; 62: microprocessor; 63: external device. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] Combine the following Figures 1 to 18 The interdigital capacitor assembly and sensing device of the present invention are described.

[0050] like Figure 1 As shown, the present invention provides an interdigital capacitor component, which includes: a substrate 10, an interdigital capacitor 20 and a transmission circuit 42.

[0051] The substrate 10 includes an input end 11 and an output end 12 , and the input end 11 is made of insulating material.

[0052] It can be understood that the substrate 10 mainly plays a supporting role. Various electronic components can be installed on the substrate 10. The substrate 10 can be made of flexible material, such as polyimide material. The substrate 10 made of flexible material has strong plasticity and can be easily deformed under the action of external force to adapt to the shape of the installation carrier. For example, the substrate 10 can be installed on the fingers of a bionic robot. When the substrate 10 is a flexible material, the substrate 10 can adapt to the shape of the bionic robot's fingers.

[0053] The substrate 10 may have an input terminal 11 and an output terminal 12. The input terminal 11 is made of insulating material. Conductive electronic components may be installed on the input terminal 11 so as not to interfere with the operation of the electronic components. The output terminal 12 may be used to connect to an external device 63 to output electrical signals. For example, the output terminal 12 may have an electrode lead-out point compatible with an FFC (Flexible Flat Cable) interface.

[0054] like Figure 1 and Figure 2 As shown, the interdigital capacitor 20 is installed at the input end 11, and the interdigital capacitor 20 includes a first electrode 21 and a second electrode 22. The first electrode 21 and the second electrode 22 are both coiled on the first side surface 13 of the substrate 10. The second electrode 22 is arranged in the gap of the first electrode 21 and is staggered with the first electrode 21 in a comb-teeth shape.

[0055] like Figure 3 and Figure 4 As shown, the number of the interdigital capacitors 20 may be one or more, and the multiple interdigital capacitors 20 may be arranged in an array on the input terminal 11 .

[0056] It can be understood that the interdigital capacitor 20 is a sensor element for proximity sensing, which can sense the approach of an object. The interdigital capacitor 20 can have a first electrode 21 and a second electrode 22, and the first electrode 21 and the second electrode 22 respectively constitute two plates of the capacitor. Unlike conventional capacitors, the first electrode 21 and the second electrode 22 are both in the shape of long strips, and the first electrode 21 and the second electrode 22 are both coiled on the first side surface 13 of the substrate 10, and are both at the input end 11 of the substrate 10. When the input end 11 is disc-shaped, the first electrode 21 and the second electrode 22 can also be coiled into a disc shape. The first electrode 21 and the second electrode 22 can be arranged in a comb-tooth-like staggered manner. The first electrode 21 can form a gap during the coiling process, and the second electrode 22 is installed in the gap. The spacing between the first electrode 21 and the second electrode 22 can be kept consistent at different positions.

[0057] A first end of the transmission circuit 42 is electrically connected to the interdigital capacitor 20 , and a second end of the transmission circuit 42 extends to the output end 12 .

[0058] It can be understood that the first electrode 21 can be the positive electrode of the capacitor, and the second electrode 22 can be the negative electrode of the capacitor. The first electrode 21 and the second electrode 22 can be respectively connected to the wires in the transmission circuit 42. The first end of the transmission circuit 42 is electrically connected to the interdigital capacitor 20, and the second end extends to the output end 12. That is, the transmission circuit 42 can transmit the electrical signal changes on the interdigital capacitor 20 to the external device 63 through the output end 12, and the external device 63 can be connected to the interdigital capacitor 20.

[0059] It should be noted that when an object approaches the fork-finger capacitor 20, the edge electromagnetic field of the fork-finger capacitor 20 will be disturbed, the capacitance value of the fork-finger capacitor 20 on the input terminal 11 will change, and the capacitance value can present a corresponding numerical value according to the distance of the object approaching. The fork-finger capacitor component can transmit the capacitance value change to the external device 63 through the output terminal 12, and the external device 63 can judge the proximity of the object based on the change in capacitance value, so that it can sense the proximity of the object and the distance of the object approaching.

[0060] The interdigital capacitor 20 is formed by using the first electrode 21 and the second electrode 22 which are coiled around the input end 11 in a long strip shape. This can increase the coverage area of ​​the capacitor, sense slight magnetic field changes when an object approaches, and improve the sensing sensitivity and anti-interference ability.

[0061] The interdigital capacitor component provided by the present invention, by setting an interdigital capacitor 20 at the input end 11 of the substrate 10, using the first electrode 21 and the second electrode 22 arranged in a comb-like staggered manner to form the interdigital capacitor 20, and using the output end 12 to derive the electrical signal, can improve the perception sensitivity, improve the anti-interference ability, and improve the perception ability of the approaching object with a simple and light structure.

[0062] like Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, in some embodiments, the interdigital capacitor assembly further includes: a shielding head 30 and a shielding line 31 .

[0063] The shielding head 30 is disposed on the second side surface (not shown in the figure) of the substrate 10 and covers the portion of the input terminal 11 located on the second side surface.

[0064] It can be understood that when the shielding head 30 is not set on the first side 13 and the second side of the substrate 10, then the first side 13 and the second side of the substrate 10 can both sense the approach of objects. In actual use, some scenes only require one side to sense the approach of objects, then the perception signal of the other side will interfere with the normal perception work. In this embodiment, the shielding head 30 is installed on the second side of the substrate 10. The shielding head 30 can cover the part of the input terminal 11 on the second side, so that the interdigital capacitor 20 only senses the magnetic field changes on the first side 13, thereby eliminating electromagnetic interference and further improving the anti-interference ability.

[0065] A first end of the shielding line 31 is electrically connected to the shielding head 30 , and a second end of the shielding line 31 is disposed at the output end 12 .

[0066] It can be understood that the shielding head 30 is electrically connected to the first end of the shielding line 31, and the second end of the shielding line 31 can extend to the output end 12, so that the shielding head 30 and the external device 63 are electrically connected. The external device 63 can send an electrical signal to the shielding head 30, thereby being able to control the shielding head 30 and realize active shielding of the shielding head 30.

[0067] like Fig. 9 , Fig.10 and Fig.11 As shown, in some embodiments, the interdigital capacitor component further includes: a circuit layer 40 .

[0068] The circuit layer 40 is disposed on the second side of the substrate 10 , and a portion of the circuit layer 40 is disposed between the interdigital capacitor 20 and the shielding head 30 , and another portion of the circuit layer 40 is disposed between the input end 11 and the output end 12 . The transmission circuit 42 is disposed on the circuit layer 40 .

[0069] It can be understood that the circuit layer 40 can be arranged between the substrate 10 and the shielding head 30, wherein a part of it is arranged between the interdigital capacitor 20 and the shielding head 30, and the other part is arranged between the input end 11 and the output end 12 of the substrate 10. The circuit layer 40 is mainly used to arrange the transmission circuit 42, which can facilitate the reasonable wiring of the transmission circuit 42, facilitate product manufacturing and assembly, improve product production efficiency, and at the same time protect the transmission circuit 42.

[0070] like Fig. 9 As shown, in some embodiments, the substrate 10 includes: a first shielding layer 15 .

[0071] The first shielding layer 15 is connected to the input end 11 . The first shielding layer 15 includes an output end 12 . The first shielding layer 15 is coated on one side of the circuit layer 40 .

[0072] It is understandable that the substrate 10 may further include a first shielding layer 15 , which may be located on one side of the circuit layer 40 to shield one side of the circuit layer 40 . The first shielding layer 15 is connected to the input terminal 11 , and the first shielding layer 15 may include an output terminal 12 .

[0073] The interdigital capacitor assembly further includes a second shielding layer 32 , which is connected to the shielding head 30 and covers the other side of the circuit layer 40 .

[0074] It can be understood that the interdigital capacitor assembly may include a second shielding layer 32, which can be arranged on the other side of the circuit layer 40 to shield the other side of the circuit layer 40. Through the first shielding layer 15 and the second shielding layer 32, both sides of the circuit layer 40 can be shielded. The second shielding layer 32 and the shielding head 30 can be connected in an integrally formed manner. For example, the second shielding layer 32 and the shielding head 30 can both be integrally formed of metal materials.

[0075] like Fig. 9 As shown, in some embodiments, the first shielding layer 15, the second shielding layer 32 and the shielding head 30 all include a plurality of hollow patterns arranged in a grid shape, and the substrate 10 is made of a flexible material.

[0076] It can be understood that a plurality of hollow patterns can be provided on the first shielding layer 15, the second shielding layer 32 and the shielding head 30, and the plurality of hollow patterns can be arranged in a grid shape on the first shielding layer 15, the second shielding layer 32 and the shielding head 30. By providing the hollow patterns, the rigidity of the first shielding layer 15, the second shielding layer 32 and the shielding head 30 can be reduced. When the substrate 10 is made of a flexible material, the entire finger capacitor assembly can be flexible, which can improve the plasticity of the finger capacitor assembly, so that the finger capacitor assembly can adapt to the shape of the mounting carrier and can expand the adaptation scenario.

[0077] like Fig.11 As shown, in some embodiments, the interdigital capacitor assembly further includes: a shielding line 41 .

[0078] The shielding line 41 is disposed on the circuit layer 40 , and the shielding line 41 is disposed between two adjacent transmission circuits 42 .

[0079] It can be understood that the shielding wire 41 is installed on the circuit layer 40. There can be multiple transmission circuits 42 on the circuit layer 40. For example, there can be multiple cables arranged side by side on the circuit layer 40. The shielding wire 41 is set between two adjacent transmission circuits 42. The shielding wire 41 can eliminate electromagnetic interference between adjacent transmission circuits 42, so that the transmission circuits 42 can work relatively independently.

[0080] In some embodiments, the first shielding layer 15 , the second shielding layer 32 , and the shielding head 30 are all made of metal materials, and the first shielding layer 15 , the second shielding layer 32 , the shielding head 30 , and the shielding wire 41 are all connected to the shielding line 31 .

[0081] It can be understood that the first shielding layer 15, the second shielding layer 32 and the shielding head 30 can all be made of metal materials. The metal material covering the input end 11 and the circuit layer 40 can directly shield electromagnetic interference. The first shielding layer 15, the second shielding layer 32, the shielding head 30 and the shielding wire 41 are all connected to the shielding circuit 31. The shielding circuit 31 can be used to give a unified potential signal to the first shielding layer 15, the second shielding layer 32, the shielding head 30 and the shielding wire 41, thereby realizing the integrity of the shielding, realizing active shielding and overall shielding, and further reducing electromagnetic interference.

[0082] In some embodiments, there are multiple interdigital capacitors 20 , and the multiple interdigital capacitors 20 are arranged in an array on the input terminal 11 .

[0083] It is understandable that there can be multiple interdigital capacitors 20 on the input end 11, and there can also be multiple corresponding transmission circuits 42. The multiple interdigital capacitors 20 are all located at the input end 11 and are arranged in an array on the first side 13. This can further improve the perception accuracy of the interdigital capacitors 20.

[0084] like Fig.12 , Fig.13 , Fig.14 , Fig.15 and Fig.16 As shown, in some embodiments, the interdigital capacitor assembly further includes: a dielectric film 50 .

[0085] The working side surface of the dielectric film 50 has a plurality of micro-pyramid structures 51 , and the working side surface of the dielectric film 50 is mounted in contact with the first side surface 13 of the substrate 10 .

[0086] It can be understood that the dielectric film 50 can be made of a polydimethylsiloxane-carbon black nano-conductive particle mixture material, and the surface can have multiple micro-pyramid structures 51. When an object contacts the interdigital capacitor 20 and applies pressure to it, the dielectric film is squeezed and deformed, the air gap is reduced, and the micro-pyramid structure 51 close to the surface of the interdigital capacitor 20 is flattened, thereby occupying more dielectric space, which is equivalent to increasing the dielectric constant of the material in the edge field, thereby increasing the capacitance value. When the dielectric layer is compressed, the dielectric properties will change, thereby affecting the capacitance value of the interdigital capacitor 20. As the degree to which the dielectric film 50 is pressed varies, the capacitance value of the interdigital capacitor 20 will change accordingly, so that the pressing force of the object on the interdigital capacitor component can be detected, so that contact sensing can be achieved and the sensitivity of contact sensing can be improved.

[0087] It is worth mentioning that by providing the dielectric film 50 on the interdigital capacitor assembly, it is possible to detect the proximity of an object or the pressure exerted by the object on the interdigital capacitor assembly, that is, to achieve dual-mode detection, specifically a proximity sensing mode and a pressure sensing mode.

[0088] When an object approaches the interdigital capacitor assembly, the edge electromagnetic field of the interdigital electrodes is disturbed, and the capacitance value of the interdigital capacitor changes. The degree of interference varies with the conductivity of the approaching object. This is the proximity sensing mode. When the object contacts the sensor and applies pressure to it, the dielectric film 50 is compressed and deformed, the air gap is reduced, and the micro-pyramid structure occupies more dielectric space, thereby increasing the capacitance. This is the pressure sensing mode.

[0089] like Fig.17 and Fig.18 As shown, the present invention further provides a sensing device, which comprises: an interdigital capacitor assembly, a capacitance acquisition chip 61 and a microprocessor 62 as in any of the above embodiments.

[0090] Among them, the microprocessor 62 is electrically connected to the interdigital capacitor assembly through the capacitance acquisition chip 61. The microprocessor 62 is configured to output the capacitance value change to the external device 63 based on the electrical signal collected by the interdigital capacitor assembly. The capacitance value change is used for the external device 63 to determine the proximity of the object.

[0091] It can be understood that the fork-finger capacitor assembly can be electrically connected to the LC oscillation matching circuit 60, the LC oscillation matching circuit 60 is electrically connected to the capacitor acquisition chip 61, the capacitor acquisition chip 61 is electrically connected to the microprocessor 62, the microprocessor 62 can be electrically connected to the external device 63, the external device 63 can be an electronic device with a logical operation function, such as a mobile phone, a tablet computer, a laptop computer or a desktop computer, etc., the external device 63 can be installed with a host computer signal analysis software, the microprocessor 62 can output the capacitance value change to the external device 63 according to the electrical signal collected by the fork-finger capacitor assembly, and the host computer signal analysis software in the external device 63 can process the capacitance value change to determine the proximity of the object.

[0092] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0093] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An interdigital capacitor assembly, characterized in that: include: A substrate, the substrate comprising an input end and an output end, the input end being made of an insulating material; An interdigital capacitor, the interdigital capacitor is installed at the input end, the interdigital capacitor comprises a first electrode and a second electrode, the first electrode and the second electrode are both coiled on the first side of the substrate, the second electrode is arranged in the gap of the first electrode, and is staggered with the first electrode in a comb-teeth shape, the first electrode and the second electrode are coiled into a disk shape, and the distance between the first electrode and the second electrode is consistent at different positions; a transmission circuit, wherein a first end of the transmission circuit is electrically connected to the interdigital capacitor, and a second end of the transmission circuit extends to the output end; a shielding head, the shielding head being disposed on the second side surface of the substrate and covering a portion of the input end located on the second side surface; A shielded circuit, wherein a first end of the shielded circuit is electrically connected to the shielding head, and a second end of the shielded circuit is disposed at the output end; A circuit layer, wherein the circuit layer is disposed on the second side of the substrate, a portion of the circuit layer is disposed between the interdigital capacitor and the shielding head, and another portion of the circuit layer is disposed between the input end and the output end, and the transmission circuit is disposed on the circuit layer; The substrate comprises: a first shielding layer, the first shielding layer is connected to the input end, the first shielding layer comprises the output end, and the first shielding layer is coated on one side of the circuit layer; The interdigital capacitor assembly further includes: a second shielding layer, the second shielding layer is connected to the shielding head, and the second shielding layer is coated on the other side of the circuit layer; The first shielding layer, the second shielding layer and the shielding head all include a plurality of hollow patterns arranged in a grid shape, and the substrate is made of a flexible material.

2. The interdigital capacitor assembly according to claim 1, characterized in that: Also includes: A shielding line is provided in the circuit layer, and the shielding line is provided between two adjacent transmission circuits.

3. The interdigital capacitor assembly according to claim 2, characterized in that: The first shielding layer, the second shielding layer and the shielding head are all made of metal materials, and the first shielding layer, the second shielding layer, the shielding head and the shielding wire are all connected to the shielding line.

4. The interdigital capacitor assembly according to any one of claims 1 to 3, characterized in that: There are a plurality of interdigital capacitors, and the plurality of interdigital capacitors are arranged in an array on the input end.

5. The interdigital capacitor assembly according to any one of claims 1 to 3, characterized in that: Also includes: A dielectric film, wherein a working side of the dielectric film has a plurality of micro-pyramid structures, and the working side of the dielectric film is mounted in contact with the first side of the substrate.

6. A sensing device, characterized in that: include: The interdigital capacitor assembly according to any one of claims 1 to 5; A capacitance acquisition chip and a microprocessor, wherein the microprocessor is electrically connected to the interdigital capacitance assembly via the capacitance acquisition chip, and the microprocessor is configured to output capacitance value changes to an external device based on electrical signals acquired by the interdigital capacitance assembly.

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