Symmetrical cooling plate design

Abstract

An embodiment of a cooling plate comprising a substantially identical first frame and a second frame is disclosed. The first frame comprises a first frame body and a plurality of first heat-conducting fins, the first frame body having a first recess and a first mating surface surrounding the first recess, the plurality of first heat-conducting fins being located in the first recess. The second frame comprises a second frame body and a plurality of second heat-conducting fins, the second frame body having a second recess and a second mating surface surrounding the second recess, the plurality of second heat-conducting fins being located in the second recess. The second mating surface is in sealing contact with the first mating surface, so that the first recess and the second recess form a fluid chamber. The plurality of first and second heat-conducting fins form a plurality of fin channels in the fluid chamber. An advanced sealing structure can be formed between the first mating surface and the second mating surface. The first fluid port and the second fluid port are fluidically connected to the plurality of fin channels via the fluid channel.

Description

Technical Field

[0001] The disclosed embodiments relate generally to liquid cooling systems for electronic devices, and particularly, but not limited to, cold plates used in liquid cooling systems. Background Art

[0002] Many modern information technology (IT) devices, such as servers, blade servers, routers, and edge servers, generate significant amounts of heat during operation. The heat generated by individual components, particularly high-power components like processors, makes it difficult or impossible to effectively cool many of these components using air cooling systems. Therefore, modern IT equipment requires liquid cooling or liquid-air hybrid cooling.

[0003] Cold plates are components used in many liquid cooling solutions. They are attached to heat-generating components. Once attached, liquid circulates through the cold plate to remove heat. Currently, there are several challenges in using liquid cooling to remove heat through cold plates:

[0004] Improve cooling plate design and manufacturing efficiency;

[0005] Improved performance and availability of liquid-cooled cold plates;

[0006] Support costs are reduced and provide better price / performance ratio;

[0007] Improve reliability;

[0008] Continue to support increasing power demands and their corresponding increases in heat; and

[0009] Scalability to different and changing electronic packaging platforms. Summary of the Invention

[0010] A cooling plate includes a first frame and a second frame. The first frame includes: a first frame body having a planar first base surface, an annular first mating surface, and at least one outer sidewall, wherein the first mating surface is spaced apart from the first base surface and surrounds a first recess in the first frame body, the first recess having a bottom and at least one inner sidewall, a plurality of first thermally conductive fins positioned in the first recess, each thermally conductive fin having a first edge thermally coupled to the bottom and a second edge positioned substantially in a plane defined by the first mating surface, a first fluid channel positioned in the bottom of the first recess, and a first fluid port positioned in the at least one frame sidewall, the first fluid port being fluidly coupled to the first fluid channel. The second frame includes: a second frame body having a planar second base surface, an annular second mating surface, and at least one outer sidewall, wherein the second mating surface is spaced apart from the second base surface and surrounds a second recess in the second frame body, the second recess having a bottom and at least one inner sidewall, a plurality of second thermally conductive fins positioned in the second recess, each thermally conductive fin having a first edge thermally coupled to the bottom of the second recess and a second edge substantially positioned at a plane defined by the second mating surface, a second fluid channel positioned at the bottom of the second recess, and a second fluid port positioned in the at least one frame sidewall, the second fluid port being fluidly coupled to the second fluid channel.

[0011] According to some embodiments, the second mating surface is positioned in sealing contact with the first mating surface such that the first recess and the second recess form a fluid chamber.

[0012] According to some embodiments, a second edge of each of the first plurality of thermally conductive fins is in thermal contact with a second edge of a corresponding thermally conductive fin of the second plurality of thermally conductive fins, such that the first plurality of thermally conductive fins and the second plurality of thermally conductive fins form a plurality of fin channels in the fluid chamber.

[0013] According to some embodiments, a first fluid port and a second fluid port are fluidly coupled to the plurality of fin channels via their fluid channels, wherein the first fluid port is an inlet port that delivers fluid to the first fluid channel and the second fluid port is an outlet port that discharges fluid from the second fluid channel.

[0014] According to some embodiments, the first recess and the second recess are quadrilaterals, and the thermal fins in the first and second plurality of thermal fins have one end positioned at one recess sidewall and the other end positioned at the opposite recess sidewall.

[0015] According to some embodiments, the cooling plate further includes a first groove formed in the first mating surface and a second groove formed in the second mating surface.

[0016] According to some embodiments, the first groove and the second groove are aligned with each other, the first mating surface mates with the second mating surface, and the cooling plate further includes a seal positioned in the first groove and the second groove.

[0017] According to some embodiments, the first groove and the second groove together form an H-shaped channel, and the cooling plate further includes a seal having an H-shaped cross-section positioned in the H-shaped channel.

[0018] According to some embodiments, the first groove and the second groove are not aligned with each other, the first mating surface mates with the second mating surface, and the cooling plate further includes a first seal positioned in the first groove and a second seal positioned in the second groove.

[0019] According to some embodiments, the first frame and the second frame are identical in shape.

[0020] According to some embodiments, the second frame is coupled to the first frame with the first and second ports aligned on the same side of the cooling plate, or the second frame is coupled to the first frame with the first and second ports located on different sides of the cooling plate.

[0021] According to some embodiments, the cooling plate further includes a plurality of mounting channels extending through the first frame and the second frame to facilitate mounting the cooling plate to a heat source, wherein the first base surface is thermally coupled to the heat source.

[0022] A cooling system includes: a fluid supply portion and a fluid return portion; and at least one cooling plate fluidly coupled to the fluid supply portion and the fluid return portion, wherein the at least one cooling plate includes a first frame and a second frame. The first frame includes: a first frame body having a planar first base surface, an annular first mating surface, and at least one outer sidewall, wherein the first mating surface is spaced apart from the first base surface and surrounds a first recess in the first frame body, the first recess having a bottom and at least one inner sidewall, a plurality of first thermally conductive fins positioned in the first recess, each thermally conductive fin having a first edge thermally coupled to the bottom and a second edge substantially positioned in a plane defined by the first mating surface, a first fluid channel positioned in the bottom of the first recess, and a first fluid port positioned in at least one frame sidewall, the first fluid port fluidly coupled to the first fluid channel. The second frame includes: a second frame body having a planar second base surface, an annular second mating surface, and at least one outer sidewall, wherein the second mating surface is spaced apart from the second base surface and surrounds a second recess in the second frame body, the second recess having a bottom and at least one inner sidewall, a plurality of second thermally conductive fins positioned in the second recess, each thermally conductive fin having a first edge thermally coupled to the bottom of the second recess and a second edge substantially positioned at a plane defined by the second mating surface, a second fluid channel positioned at the bottom of the second recess, and a second fluid port positioned in the at least one frame sidewall, the second fluid port being fluidly coupled to the second fluid channel.

[0023] According to some embodiments, the second mating surface sealingly contacts the first mating surface such that the first recess and the second recess form a fluid chamber, and wherein the second edge of each of the plurality of first thermally conductive fins is in thermal contact with the second edge of a corresponding thermally conductive fin of the plurality of second thermally conductive fins such that the plurality of first thermally conductive fins and the plurality of second thermally conductive fins form a plurality of fin channels in the fluid chamber.

[0024] According to some embodiments, a first fluid port and a second fluid port are fluidly coupled to the plurality of fin channels via their fluid channels, wherein the first fluid port is an inlet port that delivers fluid to the first fluid channel, the second fluid port is an outlet port that discharges fluid from the second fluid channel, and wherein the fluid supply delivers cool fluid and is fluidly coupled to the first fluid port, and the fluid return discharges hot fluid and is fluidly coupled to the second fluid port.

[0025] According to some embodiments, the first and second recesses are quadrilateral, and the thermal fins in the first and second plurality of thermal fins have one end positioned at one recess sidewall and another end positioned at an opposite recess sidewall.

[0026] According to some embodiments, the at least one cooling plate further includes a first groove formed in the first mating surface and a second groove formed in the second mating surface.

[0027] According to some embodiments, the first groove and the second groove are aligned with each other, the first mating surface mates with the second mating surface, and the cooling system further includes a seal positioned in the first groove and the second groove.

[0028] According to some embodiments, the first groove and the second groove together form an H-shaped channel, and the cooling system further includes a seal having an H-shaped cross-section positioned in the H-shaped channel.

[0029] According to some embodiments, the first groove and the second groove are not aligned with each other, the first mating surface mates with the second mating surface, and the cooling system further includes a first seal positioned in the first groove and a second seal positioned in the second groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Non-limiting and non-exhaustive embodiments of the present invention are described below with reference to the following figures, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified.

[0031] Figure 1 is a block diagram of an embodiment of a data center device.

[0032] Figure 2is a block diagram of an embodiment of an IT container including electronics racks housing electronics and cooling systems.

[0033] Figure 3 is a block diagram of an embodiment of a cooling plate configuration.

[0034] Figure 4A -4F is a diagram of an embodiment of a cooling plate. Figure 4A It is an exploded stereogram; Figure 4B is a top view of an embodiment of a frame; Figure 4C is a side view of an embodiment of a frame; Figure 4D It is a side view of a pair of frames being assembled; Figure 4E is a side view of an embodiment of an assembled cooling plate; Figure 4F is an exploded perspective view illustrating a fluid flow path through a cooling plate in one embodiment of cooling plate operation.

[0035] Figure 5A -5B is an exploded perspective view of an embodiment of a sealing device in a cooling plate.

[0036] Figure 6A -6B is a side view of an embodiment of a sealing device in a cooling plate. Figure 6A It's an exploded view. Figure 6B It is an assembly diagram.

[0037] Figure 7-8 is a perspective view of an embodiment of a cooling plate in which the frames of the cooling plate are positioned differently relative to each other.

[0038] Figure 9A - 9C is a diagram of an embodiment of a cooling plate in a mounting structure. Figure 9A It's a stereogram. Figures 9B-9C It is a cross-sectional view.

[0039] Figure 10A -10B is a cross-sectional view of an embodiment of a plurality of cooling plates included in a mounting structure. DETAILED DESCRIPTION

[0040] Embodiments of cooling plates for use in liquid cooling systems are described. Specific details are described to provide an understanding of the embodiments, but one skilled in the relevant art will recognize that the invention can be practiced without one or more of the described details, or with other methods, components, materials, etc. In some instances, well-known structures, materials, or operations are not shown or described in detail, but are nonetheless encompassed within the scope of the invention.

[0041] References in this specification to "one embodiment" or "an embodiment" mean that the described features, structures, or characteristics may be included in at least one of the described embodiments, and thus, appearances of "in one embodiment" or "in an embodiment" do not necessarily refer to the same embodiment. Furthermore, particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. As used in this application, directional terms such as "front," "rear," "top," "bottom," "side," "lateral," "longitudinal," etc. refer to the orientation of the embodiments as they appear in the accompanying drawings, but, when actually used, any directional term should not be interpreted as implying or requiring any particular orientation of the described embodiments.

[0042] The described embodiments provide an advanced structure for liquid cooling that not only simplifies design and manufacturing but also offers greater usability for diverse electronics cooling scenarios. Furthermore, the disclosed embodiments provide improved thermal management performance, which can benefit high-power density processors and electronic packaging. The described embodiments also simplify the cold plate of liquid-based cooling solutions without sacrificing performance. The simplified design of such solutions directly impacts reliability, usability, manufacturability, cost, and many other factors.

[0043] An integrated cooling plate structure for liquid cooling of electronic devices is proposed. A completely symmetrical design is adopted for the cooling plate assembly, which means that the cooling plate has identical upper and lower parts, thereby improving usability and corresponding manufacturability. A detailed internal structure is described, which includes fin channels, water fins, and fluid inlet and outlet channels. The design of the fluid distribution enables improved thermal conductivity. An advantageous sealing structure design is disclosed, which improves the reliability of the design; the thermal expansion characteristics of the sealing gasket can provide even higher reliability for the cooling plate assembly. Finally, a mounting structure is described as an alternative design for the cooling plate integration.

[0044] Figure 11 is a block diagram of at least a portion of an embodiment of a data center 100. The data center system 100 includes one or more rows of electronics racks 101-102 of information technology (IT) components, equipment, or instruments, such as computer servers or computing nodes that provide data services to various clients via a network (e.g., the Internet). In the present embodiment, each row includes an array of electronics racks, such as electronics racks 110A–110N, but more or fewer rows of electronics racks may be implemented. Typically, the rows 101–102 are aligned in parallel, with their front ends facing each other and their rear ends facing away from each other, with aisles 103 formed therebetween to allow administrators to pass through. However, other configurations or arrangements may also be provided. For example, two rows of electronics racks may face each other with their rear ends facing each other without forming an aisle in between, with their front ends facing away from each other. The rear ends of the electronics racks may be connected to an indoor cooling liquid manifold.

[0045] In one embodiment, each electronics rack (e.g., electronics racks 110A–110N) includes an enclosure to house a plurality of IT components arranged in a stack that operate therein. The electronics rack may include a cooling liquid manifold, a plurality of server slots (e.g., standard racks or chassis constructed in the same or similar form factor), and a plurality of server chassis (also referred to as server blades or server racks) that can be inserted into and removed from the server slots. Each server chassis represents a compute node having one or more processors, memory, and / or persistent storage devices (e.g., hard drives), wherein a compute node may include one or more servers operating therein. At least one processor is connected to a liquid-cooled cold plate (also referred to as a cold plate assembly) to receive cooling liquid. Additionally, one or more optional cooling fans are associated with the server chassis to provide air cooling to the compute nodes contained therein. Note that cooling system 120 may be coupled to a plurality of data center systems, such as data center system 100.

[0046] In one embodiment, cooling system 120 includes an external liquid loop connected to a dry cooler or cooling tower external to the building / housing container. Cooling system 120 may include, but is not limited to, evaporative cooling, free air, large thermal mass rejection, and waste heat recovery designs. Cooling system 120 may include or be coupled to a cooling liquid source that provides cooling liquid.

[0047] In one embodiment, each server chassis is modularly coupled to the coolant manifold, allowing the server chassis to be removed from the electronics rack without affecting the operation of the remaining server chassis and coolant manifold in the electronics rack. In another embodiment, each server chassis is coupled to the coolant manifold to distribute coolant to the processors via a quick-release coupling assembly having a server liquid inlet connector and a server liquid outlet connector coupled to a flexible hose. The server liquid inlet connector receives coolant from the coolant manifold mounted at the rear end of the electronics rack via the rack liquid inlet connector. The server liquid outlet connector discharges warmer or hotter liquid, carrying heat exchanged from the processors, to the coolant manifold via the rack liquid outlet connector. The warmer or hotter liquid then returns to the coolant distribution unit (CDU) within the electronics rack.

[0048] In one embodiment, a cooling liquid manifold located at the rear end of each electronics rack is coupled to a liquid supply line 132 (also referred to as an indoor supply manifold) to receive cooling liquid from the cooling system 120. The cooling liquid is distributed through a liquid distribution circuit attached to a cold plate assembly (on which the processors are mounted) to remove heat from the processors. The cold plate is constructed similarly to a radiator with liquid distribution pipes attached to or embedded within the radiator. The resulting warmer or hotter liquid, carrying heat removed from the processors, is transported back to the cooling system 120 via a liquid return line 131 (also referred to as an indoor return manifold).

[0049] Liquid supply / return lines 131-132, referred to as data center or room liquid supply / return lines (e.g., master liquid supply / return lines), supply cooling liquid to all electronics racks in rows 101-102. Liquid supply line 132 and liquid return line 131 are coupled to the heat exchanger of the CDU located within each electronics rack, forming the primary loop. The secondary loop of the heat exchanger is coupled to each server chassis in the electronics rack to deliver cooling liquid to the processor cold plates.

[0050] In one embodiment, data center system 100 further includes an optional airflow delivery system 135 for generating airflow to facilitate airflow through the air spaces of the server chassis of the electronics racks to remove heat generated by the operation of the computing nodes (e.g., servers) and to discharge the heat-exchanged airflow to the external environment or a cooling system (e.g., an air-to-liquid heat exchanger) to reduce the temperature of the airflow. For example, air supply system 135 generates cool / cold airflow to circulate from duct 103 through electronics racks 110A-110N to remove the exchanged heat.

[0051] Cold air enters the electronics rack through the front of the rack, while warm / hot air leaves the rack through the rear. The warm / hot air, which has been subjected to heat exchange, is then exhausted from the room / building or cooled using a separate cooling system (such as an air-to-liquid heat exchanger). Therefore, the cooling system is a liquid-air hybrid cooling system, in which a portion of the heat generated by the processor is discharged through the corresponding cooling plate via the coolant, while the remaining heat generated by the processor (or other electronic components or processing equipment) is discharged through air cooling.

[0052] Figure 2 1 is a block diagram illustrating a side view of an embodiment of an electronics rack, a type of IT container commonly used in data centers. In one embodiment, electronics rack 100 includes a CDU 101, a rack management unit (RMU) 102, and one or more server blades 103A-103D, collectively referred to as server blades 103. Server blades 103 can be inserted into an array of server slots from a front end 104 of electronics rack 100. Note that while only four server blades 103A–103D are shown, more or fewer server blades can be held within electronics rack 100. Note that the specific positions of CDU 101, CMU 102, and server blades 103 are shown for illustrative purposes only; other arrangements or configurations of CDU 101, CMU 102, and server blades 103 may also be implemented. Furthermore, the front door located at front end 104 and the rear door located at rear end 105 are optional. In some embodiments, there may be no doors at front end 104 and / or rear end 105.

[0053] In one embodiment, CDU 101 includes a heat exchanger 211, a liquid pump 212, and a pump controller 210. Heat exchanger 211 may be a liquid-to-liquid heat exchanger. Heat exchanger 211 includes a first pipe having a first pair of liquid connectors coupled to external liquid supply / return lines 131-132 to form a primary loop. The connectors coupled to external liquid supply / return lines 131-132 may be arranged or mounted on the rear end 205 of electronics rack 200. Furthermore, heat exchanger 211 includes a second pipe having a second pair of liquid connectors coupled to a liquid manifold 225. The second pipe may include a supply manifold for supplying cooling liquid to server blades 203 and a return manifold for returning warmed liquid to CDU 201. Processors may be mounted on a cold plate, wherein the cold plate includes liquid distribution channels embedded therein to receive cooling liquid from the liquid manifold 225 and return the cooling liquid, carrying heat exchanged from the processors, to the liquid manifold 225.

[0054] Each server blade 203 may include one or more IT components (e.g., CPU, GPU, memory and / or storage device). Each IT component may perform data processing tasks, wherein the IT component may include software installed in a storage device, loaded into memory and executed by one or more processors to perform the data processing tasks. The server blade 203 may include a host server (referred to as a host node) connected to one or more computing servers (also referred to as computing nodes). The host server (having one or more CPUs) typically connects to a client via a network (e.g., the Internet) to receive requests for specific services, such as storage services (e.g., cloud-based storage services, such as backup and / or recovery), executes applications to perform specific operations (e.g., image processing, deep data learning algorithms or modeling, etc., as part of a software as a service or SaaS platform). In response to the request, the host server distributes the task to one or more computing servers (having one or more GPUs) managed by the host server. The computing servers perform the actual tasks, which may generate heat during operation.

[0055] Electronics rack 200 also includes an RMU 202 configured to provide and manage power to server blades 203 and CDU 201. RMU 202 can be coupled to a power supply unit (not shown) to manage the power consumption of the power supply unit, as well as other thermal management functions for the power supply unit (e.g., cooling fans). The power supply unit can include necessary circuitry (e.g., an alternating current (AC) to direct current (DC) or DC to AC power converter, a battery, a transformer, or a regulator, etc.) to provide power to the remaining components of electronics rack 200.

[0056] In one embodiment, the RMU 202 includes optimized control logic 221 and a rack management controller (RMC) 222. The optimized control logic 221 is coupled to at least some of the server blades 203 to receive the operating status of each server blade 203, such as the processor temperature of the processor, the current pump speed of the liquid pump 212, and the liquid temperature of the coolant. The optimized control logic 221 determines the optimal pump speed of the liquid pump 212 by optimizing a predetermined objective function such that the output of the objective function reaches a maximum value while satisfying a set of predetermined constraints. Based on the optimal pump speed, the RMC 222 is configured to send a signal to the pump controller 220 to control the pump speed of the liquid pump 212 based on the optimal pump speed.

[0057] Figure 3 1 shows an embodiment of a processor / cold plate configuration 300. The processor / cold plate assembly 300 may represent a Figure 2Any processor / cold plate structure of the server chassis 203 shown. The processor 301 is plugged into a processor socket mounted on a printed circuit board (PCB) or motherboard 302, which is connected to other electrical components or circuits of the data processing system or server. The processor 301 also includes a cold plate 303 attached thereto, which is connected to the rack manifold, which is connected to the liquid supply line 132 and / or the liquid return line 131. Some of the heat generated by the processor 301 is removed by the coolant via the cold plate 303. The remainder of the heat enters the atmosphere from below or from above, and the remainder of the heat can be removed by the airflow generated by the cooling fan 304. The cold plate 303 can be the following in combination Figure 4A Any of the cooling plate embodiments discussed above.

[0058] Figure 4A -4F collectively illustrate an embodiment of a cooling plate 400 . Figure 4A It is an exploded stereogram; Figure 4B is a top view of an embodiment of a frame; Figure 4C is a side view of an embodiment of a frame; Figure 4D is a side view of a pair of frames being assembled; and Figure 4E is a side view of an embodiment of an assembled cooling plate; Figure 4F is an exploded perspective view illustrating a fluid flow path through a cooling plate in one embodiment of cooling plate operation.

[0059] The cooling plate 400 includes a first or bottom frame 402b coupled to a second or top frame 402t. The first frame 402b includes a frame body 404b having a planar first base surface 406b spaced from and substantially parallel to an annular first mating surface 408b. The base surface 406b and the mating surface 408b are connected along their perimeters by a plurality of outer sidewalls 410b. The terms "annular" or "annular" are generally understood to refer to an annular area between concentric circles of different radii, or in other words, the area resulting when one circle is subtracted from the area of a larger concentric circle. However, as used herein, the terms "annular" or "annular" are more general and refer to any shape resulting when the area of one shape is subtracted from the area of a larger shape, regardless of whether the shapes are concentric or not and whether they are scaled versions of the same basic shape. The definition of "annular" or "ring-shaped" encompasses the conventional understanding of the term, but also includes other polygonal shapes, such as squares, rectangles, triangles, trapezoids, etc., as well as non-polygonal shapes, such as ellipses. Therefore, the annular mating surface 408b can be considered a quadrilateral ring (see Figure 4B ).

[0060] The recess 412b is formed in the frame 404b. The recess extends from the plane defined by the mating surface 408b into the frame 404b to a position between the mating surface 408b and the base surface 406b (see, for example, FIG. Figure 4C ). Recess 412b includes a bottom 414b and a plurality of inner sidewalls 416b. A fluid channel 418b is positioned along bottom 414b. In the illustrated embodiment, fluid channel 418b is positioned within frame 404b below bottom 414b and extends through outer sidewall 410b, such that the fluid channel fluidically connects the interior of recess 412b to the exterior of frame 404b. In other embodiments, fluid channel 418b may be positioned differently than shown; for example, in other embodiments, fluid channel 418b may be positioned within recess 412b, in which case the fluid channel extends through inner sidewall 416b and outer sidewall 410b to reach the exterior of the frame. A fluid port 420b is positioned on outer sidewall 410b and fluidically coupled to fluid channel 418b, such that fluid can be delivered to or discharged from fluid channel 418b from a source line or return line fluidically coupled to the port. Although in the embodiment shown, fluid channel 418b and fluid port 420b both have quadrilateral cross-sections, other embodiments may have cross-sections that make it easier to attach hoses and accessories, such as circular cross-sections. In other embodiments, fluid channel 418b and fluid port 420b do not necessarily have the same cross-sectional shape.

[0061] A set of thermally conductive fins 422b is formed or inserted into the recess 412b. The fin set 422b includes one or more individual thermally conductive fins. Each individual fin is substantially rectangular and has a first edge 424, a second edge 426, a first end 428, and a second end 430. The fin set 422b is positioned in the recess 412b with the first edge 424 in thermal contact with the bottom 414b and the second edge 426 substantially flush with the plane of the mating surface 408b. Each fin in the fin set 422b extends through the dimensions of the recess 412b such that, for each fin, its first end 428 is positioned in contact with one inner sidewall 416b and its second end is positioned in contact with the opposing inner sidewall. In embodiments where the fins 422b are formed directly in the recess 412b, there is no edge 424 because the fins are formed directly on the surface of the bottom 414b.

[0062] The second or top frame 402t is substantially identical to the first or bottom frame 402b such that each element of the bottom frame 402b encounters an identical corresponding element in the top frame 402t. Thus, the cooling plate 400 is described as symmetrical because it comprises two identical halves, even though the halves are not positioned so as to produce a completely symmetrical cooling plate (see, e.g., Figure 8). Thus, the top frame 402t includes a frame body 404t having a planar second base surface 406t spaced apart from and substantially parallel to an annular second mating surface 408t, with the base surface 406t and mating surface 408t connected along their perimeter by an outer sidewall 410t. The recess 412t includes a bottom 414t and a plurality of inner sidewalls 416t. A fluid channel 418t is positioned along the bottom 414t. In the illustrated embodiment, the fluid channel 418t is positioned within the frame body 404t below the bottom 414t and extends through the outer sidewall 410t, such that the fluid channel fluidically connects the interior of the recess 412t to the exterior of the frame body 404t. A fluid port 420t is positioned on the outer sidewall 410t and fluidically coupled to the fluid channel 418t, allowing fluid to be delivered to or discharged from the fluid channel 418t from a source line or return line fluidically coupled to the port. Although in the embodiment shown, the fluid channel 418t and the fluid port 420t both have a quadrilateral cross-section, other embodiments may have a cross-section that makes it easier to attach hoses and accessories, such as a circular cross-section. In other embodiments, the fluid channel 418t and the fluid port 420t do not necessarily have the same cross-sectional shape.

[0063] The set of thermally conductive fins 422t is formed or inserted into the recess 412t in the same manner as the fins 422b are formed or inserted into the recess 412b. The set of fins 422t is positioned in the recess 412t with the first edge 424 in thermal contact with the bottom 414t and the second edge 426 substantially flush with the plane of the mating surface 408t. Each fin in the set of fins 422t extends through the dimensions of the recess 412t such that, for each fin, its first end 428 is positioned in contact with one inner sidewall 416t and its second end is positioned in contact with the opposing inner sidewall.

[0064] As best shown in 4D-4E, the cooling plate 400 is formed by joining a first or bottom frame 402b to a second or top frame 402t. To assemble the cooling plate 400, the second frame 402t is placed together with the first frame 402b so that the second mating surface 408t contacts the first mating surface 408b. When positioned so that the mating surfaces 408b and 408t contact, the recesses 412b and 412t form a fluid chamber 432. The fin sets 422b and 422t are positioned so that when the top and bottom frames are joined, the second edge 426 of each individual fin in the fin set 422b will contact the second edge of the corresponding fin in the fin set 422t. As a result, the fin sets 422b and 422t together form a plurality of fin channels within the fluid chamber 432. Fasteners can be inserted into the mounting channels 434 to keep the top frame 402t securely connected to the mating surface 408b of 402b. As shown below in conjunction with Figure 5AAs discussed further in FIG. 6B , to prevent leakage of the cooling fluid from the chamber 432 , a seal may be formed at the interface of the mating surfaces 408 b and 408 t .

[0065] Figure 4F FIG4 shows an embodiment of the operation of the cooling plate 400 and the fluid path through the cooling plate. The fluid path is represented by the dashed arrows in the figure. In operation, the first base surface 406b is thermally coupled to a heat generating electronic component, such as a microprocessor (not shown in the figure, but see FIG4). Figure 3 and Figure 9A -10B). The thermal connection between the base surface 406b and the electronic component can be through direct contact or through indirect contact via a thermal interface material. Figure 3 As shown, the fluid supply line is connected to port 420b, and the fluid return line is connected to port 420t. When the component generates heat, cooling fluid from the fluid supply connected to port 420b enters the port and flows into and through fluid channel 418b into chamber 432 (not shown in this exploded view, but shown in FIG. Figure 4E ). Fluid channels 418b distribute the cooling fluid into the fin channels, which are the spaces between the fins in the chamber 432. Heat from the components flows through the first base surface 406b by conduction, into the individual fins, and from the fins into the fluid in the fin channels. As the fluid flows through the fin channels in the bottom frame 402b, the fluid absorbs heat from the heat-conducting fins, becomes hotter, and flows from the fin channels in the bottom fin set 422b into the corresponding fin channels in the top fin set 422t. The fluid flows from the fin channels in the top fin set 422t into the fluid channels 418t, and then flows through the fluid channels 418t to the port 420t, where the now heated fluid leaves the cooling plate and enters the return line. In other embodiments, the flow through the cooling plate 400 can be reversed, with port 420t serving as the inlet port, port 420b serving as the outlet port, and the direction of flow through the interior of the cooling plate being opposite to that shown in the figure.

[0066] Figure 5A -5B shows an embodiment of a sealing arrangement for a cooling plate such as cooling plate 400. When the first frame 402b and the second frame 402t are as described above for Figure 4D When assembled as described in FIG. 4E , a seal needs to be provided to prevent liquid from leaking from the chamber 132 during operation of the cooling plate. Figure 5AAn embodiment is shown in which the first mating surface 408b includes a sealing groove 502b formed in the surface and the second mating surface 408t includes a second sealing groove 502t formed in the surface. The sealing recesses or grooves 502b and 502t are positioned in their respective mating surfaces so that when the mating surface 408t is placed in contact with the mating surface 408b and the first frame 402b is secured to the second frame 402t using the mounting channel 434, the sealing recesses or grooves 502b and 502t will align. In one embodiment, the sealing recesses 502b and 502t each have a semicircular cross-section so that when the mating surfaces 408b and 408t are placed together, the sealing recesses 502b and 502t together form a circular channel. In other embodiments, the sealing recesses 502b and 502t can have shapes other than semicircular.

[0067] Seals (not shown in this figure, but see e.g. Figure 6A -6B) is positioned in the aligned grooves 502t and 502b to complete the seal. In embodiments where the sealing grooves 502b and 502t are semicircular, the seal can be an O-ring, but other seals with different cross-sectional shapes can be used in other embodiments—for example, square, rectangular, triangular, oval, and semicircular shapes can be used in different embodiments. The size and dimensions of the seals 506b and 506t should match the groove configuration. In one embodiment, the seal can expand with temperature; thermal expansion parameters should be carefully designed so that the seal expands with increasing temperature and contracts with decreasing temperature, but the minimum dimensions should meet the sealing requirements.

[0068] Figure 5B Another embodiment of a sealing device for a cold plate 200 is shown. In the illustrated embodiment, a first mating surface 408b includes a sealing groove 504b formed in the surface, and a second mating surface 408t includes a second sealing groove 504t formed in the surface. In addition to groove 504t, a projection 504tp of groove 504t is also shown in this figure, which is also indicated on the first mating surface 408b. In this embodiment, sealing grooves 504b and 504tb are positioned in their respective surfaces such that when mating surface 408t is placed in contact with mating surface 408b, sealing grooves 504b and 504tb do not align. Instead, one groove has different dimensions than the other, such that when the mating surfaces are placed in contact, one groove is completely within the perimeter of the other groove; grooves 504b and 504t can be described as concentric, except that grooves 504b and 504t do not need to share the same center (although in some embodiments, they can).

[0069] Seals 506b and 506t can be positioned in grooves 504t and 504b to complete the seal. In one embodiment, each seal can be an O-ring, but in other embodiments, other seals with different cross-sectional shapes can be used - for example, square, rectangular, triangular, oval, semicircular can be used in different embodiments. This arrangement can be helpful because it provides redundancy: if one seal fails, there is another seal to maintain the seal. Different locations and / or sizes of the recesses can also improve the sealing performance. The size and dimensions of the seals 506b and 506t should match the groove structure. In one embodiment, the seals 506b and 506t can expand with temperature; the thermal expansion parameters should be carefully designed so that the seals expand with increasing temperature and contract with decreasing temperature, but the minimum size should meet the sealing requirements.

[0070] Figure 6A -6B collectively show another embodiment of a sealing device for a cooling plate 600 . Figure 6A It's an exploded view. Figure 6B The cooling plate 600 is similar in most respects to the cooling plate 400: the cooling plate 600 comprises a first or bottom frame 402b and a second or top frame 402t, both of which are constructed as described above for the cooling plate 400. The main difference in the cooling plate 600 is the sealing arrangement.

[0071] In the cooling plate 600, the first mating surface 408b has a notch or groove 602 formed therein, the cross-section of which is shaped like the lower half of the letter H. The second mating surface 408t similarly has a notch or groove 604 formed therein, the cross-section of which is shaped like the upper half of the letter H. The grooves 602 and 604 are aligned so that when the top frame 402t is coupled to the bottom frame 402b, the second mating surface 408t contacts the first mating surface 408b, and the grooves 602 and 604 together form a channel having an H-shaped cross-section (see FIG. 1 ). Figure 6B To complete the seal, a gasket 606 with an H-shaped cross-section is inserted into the channel formed by grooves 602 and 604. The H-shaped gasket 606 enhances the sealing of the entire package. The size and dimensions of the gasket 606 should match the groove structure. In one embodiment, seals 506b and 506t can expand with temperature; the thermal expansion parameters should be carefully designed so that the seals expand with increasing temperature and contract with decreasing temperature, but the minimum dimensions should meet the sealing requirements.

[0072] Figure 7-8 Additional embodiments of cooling plates are shown. Figure 7An embodiment of a cooling plate 700 is shown. The cooling plate 700 is arranged substantially as shown and described above for the cooling plate 400, with the first frame 402b and the second frame 402t assembled so that the ports 420b and 420t are aligned on the same side of the cooling plate. Since this embodiment uses the same frame and is symmetrical about the plane between the two frames, this embodiment is a completely symmetrical arrangement. Figure 8 An embodiment of a cooling plate 800 is shown in which the first frame 402b and the second frame 402t are assembled so that ports 420b and 420t terminate on opposite sides of the cooling plate. Because this embodiment uses the same frame, but is asymmetrical about the plane between the two frames, this embodiment is a partially symmetrical arrangement. For example, cooling plate 800 can be used in applications where there are multiple cooling plates but insufficient space to install all required hoses and connectors on one side of the cooling plate. The fluid distribution within cooling plate 800 remains similar, but the inlet / outlet arrangement can be more flexible for different use cases.

[0073] Figure 9A -9C collectively illustrate an embodiment of a cooling plate assembly 900 utilizing a mounting structure. Figure 9A It's a stereogram. Figure 9B It is an exploded cross-sectional view. Figure 9C is a cross-sectional view of the assembly. In some cases, it may be difficult or impossible to attach a cooling plate (such as cooling plate 400, 700, or 800) directly to an electronic component. The cooling plate assembly 900 can be useful in these situations.

[0074] In cooling plate assembly 900, cooling plate 700 is coupled to mounting structure 902. While the illustrated embodiment of cooling plate assembly 900 utilizes cooling plate 700, other embodiments may utilize other cooling plates, such as cooling plates 400, 600, or 800. Mounting structure 902 includes an opening 910 extending through the entire thickness of the mounting structure from top surface 904 to bottom surface 906 and is sized and shaped to receive at least a portion of cooling plate 700, such that its first base surface 406b is exposed at the bottom of the mounting structure. In one embodiment, cooling plate 700 can be secured within opening 910 by press-fitting the cooling plate into the opening, but in other embodiments, the cooling plate can be secured to the mounting structure in a different manner. In some embodiments, mounting structure 902 can be thermally conductive, allowing it to function as a heat conducting plate. In another embodiment, the mounting structure can be formed directly onto the cooling plate frame rather than using a separate mounting structure, and in another embodiment, other fluidic components can be assembled onto the mounting structure, if desired.

[0075] In operation, heat-generating electronic components such as processor 912 are mounted on base 914. To cool processor 912, the cooling plate assembly is lowered onto processor 912 until first base surface 406b of cooling plate 700 is thermally coupled to processor 912. When the first base surface is thermally coupled to the processor, bottom surface 906 rests on the surface of base 914 surrounding the processor. One or more fasteners 908 can then be inserted into mounting structure 902 and base 914 to secure cooling plate assembly 900 in place, as shown in FIG. Figure 9C The cold plate assembly 900 eliminates any dependency of the cold plate mounting on the processor.

[0076] Figure 10A -10B collectively illustrate another embodiment of a cooling plate assembly 1000 utilizing a mounting structure. Figure 10A It is an exploded cross-sectional view. Figure 10B is a cross-sectional view of the assembly. The cooling plate assembly 1000 is similar to the cooling plate assembly 900; the primary difference is that the cooling plate assembly 1000 can accommodate multiple cooling plates. In the illustrated embodiment, all cooling plates are cooling plates 700, but in other embodiments the cooling plates can be any other cooling plates disclosed herein, and in other embodiments, all cooling plates in the cooling plate assembly 1000 need not be identical.

[0077] In cold plate assembly 1000, multiple cooling plates 700 are coupled to a mounting structure 1002. Mounting structure 1002 includes a plurality of openings 1010 extending through the entire thickness of the mounting structure from a top surface 1004 to a bottom surface 1006. The mounting structure 1002 is sized and shaped to receive at least a portion of a cooling plate 700, such that its first base surface 406b is exposed at the bottom of the mounting structure. In the illustrated embodiment, the thickness of mounting structure 1002 is substantially uniform, but this need not be the case in other embodiments. In other embodiments, for example, the mounting structure may be thicker at its perimeter than in the spaces between cooling plates 700. In one embodiment, cooling plates 700 may be secured within openings 910 by press-fitting the cooling plates into the openings, but in other embodiments, the cooling plates may be secured to the mounting structure in a different manner. In some embodiments, mounting structure 1002 may be thermally conductive, allowing it to function as a heat conducting plate. In another embodiment, the mounting structure may be formed directly onto the cooling plate frame rather than using a separate mounting structure, and in another embodiment, other fluidic components may be assembled onto the mounting structure if desired.

[0078] In operation, a plurality of heat-generating electronic components, such as a processor 1012, are mounted on the base 1014. To cool the processor 1012, the cooling plate assembly 1000 is lowered onto the base 1014 and the processor 1012 until the first base surface 406b of each cooling plate 700 is thermally coupled to the corresponding processor 1012. When the first base surface 406b is thermally coupled to its corresponding processor, the bottom surface 1006 rests on the surface of the base 1014 surrounding the processor. Figure 10B As shown, one or more fasteners 1008 may be inserted into the mounting structure 1002 and the base 1014 to secure the cold plate assembly 1000 in place.

[0079] In addition to the above embodiments, other embodiments of the cooling plate are possible. For example:

[0080] Different types of packaging solutions for assembling the upper and lower frames can be implemented.

[0081] Different types of sealing channels and corresponding gaskets can be used to improve performance and reliability.

[0082] The above description of the embodiments is not intended to be exhaustive or to limit the invention to the form described. Specific embodiments of and examples for the invention are described herein for purposes of illustration, but various modifications are possible.

Claims

1. A cooling plate comprising: The first box includes: The first frame has a planar first base surface, an annular first mating surface, and at least one outer sidewall, wherein the first mating surface is spaced apart from the first base surface and surrounds a first recess in the first frame, the first recess having a bottom and at least one inner sidewall. a plurality of first thermally conductive fins positioned in the first recess, each thermally conductive fin having a first edge thermally coupled to the base and a second edge positioned substantially at a plane defined by the first mating surface, a first fluid channel positioned at the bottom of the first recess, and a first fluid port positioned in at least one frame sidewall, the first fluid port fluidly coupled to the first fluid channel; The second box includes: The second frame has a planar second base surface, an annular second mating surface, and at least one outer sidewall, wherein the second mating surface is spaced apart from the second base surface and surrounds a second recess in the second frame, the second recess having a bottom and at least one inner sidewall. a plurality of second thermally conductive fins positioned in the second recess, each thermally conductive fin having a first edge thermally coupled to a bottom of the second recess and a second edge positioned substantially at a plane defined by the second mating surface, a second fluid channel positioned at the bottom of the second recess, and a second fluid port positioned in the at least one frame sidewall, the second fluid port fluidly coupled to the second fluid passage; wherein the second mating surface is positioned in sealing contact with the first mating surface such that the first recess and the second recess form a fluid chamber; The second edge of each of the first plurality of thermally conductive fins is in thermal contact with the second edge of a corresponding thermally conductive fin of the second plurality of thermally conductive fins, so that the first plurality of thermally conductive fins and the second plurality of thermally conductive fins form a plurality of fin channels in the fluid chamber.

2. The cooling plate of claim 1 , wherein the first fluid port and the second fluid port are fluidly coupled to the plurality of fin channels via their fluid channels, wherein: The first fluid port is an inlet port that delivers fluid to the first fluid channel, and the second fluid port is an outlet port that exhausts fluid from the second fluid channel.

3. The cooling plate according to claim 1 , wherein the first recess and the second recess are quadrilaterals, and the thermal conductive fins in the first plurality of thermal conductive fins and the second plurality of thermal conductive fins have one end positioned at a side wall of one recess and the other end positioned at an opposite side wall of the recess. 4 . The cooling plate of claim 1 , further comprising a first groove formed in the first mating surface and a second groove formed in the second mating surface.

5. The cooling plate of claim 4, wherein the first groove and the second groove are aligned with each other, the first mating surface mates with the second mating surface, and the cooling plate further comprises a seal positioned in the first groove and the second groove. 6 . The cooling plate of claim 5 , wherein the first groove and the second groove together form an H-shaped channel, and the cooling plate further comprises a seal having an H-shaped cross-section positioned in the H-shaped channel.

7. The cooling plate of claim 4, wherein the first groove and the second groove are not aligned with each other, the first mating surface mates with the second mating surface, and the cooling plate further comprises a first seal positioned in the first groove and a second seal positioned in the second groove. The cooling plate of claim 1 , wherein the first frame and the second frame are identical in shape.

9. The cooling plate of claim 1 , wherein: The second frame is coupled to the first frame, wherein the first port and the second port are aligned on the same side of the cooling plate, or The second frame is coupled to the first frame, wherein the first port and the second port are located on different sides of the cooling plate.

10. The cooling plate of claim 1, further comprising a plurality of mounting channels extending through the first frame and the second frame for mounting the cooling plate to a heat source, wherein the first base surface is thermally coupled to the heat source.

11. A cooling system comprising: a fluid supply portion and a fluid return portion; at least one cooling plate fluidly coupled to the fluid supply and the fluid return, wherein the at least one cooling plate comprises: The first box includes: The first frame has a planar first base surface, an annular first mating surface, and at least one outer sidewall, wherein the first mating surface is spaced apart from the first base surface and surrounds a first recess in the first frame, the first recess having a bottom and at least one inner sidewall. a plurality of first thermally conductive fins positioned in the first recess, each thermally conductive fin having a first edge thermally coupled to the base and a second edge positioned substantially at a plane defined by the first mating surface, a first fluid channel positioned at the bottom of the first recess, and a first fluid port positioned in at least one frame sidewall, the first fluid port fluidly coupled to the first fluid channel; The second box includes: The second frame has a planar second base surface, an annular second mating surface, and at least one outer sidewall, wherein the second mating surface is spaced apart from the second base surface and surrounds a second recess in the second frame, the second recess having a bottom and at least one inner sidewall. a plurality of second thermally conductive fins positioned in the second recess, each thermally conductive fin having a first edge thermally coupled to a bottom of the second recess and a second edge positioned substantially at a plane defined by the second mating surface, a second fluid channel positioned at the bottom of the second recess, and a second fluid port positioned in the at least one frame sidewall, the second fluid port fluidly coupled to the second fluid passage; The second mating surface is in sealing contact with the first mating surface, so that the first recess and the second recess form a fluid chamber, and the second edge of each of the plurality of first thermally conductive fins is in thermal contact with the second edge of a corresponding thermally conductive fin of the plurality of second thermally conductive fins, so that the plurality of first thermally conductive fins and the plurality of second thermally conductive fins form a plurality of fin channels in the fluid chamber.

12. The cooling system of claim 11 , wherein the first fluid port and the second fluid port are fluidly coupled to the plurality of fin channels via their fluid channels, wherein the first fluid port is an inlet port that delivers fluid to the first fluid channel, and the second fluid port is an outlet port that discharges fluid from the second fluid channel, and wherein the fluid supply delivers cool fluid and is fluidly coupled to the first fluid port, and the fluid return discharges hot fluid and is fluidly coupled to the second fluid port.

13. The cooling system of claim 11, wherein the first recess and the second recess are quadrilateral, and the thermal fins in the first plurality of thermal fins and the second plurality of thermal fins have one end positioned at one recess sidewall and the other end positioned at the opposite recess sidewall.

14. The cooling system of claim 11, wherein the at least one cooling plate further comprises a first groove formed in the first mating surface and a second groove formed in the second mating surface.

15. The cooling system of claim 14, wherein the first groove and the second groove are aligned with each other, the first mating surface mates with the second mating surface, and the cooling system further comprises a seal positioned in the first groove and the second groove. 16 . The cooling system of claim 15 , wherein the first groove and the second groove together form an H-shaped channel, and the cooling system further comprises a seal having an H-shaped cross-section positioned in the H-shaped channel.

17. The cooling system of claim 14, wherein the first groove and the second groove are not aligned with each other, the first mating surface mates with the second mating surface, and the cooling system further comprises a first seal positioned in the first groove and a second seal positioned in the second groove.

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