Tinning device

Abstract

The present application relates to a tinning device. The tinning device includes: a solder paste bucket, a connecting rod, a tinning needle holder, a first connector, a tin adding pipe, and a first fixed plate; the solder paste bucket is fixed to the first fixed plate at a preset angle, and the first fixed plate is installed on the tinning machine; the first end of the solder paste bucket is connected to the first end of the connecting rod through the first connector, and the second end of the connecting rod is connected to the base of the tinning needle holder; the second end of the solder paste bucket is connected to a tin control device; the tin adding pipe is used to add solder paste to the solder paste bucket, and is connected to the first end of the solder paste bucket by inserting it into the first connector. When using the tinning device to add solder paste, you only need to pull out the first connector at the bottom of the solder paste bucket from the connecting rod, and then insert the tin adding pipe into the first connector of the solder paste bucket to add solder paste, which improves the efficiency of adding solder paste, while also ensuring that the quality of the added solder paste is not affected, ensuring stable and consistent welding quality.

Description

Technical Field

[0001] The present application relates to the technical field of tin soldering welding of base station antenna components in the field of mobile communications, and in particular to a tinning device. Background Art

[0002] Base station antennas are critical components for mobile communication network coverage. The quality of the welds within them is directly related to product performance. Quantitative control of each welding element is a crucial prerequisite for achieving product consistency.

[0003] Reflow soldering is increasingly being adopted for the soldering of antenna components. This not only improves solder quality but also facilitates automated assembly lines, improving production efficiency. Controlling all aspects of reflow soldering is directly related to product quality. Solder paste is the soldering material used in reflow soldering, which places stringent requirements not only on solder paste quality but also on the amount of solder paste used during antenna component soldering. Currently, during the reflow soldering process, some antenna components have a three-dimensional solder joint distribution, making it impossible to apply solder paste using automated solder dispensers. Manual soldering is inefficient due to the large number of solder joints. Furthermore, due to human error, the placement and amount of solder paste applied to each solder joint can vary, resulting in poor quality consistency. For these complex antenna components with high solder quality requirements, the following challenges often arise: Solder paste cannot be applied using automated solder dispensers, resulting in inefficiency and poor consistency when manually applying solder paste. Alternatively, automated solder dispensing devices can be inefficient, reducing solder paste quality, impacting subsequent commissioning and causing overall performance instability.

[0004] Based on this, how to provide a tinning device that can solve the above problems has become an urgent problem to be solved. Summary of the Invention

[0005] Based on this, it is necessary to provide a tin-dispensing device that can improve the efficiency of adding solder paste and the quality of solder paste in order to address the above technical problems.

[0006] In a first aspect, the present application provides a tinning device. The tinning device comprises: a solder paste bucket, a connecting rod, a tinning needle holder, a first connector, a tinning pipe, and a first fixing plate;

[0007] The solder paste bucket is fixed to the first fixing plate at a preset angle, and the first fixing plate is installed on the soldering machine; the first end of the solder paste bucket is connected to the first end of the connecting rod through the first connecting head, and the second end of the connecting rod is connected to the base of the soldering needle holder; the second end of the solder paste bucket is connected to the solder control device;

[0008] The tin adding pipeline is used to add tin paste to the tin paste bucket, and is connected to the first end of the tin paste bucket by being inserted into the first connector.

[0009] In one embodiment, the material of the barrel wall of the solder paste barrel where the solder paste is placed is a transparent material.

[0010] In one embodiment, the first connector includes: a threaded head, a housing, a first sealing ring, a connecting ring, an elastic ring, a fixing ring, and a pressing ring; the first sealing ring, the connecting ring, the elastic ring, the fixing ring, and the pressing ring are all arranged inside the housing, and the first sealing ring, the connecting ring, the elastic ring, the fixing ring, and the pressing ring are all provided with holes of the same size inside, and when the connecting rod is inserted into the first connector through the holes, the first sealing ring, the connecting ring, the elastic ring, the fixing ring, and the pressing ring are nested with each other and are used to fix the connecting rod; wherein:

[0011] The threaded head is connected to the head of the first end of the solder paste barrel through a thread;

[0012] The first sealing ring is fixed in the housing through the connecting ring and the fixing ring;

[0013] The elastic ring is arranged between the fixing ring and the pressing ring. When the connecting rod is inserted into the first connecting head, the elastic ring enters the recessed step portion on the connecting rod; when the connecting rod is pulled out of the first connecting head, the pressing ring squeezes the elastic ring to make the elastic ring disengage from the recessed step portion on the connecting rod.

[0014] In one embodiment, the elastic ring is an elastic barb structure; the first end of the pressure ring is an inclined surface structure, and the inclined surface structure contacts the inclined surface of the elastic barb structure of the elastic ring;

[0015] The plane of the elastic barb structure of the elastic ring contacts the side plane of the first end of the fixed ring, and the side plane of the second end of the fixed ring contacts the side plane of the structure between the first end and the second end of the pressure ring; the first end of the fixed ring and the first end of the elastic ring are both connected to the first end of the connecting ring, and the second end of the connecting ring is connected to the first end of the sealing ring.

[0016] In one embodiment, the tinning device further includes: a second fixing plate, a first through hole is provided on the second fixing plate, and the second fixing plate is fixed to the first fixing plate by screws; the solder paste bucket is passed through the first through hole and fixed to the first fixing plate.

[0017] In one embodiment, the tinning device further includes: a third fixing plate, a second through hole is provided on the third fixing plate, and the third fixing plate is fixed to the first fixing plate by screws; the tinning needle seat is passed through the second through hole and fixed to the first fixing plate.

[0018] In one embodiment, the connecting rod is a hollow structure.

[0019] In one embodiment, the solder paste barrel includes a piston, and the shape of the plug portion of the piston is adapted to the shape of the inner wall of the portion of the solder paste barrel where the solder paste is placed.

[0020] In one embodiment, the solder paste barrel includes a second sealing ring, which is arranged between the piston and the inner wall of the solder paste barrel.

[0021] In one embodiment, the tinning device further includes: an upper cover, which is used to cover the second end of the solder paste bucket.

[0022] In one embodiment, the tinning device further includes: a third sealing ring, and the third sealing ring is arranged between the upper cover and the inner wall of the solder paste barrel.

[0023] In one embodiment, the tinning device further includes: a second connector, the upper cover is connected to the tinning control device via the second connector, and the structure of the second connector is the same as that of the first connector.

[0024] In one embodiment, the soldering needle holder includes at least one soldering needle tube.

[0025] In one embodiment, the tin-dotting needles have different shapes and / or lengths.

[0026] In one embodiment, the tinning device further includes: a third connecting head, the connecting rod is connected to the tinning needle seat through the third connecting head, and the structure of the third connecting head is the same as that of the first connecting head.

[0027] The above-mentioned tinning device includes a solder paste bucket, a connecting rod, a tinning needle holder, a first connecting head, a tin adding pipe and a first fixed plate; the solder paste bucket is fixed on the first fixed plate at a preset angle, and the first fixed plate is installed on the tinning machine; the first end of the solder paste bucket is connected to the first end of the connecting rod through the first connecting head, and the second end of the connecting rod is connected to the base of the tinning needle holder; the second end of the solder paste bucket is connected to the tin control device; the tin adding pipe is used to add solder paste to the solder paste bucket, and is connected to the first end of the solder paste bucket by inserting it into the first connecting head. When using this tinning device to add solder paste, you only need to pull out the first connecting head at the bottom of the solder paste bucket from the connecting rod, and then insert the tin adding pipe into the first connecting head of the solder paste bucket to add solder paste. This improves the efficiency of adding solder paste, while also ensuring that the quality of the added solder paste is not affected, ensuring stable and consistent welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic structural diagram of a tinning device in one embodiment;

[0029] Figure 2 is a schematic structural diagram of a second fixing plate in one embodiment;

[0030] Figure 3 is a schematic structural diagram of a third fixing plate in one embodiment;

[0031] Figure 4 A schematic diagram of a connection method between a connecting rod and a soldering pin holder in one embodiment;

[0032] Figure 5 A schematic diagram of a tinning device when adding solder paste in one embodiment;

[0033] Figure 6 is a schematic structural diagram of a first connector in one embodiment;

[0034] Figure 7 A schematic structural diagram of another tinning device according to an embodiment;

[0035] Description of reference numerals:

[0036] 1: Solder paste bucket; 2: Connecting rod; 3: Soldering needle holder;

[0037] 4: First connector; 5: Soldering pipe; 6: First fixing plate;

[0038] 7: Piston; 8: Second sealing ring; 9: Upper cover;

[0039] 10: Third sealing ring; 11: Second connector; 12: Second fixing plate;

[0040] 121: first through hole; 13: third fixing plate; 131: second through hole;

[0041] 14: Third connector; 31: Soldering needle; 40: Threaded head;

[0042] 41: housing; 42: first sealing ring; 43: connecting ring;

[0043] 44: Elastic ring; 45: Fixed ring; 46: Pressure ring. DETAILED DESCRIPTION

[0044] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0045] The following specific embodiments describe in detail the technical solution of this application and how the technical solution of this application solves the technical problem. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of this application will be described below in conjunction with the accompanying drawings.

[0046] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application include direct and indirect connections (couplings) unless otherwise specified. In the description of this application, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0047] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0048] The solder paste barrels in current automatic tinning devices are made of non-pressure-resistant materials, so they are all covered with metal pressure-resistant shells on the outside. This makes it impossible to directly observe the usage status and appearance of the solder paste, and the solder paste is uncontrollable. In addition, when replacing the soldering needle seat, it is necessary to unscrew and remove the metal pressure-resistant barrel cover, then unscrew and remove the connecting thread between the solder paste barrel and the soldering needle seat, and then loosen the fixing screw of the soldering needle seat to replace the soldering needle seat. When adding solder paste, it is necessary to unscrew and remove the metal pressure-resistant barrel cover, then unscrew and remove the internal solder paste barrel, and then remove the internal piston of the solder paste barrel to add solder paste. Alternatively, without removing the solder paste barrel, unscrew the metal pressure-resistant barrel cover, remove the piston separately, and then add solder paste to the automatic tinning device. This operation is time-consuming and labor-intensive, and it is also easy for a large amount of air to be mixed into the solder paste, affecting the quality of the solder paste, and further affecting the overall debugging of the subsequent antenna product and the overall performance of the product. Based on this, the present application provides a tinning device that can improve the efficiency of tinning and reduce the impact on the quality of the solder paste. The following embodiment specifically describes the tinning device.

[0049] In the first embodiment, Figure 1 As shown, a tinning device is provided, which includes: a solder paste bucket 1, a connecting rod 2, a tinning needle seat 3, a first connector 4, a tinning pipe 5 and a first fixing plate 6, the first fixing plate 6 is installed in the tinning machine ( Figure 1 The soldering machine is not shown in the figure); the solder paste bucket 1 is fixed on the first fixing plate 6 at a preset angle; the first end of the solder paste bucket 1 (the lower part of the solder paste bucket 1 in the figure) is connected to the first end of the connecting rod 2 (the upper part of the connecting rod 2 in the figure) through the first connector 4, and the second end of the connecting rod 2 (the lower part of the connecting rod 2 in the figure) is connected to the base of the soldering needle seat 3; the second end of the solder paste bucket 1 (the upper part of the solder paste bucket 1 in the figure) is connected to the tin control device ( Figure 1 The tin adding pipe 5 is used to add tin paste to the tin paste barrel 1, and is connected to the first end of the tin paste barrel 1 by inserting the first connector 4.

[0050] The preset angle represents the installation angle between the solder paste bucket 1 and the first fixing plate 6, which means that the solder paste bucket 1 can be installed on the first fixing plate 6 perpendicular to the horizontal plane, or can be installed on the first fixing plate 6 at an angle relative to the horizontal plane. The preset angle can be determined in advance according to the tinning position. For example, if the tinning position is on a plane, the installation angle between the solder paste bucket 1 and the first fixing plate 6 is 0°, which means that the solder paste bucket 1 is installed perpendicular to the horizontal plane (for example, Figure 1The preset angle is set to 0° at this time; if the tinning position is on an inclined plane, the installation angle between the corresponding solder paste bucket 1 and the first fixed plate 6 can be any angle between 0°-90°, which means that the solder paste bucket 1 is installed tilted relative to the horizontal plane. At this time, the preset angle is set to any angle between 0°-90°.

[0051] The solder paste barrel 1 is used to hold solder paste. Pressure is applied to the solder paste contained within the barrel 1, forcing it from the barrel's outlet (first end) into the tin-dispensing needle tube 31 on the tin-dispensing needle holder 3, allowing the tin-dispensing operation to proceed through the tin-dispensing needle tube 31. Optionally, the barrel wall of the portion of the barrel 1 where the solder paste is placed is made of a transparent material, such as transparent plastic. This transparent material exhibits excellent pressure resistance, making it a pressure-resistant material. Therefore, the exterior of the barrel 1 does not require a metal pressure-resistant housing, simplifying the structure of the barrel 1. Furthermore, the use and addition of solder paste can be observed through the transparent barrel, achieving controllable solder paste during the tin-dispensing process. The barrel 1 is connected to the tin-dispensing needle holder 3 via a first connector 4, a first connecting rod 2, and a first fixing plate 6. The barrel 1 can be secured to the first fixing plate 6 by any means, such as a fixing ring, screws, a clamp, or the like, allowing for both attachable and detachable attachment. Optionally, the barrel 1 includes threads on its lower portion for threaded connection to the first connector 4.

[0052] Optionally, the solder paste barrel 1 includes a piston 7, and the shape of the plug portion of the piston 7 is adapted to the shape of the inner wall of the portion of the solder paste barrel 1 where the solder paste is placed. Figure 1 In the tinning device shown, the lower shape of the piston 7 is basically consistent with the lower shape of the solder paste barrel 1. When the tinning device is working, the solder paste is located at the lower part of the piston 7. When the solder paste is used up, the piston 7 moves to the lower part of the solder paste barrel 1. Such shape matching allows the solder paste to be squeezed out as much as possible, so that each batch of solder paste will not be mixed, thereby improving the quality of the solder paste during the tinning operation; when solder paste is added through the solder adding pipeline 5, the solder paste squeezes the piston 7 to move the piston 7 upward, reducing the mixing of air and ensuring the stability of the welding quality.

[0053] Optionally, the solder paste barrel 1 further includes a second sealing ring 8 , which is disposed between the piston 7 and the inner wall of the solder paste barrel 1 to ensure a sealed fit between the piston 7 and the solder paste barrel 1 .

[0054] Optional, Figure 1 The tinning device shown also includes an upper cover 9, which is used to cover the second end (top) of the solder paste bucket 1. Specifically, a thread is provided on the upper part of the solder paste bucket 1, and the upper cover 9 can be fixed by the thread. Figure 1The tinning device shown also includes a third sealing ring 10, which is arranged between the upper cover 9 and the inner wall of the solder paste bucket 1 to ensure that the upper cover 9 and the inner wall of the solder paste bucket 1 can be sealed by the third sealing ring 10.

[0055] Optional, Figure 1 The tinning device shown also includes a second connector 11, through which the upper cover 9 is connected to the tin control device (the tin control device is not shown in the figure). The structure of the second connector 11 is the same as that of the first connector 4. Specifically, a threaded component is provided on the top of the upper cover 9, and the second connector 11 can be connected via the threaded component. One end of the second connector 11 is connected to the upper cover, and the other end is connected to the pipe of the tin control device. This allows for quick plugging and unplugging of the tin control device and the upper cover of the solder paste barrel 1, and also allows for control of the amount of tin applied to the solder paste. The structure of the second connector is the same as that of the first connector, allowing for quick plugging and unplugging of the pipe of the tin control device.

[0056] The above-mentioned first connector 4 is connected to the tin needle seat 3 through the connecting rod 2. The first connector 4 and the connecting rod 2 can be connected by direct plug-in quick disassembly and assembly, thereby improving the work efficiency when adding solder paste; optionally, the first connector 4 is connected by the thread on the shell of the first connector 4 and the thread of the solder paste barrel 1. This connection method is simple and can achieve a fixed connection; at the same time, when adding solder paste, the tin adding pipeline 5 can be directly inserted into the first connector 4 to achieve rapid addition of solder paste, reduce air mixing, and improve the efficiency of adding solder paste while ensuring the quality of solder paste.

[0057] The connecting rod 2 is connected to the soldering pin seat 3 via a thread. The interior of the connecting rod 2 is a hollow structure, and the soldering pin seat 3 is also a hollow structure. The connecting rod 2 can be a flexible hose or a rigid tube.

[0058] Optional, Figure 1 The tinning device shown also includes a second fixing plate 12 for fixing the solder paste bucket 1. Figure 2 As shown, the second fixing plate 12 is provided with a first through hole 121 , and the second fixing plate 12 is fixed to the first fixing plate 6 by screws; the solder paste bucket 1 is passed through the first through hole 121 and fixed to the first fixing plate 6 .

[0059] The second fixing plate 12 may have one or more first through holes 121 formed therein. The second fixing plate 12 is used to fix one or more solder paste barrels 1 on the first fixing plate 6. Specifically, the second fixing plate 12 may fix the upper portion of the solder paste barrel 1 (e.g., Figure 1As shown). In actual applications, the second fixing plate 12 for fixing the solder paste bucket 1 changes accordingly, and the second fixing plate 12 can be fixed on the first fixing plate 6 at an angle, so that the solder paste bucket 1 is fixed on the first fixing plate 6 at a preset angle. When multiple solder paste buckets 1 need to be fixed on the first fixing plate 6, multiple second fixing plates 12 can be used to fix multiple solder paste buckets 1, and multiple second fixing plates 12 can fix the solder paste buckets 1 on the same plane, or can fix the solder paste buckets 1 on different planes. The fixed position of the second fixing plate 12 on the first fixing plate 6 can be determined according to the actual soldering point position of the solder paste, that is, the soldering point position of the solder paste can be on a parallel plane, or be distributed in a three-dimensional shape. By adjusting the fixed positions of different second fixing plates 12, the soldering operation of soldering points in different positions can be achieved. Optionally, a second fixing plate 12 comprising multiple second through holes 121 can also be used to fix multiple solder paste buckets 1. For example, as shown in FIG. Figure 2 The second fixing plate 12 shown can fix the two solder paste buckets 1 .

[0060] Optional, Figure 1 The tinning device shown in the figure also includes a third fixing plate 13 for fixing the tinning needle seat 3. Figure 3 As shown, the third fixing plate 13 is provided with a second through hole 131 , and the third fixing plate 13 is fixed to the first fixing plate 6 by screws; the soldering needle holder 3 is passed through the second through hole 131 and fixed to the first fixing plate 6 .

[0061] The third fixing plate 13 may have one or more second through holes 131 formed thereon. The third fixing plate 13 is used to fix one or more tin-tip pin holders 3 on the first fixing plate 6. Specifically, the third fixing plate 13 may fix the tin-tip pin holders 3 (e.g. Figure 1 As shown). In actual applications, the third fixing plate 13 that fixes the point tin needle seat 3 changes accordingly, and the third fixing plate 13 can be fixed on the first fixing plate 6 at an angle, so that the point tin needle seat 3 is fixed on the first fixing plate 6 at an angle. When multiple point tin needle seats 3 need to be fixed on the first fixing plate 6, multiple third fixing plates 13 can be used to fix multiple point tin needle seats 3, and multiple third fixing plates 13 can fix the point tin needle seats 3 on the same plane, or can fix the tin needle seats 3 on different planes. The fixed position of each third fixing plate 13 on the first fixing plate 6 can be determined according to the actual position of the soldering point where the solder paste is applied, that is, the position of the soldering point where the solder paste is applied can be on a parallel plane, or be distributed in a three-dimensional shape. By adjusting the fixed positions of different third fixing plates 13, the tinning operation of soldering points at different positions can be achieved. Optionally, a third fixing plate 13 containing multiple second through holes 131 can also be used to fix multiple point tin needle seats 3. For example, as shown in FIG. Figure 3The third fixing plate 13 shown can fix two soldering needle holders 3. Optionally, two or more screw holes can be provided adjacent to the second through hole 131 on the third fixing plate 13 for fastening the soldering needle holders 3 passing through the second through hole 131.

[0062] In actual applications, there can be one or more tin needle seats 3, and the third fixed plate 13 for fixing the tin needle seat 3 will change accordingly. At the same time, the third fixed plate 13 can also be fixed on the first fixed plate 6 at an angle, or multiple third fixed plates 13 can be not on the same plane. Correspondingly, the number of solder paste barrels 1 is consistent with the number of tin needle seats 3, and the second fixed plate 12 for fixing the solder paste barrel 1 changes with the third fixed plate 13 for fixing the tin needle seat 3, that is, the position of the welding point for applying solder paste can be on a parallel plane, or in a three-dimensional distribution.

[0063] The second fixed plate 12 and the third fixed plate 13 can be set to a single row and single column, or a single row and multiple columns, or multiple rows and single columns, or multiple rows and multiple columns according to actual needs, and multiple solder paste buckets 1 and solder needle holders 3 can be assembled to achieve solder paste application to multiple welding positions at one time, and are not limited to a single row and single column distribution structure.

[0064] The above-mentioned tin needle seat 3 is a hollow structure. Optionally, the tin needle seat 3 includes at least one tin needle tube 31. The shapes of the tin needle tubes 31 are different, and the lengths of the tin needle tubes 31 are different. Specifically, threads are processed on the tin needle seat 3 to facilitate the connection and fixation with the connecting rod 2 through threads. There are protruding tin needle tubes 31 on the tin needle seat 3. The size of the tin needle tubes is configured according to the amount of solder paste to be applied. They can be of different sizes to ensure that the amount of solder paste applied is accurate and controllable. The number of tin needle tubes 31 is configured according to the position of the welding point, and can be one or more ( Figure 1 Two tinning needles 31 are shown in the figure. The length of the tinning needles 31 can also be different according to the location of the soldering point.

[0065] Optionally, the tin dot needle seat 3 is a cylindrical shape with a flat position, and is positioned with the flat hole (second through hole) of the third fixed plate 13 through the cylinder, and the direction is determined with the flat hole of the third fixed plate 13 through the flat position to ensure that the position of the solder paste is accurate. The tin dot needle seat 3 is fixedly connected to the third fixed plate 13 by screws, and the third fixed plate 13 is fixed to the first fixed plate 6 by screws.

[0066] Optional, Figure 1 The tinning device shown also includes a third connector 14, such as Figure 4As shown, the connecting rod 2 is connected to the soldering needle holder 3 via a third connector 14. The structure of the third connector 14 is the same as that of the first connector 4. Specifically, a threaded component is provided on the base of the soldering needle holder 3, and the third connector 14 can be fixedly connected via this threaded component. One end of the third connector 14 is connected to the connecting rod 2, and the other end is connected to the base of the soldering needle holder 3. This allows for quick disassembly of the connecting rod 2 and the soldering needle holder 3, facilitating operation and maintenance.

[0067] The tin adding pipe 5 can be a flexible hose or a rigid tube. Specifically, a connection structure similar to the connecting rod 2 can be used to achieve a sealed connection with the first connector 4. When the solder paste barrel 1 needs to be filled with solder paste, the tin adding pipe 5 can be connected to the first end of the solder paste barrel 1 (the lower part of the solder paste barrel 1 in the figure) by inserting the tin adding pipe 5 into the first connector 4. Figure 5 As shown, when the first connector 4 is connected to the tin adding pipe 5, tin paste can be added to the tin paste barrel 1 through the tin adding pipe 5, thereby realizing the addition of tin paste from the paste outlet of the tin paste barrel 1 without the need to add tin paste by opening the upper cover of the tin paste barrel 1. Moreover, since the sealing performance of the first connector 4 is very good, adding tin paste in this way can reduce the inhalation of air, thereby improving the quality of the tin paste.

[0068] In one embodiment, a structure of a first connector 4 is provided, such as Figure 6 As shown, the first connector 4 includes: a threaded head 40, a housing 41, a first sealing ring 42, a connecting ring 43, an elastic ring 44, a fixing ring 45 and a pressing ring 46; the first sealing ring 42, the connecting ring 43, the elastic ring 44, the fixing ring 45 and the pressing ring 46 are all arranged inside the housing 41, and the first sealing ring 42, the connecting ring 43, the elastic ring 44, the fixing ring 45 and the pressing ring 46 are all provided with holes of the same size, and when the connecting rod 2 is inserted into the first connector 4 through the hole, the first sealing ring 42, the connecting ring 43, the elastic ring 44, the fixing ring 45 and the pressing ring 5 and the pressing ring 46 are nested with each other and are used to fix the connecting rod 2; wherein: the threaded head 40 is connected to the head of the first end of the solder paste barrel 1 through a thread; the first sealing ring 42 is fixed in the shell 41 through the connecting ring 43 and the fixing ring 45; the elastic ring 44 is arranged between the fixing ring 45 and the pressing ring 46, when the connecting rod 2 is inserted into the first connecting head 4, the elastic ring 44 enters the recessed step portion on the connecting rod 2; when the connecting rod 2 is pulled out of the first connecting head 4, the pressing ring 46 squeezes the elastic ring 44, so that the elastic ring 44 is separated from the recessed step portion on the connecting rod 2.

[0069] Optionally, the elastic ring 44 in the above-mentioned first connector can be a component of an elastic barb structure, and one side of the elastic barb structure is an inclined surface and the other side is a plane; the end of the pressing ring 46 that contacts the inclined surface of the elastic barb structure of the elastic ring 44 is the first end of the pressing ring 46, and the first end of the pressing ring 46 is an inclined surface structure, and the inclined surface structure can be in seamless contact with the inclined surface of the elastic barb structure of the elastic ring 44; the above-mentioned fixing ring 45 can be a component of a Z-shaped structure or a component of a rectangular structure, and the end of the fixing ring 45 that contacts the plane of the elastic barb structure of the elastic ring 44 is the first end of the fixing ring 45, and the first end of the fixing ring 45 is a plane structure, and the plane structure can be in seamless contact with the plane of the elastic barb structure of the elastic ring 44; the above-mentioned elastic ring 44, pressing ring 46 and fixing ring 45 are tightly nested and fixed between the shell 41 and the connecting rod 2, and are used to fasten the connecting rod 2.

[0070] The interior of the first connector 4 is equipped with a first sealing ring 42. When the connecting rod 2 is inserted, the first sealing ring 42 and the outer circle of the connecting rod 2 cooperate to form a seal, preventing solder paste from leaking. The first sealing ring 42 is fixed to the housing 41 of the first connector 4 by a connecting ring 43 and a fixing ring 45. An elastic ring 44 is also installed inside the fixing ring 45. When the connecting rod 2 is inserted into the first connector 4, the recessed step on the connecting rod 2 allows the elastic barb structure of the elastic ring 44 to enter, thus preventing the connecting rod 2 from being removed and becoming loose. The first connector 4 is also equipped with a pressing ring 46. The inclined surface of the first end of the pressing ring 46 contacts the elastic barb structure of the elastic ring 44. When the solder paste bucket 1 needs to be removed, the pressing ring 46 is pressed. The inclined surface of the pressing ring 46 squeezes the elastic barb structure of the elastic ring 44, causing the elastic barb structure to disengage from the recessed step of the connecting rod 2. In this way, the first connector 4 of the solder paste bucket 1 can be removed from the connecting rod 2 and solder paste can be added. Optionally, the second end of the pressing ring 46 may be a protruding rectangular structure so as to be pressed, so that the inclined surface structure of the first end of the pressing ring 46 can squeeze the elastic barb structure of the elastic ring 44 .

[0071] Optionally, the structures of the first connector 4, the second connector 11, and the third connector 14 in any of the above embodiments can be as follows: Figure 6 The structure of the connector shown can realize the quick plugging and unplugging of other components and the connector, and the tube connected to the connector can be a hose made of flexible material or a hard tube made of rigid material. For example, when using the connecting rod 2 to connect the tin needle seat 3 through the third connecting head 14, the connecting rod 2 of this type can be made of flexible material, and the elastic deformation generated by the elastic ring of the third connecting head 14 can prevent the connecting rod 2 from loosening, and the outer circle of the connecting rod 2 enters the sealing ring of the third connecting head 14 without leakage. The two ends of the connecting rod 2 can also adopt a recessed step method, which is the same as the rigid connecting rod 2 connection sealing structure.

[0072] In one embodiment, in order to realize the dot coating operation at multiple locations, multiple rows and columns of solder paste barrels can be designed. Based on this, the application also provides a tin dot device, which is as follows: Figure 7 As shown, it includes multiple solder paste buckets 1, multiple connecting rods 2, multiple tin needle seats 3, multiple first connecting heads 4, at least one tin adding pipeline 5 and a first fixing plate 6.

[0073] The solder paste bucket 1 in this embodiment can be the solder paste bucket 1 described in any of the aforementioned embodiments; the connecting rod 2 in this embodiment can be the connecting rod 2 described in any of the aforementioned embodiments; the tin point needle seat 3 in this embodiment can be the tin point needle seat 3 described in any of the aforementioned embodiments; the first connecting head 4 in this embodiment can be the first connecting head 4 described in any of the aforementioned embodiments; the tin adding pipeline 5 in this embodiment can be the tin adding pipeline 5 described in any of the aforementioned embodiments; the first fixing plate 6 in this embodiment can be the first fixing plate 6 described in any of the aforementioned embodiments; for detailed descriptions of each component, please refer to the aforementioned content and will not be repeated here.

[0074] It should be noted that Figure 7 This diagram illustrates the arrangement of three solder paste buckets in a single row. In actual designs, multiple rows, multiple columns, or multiple rows, multiple columns, or multiple columns, can be implemented. In these designs, multiple solder paste buckets 1 can be secured to a first fixing plate 6. The first fixing plate 6 is provided with multiple screw holes, allowing different solder paste buckets to be secured using screws of varying lengths and positions. When the soldering machine moves the first fixing plate 6 up, down, left, and right, spot coating can be achieved at both planar and spatially distributed soldering locations.

[0075] when Figure 7 After the solder paste in the shown tinning device is used up, that is, when it is necessary to add solder paste in the solder paste barrel, the solder paste barrel to which solder paste needs to be added can be removed from the first fixed plate 6, and then the connecting rod 2 of the first connecting head 4 of the solder paste barrel 1 is pulled out, and the tin adding pipe 5 is inserted into the lower first connecting head 4 of the solder paste barrel 1 to add solder paste. The addition status of the solder paste can also be directly observed during the solder paste adding process. The solder paste squeezes the piston 7 upward under the action of pressure. When the specified amount of solder paste is added, the addition is stopped, and the pressure ring 16 of the lower first connecting head 4 is pressed. The inclined structure of the pressure ring 16 pushes the elastic hook part of the elastic ring 44, so that the elastic hook part is separated from the recessed step or the flexible material is not used to restore elastic deformation. At this time, the tin adding pipe 5 is pulled out from the lower connecting head 4 of the solder paste barrel 1, and then the solder paste barrel 1 is fixed on the first fixed plate 6, and the first connecting head 4 at the bottom of the solder paste barrel 1 is inserted into the connecting rod 2 to complete the addition of solder paste.

[0076] In summary, the above Figure 1-Figure 7The tinning device described in any embodiment has the following advantages: 1. The material of the exterior of the solder paste barrel is a transparent material with high pressure resistance, and there is no need to cover the exterior with a metal pressure-resistant shell, which has a simple structure and low cost. 2. The solder paste barrel adopts a transparent material, so the state of the solder paste can be directly observed at any time, the quality of the solder paste can be monitored, and the solder paste can be controlled. 3. The connector at the bottom of the solder paste barrel and the connector on the upper cover are connected to the outside using a plug-in quick connection method, which can achieve quick disassembly, and the solder paste barrel is not covered with a metal pressure-resistant shell, which makes the entire device simple in structure and easy and quick to maintain. 4. When adding solder paste, you only need to pull out the lower connector of the solder paste barrel from the connecting rod, and then insert the tin adding pipe into the lower connector of the solder paste barrel to add solder paste. With the piston that matches the shape of the solder paste barrel, it can not only achieve rapid addition of solder paste, but also ensure that the quality of the added solder paste is not affected, and ensure the stability and consistency of welding quality.

[0077] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A tinning device, characterized in that: The tinning device comprises: a solder paste bucket, a connecting rod, a tinning needle seat, a first connector, a tin adding pipeline and a first fixing plate; The solder paste bucket is fixed to the first fixing plate at a preset angle, and the first fixing plate is installed on the soldering machine; the first end of the solder paste bucket is connected to the first end of the connecting rod through the first connecting head, and the second end of the connecting rod is connected to the base of the soldering needle holder; the second end of the solder paste bucket is connected to the solder control device; The tin adding pipe is used to add tin paste to the tin paste barrel, and is connected to the first end of the tin paste barrel by being inserted into the first connector; The first connector includes a housing, an elastic ring, a fixed ring, and a pressure ring, wherein the elastic ring, the fixed ring, and the pressure ring are all arranged inside the housing; the elastic ring is an elastic barb structure, and the first end of the pressure ring is an inclined surface structure, and the inclined surface structure contacts the inclined surface of the elastic barb structure of the elastic ring, and the plane of the elastic barb structure of the elastic ring contacts the side plane of the first end of the fixed ring; The elastic ring is arranged between the fixing ring and the pressing ring. When the connecting rod is inserted into the first connecting head, the elastic ring enters the recessed step portion on the connecting rod; when the connecting rod is pulled out of the first connecting head, the pressing ring squeezes the elastic ring to make the elastic ring disengage from the recessed step portion on the connecting rod.

2. The tinning device according to claim 1, characterized in that: The barrel wall of the solder paste barrel where the solder paste is placed is made of transparent material.

3. The tinning device according to claim 1 or 2, characterized in that: The first connector further comprises: a threaded head, a first sealing ring and a connecting ring; the first sealing ring and the connecting ring are both arranged inside the housing, and the first sealing ring, the connecting ring, the elastic ring, the fixing ring and the pressing ring are all provided with holes of the same size inside, and when the connecting rod is inserted into the first connector through the holes, the first sealing ring, the connecting ring, the elastic ring, the fixing ring and the pressing ring are used to fix the connecting rod; wherein: The threaded head is connected to the head of the first end of the solder paste barrel through a thread; The first sealing ring is fixed in the housing through the connecting ring and the fixing ring.

4. The tinning device according to claim 3, characterized in that: The side plane of the second end of the fixing ring contacts the side plane of the structure between the first end and the second end of the pressure ring; the first end of the fixing ring and the first end of the elastic ring are both connected to the first end of the connecting ring, and the second end of the connecting ring is connected to the first end of the first sealing ring.

5. The tinning device according to claim 1, characterized in that: The tinning device further includes: a second fixing plate, a first through hole is provided on the second fixing plate, and the second fixing plate is fixed to the first fixing plate by screws; the solder paste bucket is passed through the first through hole and fixed to the first fixing plate.

6. The tinning device according to claim 1, characterized in that: The tinning device further includes: a third fixing plate, a second through hole is defined on the third fixing plate, and the third fixing plate is fixed to the first fixing plate by screws; the tinning needle holder is passed through the second through hole and fixed to the first fixing plate.

7. The tinning device according to claim 1, characterized in that: The connecting rod is a hollow structure.

8. The tinning device according to claim 1, characterized in that: The solder paste barrel includes a piston, and the shape of the plug portion of the piston is adapted to the shape of the inner wall of the portion of the solder paste barrel where the solder paste is placed.

9. The tinning device according to claim 8, characterized in that: The solder paste barrel includes a second sealing ring, which is arranged between the piston and the inner wall of the solder paste barrel.

10. The tinning device according to claim 1, characterized in that: The tinning device further includes an upper cover, which is used to cover the second end of the solder paste bucket.

11. The tinning device according to claim 10, characterized in that: The tinning device further includes: a third sealing ring, which is arranged between the upper cover and the inner wall of the solder paste barrel.

12. The tinning device according to claim 10 or 11, characterized in that: The tinning device further includes a second connector, through which the upper cover is connected to the tinning control device, and the structure of the second connector is the same as that of the first connector.

13. The tinning device according to claim 1, characterized in that: The tin-dotting needle seat includes at least one tin-dotting needle tube.

14. The tinning device according to claim 13, characterized in that: The shapes and / or lengths of the tin-dotting needle tubes are different.

15. The tinning device according to claim 1 or 14, characterized in that: The tinning device further includes a third connecting head, through which the connecting rod is connected to the tinning needle seat, and the structure of the third connecting head is the same as that of the first connecting head.

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