Heat dissipation capacitor

Abstract

The present invention provides a heat dissipation capacitor, which includes a body, a mounting housing, and a semiconductor refrigeration component. A cleaning housing is provided on the outer wall of the mounting housing. A first pipeline with a communicating inner cavity is provided between the cleaning housing and the mounting housing. A water removal mechanism is provided in the cleaning housing. The water removal mechanism includes a fan for guiding the air flow around the body. The water removal mechanism also has an adsorption function for adsorbing water vapor in the flowing air. The beneficial effects of the present invention are as follows: The water removal mechanism provided can adsorb the water vapor in the air around the body. When the semiconductor refrigeration component is working, it can prevent the water vapor in the air from condensing on the semiconductor refrigeration component, that is, it can ensure that the surrounding of the body remains in a dry environment, prevent damage to the body caused by the accumulation of water vapor, and greatly improve the overall service life.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitors, and in particular to heat dissipation capacitors. Background Art

[0002] A capacitor, that is, two conductors close to each other with a non-conductive insulating medium sandwiched in the middle, constitutes a capacitor. When a voltage is applied between the two plates of the capacitor, the capacitor will store charge. The capacitance of the capacitor is numerically equal to the ratio of the charge amount on one conductive plate to the voltage between the two plates. The basic unit of the capacitance of the capacitor is the farad. In a circuit diagram, the capacitance element is usually represented by the letter C.

[0003] During the use of the capacitor, multiple groups of capacitors are combined together to form a large capacitor for convenient use in special environments. When multiple groups of capacitors are used in combination, due to the internal operation of the capacitor, a large amount of heat will accumulate, and heat dissipation treatment needs to be carried out on multiple groups of capacitors.

[0004] Semiconductor refrigeration, since it does not require any refrigerant, can work continuously, has no pollution source, no rotating parts, will not produce a gyroscopic effect, and has no sliding parts. It is a solid sheet. When working, it has no vibration, no noise, a long service life, and is easy to install. In the heat dissipation process of the capacitor, semiconductor refrigeration heat dissipation has developed into a relatively mature technology. However, when using a semiconductor for refrigeration, since the refrigeration end of the semiconductor refrigeration component will drive the surrounding temperature to drop rapidly, the water vapor in the air around the capacitor will condense on the semiconductor refrigeration component, resulting in a large amount of water vapor accumulation. When the water vapor condenses into water droplets, it will cause damage to the capacitor, seriously affecting the service life of the capacitor. Summary of the Invention

[0005] The present invention provides a heat dissipation capacitor in view of the deficiencies of the prior art.

[0006] The present invention solves the above technical problems through the following technical means:

[0007] The heat dissipation capacitor includes a body, a mounting housing, and a semiconductor refrigeration component. The semiconductor refrigeration component is fixedly arranged in the inner cavity of the mounting housing. The body is connected to the mounting housing and is always arranged below the semiconductor refrigeration component.

[0008] A cleaning housing is arranged on the outer wall of the mounting housing. A first pipeline with a communicating inner cavity is arranged between the cleaning housing and the mounting housing. A water removal mechanism is arranged in the cleaning housing. The water removal mechanism includes a fan for guiding the air flow around the body, and the water removal mechanism also has an adsorption function for adsorbing the water vapor in the flowing air.

[0009] As an improvement to the above technical solution, multiple groups of the main bodies are provided, and multiple groups of main bodies are all arranged below the semiconductor refrigeration component. The pin components of multiple groups of the main bodies extend to the outside of the installation shell; the semiconductor refrigeration component is connected to the pins of the main body.

[0010] As an improvement to the above technical solution, the water removal mechanism includes a fixed pipe and a water absorption layer. The fixed pipe is fixedly arranged in the inner cavity of the cleaning shell. The fan is fixedly arranged in the fixed pipe for guiding air flow. An annular groove is arranged on the inner wall of the fixed pipe, and the water absorption layer is fixedly arranged in the groove in an annular shape.

[0011] As an improvement to the above technical solution, a heat conduction rod is further arranged on the fixed pipe, and the heat conduction rod penetrates into the installation shell.

[0012] As an improvement to the above technical solution, the semiconductor refrigeration component divides the installation shell into a first flow cavity that is in communication and a second flow cavity that is airtight. The main body is always arranged in the second flow cavity, and the second flow cavity is filled with inert gas.

[0013] As an improvement to the above technical solution, a second pipeline is arranged on the first flow cavity. A three-way joint is arranged between the second pipeline and the first pipeline, and a solenoid valve is arranged on the first pipeline.

[0014] Advantages of the present invention:

[0015] 1. The water removal mechanism provided can adsorb the water vapor in the air around the main body. When the semiconductor refrigeration component is working, it can prevent the water vapor in the air from condensing on the semiconductor refrigeration component, that is, it can ensure that the surrounding of the main body remains in a dry environment, and can prevent the main body from being damaged due to the accumulation of water vapor, greatly improving the overall service life.

[0016] 2. The water removal mechanism provided can disturb the air around the main body. When the semiconductor refrigeration component is working, it can make the air around the main body cool evenly, so as to prevent heat accumulation in a certain place around the main body, and can effectively improve the heat dissipation effect of the semiconductor refrigeration component. Brief Description of the Drawings

[0017] Figure 1 It is a connection schematic diagram of the cleaning shell and the installation shell in the embodiment of the present invention;

[0018] Figure 2 It is a structural schematic diagram of the water removal mechanism in the embodiment of the present invention;

[0019] Figure 3 It is a connection schematic diagram of the first pipeline and the second pipeline in the embodiment of the present invention.

[0020] In the figure: 10. Installation housing; 11. First flow chamber; 12. Second flow chamber; 20. Semiconductor refrigeration module; 30. Body; 40. First pipeline; 50. Cleaning housing; 60. Dew removal mechanism; 61. Fixed pipeline; 62. Water absorption layer; 63. Heat conduction rod; 64. Fan; 70. Three-way joint; 80. Solenoid valve; 90. Second pipeline. Detailed implementation mode

[0021] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time.

[0023] Embodiment 1:

[0024] As Figure 1 、 Figure 2 and Figure 3 shown, the heat dissipation capacitor in this embodiment includes a body 30, an installation housing 10 and a semiconductor refrigeration module 20. The semiconductor refrigeration module 20 is fixedly arranged in the inner cavity of the installation housing 10. The body 30 is connected to the installation housing 10 and the body 30 is always arranged below the semiconductor refrigeration module 20;

[0025] A cleaning housing 50 is arranged on the outer wall of the installation housing 10. A first pipeline 40 with a communicating inner cavity is arranged between the cleaning housing 50 and the installation housing 10. A dew removal mechanism 60 is arranged in the cleaning housing 50. The dew removal mechanism 60 includes a fan 64 for guiding the air flow around the body 30. The dew removal mechanism 60 also has an adsorption function for adsorbing the water vapor in the flowing air.

[0026] In this embodiment, multiple groups of the bodies 30 are arranged, and multiple groups of the bodies 30 are all arranged below the semiconductor refrigeration module 20. The pin components of multiple groups of the bodies 30 extend to the outside of the installation housing 10. The semiconductor refrigeration module 20 is connected to the pins of the body 30 so that the semiconductor refrigeration module 20 and the body 30 work simultaneously.

[0027] When the main body 30 is working, the semiconductor refrigeration component 20 works along with the operation of the main body 30 for refrigeration. Meanwhile, the water removal mechanism 60 works, driving the air flow inside the installation housing 10, so that the air around the main body 30 enters the cleaning housing 50 and is adsorbed by the water removal mechanism 60.

[0028] Through the arranged water removal mechanism 60, the water vapor in the air around the main body 30 can be adsorbed. When the semiconductor refrigeration component 20 is working, it can prevent the water vapor in the air from condensing on the semiconductor refrigeration component 20. That is, it can ensure that the surrounding of the main body 30 is kept in a dry environment, prevent the main body 30 from being damaged due to the accumulation of water vapor, and greatly improve the overall service life.

[0029] Through the arranged water removal mechanism 60, the air around the main body 30 can be disturbed. When the semiconductor refrigeration component 20 is working, it can make the air around the main body 30 cool down evenly, so as to prevent heat accumulation at a certain place around the main body 30 and effectively improve the heat dissipation effect of the semiconductor refrigeration component 20.

[0030] As Figure 2 shown, the water removal mechanism 60 includes a fixed pipe 61 and a water absorption layer 62. The fixed pipe 61 is fixedly arranged in the inner cavity of the cleaning housing 50. The fan 64 is fixedly arranged in the fixed pipe 61 for guiding the air flow. An annular groove is arranged on the inner wall of the fixed pipe 61, and the water absorption layer 62 is fixedly arranged in the groove in an annular shape.

[0031] When adsorbing the water vapor in the air, the fan 64 works. The fan 64 sucks the air around the main body 30, making the air enter the fixed pipe 61, and then adsorbing it through the water absorption layer 62. At the same time, when the fan 64 rotates, it can block the water vapor in the air, making the water vapor adhere to the fan blades of the fan 64, and then under the action of centrifugal force, making the water vapor move towards the water absorption layer 62 for adsorption.

[0032] Through the cooperation between the arranged fan 64 and the water absorption layer 62, the air around the main body 30 can be made to flow and the water vapor in the air can be adsorbed, so as to prevent the water vapor from condensing on the semiconductor refrigeration component 20 and causing overall damage.

[0033] As Figure 2 shown, a heat conduction rod 63 is also arranged on the fixed pipe 61. The heat conduction rod 63 penetrates into the installation housing 10 for transferring heat.

[0034] When adsorbing water vapor, the relatively cold temperature around the main body 30 can be guided to the position of the fan 64, making the temperature around the fan 64 drop, so as to facilitate the rapid condensation and adhesion of water vapor on the fan 64 and improve the water removal efficiency.

[0035] Example 2:

[0036] Different from the previous Example 1, please refer to Figure 1 and Figure 2 , the semiconductor refrigeration component 20 divides the installation housing 10 into a flowing first flow cavity 11 and a sealed second flow cavity 12. The body 30 is always arranged in the second flow cavity 12, and the second flow cavity 12 is filled with inert gas.

[0037] By setting inert gas instead of oxygen, it can prevent oxidation reactions of the body 30 and the semiconductor refrigeration component 20, causing damage, and can effectively improve the overall service life.

[0038] Example 3:

[0039] Different from the previous Example 1 and Example 2, as Figure 3 shown, a second pipeline 90 is arranged on the first flow cavity 11. A three-way joint 70 is arranged between the second pipeline 90 and the first pipeline 40, and a solenoid valve 80 is arranged on the first pipeline 40.

[0040] In this embodiment, no inert gas is arranged in the second flow cavity 12.

[0041] When the semiconductor refrigeration component 20 is working, when the heat dissipation of the hot end of the semiconductor refrigeration component 20 is not smooth, the solenoid valve 80 is opened, and the hot end of the semiconductor refrigeration component 20 can be dissipated by the flowing and relatively low-temperature air, so as to improve the refrigeration efficiency and service life of the semiconductor refrigeration component 20.

[0042] It should be noted that in this article, if there are relational terms such as first and second, they are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0043] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A heat dissipation capacitor, characterized in that: It includes a main body (30), an installation housing (10), and a semiconductor refrigeration component (20). The semiconductor refrigeration component (20) is fixedly arranged in the inner cavity of the installation housing (10). The main body (30) is connected to the installation housing (10), and the main body (30) is always arranged below the semiconductor refrigeration component (20); A cleaning housing (50) is arranged on the outer wall of the installation housing (10). A first pipeline (40) with a connected inner cavity is arranged between the cleaning housing (50) and the installation housing (10). A water removal mechanism (60) is arranged in the cleaning housing (50). The water removal mechanism (60) includes a fan (64) for guiding the air flow around the main body (30). The water removal mechanism (60) also has an adsorption function for adsorbing water vapor in the flowing air; The water removal mechanism (60) includes a fixed pipeline (61) and a water absorption layer (62). The fixed pipeline (61) is fixedly arranged in the inner cavity of the cleaning housing (50). The fan (64) is fixedly arranged in the fixed pipeline (61) for guiding the air flow. An annular groove is arranged on the inner wall of the fixed pipeline (61). The water absorption layer (62) is fixedly arranged in the groove in an annular shape.

2. The heat dissipation capacitor according to claim 1, wherein: Multiple groups of the main bodies (30) are arranged, and multiple groups of the main bodies (30) are all arranged below the semiconductor refrigeration component (20). The pin components of multiple groups of the main bodies (30) extend to the outside of the installation housing (10). The semiconductor refrigeration component (20) is connected to the pins of the main body (30).

3. The heat dissipation capacitor according to claim 1, wherein: A heat conduction rod (63) is also arranged on the fixed pipeline (61), and the heat conduction rod (63) penetrates into the installation housing (10).

4. The heat dissipation capacitor according to claim 1, wherein: The semiconductor refrigeration component (20) divides the installation housing (10) into a flowing first flow cavity (11) and a closed second flow cavity (12). The main body (30) is always arranged in the second flow cavity (12), and the second flow cavity (12) is filled with an inert gas.

5. The heat dissipation capacitor according to claim 4, characterized in that: A second pipeline (90) is arranged on the first flow cavity (11). A three-way joint (70) is arranged between the second pipeline (90) and the first pipeline (40). An electromagnetic valve (80) is arranged on the first pipeline (40).

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