Semiconductor devices

Abstract

The object is to provide a semiconductor device that can easily identify the model name of a product and suppress the mis-loading on a substrate. The semiconductor device (100) comprises: a package (1) that packages a semiconductor element; a lead frame (2) whose one end is connected to the semiconductor element and whose other end protrudes from the side of the package (1); a plurality of screw holes (3) formed in the package (1) so that the package (1) can be fixed to the substrate; and a resin part (7) that can block the plurality of screw holes (3). The model name of the semiconductor device (100) is indicated by the open and closed state of each screw hole (3).

Description

Technical Field

[0001] The present invention relates to a semiconductor device. Background Art

[0002] In conventional semiconductor devices, there is a technology in which, after a plurality of holes are formed in a package, the upper ends of the holes are blocked by a thin resin portion, the thin resin portion is broken according to the results of an electrical characteristics test, and the level of the results of the electrical characteristics test is displayed by the opening and closing states of the individual holes (for example, refer to Patent Document 1).

[0003] Patent Document 1: Japanese Utility Model Publication No. 63-55546

[0004] However, in the technology described in Patent Document 1, since the model name of the product cannot be identified by the open or closed state of each hole, there is a problem that, even if the model names are different but the levels of the results of the electrical characteristics test are the same, semiconductor devices of other models may be mistakenly mounted on the substrate. Summary of the invention

[0005] Therefore, an object of the present invention is to provide a semiconductor device that can easily identify the model name of a product and suppress erroneous mounting on a substrate.

[0006] The semiconductor device involved in the present invention is mounted on a substrate, and comprises: a package that packages a semiconductor element; a lead frame, one end of which is connected to the semiconductor element and the other end of which protrudes from the side of the package; a plurality of screw holes formed in the package so that the package can be fixed to the substrate; and a resin portion that can block the plurality of screw holes, and the model name of the semiconductor device is represented by the open and closed states of each of the screw holes.

[0007] Effects of the Invention

[0008] According to the present invention, since the model name of a product can be easily identified using the open and closed states of each screw hole formed in the package, it is possible to suppress erroneous mounting of a semiconductor device on a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a top view of the semiconductor device according to the first embodiment.

[0010] Figure 2 This is a front view of the semiconductor device according to the first embodiment in a state where it is turned upside down.

[0011] Figure 3 This is an enlarged plan view of the periphery of a screw hole of a package included in the semiconductor device according to the second embodiment.

[0012] Figure 4 It is a front view of the semiconductor device according to the third embodiment in a state where it is turned upside down. DETAILED DESCRIPTION

[0013] <Implementation method 1>

[0014] Hereinafter, Embodiment 1 will be described using the drawings. Figure 1 1 is a plan view of the semiconductor device 100 according to the first embodiment. Figure 2 It is a front view of the semiconductor device 100 in a state where it is turned upside down.

[0015] like Figure 1 As shown, the semiconductor device 100 includes a package 1 , a plurality of lead frames 2 , a plurality of screw holes 3 , and at least one resin portion 7 .

[0016] The package 1 is rectangular in a plan view and packages a semiconductor element (not shown) and an internal circuit (not shown). The package 1 is formed of a thermosetting resin such as an epoxy resin. One end of a plurality of lead frames 2 is connected to the semiconductor element inside the package 1. The other end of the plurality of lead frames 2 protrudes from the side of the package 1 and is connected to an external circuit (not shown).

[0017] The plurality of screw holes 3 are through holes through which screws (not shown) can be inserted in order to fix the package 1 to the substrate when the semiconductor device 100 is mounted on the substrate (not shown). The plurality of screw holes 3 are formed at the front and rear ends of the package 1. Specifically, the plurality of screw holes 3 are in a shape that is recessed inward from the front and rear ends of the package 1. Figure 1 Although four screw holes 3 are shown in the figure, the present invention is not limited thereto, and the number of screw holes 3 only needs to be greater than or equal to two.

[0018] The resin portion 7 is formed to be the same size as the screw hole 3 when viewed from above so that the screw hole 3 can be blocked. The resin portion 7 is formed of a thermosetting resin such as an epoxy resin. By providing the resin portion 7 in each screw hole 3, each screw hole 3 is closed. In addition, the model name of the product, i.e., the semiconductor device 100, is indicated by the open and closed state of each screw hole 3. Specifically, the model name of the semiconductor device 100 is set by the combination of the open and closed states of each screw hole 3. That is, the combination of the open and closed states of each screw hole 3 is different depending on the model name of the semiconductor device 100.

[0019] The resin portion 7 is provided in advance in all the screw holes 3 formed in the package 1 , and the resin portion 7 provided in the specific screw hole 3 is removed in a subsequent process according to the model name of the semiconductor device 100 , thereby forming a combination of the open and closed states of each screw hole 3 .

[0020] Screw holes corresponding to the screw holes 3 of the semiconductor device 100 are formed at the mounting portion of the substrate for the semiconductor device 100. The screw holes of the substrate are formed at positions corresponding to the screw holes 3 of the semiconductor device 100 in the open state.

[0021] When a semiconductor device 100 whose model name matches the model name of the semiconductor device 100 mounted on the substrate is arranged on the substrate, screw fastening can be performed because the screw holes of the substrate match the screw holes 3 of the semiconductor device 100 in the open state. On the other hand, when a semiconductor device 100 of another model is mistakenly arranged on the substrate, screw fastening cannot be performed because the screw holes of the substrate do not match the screw holes 3 of the semiconductor device 100 in the open state. Thus, it is possible to suppress the semiconductor device 100 from being mistakenly mounted on the substrate.

[0022] like Figure 2 As shown, the resin portion 7 has a thickness thinner than that of the package 1 and is formed at the upper end of the screw hole 3. Specifically, the thickness of the resin portion 7 is a thickness that can be punched by a simple tool such as pliers, and is less than or equal to 2 mm. More preferably, the thickness of the resin portion 7 is less than or equal to 1 mm, and further preferably, the thickness of the resin portion 7 is less than or equal to 0.5 mm.

[0023] As described above, the semiconductor device 100 involved in embodiment 1 includes: a package 1, which packages a semiconductor element; a lead frame 2, one end of which is connected to the semiconductor element and the other end protrudes from the side of the package 1; a plurality of screw holes 3, which are formed in the package 1 in a manner that can fix the package 1 to the substrate; and a resin portion 7, which can block the plurality of screw holes 3, and the model name of the semiconductor device 100 is represented by the open and closed states of each screw hole 3.

[0024] Therefore, the model name of the semiconductor device 100 can be easily identified by using the open / closed state of each screw hole 3 formed in the package 1 , and thus, it is possible to suppress erroneous mounting of the semiconductor device 100 on the substrate.

[0025] Furthermore, since the model name of the semiconductor device 100 can be identified using the screw holes 3 used when the semiconductor device 100 is fixed to the substrate, it is not necessary to drill additional holes, and it is possible to suppress an increase in the manufacturing cost of the semiconductor device 100 .

[0026] In addition, the resin portion 7 is thinner than the package 1, so when the resin portion 7 provided in the specific screw hole 3 is removed in a subsequent process according to the model name of the semiconductor device 100, a simple tool such as pliers can be used for perforation. Thus, the production efficiency of the semiconductor device 100 can be improved.

[0027] <Implementation method 2>

[0028] Next, a semiconductor device 200 according to the second embodiment will be described. Figure 3 It is an enlarged plan view of the periphery of the screw hole 3 of the package 1 included in the semiconductor device 200 according to the second embodiment. In the second embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

[0029] like Figure 3 As shown, in the second embodiment, the semiconductor device 200 includes a package 1 , a plurality of lead frames 2 , a plurality of screw holes 3 , and at least one resin portion 17 .

[0030] The resin portion 17 is formed to have substantially the same size as the screw hole 3 in a plan view so as to be able to block the screw hole 3. The resin portion 17 is formed of a thermosetting resin such as an epoxy resin.

[0031] The resin portion 17 has a thickness thinner than that of the package 1 and is formed at the upper end of the screw hole 3. In addition, the resin portion 17 is connected to the screw hole 3 via, for example, three connecting portions 17a formed of a thermosetting resin such as epoxy resin. The width of the connecting portion 17a is thinner than the width of the resin portion 17 when viewed from above, so it can be cut with a simple tool such as pliers. In addition, the number of connecting portions 17a is not limited to three, as long as it is greater than or equal to one.

[0032] As described above, in the semiconductor device 200 according to the second embodiment, since the resin portion 17 is connected to the screw hole 3 via the connection portion 17a, the connection portion 17a can be cut off with a simple tool such as pliers to remove the resin portion 17 and perform drilling. This can improve the production efficiency of the semiconductor device 200.

[0033] In addition, the ease of removing the resin portion 17 is not affected by the thickness of the resin portion 17. Therefore, compared with the case of embodiment 1, the durability of the resin portion 17 can be improved by increasing the thickness of the resin portion 17, thereby suppressing unexpected perforation of the screw hole 3 caused by falling or impact.

[0034] <Implementation method 3>

[0035] Next, a semiconductor device 300 according to a third embodiment will be described. Figure 4 It is a front view of a semiconductor device 300 according to Embodiment 3 which is turned upside down. In Embodiment 3, the same components as those described in Embodiments 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

[0036] like Figure 4As shown, in the third embodiment, the semiconductor device 300 includes a package 1 , a plurality of lead frames 2 , a plurality of screw holes 3 , and at least one resin portion 27 .

[0037] The resin portion 27 is formed to have the same size as the screw hole 3 in a plan view so as to be able to block the screw hole 3. The resin portion 27 is formed of a thermosetting resin such as epoxy resin.

[0038] The resin portion 27 is provided in all the screw holes 3, and blocks the screw holes 3 by extending downward from the screw holes 3. In addition, the resin portion 27 protrudes to a height position that can abut against the upper surface of the substrate when the semiconductor device 300 is mounted on the substrate. Therefore, it is necessary to provide a recess (omitted from the figure) or a hole (omitted from the figure) into which the resin portion 27 can be inserted at a position corresponding to the resin portion 27 on the substrate.

[0039] When a semiconductor device 300 whose model name matches the model name of the semiconductor device 300 mounted on the substrate is to be arranged on the substrate, the recess or hole of the substrate matches the resin portion 27 of the semiconductor device 300, and therefore, the semiconductor device 300 can be arranged on the substrate by inserting the resin portion 27 into the recess or hole. On the other hand, when another model of semiconductor device 300 is to be arranged on the substrate by mistake, the semiconductor device 300 cannot be arranged on the substrate because the recess or hole of the substrate does not match the resin portion 27 of the semiconductor device 300. Thus, it is possible to suppress the semiconductor device 300 from being incorrectly mounted on the substrate.

[0040] Here, the length of the portion of the resin portion 27 protruding from the lower surface of the package 1 only needs to be greater than or equal to 1 mm, more preferably greater than or equal to 3 mm, and even more preferably greater than or equal to 5 mm.

[0041] As described above, in the semiconductor device 300 according to the third embodiment, the resin portion 27 protrudes downward from the screw hole 3. Therefore, even if a semiconductor device of another model is to be arranged on the substrate, it cannot be arranged because the lower end of the resin portion 27 abuts against the upper surface of the substrate. By combining this function with a function of identifying the model name of the semiconductor device 100 using the open and closed state of each screw hole 3, it is possible to further suppress the semiconductor device 300 from being incorrectly mounted on the substrate.

[0042] In addition, the various embodiments can be freely combined, or the various embodiments can be appropriately modified or omitted.

[0043] Description of the label

[0044] 1 package, 2 lead frame, 3 screw hole, 7, 17, 27 resin portion, 17a connection portion, 100, 200, 300 semiconductor device.

Claims

1. A semiconductor device mounted on a substrate, The semiconductor device has: a package that packages a semiconductor element; a lead frame, one end of which is connected to the semiconductor element and the other end of which protrudes from a side surface of the package; a plurality of screw holes formed in the package to enable the package to be fixed to the substrate; as well as The resin portion can block the plurality of screw holes. At least one of the screw holes is in an open state, The screw hole blocked by the resin portion can be observed from the outside of the package, The bottom surface of the resin portion is offset from the bottom surface of the package, The model name of the semiconductor device is represented by the open / closed state of each of the screw holes.

2. The semiconductor device according to claim 1, wherein The resin portion has a thickness thinner than a thickness of the package.

3. The semiconductor device according to claim 2, wherein: The resin portion is connected to the screw hole via a connecting portion.

4. The semiconductor device according to claim 1, wherein The resin portion protrudes downward from the screw hole.

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