A vibration energy harvesting friction nanogenerator structure that can be mass-processed

By designing a standardized friction nanogenerator structure, including multiple power generation units and integrated power management PCB, the existing TENG has solved the problem of high cost and unstable yield rate when preparing vibration energy harvesting devices on a large scale, and realizes batch processing of low-cost and high yield rate.

CN114499270BActive Publication Date: 2025-04-25XI AN JIAOTONG UNIV +1
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Patent Information

Application Number
CN202111434166.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-11-29
Publication Date
2025-04-25
Estimated Expiration
2041-11-29

AI Technical Summary

Technical Problem

When existing friction nanogenerators (TENGs) are prepared on a large scale, it is difficult to achieve standardized batch processing, resulting in high costs and unstable yield.

Method used

A friction nanogenerator structure including a PCB base plate and several power generation units is designed. Each power generation unit consists of a bottom electrode layer, a dielectric layer, a movable metal layer, a mass block, an upper frame, an upper cover plate and a power management PCB, and adopts a standardized batch processing process.

Benefits of technology

Standardized batch processing of friction nanogenerators is realized, which reduces the integrated processing and packaging costs of the same batch, and ensures the similar yield rate of the same batch.

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Abstract

The present invention discloses a vibration energy harvesting friction nanogenerator structure that can be processed in batches, including a PCB bottom plate and a plurality of power generation units arranged on the PCB bottom plate, in each power generation unit, a lower frame is arranged on the PCB bottom plate, a bottom electrode layer is arranged on the PCB bottom plate and located on the inner side of the lower frame; a dielectric layer is arranged on the bottom electrode layer and filled in the lower frame; a fixed part of a movable metal layer is connected to a movable part, a lower side surface of the fixed part is connected to an upper side surface of the lower frame, a lower side surface of the upper frame is connected to an upper side surface of the fixed part, a mass block is arranged on the movable part and located in the upper frame, and an upper cover plate is encapsulated on the upper side surface of the upper frame; a power management PCB is arranged on the PCB bottom plate and located on the outer side of the lower frame, the bottom electrode layer and the movable metal layer both have lead-out electrodes, and the lead-out electrodes of the bottom electrode layer and the movable metal layer are connected to the power management PCB. The present invention will greatly promote the standardization, industrialization and practical application of vibration energy harvesting friction nanogenerator devices.
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Description

Technical Field

[0001] The present invention belongs to the technical field of new energy devices, and in particular relates to a vibration energy harvesting friction nanogenerator structure that can be processed in batches. Background Art

[0002] The triboelectric nanogenerator (TENG) uses displacement current as a driving force to convert mechanical energy into electrical energy, which has made great contributions to micro-nano energy harvesting, self-powered systems and sustainable development of energy. Vibration energy harvesting provides a sustainable self-powered solution for sensors that monitor the human body and mechanical equipment. The TENG structure that generates electricity by contact classification is very suitable for collecting vibration energy. The TENG movable structure resonates under environmental excitation, and the dielectric layer and the metal layer contact and separate after collision. It generates electricity by friction electrification and electrostatic induction. The generated AC charge can drive micro-nano electronic devices such as sensors and actuators after power management such as rectification and energy storage. Compared with electromagnetic generators and piezoelectric generators, TENG has the advantages of high output voltage, flexible structure, rich preparation materials and low cost for vibration energy harvesting. In recent years, TENG-related research has set off a boom in terms of mechanism analysis, structural design, preparation process, power management, self-powered applications, etc. The current hot application areas of TENG include wearable energy harvesting, self-driven sensing and interactive systems, blue energy, etc. The research on TENG for vibration energy harvesting is in its infancy. Most studies use manual processing of individual prototypes. In order to prepare TENG vibration energy harvesting devices on a large scale, it is necessary to study the application of integrated micro-nano processing and packaging technology to prepare batch TENG vibration energy harvesters. Summary of the invention

[0003] In order to solve the above problems, the present invention proposes a vibration energy harvesting friction nanogenerator structure that can be mass-processed. The friction nanogenerator structure of the present invention enables standardized mass processing, which can further reduce the integrated processing and packaging costs of the same batch of friction nanogenerators, and ensure a similar yield rate in the same batch.

[0004] The present invention has the following beneficial effects:

[0005] A vibration energy harvesting friction nanogenerator structure that can be processed in batches, including a PCB base plate and a plurality of power generation units arranged on the PCB base plate, each power generation unit including a bottom electrode layer, a dielectric layer, a lower frame, a movable metal layer, a mass block, an upper frame, an upper cover plate and a power management PCB;

[0006] In each power generation unit, the lower frame is arranged on the PCB bottom plate, and the bottom electrode layer is arranged on the PCB bottom plate and located inside the lower frame;

[0007] The dielectric layer is disposed on the bottom electrode layer and filled in the lower frame;

[0008] The movable metal layer has a fixed part and a movable part, the fixed part and the movable part are connected, the lower side of the fixed part of the movable metal layer is connected to the upper side of the lower frame, the lower side of the upper frame is connected to the upper side of the fixed part of the movable metal layer, the mass block is arranged on the movable part of the movable metal layer and is located in the upper frame, and the upper cover plate is encapsulated on the upper side of the upper frame;

[0009] The power management PCB is arranged on the PCB bottom plate and is located outside the lower frame. The bottom electrode layer and the movable metal layer both have lead-out electrodes, and the lead-out electrodes of the bottom electrode layer and the movable metal layer are connected to the power management PCB.

[0010] Preferably, the movable part and the fixed part are connected via a plurality of elastic structures, and the plurality of elastic structures are evenly distributed around the circumference of the movable part.

[0011] Preferably, the movable metal layer is provided with a first L-shaped gap, a second L-shaped gap, a third L-shaped gap and a fourth L-shaped gap for dividing the movable metal layer into a fixed part and a movable part;

[0012] The area inside the first L-shaped gap, the second L-shaped gap, the third L-shaped gap and the fourth L-shaped gap as a whole is a movable part, and the area outside the first L-shaped gap, the second L-shaped gap, the third L-shaped gap and the fourth L-shaped gap as a whole is a fixed part;

[0013] The first side of the second L-shaped gap is located inside the first side of the first L-shaped gap, and the first side of the second L-shaped gap is parallel to the first side of the first L-shaped gap and is separated by a preset distance; the first side of the third L-shaped gap is located inside the second side of the second L-shaped gap, and the first side of the third L-shaped gap is parallel to the second side of the second L-shaped gap and is separated by a preset distance; the second side of the third L-shaped gap is located outside the first side of the fourth L-shaped gap, and the second side of the third L-shaped gap is parallel to the first side of the fourth L-shaped gap and is separated by a preset distance; the second side of the fourth L-shaped gap is located inside the second side of the first L-shaped gap, and the second side of the third L-shaped gap is parallel to the first side of the fourth L-shaped gap and is separated by a preset distance; the second side of the fourth L-shaped gap is located inside the first L-shaped gap, and the first .... Outside the second side, the second side of the fourth L-shaped gap is parallel to the second side of the first L-shaped gap and is at a preset distance; the area between the first side of the first L-shaped gap and the first side of the second L-shaped gap serves as an elastic structure, the area between the second side of the second L-shaped gap and the first side of the third L-shaped gap serves as an elastic structure, the area between the second side of the third L-shaped gap and the first side of the fourth L-shaped gap serves as an elastic structure, and the area between the second side of the fourth L-shaped gap and the second side of the first L-shaped gap serves as an elastic structure.

[0014] Preferably, the lead-out electrode of the bottom electrode layer extends from between the lower frame and the PCB bottom plate to the outside of the lower frame.

[0015] Preferably, the lead-out electrode of the movable metal layer is connected to the fixing portion, and the lead-out electrode of the movable metal layer extends from between the lower frame and the upper frame to the outside of the lower frame and the upper frame.

[0016] Preferably, the lead-out electrodes of the bottom electrode layer and the lead-out electrodes of the movable metal layer are staggered at different levels.

[0017] The method for preparing the vibration energy harvesting friction nanogenerator structure that can be processed in batches as described above in the present invention comprises the following steps:

[0018] S1, electroplating the bottom electrode layer on the PCB bottom plate;

[0019] S2, bonding the lower frame to the PCB bottom plate;

[0020] S3, using the frame below as a mold, spin-coating the dielectric layer onto the bottom electrode layer;

[0021] S4, bonding the fixed portion of the movable metal layer to the lower frame, wherein the movable portion is located above the area enclosed by the lower frame;

[0022] S5, the mass block is bonded to the movable part of the movable metal layer;

[0023] S6, bonding the upper frame to the fixed portion of the movable metal layer;

[0024] S7, bonding the upper cover plate to the upper frame;

[0025] S8, soldering the power management PCB to the PCB bottom plate and connecting it to the bottom electrode layer and the lead-out electrodes of the movable metal layer.

[0026] Preferably, the movable metal layer is patterned by laser cutting technology; the lower frame is patterned by laser cutting technology; the upper frame is patterned by laser cutting technology; and the upper cover plate is patterned by laser cutting technology.

[0027] Preferably, the vibration energy harvesting friction nanogenerator structure that can be processed in batches is divided into independent vibration energy harvesting friction nanogenerators by mechanically cutting the PCB bottom plate.

[0028] The present invention has the following beneficial effects:

[0029] In the vibration energy harvesting friction nanogenerator structure that can be processed in batches, the movable metal layer has a fixed part and a movable part, and the mass block is arranged on the movable part of the movable metal layer and is located in the upper frame. Therefore, the mass block and the movable metal layer act as resonant devices, and have low resonant frequency and stable parallel vibration contact separation friction power generation in a small volume. In the design stage, the size of the movable metal layer can be controlled to adjust the resonant frequency, and the thickness of the mass block 6 can be changed in the assembly stage to adjust the resonant frequency. During resonance, the collision between the movable part of the movable metal layer and the dielectric layer has a nonlinear frequency extension effect, and can resonate in a wide range to achieve energy collection with the maximum amplitude. The vibration energy harvesting chip and the power management circuit are packaged on the same substrate, which has the advantage of integration. The proposed vibration energy harvesting friction nanogenerator structure has a standardized batch processing technology, and the integrated processing and packaging of the same batch reduces the cost and can ensure a similar yield rate of the same batch. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of a single device of the vibration energy harvesting friction nanogenerator structure that can be processed in batches according to the present invention;

[0031] Figure 2 It is an exploded schematic diagram of the assembly of a single device of the vibration energy harvesting friction nanogenerator structure that can be processed in batches according to the present invention;

[0032] Figure 3 It is a top view schematic diagram of a 2×2 full-row structure that can be processed in batches in an embodiment of the present invention;

[0033] Figure 4 It is a schematic front view of a 2×2 full-row structure that can be processed in batches in an embodiment of the present invention;

[0034] Figure 5 A schematic structural diagram of a movable metal layer in an embodiment of the present invention.

[0035] In the accompanying drawings: 1. PCB base plate, 2. bottom electrode layer, 2-1. first lead electrode, 3. dielectric layer, 4. lower frame, 5. movable metal layer, 5-1. first L-shaped gap, 5-2. second L-shaped gap, 5-3. third L-shaped gap, 5-4. fourth L-shaped gap, 5-5. second lead electrode, 5-6. fixed part, 5-7. movable part, 6. mass block, 7. upper frame, 8. upper cover, 9. power management PCB. DETAILED DESCRIPTION

[0036] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are described based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientation structure and operation, and therefore should not be understood as a limitation on the present invention.

[0038] Reference Figures 1 to 4 The vibration energy harvesting friction nanogenerator structure that can be processed in batches of the present invention comprises a PCB bottom plate 1 and a plurality of power generation units arranged on the PCB bottom plate 1, each power generation unit comprises a bottom electrode layer 2, a dielectric layer 3, a lower frame 4, a movable metal layer 5, a mass block 6, an upper frame 7, an upper cover plate 8 and a power management PCB 9; in each power generation unit, the lower frame 4 is arranged on the PCB bottom plate 1, the bottom electrode layer 2 is arranged on the PCB bottom plate 1 and is located on the inner side of the lower frame 4; the dielectric layer 3 is arranged on the bottom electrode layer 2 and filled in the lower frame 4; the movable metal layer 5 has a fixing portion 5- 6 and the movable part 5-7, the fixed part 5-6 and the movable part 5-7 are connected, the lower side surface of the fixed part of the movable metal layer 5 is connected to the upper side surface of the lower frame 4, the lower side surface of the upper frame 7 is connected to the upper side surface of the fixed part of the movable metal layer 5, the mass block 6 is arranged on the movable part of the movable metal layer 5 and is located in the upper frame 7, and the upper cover plate 8 is encapsulated on the upper side surface of the upper frame 7; the power management PCB 9 is arranged on the PCB bottom plate 1 and is located on the outer side of the lower frame 4, the bottom electrode layer 2 and the movable metal layer 5 both have lead-out electrodes, and the lead-out electrodes of the bottom electrode layer 2 and the movable metal layer 5 are connected to the power management PCB 9.

[0039] As a preferred embodiment of the present invention, refer to Figure 2 and Figure 5 The movable part 5-7 and the fixed part 5-6 are connected by a plurality of elastic structures, and the plurality of elastic structures are evenly distributed around the movable part 5-7.

[0040] As a preferred embodiment of the present invention, refer to Figure 5, the movable metal layer 5 adopts a U-shaped four-beam structure, and its structure is as follows: the movable metal layer 5 is provided with a first L-shaped gap 5-1, a second L-shaped gap 5-2, a third L-shaped gap 5-3 and a fourth L-shaped gap 5-2 for dividing the movable metal layer 5 into a fixed part 5-6 and a movable part 5-7; the area inside the first L-shaped gap 5-1, the second L-shaped gap 5-2, the third L-shaped gap 5-3 and the fourth L-shaped gap 5-2 as a whole is the movable part 5-7, and the area outside the first L-shaped gap 5-1, the second L-shaped gap 5-2, the third L-shaped gap 5-3 and the fourth L-shaped gap 5-2 as a whole is the fixed part 5-6; the first side ( Figure 5 The upper side shown) is located at the first side of the first L-shaped gap 5-1 ( Figure 5 The first side of the second L-shaped slot 5-2 is parallel to the first side of the first L-shaped slot 5-1 and is at a preset distance from the first side of the third L-shaped slot 5-3. Figure 5 The right side shown in the figure) is located at the second side of the second L-shaped gap 5-2 ( Figure 5 The first side of the third L-shaped slot 5-3 is parallel to the second side of the second L-shaped slot 5-2 and is at a preset distance from the second side of the third L-shaped slot 5-3. Figure 5 The lower side shown) is located at the first side of the fourth L-shaped gap 5-2 ( Figure 5 The second side of the third L-shaped slot 5-3 is parallel to the first side of the fourth L-shaped slot 5-2 and is at a preset distance from the second side of the fourth L-shaped slot 5-2. Figure 5 The left side shown) is located at the second side of the first L-shaped gap 5-1 ( Figure 5 The outer side of the fourth L-shaped gap 5-2 is parallel to the second side of the first L-shaped gap 5-1 and is at a preset distance; the area between the first side of the first L-shaped gap 5-1 and the first side of the second L-shaped gap 5-2 serves as an elastic structure (the structure is a beam), the area between the second side of the second L-shaped gap 5-2 and the first side of the third L-shaped gap 5-3 serves as an elastic structure, the area between the second side of the third L-shaped gap 5-3 and the first side of the fourth L-shaped gap 5-2 serves as an elastic structure, and the area between the second side of the fourth L-shaped gap 5-2 and the second side of the first L-shaped gap 5-1 serves as an elastic structure.

[0041] As a preferred embodiment of the present invention, refer to Figures 1 to 4 The lead-out electrode of the bottom electrode layer 2 extends from between the lower frame 4 and the PCB bottom plate 1 to the outside of the lower frame 4 .

[0042] As a preferred embodiment of the present invention, refer to Figures 1 to 4The lead-out electrode of the movable metal layer 5 is connected to the fixed part 5 - 6 , and the lead-out electrode of the movable metal layer 5 extends from between the lower frame 4 and the upper frame 7 to the outside of the lower frame 4 and the upper frame 7 .

[0043] As a preferred embodiment of the present invention, the lead-out electrodes of the bottom electrode layer 2 and the lead-out electrodes of the movable metal layer 5 are staggered at different levels.

[0044] The method for preparing the vibration energy harvesting friction nanogenerator structure that can be processed in batches as described above in the present invention comprises the following steps:

[0045] S1, electroplating a bottom electrode layer 2 on a PCB bottom plate 1;

[0046] S2, bonding the lower frame 4 to the PCB base plate 1;

[0047] S3, using the lower frame 4 as a mold, spin-coating the dielectric layer 3 onto the bottom electrode layer 2;

[0048] S4, bonding the fixed portion 5-6 of the movable metal layer 5 to the lower frame 4, and the movable portion 5-7 is located above the area surrounded by the lower frame 4;

[0049] S5, the mass block 6 is bonded to the movable portion 5-7 of the movable metal layer 5;

[0050] S6, bonding the upper frame 7 to the fixed portion 5-6 of the movable metal layer 5;

[0051] S7, bonding the upper cover plate 8 to the upper frame 7;

[0052] S8 , soldering the power management PCB 9 onto the PCB bottom plate 1 and connecting it to the bottom electrode layer 2 and the lead-out electrodes of the movable metal layer 5 .

[0053] As a preferred embodiment of the present invention, the movable metal layer 5 is patterned by laser cutting technology; the lower frame 4 is patterned by laser cutting technology; the upper frame 7 is patterned by laser cutting technology; and the upper cover plate 8 is patterned by laser cutting technology.

[0054] As a preferred embodiment of the present invention, the vibration energy harvesting friction nanogenerator structure that can be processed in batches is divided into independent vibration energy harvesting friction nanogenerators by mechanically cutting the PCB bottom plate 1.

[0055] Example

[0056] like Figure 1 to Figure 3 As shown, in this embodiment,

[0057] This embodiment adopts the method of laminating and bonding after each layer is patterned, and the packaged TENG vibration energy harvester chip and power management circuit are integrated on the PCB substrate. The entire PCB substrate can form a multi-device array, and a large number of TENG vibration energy harvester devices can be released after cutting. The proposed vibration energy harvesting friction nanogenerator structure has a standardized batch processing technology. The integrated processing and packaging of the same batch reduces the cost and can ensure a similar yield rate of the same batch. The specific technical solution is as follows:

[0058] In the vibration energy harvesting friction nanogenerator structure that can be mass-processed in this embodiment, the bottom electrode layer 2 is electroplated on the PCB base plate 1, the lower frame 4 is bonded to the PCB base plate 1, the dielectric layer 3 is spin-coated on the bottom electrode layer 2 using the lower frame 4 as a mold, the movable metal layer 5 is bonded to the lower frame 4, the mass block 6 is bonded to the movable metal layer 5, the upper frame 7 is bonded to the movable metal layer 5, the upper cover plate 8 is bonded to the upper frame 7, and the power management PCB 9 is welded to the PCB base plate 1.

[0059] In this embodiment, the movable metal layer 5 adopts the above-mentioned U-shaped four-beam structure. The movable metal layer 5 of the U-shaped four-beam structure and the additional mass block 6 are used as resonant devices. During the resonance process, the length of the four-beam structure is relatively long, and its first-order resonant frequency is relatively low after the additional mass is added, and the first-order resonant mode is far away from the other modal vibration modes, which can ensure the stable parallel vibration contact separation friction power generation between the movable metal layer and the dielectric layer. In the design stage, the size of the movable metal layer 5 can be controlled to adjust the resonant frequency, and the thickness of the mass block 6 can be changed in the assembly stage to adjust the resonant frequency. During resonance, the collision between the movable metal layer 5 and the dielectric layer 3 has a nonlinear frequency extension effect, and can resonate in a wide range to achieve energy collection with the maximum amplitude. The movable metal layer 5, the upper frame 7, the lower frame 4 and the cover plate 8 are all patterned by laser cutting technology. The movable metal layer 5 is patterned and processed, and each layer is bonded by bonding technology to form a package of an array chip structure. The lead-out electrode of the movable metal layer 5 and the lead-out electrode of the bottom electrode layer on the PCB bottom plate are staggered at different levels on the left and right, and can be jumped to the input end of the power management PCB 9 through a jumper. The chip and the power management form a vibration energy harvesting device, which is separated by mechanical cutting to form an independent device. It can be seen from the above scheme that in the vibration energy harvesting friction nanogenerator structure that can be mass-processed in this embodiment, the movable metal layer 5 and the additional mass block 6 of the U-shaped four-beam structure serve as resonant devices, which have low resonant frequency and stable parallel vibration contact separation friction power generation in a small volume. The vibration energy harvesting chip and the power management circuit of this embodiment are packaged on the same substrate, which has the advantage of integration. The proposed vibration energy harvesting friction nanogenerator structure has a standardized mass processing technology, and the integrated processing and packaging of the same batch reduces the cost and can ensure a similar yield rate in the same batch. The present invention will greatly promote the standardization, industrialization and practical application of vibration energy harvesting friction nanogenerator devices.

Claims

1. A vibration energy harvesting friction nanogenerator structure that can be processed in batches, characterized in that: It comprises a PCB bottom plate (1) and a plurality of power generation units arranged on the PCB bottom plate (1), each power generation unit comprising a bottom electrode layer (2), a dielectric layer (3), a lower frame (4), a movable metal layer (5), a mass block (6), an upper frame (7), an upper cover plate (8) and a power management PCB (9); In each power generation unit, a lower frame (4) is arranged on the PCB bottom plate (1), and a bottom electrode layer (2) is arranged on the PCB bottom plate (1) and is located inside the lower frame (4); The dielectric layer (3) is arranged on the bottom electrode layer (2) and filled in the lower frame (4); The movable metal layer (5) comprises a fixed part (5-6) and a movable part (5-7), the fixed part (5-6) and the movable part (5-7) are connected, the lower side surface of the fixed part of the movable metal layer (5) is connected to the upper side surface of the lower frame (4), the lower side surface of the upper frame (7) is connected to the upper side surface of the fixed part of the movable metal layer (5), the mass block (6) is arranged on the movable part of the movable metal layer (5) and is located in the upper frame (7), and the upper cover plate (8) is encapsulated on the upper side surface of the upper frame (7); The power management PCB (9) is arranged on the PCB bottom plate (1) and is located outside the lower frame (4); the bottom electrode layer (2) and the movable metal layer (5) both have lead-out electrodes; and the lead-out electrodes of the bottom electrode layer (2) and the movable metal layer (5) are connected to the power management PCB (9).

2. The vibration energy harvesting friction nanogenerator structure that can be processed in batches according to claim 1 is characterized in that: The movable part (5-7) and the fixed part (5-6) are connected via a plurality of elastic structures, and the plurality of elastic structures are evenly distributed in the circumference of the movable part (5-7).

3. The vibration energy harvesting friction nanogenerator structure that can be mass-processed according to claim 2 is characterized in that: The movable metal layer (5) is provided with a first L-shaped gap (5-1), a second L-shaped gap (5-2), a third L-shaped gap (5-3) and a fourth L-shaped gap (5-4) for dividing the movable metal layer (5) into a fixed part (5-6) and a movable part (5-7); The area inside the first L-shaped gap (5-1), the second L-shaped gap (5-2), the third L-shaped gap (5-3) and the fourth L-shaped gap (5-4) as a whole is a movable part (5-7), and the area outside the first L-shaped gap (5-1), the second L-shaped gap (5-2), the third L-shaped gap (5-3) and the fourth L-shaped gap (5-4) as a whole is a fixed part (5-6); The first side of the second L-shaped slit (5-2) is located inside the first side of the first L-shaped slit (5-1), the first side of the second L-shaped slit (5-2) is parallel to the first side of the first L-shaped slit (5-1) and is separated by a preset distance; the first side of the third L-shaped slit (5-3) is located inside the second side of the second L-shaped slit (5-2), the first side of the third L-shaped slit (5-3) is parallel to the second side of the second L-shaped slit (5-2) and is separated by a preset distance; the second side of the third L-shaped slit (5-3) is located outside the first side of the fourth L-shaped slit (5-4), the second side of the third L-shaped slit (5-3) is parallel to the first side of the fourth L-shaped slit (5-4) and is separated by a preset distance; the second side of the fourth L-shaped slit (5-4) is located inside the second side of the second L-shaped slit (5-2), the first side of the third L-shaped slit (5-3) is parallel to the first side of the fourth L-shaped slit (5-4) and is separated by a preset distance; the second side of the fourth L-shaped slit (5-4) is located inside the second side of the third L-shaped slit (5-3), the first side of the third L-shaped slit (5-3) is parallel to the first side of the fourth L-shaped slit (5-4) and is separated by a preset distance; the second side of the third L-shaped slit (5-4) is located inside the second side of the third L-shaped slit (5-4), the first side of the third L-shaped slit (5-3) is parallel to the first side of the fourth L-shaped slit (5-4) and is separated by a preset distance; the second side of the third L-shaped slit (5-4) is located The second side of the fourth L-shaped gap (5-4) is parallel to the second side of the first L-shaped gap (5-1) and is at a preset distance from the second side of the first L-shaped gap (5-1); the area between the first side of the first L-shaped gap (5-1) and the first side of the second L-shaped gap (5-2) serves as an elastic structure; the area between the second side of the second L-shaped gap (5-2) and the first side of the third L-shaped gap (5-3) serves as an elastic structure; the area between the second side of the third L-shaped gap (5-3) and the first side of the fourth L-shaped gap (5-4) serves as an elastic structure; and the area between the second side of the fourth L-shaped gap (5-4) and the second side of the first L-shaped gap (5-1) serves as an elastic structure.

4. The vibration energy harvesting friction nanogenerator structure that can be processed in batches according to claim 1 is characterized in that: The lead-out electrode of the bottom electrode layer (2) extends from between the lower frame (4) and the PCB bottom plate (1) to the outside of the lower frame (4).

5. The vibration energy harvesting friction nanogenerator structure that can be processed in batches according to claim 1 is characterized in that: The lead-out electrode of the movable metal layer (5) is connected to the fixed part (5-6), and the lead-out electrode of the movable metal layer (5) extends from between the lower frame (4) and the upper frame (7) to the outside of the lower frame (4) and the upper frame (7).

6. A vibration energy harvesting friction nanogenerator structure capable of mass processing according to claim 1 / 4 or 5, characterized in that: The lead-out electrodes of the bottom electrode layer (2) and the lead-out electrodes of the movable metal layer (5) are staggered at different levels.

7. The method for preparing a vibration energy harvesting friction nanogenerator structure capable of being processed in batches according to any one of claims 1 to 6, characterized in that: The steps include: S1, electroplating a bottom electrode layer (2) on a PCB bottom plate (1); S2, bonding the lower frame (4) to the PCB bottom plate (1); S3, using the lower frame (4) as a mold, spin-coating the dielectric layer (3) onto the bottom electrode layer (2); S4, bonding the fixed portion (5-6) of the movable metal layer (5) to the lower frame (4), wherein the movable portion (5-7) is located above the area enclosed by the lower frame (4); S5, the mass block (6) is bonded to the movable part (5-7) of the movable metal layer (5); S6, bonding the upper frame (7) to the fixed portion (5-6) of the movable metal layer (5); S7, bonding the upper cover plate (8) to the upper frame (7); S8, soldering the power management PCB (9) onto the PCB bottom plate (1) and connecting it to the bottom electrode layer (2) and the lead-out electrodes of the movable metal layer (5).

8. The method for preparing a vibration energy harvesting friction nanogenerator structure capable of being processed in batches according to claim 7, characterized in that: The movable metal layer (5) is patterned by laser cutting technology; the lower frame (4) is patterned by laser cutting technology; the upper frame (7) is patterned by laser cutting technology; and the upper cover plate (8) is patterned by laser cutting technology.

9. The method for preparing a vibration energy harvesting friction nanogenerator structure capable of being processed in batches according to claim 7, characterized in that: By mechanically cutting the PCB bottom plate (1), the vibration energy harvesting friction nanogenerator structure that can be processed in batches is divided into independent vibration energy harvesting friction nanogenerators.

Citation Information

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