Electronic device housing and method of manufacturing an electronic device housing

Abstract

The present application provides an electronic device shell, comprising a shell frame and a composite board. The shell frame is a pre-injection molded plastic structure. The shell frame comprises a support frame. The composite board is adhered to the support frame. The support frame comprises a frame body and a support bracket. The support bracket extends inwardly from the frame body. The frame body is located on one side of the composite board. The support bracket is located below the composite board. The bottom surface of the composite board is adhered to the support bracket. The electronic device shell provided by the present application avoids the deformation of the electronic device shell caused by the shrinkage of the shell frame after molding by using an adhesive layer to adhere the composite board to the pre-injection molded shell frame. The present application also provides an electronic device shell manufacturing method.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic device shell and a manufacturing method thereof. BACKGROUND

[0002] With the rapid development of computer technology and mobile communication technology, various intelligent mobile electronic devices such as notebook computers, tablet computers, mobile phones and the like are widely used. At the same time, consumers' requirements for the portability of mobile electronic devices are gradually increasing. As a result, the lightweight technology of various mobile electronic devices has been developed. The current electronic device shell usually uses a structure combining carbon fiber plate and plastic material, such as wrapping the edge of the carbon fiber plate with plastic material, thereby reducing the weight of the shell and increasing the impact strength of the shell. However, the carbon fiber plate and the plastic material are directly combined by in-mold forming, and the shrinkage of the formed plastic material is large, while the carbon fiber plate does not shrink, which will cause the deformation of the shell structure and affect the appearance of the shell. SUMMARY

[0003] Therefore, the present application aims to provide an electronic device shell and a manufacturing method thereof to solve the technical problem of shell structure deformation caused by shrinkage of the formed plastic material.

[0004] The present application provides an electronic device shell. The electronic device shell comprises a shell frame and a composite plate. The shell frame is a pre-injection molded plastic structure. The shell frame comprises a support frame. The composite plate is adhered to the support frame. The support frame comprises a frame body and a support bracket. The support bracket extends inwardly from the frame body. The frame body is located on one side of the composite plate. The support bracket is located below the composite plate. The bottom surface of the composite plate is adhered to the support bracket.

[0005] Optionally, the composite plate is adhered to the support bracket by a glue layer. The material of the glue layer is epoxy glue or A / B glue. The thickness of the glue layer ranges from 0.05 to 0.2 mm. The width of the glue layer ranges from 1 to 50 mm.

[0006] Optionally, the side of the support bracket and the bottom surface of the composite plate to which the glue layer is adhered is provided with a slot. The glue layer is filled in the slot. The frame body extends in the vertical direction. The support bracket extends in the horizontal direction. There is a gap between the composite plate and the frame body in the horizontal direction.

[0007] Optionally, the electronic device shell further comprises a filling block. The filling block is filled in the gap to integrate the composite plate and the frame body.

[0008] Optionally, the width ratio of the filling block to the composite plate ranges from 1:500 to 1:50.

[0009] Optionally, a step is provided for setting a step in the cross section of the gap near the support frame.

[0010] Optionally, the frame body comprises four frame body components located at four sides and connected to each other, the support frame comprises four support frame components located at four sides and connected to each other, and the bottom surface of the composite board is adhered to the four support frame components of the support frame correspondingly.

[0011] The present application also provides an electronic device shell manufacturing method. The electronic device shell manufacturing method comprises: pre-injection molding a shell frame, the shell frame comprising a support frame and a frame body, the support frame extending inwardly from the frame body; performing shrinkage treatment on the pre-injection molded shell frame; and adhering a bottom surface of a composite board to the support frame of the shell frame in a vertical direction.

[0012] Optionally, between the step of performing shrinkage treatment on the pre-injection molded shell frame and the step of adhering the bottom surface of the composite board to the support frame of the shell frame in a vertical direction, the electronic device shell manufacturing method further comprises: providing a gap between the composite board and the frame body of the shell frame in a horizontal direction. After the step of adhering the bottom surface of the composite board to the support frame of the shell frame in a vertical direction, the electronic device shell manufacturing method further comprises: filling a filler block in the gap to integrate the composite board and the frame body.

[0013] Optionally, the step of filling a filler block in the gap to integrate the composite board and the frame body specifically comprises: filling a filler block in the gap by an injection molding process or a dispensing process to integrate the composite board and the frame body.

[0014] The electronic device shell and the electronic device shell manufacturing method provided by the present application can adhere the composite board to the pre-injection molded shell frame by using the adhesive layer, thereby avoiding the deformation of the electronic device shell caused by the shrinkage of the shell frame after molding. The electronic device shell provided by the present application is provided with a slot on the shell frame for filling the adhesive layer, thereby calibrating the adhesion size of the adhesive layer and ensuring the adhesion effect. The electronic device shell provided by the present application is further provided with a gap between the composite board and the shell frame in a horizontal direction, and a filler block is filled in the gap, thereby more effectively preventing the deformation of the shell and achieving the flatness of the shell. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present application, but not limit the present application.

[0016] Figure 1 A structural schematic diagram of an electronic device shell according to an embodiment of the present application is provided.

[0017] Figure 2 A structural schematic diagram of an electronic device shell according to an embodiment of the present application is provided. Figure 1 A sectional view of the electronic device shell according to the embodiment is provided.

[0018] Figure 3 A structural schematic diagram of an electronic device shell according to an embodiment of the present application is provided.

[0019] Figure 4 A structural schematic diagram of an electronic device shell according to an embodiment of the present application is provided.

[0020] Figure 5 A structural schematic diagram of an electronic device shell according to an embodiment of the present application is provided.

[0021] Figure 6 A flowchart of a manufacturing method of an electronic device shell according to an embodiment of the present application is provided. DETAILED DESCRIPTION

[0022] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the described embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the protection scope of the present application.

[0023] Referring to Figure 1 and Figure 2 , an electronic device shell 900 according to an embodiment of the present application is provided. The electronic device shell 900 comprises a composite board 100, a shell frame 200 and a glue layer 300. The composite board 100 is adhered to the shell frame 200 through the glue layer 300 to form the electronic device shell 900 with stable structure. In the embodiment, the composite board 100 is a carbon fiber board with high tensile strength. The shell frame 200 is made of plastic material, which is light in weight and has plasticity, and is easy to be shaped. The electronic device shell 900 formed by the combination of the composite board 100 and the shell frame 200 is light in weight and has the effect of buffering and damping. The material of the glue layer 300 is epoxy glue or A / B glue. The shell frame 200 is pre-injection molded and shrunk, and then is bonded to the composite board 100 through the glue layer 300, so that the electronic device shell 900 formed thereby is stable in structure and is not easy to be deformed.

[0024] Referring to Figure 1 and Figure 2The shell frame 200 comprises four supporting frames 210. The four supporting frames 210 are connected to each other and jointly surround the shell frame 200. The composite panel 100 is adhered to the supporting frames 210. The four supporting frames 210 jointly comprise four frame bodies 211 and four corresponding supporting frames 212. In the embodiment, the frame body 211 comprises four frame body components located at four sides and connected to each other, and the supporting frame 212 comprises four supporting frame components located at four sides and connected to each other. The frame body 211 and the supporting frame 212 are integrally formed plastic structures. The frame body 211 is higher than the supporting frame 212 in the vertical direction and is located outside the supporting frame 212 in the horizontal direction. The frame body 211 wraps the edge of the composite panel 100 in the horizontal direction, and the supporting frame 212 supports the edge of the composite panel 100 in the vertical direction, so as to enhance the impact resistance of the edge of the composite panel 100. The four supporting frame components extend to the inner side of the shell frame 200, respectively. The bottom surface 110 of the composite panel 100 is adhered to the four supporting frame components of the supporting frame 212 correspondingly.

[0025] Referring to Figure 2 The side of the supporting frame 212 adhered to the composite panel 100 has a rectangular slot 2121, and the adhesive layer 300 is filled in the slot 2121. The thickness H of the adhesive layer 300 ranges from 0.05 mm to 0.2 mm. If the thickness H of the adhesive layer 300 is less than 0.05 mm, the amount of glue will be insufficient, and the composite panel 100 cannot be stably adhered to the shell frame 200. If the thickness H of the adhesive layer 300 is greater than 0.2 mm, the glue will overflow, the electronic device shell 900 will be uneven, and the appearance of the electronic device shell 900 will be affected. The width W of the adhesive layer 300 ranges from 1 mm to 50 mm. If the width W of the adhesive layer 300 is less than 1 mm, the amount of glue will be insufficient, and the adhesion strength of the composite panel 100 and the shell frame 200 will be low. If the width W of the adhesive layer 300 is greater than 50 mm, the glue will overflow, the electronic device shell 900 will be uneven, and the appearance of the electronic device shell 900 will be affected. In the embodiment, the cross-sectional shape of the slot 2121 is rectangular. In other embodiments, the cross-sectional shape of the slot 2121 can also be other shapes, such as trapezoidal.

[0026] Referring to Figure 2The electronic device housing 900 further comprises the filling block 400. The composite board 100 and the frame 211 have a gap 500 in the horizontal direction. The lower end surface of the gap 500 is flush with the bottom surface 110 of the composite board. The filling block 400 fills in the gap 500 to integrate the composite board 100 and the frame 211, thereby increasing the sealing property of the electronic device housing 900. The filling block 400 is made of plastic material or glue material, i.e. epoxy glue or A / B glue, which is the same as the adhesive layer 300. The filling block 400 made of plastic material is formed by the in-mold injection molding process to fill in the gap 500. The filling block 400 made of glue material is filled in the gap 500 by the dispensing process. The width ratio of the filling block 400 to the composite board 100 ranges from 1:500 to 1:50. In the embodiment, the cross-sectional shape of the gap 500 is rectangular, which can simplify the processing procedure and facilitate the filling block 400 to completely fill in the gap 500.

[0027] Referring to Figure 3 Another embodiment of the present application provides a partial cross-sectional structure diagram of an electronic device housing 800. The electronic device housing 800 comprises a composite board 810, a housing frame 820, an adhesive layer 830 and a filling block 840. The composite board 810 is adhered to the housing frame 820 by the adhesive layer 830. The housing frame 820 comprises a frame 821 in the horizontal direction and a support 822 in the vertical direction. The bottom surface 811 of the composite board 810 is adhered to the support 822. The composite board 810 and the frame 821 have a gap 850 in the horizontal direction. The lower end surface of the gap 850 is flush with the bottom surface 811 of the composite board. The filling block 840 fills in the gap 850. In the embodiment, the cross-sectional shape of the gap 850 is trapezoidal, which can increase the bonding force between the composite board 810 and the frame 821. Since the opening width of the gap 850 is smaller than the internal opening width, the filling block 840 is not easy to be pulled out after filling in the gap 850.

[0028] Referring to Figure 4Another embodiment of the present application provides a partial cross-sectional structure diagram of an electronic device housing 700. The electronic device housing 700 comprises a composite board 710, a housing frame 720, a glue layer 730, and a filling block 740. The composite board 710 is adhered to the housing frame 720 through the glue layer 730. The housing frame 720 comprises a frame 721 in the horizontal direction and a support frame 722 in the vertical direction. The bottom surface 711 of the composite board 710 is adhered to the support frame 722. The composite board 710 and the frame 721 have a gap 750 in the horizontal direction. The filling block 740 fills the gap 750 to integrate the composite board 710 and the frame 721. The electronic device housing 700 of the present embodiment is different from the electronic device housing 900 of the previous embodiment in that the lower end surface of the gap 750 is at least partially embedded in the support frame 722, so as to further increase the bonding force between the housing frame 720 and the composite board 710, and to make the electronic device housing 700 stable in structure and not easy to deform.

[0029] Referring to Figure 5 Another embodiment of the present application provides a partial cross-sectional structure diagram of an electronic device housing 600. The electronic device housing 600 comprises a composite board 610, a housing frame 620, a glue layer 630, and a filling block 640. The composite board 610 is adhered to the housing frame 620 through the glue layer 630. The housing frame 620 comprises a frame 621 in the horizontal direction and a support frame 622 in the vertical direction. The bottom surface 611 of the composite board 610 is adhered to the support frame 622. The composite board 610 and the frame 621 have a gap 650 in the horizontal direction. The filling block 640 fills the gap 650 to integrate the composite board 610 and the frame 621. The electronic device housing 600 of the present embodiment is different from the electronic device housing 800 of the previous embodiment in that the lower end surface of the gap 650 is at least partially embedded in the support frame 622, so as to further increase the bonding force between the housing frame 620 and the composite board 610, and to make the electronic device housing 600 stable in structure and not easy to deform.

[0030] Referring to Figure 6 An embodiment of the present application provides a manufacturing method of an electronic device housing, which comprises the following steps 902-910.

[0031] In step 902, a housing frame is pre-injection molded. The housing frame comprises a support frame and a frame, and the support frame extends inward from the frame. In the present embodiment, the housing frame is pre-injection molded by an injection molding process, so as to have the properties of light weight and plasticity. In the specific product structure, the frame is higher than the support frame in the vertical direction and is located outside the support frame in the horizontal direction. One side of the support frame is provided with a slot.

[0032] In step 904, the pre-injection molded housing frame is subjected to shrinkage treatment.

[0033] Step 906, a gap is provided between the composite plate and the frame of the shell in horizontal direction.

[0034] Step 908, the bottom surface of the composite plate is adhered to the support frame of the shell in vertical direction. An adhesive layer is filled in the slot of the support frame to adhere the support frame and the bottom surface of the composite plate together. The material of the adhesive layer is epoxy or A / B glue, the thickness of the adhesive layer ranges from 0.05mm to 0.2mm, and the width of the adhesive layer ranges from 1mm to 50mm.

[0035] Step 910, a filling block is filled in the gap to integrate the composite plate and the frame. The ratio of the width of the filling block to the composite plate ranges from 1:500 to 1:50.

[0036] The electronic device shell and the manufacturing method thereof provided by the present application can adhere the composite plate to the pre-injection molded shell frame by using the adhesive layer, so as to avoid the deformation of the electronic device shell caused by the shrinkage of the shell frame after the molding. The electronic device shell of the present application provides a slot on the shell frame for filling the adhesive layer, so as to calibrate the adhesion size of the adhesive layer and ensure the adhesion effect. The electronic device shell of the present application further provides a gap between the composite plate and the shell frame in horizontal direction, and fills a filling block in the gap, so as to more effectively prevent the deformation of the shell and achieve the flatness of the shell.

[0037] Although the description and drawings of the embodiments of the present application have been given, those skilled in the art should understand that the description and drawings of the embodiments do not constitute a limitation on the scope of the present application, and various forms and details of the present application can be changed without exceeding the concept and scope of the present application. Therefore, the scope of the present disclosure is not limited to the above embodiments, but should be determined by the claims and the equivalents of the claims.

Claims

1. An electronic device housing, characterized by, The electronic device shell comprises a shell frame and a composite plate, the shell frame is a pre-injection molded plastic structure, the shell frame comprises a supporting frame, the composite plate is adhered to the supporting frame, the supporting frame comprises a frame body and a supporting frame, the frame body and the supporting frame are integrally formed plastic structures, the frame body is higher than the supporting frame in the vertical direction and is located outside the supporting frame in the horizontal direction, the supporting frame extends inward from the frame body, the frame body is located on one side of the composite plate, the supporting frame is located below the composite plate, the bottom surface of the composite plate is adhered to the supporting frame, the composite plate is adhered to the supporting frame through an adhesive layer, the material of the adhesive layer is epoxy or A / B glue, the thickness of the adhesive layer is 0.05-0.2mm, the width of the adhesive layer is 1-50mm, the supporting frame and the side of the composite plate adhered to the bottom surface are provided with a slot, the adhesive layer is filled in the slot, the frame body extends in the vertical direction, the supporting frame extends in the horizontal direction, the composite plate and the frame body have a gap in the horizontal direction, the electronic device shell further comprises a filling block, the filling block is filled in the gap to integrate the composite plate and the frame body, the width ratio of the filling block to the composite plate is 1:500-1:

50.

2. An electronic device housing as defined in claim 1, wherein The cross section of the gap is provided with a step near the supporting frame.

3. An electronic device housing as defined in claim 2, wherein The frame body comprises four frame body assemblies located at four sides and connected to each other, the supporting frame comprises four supporting frame assemblies located at four sides and connected to each other, and the bottom surface of the composite plate is adhered to the four supporting frame assemblies of the supporting frame.

4. An electronic device housing manufacturing method characterized by comprising: The electronic device shell comprises a shell frame and a composite plate, and the electronic device shell manufacturing method comprises: Pre-injection molding a shell frame, the shell frame comprises a supporting frame and a frame body, the frame body and the supporting frame are integrally formed plastic structures, the frame body is higher than the supporting frame in the vertical direction and is located outside the supporting frame in the horizontal direction, and the supporting frame extends inward from the frame body; Shrinking the pre-injection molded shell frame; Providing a gap between the composite plate and the frame body of the shell frame in the horizontal direction; Adhering the bottom surface of the composite plate to the supporting frame of the shell frame in the vertical direction; Filling a filling block in the gap to integrate the composite plate and the frame body.

5. The electronic device housing manufacturing method of claim 4, wherein The step of filling a filling block in the gap to integrate the composite plate and the frame body specifically comprises: Filling a filling block in the gap by injection molding process or dispensing process to integrate the composite plate and the frame body.

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