Embedded circuit board and manufacturing method thereof

Abstract

The present invention provides an embedded circuit board, comprising: an inner layer stacking structure, comprising a first main body, a first surface, a second surface, a first groove and a first opening, wherein the first surface and the second surface are arranged on two opposite sides of the first main body, the first groove is formed by the first surface being recessed toward the first main body, the first groove does not extend to the second surface, the first opening penetrates the second surface and is connected to the first groove; an embedded element is arranged in the first groove; a first insulating part covers the first surface and the side of the embedded element away from the second surface; a second insulating part covers the second surface and contacts the embedded element through the first opening. The present invention also provides a method for manufacturing the embedded circuit board.

Description

Technical Field

[0001] The invention relates to a circuit board and a manufacturing method thereof, and in particular to an embedded circuit board and a manufacturing method thereof. Background Art

[0002] In recent years, electronic products have been widely used in daily work and life, and light, thin and small electronic products are becoming more and more popular. As the main component of electronic products, circuit boards occupy a large space of electronic products. Therefore, the volume of circuit boards largely affects the volume of electronic products. Large-volume circuit boards are bound to be difficult to meet the trend of light, thin, short and small electronic products. Among them, embedded circuit boards mainly embed electronic components into the inside of the circuit board, so as to miniaturize the circuit board module, shorten the connection path between components, and reduce transmission losses. Embedded circuit boards are a technical approach to make portable electronic devices smaller, lighter, more multifunctional and more high-performance.

[0003] However, in the process of embedding the existing embedded circuit boards, the flowing colloid fills the gaps around the components and at the bottom of the components in turn. However, due to the obstruction of the components themselves and the pads at both ends, as well as the surrounding of the colloid on both sides of the components, the residual gas in the pressing process is compressed to the bottom of the components and cannot effectively overflow. As the pressing proceeds, the gas is eventually squeezed and distributed locally at the bottom of the components and the edges of the pads, thereby forming local bubbles in the embedded layers, affecting product quality. Moreover, it is difficult to fundamentally solve the problem of gas gathering at the bottom of the components to form residual bubbles by increasing the glue content of the prepreg (or film), improving the fluidity of the colloid, and optimizing the circuit graphic design.

[0004] How to solve the above problems is what those skilled in the art need to consider. Summary of the invention

[0005] The invention relates to a circuit board and a manufacturing method thereof, and in particular to an embedded circuit board and a manufacturing method thereof.

[0006] An embodiment of the present invention provides an embedded circuit board, including:

[0007] An inner layer stack structure comprises a first main body, a first surface, a second surface, a first groove and a first opening, wherein the first surface and the second surface are arranged on two opposite sides of the first main body, the first groove is formed by the first surface being recessed toward the first main body, the first groove does not extend to the second surface, and the first opening penetrates the second surface and is connected to the first groove;

[0008] An embedded element is disposed in the first groove;

[0009] A first insulating portion covering the first surface and a side of the embedded component away from the second surface; and

[0010] A second insulating portion covers the second surface and contacts the embedded component through the first opening.

[0011] In one embodiment, the first groove includes a side wall and a bottom wall, the side wall connects the first surface and the bottom wall, the first opening connects the bottom wall and the second surface, and the second insulating portion fills the first opening.

[0012] In one embodiment, the inner layer stack structure also includes a first connection layer and a second connection layer, the first connection layer is electrically connected to the second connection layer, the first connection layer is arranged on the bottom wall and the side wall and is electrically connected to the first main body, and the second connection layer is arranged on the side of the first connection layer close to the embedded element and is electrically connected to the embedded element.

[0013] In one embodiment, the first main body comprises:

[0014] The inner conductive structure comprises a core board and an insulating substrate and an inner conductive circuit stacked in sequence on both sides of the core board, wherein the first groove completely penetrates the inner conductive structure;

[0015] A first insulating layer, covering a surface of the inner conductive structure close to the first surface and facing the first groove;

[0016] a second insulating layer, covering the inner conductive structure on a side close to the second surface and extending to the first groove, the first opening passing through the second insulating layer, and the first insulating layer being connected to the second insulating layer;

[0017] A first conductive circuit is provided on a surface of the first insulating layer away from the inner conductive structure, and a surface of the second insulating layer away from the second surface and not covered by the inner conductive structure; and

[0018] The second conductive circuit is disposed on a surface of the second insulating layer away from the inner conductive structure and the first groove.

[0019] In one embodiment, it further includes:

[0020] A first outer layer circuit, the first outer layer circuit is arranged on a surface of the first insulating portion away from the second insulating portion;

[0021] a second outer layer circuit, the second outer layer circuit being arranged on a surface of the second insulating portion away from the first insulating portion; and

[0022] A solder resist layer is disposed on a side of the first outer layer circuit and the second outer layer circuit away from the inner layer stacked structure.

[0023] The present invention also provides a method for manufacturing an embedded circuit board, comprising the following steps:

[0024] Providing an inner conductive structure, wherein the inner conductive structure comprises a core board and an insulating substrate and an inner conductive circuit sequentially stacked on both sides of the core board, and the inner conductive structure further comprises a first slot, wherein the first slot penetrates the inner conductive structure;

[0025] Providing a first insulating layer, a second insulating layer, a first conductive material layer and a second conductive material layer, opening a second groove in the first insulating layer corresponding to the first groove, disposing the second insulating layer on a side of the inner conductive structure away from the first insulating layer, disposing the first conductive material on a side of the first insulating layer away from the inner conductive structure, and disposing the second conductive material on a side of the second insulating layer away from the inner conductive structure;

[0026] Laminating the first insulating layer, the second insulating layer, the first conductive material layer, the second conductive material layer and the inner conductive structure to form a first groove;

[0027] The first conductive material layer is processed to obtain a first conductive circuit, the second conductive material layer is processed to obtain a second conductive circuit, and at least a portion of the second insulating layer not covered by the first conductive circuit and the second conductive circuit is removed to obtain a first opening, thereby obtaining an inner layer stacking structure;

[0028] Providing an embedded element, and disposing the embedded element in the first groove; and

[0029] A first insulating portion and a second insulating portion are provided so that the first insulating portion and the second insulating portion cover the outer surface of the inner stacked structure, and the exposed surfaces of the two opposite sides of the embedded element are respectively covered by the first insulating portion and the second insulating portion.

[0030] In one embodiment, the manufacturing of the inner conductive structure includes the following steps:

[0031] A core board is provided, the core board comprising a core layer and two core layer conductive circuits respectively arranged on both sides of the core layer;

[0032] A layer of insulating substrate and a layer of conductive layer are sequentially pressed on both sides of the core board;

[0033] Performing patterning on the conductive layer to obtain an inner conductive circuit; and

[0034] The first slot is formed to penetrate the multiple layers of the conductive circuit and the insulating substrate.

[0035] In one embodiment, the first insulating layer and the second insulating layer are provided, the first insulating layer covers the surface of the inner conductive structure facing the first groove, the first insulating layer extends from the surface of the inner conductive structure away from the second insulating layer to the surface of the inner conductive structure facing the first groove and is connected to the second insulating layer.

[0036] In one embodiment, the process of disposing the embedded component in the first groove includes the following steps:

[0037] Forming a first connection layer on the surface of the first conductive circuit disposed in the first groove by a gold deposition process, so that the first connection layer is electrically connected to the first conductive circuit;

[0038] Disposing a conductive paste on a surface of the first connecting layer away from the first conductive line to form a second connecting layer, so that the second connecting layer is electrically connected to the first connecting layer; and

[0039] The embedded component is disposed in the first groove, the embedded component is fixed to the inner layer stack structure, and the embedded component is electrically connected to the second connection layer.

[0040] In one embodiment, the first insulating portion and the second insulating portion are formed by laminating and stacking, the inner layer stack structure further comprises a first surface and a second surface disposed opposite to each other, the first groove does not extend to the second surface, the first opening penetrates the second surface and is connected to the first groove, the first insulating portion covers the first surface and a side of the embedded component away from the second surface, and the second insulating portion covers the second surface and contacts the embedded component through the first opening;

[0041] Forming a first outer layer circuit on a surface of the first insulating portion away from the second insulating portion;

[0042] forming a second outer layer circuit on a surface of the second insulating portion away from the first insulating portion; and

[0043] A solder resist layer is formed on the first outer layer circuit and the second outer layer circuit at a side away from the inner layer stack structure.

[0044] Compared with the prior art, the embedded circuit board of the present invention sets a through structure on the upper and lower sides in the preset area of ​​the embedded component, so that during the embedding process, the colloid wraps the embedded component from different directions. On the one hand, it can effectively avoid the formation of defects due to the accumulation of gas at the bottom of the component due to the inability to overflow. On the other hand, the gap between the embedded component and the connecting layer is filled by the first insulating part and the second insulating part, so that the bonding force between the embedded component and the inner layer stacking structure is greatly improved, effectively improving the product quality. In addition, the bottom of the first groove can provide support for the embedded component, and the embedded component can be positioned by the first groove, effectively preventing the embedded component from being offset, and further improving the embedding accuracy. Furthermore, the connecting layer for fixing the embedded component is set in the first groove, so that the overall gap in the embedded area is reduced, thereby reducing the demand for adding layers of colloid, which is conducive to the thinness of the circuit board and the high density of the product structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 FIG. 4 is a schematic cross-sectional view of an embedded circuit board according to an embodiment of the present invention.

[0046] Figure 2 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0047] Figure 3 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0048] Figure 4 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0049] Figure 5 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0050] Figure 6 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0051] Figure 7 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0052] Figure 8 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0053] Fig. 9 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0054] Fig.10 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0055] Fig.11 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0056] Fig.12 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0057] Fig.13 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0058] Fig.14 The figure is a schematic diagram of the manufacturing process of an embedded circuit board according to an embodiment of the present invention.

[0059] Main component symbols

[0060] Embedded circuit board 1

[0061] Inner layer stacking 10

[0062] First surface 101

[0063] Second surface 102

[0064] First groove 103

[0065] Side wall 1031

[0066] Bottom wall 1032

[0067] First opening 104

[0068] First connection layer 105

[0069] Second connection layer 106

[0070] First body portion 11

[0071] Inner conductive structure 110

[0072] Inner conductive circuit 111

[0073] Insulating substrate 112

[0074] First insulating layer 113

[0075] The second insulating layer 114

[0076] First conductive circuit 115

[0077] The second conductive circuit 116

[0078] Core layer 117

[0079] Core layer conductive circuit 118

[0080] Embedded components 12

[0081] First insulating portion 13

[0082] Second insulating portion 14

[0083] The first outer circuit 15

[0084] The second outer layer circuit 16

[0085] Solder mask 18

[0086] Conductive column 19

[0087] Core board 21

[0088] Conductive layer 22

[0089] First conductive material layer 25

[0090] The second conductive material layer 26

[0091] First slot 27

[0092] Second slot 28

[0093] Pre-cut opening 29

[0094] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0095] The following description will refer to the accompanying drawings to more fully describe the present invention. Illustrated in the accompanying drawings are exemplary embodiments of the present invention. However, the present invention can be implemented in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present invention thorough and complete, and to fully convey the scope of the present invention to those skilled in the art. Similar reference numerals represent identical or similar components.

[0096] The terms used herein are only used for the purpose of describing specific exemplary embodiments and are not intended to limit the present invention. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to also include the plural forms. In addition, when used herein, "include" and / or "comprise" or "include" and / or "includes" or "have" and / or "have", integers, steps, operations, components and / or components, but do not exclude the existence or addition of one or more other features, regions, integers, steps, operations, components, components and / or groups thereof.

[0097] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, unless explicitly defined herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant technology and the present invention, and will not be interpreted as an idealized or overly formal meaning.

[0098] The following will describe exemplary embodiments in conjunction with the accompanying drawings. It should be noted that the components depicted in the reference drawings are not necessarily shown to scale; and the same or similar components will be given the same or similar reference numerals or similar technical terms.

[0099] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings.

[0100] like Figure 1 As shown, an embedded circuit board 1 provided by the present invention includes an inner layer stack 10, an embedded component 12, a first insulating portion 13, a second insulating portion 14, a first outer layer circuit 15, a second outer layer circuit 16 and a solder mask 18.

[0101] The inner layer stack structure 10 includes a first main body 11, a first surface 101, a second surface 102, a first groove 103 and a first opening 104. The first surface 101 and the second surface 102 are arranged on opposite sides of the first main body 11, the first groove 103 is formed by the first surface 101 being recessed toward the first main body 11, the first groove 103 does not extend to the second surface 102, and the first opening 104 penetrates the second surface 102 and communicates with the first groove 103.

[0102] The first body portion 11 includes an inner conductive structure 110 , a first insulating layer 113 , a second insulating layer 114 , a first conductive circuit 115 , and a second conductive circuit 116 .

[0103] The inner conductive structure 110 includes a core board 21 and an insulating substrate 112 and an inner conductive circuit 111 sequentially stacked on both sides of the core board 21 . The inner conductive structure 110 also includes a first slot 27 that completely penetrates the inner conductive structure 110 .

[0104] In one embodiment, the core board 21 includes a core layer 117 and two core layer conductive circuits 118 disposed on both sides of the core layer 117 , respectively. The two core layer conductive circuits 118 are electrically connected via the conductive pillars 19 .

[0105] The first insulating layer 113 covers the surface of the inner conductive structure 110 close to the first surface 101 and the surface of the inner conductive structure 110 facing the first groove 103 .

[0106] The second insulating layer 114 covers the inner conductive structure 110 on a side close to the second surface 102 and extends toward the first groove 103 . The first opening 104 penetrates the second insulating layer 114 . The first insulating layer 113 is connected to the second insulating layer 114 .

[0107] In one embodiment, the embedded circuit board 1 includes a plurality of conductive pillars 19 , and the multiple layers of inner conductive circuits 111 in the inner conductive structure 110 can be electrically connected via the plurality of conductive pillars 19 .

[0108] In one embodiment, the first groove 103 completely penetrates the inner conductive structure 110, but does not completely penetrate the first main body 11. Specifically, the first groove 103 does not penetrate the second insulating layer 114, and the first insulating layer 113 extends along the side wall of the groove of the inner conductive structure 110 and is connected to the second insulating layer 114, that is, the first insulating layer 113 and the second insulating layer 114 constitute a semi-enclosed structure.

[0109] The first conductive circuit 115 is disposed on a surface of the first insulating layer 113 away from the inner conductive structure 110 , and the first conductive circuit 115 is disposed on a surface of the second insulating layer 114 away from the second surface 102 and not covered by the inner conductive structure 110 .

[0110] In one embodiment, the first conductive circuit 115 may extend from the outer surface of the inner conductive structure 110 to the first groove 103 to cover the surface of the first insulating layer 113 and the surface of the second insulating layer 114. The first conductive circuit 115 may be electrically connected to the inner conductive structure 110 through the conductive pillar 19.

[0111] The second conductive circuit 116 is disposed on a surface of the second insulating layer 114 away from the inner conductive structure 110 and the first groove 103. The second conductive circuit 116 can be electrically connected to the inner conductive structure 110 through the conductive pillar 19.

[0112] The first groove 103 includes a side wall 1031 and a bottom wall 1032 . The side wall 1031 connects the first surface 101 and the bottom wall 1032 . The first opening 104 connects the bottom wall 1032 and the second surface 102 .

[0113] The inner layer stack structure 10 also includes a first connection layer 105 and a second connection layer 106. The first connection layer 105 is electrically connected to the second connection layer 106. The first connection layer 105 is arranged on the bottom wall 1032 and the side wall 1031 and is electrically connected to the first main body 11. The second connection layer 106 is arranged on the side of the first connection layer 105 close to the embedded component 12 and is electrically connected to the embedded component 12.

[0114] In one embodiment, the first connection layer 105 may be a gold-plated layer, such as a nickel layer, a gold layer, a tin layer, etc., and the second connection layer 106 may be a conductive paste.

[0115] The embedded component 12 is disposed in the first groove 103 and is electrically connected to the second connection layer 106. In one embodiment, the embedded component 12 may be an active component or a passive component. In one embodiment, the length or width of the embedded component 12 is smaller than the length or width of the first groove 103. The first groove 103 has a fixing effect on the embedded component 12, which can improve the positioning accuracy of the embedded component 12.

[0116] In one embodiment, the embedded component 12 includes two terminals disposed at its two ends. The two terminals can be rectangles with a side length of a. The length of one terminal disposed on the bottom wall 1032 is greater than a / 2, and the distance that the terminal exceeds the bottom wall 1032 can be 0 to a / 3.

[0117] In one embodiment, the distance from the edge of the embedded component 12 to the first connection layer 105 can be 30μm to 100μm, the thickness of the second insulating layer 114 is greater than 50μm, and the distance of the embedded component 12 beyond the upper boundary of the first groove 103 adjacent to the first surface 101 ranges from -50μm to 50μm.

[0118] The first insulating portion 13 covers the first surface 101 and the side of the embedded component 12 away from the second surface 102. The first insulating portion 13 can be formed by solidifying a semi-cured or fluid insulating material.

[0119] The second insulating portion 14 covers the second surface 102 and contacts the embedded component 12 through the first opening 104 . The second insulating portion 14 can be formed by solidifying a semi-cured or fluid insulating material. During the formation process, the second insulating portion 14 fills the first opening 104 and covers at least a portion of the surface of the embedded component 12 .

[0120] The first outer layer circuit 15 is disposed on a surface of the first insulating portion 13 away from the second insulating portion 14 . The first outer layer circuit 15 can be electrically connected to the first conductive circuit 115 through the conductive pillar 19 .

[0121] The second outer layer circuit 16 is disposed on a surface of the second insulating portion 14 away from the first insulating portion 13 . The second outer layer circuit 16 can be electrically connected to the second conductive circuit 116 through the conductive pillar 19 .

[0122] The solder mask 18 is disposed on the side of the first outer layer circuit 15 and the second outer layer circuit 16 away from the inner layer stack structure 10 , and covers the exposed outer surfaces of the first outer layer circuit 15 , the second outer layer circuit 16 , the first insulating portion 13 and the second insulating portion 14 .

[0123] like Figures 2 to 14 As shown, the present invention also provides a method for manufacturing an embedded circuit board 1.

[0124] A method for manufacturing an embedded circuit board comprises the following steps:

[0125] Step S1: Provide an inner conductive structure 110, so that the inner conductive structure 110 includes a core board 21 and an insulating substrate 112 and an inner conductive circuit 111 stacked in sequence on both sides of the core board 21, and the inner conductive structure 110 also includes a first slot 27, and the first slot 27 runs through the inner conductive structure 110.

[0126] The manufacturing of the inner conductive structure 110 includes the following steps:

[0127] Step S11: Figure 2 As shown, a core board 21 is provided. The core board 21 includes a core layer 117 and two core layer conductive circuits 118 respectively disposed on both sides of the core layer 117 .

[0128] Each core conductive circuit 118 has at least two pre-cut cuts 29 arranged at intervals, and the pre-cut cuts 29 expose the core layer 117. The projections of the pre-cut cuts 29 on the two core conductive circuits 118 arranged on both sides of the core layer 117 in the direction perpendicular to the plane of the core layer 117 overlap.

[0129] The conductive pillars 19 are formed to electrically connect the two core conductive circuits 118 .

[0130] Step S12: Figure 3 As shown, a layer of insulating substrate 112 and a layer of conductive layer 22 are laminated on both sides of the core board 21 in sequence.

[0131] Step S13: Figure 4 As shown, the conductive layer 22 is patterned to obtain the inner conductive circuit 111. Each inner conductive circuit 111 is provided with at least two pre-cut cuts 29 arranged at intervals, and the pre-cut cuts 29 expose the insulating substrate 112. In the plane direction perpendicular to the core layer 117, the projections of the pre-cut cuts 29 arranged on the two inner conductive circuits 111 on the side of the insulating substrate 112 away from the core layer 117 overlap. In the plane direction perpendicular to the core layer 117, the projections of the pre-cut cuts 29 arranged on the inner conductive circuit 111 overlap with the projections of the pre-cut cuts 29 arranged on the core conductive circuit 118.

[0132] The conductive pillars 19 are formed to electrically connect the inner conductive circuit 111 with the core conductive circuit 118 .

[0133] Step S14: Figure 5 As shown, the inner conductive structure 110 is cut along the pre-cutting cut 29 to form a first slot 27 penetrating the inner conductive structure 110 , so that the first slot 27 completely penetrates the inner conductive structure 110 .

[0134] Step S2: Figure 6As shown, a first insulating layer 113, a second insulating layer 114, a first conductive material layer 25 and a second conductive material layer 26 are provided, a second groove 28 is opened in the first insulating layer 113 corresponding to the first groove 27, the second insulating layer 114 is arranged on the side of the inner conductive structure 110 away from the first insulating layer 113, the first conductive material 25 is arranged on the side of the first insulating layer 113 away from the inner conductive structure 110, and the second conductive material 26 is arranged on the side of the second insulating layer 114 away from the inner conductive structure 110.

[0135] Step S3: Laminating the first insulating layer 113, the second insulating layer 114, the first conductive material layer 25, the second conductive material layer 26 and the inner conductive structure 110 to form a first groove 103;

[0136] In one embodiment, the material of the first insulating layer 113 and the second insulating layer 114 is a semi-cured material.

[0137] The first insulating layer 113 covers the surface of the inner conductive structure 110 facing the first groove 103 . The first insulating layer 113 extends from the surface of the inner conductive structure 110 away from the second insulating layer 114 to the surface of the inner conductive structure 110 facing the first groove 103 and is connected to the second insulating layer 114 .

[0138] Step S4: Figure 7 As shown, the first conductive material layer 25 is patterned to obtain a first conductive circuit 115 , and the second conductive material layer 26 is patterned to obtain a second conductive circuit 116 .

[0139] The conductive pillars 19 are formed to electrically connect the first conductive circuit 115 and the second conductive circuit 116 to the inner conductive circuit 111 , respectively.

[0140] Step S5: Figure 8 As shown, a first connection layer 105 is formed on the surface of the first conductive circuit 115 disposed in the first groove 103 by a gold deposition process, so that the first connection layer 105 is electrically connected to the first conductive circuit 115 .

[0141] Step S6: Fig. 9 As shown, the portion of the second insulating layer 114 not covered by the first conductive line 115 is removed to form a first opening 104 , thereby obtaining an inner layer stack structure 11 .

[0142] Step S7: Fig.10 As shown, a conductive paste is disposed on a surface of the first connection layer 105 away from the first conductive circuit 115 to form a second connection layer 106 , so that the second connection layer 106 is electrically connected to the first connection layer 105 .

[0143] Step S8 : providing an embedded component 12 , and disposing the embedded component 12 in the first groove 104 .

[0144] Among them, Fig.11 As shown, the embedded component 12 is disposed in the first groove 103 , so that the embedded component 12 is fixed to the inner layer stack 10 , and the embedded component 12 is electrically connected to the second connection layer 106 .

[0145] Step S9: providing a first insulating portion 13 and a second insulating portion 14 so that the first insulating portion 13 and the second insulating portion 14 cover the outer surface of the inner layer stack 10 and the exposed surfaces of the embedded component 12 on opposite sides are covered by the first insulating portion 13 and the second insulating portion 14 respectively.

[0146] In one embodiment, if Fig.12 and Fig.13 As shown, the first insulating portion 13 and the second insulating portion 14 are formed by laminating and laminating, and the inner layer stack 10 also includes a first surface 101 and a second surface 102 disposed opposite to each other. The first groove 103 does not extend to the second surface 102, and the first opening 104 passes through the second surface 102 and communicates with the first groove 103. The first insulating portion 13 covers the first surface 101 and the side of the embedded component 12 away from the second surface 102, and the second insulating portion 14 covers the second surface 102 and contacts the embedded component 12 through the first opening 104.

[0147] Step S10: Fig.12 and Fig.13 As shown, a first outer layer circuit 15 is formed on a surface of the first insulating portion 13 away from the second insulating portion 14 ; and a second outer layer circuit 16 is formed on a surface of the second insulating portion 14 away from the first insulating portion 13 .

[0148] The conductive pillars 19 are formed to electrically connect the first outer layer circuit 15 with the first conductive circuit 115 , and the second outer layer circuit 16 with the second conductive circuit 116 .

[0149] Step S11: Fig.14 As shown, a solder resist layer 18 is formed on the side of the first outer layer circuit 15 and the second outer layer circuit 16 away from the inner layer stack structure 10 .

[0150] In the above, the specific embodiments of the present invention are described with reference to the accompanying drawings. However, those skilled in the art will appreciate that various changes and substitutions may be made to the specific embodiments of the present invention without departing from the spirit and scope of the present invention. These changes and substitutions are all within the scope defined by the present invention.

Claims

1. A method for manufacturing an embedded circuit board, characterized in that: The steps include: Providing an inner conductive structure, wherein the inner conductive structure comprises a core board and inner conductive insulating substrates and electrical circuits sequentially stacked on both sides of the core board, and the inner conductive structure further comprises a first slot, wherein the first slot penetrates the inner conductive structure; Providing a first insulating layer, a second insulating layer, a first conductive material layer and a second conductive material layer, opening a second groove in the first insulating layer corresponding to the first groove, disposing the second insulating layer on a side of the inner conductive structure away from the first insulating layer, disposing the first conductive material on a side of the first insulating layer away from the inner conductive structure, and disposing the second conductive material on a side of the second insulating layer away from the inner conductive structure; Laminating the first insulating layer, the second insulating layer, the first conductive material layer, the second conductive material layer and the inner conductive structure to form a first groove; The first conductive material layer is processed to obtain a first conductive circuit, the second conductive material layer is processed to obtain a second conductive circuit, and at least a portion of the second insulating layer not covered by the first conductive circuit and the second conductive circuit is removed to obtain a first opening, thereby obtaining an inner layer stacking structure; An embedded component is provided, the embedded component is arranged in the first groove, a first connection layer is formed on the surface of the first conductive circuit arranged in the first groove by a gold deposition process, so that the first connection layer is electrically connected to the first conductive circuit; a conductive paste is arranged on the surface of the first connection layer away from the first conductive circuit to form a second connection layer, so that the second connection layer is electrically connected to the first connection layer; the embedded component is arranged in the first groove, the embedded component is fixed to the inner layer stacked structure, and the embedded component is electrically connected to the second connection layer; the first insulating layer covers the surface of the inner layer conductive structure facing the first groove, the first insulating layer extends from the surface of the inner layer conductive structure away from the second insulating layer to the surface of the inner layer conductive structure facing the first groove and is connected to the second insulating layer; as well as A first insulating portion and a second insulating portion are provided so that the first insulating portion and the second insulating portion cover the outer surface of the inner layer stack structure, and the exposed surfaces of the two opposite sides of the embedded element are respectively covered by the first insulating portion and the second insulating portion.

2. The method for manufacturing an embedded circuit board according to claim 1, characterized in that: The production of the inner conductive structure comprises the following steps: Providing the core board, the core board comprising a core layer and two core layer conductive circuits respectively arranged on both sides of the core layer; A layer of insulating substrate and a layer of conductive layer are sequentially pressed on both sides of the core board; Performing patterning on the conductive layer to obtain an inner conductive circuit; as well as The first slot is formed to penetrate the multiple layers of the inner conductive circuits and the insulating substrate.

3. The method for manufacturing an embedded circuit board according to claim 1, characterized in that: The first insulating part and the second insulating part are formed by laminating and laminating, the inner layer stack structure further comprises a first surface and a second surface arranged opposite to each other, the first groove does not extend to the second surface, the first opening penetrates the second surface and is connected to the first groove, the first insulating part covers the first surface and the side of the embedded component away from the second surface, and the second insulating part covers the second surface and contacts the embedded component through the first opening; Forming a first outer layer circuit on a surface of the first insulating portion away from the second insulating portion; forming a second outer layer circuit on a surface of the second insulating portion away from the first insulating portion; and A solder resist layer is formed on the first outer layer circuit and the second outer layer circuit at a side away from the inner layer stack structure.

4. An embedded circuit board, characterized in that: The embedded circuit board is manufactured by the method for manufacturing the embedded circuit board according to any one of claims 1 to 3, wherein the embedded circuit board comprises: An inner layer stack structure, comprising a first main body, a first surface, a second surface, a first groove, a first opening, a first connection layer and a second connection layer, wherein the first surface and the second surface are arranged on two opposite sides of the first main body, the first groove is formed by the first surface being recessed toward the first main body, the first groove does not extend to the second surface, the first opening penetrates the second surface and is connected to the first groove, the first groove comprises a side wall and a bottom wall, the side wall is connected to the first surface and the bottom wall, the first opening is connected to the bottom wall and the second surface, and the first connection layer is arranged on the bottom wall and the side wall and is electrically connected to the first main body; An embedded component is disposed in the first groove, the second connection layer is a conductive paste, and the second connection layer is disposed on a side of the first connection layer close to the embedded component and is electrically connected to the embedded component; A first insulating portion covering the first surface and a side of the embedded component away from the second surface; and A second insulating portion covers the second surface and contacts the embedded component through the first opening, and the second insulating portion fills the first opening.

5. The embedded circuit board according to claim 4, characterized in that: The first main body comprises: The inner conductive structure comprises a core board and an insulating substrate and an inner conductive circuit stacked in sequence on both sides of the core board, wherein the first groove completely penetrates the inner conductive structure; A first insulating layer, covering a surface of the inner conductive structure close to the first surface and facing the first groove; a second insulating layer, covering the inner conductive structure on a side close to the second surface and extending to the first groove, the first opening passing through the second insulating layer, and the first insulating layer being connected to the second insulating layer; A first conductive circuit is provided on a surface of the first insulating layer away from the inner conductive structure, and a surface of the second insulating layer away from the second surface and not covered by the inner conductive structure; and The second conductive circuit is disposed on a surface of the second insulating layer away from the inner conductive structure and the first groove.

6. The embedded circuit board according to claim 4, characterized in that: Also includes: a first outer layer circuit, the first outer layer circuit being arranged on a surface of the first insulating portion away from the second insulating portion; a second outer layer circuit, the second outer layer circuit being arranged on a surface of the second insulating portion away from the first insulating portion; as well as A solder resist layer is disposed on a side of the first outer layer circuit and the second outer layer circuit away from the inner layer stacked structure.

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