A wafer extraction mechanism for a semiconductor die bonder

Abstract

The present application discloses a wafer extraction mechanism for a semiconductor crystal bonder, comprising a rotating mechanism, a lifting mechanism and a suction cup assembly, wherein the rotating mechanism and the lifting mechanism are respectively connected to the suction cup assembly; the rotating mechanism comprises a rotating drive member and a rotating shaft, wherein the rotating shaft is connected to the rotating drive member, and the rotating shaft is connected to the suction cup assembly; the lifting mechanism comprises a lifting drive member, an eccentric shaft and a linkage mechanism, wherein the lifting drive member is connected to one end of the eccentric shaft, and the other end of the eccentric shaft is connected to the linkage mechanism, wherein a shift fork is provided on the linkage mechanism, and the lifting drive member can drive the shift fork to move up and down; an elastic reset member is provided on the rotating shaft, and a roller is provided on the suction cup bracket, wherein the elastic reset member is connected to the suction cup bracket, and the roller abuts against the lower surface of the shift fork. The present application avoids laying lines or pipes in the rotating mechanism, can effectively reduce the failure rate of the equipment, and thus improve the processing efficiency of the crystal bonder; the overall structure is more compact, which reduces the difficulty of assembly and after-sales maintenance of the equipment.

Description

Technical Field

[0001] The present application belongs to the field of automation equipment, and more specifically, relates to a wafer extraction mechanism for a semiconductor die bonder. Background Art

[0002] A die bonder is a type of chip placement equipment, also known as a die bonding machine. Semiconductor wafers range in size from 0.2 to 2 mm, so manual extraction is not convenient for loading and unloading the wafers. The current method involves installing a wafer extraction mechanism on the die bonder.

[0003] Since semiconductor chips are usually glued to the crystal ring blue film and crystal ring film by the supplier, during the process of extracting the wafer, the wafer suction cup in the wafer extraction mechanism needs to first move down to suck the wafer, then lift it up, and finally rotate to load it; this requires that the wafer extraction mechanism must include at least two sets of motion structures: lifting and rotating.

[0004] The rotating mechanism on the existing wafer extraction mechanism generally uses a motor to drive the wafer suction cup to rotate to complete the rotation of the wafer loading; the lifting drive structure mainly includes two types of cylinder or servo motor drive. However, whether using a cylinder or a servo motor, it is inevitable to lay wires or air pipes on the rotating mechanism.

[0005] The wafer extraction mechanism on the above-mentioned existing die bonder has the following technical problems:

[0006] 1. The overall structure of the wafer extraction mechanism is relatively complex, which increases the difficulty of equipment assembly and after-sales maintenance.

[0007] 2. After the die bonder has been working for a long time, the rotating mechanism in the wafer extraction mechanism will rotate continuously, which will inevitably cause contact and friction with the cables of the motor in the lifting mechanism or the air pipe of the cylinder, thereby causing wear on the cables or air pipes and causing equipment failure. Summary of the Invention

[0008] In order to solve the technical problems existing in the above-mentioned prior art, the present application provides a wafer extraction mechanism for a semiconductor crystal bonder, the crystal bonder includes a support and a controller, the wafer extraction mechanism includes a conveying mechanism, the conveying mechanism is connected to the controller, and the conveying mechanism is installed on the support; the conveying mechanism includes a rotating mechanism, a lifting mechanism and a suction cup assembly respectively connected to the controller, the rotating mechanism and the lifting mechanism are respectively connected to the suction cup assembly; the rotating mechanism includes a rotating drive member and a rotating shaft, the rotating drive member is connected to the support member, the rotating shaft is connected to the rotating drive member, and the rotating shaft is connected to the suction cup assembly; the suction cup assembly includes a rotating mechanism, a lifting mechanism and a suction cup assembly respectively connected to the controller, and ... The invention comprises a suction cup bracket and a negative pressure suction cup, the negative pressure suction cup is mounted on the suction cup bracket, and the suction cup bracket is connected to the rotating shaft; the lifting mechanism comprises a lifting drive member, an eccentric shaft and a linkage mechanism, the lifting drive member is connected to the support member, the lifting drive member is connected to one end of the eccentric shaft, and the other end of the eccentric shaft is connected to the linkage mechanism, a shift fork is provided on the linkage mechanism, and the lifting drive member can drive the shift fork to move up and down; an elastic reset member is provided on the rotating shaft, a roller is provided on the suction cup bracket, the elastic reset member is connected to the suction cup bracket, the roller abuts against the lower surface of the shift fork, and the roller can slide on the lower surface of the shift fork.

[0009] As a further improvement of the present application, there are two lifting mechanisms and two suction cup assemblies, and a lifting mechanism and a suction cup assembly are symmetrically installed on the left and right sides of the rotating mechanism respectively; the forks on the two lifting mechanisms are staggered in the horizontal direction, and the distance between the two forks is greater than the distance that the lifting mechanism drives the forks to move.

[0010] As a further improvement of the present application, there are suction cup lifting guides on the rotating shaft along the movement direction of the suction cup bracket, and suction cup lifting sliding members are provided at corresponding positions on the suction cup bracket and the suction cup lifting guides, and the suction cup lifting sliding members are slidably connected to the suction cup lifting guides.

[0011] As a further improvement of the present application, the lifting drive member is a first motor, and a coupling is provided on the rotating shaft of the first motor, and the coupling is connected to one end of the eccentric shaft; the linkage mechanism includes a connecting member, a transmission shaft and a linkage member, one end of the connecting member is rotatably connected to the end of the eccentric shaft away from the coupling, and the other end of the connecting member is rotatably connected to the transmission shaft, the transmission shaft is installed on the linkage member, and the linkage member is connected to the fork.

[0012] As a further improvement of the present application, two mounting holes are provided on the connecting member, and a first bearing and a second bearing are respectively provided in the mounting holes. The first bearing is connected to the end of the eccentric shaft away from the coupling, and the second bearing is connected to the transmission shaft. The first bearing and the second bearing are respectively connected to the connecting member through bearing seats.

[0013] As a further improvement of the present application, the first motor is connected to the support member through a first motor fixing seat, a fork lifting guide member is provided on the first motor fixing seat, a fork lifting sliding member is provided on the linkage member, and the fork lifting sliding member is slidably connected to the fork lifting guide member.

[0014] As a further improvement of the present application, a sensor is provided on the first motor fixing seat, the sensor is connected to the controller, a shift block is provided on the linkage member, the shift block moves up and down with the linkage member, and the shift block can be connected with the sensor.

[0015] As a further improvement of the present application, the rotating drive member is a second motor, the second motor is connected to the support member through a second motor fixing seat, the rotating shaft is connected to the rotating shaft of the second motor, and the second motor is connected to the controller.

[0016] As a further improvement of the present application, a visual positioning mechanism is provided on the support member, the visual positioning mechanism is connected to the controller, and the visual positioning mechanism is used to provide visual positioning for the transport mechanism.

[0017] As a further improvement of the present application, the visual positioning mechanism includes a material picking camera and a material unloading camera, the material picking camera and the material unloading camera are respectively connected to the controller, and the material picking camera and the material unloading camera are respectively connected to the support member through a camera fixing block.

[0018] The beneficial effects of this application are:

[0019] This application avoids laying lines or pipes in the rotating mechanism, which can effectively reduce the failure rate of the equipment and thus improve the processing efficiency of the crystal bonding machine; and the lifting mechanism and the rotating mechanism are independent in structure, and can be assembled separately during assembly, and then the two are fixed to the support parts respectively, making the overall equipment structure more compact and reducing the difficulty of equipment assembly and after-sales maintenance.

[0020] Specifically, when the chip extraction mechanism is working, the rotary drive member drives the rotary shaft and the suction cup assembly to rotate, thereby driving the suction cup assembly to a predetermined loading and unloading position; when the suction cup assembly needs to descend to absorb or unload, the lifting drive member drives the eccentric wheel to rotate, the eccentric wheel drives the linkage mechanism and the fork to descend, the fork presses the roller to descend synchronously, and the roller drives the suction cup assembly to descend to complete the absorption or unloading, and at the same time, the suction cup assembly will stretch the elastic reset member; when the absorption or unloading is completed, the suction cup assembly needs to rise, the lifting drive member drives the eccentric wheel to rotate, the eccentric wheel drives the linkage mechanism and the fork to rise, and at this time the fork is released from the pressure on the roller, and under the action of the elastic force of the elastic reset member, the suction cup assembly is pulled up until the roller abuts against the fork, thereby completing the absorption or unloading of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the solutions in the present application or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the present application;

[0023] Figure 2 This is a schematic diagram of the overall structure of the transport mechanism in the embodiment of the present application;

[0024] Figure 3 This is a schematic diagram of the overall structure of the rotating mechanism and the suction cup assembly in an embodiment of the present application;

[0025] Figure 4 This is a schematic diagram of the overall structure of the lifting mechanism in the embodiment of the present application;

[0026] Figure 5 This is a schematic diagram of the decomposed structure of the lifting mechanism in the embodiment of the present application;

[0027] Figure 6 It is a schematic diagram of the eccentric shaft structure in an embodiment of the present application. DETAILED DESCRIPTION

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0029] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0030] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0031] like Figure 1-6 As shown, a wafer extraction mechanism for a semiconductor die bonder includes a support 1 and a controller. The support 1 is used to mount the wafer extraction mechanism, and the controller is capable of controlling the operation of the wafer extraction mechanism. The wafer extraction mechanism includes a conveying mechanism and a visual positioning mechanism 2, each of which is connected to the controller. The visual positioning mechanism 2 is used to provide visual positioning for the conveying mechanism. The visual positioning mechanism 2 includes a retrieving camera 21 and a discharging camera 22, each mounted on the support 1 via a camera fixing block 23. The retrieving camera 21 is positioned directly above the wafer extraction mechanism's wafer pickup position, while the discharging camera 22 is positioned directly above the wafer discharging position.

[0032] During operation, the picking camera 21 is used to determine whether the transport mechanism has reached the wafer loading position. When the transport mechanism reaches the loading position, the picking camera 21 sends a signal to the controller, and the controller controls the transport mechanism to pick up the wafer. On the other hand, the unloading camera 22 is used to determine whether the transport mechanism has reached the wafer unloading position. When the transport mechanism reaches the unloading position, the unloading camera 22 sends a signal to the controller, and the controller controls the transport mechanism to release the wafer.

[0033] The transport mechanism includes a rotating mechanism 3, a lifting mechanism 4 and a suction cup assembly 5 respectively connected to the controller. The rotating mechanism 3 and the lifting mechanism 4 are respectively connected to the suction cup assembly 5; the suction cup assembly 5 is used to absorb and release the wafer, the rotating mechanism 3 is used to drive the suction cup assembly 5 to rotate, and the lifting mechanism 4 is used to drive the suction cup assembly 5 to move up and down.

[0034] The rotating mechanism 3 includes a rotary drive member and a rotating shaft 31. The rotary drive member is a second motor 32, which is connected to a controller. The second motor 32 is fixedly connected to the support member 1 via a second motor mounting bracket 33. The rotating shaft of the second motor 32 is fixedly connected to the rotating shaft 31, which is in a sliding, limited position connection with the suction cup assembly 5. During operation, the controller controls the rotation of the second motor 32, which drives the rotating shaft 31 to rotate synchronously. The rotating shaft 31 then rotates synchronously with the suction cup assembly 5, completing the suction or release of the wafer.

[0035] There are two suction cup assemblies 5, and the two suction cup assemblies 5 are symmetrically installed on the left and right sides of the rotating shaft 31 facing back to back. The suction cup assembly 5 includes a suction cup bracket 51 and a negative pressure suction cup 52. The negative pressure suction cup 52 is installed on the suction cup bracket 51. The negative pressure suction cup 52 is used for an external negative pressure device to facilitate the suction of the wafer. The suction cup bracket 51 is slidably connected to the rotating shaft 31.

[0036] There are two lifting mechanisms 4, and the positions of the two lifting mechanisms 4 and the two suction cup assemblies 5 are arranged in a one-to-one correspondence. The lifting mechanism 4 includes a lifting drive member, an eccentric shaft 41 and a linkage mechanism 42, wherein the lifting drive member is a first motor 43, and the central axis of one end of the eccentric shaft 41 is parallel to the central axis of the other end but does not overlap; the first motor 43 is fixedly connected to the support member 1 through a first motor fixing seat 44, and a coupling 45 is connected to the rotating shaft of the first motor 43, and the coupling 45 is fixedly connected to one end of the eccentric shaft 41, and the other end of the eccentric shaft 41 is connected to the linkage mechanism 42, and a fork 46 is provided on the linkage mechanism 42, and the first motor 43 can drive the fork 46 to move up and down.

[0037] An elastic reset part is provided on the rotating shaft 31, which is a strong spring 6. A roller 7 is fixedly mounted on the suction cup bracket 51. The other end of the strong spring 6 is fixedly connected to the suction cup bracket 51, and the roller 7 abuts against the lower surface of the fork 46; when the rotating mechanism 3 drives the suction cup assembly 5 to rotate, the roller 7 can roll or slide on the lower surface of the fork 46.

[0038] When the wafer extraction mechanism is working, the second motor 32 drives the rotating shaft 31 and the suction cup assembly 5 to rotate, thereby driving the suction cup assembly 5 to reach the predetermined loading and unloading position; when the suction cup assembly 5 needs to descend to absorb or discharge the material, the first motor 43 drives the eccentric wheel 41 to rotate, and the eccentric wheel 41 drives the linkage mechanism 42 and the fork 46 to descend, and the fork 46 presses the roller 7 to descend synchronously, and the roller 7 drives the suction cup assembly 5 to descend to complete the absorption or discharge. At the same time, the suction cup bracket 51 will stretch the strong spring 6; when the absorption or discharge is completed and the suction cup assembly 5 needs to rise, the first motor 43 drives the eccentric wheel 41 to rotate, and the eccentric wheel 41 drives the linkage mechanism 42 and the fork 46 to rise. At this time, the fork 46 is released from the pressure on the roller 7. Under the action of the elastic force of the strong spring 6, the suction cup assembly 5 moves upward until the roller 7 abuts against the fork 46, thereby resetting the suction cup assembly 5 upward.

[0039] In this embodiment, the shift forks 46 on the two lifting mechanisms 4 are staggered in the horizontal direction, and the distance between the two shift forks 46 is greater than the distance that the first motor 43 drives the shift fork 46 to move, thereby ensuring that the two shift forks 46 will not collide during the lifting movement; by staggering the two shift forks 46, it can be ensured that when one of the suction cup assemblies 5 is sucking the wafer, the other suction cup assembly 5 is releasing the wafer, ensuring that the rotation angle of each suction cup assembly 5 in the horizontal direction is controlled at 180°. When the material is taken or discharged, the second motor 32 rotates 180° in the opposite direction, which can swap the positions of the two suction cup assemblies 5. This operation is repeated, thereby improving the working efficiency of the wafer extraction mechanism.

[0040] To limit and guide the lifting movement of the suction cup bracket 51, suction cup lifting guides 311 are provided on the rotating shaft 31 along the direction of movement of the suction cup assembly 5. Suction cup lifting slides 511 are provided on the suction cup bracket 51 at positions corresponding to the suction cup lifting guides 311. The suction cup lifting slides 511 are slidably connected to the suction cup lifting guides 311. The cooperation between the suction cup lifting guides 311 and the suction cup lifting slides 511 limits and guides the movement direction of the suction cup bracket 51, thereby improving the processing accuracy of the wafer extraction mechanism.

[0041] The linkage mechanism 42 includes a connecting member 421, a transmission shaft 422 and a linkage member 423. One end of the connecting member 421 is rotatably connected to the end of the eccentric shaft 41 away from the coupling 45, and the other end of the connecting member 421 is rotatably connected to the transmission shaft 422. The transmission shaft 422 is fixedly mounted on the linkage member 423, and the linkage member 423 is fixedly connected to the fork 46. Two mounting holes 424 are provided on the connecting member 421, and the first bearing 425 and the second bearing 426 are respectively installed on the two mounting holes 424. The first bearing 425 is connected to the end of the eccentric shaft 41 away from the coupling 45, and the transmission shaft 422 is inserted into the corresponding mounting hole 424 and fixedly connected to the second bearing 426. The first bearing 425 and the second bearing 426 are respectively fixedly connected to the connecting member 421 through the bearing seat 8; when the first motor 43 is working, the eccentric shaft 41 rotates to drive the connecting member 421 to move in a circular arc. At this time, the first bearing 425 and the second bearing 426 will rotate in the mounting hole 424, and the second bearing 426 pulls the transmission shaft 422 to move up and down, thereby driving the linkage member 423 and the fork 46 to move up and down.

[0042] In order to limit and guide the movement direction of the fork 46, a fork lifting guide 47 is installed on the first motor fixing seat 44. The direction of the fork lifting guide 47 is perpendicular to the horizontal direction. A fork lifting slide 48 is installed on the linkage member 423. The fork lifting slide 48 is slidably connected to the fork lifting guide 47. The connection between the fork lifting slide 48 and the fork lifting guide 47 limits the fork 46 to move only in the lifting direction, thereby improving the processing accuracy of the chip extraction mechanism.

[0043] To control the travel of the shift fork 46, sensors 9 are mounted on each of the two first motor mounts 44, each connected to a controller. A shift block 10 is mounted on the linkage 423, capable of rising and falling along with the linkage 423. When the linkage 423, driven by the first motor 43, descends to a certain point, the shift block 10 engages the sensor 9, which then responds with a signal, causing the controller to stop the first motor 43. By providing sensors 9, the descending distance of the linkage 423 and shift fork 46 can be controlled, ensuring that the suction cup assembly 5 descends a consistent distance each time, thereby improving the machining accuracy of the wafer extraction mechanism.

[0044] The process of the wafer extraction mechanism sucking the wafer is as follows:

[0045] First, the first motor 43 works to drive the eccentric shaft 41 to rotate, and the eccentric shaft 41 drives the connecting member 421 to move. The connecting member 421 brings the linkage member 423 and the shift fork 46 to slide downward on the shift fork lifting guide 47, and the shift fork 46 presses the roller 7 to drop. At the same time, the suction cup bracket 51 will pull up the strong spring 6, and the roller 7 brings the suction cup bracket 51 and the negative pressure suction cup 52 to slide downward on the suction cup lifting guide 311. When the negative pressure suction cup 52 drops to a position where it can absorb the wafer, the shift block 10 is connected to the sensor 9, and the sensor 9 sends a signal to the controller, and the controller controls the first motor 43 to stop working, thereby stopping the shift fork 46 and the negative pressure suction cup 52 from falling. At this time, the negative pressure suction cup 52 starts to work and moves the upper wafer. The wafer at the material position is sucked up; after the negative pressure suction cup 52 sucks the wafer, the first motor 43 rotates in the opposite direction, driving the shift fork 46 to move upward, and the shift fork 46 is released from the pressure on the roller 7. Under the elastic force of the strong spring 6, the suction cup bracket 51 and the negative pressure suction cup 52 are pulled to slide upward on the suction cup guide 311; immediately afterwards, the second motor 32 starts working, driving the rotating shaft 31 to rotate, and the rotating shaft 31 drives the suction cup bracket 51 and the negative pressure suction cup 52 to rotate. At this time, the roller 7 will roll or slide on the lower surface of the shift fork 46. When the discharge camera 22 detects the negative pressure suction cup 52, the discharge camera 22 gives a feedback signal to the controller, and the controller controls the second motor 32 to stop rotating, and the negative pressure suction cup 52 stays at the wafer discharge position.

[0046] The process of releasing the wafer by the wafer extraction mechanism is as follows:

[0047] First, the first motor 43 works to drive the eccentric shaft 41 to rotate, and the eccentric shaft 41 drives the connecting member 421 to move. The connecting member 421 slides downward on the fork lifting guide 47 with the linkage member 423 and the shift fork 46. The shift fork 46 presses the roller 7 to drop. At the same time, the suction cup bracket 51 pulls up the strong spring 6, and the roller 7 slides downward on the suction cup lifting guide 311 with the suction cup bracket 51 and the negative pressure suction cup 52. When the negative pressure suction cup 52 drops to the position of releasing the wafer, the shift block 10 connects with the sensor 9, and the sensor 9 sends a signal to the controller, and the controller controls the first motor 43 to stop working, thereby stopping the shift fork 46 and the negative pressure suction cup 52 from falling. At this time, the negative pressure suction cup 52 starts to work and moves the wafer Release to the preset position; after the negative pressure suction cup 52 sucks the chip, the first motor 43 rotates in the opposite direction, driving the fork 46 to move upward, and the fork 46 is released from the pressure on the roller 7. Under the elastic force of the strong spring 6, the suction cup bracket 51 and the negative pressure suction cup 52 are pulled to slide upward on the suction cup guide 311; immediately afterwards, the second motor 32 starts working, driving the rotating shaft 31 to rotate, and the rotating shaft 31 drives the suction cup bracket 51 and the negative pressure suction cup 52 to rotate. At this time, the roller 7 will roll or slide on the lower surface of the fork 46. When the material picking camera 21 detects the negative pressure suction cup 52, the material picking camera 21 gives a feedback signal to the controller, and the controller controls the second motor 32 to stop rotating, and the negative pressure suction cup 52 stays at the chip loading position.

[0048] It should be noted that the process of sucking in and releasing the wafer by the wafer extraction mechanism can be carried out simultaneously, that is, while one suction cup assembly 5 is sucking in the wafer, the other suction cup assembly 5 is releasing the wafer. It is only necessary to ensure that the rotation angle of each suction cup bracket 51 is controlled at 180°, so that the processing efficiency of the wafer extraction mechanism can be multiplied.

[0049] Obviously, the embodiments described above are only some of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present application specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present application.

Claims

1. A wafer extraction mechanism for a semiconductor die bonder, the die bonder comprising a support member and a controller, characterized in that: The wafer extraction mechanism includes a transport mechanism, the transport mechanism is connected to the controller, and the transport mechanism is installed on the support member; The transport mechanism includes a rotating mechanism, a lifting mechanism and a suction cup assembly respectively connected to the controller, and the rotating mechanism and the lifting mechanism are respectively connected to the suction cup assembly; The rotating mechanism includes a rotating drive member and a rotating shaft, wherein the rotating drive member is connected to the supporting member, the rotating shaft is connected to the rotating drive member, and the rotating shaft is connected to the suction cup assembly; The suction cup assembly includes a suction cup bracket and a negative pressure suction cup, the negative pressure suction cup is mounted on the suction cup bracket, and the suction cup bracket is connected to the rotating shaft; The lifting mechanism includes a lifting drive member, an eccentric shaft and a linkage mechanism, wherein the lifting drive member is connected to the support member, the lifting drive member is connected to one end of the eccentric shaft, and the other end of the eccentric shaft is connected to the linkage mechanism. A shift fork is provided on the linkage mechanism, and the lifting drive member can drive the shift fork to move up and down; An elastic reset member is provided on the rotating shaft, a roller is provided on the suction cup bracket, the elastic reset member is connected to the suction cup bracket, the roller abuts against the lower surface of the shift fork, and the roller can slide on the lower surface of the shift fork; The rotary drive member is a second motor, the second motor is connected to the support member through a second motor fixing seat, the rotating shaft is connected to the rotating shaft of the second motor, and the second motor is connected to the controller; A visual positioning mechanism is provided on the support member, the visual positioning mechanism is connected to the controller, and the visual positioning mechanism is used to provide visual positioning for the transport mechanism.

2. The wafer extraction mechanism for a semiconductor die bonder according to claim 1, characterized in that: There are two lifting mechanisms and two suction cup assemblies, and a lifting mechanism and a suction cup assembly are symmetrically installed on the left and right sides of the rotating mechanism respectively; The shift forks on the two lifting mechanisms are staggered in the horizontal direction, and the distance between the two shift forks is greater than the distance that the lifting mechanism drives the shift forks to move.

3. The wafer extraction mechanism for a semiconductor die bonder according to claim 2, characterized in that: There are suction cup lifting guides on the rotating shaft along the movement direction of the suction cup bracket, and suction cup lifting sliding members are respectively provided at the corresponding positions of the suction cup bracket and the suction cup lifting guides, and the suction cup lifting sliding members are slidably connected to the suction cup lifting guides.

4. The wafer extraction mechanism for a semiconductor die bonder according to claim 2, characterized in that: The lifting drive member is a first motor, a coupling is provided on the rotating shaft of the first motor, and the coupling is connected to one end of the eccentric shaft; The linkage mechanism includes a connecting member, a transmission shaft and a linkage member, one end of the connecting member is rotatably connected to the end of the eccentric shaft away from the coupling, the other end of the connecting member is rotatably connected to the transmission shaft, the transmission shaft is installed on the linkage member, and the linkage member is connected to the shift fork.

5. The wafer extraction mechanism for a semiconductor die bonder according to claim 4, characterized in that: The connecting member is provided with two mounting holes, and a first bearing and a second bearing are respectively provided in the mounting holes. The first bearing is connected to the end of the eccentric shaft away from the coupling, and the second bearing is connected to the transmission shaft. The first bearing and the second bearing are respectively connected to the connecting member through bearing seats.

6. The wafer extraction mechanism for a semiconductor die bonder according to claim 4, characterized in that: The first motor is connected to the support member through a first motor fixing seat. A fork lifting guide member is provided on the first motor fixing seat. A fork lifting sliding member is provided on the linkage member. The fork lifting sliding member is slidably connected to the fork lifting guide member.

7. The wafer extraction mechanism for a semiconductor die bonder according to claim 6, characterized in that: A sensor is provided on the first motor fixing seat, and the sensor is connected to the controller. A shift block is provided on the linkage member, and the shift block moves up and down along with the linkage member, and the shift block can be connected with the sensor.

8. The wafer extraction mechanism for a semiconductor die bonder according to claim 1, wherein: The visual positioning mechanism includes a material picking camera and a material discharging camera, the material picking camera and the material discharging camera are respectively connected to the controller, and the material picking camera and the material discharging camera are respectively connected to the support member through a camera fixing block.

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