Power conversion module

Abstract

The present disclosure relates to a power conversion module, comprising a multi-layer printed circuit board, a switching device, a capacitor device, a first, a second, a third and a fourth via. The multi-layer printed circuit board has a plurality of copper layers, the plurality of copper layers comprising a plurality of positive copper layers and a plurality of negative copper layers arranged alternately. The switching device has a switching positive terminal and a switching negative terminal. The capacitor device has a capacitor positive terminal and a capacitor negative terminal, and the capacitor device forms a capacitor region. The first, the second, the third and the fourth via are electrically connected to the switching positive terminal, the switching negative terminal, the capacitor positive terminal and the capacitor negative terminal respectively, wherein the plurality of positive copper layers are electrically connected to the first via and the third via, and the plurality of negative copper layers are electrically connected to the second via and the fourth via. A dielectric layer is arranged between any two adjacent copper layers. The projections of the adjacent positive copper layer and the adjacent negative copper layer on the first face and the capacitor region are at least partially overlapped.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a power conversion module, in particular to a power conversion module with interleaved positive and negative copper layers. BACKGROUND

[0002] With the rapid development of mobile communication and cloud computing technologies, high-power power conversion modules are widely used in electronic products. As electronic products are becoming more powerful and smaller, it is important to improve the conversion efficiency of power conversion modules and reduce the size of power conversion modules.

[0003] The output power of existing power conversion modules is increasing, which results in greater loss in the corresponding current loop and flow path in the power conversion module, and the proportion of this loss in the total loss of the power conversion module also increases. To reduce the loss on the transmission path, multiple copper layers in a multilayer printed circuit board are often wired in parallel to reduce the equivalent impedance on the flow path. However, due to the existence of parasitic parameters between multiple copper layers and the alternating current loop in the power conversion module, the alternating current loss in the corresponding alternating current loop increases, which reduces the conversion efficiency of the power conversion module.

[0004] Therefore, it is an urgent need to develop a power conversion module that can improve the above-mentioned prior art. SUMMARY

[0005] The purpose of the present disclosure is to provide a power conversion module, in which multiple positive and negative copper layers are interleaved and electrically connected to the corresponding switch positive and negative terminals, capacitor positive and negative terminals, and multiple vias. The projections of adjacent positive and negative copper layers and capacitor regions on the first surface are at least partially overlapping, thereby reducing the parasitic inductance of the wiring and reducing the parasitic loss, and improving the conversion efficiency of the power conversion module.

[0006] According to the concept of the present disclosure, the present disclosure provides a power conversion module, comprising a multi-layer printed circuit board, at least one switching device, at least one capacitor device, at least one first via, at least one second via, at least one third via, and at least one fourth via. The multi-layer printed circuit board has a first surface and a second surface, the first surface and the second surface are opposite, and the multi-layer printed circuit board has a plurality of copper layers, the plurality of copper layers include a plurality of positive copper layers and a plurality of negative copper layers, the plurality of positive copper layers and the plurality of negative copper layers are arranged alternately. The switching device is arranged on the first surface of the multi-layer printed circuit board, and the switching device has a switching positive terminal and a switching negative terminal. The capacitor device is arranged on the first surface of the multi-layer printed circuit board, and the capacitor device has a capacitor positive terminal and a capacitor negative terminal, and the capacitor device forms a capacitor region. The first via is electrically connected to the switching positive terminal, the second via is electrically connected to the switching negative terminal, the third via is electrically connected to the capacitor positive terminal, and the fourth via is electrically connected to the capacitor negative terminal. The plurality of positive copper layers are electrically connected to the first via and the third via, and the plurality of negative copper layers are electrically connected to the second via and the fourth via. A dielectric layer is arranged between any two adjacent copper layers. The projections of the adjacent positive copper layer and the negative copper layer and the capacitor region on the first surface are at least partially overlapped. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 It is a perspective view of the power conversion module of the preferred embodiment of the present disclosure.

[0008] Figure 2 It is an exploded view of the power conversion module of the preferred embodiment of the present disclosure.

[0009] Figure 3 It is a side view of the power conversion module of the preferred embodiment of the present disclosure.

[0010] Figure 4 It is a side view of the power conversion module of the preferred embodiment of the present disclosure.

[0011] Figure 5 It is a structure view of the second surface of the power conversion module of the preferred embodiment of the present disclosure.

[0012] Figure 6 It is an equivalent circuit schematic diagram of the power conversion module of the present disclosure.

[0013] Figure 7 It is a side view of the power conversion module of another preferred embodiment of the present disclosure.

[0014] Wherein, the reference signs are explained as follows:

[0015] 1: power conversion module

[0016] 10: multi-layer printed circuit board

[0017] 101: switching device

[0018] 101a: positive terminal of switch

[0019] 101b: negative terminal of switch

[0020] 102: capacitor device

[0021] 102a: positive terminal of capacitor

[0022] 102b: negative terminal of capacitor

[0023] 103: magnetic core assembly

[0024] 104: hole

[0025] 105: winding via

[0026] 106: first via

[0027] 107: second via

[0028] 108: third via

[0029] 109: fourth via

[0030] 11: first surface

[0031] 12: second surface

[0032] 13: pad

[0033] 14: inner layer

[0034] PP: dielectric layer

[0035] L1-L8: copper layer

[0036] Vin+: positive input terminal

[0037] Vin-: negative input terminal

[0038] SW: contact

[0039] Cin: input capacitor

[0040] Co: output capacitor

[0041] Vin: input voltage

[0042] Vo: output voltage DETAILED DESCRIPTION

[0043] Some exemplary embodiments embodying features and advantages of the present disclosure are described in detail in the following description. It should be understood that the present disclosure can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as such description and drawings are to be regarded in an illustrative manner and not as imposing structural limitations on the present disclosure.

[0044] Figure 1 This is a three-dimensional structural diagram of a power conversion module according to a preferred embodiment of the present disclosure. Figure 2 This is an exploded structural diagram of the power conversion module according to a preferred embodiment of the present disclosure. Figure 3 This is a side view of a power conversion module according to a preferred embodiment of the present disclosure. Figure 4 This is a side view of a power conversion module according to a preferred embodiment of this disclosure. Figures 1 to 4 As shown, the power conversion module 1 includes a multilayer printed circuit board 10, at least one switching device 101, at least one capacitor device 102, at least one magnetic core assembly 103, and at least one winding via 105. The multilayer printed circuit board 10 has a first surface 11, a second surface 12, and an inner layer 14, with the first surface 11 and the second surface 12 facing each other. The multilayer printed circuit board 10 has multiple copper layers L1 to L8. The switching device 101 is disposed on the first surface 11 of the multilayer printed circuit board 10. The magnetic core assembly 103 is disposed in the inner layer 14 of the multilayer printed circuit board 10, wherein the magnetic core assembly 103 has a hole 104. One end of the winding via 105 is electrically connected to the switching device 101, and the other end of the winding via 105 is electrically connected to the second surface 12 of the multilayer printed circuit board 10. The winding via 105 passes through the hole 104 of the magnetic core assembly 103 and forms a magnetic assembly with the magnetic core assembly 103. Via 105 is electrically connected to all or part of the copper layers. Capacitor device 102 is disposed on the first surface 11 of the multilayer printed circuit board 10. Capacitor device 102 includes at least one capacitor, which is either an input capacitor or an output capacitor. In some embodiments, the winding via 105 is a straight via or a stepped via; specifically, the winding via 105 may have a straight structure or a partially bent structure. The number of copper layers on the side of the core assembly 103 closest to the first surface 11 of the multilayer printed circuit board 10 is at least two more than the number of copper layers on the other side of the core assembly 103. In some embodiments, the number of copper layers on the side of the core assembly 103 closest to the first surface 11 of the multilayer printed circuit board 10 is at least three more than the number of copper layers on the other side of the core assembly 103. Figure 3 and Figure 4For example, the multi-layer printed circuit board 10 includes eight copper layers L1-L8 and eight dielectric layers PP, the dielectric layers PP are arranged between two adjacent copper layers, but the actual number of layers is not limited thereto. The magnetic core assembly 103 is arranged between the copper layers L7 and L8 in the multi-layer printed circuit board 10. Therefore, the number of copper layers L1-L7 on one side of the magnetic core assembly 103 is more than the number of copper layers L8 on the other side of the magnetic core assembly 103, and the copper layers L1-L7 have a larger wiring area and copper area. Therefore, by increasing the number of copper layers on one side of the magnetic core assembly 103 than the number of copper layers on the other side of the magnetic core assembly 103, for example, the number of copper layers on one side of the magnetic core assembly 103 is two more than the number of copper layers on the other side of the magnetic core assembly 103, so that a larger wiring area and copper area can be obtained by using the copper layers on one side of the magnetic core assembly 103 and the number of copper layers is larger. Thus, sufficient space is provided for wiring to avoid strong electromagnetic field interference caused by the power loop, and the flexibility of the copper network is increased, and the parasitic resistance and parasitic inductance of the multi-layer printed circuit board are reduced, thereby improving the conversion efficiency of the power conversion module.

[0045] Figure 5 The structure of the second surface of the power conversion module of the preferred embodiment of the present disclosure is shown in the schematic diagram. In some embodiments, as shown in Figure 5 The power conversion module 1 also includes a solder pad 13 arranged on the second surface 12 of the multi-layer printed circuit board 10. The solder pad 13 is a copper block pin or a surface copper skin of the multi-layer printed circuit board 10, and the solder pad 13 is fixed on the second surface 12, and the other end of the winding via hole 105 is electrically connected to the solder pad 13.

[0046] Figure 6 The equivalent circuit diagram of the power conversion module of the present disclosure is shown in the schematic diagram. As Figure 6As shown, the capacitor device 102 comprises an input capacitor Cin and an output capacitor Co, and the magnetic component is an inductor Lo, wherein the winding via 105 serves as the winding of the inductor Lo. The switch device 101 has an upper switch 1010 and a lower switch 1011, which can be MOS (Metal Oxide Semiconductor) for example, but are not limited thereto. There is a junction SW between the upper switch 1010 and the lower switch 1011, which is electrically connected to the inductor Lo, and is electrically connected to one end of the winding via 105. One end of the input capacitor Cin is electrically connected to the upper switch 1010 to form an input positive terminal Vin+, and the other end of the input capacitor Cin is electrically connected to the lower switch 1011 to form an input negative terminal Vin-. One end of the output capacitor Co is electrically connected to the inductor Lo, and the other end of the output capacitor Co is electrically connected to the lower switch 1011. In some embodiments, the inductor Lo, as the magnetic component in the above-mentioned embodiments, is located in the inner layer 14 of the multi-layer printed circuit board 10, the projection of the inductor Lo and the switch device 101 on the first surface 11 at least partially overlaps, and the inductor Lo is electrically connected to an output positive terminal Vo+ of the power conversion module 1, which is arranged on the second surface 12 of the multi-layer printed circuit board 10. It is worth noting that, Figure 6 In the figure, only one phase half-bridge branch is shown. In actual power conversion modules, multiple-phase parallel-connected half-bridge branches can be included.

[0047] Figure 7 A side view of a power conversion module according to another preferred embodiment of the present disclosure. Figure 7 With Figure 4 Components having similar structures and functions in the figure are denoted by the same reference numerals, and will not be described here. In Figure 7In the shown embodiment, the plurality of copper layers include a plurality of positive copper layers and a plurality of negative copper layers, the plurality of positive copper layers and the plurality of negative copper layers are arranged alternately, in some embodiments, the positive copper layers include the copper layers L3, L5 and L7, and the negative copper layers include the copper layers L2, L4 and L6. The switch device 101 has a switch positive terminal 101a and a switch negative terminal 101b, and the capacitor device 102 has a capacitor positive terminal 102a and a capacitor negative terminal 102b. The capacitor device 102 is arranged on the first surface 11 and is arranged adjacent to the switch device 101, and the capacitor device 102 forms a capacitor region. The power conversion module 1 further includes a first via 106, a second via 107, a third via 108 and a fourth via 109. The first via 106 is electrically connected to the switch positive terminal 101a, the second via 107 is electrically connected to the switch negative terminal 101b, the third via 108 is electrically connected to the capacitor positive terminal 102a, and the fourth via 109 is electrically connected to the capacitor negative terminal 102b. The first via 106 and the third via 108 are electrically connected to part of the copper layer L1 (i.e. the part of the copper layer L1 electrically connected to the switch positive terminal 101a and the capacitor positive terminal 102a), the copper layer L3, the copper layer L5, the copper layer L7 and part of the copper layer L8 (i.e. the part of the copper layer L8 electrically connected to the input positive terminal Vin+). The second via 107 and the fourth via 109 are electrically connected to part of the copper layer L1 (i.e. the part of the copper layer L1 electrically connected to the switch negative terminal 101b and the capacitor negative terminal 102b), the copper layer L2, the copper layer L4, the copper layer L6 and part of the copper layer L8 (i.e. the part of the copper layer L8 electrically connected to the input negative terminal Vin-). The positive copper layers and the negative copper layers are arranged alternately. The first via 106 and the third via 108 are electrically connected to the input positive terminal Vin+, and the second via 107 and the fourth via 109 are electrically connected to the input negative terminal Vin-. The input positive terminal Vin+ and the input negative terminal Vin- are arranged on the second surface of the multi-layer printed circuit board. Figure 7 The arrow lines in the figure represent the direction of the alternating current of the present embodiment. The following example illustrates the alternating current loop of the present embodiment. Starting from the capacitor positive terminal 102a of the capacitor device 102, the alternating current passes through the third via 108, flows through each positive copper layer, and then flows into the switch positive terminal 101a of the switch device 101 through the first via 106. Starting from the switch negative terminal 101b of the switch device 101, the alternating current passes through the second via 107, flows through each negative copper layer, and then flows into the capacitor negative terminal 102b of the capacitor device 102 through the fourth via 109. The direction of the current flowing through adjacent positive copper layers and negative copper layers is opposite. Figure 7The overlapped portions of the first via 106 and the third via 108 with the copper layers L2, L4 and L6 only represent the front and back relationship between the vias and the copper layers under this perspective condition, not the actual connection. Similarly, the overlapped portions of the second via 107 and the fourth via 109 with the copper layers L3, L5 and L7 only represent the front and back relationship between the vias and the copper layers under this perspective condition, not the actual connection. The alternating current flowing directions on the adjacent copper layers are opposite, so that the alternating magnetic flux between the adjacent copper layers is cancelled out, thus reducing the parasitic inductance of the current loop, and further improving the conversion efficiency of the power conversion module.

[0048] In addition, the power conversion module 1 further comprises a dielectric layer PP between any two adjacent copper layers. The projections of the adjacent positive copper layers and negative copper layers and the capacitor region on the first surface 11 are at least partially overlapped, thereby reducing the parasitic inductance of the wiring and reducing the parasitic loss, and further improving the conversion efficiency of the power conversion module. In some embodiments, the first via 106, the second via 107, the third via 108 and the fourth via 109 are straight holes or stepped holes.

[0049] In some embodiments, part of the copper layer L8 is electrically connected to the output positive terminal of the power conversion module 1, and part of the copper layer L8 is electrically connected to the output negative terminal of the power conversion module 1.

[0050] In another embodiment, when the positive copper layer of the copper layer on one side of the magnetic core assembly 103 is one layer and the negative copper layer is also only one layer, the number of layers of the copper layer on one side of the magnetic core assembly 103 is two more than the number of layers of the copper layer on the other side of the magnetic core assembly 103.

[0051] It should be noted that, Figure 4 The side view shown focuses on presenting the position and connection relationship between the copper layers, the magnetic core assembly and the corresponding winding vias, Figure 7 The side view shown focuses on presenting the positive copper layer and the negative copper layer and the electrical connection relationship with the switching device and the capacitor device, and in fact, Figure 4 and Figure 7 The structure shown can be implemented in different power conversion modules, or in the same power conversion module.

[0052] In summary, the present disclosure provides a power conversion module, by having more layers of copper on one side of the magnetic core assembly than on the other side, a larger layout area and copper area can be obtained by the copper layers on one side of the magnetic core assembly. This provides sufficient space for the layout to avoid the strong electromagnetic interference caused by the power loop, and increases the flexibility of the copper network, reduces the parasitic resistance and parasitic inductance of the multi-layer printed circuit board, and thus improves the conversion efficiency of the power conversion module. The present disclosure also provides a power conversion module, by interlacedly arranging a plurality of positive copper layers and a plurality of negative copper layers to be electrically connected to the corresponding switch positive and negative terminals, capacitor positive and negative terminals, and a plurality of vias, the projections of the adjacent positive copper layers and negative copper layers and the capacitor region on the first surface are at least partially overlapped, thereby reducing the parasitic inductance of the layout and reducing the parasitic loss, and thus improving the conversion efficiency of the power conversion module.

[0053] It should be noted that the above only describes the preferred embodiments of the present disclosure, and the present disclosure is not limited to the described embodiments, the scope of the present disclosure is determined by the appended claims. And the present disclosure can be modified by those skilled in the art, but all do not deviate from the protection of the appended claims.

Claims

1. A power conversion module comprising: a multi-layer printed circuit board, wherein the multi-layer printed circuit board has a first surface and a second surface, the first surface and the second surface are opposite, and the multi-layer printed circuit board has a plurality of copper layers, the plurality of copper layers include a plurality of positive copper layers and a plurality of negative copper layers, the plurality of positive copper layers and the plurality of negative copper layers are arranged alternately; at least one switching device arranged on the first surface of the multi-layer printed circuit board, wherein the switching device comprises a switching positive terminal and a switching negative terminal; at least one capacitor device arranged on the first surface of the multi-layer printed circuit board, wherein the capacitor device has a capacitor positive terminal and a capacitor negative terminal, and the at least one capacitor device forms a capacitor region; at least one first via, at least one second via, at least one third via and at least one fourth via, wherein the first via is electrically connected to the switching positive terminal, the second via is electrically connected to the switching negative terminal, the third via is electrically connected to the capacitor positive terminal, and the fourth via is electrically connected to the capacitor negative terminal, wherein the plurality of positive copper layers are electrically connected to the first via and the third via, and the plurality of negative copper layers are electrically connected to the second via and the fourth via; and a dielectric layer arranged between any two adjacent copper layers, wherein the projections of the adjacent positive copper layer and the adjacent negative copper layer and the capacitor region on the first surface are at least partially overlapped.

2. The power conversion module of claim 1, wherein, The current directions flowing through the adjacent positive copper layer and the adjacent negative copper layer are opposite.

3. The power conversion module of claim 1, wherein, The switching device comprises at least one upper switch and at least one lower switch which are electrically connected to each other, and the at least one upper switch and the at least one lower switch have a contact point therebetween, and the at least one switching device and the at least one capacitor device are arranged adjacent to each other on the first surface.

4. The power conversion module of claim 3, wherein, The contact point of the switching device is electrically connected to at least one inductor, the projection of the inductor and the switching device on the first surface is at least partially overlapped, and the inductor is electrically connected to an output positive terminal of the power conversion module, and the output positive terminal is arranged on the second surface of the multi-layer printed circuit board.

5. The power conversion module of claim 4, wherein, A magnetic core assembly of the inductor is located in an inner layer of the multi-layer printed circuit board, and the number of copper layers located on the side of the magnetic core assembly close to the first surface is more than the number of copper layers located on the other side of the magnetic core assembly by at least two layers.

6. The power conversion module of claim 4, wherein, The multi-layer printed circuit board further comprises winding vias which are used as windings of the inductor, and the winding vias are straight holes.

7. The power conversion module of claim 1, wherein, The first via and the third via are electrically connected to an input positive terminal of the power conversion module, and the second via and the fourth via are electrically connected to an input negative terminal of the power conversion module.

8. The power conversion module of claim 7, wherein, The input positive terminal and the input negative terminal are arranged on the second surface of the multi-layer printed circuit board.

9. The power conversion module of claim 1, wherein, The first via, the second via, the third via and the fourth via are straight holes or stepped holes.

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