Power conversion module

Abstract

This disclosure relates to a power conversion module comprising a multilayer printed circuit board, at least one switching device, at least one magnetic core assembly, and at least one winding via. The multilayer printed circuit board has a first side, a second side, and an inner layer, with the first and second sides facing each other, and the multilayer printed circuit board has multiple copper layers. The switching device is disposed on the first side of the multilayer printed circuit board. The magnetic core assembly is disposed in the inner layer of the multilayer printed circuit board, wherein the magnetic core assembly has at least one hole. One end of the winding via is electrically connected to the switching device, and the other end of the winding via is electrically connected to the second side of the multilayer printed circuit board, and the winding via passes through the hole of the magnetic core assembly, forming a magnetic assembly with the magnetic core assembly. The number of copper layers on the side of the magnetic core assembly closer to the first side of the multilayer printed circuit board is at least two more than the number of copper layers on the other side of the magnetic core assembly.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a power conversion module, in particular to a power conversion module with different number of copper layers on both sides of a magnetic core assembly. BACKGROUND

[0002] With the rapid development of mobile communication and cloud computing technologies, high-power power conversion modules are widely used in electronic products. As electronic products are becoming more powerful and smaller, it is important to improve the conversion efficiency of power conversion modules and reduce the size of power conversion modules.

[0003] The existing power conversion module embeds the magnetic core assembly in a multi-layer printed circuit board to reduce the size of the power conversion module. In order to facilitate the process, the number of layers of the printed circuit board above and below the magnetic core assembly is the same. However, this arrangement limits the wiring area and copper area above or below the magnetic core assembly, increasing the difficulty of internal wiring of the printed circuit board. In addition, due to the increase in wiring length, the parasitic loss of wiring increases, the interference between signals increases, and the conversion efficiency of the power conversion module is affected.

[0004] Therefore, it is an urgent need to develop a power conversion module that can improve the above-mentioned prior art. SUMMARY

[0005] The purpose of the present disclosure is to provide a power conversion module, wherein the magnetic core assembly is accommodated in a multi-layer printed circuit board with multiple copper layers, and the number of copper layers on one side of the magnetic core assembly is greater than that on the other side. This can provide a larger wiring area and copper area by concentrating more copper layers on one side of the magnetic core assembly. This provides sufficient space for wiring to avoid strong electromagnetic field interference caused by power loops, increases the flexibility of the copper network, and reduces the parasitic resistance and inductance of the multi-layer printed circuit board, thereby improving the conversion efficiency of the power conversion module.

[0006] According to the concept of the present disclosure, the present disclosure provides a power conversion module, comprising a multi-layer printed circuit board, at least one switching device, at least one magnetic core assembly, and at least one winding via. The multi-layer printed circuit board has a first surface, a second surface, and an inner layer, the first surface and the second surface are opposite, and the multi-layer printed circuit board has a plurality of copper layers. The switching device is arranged on the first surface of the multi-layer printed circuit board. The magnetic core assembly is arranged in the inner layer of the multi-layer printed circuit board, wherein the magnetic core assembly has at least one hole. One end of the winding via is electrically connected to the switching device, the other end of the winding via is electrically connected to the second surface of the multi-layer printed circuit board, and the winding via passes through the hole of the magnetic core assembly and forms a magnetic assembly with the magnetic core assembly. Wherein, the number of copper layers on the side of the magnetic core assembly close to the first surface of the multi-layer printed circuit board is at least two more than the number of copper layers on the other side of the magnetic core assembly. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 The schematic diagram of the power conversion module of the preferred embodiment of the present disclosure is shown in the figure.

[0008] Figure 2 The schematic diagram of the power conversion module of the preferred embodiment of the present disclosure is shown in the figure.

[0009] Figure 3 The schematic diagram of the power conversion module of the preferred embodiment of the present disclosure is shown in the figure.

[0010] Figure 4 The schematic diagram of the power conversion module of the preferred embodiment of the present disclosure is shown in the figure.

[0011] Figure 5 The schematic diagram of the second surface of the power conversion module of the preferred embodiment of the present disclosure is shown in the figure.

[0012] Figure 6 The schematic diagram of the equivalent circuit of the power conversion module of the present disclosure is shown in the figure.

[0013] Figure 7 The schematic diagram of the power conversion module of another preferred embodiment of the present disclosure is shown in the figure.

[0014] Wherein, the figure mark is explained as follows:

[0015] 1: power conversion module

[0016] 10: multi-layer printed circuit board

[0017] 101: switching device

[0018] 101a: positive terminal of switch

[0019] 101b: negative terminal of switch

[0020] 102: capacitor device

[0021] 102a: positive terminal of capacitor

[0022] 102b: negative terminal of capacitor

[0023] 103: magnetic core assembly

[0024] 104: hole

[0025] 105: winding via hole

[0026] 106: first via hole

[0027] 107: second via hole

[0028] 108: third via hole

[0029] 109: fourth via hole

[0030] 11: first surface

[0031] 12: second surface

[0032] 13: pad

[0033] 14: inner layer

[0034] PP: dielectric layer

[0035] L1-L8: copper layer

[0036] Vin+: positive input terminal

[0037] Vin-: negative input terminal

[0038] SW: contact

[0039] Cin: input capacitor

[0040] Co: output capacitor

[0041] Vin: input voltage

[0042] Vo: output voltage DETAILED DESCRIPTION

[0043] Some typical embodiments embodying features and advantages of the present disclosure will be described in detail in the following description. It should be understood that the present disclosure can have various changes on different embodiments, all of which do not deviate from the scope of the present disclosure, and the description and drawings in the present disclosure are essentially used as an illustration, not as a limitation of the present disclosure.

[0044] Figure 1 The perspective structural schematic diagram of the power conversion module of the preferred embodiment of the present disclosure. Figure 2 The exploded structural schematic diagram of the power conversion module of the preferred embodiment of the present disclosure. Figure 3This is a side view of a power conversion module according to a preferred embodiment of the present disclosure. Figure 4 This is a side view of a power conversion module according to a preferred embodiment of this disclosure. Figures 1 to 4 As shown, the power conversion module 1 includes a multilayer printed circuit board 10, at least one switching device 101, at least one capacitor device 102, at least one magnetic core assembly 103, and at least one winding via 105. The multilayer printed circuit board 10 has a first surface 11, a second surface 12, and an inner layer 14, with the first surface 11 and the second surface 12 facing each other. The multilayer printed circuit board 10 has multiple copper layers L1 to L8. The switching device 101 is disposed on the first surface 11 of the multilayer printed circuit board 10. The magnetic core assembly 103 is disposed in the inner layer 14 of the multilayer printed circuit board 10, wherein the magnetic core assembly 103 has a hole 104. One end of the winding via 105 is electrically connected to the switching device 101, and the other end of the winding via 105 is electrically connected to the second surface 12 of the multilayer printed circuit board 10. The winding via 105 passes through the hole 104 of the magnetic core assembly 103 and forms a magnetic assembly with the magnetic core assembly 103. The winding via 105 is electrically connected to all or part of the copper layers. A capacitor device 102 is disposed on the first surface 11 of the multilayer printed circuit board 10. The capacitor device 102 includes at least one capacitor, which may be an input capacitor or an output capacitor. In some embodiments, the winding via 105 is a straight via or a stepped via; specifically, the winding via 105 may have a straight structure or a partially bent structure. The number of copper layers on the side of the core assembly 103 closest to the first surface 11 of the multilayer printed circuit board 10 is at least two more than the number of copper layers on the other side of the core assembly 103. In some embodiments, the number of copper layers on the side of the core assembly 103 closest to the first surface 11 of the multilayer printed circuit board 10 is at least three more than the number of copper layers on the other side of the core assembly 103. Figure 3 and Figure 4For example, the multi-layer printed circuit board 10 includes eight copper layers L1-L8 and eight dielectric layers PP, the dielectric layers PP are arranged between two adjacent copper layers, but the actual number of layers is not limited thereto. The magnetic core assembly 103 is arranged between the copper layers L7 and L8 in the multi-layer printed circuit board 10. Therefore, the number of copper layers L1-L7 on one side of the magnetic core assembly 103 is more than the number of copper layers L8 on the other side of the magnetic core assembly 103, and the copper layers L1-L7 have a larger wiring area and copper area. Therefore, by increasing the number of copper layers on one side of the magnetic core assembly 103 than the number of copper layers on the other side of the magnetic core assembly 103, for example, the number of copper layers on one side of the magnetic core assembly 103 is two more than the number of copper layers on the other side of the magnetic core assembly 103, a larger wiring area and copper area can be obtained by using the copper layers on one side of the magnetic core assembly 103 and the number of copper layers is larger. Therefore, sufficient space is provided for wiring to avoid strong electromagnetic field interference caused by the power loop, and the flexibility of the copper network is increased, and the parasitic resistance and parasitic inductance of the multi-layer printed circuit board are reduced, thereby improving the conversion efficiency of the power conversion module.

[0045] Figure 5 is a structural schematic diagram of the second surface of the power conversion module of the preferred embodiment of the present disclosure. In some embodiments, as shown in Figure 5 the power conversion module 1 also includes a solder pad 13 arranged on the second surface 12 of the multi-layer printed circuit board 10. The solder pad 13 is a copper block pin or a surface copper skin of the multi-layer printed circuit board 10, and the solder pad 13 is fixed on the second surface 12, and the other end of the winding via hole 105 is electrically connected to the solder pad 13.

[0046] Figure 6 is an equivalent circuit schematic diagram of the power conversion module of the present disclosure. As shown in Figure 6As shown, capacitor device 102 includes an input capacitor Cin and an output capacitor Co. The magnetic component is an inductor Lo, wherein the winding via 105 serves as the winding of inductor Lo. Switching device 101 has an upper switch 1010 and a lower switch 1011, which may be, for example, MOS (Metal Oxide Semiconductor), but are not limited thereto. A contact SW is provided between the upper switch 1010 and the lower switch 1011. Contact SW is electrically connected to inductor Lo and is also electrically connected to one end of winding via 105. One end of input capacitor Cin is electrically connected to upper switch 1010 to form the positive input terminal Vin+, and the other end of input capacitor Cin is electrically connected to lower switch 1011 to form the negative input terminal Vin-. One end of output capacitor Co is electrically connected to inductor Lo, and the other end of output capacitor Co is electrically connected to lower switch 1011. In some embodiments, the inductor Lo, as the magnetic component in the above embodiments, is located on the inner layer 14 of the multilayer printed circuit board 10. The projection of the inductor Lo and the switching device 101 on the first surface 11 at least partially overlaps, and the inductor Lo is electrically connected to the positive output terminal Vo+ of the power conversion module 1, which is located on the second surface 12 of the multilayer printed circuit board 10. It is worth noting that... Figure 6 The diagram only shows a single-phase half-bridge branch. In an actual power conversion module, it may include multiple phases connected in parallel.

[0047] Figure 7 This is a side view of a power conversion module according to another preferred embodiment of the present disclosure. Figure 7 and Figure 4 Components with similar structures and functions are represented by the same designation, and will not be elaborated further here. Figure 7In the illustrated embodiment, the multiple copper layers include multiple positive copper layers and multiple negative copper layers, which are alternately arranged. In some embodiments, the positive copper layers include copper layers L3, L5, and L7, and the negative copper layers include copper layers L2, L4, and L6. The switching device 101 has a positive terminal 101a and a negative terminal 101b, and the capacitor device 102 has a positive terminal 102a and a negative terminal 102b. The capacitor device 102 is disposed on the first surface 11 and adjacent to the switching device 101, and the capacitor device 102 forms a capacitor region. The power conversion module 1 also includes a first via 106, a second via 107, a third via 108, and a fourth via 109. The first via 106 is electrically connected to the positive terminal 101a of the switch, the second via 107 is electrically connected to the negative terminal 101b of the switch, the third via 108 is electrically connected to the positive terminal 102a of the capacitor, and the fourth via 109 is electrically connected to the negative terminal 102b of the capacitor. The first via 106 and the third via 108 are electrically connected to portions of copper layer L1 (i.e., the portions of copper layer L1 electrically connected to the positive terminal 101a of the switch and the positive terminal 102a of the capacitor), copper layers L3, L5, and L7, and a portion of copper layer L8 (i.e., the portion of copper layer L8 electrically connected to the positive input terminal Vin+). The second via 107 and the fourth via 109 are electrically connected to portions of copper layer L1 (i.e., the portions of copper layer L1 electrically connected to the negative terminal 101b of the switch and the negative terminal 102b of the capacitor), copper layers L2, L4, and L6, and a portion of copper layer L8 (i.e., the portion of copper layer L8 electrically connected to the negative input terminal Vin-). The positive and negative copper layers are alternately arranged. The first via 106 and the third via 108 are electrically connected to the positive input terminal Vin+, and the second via 107 and the fourth via 109 are electrically connected to the negative input terminal Vin-. The positive input terminal Vin+ and the negative input terminal Vin- are located on the second surface of the multilayer printed circuit board. Figure 7 The arrows in the diagram represent the direction of the alternating current in this embodiment. The following example illustrates the alternating current loop of this embodiment. Starting from the positive terminal 102a of capacitor device 102, the alternating current flows through the third via 108, through each positive copper layer, and then through the first via 106 into the positive terminal 101a of switch device 101. Starting from the negative terminal 101b of switch device 101, the alternating current flows through the second via 107, through each negative copper layer, and then through the fourth via 109 into the negative terminal 102b of capacitor device 102. The current flowing through adjacent positive and negative copper layers has opposite directions. Figure 7The overlapping portions of the first via 106 and the third via 108 with copper layers L2, L4, and L6 shown only represent the relative positions of the vias and copper layers under this viewing angle, not actual connections. Similarly, the overlapping portions of the second via 107 and the fourth via 109 with copper layers L3, L5, and L7 only represent the relative positions of the vias and copper layers under this viewing angle, not actual connections. By using alternating currents in opposite directions on adjacent copper layers, the alternating magnetic flux between adjacent copper layers cancels each other out, thus reducing the parasitic inductance of the current loop and improving the conversion efficiency of the power conversion module.

[0048] Furthermore, the power conversion module 1 also includes a dielectric layer PP, which is located between any two adjacent copper layers. The projections of adjacent positive and negative copper layers and the capacitor region onto the first surface 11 at least partially overlap, thereby reducing parasitic inductance and parasitic losses in the wiring, and thus improving the conversion efficiency of the power conversion module. In some embodiments, the first via 106, the second via 107, the third via 108, and the fourth via 109 are straight holes or stepped holes.

[0049] In some embodiments, a portion of the copper layer L8 is electrically connected to the positive output terminal of the power conversion module 1, and a portion of the copper layer L8 is electrically connected to the negative output terminal of the power conversion module 1.

[0050] In another embodiment, when the positive copper layer on one side of the magnetic core assembly 103 is one layer and the negative copper layer is also only one layer, the number of copper layers on one side of the magnetic core assembly 103 is two more than the number of copper layers on the other side of the magnetic core assembly 103.

[0051] It should be noted that, Figure 4 The side view shown focuses on illustrating the position and connection relationships between the copper layer, the magnetic core assembly, and the corresponding winding vias. Figure 7 The side view shown focuses on illustrating the electrical connections between the positive and negative copper layers and the switching and capacitor devices. However, in reality... Figure 4 and Figure 7 The structure shown can be implemented in different power conversion modules or in the same power conversion module.

[0052] In summary, this disclosure provides a power conversion module that utilizes a larger copper layer concentration on one side of the core assembly compared to the other side to achieve a larger wiring area and copper plating area. This provides sufficient space for wiring to avoid strong electromagnetic interference caused by power loops, increases the flexibility of the copper plating network, and reduces parasitic resistance and inductance of multilayer printed circuit boards, thereby improving the conversion efficiency of the power conversion module. This disclosure also provides a power conversion module in which multiple staggered positive and negative copper layers are electrically connected to corresponding switch positive and negative terminals, capacitor positive and negative terminals, and multiple vias. The projections of adjacent positive and negative copper layers and the capacitor area on the first surface at least partially overlap, thereby reducing parasitic inductance and parasitic losses in the wiring, and further improving the conversion efficiency of the power conversion module.

[0053] It should be noted that the above are merely preferred embodiments for illustrating this disclosure, and this disclosure is not limited to the described embodiments. The scope of this disclosure is determined by the appended claims. Furthermore, this disclosure may be modified in various ways by those skilled in the art, but all such modifications shall not depart from the protection sought by the appended claims.

Claims

1. A power conversion module, comprising: a multi-layer printed circuit board, wherein the multi-layer printed circuit board has a first surface, a second surface, and an inner layer, the first surface and the second surface are opposite, and the multi-layer printed circuit board has a plurality of copper layers; at least one switching device disposed on the first surface of the multi-layer printed circuit board; at least one magnetic core assembly disposed in the inner layer of the multi-layer printed circuit board, wherein the magnetic core assembly has at least one hole; and at least one winding via, wherein one end of the winding via is electrically connected to the switching device, the other end of the winding via is electrically connected to the second surface of the multi-layer printed circuit board, and the winding via passes through the hole of the magnetic core assembly and forms a magnetic assembly with the magnetic core assembly, wherein the number of the copper layers used as circuit layout on the side of the magnetic core assembly close to the first surface of the multi-layer printed circuit board is at least two more than the number of the copper layers used as circuit layout on the other side of the magnetic core assembly, and the number of the copper layers used as circuit layout on the other side of the magnetic core assembly is at least one, wherein the plurality of copper layers include a plurality of positive copper layers and a plurality of negative copper layers, the plurality of positive copper layers are electrically connected to each other, and the plurality of negative copper layers are electrically connected to each other.

2. The power conversion module of claim 1, wherein, The number of the copper layers on the side of the magnetic core assembly close to the first surface of the multi-layer printed circuit board is at least three more than the number of the copper layers on the other side of the magnetic core assembly.

3. The power conversion module of claim 1, further comprising at least one pad disposed on the second surface of the multi-layer printed circuit board, and the other end of the winding via is electrically connected to the pad.

4. The power conversion module of claim 3, wherein, The pad is a copper block pin or a surface copper skin of the multi-layer printed circuit board, and the pad is fixed on the second surface.

5. The power conversion module of claim 1, wherein, The winding via is electrically connected to all or part of the plurality of copper layers.

6. The power conversion module of claim 1, wherein, The winding via is a straight hole or a stepped hole.

7. The power conversion module of claim 1, wherein, The magnetic assembly constitutes an inductor.

8. The power conversion module of claim 1, further comprising a capacitor device disposed on the first surface of the multi-layer printed circuit board, wherein the capacitor device comprises at least one capacitor, and the capacitor is an input capacitor or an output capacitor.

9. The power conversion module of claim 1, wherein, The switching device comprises at least one upper switch and at least one lower switch electrically connected, and the upper switch and the lower switch have a contact point, and the contact point of the upper switch and the lower switch is electrically connected to one end of the winding via.

10. The power conversion module of claim 8, wherein, The plurality of positive copper layers and the plurality of negative copper layers are arranged alternately, and the current directions flowing through adjacent positive copper layers and negative copper layers are opposite.

11. The power conversion module of claim 10, further comprising at least a first via, at least a second via, at least a third via, and at least a fourth via, wherein the first via is electrically connected to a switch positive terminal of the switch device, the second via is electrically connected to a switch negative terminal of the switch device, the third via is electrically connected to a capacitor positive terminal of the capacitor device, and the fourth via is electrically connected to a capacitor negative terminal of the capacitor device, wherein, The plurality of positive copper layers are electrically connected to the first via and the third via, and the plurality of negative copper layers are electrically connected to the second via and the fourth via.

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