Integrated circuit pin configuration method and embedded touch display driver integrated circuit

Abstract

The present invention provides a pin configuration method of an integrated circuit and an embedded touch display driver integrated circuit. The pin configuration method of the integrated circuit includes: dividing the integrated circuit into a middle block, a left block and a right block in a first axis direction; configuring the outer lead bonding (OLB) pins of the integrated circuit in sequence from the edge of the middle block along the first coordinate of the second axis to the second coordinate of the second axis; and configuring at least one auxiliary bump at the vacant position of the left block and the right block, respectively, wherein the first coordinate is not equal to the second coordinate.

Description

Technical Field

[0001] The present invention relates to a display driver integrated circuit technology, and more specifically, to an integrated circuit pin configuration method and an embedded touch display driver integrated circuit. Background Art

[0002] Figure 1 This is a schematic diagram of the configuration of the outer lead bonding (OLB) and inner lead bonding (ILB) pins of the embedded touch display driver integrated circuit in the prior art. Please refer to Figure 1 In a conventional display touch driver component, the inner pin positions 101 and the outer pin positions 102 are evenly placed on the upper and lower sides of the touch display driver integrated circuit, such as Figure 1 Therefore, when the touch display driver integrated circuit is attached to the panel, the stress of the attachment will be evenly distributed on the pins on the upper and lower sides of the touch display driver integrated circuit, and there will be no problem of uneven force on the touch display driver integrated circuit.

[0003] However, due to the demand for full screen, the panel has a height limit on the bottom edge, so this pin design cannot meet the requirement of reducing the bottom edge. Summary of the invention

[0004] An object of the present invention is to provide a pin configuration method of an integrated circuit and an embedded touch display driver integrated circuit to achieve a narrow frame design of a display panel.

[0005] An object of the present invention is to provide a pin configuration method of an integrated circuit and an embedded touch display driver integrated circuit to achieve stress balance and avoid improper bonding.

[0006] In view of this, the present invention provides a pin configuration method for an integrated circuit, wherein the integrated circuit is used to drive a display panel, and the pin configuration method for the integrated circuit includes: dividing the surface of the integrated circuit into a middle block, a left block and a right block along a first axial direction; configuring the external pins of the integrated circuit in sequence from the edges of the intersection of the middle block and the left and right blocks on both sides along the first coordinate of the second axial direction to the second coordinate of the second axial direction; and configuring at least one auxiliary bump in the left block and the right block respectively, wherein the first coordinate is not equal to the second coordinate.

[0007] The present invention further provides an embedded touch display driver integrated circuit for driving a display panel, wherein the embedded touch display driver integrated circuit comprises a plurality of pins, a left block, a middle block and a right block. The external pins of the middle block are arranged along a first axial direction. The external pins of the left block and the right block are arranged in sequence from the edge of the middle block along a first coordinate of a second axial direction to a second coordinate of the second axial direction; and at least one auxiliary bump is arranged at an empty position of the left block and the right block, respectively, wherein the first coordinate is not equal to the second coordinate.

[0008] According to the pin configuration method of the integrated circuit and the embedded touch display driver integrated circuit described in the preferred embodiment of the present invention, the configuration method of the auxiliary bumps includes: directly configuring the auxiliary bumps on the passivation protection layer of the integrated circuit. In another preferred embodiment, the configuration method of the auxiliary bumps includes: setting a default auxiliary metal at a default position of the integrated circuit corresponding to the auxiliary bump; and configuring the auxiliary bumps for the block with the preset auxiliary metal.

[0009] The spirit of the present invention lies in the pin configuration of the integrated circuit. The external pins are arranged in a trapezoidal sinking pin arrangement, that is, the external pins on both sides of the left and right blocks of the integrated circuit are slightly lower than the external pins in the central block, so that they are arranged in a trapezoidal manner. By overlapping the concept of data fanout, the lower edge of the panel can be reduced, and auxiliary bumps are set in the vacant positions in the left and right blocks of the integrated circuit, so that when bonding or bonding the above integrated circuit, there will be no undesirable skew caused by uneven stress.

[0010] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 The present invention is a schematic diagram of the configuration of the external pin positions and the internal pin positions of the embedded touch display driver integrated circuit in the prior art.

[0012] Figure 2 The figure is a schematic diagram showing the configuration of external pins and internal pins of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention.

[0013] Figure 3 The figure is a schematic diagram showing the configuration of external pins and internal pins of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention.

[0014] Figure 4The present invention is a schematic diagram of the configuration of the external pins and the internal pins of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention and a cross-sectional view thereof.

[0015] Figure 5 The present invention is a schematic diagram of the configuration of the external pins and the internal pins of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention and a cross-sectional view thereof.

[0016] Figure 6 The present invention is a schematic diagram of the configuration of the external pins and the internal pins of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention and a cross-sectional view thereof.

[0017] Figure 7 The present invention is a schematic diagram of the configuration of the external pins and the internal pins of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention and a cross-sectional view thereof.

[0018] Figure 8 The present invention is a flowchart of a pin configuration method of an integrated circuit according to a preferred embodiment of the present invention.

[0019] Explanation of symbols:

[0020] 100: LCD panel with optical reading function

[0021] 101: Inner pin position

[0022] 102: External pin position

[0023] 201: Left block

[0024] 202: Middle block

[0025] 203: Right block

[0026] 301, 302: Auxiliary bumps

[0027] S801-S804: Process steps of the integrated circuit pin configuration method according to the embodiment of the present invention DETAILED DESCRIPTION

[0028] Figure 2 This is a schematic diagram of the configuration of the outer lead bonding (OLB) and inner lead bonding (ILB) pins of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention. Figure 2, the embedded touch display driver integrated circuit adopts another design method, which is to change the external pin position to a sunken type. Among them, the embedded touch display driver integrated circuit is divided into three blocks in the X-axis direction, namely a left block 201, a middle block 202 and a right block 203. The external pin positions of the middle block 202 are arranged along the X-axis direction. The external pin positions of the left block 201 and the right block 203 are arranged in sequence along the Y-axis coordinate Y1 to the Y-axis coordinate Y2. Therefore, a trapezoidal-like sunken pin arrangement is formed. By overlapping the data fan-out concept, the lower edge of the panel can be reduced. That is to say, the pin positions of the external pins extend along the X-axis direction in the middle block 202, and in the left block 201 and the right block 203, the pin positions of the external pins are arranged from the edge of the junction of the middle block 202 and the left and right blocks 201 and 203, and are gradually displaced a certain distance in a direction away from the junction edge, so that they are distributed in a trapezoidal shape.

[0029] However, this arrangement of sunken pins may cause uneven stress on the bonding and binding of the outer pins and the inner pins, resulting in the undesirable phenomenon that the outer pins of the embedded touch display driver integrated circuit are tilted to the left or right after bonding, and finally causing a poor yield problem in the bonding of the display touch driver component and the panel.

[0030] Figure 3 FIG. 1 is a schematic diagram of the configuration of the outer pins (OLB) and inner pins (ILB) of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention. Figure 2 as well as Figure 3 , Figure 2 and Figure 3 The difference is that Figure 3 The embedded touch display driver integrated circuit has additional pins 301 and 302, and the pins 301 and 302 are auxiliary bumps (Dummy Bump). In this embodiment, three auxiliary bumps 301 and 302 are installed in the vacant positions of the left block 201 and the right block 203 where no external pin pins are formed, or between the external pin pins and the long side edges of the integrated circuit. The size and number of the auxiliary bumps are adjusted elastically to increase the support stress during bonding and binding, thereby solving the problem of uneven distribution of bonding stress in the arrangement of sunken external pins. Since the auxiliary bumps are used for auxiliary support, they do not necessarily need to be bonded, and the present invention is not limited to this.

[0031] Figure 4 This is a schematic diagram of the configuration of the outer pins (OLB) and inner pins (ILB) of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention and its cross-sectional view. Figure 4The lower half of the diagram is a cross-sectional view of the dotted line section in the upper view. In the manufacturing process of a general embedded touch display driver integrated circuit, a passivation protection mask is used to open a window in the passivation layer of the integrated circuit, such as Figure 4 As shown, the purpose is to allow the metal at the window position to be electrically connected to the pins on the embedded touch display driver integrated circuit, so that the signal or power supply of the embedded touch display driver integrated circuit can be connected to the external environment. However, in order to solve the problem of the auxiliary bumps increased by uneven bonding stress, the passivation protection mask must also be opened at the position of the auxiliary bumps when the embedded touch display driver integrated circuit is manufactured. If there is a need for auxiliary bumps at different positions, the passivation protection mask of the embedded touch display driver integrated circuit must be repeatedly modified, such as Figure 5 shown. Figure 5 The schematic diagram of the configuration of the external pins and the internal pins of the embedded touch display driver integrated circuit of a preferred embodiment of the present invention and its cross-sectional view. Figure 4 Example, Figure 5 The auxiliary bumps in the embodiment have only two. Figure 4 and Figure 5 As can be seen from the description, due to different auxiliary bump designs, the position of the passivation protection mask is modified again, which increases the number of mask revisions of the embedded touch display driver integrated circuit and increases the manufacturing cost of the embedded touch display driver integrated circuit.

[0032] Figure 6 This is a schematic diagram of the configuration of the external pins and internal pins of an embedded touch display driver integrated circuit according to a preferred embodiment of the present invention and its cross-sectional view. Figure 6 In this embodiment, regardless of the arrangement of the sunken pins and the position of the auxiliary bumps, except for the normal pads that need to have windows in the passivation protection mask, the masks corresponding to the other auxiliary bumps do not allow windows to be opened. During the packaging process, the auxiliary bumps are directly grown at the positions required by the passivation protection layer. In this way, the position of the auxiliary bumps can be flexibly adjusted without repeatedly modifying the passivation protection mask. Therefore, a lot of integrated circuit manufacturing costs can be saved. That is to say, in this embodiment, the auxiliary bumps are electrically isolated from the upper metal of the integrated circuit.

[0033] In the above embodiment, if the number of auxiliary bumps is changed, the pin configuration diagram of this embodiment is as follows: Figure 7 shown. Figure 7 The schematic diagram of the configuration of the external pins and the internal pins of the embedded touch display driver integrated circuit of a preferred embodiment of the present invention and its cross-sectional view. Figure 6 Example, Figure 7 The embodiment has only one auxiliary bump.

[0034] In the above embodiments, the auxiliary bumps can also be called auxiliary pins, and the number of the auxiliary bumps is 1 to 3, and the design positions are, for example, the lower left corner and the lower right corner. However, a person skilled in the art should know that the number and position of the auxiliary bumps can be changed according to the actual design and cost. Therefore, as long as the bumps or pins are used for auxiliary support to solve the problem of uneven stress distribution, they all fall within the scope of the present invention. In addition, the shapes of the auxiliary bumps are all rectangular, but a person skilled in the art should know that the shape of the auxiliary bumps can also be circular or other regular or irregular shapes. Therefore, the present invention does not limit the shape of the auxiliary bumps.

[0035] Figure 8 This is a flowchart of a pin configuration method for an integrated circuit according to a preferred embodiment of the present invention. Figure 8 , the pin configuration method of the integrated circuit comprises the following steps:

[0036] Step S800: Start.

[0037] Step S801: Divide the surface of the integrated circuit into a middle block, a left block and a right block along a first axial direction. As described in the above embodiment, in the X-axis direction, the integrated circuit area is divided into a middle block, a left block and a right block.

[0038] Step S802: Arrange the external pins of the integrated circuit in sequence from the edges of the middle block and the left and right blocks along the first coordinate of the second axis to the second coordinate of the second axis, such as the arrangement of the sunken pins, as described in the above embodiment.

[0039] Step S803: at least one auxiliary bump is disposed at each of the vacant positions in the left block and the right block, so as to reduce the tilting rate and achieve stress balance through the auxiliary bumps.

[0040] Step S804: End.

[0041] In summary, the spirit of the present invention is that in the configuration of the pins, the external pins are arranged in a trapezoidal sinking pin arrangement. By overlapping the data fan-out concept, the edge of the panel can be reduced, and auxiliary bumps are set at the vacant positions of the integrated circuit, that is, the positions vacated after the external pins sink, so that when the above integrated circuit is bonded, the undesirable situation of skewness caused by uneven stress can be avoided.

[0042] The specific embodiments proposed in the detailed description of the preferred embodiments are only used to facilitate the description of the technical content of the present invention, and are not intended to narrowly limit the present invention to the above embodiments. Various changes and implementations made without exceeding the spirit of the present invention and the following claims are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the definition of the attached claims.

Claims

1. A method for configuring pin positions of an integrated circuit, characterized in that: The integrated circuit is used to drive a display panel. The pin configuration method of the integrated circuit includes: Dividing the surface of the integrated circuit into a middle block, a left block and a right block along a first axial direction; Arrange the external pins of the integrated circuit in sequence from the edges of the middle block and the two sides of the left and right blocks along the first coordinate of the second axis to the second coordinate of the second axis; and At least one auxiliary bump is disposed in the left block and the right block respectively. wherein the first coordinate is not equal to the second coordinate, The configuration of the pins of the external pins in the left and right blocks includes gradually shifting a certain distance from the border edge with the central block toward a direction away from the border edge.

2. The pin configuration method of an integrated circuit as claimed in claim 1, wherein: The auxiliary bump configuration method includes: Auxiliary bumps are directly arranged on the passivation protection layer of the integrated circuit.

3. The pin configuration method of an integrated circuit as claimed in claim 1, wherein: The auxiliary bump configuration method includes: Disposing a default auxiliary metal at a default position of the integrated circuit corresponding to the auxiliary bump; and Auxiliary bumps are arranged for the blocks with the preset auxiliary metal.

4. The pin configuration method of an integrated circuit as claimed in claim 1, wherein: The auxiliary bumps in the left block and the right block are located between the outer lead pins and the long side edges of the integrated circuit.

5. An embedded touch display driver integrated circuit for driving a display panel, comprising: Most foot positions; A left block including a plurality of external pin positions; A middle block including a plurality of external pin positions, wherein the external pin positions of the middle block are arranged along a first axial direction; A right side block including a plurality of external pin positions; The external pins of the left block and the right block are arranged in sequence from the edges of the junctions of the middle block and the left and right blocks, along the first coordinate of the second axis to the second coordinate of the second axis; and At least one auxiliary bump is disposed at each of the vacant positions of the left block and the right block. wherein the first coordinate is not equal to the second coordinate, The configuration of the pins of the external pins in the left and right blocks includes gradually shifting a certain distance from the border edge with the central block toward a direction away from the border edge.

6. The embedded touch display driver integrated circuit according to claim 5, wherein: Auxiliary bumps are directly arranged on the passivation protection layer of the embedded touch display driver integrated circuit.

7. The embedded touch display driver integrated circuit according to claim 5, wherein: Auxiliary metal is also included at a default position of the embedded touch display driver integrated circuit corresponding to the auxiliary bump.

8. The embedded touch display driver integrated circuit as claimed in claim 5, wherein: The auxiliary bumps in the left block and the right block are located between the outer lead pins and the long side edges of the integrated circuit.

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