Temperature detection circuit, driver chip, intelligent power module and air conditioner

Abstract

The present invention discloses a temperature detection circuit, a driver chip, an intelligent power module, and an air conditioner. The temperature detection circuit includes: a temperature sensing unit for collecting the temperature value of a device under test and outputting a corresponding analog temperature signal; a temperature-current conversion circuit connected to the output end of the temperature sensing unit and configured to convert the analog temperature signal into a corresponding current signal; and a pulse conversion quantization circuit connected to the output end of the temperature-current conversion circuit and configured to convert the current signal into a pulse signal and quantize the pulse signal to generate a digital temperature signal. The present invention can reduce the chip area occupied by the temperature detection circuit in an intelligent power module, a driver chip, etc., while ensuring quantization accuracy and resolution, and can also reduce the power consumption of the intelligent power module.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic circuits, and in particular to a temperature detection circuit, a drive chip, an intelligent power module and an air conditioner. Background Art

[0002] An intelligent power module (IPM) is a power drive product that combines power electronics and integrated circuit technology. It is typically used in electronic control boards that drive equipment such as fans and compressors. IPMs typically integrate power devices, which can experience significant temperature rises. This requires detecting the junction temperature of these devices and performing signal conversion, converting the analog temperature signal into a digital one. However, the complex structure of the analog-to-digital converter (ADC) requires a large chip area and consumes significant power. Furthermore, the ADC circuit typically requires a digital filter to improve the output signal quality, which complicates the circuit and increases both area and power consumption. Summary of the Invention

[0003] The main purpose of the present invention is to provide a temperature detection circuit, a driver chip, an intelligent power module and an air conditioner, aiming to reduce the chip area occupied by the temperature detection circuit in the intelligent power module, the driver chip, etc., and to reduce the power consumption of the intelligent power module.

[0004] To achieve the above object, the present invention proposes a temperature detection circuit comprising:

[0005] The temperature sensing unit is used to collect the temperature value of the device under test and output the corresponding analog temperature signal;

[0006] a temperature-current conversion circuit connected to the output end of the temperature sensing unit, the temperature-current conversion circuit being configured to convert the analog temperature signal into a corresponding current signal; and

[0007] The pulse conversion quantization circuit is connected to the output end of the temperature-current conversion circuit. The pulse conversion quantization circuit is used to convert the current signal into a pulse signal and quantize the pulse signal to generate a digital temperature signal.

[0008] Optionally, the temperature-current conversion circuit includes:

[0009] A delay unit proportional to absolute temperature and a delay unit complementary to absolute temperature are respectively connected to the output end of the temperature sensing unit; wherein the delay unit proportional to absolute temperature is used to generate a current proportional to absolute temperature according to the analog temperature signal; the delay unit complementary to absolute temperature is used to generate a current complementary to absolute temperature according to the analog temperature signal; and

[0010] An exclusive OR logic gate, wherein the two input ends of the exclusive OR logic gate are respectively connected to the delay unit proportional to absolute temperature and the delay unit complementary to absolute temperature, and the output end of the exclusive OR logic gate is the output end of the temperature-current conversion circuit.

[0011] Optionally, the temperature detection circuit further includes:

[0012] an inverter connected to an output terminal of the temperature current conversion circuit; and

[0013] A trigger, wherein the input end of the trigger is connected to the output end of the inverter, and the output end of the trigger is respectively connected to the controlled ends of the delay unit proportional to absolute temperature and the delay unit complementary to absolute temperature.

[0014] Optionally, the pulse conversion quantization circuit includes:

[0015] a temperature pulse conversion circuit, whose input terminal is connected to the output terminal of the temperature current conversion circuit, and is used to convert the current signal corresponding to the temperature value into a temperature modulated pulse width signal; and

[0016] A pulse counter is connected to the output end of the temperature pulse conversion circuit and is used to quantize the temperature modulated pulse width signal to generate the digital temperature signal.

[0017] Optionally, the temperature pulse conversion circuit includes a first capacitor and a comparator; wherein,

[0018] One end of the first capacitor is interconnected with the output end of the temperature-current conversion circuit and the first input end of the comparator, and the other end of the first capacitor is grounded;

[0019] The second input terminal of the comparator is connected to the first reference voltage, and the output terminal of the comparator is the output terminal of the temperature pulse conversion circuit.

[0020] Optionally, the temperature pulse conversion circuit further includes a first switch and a second switch, wherein the input end of the first switch is connected to a first DC power supply, and a common end of the first switch and the second switch is connected to the first input end of the comparator;

[0021] The input end of the second switch is connected to the output end of the temperature-current conversion circuit;

[0022] Wherein, the first switch and the second switch are interlocking switches.

[0023] The present invention further provides a driver chip, which includes the temperature detection circuit described above.

[0024] Optionally, the driver chip further includes:

[0025] Logic input and anti-penetration protection circuit, whose input terminal is used to access the control signal;

[0026] a potential shift circuit, the input end of which is connected to the logic input and the output end of the anti-shoot-through protection circuit;

[0027] The upper bridge driving output circuit and the lower bridge driving output circuit are respectively connected to the output end of the potential shift circuit.

[0028] The present invention further provides an intelligent power module, which includes an inverter power module and the temperature detection circuit as described above;

[0029] Alternatively, it includes the driver chip as described above.

[0030] The present invention also provides an air conditioner, which includes the intelligent power module described above.

[0031] The temperature detection circuit of the present invention is provided with a temperature sensing unit to collect the temperature value of the device to be tested, and outputs a corresponding analog temperature signal to a temperature-current conversion circuit, so that the temperature-current conversion circuit converts the analog temperature signal into a corresponding current signal to a pulse conversion quantization circuit. The pulse conversion quantization circuit converts the current signal into a pulse signal and quantizes the pulse signal to generate a digital temperature signal. The present invention does not require the provision of an analog-to-digital converter, that is, does not require the provision of a large ADC module and digital filter. Therefore, the chip area occupied by the temperature detection circuit in an intelligent power module, a driver chip, etc. can be reduced while ensuring quantization accuracy and resolution, and the power consumption of the intelligent power module can also be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0033] Figure 1 This is a functional module diagram of an embodiment of a temperature detection circuit of the present invention;

[0034] Figure 2 Schematic diagram of the circuit structure of an embodiment of a temperature detection circuit of the present invention;

[0035] Figure 3 for Figure 2 A schematic diagram of the circuit structure of an embodiment of a temperature pulse conversion circuit in a pulse conversion quantization circuit;

[0036] Figure 4 FIG. 1 is a schematic diagram of the circuit structure of an embodiment of an intelligent power module of the present invention.

[0037] Description of Figure Numbers:

[0038] Label name Label name 10 Temperature sensing unit S1 First switch 20 Temperature-current conversion circuit S2 Second switch 30 Pulse conversion quantization circuit 100 Temperature detection circuit 21 Delay unit proportional to absolute temperature 200 Logic input and anti-through protection circuit 22 Complementary to absolute temperature delay unit 300 Potential shift circuit 31 Temperature pulse conversion circuit 400 Upper bridge drive output circuit U1 XOR logic gate 500 Lower bridge drive output circuit U2 Inverter 600 VCC undervoltage protection circuit U3 trigger 700 VB overvoltage protection circuit U4 Comparator 800 Overcurrent protection circuit C1 First capacitor

[0039] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0041] The present invention provides a temperature detection circuit, which is suitable for use in an integrated circuit chip, such as an intelligent power module or a driver chip.

[0042] Intelligent power modules (IPMs) integrate power devices, which can experience significant temperature rises. Therefore, a temperature sampling circuit is required to monitor the junction temperature of these devices in real time. This circuit typically uses an integrated sampling resistor to detect temperature changes in the IPM's power devices. The analog temperature signal is then converted to a digital temperature signal (Dout) via an analog-to-digital converter (ADC) and transmitted to the logic unit. The sampling resistor and ADC circuit often occupy a significant chip area. However, modern processes are placing increasing demands on temperature sampling and protection circuits, striving to reduce chip power consumption while minimizing footprint and improving the accuracy and resolution of the temperature output circuit. Currently, widely adopted ADC designs feature numerous analog circuit modules, resulting in complex structures that consume a significant chip area and consume high power. Furthermore, ADC circuits typically require digital filters to improve output signal quality, leading to complex circuitry and significant increase in chip area and power consumption.

[0043] To solve the above problems, refer to Figures 1 to 4 The present invention proposes a new temperature detection circuit 100. In one embodiment of the present invention, the temperature detection circuit 100 includes:

[0044] The temperature sensing unit 10 is used to collect the temperature value of the device under test and output a corresponding analog temperature signal;

[0045] a temperature-current conversion circuit 20 connected to the output end of the temperature sensing unit 10 , the temperature-current conversion circuit 20 being configured to convert the analog temperature signal into a corresponding current signal; and

[0046] The pulse conversion quantization circuit 30 is connected to the output end of the temperature-current conversion circuit 20 . The pulse conversion quantization circuit 30 is used to convert the current signal into a pulse signal and quantize the pulse signal to generate a digital temperature signal Dout.

[0047] In this embodiment, the temperature sensing unit 10 can be provided with one or more combinations of negative temperature coefficient thermistors, positive temperature coefficient thermistors, thermocouples, thermopile infrared temperature sensors, and RTDs (platinum resistance thermometers). The negative temperature coefficient thermistors, positive temperature coefficient thermistors, thermocouples, thermopile infrared temperature sensors, and RTDs (platinum resistance thermometers) can be used as probes and placed near the device under test, such as the power device of an intelligent power module. In some embodiments, the temperature sensing unit 10 and the device under test, such as the power device, can also be integrated into a chip package. The temperature sensing unit 10 converts the detected temperature value into a voltage signal corresponding to the temperature value, specifically a PTAT (proportional to absolute temperature) voltage and a CTAT (complementary to absolute temperature) voltage, that is, an analog temperature signal. Of course, in other embodiments, the temperature sensing unit 10 can also be integrated into the driver chip. The specific configuration can be based on the different temperature sensing devices used and the device under test, and is not limited here.

[0048] The temperature-current conversion circuit 20 converts the received PTAT voltage and CTAT voltage into a PTAT current and a CTAT current. This process converts the analog temperature signal into a corresponding current signal.

[0049] The pulse conversion quantization circuit 30 can charge / discharge the capacitor provided in the circuit according to the output current signal, thereby generating corresponding PTAT and CTAT delays, which are then converted into corresponding temperature-modulated pulse width signals (pulse signals). The number of acquired pulses is then counted to quantize the pulse signals. In this way, the temperature signal obtained by the temperature sensing unit 10 can be converted into a voltage signal, which is then converted into a current signal. The pulse conversion quantization circuit 30 then performs corresponding PTAT and CTAT delay processing on the received current signal within a sampling period according to the received clock signal CLK to convert it into a time pulse signal, which is then converted into a digital temperature signal Dout for output.

[0050] The temperature detection circuit 100 of the present invention is provided with a temperature sensing unit 10 to collect the temperature value of the device under test and output a corresponding analog temperature signal to the temperature-current conversion circuit 20, so that the temperature-current conversion circuit 20 converts the analog temperature signal into a corresponding current signal to the pulse conversion quantization circuit 30. The pulse conversion quantization circuit 30 converts the current signal into a pulse signal and quantizes the pulse signal to generate a digital temperature signal Dout. The present invention does not require the provision of an analog-to-digital converter, that is, it does not require the provision of a large ADC module and digital filter. Therefore, the chip area occupied by the temperature detection circuit 100 in the intelligent power module, driver chip, etc. can be reduced while ensuring quantization accuracy and resolution, and the power consumption of the intelligent power module can also be reduced.

[0051] Reference Figure 2 In one embodiment, the temperature-current conversion circuit 20 includes:

[0052] The delay unit 21 proportional to absolute temperature and the delay unit 22 complementary to absolute temperature are respectively connected to the output end of the temperature sensing unit 10; wherein the delay unit 21 proportional to absolute temperature is used to generate a current proportional to absolute temperature according to the analog temperature signal; the delay unit 22 complementary to absolute temperature is used to generate a current complementary to absolute temperature according to the analog temperature signal; and

[0053] The XOR logic gate U1 has two input terminals connected to the delay unit 21 proportional to the absolute temperature and the delay unit 22 complementary to the absolute temperature, and the output terminal of the XOR logic gate U1 is the output terminal of the temperature-current conversion circuit 20.

[0054] In this embodiment, the output of the proportional to absolute temperature delay unit 21 is a proportional to absolute temperature (PTAT) current, and the output of the complementary to absolute temperature (CTAT) current is a complementary to absolute temperature (CTAT) current. The proportional to absolute temperature delay unit provides an output that increases with increasing temperature, while the complementary to absolute temperature delay unit provides an output that decreases with increasing temperature. In this way, a current signal corresponding to the temperature value can be generated. The outputs of the proportional to absolute temperature delay unit 21 and the complementary to absolute temperature delay unit 22 are respectively connected to the two input terminals of the exclusive-OR logic gate U1. When generating a current signal, it can be the output of either the proportional to absolute temperature delay unit 21 or the complementary to absolute temperature delay unit 22. The conversion from a temperature signal to a current signal is achieved by the proportional to absolute temperature delay unit 21 and the complementary to absolute temperature delay unit 22. The proportional to absolute temperature delay unit 21 and the complementary to absolute temperature delay unit 22 can be implemented using semiconductor devices such as MOS tubes, IGBTs, and bipolar transistors, thereby converting the analog temperature signal into a current signal corresponding to the temperature value.

[0055] Reference Figure 2 In one embodiment, the temperature detection circuit 100 further includes:

[0056] an inverter U2 connected to the output terminal of the temperature-current conversion circuit 20; and

[0057] The trigger U3 has an input end connected to the output end of the inverter U2, and an output end of the trigger U3 is connected to the controlled ends of the delay unit 21 proportional to absolute temperature and the delay unit 22 complementary to absolute temperature, respectively.

[0058] In this embodiment, inverter U2 inverts the current signal output by XOR logic gate U1 and outputs it to trigger U3, thereby triggering the output control signal and controlling the normal operation of the delay unit 21 proportional to the absolute temperature and the delay unit 22 complementary to the absolute temperature. The trigger terminal of trigger U3 is also used to receive a reset signal. After completing a temperature conversion cycle, a reset signal can be output to trigger U3, causing trigger U3 to output a Done signal to the delay unit 21 proportional to the absolute temperature and the delay unit 22 complementary to the absolute temperature, thereby shutting down the delay unit 21 proportional to the absolute temperature and the delay unit 22 complementary to the absolute temperature. This helps reduce the power consumption of the temperature detection circuit 100 itself, making it more energy-efficient and environmentally friendly.

[0059] Reference Figure 3 In one embodiment, the pulse conversion quantization circuit 30 includes:

[0060] a temperature pulse conversion circuit 31 , whose input terminal is connected to the output terminal of the temperature current conversion circuit 20 , and is used to convert the current signal corresponding to the temperature value into a temperature modulated pulse width signal; and

[0061] A pulse counter (not shown) is connected to the output end of the temperature pulse conversion circuit 31 and is used to quantize the temperature modulated pulse width signal to generate the digital temperature signal Dout.

[0062] It is understood that different temperature values ​​produce different current signal strengths (current values), and thus different pulse widths of the temperature-adjusted temperature-modulated pulse width signal converted by temperature pulse conversion circuit 31. Thus, within a temperature sampling cycle, the pulse counter counts the number of pulses in the temperature-modulated pulse width signal generated by temperature pulse conversion circuit 31, thereby quantifying the pulse signal.

[0063] Reference Figure 3 In one embodiment, the temperature pulse conversion circuit 31 includes a first capacitor C1 and a comparator U4; wherein,

[0064] One end of the first capacitor C1 is interconnected with the output end of the temperature-current conversion circuit 20 and the first input end of the comparator U4, and the other end of the first capacitor C1 is grounded;

[0065] The second input terminal of the comparator U4 is connected to the first reference voltage, and the output terminal of the comparator U4 is the output terminal of the temperature pulse conversion circuit 31 .

[0066] Furthermore, the temperature pulse conversion circuit 31 further includes a first switch S1 and a second switch S2, wherein the input end of the first switch S1 is connected to the first DC power supply VDD, and the common end of the first switch S1 and the second switch S2 is connected to the first input end of the comparator U4;

[0067] The input end of the second switch S2 is connected to the output end of the temperature-current conversion circuit 20;

[0068] The first switch S1 and the second switch S2 are interlocking switches.

[0069] In this embodiment, the first capacitor C1 is charged and discharged according to the input current signal, and the first switch S1 and the second switch S2 are turned on / off according to the received clock signal (Start signal, Stop signal). When the clock signal representing the start is received, that is, the rising edge of the Start signal, the temperature pulse conversion circuit 31 is triggered and begins to operate. When the Start signal is low, the first switch S1 is closed and the second switch S2 is opened, and the first capacitor C1 is charged to VDD (the reference voltage of the temperature-current conversion circuit 20). At this time, the comparator U4 outputs a low level. When the temperature measurement is started, the Start signal changes from low to high, the first switch S1 is opened, and the second switch S2 is closed. The delay unit 21 proportional to the absolute temperature and the delay unit complementary to the absolute temperature discharge the first capacitor C1. When the first capacitor C1 is discharged to the first preset voltage value V, that is, when the voltage is greater than Vx, the comparator U4 generates a level jump conversion, for example, a jump from low to high, or a jump from high to low. When the Stop signal is received, the first switch S1 is closed, the second switch S2 is opened, and the first capacitor C1 stops discharging. In this process, the pulse counter starts counting when the Start signal is received and stops counting when the Stop signal is received. The delay t between the rising edge of the Stop signal and the rising edge of the Start signal is the pulse width delay corresponding to the temperature value collected by the temperature sensing unit 10. The Start signal and the Stop signal serve as the start counting signal and the TDC stop counting signal of a pulse digital converter, such as a TDC (Time-to-Digital Converter, i.e., time, which is a commonly used time interval measurement circuit). The TDC converts this time quantity t into a digital temperature signal Dout.

[0070] The present invention further provides a driver chip, which includes the temperature detection circuit 100 as described above.

[0071] The detailed structure of the temperature detection circuit 100 can be referred to the above embodiment and will not be described in detail here. It can be understood that since the above temperature detection circuit 100 is used in the driver chip of the present invention, the embodiments of the driver chip of the present invention include all technical solutions of all embodiments of the above temperature detection circuit 100, and the technical effects achieved are also exactly the same, which will not be described in detail here.

[0072] In this embodiment, the temperature detection circuit 100 can be integrated into the driver chip, converting the collected analog temperature signal into a voltage signal, and then converting the voltage signal into a current signal, thereby performing corresponding PTAT delay and CTAT delay processing on the current signal to convert it into a time pulse signal, and then converting the time pulse signal into a digital temperature signal Dout for output. Specifically, it can be output to the main controller so that the main controller can determine whether the junction temperature of the device under test is too high based on the received digital temperature signal Dout, and output a control signal when the temperature is too high to control the driver chip to drive the inverter bridge circuit to stop working, thereby achieving over-temperature protection. In some embodiments, an over-temperature protection circuit can also be integrated into the driver chip, and the output end of the temperature detection circuit 100 is connected to the signal input end of the over-temperature protection circuit. The over-temperature protection circuit determines whether the junction temperature of the device under test is too high based on the received digital temperature signal Dout, and outputs a trigger signal when the temperature is too high to trigger the main controller to control the driver chip to drive the inverter bridge circuit to stop working, thereby achieving over-temperature protection. By setting the above-mentioned temperature detection circuit 100 in the driver chip, there is no need to set up an analog-to-digital converter, that is, there is no need to set up an ADC module and a digital filter with a large area. Therefore, while ensuring quantization accuracy and resolution, the chip area occupied by the temperature detection circuit 100 in the intelligent power module, driver chip, etc. can be reduced, and the power consumption of the intelligent power module can also be reduced.

[0073] Reference Figure 4 In one embodiment, the driver chip further includes:

[0074] Logic input and anti-punch-through protection circuit 200, whose input terminal is used to receive control signals;

[0075] A potential shift circuit 300 , whose input terminal is connected to the logic input and the output terminal of the anti-shoot-through protection circuit 200 ;

[0076] The upper bridge driving output circuit 400 and the lower bridge driving output circuit 500 are respectively connected to the output terminals of the potential shift circuit 300 .

[0077] In this embodiment, the driver chip also has an upper bridge signal input terminal HIN and a lower bridge signal input terminal LIN, each connected to the main controller. These receive control signals from the main controller and then output them to the logic input and anti-shoot-through protection circuit 200. The logic input and anti-shoot-through protection circuit 200 converts the control signals from the main controller into corresponding logic signals, namely pulse-width modulation signals, and outputs these pulse-width modulation signals with a certain dead time to the potential shift circuit 300. The potential shift circuit 300 is used to transfer the narrow pulse-width modulation signal on the low-voltage side to the pulse-width modulation signal on the high-voltage side. The upper bridge driver output circuit 400 and the lower bridge driver output circuit 500 are interlocked.

[0078] The upper bridge drive output circuit 400 includes three-phase upper bridge drive units, with the output end of each phase upper bridge drive unit connected to a corresponding upper bridge arm power transistor. The lower bridge drive output circuit 500 includes three-phase lower bridge drive units, with the output end of each phase lower bridge drive unit connected to a corresponding lower bridge arm power transistor.

[0079] In some embodiments, the above-mentioned logic input and anti-penetration protection circuit 200, the upper bridge drive output circuit 400 and the lower bridge drive output circuit 500 are all integrated into an HVIC. Alternatively, the three-phase upper bridge drive unit of the upper bridge drive output circuit 400 is integrated into a high-voltage integrated chip HVIC, and the three-phase lower bridge drive circuit of the lower bridge drive output circuit 500 is integrated into a low-voltage integrated chip LVIC, or each phase upper bridge drive unit in the three-phase upper bridge drive unit corresponds to one phase upper bridge drive unit in the three-phase lower bridge drive unit and is integrated into an HVIC, for example, the U-phase upper bridge drive unit and the U-phase lower bridge drive unit are integrated into an HVIC. The specific setting method may vary according to the internal structure of the driver chip, and is not limited here.

[0080] Reference Figure 4 In some embodiments, there are multiple devices under test. For example, when applied to an intelligent power module, multiple temperature detection circuits 100 are integrated in the driver chip, and the number of the temperature detection circuits 100 corresponds to the number of the multiple devices under test.

[0081] Alternatively, the number of the driving chips corresponds to the number of the devices under test, and each of the driving chips integrates one temperature detection circuit 100 .

[0082] The number of DUTs can be one or more. When multiple, the number can include four DUTs, or multiples of four, or six DUTs, or multiples of six. These six DUTs form an inverter circuit, which can be used in electrical equipment such as inverters, frequency converters, refrigeration equipment, metallurgical machinery, and electric traction equipment, particularly variable-frequency household appliances. When the intelligent power module is operating, the driver chip outputs corresponding PWM control signals to turn the corresponding DUT on and off, thereby outputting drive power to drive loads such as motors.

[0083] The number of driver chips can be one, such as an HVIC driver chip. The driver chip is an integrated chip, in which the driver circuits of four, six or three devices under test are integrated. Specifically, an integrated setting can be performed according to the number of driver chips. The number of driver chips can also be multiple, such as two, four or six. The number of multiple driver chips can correspond to the number of devices under test, and each driver chip drives one device under test to work. The driver chip can also be provided with two separate driver chips, an upper bridge arm driver chip and a lower bridge arm driver chip, and respectively drive the upper bridge arm device under test and the lower bridge arm device under test to work. The device under test and the driver chip are electrically connected by metal leads to form a current loop. When the driver chip is set to one, a temperature detection circuit 100 corresponding to the number of devices under test is integrated in the driver chip. When the driver chip is set to multiple, the number of driver chips corresponds to the device under test. And a temperature detection circuit 100 for temperature protection of the device under test is integrated in each driver chip.

[0084] The present invention further provides an intelligent power module, which includes an inverter power module and the temperature detection circuit 100 as described above;

[0085] Alternatively, it includes the driver chip as described above.

[0086] An intelligent power module (IPM) is a power drive product that combines power electronics and integrated circuit technology. The driver chip integrates power switching devices and high-voltage drive circuitry, and includes built-in fault detection circuitry for overvoltage, overcurrent, and overheating. Multiple power switching devices, typically six in total, form a power inverter bridge circuit. These devices, controlled by a high-voltage drive circuit such as the high-voltage driver chip (HVIC), drive loads such as motors and compressors. The driver chip receives control signals from the main controller (MCU) to drive subsequent circuitry and transmits status signals from the driver chip system back to the main controller MCU. Compared to traditional discrete solutions, driver chips are gaining a growing market share due to their high integration and reliability. They are particularly well-suited for motor drive inverters and various inverter power supplies, making them ideal power electronics devices for variable-frequency speed regulation, metallurgical machinery, electric traction, servo drives, and variable-frequency home appliances.

[0087] In this embodiment, the inverter power module includes multiple power tubes, which can be MOS tubes or IGBTs, wherein the MOS tube is integrated with a fast recovery diode FRD, and the IGBT can be an RC-power tube, which is integrated with a fast recovery diode. Since the RC-IGBT does not require an anti-parallel diode outside the IGBT, the structure of the intelligent power module can be simplified, thereby reducing the size of the intelligent power module, and can reduce the use of components, making the component patch and packaging easier.

[0088] When the intelligent power module is operating, the driver chip outputs corresponding drive signals to turn the power transistor on and off, thereby outputting drive power to drive loads such as motors. This process generates a high level of heat in the power transistor. If the temperature is too high, exceeding the junction temperature of the power transistor, it can be damaged. To this end, the present invention provides a temperature detection circuit 100 to detect the junction temperature of the power transistor. Based on the detected temperature, it determines whether the junction temperature of the power transistor is too high, thereby providing overtemperature protection for the intelligent common-mode module.

[0089] In some embodiments, the intelligent power module also integrates protection circuit modules such as a VCC undervoltage protection circuit 600, a VB overvoltage protection circuit 700, and an overcurrent protection circuit 800 to ensure the normal operation of the intelligent power module. The connection relationship between the VCC undervoltage protection circuit 600, the VB overvoltage protection circuit 700, and the overcurrent protection circuit 800 and other circuit structures in the intelligent power module, as well as the position in the intelligent power module, can be adjusted according to actual setting requirements and are not limited here. When any one or more of the undervoltage, overcurrent, overvoltage and other protection circuit modules reaches the protection threshold, a fault signal is output to the main controller so that the main controller outputs a corresponding control signal to achieve fault protection for the intelligent power module. There is no need to set up an analog-to-digital converter in the intelligent power module, that is, there is no need to set up a large ADC module and digital filter. Therefore, the chip area occupied by the temperature detection circuit 100 in the intelligent power module can be reduced while ensuring quantization accuracy and resolution, and the power consumption of the intelligent power module can also be reduced.

[0090] The present invention also provides an air conditioner, which includes the intelligent power module described above.

[0091] The detailed structure of the intelligent power module can be referred to the above-mentioned embodiment and will not be described in detail here. It can be understood that since the above-mentioned intelligent power module is used in the air conditioner of the present invention, the embodiments of the air conditioner of the present invention include all technical solutions of all embodiments of the above-mentioned intelligent power module, and the technical effects achieved are also exactly the same, which will not be described in detail here.

[0092] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A temperature detection circuit, characterized in that: The temperature detection circuit comprises: The temperature sensing unit is used to collect the temperature value of the device under test and output the corresponding analog temperature signal; a temperature-current conversion circuit connected to the output end of the temperature sensing unit, the temperature-current conversion circuit being configured to convert the analog temperature signal into a corresponding current signal; and A pulse conversion quantization circuit is connected to the output end of the temperature-current conversion circuit, and is used to convert the current signal into a pulse signal and quantize the pulse signal to generate a digital temperature signal; the temperature-current conversion circuit includes: A delay unit proportional to absolute temperature and a delay unit complementary to absolute temperature are respectively connected to the output end of the temperature sensing unit; wherein the delay unit proportional to absolute temperature is used to generate a current proportional to absolute temperature according to the analog temperature signal; the delay unit complementary to absolute temperature is used to generate a current complementary to absolute temperature according to the analog temperature signal; and an XOR logic gate, wherein the two input ends of the XOR logic gate are respectively connected to the delay unit proportional to the absolute temperature and the delay unit complementary to the absolute temperature, and the output end of the XOR logic gate is the output end of the temperature-current conversion circuit; The pulse conversion quantization circuit comprises: a temperature pulse conversion circuit, whose input terminal is connected to the output terminal of the temperature current conversion circuit, and is used to convert the current signal corresponding to the temperature value into a temperature modulated pulse width signal; and A pulse counter is connected to the output end of the temperature pulse conversion circuit and is used to quantize the temperature modulated pulse width signal to generate the digital temperature signal.

2. The temperature detection circuit according to claim 1, wherein: The temperature detection circuit further includes: an inverter connected to an output terminal of the temperature current conversion circuit; and A trigger, wherein the input end of the trigger is connected to the output end of the inverter, and the output end of the trigger is respectively connected to the controlled ends of the delay unit proportional to absolute temperature and the delay unit complementary to absolute temperature.

3. The temperature detection circuit according to claim 1, wherein: The temperature pulse conversion circuit includes a first capacitor and a comparator; wherein, One end of the first capacitor is interconnected with the output end of the temperature current conversion circuit and the first input end of the comparator, and the other end of the first capacitor is grounded; the second input end of the comparator is connected to the first reference voltage, and the output end of the comparator is the output end of the temperature pulse conversion circuit.

4. The temperature detection circuit according to claim 3, wherein: The temperature pulse conversion circuit also includes a first switch and a second switch, the input end of the first switch is connected to a first DC power supply, and the common end of the first switch and the second switch is connected to the first input end of the comparator; the input end of the second switch is connected to the output end of the temperature current conversion circuit; wherein, the first switch and the second switch are interlocking switches.

5. A driver chip, characterized in that: The driving chip includes the temperature detection circuit according to any one of claims 1 to 4.

6. The driver chip according to claim 5, wherein: The driver chip further includes: A logic input and anti-penetration protection circuit, whose input end is used to access the control signal; a potential shift circuit, whose input end is connected to the output end of the logic input and anti-penetration protection circuit; an upper bridge drive output circuit and a lower bridge drive output circuit, respectively connected to the output end of the potential shift circuit.

7. An intelligent power module, characterized in that: The intelligent power module includes an inverter power module and the temperature detection circuit according to any one of claims 1 to 4; or includes the driver chip according to any one of claims 5 or 6.

8. An air conditioner, characterized in that: The air conditioner includes the intelligent power module according to claim 7.

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